Light-emitting device, light-emitting module and method for manufacturing light-emitting device

Abstract

Provided are a light-emitting device, a light-emitting module, and a method for manufacturing a light-emitting device, a light-emitting device with an increased light extraction amount, etc. The light-emitting device comprises: a light-transmitting adhesive component that continuously covers the second principal surface side and the third principal surface of the first side surface; a first light-reflecting component that covers the first side surface provided with the light-transmitting adhesive component and has a third side surface around it, the first light-reflecting component contains a first filler with light reflectivity, the distance between the third side surfaces on the cross section in the direction perpendicular to the second principal surface is smaller than the distance between the second side surfaces on the fourth principal surface side of the second side surface, a wavelength conversion component forms a first inclined surface inclined from the plane of the second side surface in an area close to the third principal surface of the second side surface, and the wavelength conversion component has light-reflecting particles attached to the surface of the first inclined surface that reflect light emitted by the light-emitting element.

Description

Technical Field

[0001] The present invention relates to a light-emitting device, a light-emitting module, and a method for manufacturing the light-emitting device using a light-emitting element. Background Art

[0002] Light-emitting devices using light-emitting elements such as light-emitting diodes (LEDs) are widely used as backlights of liquid crystal displays, light sources for displays, and the like.

[0003] For example, the light source device disclosed in Patent Document 1 includes a plurality of light emitting elements mounted on a mounting substrate and a phosphor layer on each of the plurality of light emitting elements, and a reflective layer is disposed on the surface of the phosphor layer.

[0004] With the recent trend toward smaller and lighter devices, such light-emitting devices are being sought to be smaller and thinner, and to have higher brightness. In particular, there is a need to improve the efficiency of extracting light emitted by a light-emitting element.

[0005] Prior art literature

[0006] Patent Literature

[0007] Patent Document 1: (Japanese) Patent Publication No. 2012-204614 Summary of the invention

[0008] Problems to be solved by the invention

[0009] An object of the present invention is to provide a light emitting device, a light emitting module, and a method for manufacturing the light emitting device and the light emitting module, which further improve light extraction efficiency.

[0010] Technical solutions to solve problems

[0011] A light emitting device according to one embodiment of the present invention comprises: a light emitting element having a first main surface provided with an electrode, a second main surface opposite to the first main surface, and a first side surface continuous with the first main surface and the second main surface;

[0012] a wavelength conversion member having a third main surface, a fourth main surface opposite to the third main surface, and a second side surface continuous with the third main surface and the fourth main surface, and converting the wavelength of light emitted by the light emitting element to emit light of a different wavelength, wherein the third main surface is a rectangular shape having a larger area than the second main surface and is bonded to the second main surface;

[0013] a light-transmitting adhesive member that continuously covers the second main surface side of the first side surface and a portion of the third main surface;

[0014] a first light reflective member covering the first side surface on which the light-transmitting adhesive member is provided and having a third side surface therearound;

[0015] The first light reflective component contains a first filler having light reflectivity,

[0016] The distance between the third side surfaces in a cross section in a direction perpendicular to the second main surface is smaller than the distance between the second side surfaces on the fourth main surface side of the second side surface.

[0017] The wavelength conversion member has a first inclined surface inclined toward a region of the second side surface close to the third main surface,

[0018] The wavelength conversion member has light reflective particles on a surface of the first inclined surface.

[0019] The first light reflecting member includes a second inclined surface inclined toward a region of the third side surface close to the third main surface, wherein the second inclined surface is continuous with the first inclined surface.

[0020] In the above light emitting device, preferably, the first inclined surface is at least partially formed into a curved surface.

[0021] In the above light emitting device, it is preferred that the light reflective particles are made of the same material as that of the first filler.

[0022] In the above light emitting device, preferably, the first filler contains TiO2.

[0023] In addition, a light emitting module according to one embodiment of the present invention includes: the light emitting device described above;

[0024] A light-transmitting light guide plate having a first main surface of the light guide plate and a second main surface of the light guide plate, wherein the first main surface of the light guide plate is a light-emitting surface that radiates light to the outside, and the second main surface of the light guide plate is a surface on the side opposite to the first main surface of the light guide plate and has a recessed portion for arranging the light-emitting device;

[0025] The second light reflective member covers the second main surface of the light guide plate and the light emitting device.

[0026] In the above light emitting module, preferably, in cross-sectional view, at least a portion of the first light reflecting member is located outside the recessed portion.

[0027] a light-transmitting joining member connected to the inner side surface of the recess and the outer side surface of the light-emitting device,

[0028] The engaging member extends toward the third side surface located outside the recess.

[0029] In addition, according to a method for manufacturing a light emitting device according to one embodiment of the present invention, the light emitting device includes a light emitting element, a wavelength conversion member, a light-transmitting adhesive member, and a first light-reflective member.

[0030] The manufacturing method of the light emitting device comprises the following steps:

[0031] A first resin layer, a plurality of the light-emitting elements, and a second resin layer are prepared, wherein the first resin layer becomes the wavelength conversion member, and a fluorescent substance is mixed in the first resin, and the plurality of the light-emitting elements are arranged separately from each other on the upper surface of the resin layer, and the second resin layer is arranged between adjacent light-emitting elements, becomes the first light-reflective member, and contains a first filler having light reflectivity;

[0032] Cutting the second resin layer at a certain interval using a first cutting tool having a first thickness to form a first cutting area;

[0033] A second tool having a second thickness thinner than the first thickness is inserted into the first cutting area, and the first resin layer directly below the first cutting area is cut to form a second cutting area, thereby separating each light-emitting device, and in the side surface of each light-emitting device, a first inclined surface inclined from the plane of the second side surface is formed near the area joined to the first light-reflective component in the second side surface serving as the side surface of the wavelength conversion component, and light-reflective particles are attached to the first inclined surface.

[0034] In the above method for manufacturing a light emitting device, preferably, in the step of forming the first cut region in the second resin layer, a portion of the first resin layer is cut by a tip end of the first blade.

[0035] In addition, according to another aspect of the present invention, a method for manufacturing a light emitting device includes: a light emitting element, a wavelength conversion member, a light-transmitting adhesive member, and a first light-reflective member.

[0036] The manufacturing method of the light emitting device comprises the following steps:

[0037] A first resin layer, a plurality of the light-emitting elements, and a second resin layer are prepared, wherein the first resin layer becomes the wavelength conversion member, and a fluorescent substance is mixed in the first resin, and the plurality of the light-emitting elements are arranged separately from each other on the upper surface of the resin layer, and the second resin layer is arranged between adjacent light-emitting elements, becomes the first light-reflective member, and contains a first filler having light reflectivity;

[0038] Cutting the second resin layer at a certain interval using a first cutting tool having a first thickness to form a first cutting area;

[0039] A second tool having a second thickness thinner than the first thickness is inserted into the first cutting area, and the first resin layer directly below the first cutting area is cut to form a second cutting area, thereby separating each light-emitting device, and in the side of each light-emitting device, a second inclined surface inclined from the plane of the third side surface is formed near the area joined to the wavelength conversion component in the third side surface which is the side surface of the first light-reflective component.

[0040] In the above method for manufacturing a light emitting device, preferably, in the step of forming the first cutting region in the second resin layer, cutting is stopped before the tip of the first blade reaches the first resin layer.

[0041] Effects of the Invention

[0042] According to a light-emitting device in one embodiment of the present invention, when the light-emitting element of the light-emitting device emits light, the light passing through the wavelength conversion component is reflected in the direction of being taken out to the outside due to the inclination direction of the first inclined surface, and further the light from the light-emitting element is scattered by light-reflective particles arranged on the first inclined surface, so that the component taken out to the outside can be increased, and the overall light extraction efficiency of the light-emitting device can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] Figure 1 This is a structural diagram showing each structure of the liquid crystal display device according to Embodiment 1.

[0044] Figure 2 This is a schematic plan view of the light emitting module according to Embodiment 1.

[0045] Figure 3 This is a schematic cross-sectional view of a part of the light emitting module according to Embodiment 1, in which a light guide plate is turned upside down.

[0046] Figure 4 It is a schematic bottom view of a light emitting module according to a modified example.

[0047] Figure 5 This is a schematic cross-sectional view showing a light emitting device according to Embodiment 1.

[0048] Figure 6 This is a photograph showing a light emitting device according to a modified example.

[0049] Figure 7 Schematic cross-sectional view showing the manufacturing process of the light emitting device according to Embodiment 1.

[0050] Figure 8 Schematic cross-sectional view showing the manufacturing process of the light emitting device according to Embodiment 1.

[0051] Fig. 9 Schematic cross-sectional view showing the manufacturing process of the light emitting device according to Embodiment 1.

[0052] Fig.10 Schematic cross-sectional view showing the manufacturing process of the light emitting device according to Embodiment 1.

[0053] Fig.11 Schematic cross-sectional view showing the manufacturing process of the light emitting device according to Embodiment 1.

[0054] Fig.12 Schematic cross-sectional view showing the manufacturing process of the light emitting device according to Embodiment 1.

[0055] Fig.13 This is a schematic cross-sectional view showing a light emitting device according to Embodiment 2.

[0056] Fig.14 It is a schematic cross-sectional view showing the manufacturing process of the light-emitting device of embodiment 2.

[0057] Fig.15 It is a schematic cross-sectional view showing the manufacturing process of the light-emitting device of embodiment 2.

[0058] Fig.16 It is a schematic cross-sectional view showing the manufacturing process of the light-emitting device of embodiment 2.

[0059] Fig.17 This is a schematic cross-sectional view showing a light emitting device according to Embodiment 3.

[0060] Description of Reference Numerals

[0061] 1000…LCD display device

[0062] 100, 100'...Light emitting module

[0063] 110a…Lens

[0064] 110b…Lens

[0065] 110c…Diffuser

[0066] 120…LCD panel

[0067] 1, 1'... Light guide plate

[0068] 1a…Optical function part

[0069] 1b…concave part

[0070] 1c…First main surface of light guide plate

[0071] 1d…Second main surface of light guide plate

[0072] 1e...slot

[0073] 1f… inclined surface

[0074] 3, 3B, 3C…Light-emitting device

[0075] 11…Light-emitting element

[0076] 11b…Electrode

[0077] 11c…Second main surface

[0078] 11d…first main surface

[0079] 11e…First side

[0080] 12…Wavelength conversion components

[0081] 12c…third main surface

[0082] 12d…Fourth main surface

[0083] 12e…side 2

[0084] 12f…first inclined surface

[0085] 14…Joint parts

[0086] 14a… Inclined surface

[0087] 15 ... first light reflecting member

[0088] 15e…The third side

[0089] 15f…Second inclined surface

[0090] 16 ... second light reflecting member

[0091] 19…Translucent adhesive parts

[0092] 24…Conductive film

[0093] 30…Bottom Plate

[0094] 40…Second resin layer

[0095] 41…First Filler

[0096] 42…Second resin

[0097] 44…Light-reflective particles

[0098] 45…Chip

[0099] 46, 46B…First cutting area

[0100] 48, 48B…Second cutting area

[0101] 49… Inclined surface

[0102] 50…First resin layer

[0103] 55…Chip

[0104] 60…Attractor

[0105] 61…First Knife

[0106] 62…Second tool DETAILED DESCRIPTION

[0107] The present invention is described in detail below based on the accompanying drawings. In addition, in the following description, terms indicating specific directions or positions (for example, "upper", "lower", and other terms including these terms) are used as needed, but these terms are used to facilitate understanding of the invention with reference to the accompanying drawings, and the technical scope of the present invention is not limited by the meaning of these terms. In addition, the same marked parts appearing in multiple drawings represent the same or equivalent parts or components.

[0108] In addition, the embodiments shown below are examples of embodiments of light-emitting devices, light-emitting modules, and methods for manufacturing light-emitting devices for embodying the technical ideas of the present invention, and the present invention is not limited below. In addition, the dimensions, materials, shapes, and relative configurations of the components described below do not limit the scope of the present invention to the descriptions thereof unless otherwise specified, but are merely examples. In addition, the contents described in one embodiment or example can also be applied to other embodiments or examples. In addition, the sizes and positional relationships of the components shown in the drawings are sometimes exaggerated for the purpose of clarifying the description.

[0109] [Implementation Method 1]

[0110] (Liquid Crystal Display Device 1000)

[0111] Figure 1 1 is a block diagram showing the components of a liquid crystal display device 1000 including the light emitting module of Embodiment 1. The liquid crystal display device 1000 includes a liquid crystal panel 120 , two lens sheets 110 a and 110 b , a diffusion sheet 110 c , and a light emitting module 100 in this order from the top. Figure 1 The illustrated liquid crystal display device 1000 is a so-called direct-type liquid crystal display device in which a light emitting module 100 is stacked below a liquid crystal panel 120. The liquid crystal display device 1000 irradiates the liquid crystal panel 120 with light emitted from the light emitting module 100. In addition to the above-mentioned components, components such as a polarizing film and a color filter may be provided.

[0112] (Light emitting module 100)

[0113] Figure 2 and Figure 3 The structure of the light emitting module 100 according to Embodiment 1 is shown. The light emitting module 100 according to Embodiment 1 emits white surface light. Figure 2 It is a schematic plan view of the light emitting module according to this embodiment. Figure 3 These are schematic cross-sectional views showing in enlarged form a part of the light emitting module according to Embodiment 1. The light emitting module 100 shown in these figures includes a light emitting device 3 as a light source and a light guide plate 1 on which the light emitting device 3 is arranged.

[0114] (Light guide plate 1)

[0115] The light guide plate 1 has a light guide plate first main surface 1c ( Figure 3 The lower surface) and the second main surface 1d of the light guide plate on the side opposite to the first main surface 1c of the light guide plate ( Figure 3 A plurality of recesses 1b in which the light emitting device 3 is disposed are formed separately on the second main surface 1d of the light guide plate 1. In addition, grooves 1e are formed between the recesses 1b. On the other hand, an optical function portion 1a having a function of reflecting or diffusing light from the light emitting device 3 can be provided on the first main surface 1c of the light guide plate 1.

[0116] The light emitting module 100 further includes a second light reflective member 16 covering the light guide plate second main surface 1d side of the light guide plate 1. The light emitting module 100 also includes a light-transmitting bonding member 14 in contact with the inner surface of the recess 1b and the outer surface of the light emitting device 3.

[0117] Figure 2 and Figure 3 The light emitting module 100 shown in the figure is provided with a plurality of recesses 1b in one light guide plate 1, and a light emitting device 3 is arranged in each recess 1b. Figure 4 As shown in the schematic bottom view of , a plurality of modules including a light guide plate 1' having one recess 1b and a light emitting device 3 disposed in the recess 1b are arranged to form a light emitting module 100'.

[0118] (Light emitting device 3)

[0119] Figure 5 The schematic cross-sectional view of the light emitting device 3 is shown. The light emitting device 3 shown in the figure includes a light emitting element 11, a wavelength conversion member 12 covering the second principal surface 11c of the light emitting element 11, a light transmissive adhesive member 19, and a first light reflective member 15 covering the first side surface 11e of the light emitting element 11.

[0120] in addition, Figure 5The light emitting device 3 covers the second principal surface 11c of the light emitting element 11 with a wavelength conversion component 12. In addition, the wavelength conversion component 12 has a third principal surface 12c bonded to the second principal surface 11c of the light emitting element 11, a fourth principal surface 12d, and a second side surface 12e connecting the third principal surface 12c and the fourth principal surface 12d. The third principal surface 12c is a rectangular shape having a larger area than the second principal surface 11c and is bonded to the second principal surface 11c. The wavelength conversion component 12 converts the wavelength of light emitted by the light emitting element 11 and emits light of a different wavelength.

[0121] On the other hand, the second principal surface 11c side and a portion of the third principal surface 12c of the first side surface 11e of the light emitting element 11 are continuously covered with the light-transmitting adhesive member 19. In addition, the first side surface 11e of the light emitting element 11 provided with the light-transmitting adhesive member 19 is covered with the first light-reflecting member 15. In addition, the first light-reflecting member 15 has a third side surface 15e around it.

[0122] (Light emitting element 11)

[0123] The light emitting element 11 has a second main surface 11c, a first main surface 11d on the side opposite to the second main surface 11c, and a first side surface 11e between the second main surface 11c and the first main surface 11d. A pair of positive and negative electrodes 11b are provided on the first main surface 11d. The light emitting element 11 mainly radiates light from the second main surface 11c, and irradiates light to the wavelength conversion component 12 covering the second main surface 11c.

[0124] The light emitting element 11 has, for example, a translucent substrate such as sapphire and a semiconductor stacking structure stacked on the translucent substrate. The semiconductor stacking structure includes a light emitting layer and an n-type semiconductor layer and a p-type semiconductor layer sandwiching the light emitting layer, and the n-side electrode and the p-side electrode as the electrode 11b are electrically connected to the n-type semiconductor layer and the p-type semiconductor layer, respectively. The second main surface 11c of the light emitting element 11, for example, having a translucent substrate, is arranged opposite to the light guide plate 1, and a pair of electrodes 11b are provided on the first main surface 11d on the side opposite to the second main surface 11c.

[0125] As the light-emitting element 11, the length, width and height are not particularly limited, but it is preferred to use a semiconductor light-emitting element whose length and width are less than 1 mm in a plan view, more preferably a light-emitting element whose length and width are less than 0.5 mm, and further preferably a light-emitting element whose length and width are less than 0.25 mm. When such a light-emitting element is used, high-definition display can be achieved when local dimming of a liquid crystal display device is performed. In addition, if a light-emitting element whose length and width are less than 0.5 mm is used, the cost efficiency of the light-emitting element becomes better, and it becomes possible to reduce the cost of the light-emitting module 100. In addition, for a light-emitting element whose length and width are both less than 0.25 mm, since the area of ​​the upper surface of the light-emitting element is small, the amount of light emitted from the first side surface 11e becomes relatively large. That is, such a light-emitting element is easy to emit light in a batwing shape, and therefore, it is preferably used in the light-emitting module of this embodiment in which the light-emitting element is bonded to the light guide plate and the distance between the light-emitting element and the light guide plate is extremely short.

[0126] The height of the light emitting element 11 is preferably 0.10 mm to 0.25 mm. The height of the light emitting element 11 is preferably such that the first principal surface 11 d of the light emitting element 11 protrudes from the recess 1 b when the light emitting device 3 is mounted in the recess 1 b of the light guide plate 1 .

[0127] The light-emitting element 11 may also be in any shape when viewed from above, such as a square or a rectangle. When the light-emitting element used in a high-definition liquid crystal display device is rectangular, even if a part of the plurality of light-emitting elements undergoes rotational deviation during the installation process of the light-emitting element, it is easy to visually confirm by using a light-emitting element that is rectangular when viewed from above. In addition, since the p-type electrode and the n-type electrode can be formed with a distance separated, the formation of the wiring described later can be easily performed. On the other hand, when a light-emitting element that is square when viewed from above is used, small light-emitting elements can be manufactured with good mass productivity. The density (arrangement pitch) of the light-emitting element 11, that is, the distance between the light-emitting elements 11, is determined by the interval at which the recesses 1b are set in the light guide plate 1, and can be set to, for example, about 0.06 mm to 20 mm, preferably about 1 mm to 10 mm. In addition, the arrangement pitch of the light-emitting element 11 is the distance between the centers of two adjacent light-emitting elements 11. The light emitting element 11 is designed to be arranged substantially at the center of the light emitting device 3. As a result, the arrangement pitch of the light emitting device 3 is also about 0.06 mm to 20 mm, preferably about 1 mm to 10 mm.

[0128] In addition, Figure 4 In the example, the outer side surfaces of the light emitting device 3 are arranged to be almost parallel to the inner side surfaces of the recess 1b, but the present invention is not limited to this arrangement. For example, the arrangement may be rotated 45° relative to the quadrilateral recess 1b with the center of the light emitting device as the axis.

[0129] A known semiconductor light emitting element can be used as the light emitting element 11. In this embodiment, a light emitting diode is exemplified as the light emitting element 11.

[0130] As the light emitting element 11, an element that emits light of any wavelength can be selected. For example, as an element that emits blue or green light, a nitride semiconductor (In x Al y Ga 1-x-y In addition, as an element emitting red light, a light-emitting element containing a semiconductor such as GaAlAs, AlInGaP, etc. can be used. In addition, a semiconductor light-emitting element composed of materials other than these can also be used. By changing the material of the semiconductor layer and its mixed crystal degree, the emission wavelength can be changed. The composition, emission color, size, number, etc. of the light-emitting element used can be appropriately selected according to the purpose.

[0131] (Wavelength conversion component 12)

[0132] The wavelength conversion member 12 is configured to cover the second main surface 11c of the light emitting element 11. The wavelength conversion member 12 receives the light emitted from the second main surface 11c through the third main surface 12c, converts the wavelength of the light, and emits it from the fourth main surface 12d. For example, the wavelength conversion member 12 includes a phosphor that is excited by the light from the light emitting element 11 and emits light of a different wavelength. In this way, the component of the light emitted by the light emitting element 11 that passes through the wavelength conversion member 12 and the component whose wavelength is converted by the wavelength conversion member 12 are mixed, and the mixed color light is emitted.

[0133] The wavelength conversion component 12 can be a component in which a wavelength conversion substance is dispersed in a first resin that serves as a base material. In addition, the wavelength conversion component 12 can also be composed of multiple layers. For example, the wavelength conversion component can be composed of multiple wavelength conversion part layers. Alternatively, the wavelength conversion component can also be a double-layer structure in which a first layer in which a wavelength conversion substance is added to a base material and a light diffusion part in which a diffusion material is added to the base material is set as a second layer.

[0134] The material of the first resin that becomes the base material can be, for example, epoxy resin, silicone resin, a resin mixed with these, or a light-transmitting material such as glass. From the perspective of the light resistance and ease of molding of the wavelength conversion component 12, it is beneficial to select silicone resin as the first resin. In addition, as the base material of the wavelength conversion component 12, a material having a higher refractive index than the material of the light guide plate 1 is preferably used.

[0135] Phosphors can be used appropriately in the wavelength conversion material contained in the wavelength conversion member 12. For example, fluoride phosphors such as YAG phosphors, β-sialon phosphors, KSF phosphors, and MGF phosphors, nitride phosphors, etc. can be cited. Specific examples of composition formulas include the following general formulas (I), (II), and (III).

[0136] A2[M 1-a Mn 4+ a F6]···(I)

[0137] (Wherein, in the above general formula (I), A is selected from K + , Li + 、Na + , Rb + , Cs + and NH 4+ At least one of the group consisting of: M is at least one element selected from the group consisting of Group 4 elements and Group 14 elements, and a satisfies 0<a<0.2. )

[0138] (x-a)MgO·a(Ma)O·b / 2(Mb)2O3·yMgF2·c(Mc)X2·(1-d-e)GeO2·d(Md)O2·e(Me)2O3:Mn···(II)

[0139] (Wherein, in the above general formula (II), Ma is at least one selected from Ca, Sr, Ba, and Zn, Mb is at least one selected from Sc, La, and Lu, Mc is at least one selected from Ca, Sr, Ba, and Zn, X is at least one selected from F and Cl, Md is at least one selected from Ti, Sn, and Zr, and Me is at least one selected from B, Al, Ga, and In. In addition, with respect to x, y, a, b, c, d, and e, 2≦x≦4, 0<y≦2, 0≦a≦1.5, 0≦b<1, 0≦c≦2, 0≦d≦0.5, and 0≦e<1)

[0140] Ma x Mb y Al3N z :Eu···(III)

[0141] (Wherein, in the above general formula (III), Ma is at least one element selected from the group consisting of Ca, Sr and Ba, Mb is at least one element selected from the group consisting of Li, Na and K, and x, y and z satisfy 0.5≦x≦1.5, 0.5≦y≦1.2, and 3.5≦z≦4.5, respectively.

[0142] The half-value width of the KSF phosphor represented by the general formula (I) can be less than 10 nm. In addition, the half-value width of the MGF phosphor represented by the general formula (II) can be greater than 15 nm and less than 35 nm. As shown in the above general formula (I), the composition of the KSF phosphor can also be substituted by Ti or Si as other tetravalent elements K2SiF6:Mn 4+ The KSF phosphor composition K2SiF6:Mn 4+ A part of K is substituted with other alkali metals, a part of Si is substituted with trivalent elements such as Al, or substitution of a plurality of elements is combined.

[0143] The wavelength conversion component 12 may contain one wavelength conversion substance or multiple wavelength conversion substances. In the case of containing multiple wavelength conversion substances, for example, the wavelength conversion component may contain a fluoride-based phosphor such as a β-sialon phosphor that emits green light and a KSF-based phosphor that emits red light. In this way, the color reproduction range of the light-emitting module 100 can be expanded. In this case, the light-emitting element 11 preferably has a nitride-based semiconductor (Indium nitride) that can emit short-wavelength light that can efficiently excite the wavelength conversion component 12. x Al y Ga 1-x-y N, 0≦X, 0≦Y, X+Y≦1). In addition, for example, when using a light-emitting element 11 that emits blue light, in the case of obtaining red light as a light-emitting module, the wavelength conversion component 12 may also contain 60% by weight or more of a KSF-based phosphor (red phosphor), preferably 90% by weight or more. That is, the wavelength conversion component 12 may also contain a wavelength conversion substance that emits light of a specific color, thereby emitting light of a specific color. In addition, the wavelength conversion substance may also be quantum dots. In the wavelength conversion component 12, the wavelength conversion substance may also be configured in any manner. For example, it may be distributed approximately evenly, or it may be partially uneven. In addition, multiple layers each containing a wavelength conversion component may also be stacked.

[0144] In addition, the wavelength conversion component 12 may also be provided with components that diffuse or reflect light. For example, a diffusion component may be mixed into the interior of the wavelength conversion component 12, or a light diffusion plate may be attached to the surface of the wavelength conversion component 12, or the diffusion component may be separated from the wavelength conversion component 12 and mixed into the surface or interior of the light guide plate, or a light diffusion layer may be provided. By providing such a light diffusion layer or light diffusion area or other light diffusion part, the light emitted from the light guide plate 1 can be made more uniform. In addition, multiple light diffusion parts may also be provided. For example, multiple light diffusion layers may be stacked to form a light diffusion area.

[0145] The light diffusion part can be formed by adding a diffusion material to a base material. For example, a resin material can be used as a base material, and a base material containing white inorganic particles such as SiO2 or TiO2 in the base material can be used as a light diffusion part. In addition, the diffusion material can use a material that processes a white resin or metal as a light reflective component into a particle shape. These diffusion materials are irregularly included in the base material, so that the light passing through the inside of the light diffusion part is irregularly and repeatedly reflected, and the transmitted light is diffused in multiple directions, so that the irradiated light is suppressed from being locally concentrated, and uneven brightness is prevented.

[0146] The thickness of the wavelength conversion member 12 is preferably 0.02 mm to 0.30 mm. In order to achieve a thinner light emitting module and various wavelength conversion effects, it is preferably within the above range.

[0147] Figure 5 In the light emitting device 3, the wavelength conversion member 12 has a larger shape than the light emitting element 11 in a plan view. The light emitting device 3 allows more light than that emitted from the second main surface 11c of the light emitting element 11 to pass through the wavelength conversion member 12 and enter the light guide plate 1, thereby reducing color unevenness or brightness unevenness.

[0148] (Translucent Adhesive Member 19)

[0149] like Figure 5 As shown, the translucent adhesive component 19 continuously covers a portion of the first side surface 11e of the light emitting element 11, that is, the second principal surface side of the first side surface 11e and a portion of the third principal surface of the wavelength conversion component 12. In addition, the outer side surface of the translucent adhesive component 19 is preferably an inclined surface that expands from the first side surface 11e toward the wavelength conversion component 12. In addition, it is more preferably a convex curved surface protruding toward the light emitting element 11. As a result, the light emitted from the first side surface 11e can be guided to the side closer to the wavelength conversion component 12, and the light extraction efficiency can be improved.

[0150] In addition, a translucent adhesive member 19 may be provided between the second principal surface 11c of the light emitting element 11 and the wavelength conversion member 12. Thus, for example, by including a diffusing agent in the translucent adhesive member 19, light emitted from the second principal surface 11c of the light emitting element 11 is diffused by the translucent adhesive member 19 and enters the wavelength conversion member 12, thereby reducing uneven brightness. The translucent adhesive member 19 can use the same member as the bonding member 14 described later.

[0151] (First Light Reflective Member 15)

[0152] In the light emitting device 3, the first side surface 11e is covered by the first light reflecting member 15 when the wavelength converting member 12 is provided on the light emitting element 11. Specifically, the first side surface 11e not covered by the light transmissive adhesive member 19 and the outer side surface of the light transmissive adhesive member 19 are covered by the first light reflecting member 15.

[0153] (First filler 41)

[0154] The first light reflecting member 15 is made of a material having excellent light reflectivity. Figure 5 As shown in the partially enlarged view of FIG. 1 , the first light reflective member 15 contains a first filler 41 having light reflectivity. The first filler 41 can be composed of an inorganic substance derived from a metal. The first filler 41 is preferably a white inorganic fine particle, such as TiO2. Such a first filler 41 is added to a second resin 42, such as a transparent resin, which is a base material, to obtain a first light reflective member 15 as a white resin.

[0155] In the light emitting device 3, the first light reflecting member 15 covers the surfaces other than the second main surface 11c of the light emitting element 11, thereby suppressing the leakage of light to directions other than the second main surface 11c. That is, the first light reflecting member 15 reflects the light emitted from the first side surface 11e or the first main surface 11d, so that the light emitted by the light emitting element 11 is effectively radiated to the outside from the light guide plate first main surface 1c of the light guide plate 1, and the light extraction efficiency of the light emitting module 100 can be improved.

[0156] The first light reflective member 15 has a reflectivity of 60% or more, preferably a white resin having a reflectivity of 90% or more with respect to the light emitted from the light emitting element 11. The first light reflective member 15 is preferably a resin containing a white pigment such as white powder. In particular, a silicone resin containing an inorganic white powder such as TiO2 is preferred.

[0157] The first light reflective member 15 is in contact with at least a portion of the first side surface 11e, and buries the light emitting element 11 around the light emitting element 11 so that the electrode 11b of the light emitting element 11 is exposed on the surface. Figure 5 In the example of FIG. 1 , the first light reflective member 15 is in contact with the wavelength converting member 12. However, a light-transmitting adhesive member may be interposed between the first light reflective member 15 and the wavelength converting member 12 as described above.

[0158] (First inclined surface 12f)

[0159] like Figure 5As shown, the distance between the third side faces 15e on the cross section in the direction perpendicular to the second main surface 11c is smaller than the distance between the second side faces 12e at the position where the light-transmitting adhesive member 19 is provided at the upper end of the first side face 11e. In other words, the width of the first light-reflective member 15 is narrower than the width of the wavelength-converting member 12 on the fourth main surface side. Specifically, the wavelength-converting member 12 having a width wider than the first light-reflective member 15 forms a first inclined surface 12f in a region close to the third main surface 12c on the second side face. The first inclined surface 12f is inclined from the upper end of the second side face 12e, that is, the third main surface 12c. In other words, the wavelength-converting member 12 is formed in a shape in which the corner of the third main surface 12c is chamfered. Thus, the light incident from the light-emitting element 11 to the wavelength-converting member 12 is reflected in the direction of being taken out to the outside due to the inclination of the first inclined surface 12f, and the component taken out to the outside can be increased, and the light-extraction efficiency of the light-emitting device as a whole can be improved.

[0160] The first inclined surface 12f is continuously inclined from the third side surface 15e to the second side surface 12e. The first inclined surface 12f is preferably at least partially formed into a curved surface. The first inclined surface 12f is flat, but by setting it to a curved surface, the area of ​​the first inclined surface 12f can be increased, the component taken out to the outside can be further increased, and the light extraction efficiency of the light emitting device as a whole can be further improved.

[0161] (Light-reflective particles 44)

[0162] In addition, the wavelength conversion member 12 has light-reflecting particles 44 attached to the first inclined surface 12f that reflect the light emitted by the light-emitting element 11. Thus, in addition to the inclination of the first inclined surface 12f described above, the light-reflecting particles 44 disposed on the first inclined surface 12f scatter the light from the light-emitting element 11, thereby further increasing the amount of light taken out to the outside. Figure 5 This is a cross-sectional view of the light emitting device, so a portion of the first inclined surface 12f is seen. If the light emitting device is rectangular in plan view, the first inclined surface exists on each of the four surfaces corresponding to the four sides of the rectangle in plan view.

[0163] The light reflective particles 44 preferably include the same material as the first filler 41. In this example, white inorganic particles such as TiO2 are contained in a base material such as silicone resin as the first filler 41. It is more preferable to dope the first filler 41 in the same base material as the second resin 42 constituting the first light reflective member 15. Thus, the first light reflective member 15 and the light reflective particles 44 can be made common, and manufacturing becomes easy.

[0164] In addition, the wavelength conversion member 12 preferably has no light reflective particles 44 attached to the second side surface 12e. However, a certain amount of light reflective particles 44 may be attached to the second side surface 12e. In this case, for example, Figure 6 As shown, it is preferable to reduce the adhesion amount of the second side surface 12e compared to the first inclined surface 12f. Figure 6 This is a diagram of the light emitting device as viewed from the side. The first inclined surface 12f is a region surrounded by a dotted line in the diagram, and a light reflective material 44 is attached to the region surrounded by the dotted line.

[0165] (Method for manufacturing light emitting device)

[0166] Next, based on Figure 7 to Figure 12 The manufacturing method of the light emitting device of Embodiment 1 is described with reference to the schematic cross-sectional view of FIG. Figure 7 As shown, a first resin layer 50, a light emitting element 11, and a second resin layer 40 are prepared. Here, the first resin layer 50 is applied on the base plate 30. The base plate 30 can use a tape material having an adhesive layer, for example. As a result, the wavelength conversion component 12 attached to the base plate 30 can be easily peeled off. The first resin layer 50 is obtained by mixing a fluorescent substance into a first resin that becomes a base material, and becomes a wavelength conversion component 12 after curing. The first resin can use the above-mentioned silicone resin, etc. In addition, the fluorescent substance can use a YAG-based fluorescent substance, etc.

[0167] In a state where the first resin layer 50 is cured, a plurality of light emitting elements 11 are arranged on its upper surface so as to be separated from each other. The light emitting element 11 has the first principal surface 11d as the upper surface, and the second principal surface 11c is bonded and fixed to the first resin layer 50. In addition, a second resin 42 is applied between adjacent light emitting elements 11. The second resin 42 is obtained by mixing a first filler 41 having light reflectivity into the second resin 42 which becomes a base material, and becomes a first light reflective component 15 after being cured. In addition, on the first principal surface 11d, the second resin 42 is applied in a state where a mask is arranged so as to cover the electrode 11b in such a manner that the electrode 11b is exposed from the second resin layer 40, as required. Alternatively, the second resin layer may be formed so as to cover the electrode 11b, and then the electrode 11b may be exposed by grinding or the like. In this way, when the second resin 42 is cured, as shown in FIG. Figure 7 As shown, an intermediate body in which the light emitting element 11 and the second resin layer 40 are provided on the first resin layer 50 is obtained.

[0168] Then, if Figure 8 and Fig. 9As shown, a first cutting area 46 is formed in the intermediate. Here, a first tool 61 having a first thickness (first tool thickness) is used to cut adjacent light-emitting elements 11 of the second resin layer 40 at a certain interval. Then, the cutting is stopped in a state where the first resin layer 50 is exposed on the bottom surface of the first cutting area 46. At this time, it is preferred to cut not only the second resin layer 40, but also a part of the first resin layer 50. In this way, the second resin layer 40 can be reliably penetrated to expose the first resin layer 50. The first tool 61 is made of materials such as a hard metal saw, an electroformed tool blade, and a metal bonded tool blade. Here, dry cutting is performed with the first tool 61. Therefore, chips 45 of the first resin layer 50 are generated during the cutting process. The chips 45 are removed by suction, etc., and a certain amount is intentionally left in the first cutting area 46. The chips 45 become light-reflective particles 44 described later.

[0169] In addition, if Fig.10 and Fig.11 As shown, each light emitting device 3 is segmented. Fig.10 As shown, the first cutting area 46 is further cut to form the second cutting area 48. Specifically, the second cutting tool 62 having a second thickness (second cutting tool thickness) thinner than the first thickness (first cutting tool thickness) is inserted into the first cutting area 46 to cut the first resin layer 50 directly below the first cutting area 46 to form the second cutting area 48. Fig.11 As shown in FIG. 1 , the scraps 55 of the first resin layer 50 are sucked by the suction device 60. As a result, as shown in FIG. Fig.11 As shown, each light-emitting device 3 is divided. At the same time, a first inclined surface 12f is formed on the side of each light-emitting device 3. The first inclined surface 12f is formed in the vicinity of the area of ​​the second side surface 12e that is joined to the first light reflective component 15. The first inclined surface 12f is in a state of being inclined from the main plane of the second side surface 12e. This first inclined surface 12f is formed at the end edge of the first cutting area 46 during the cutting process of the first tool 61 or the second tool 62. The processing of the first inclined surface 12f can be performed using other tools different from the first tool 61 or the second tool 62, or it can be performed when the second cutting area 48 is processed using the second tool. In this way, it is possible to obtain an inclined surface that reflects the light incident on the wavelength conversion component in the direction of being taken out to the outside due to the inclination direction of the first inclined surface when the light-emitting element of the light-emitting device is made to emit light.

[0170] In addition, the light reflective particles 44 are attached to the first inclined surface 12f. After the first inclined surface 12f is formed, the light reflective particles 44 are fixed to the surface by an adhesive material or the like. Alternatively, when the first inclined surface 12f is formed, the chips generated by cutting the first cutting area 46 are attached to the first inclined surface 12f. Since the chips generated by cutting the first cutting area 46 are light reflective particles, they can be attached to the first inclined surface 12f as light reflective particles 44. In addition, when the second tool 62 is inserted to cut the first resin layer 50 directly below the first cutting area 46, because the second thickness (the second tool thickness) is thinner than the first thickness (the first tool thickness), the second tool 62 does not contact the second resin layer 40, and therefore, the chips of the light reflective particles are not exposed. That is, when the first resin layer 50 is cut with the second tool 62, the chips of the light reflective particles can be prevented or suppressed from adhering to the side of the first resin layer 50. The amount of adhesion to the first inclined surface 12f can be appropriately adjusted by adjusting the number of rotations of the blade piece and the suction.

[0171] A necessary amount of the light reflective particles 44 is fixed to the first inclined surface 12f. For example, an adhesive is applied by spraying to adhere the light reflective particles 44 to the first inclined surface 12f.

[0172] In this way, Fig.12 As shown, the light emitting device 3 arranged on the base plate 30 is obtained. In addition, Figure 7 to Figure 12 2 shows a process of cutting in a direction perpendicular to the paper surface, but similarly to this process, there is also a process of cutting in a direction parallel to the paper surface. Then, each light emitting device 3 is peeled off from the base plate 30 to obtain individual light emitting devices 3.

[0173] In this way, the light passing through the wavelength conversion component 12 is reflected in the direction of being taken out to the outside according to the inclination direction of the first inclined surface 12f, and the light is further scattered by the light-reflective particles 44 arranged on the first inclined surface 12f, so that the component taken out to the outside can be increased, thereby improving the overall light extraction efficiency of the light-emitting device.

[0174] [Implementation Method 2]

[0175] In the above example, an example in which the inclined surface is provided on the wavelength conversion member 12 side is described, but the present invention is not limited to this structure. For example, the inclined surface may be provided on the first light reflective member 15 side instead of the wavelength conversion member side. This example is shown as the light emitting device 3B of Embodiment 2. Fig.13Schematic cross-sectional view. The light emitting device 3B shown in the figure includes: a light emitting element 11, a wavelength conversion member 12, a light-transmitting adhesive member 19, a first light-reflective member 15, and light-reflective particles 44. In addition, components having the same functions as the above-mentioned components are marked with the same reference numerals and detailed descriptions are omitted.

[0176] Fig.13 The light emitting device 3B shown is provided with a second inclined surface 15f as an inclined surface in the first light reflective component 15. The second inclined surface 15f is provided in a region close to the third main surface 12c in the third side surface 15e. The second inclined surface 15f is inclined from the third side surface 15e in a direction of becoming wider downward. Therefore, according to this structure, since the area where the first light reflective component 15 is joined to the third main surface 12c can be increased, the effect of improving the close contact between the first light reflective component 15 and the wavelength conversion component 12 is obtained. In addition, the effect of reflecting the light incident on the wavelength conversion component in the direction of taking it out to the outside is improved. Moreover, by arranging the light reflective particles 44 on the third main surface 12c side (near 15f) of the wavelength conversion component 12, the range of light distribution can be adjusted.

[0177] The manufacturing method of the light emitting device 3B of the second embodiment is substantially the same as the manufacturing method of the light emitting device 3 of the first embodiment. The main difference is that when the first cutting region 46B is formed in the second resin layer 40, the cutting is stopped before the front end of the first cutting tool 61 reaches the first resin layer 50 while the second resin layer 40 is being cut by the first cutting tool 61. Fig.14 As shown in FIG. 4 , only the first cutting region 46B is formed on the second resin layer 40, and the first resin layer 50 is not exposed on the bottom surface of the first cutting region 46B. Fig.15 As shown, the second tool 62 is inserted into the first cutting area 46B, as shown in FIG. Fig.16 As shown in FIG. 1 , the second cut region 48B is formed to separate the light emitting device 3B. In this way, the light emitting device 3B of the second embodiment is obtained.

[0178] [Implementation method 3]

[0179] In the above-described structure, an example in which the inclined surface is provided in either the wavelength conversion member 12 or the first light reflecting member 15 is described. However, the present invention is not limited to this structure, and the inclined surface may be provided in both the wavelength conversion member and the first light reflecting member. This example is shown as a light emitting device 3C of Embodiment 3. Fig.17Schematic cross-sectional view. The light-emitting device 3C shown in the figure has an inclined surface 49 that is continuous from the first light-reflecting component 15 to the wavelength-converting component 12. The inclined surface 49 is formed by the second inclined surface 15f of the first light-reflecting component 15 and the first inclined surface 12f of the wavelength-converting component 12. Even with this structure, the same effects as those of the above-mentioned embodiments 1 and 2 can be obtained. That is, by reflecting the light introduced from the light-emitting element 11 to the inner side of the wavelength-converting component 12 by the first inclined surface 12f, the effect of embodiment 1 that the component of light with a wavelength change can be increased as a whole to improve the utilization efficiency of light emission, and the effect of embodiment 2 that the area of ​​bonding the first light-reflecting component 15 and the third main surface 12c is increased to improve the adhesion. In this embodiment, as in other embodiments, by attaching light-reflecting particles 44 to the first inclined surface 12f of the inclined surface 49, it is possible to increase the component taken out to the outside.

[0180] A light emitting module can be formed by using the light emitting devices of Embodiments 1 to 3 as an example. Figure 3 The light emitting module shown in FIG. 1 is described below.

[0181] (Light guide plate 1)

[0182] The light guide plate 1 is a light-transmitting member that forms light incident from a light source into a planar shape and radiates it to the outside. Figure 3 As shown, the light guide plate 1 has a first main surface 1c that becomes a light emitting surface and a second main surface 1d on the opposite side of the first main surface 1c. The light guide plate 1 is provided with a plurality of recesses 1b on the second main surface 1d. In addition, in this embodiment, grooves 1e are provided between adjacent recesses 1b.

[0183] In addition, a part of the light emitting device 3 is arranged in the recess 1b. Specifically, the wavelength conversion member 12 arranges a part of the light emitting device 3 in the recess 1b of the light guide plate 1 so as to face the bottom surface of the recess 1b. This makes it possible to reduce the thickness of the light emitting module as a whole. Figure 2 and Figure 3 As shown, the light guide plate 1 can be provided with a plurality of recesses 1 b and a part of the light emitting device 3 is disposed in each recess 1 b to form a light emitting module 100 .

[0184] Or, if Figure 4 As shown, a portion of a light emitting device 3 can be arranged in a certain light guide plate 1' of a concave portion 1b, and a plurality of light guide plates 1' can be arranged in a planar shape to form a light emitting module 100'. Figure 3 As shown in FIG. 1 , the light guide plate 1 having a plurality of recesses 1b is provided with lattice-shaped grooves 1e between the recesses 1b. Figure 4As shown, a light guide plate 1' provided with one recess 1b is provided with an inclined surface 1f toward the outer peripheral edge at the outer peripheral portion of the second main surface 1d of the light guide plate.

[0185] The second light reflecting member 16 is provided on the surface of the inclined surface 1f provided on the outer periphery of the groove 1e or the second main surface 1d of the light guide plate. The second light reflecting member 16 arranged in the groove 1e will be described in detail later. It is preferable to use a white resin that reflects light from the light emitting device 3 to prevent the light emitted by the light emitting element 11 from entering the light guide plate 1 in the vicinity divided by the groove 1e, and to prevent the light of each light emitting element 11 from leaking to the adjacent light emitting element. The second light reflecting member 16 bonded to the inclined surface 1f provided on the outer periphery of the second main surface 1d of the light guide plate of one light guide plate 1' prevents light from leaking to the periphery of the light guide plate 1, and prevents the light emission intensity from the first main surface 1c of the light guide plate 1 from decreasing.

[0186] The size of the light guide plate 1 is appropriately set according to the size of the liquid crystal display device 1000. For example, for a light guide plate 1 having a plurality of recesses 1b, one side can be about 1 cm to 200 cm, preferably about 3 cm to 30 cm. The thickness can be about 0.1 mm to 5 mm, preferably 0.1 mm to 3 mm. The planar shape of the light guide plate 1 can be, for example, roughly rectangular or roughly circular.

[0187] As the material of the light guide plate 1, resin materials such as thermoplastic resins such as acrylic, polycarbonate, cyclic polyolefin, polyethylene terephthalate, polyester, thermosetting resins such as epoxy, silicon, or optically transparent materials such as glass can be used. In particular, thermoplastic resin materials are preferred because they can be manufactured efficiently by injection molding. Among them, polycarbonate, which has high transparency and low price, is preferred. In the manufacturing process, a light-emitting module that is manufactured without being exposed to a high temperature environment such as reflow soldering can be applied with a material that has thermoplasticity and low heat resistance such as polycarbonate.

[0188] In addition, the light guide plate 1 can be formed as a single layer or can be formed by stacking a plurality of light-transmitting layers. In the case of stacking a plurality of light-transmitting layers, it is preferred to provide a layer with a different refractive index, such as an air layer, between any of the layers. In this way, a light-emitting module that makes it easy to further diffuse light and reduces brightness unevenness can be formed. This structure can be achieved, for example, by providing a spacer between any of the plurality of light-transmitting layers to separate them and providing an air layer. In addition, a light-transmitting layer can be provided on the first main surface 1c of the light guide plate 1, and a layer with a different refractive index, such as an air layer, can be provided between the first main surface 1c of the light guide plate 1 and the light-transmitting layer. In this way, a liquid crystal display device that makes it easy to further diffuse light and reduce brightness unevenness can be provided. This structure can be achieved, for example, by providing a spacer between any of the light guide plate 1 and the light-transmitting layer to separate them and providing an air layer.

[0189] (recessed portion 1b)

[0190] The light guide plate 1 is provided with a recess 1b on the second main surface 1d side of the light guide plate. A part of the light emitting device 3 is arranged in the recess 1b in such a way that the wavelength conversion component 12 faces the bottom surface of the recess 1b. The inner side surface of the recess 1b is larger than the outer side surface of the light emitting device 3 in a plan view. In detail, Figure 3 As shown, the inner side surface of the recess 1 b is located outside the outer side surface of the light emitting device 3 .

[0191] Figure 2 to Figure 4 When viewed from above, the light guide plates 1 and 1' have an inner shape of a quadrilateral in the recess 1b, and the outer shape of the light emitting device 3 arranged therein is also a quadrilateral. The quadrilateral light emitting device 3 arranged in the quadrilateral recess 1b can also be arranged so that each outer side surface of the light emitting device 3 is parallel to the inner side surface of the opposite recess 1b. In addition, each outer side surface of the light emitting device 3 can also be arranged to be rotated 45° relative to each inner side surface of the recess 1b. In addition, when viewed from above, the center of the bottom surface of the recess 1b and the center of the light emitting device 3 are preferably arranged to be roughly consistent. In this way, the distance from the side surface of the light emitting device 3 to the inner side surface of the recess 1b can be made constant, and the color unevenness of the light emitting module can be improved. However, the light emitting device with a quadrilateral outer shape can also be arranged in a posture where each side intersects with the quadrilateral recess, in other words, it is rotated relative to the quadrilateral recess.

[0192] Here, the size of the recess 1b when viewed from above changes according to the shape of the light-emitting device 3, but the diameter in the case of a circle, the major diameter in the case of an ellipse, and the length of the diagonal in the case of a quadrilateral can be set to, for example, 0.05 mm to 10 mm, preferably 0.1 mm to 2 mm. The depth can be set to 0.05 mm to 4 mm, preferably 0.1 mm to 1 mm. The shape of the recess 1b when viewed from above can be, for example, roughly rectangular or roughly circular, and can be selected based on the arrangement spacing of the recesses 1b. When the arrangement spacing of the recesses 1b (the distance between the centers of the two closest recesses 1b) is roughly equal, a roughly circular or roughly square shape is preferred. In particular, a roughly circular shape has a good effect of expanding the light from the light-emitting device 3.

[0193] The height of the concave portion 1b from the bottom surface of the concave portion 1b to the second main surface 1d of the light guide plate is as shown in the cross-sectional view. Figure 3 As shown, it is more preferable to set the height of the recess 1b so that the second principal surface 11c of the light emitting element 11 and the second principal surface 1d of the light guide plate are substantially in the same plane. In addition, the height of the recess 1b may be such that the position of the third principal surface 12c is higher than the second principal surface 1d of the light guide plate when the light emitting device 3 is mounted in the recess 1b. Thus, the light emitting device 3 protrudes from the recess 1b, and wiring work on the electrode 11b can be easily performed. In this way, it is preferable to adjust the height of the recess 1b according to the height of the light emitting device 3.

[0194] (Joining member 14)

[0195] The light-transmitting joining component 14 is in contact with the inner side surface of the recess 1b and the outer side surface of the light-emitting device 3. That is, the light-transmitting joining component 14 extends from the inner side surface of the recess 1b to the third side surface of the light-emitting device 3 located outside the recess 1b. In addition, the joining component 14 may also be in contact with a portion of the first light-reflecting component 15 located outside the recess 1b. In other words, it may also be configured to continuously cover the fourth principal surface 12d and the second side surface 12e and the third side surface 15e. Furthermore, the joining component 14 has an outer side surface and an inclined surface 14a inclined relative to the third side surface 15e. The inclined surface 14a is configured so that the inclination angle α formed between it and the third side surface 15e becomes an acute angle. In addition, the joining component 14 may also be configured between the wavelength conversion component 12 and the bottom surface of the recess 1b.

[0196] like Figure 3 As shown, when the light emitting device 3 of Embodiment 1 is fixed in the recess 1 b by the bonding member 14 , an inclined surface is formed near the third principal surface 12 c of the light emitting device 3 , thereby achieving an anchoring effect and improving adhesion.

[0197] Furthermore, if Figure 3 As shown, the joining component 14 is in contact with the second main surface 1d of the light guide plate of the light guide plate 1. As a result, the area where the inclined surface 14a is formed is expanded, a large amount of light can be reflected, and the brightness unevenness can be reduced. Here, the inclination angle α formed by the inclined surface 14a of the joining component 14 and the third side surface 15e is 5° to 85°, preferably 5° to 50°, and more preferably 10° to 45°. The width d1 between the outer side surface of the light emitting device 3 and the inner side surface of the recess 1b varies depending on the inner diameter of the recess 1b and the outer diameter of the light emitting device 3, or these shapes, the posture when the light emitting device 3 is installed in the recess 1b, the tolerance of the installation position of the light emitting device 3, etc. Moreover, the inclination angle α varies according to the height of the joining component 14, that is, the height of the light emitting device 3 (the height of the light emitting element 11 or the thickness of the wavelength conversion component 12), and the depth (height) of the recess 1b. Therefore, according to these conditions, the inclined surface 14 a of the bonding member 14 that widens downward toward the second main surface 1 d is also set according to the inclination angle α formed with the outer side surface of the first light reflecting member 15 .

[0198] In addition, if Figure 3 As shown in FIG. 1 , the bonding member 14 has an inclined surface 14a in a cross-sectional view. This shape can reflect light that passes through the bonding member 14 and enters the inclined surface 14a toward the light-emitting surface side in the same state.

[0199] As the bonding member 14, a light-transmitting thermosetting resin material such as epoxy resin or silicone resin can be used. In addition, the light transmittance of the bonding member 14 is set to be 60% or more, preferably 90% or more. In addition, the bonding member 14 may include a diffusion material, or may include a light-reflecting additive, such as white powder, or may be composed only of a light-transmitting resin material that does not include a diffusion material or white powder.

[0200] In addition, the light-transmitting bonding member 14 can have the inclined surface 14a as a curved surface in cross-sectional view. For example, the inclined surface 14a can be a curved surface that is convex toward the concave portion 1b. The inclined surface 14a allows the reflected light of the inclined surface 14a to travel in a wide range, thereby reducing uneven brightness.

[0201] In addition, the inclined surface 14a may cover the entire surface of the third side surface 15e. Figure 3 In the examples, the upper portion of the third side surface 15 e remains and is covered by a portion of the inclined surface 14 a , but the upper end of the inclined surface 14 a may be extended to the upper end of the first light reflecting member 15 .

[0202] (Optical Function Section 1a)

[0203] The light guide plate 1 can be provided with an optical function part 1a having a function of reflecting or diffusing light from the light emitting device 3 on the side of the first main surface 1c of the light guide plate. The light guide plate 1 diffuses the light from the light emitting device 3 to the side, so that the light emission intensity in the surface of the light guide plate 1 is averaged. The optical function part 1a can, for example, have a function of diffusing light in the surface of the light guide plate 1. The optical function part 1a is, for example, a concave part of a cone, a quadrangular cone, a hexagonal cone, or a concave part of a truncated cone or a polygonal truncated cone, which is provided on the side of the first main surface 1c of the light guide plate. Thus, a structure can be used in which light irradiated at the interface between the light guide plate 1, a material with a different refractive index (for example, air) in the optical function part 1a, and an inclined surface of the concave part is reflected in the lateral direction of the light emitting device 3. In addition, for example, a light-reflecting material (for example, a reflective film of a metal or a white resin) can be provided in the concave part having an inclined surface. The inclined surface of the optical function part 1a can be a plane or a curved surface in a cross-sectional view.

[0204] (Second Light Reflective Member 16)

[0205] like Figure 3 As shown, the second light reflective component 16 covers the second main surface 1d side of the light guide plate 1. Specifically, the second light reflective component 16 covers the area not covered by the bonding component 14 on the second main surface 1d of the light guide plate 1, the inclined surface 14a of the light-transmitting bonding component 14, and the third side surface 15e.

[0206] The second light reflective member 16 can improve light extraction efficiency by reflecting light emitted from the light emitting element 11 and light incident into the light guide plate 1 and guiding the light to the first main surface 1c of the light guide plate, which becomes a light emitting surface for radiating light to the outside. In addition, by being stacked on the light guide plate 1, the light guide plate 1 is reinforced.

[0207] The second light reflecting member 16 is preferably made of the same material as the first light reflecting member 15, that is, a white resin in which a light-reflecting additive, such as white powder, is added to a transparent resin. The second light reflecting member 16 allows the light emitted by the light emitting element 11 to be efficiently radiated from the light guide plate first main surface 1c of the light guide plate 1 to the outside.

[0208] In addition, the second light reflective member 16 has a reflectivity of 60% or more, preferably 90% or more, with respect to the light emitted from the light emitting element 11, similarly to the first light reflective member 15. The white resin is preferably a resin containing a white pigment such as white powder. In particular, a silicone resin containing an inorganic white powder such as TiO2 is preferred. Thus, in order to cover one side of the light guide plate 1, by using a large amount of cheap raw material of TiO2 as a relatively large amount of material, the light emitting module 100 can be made low-priced.

[0209] In the above light emitting module 100, the light guide plate 1 is provided with a recess 1b, and the light emitting device 3 is arranged in the recess 1b, so that the overall thickness can be reduced. In addition, the recess 1b is provided in the light guide plate 1, and the light emitting device 3 is arranged in the recess 1b, so that the mounting accuracy of the light emitting device 3 and the light guide plate 1 is improved. In particular, by setting a structure in which the wavelength conversion member 12 is bonded to the light emitting element 11, and the light emitting device 3 that forms an integrated structure of the light emitting element 11 and the wavelength conversion member 12 is arranged in the recess 1b of the light guide plate 1, the mounting accuracy of the wavelength conversion member 12 and the light emitting element 11 on the light guide plate 1 is improved, and excellent light emitting characteristics can be achieved. In addition, the light of the light emitting element 11 is made to pass through the wavelength conversion member 12 and guide to the light guide plate 1, and in the light emitting module 100 radiated to the outside, the light emitting element 11, the wavelength conversion member 12, and the light guide plate 1 can be arranged with good accuracy, so that the light emitting characteristics such as color unevenness or brightness unevenness of the light radiated from the light guide plate 1 to the outside are improved, and in particular, excellent light emitting characteristics are achieved.

[0210] The joint member 14 is connected to the second side surface 12e and the inner side surface of the light guide plate 1. In addition, by connecting to the first light reflective member 15 located outside the recess 1b, the light emitted from the wavelength conversion member 12 can be used to guide the light exposed on the second light reflective member 16 side to the side close to the light emitting device 3, thereby improving the uneven brightness. In addition, the light emitted from the wavelength conversion member 12 can be further injected into the light guide plate 1, which can improve the light extraction efficiency.

[0211] In a direct-type liquid crystal display device, the distance between the liquid crystal panel and the light-emitting module is close, so the color unevenness or brightness unevenness of the light-emitting module may affect the color unevenness or brightness unevenness of the liquid crystal display device. Therefore, as a light-emitting module of a direct-type liquid crystal display device, a light-emitting module with less color unevenness or brightness unevenness is desired. If the structure of the light-emitting module 100 of this embodiment is adopted, the thickness of the light-emitting module 100 is reduced to less than 5 mm, less than 3 mm, less than 1 mm, etc., and the brightness unevenness or color unevenness can be reduced at the same time.

[0212] In addition, a light-transmitting component having a diffusion function or the like may be further laminated on the light guide plate 1. In this case, when the optical function portion 1a is a concave portion, the opening of the concave portion (i.e., the portion close to the first main surface 1c of the light guide plate 1) is blocked, but it is preferred to provide a light-transmitting component in a manner that does not fill the concave portion. Thus, an air layer can be provided in the concave portion of the optical function portion 1a, and the light from the light-emitting element 11 can be diffused well.

[0213] Industrial Applicability

[0214] The light-emitting device, light-emitting module, and method for manufacturing the light-emitting device disclosed herein can be used as a backlight for a television, tablet, or liquid crystal display device, and can be suitably used for a television, tablet, smart phone, smart watch, head-up display, digital signage, bulletin board, etc. In addition, it can also be used as a light source for lighting, and can also be used for emergency lighting, line lighting, various lighting, or vehicle-mounted instrument panels, etc.

Claims

1. A light emitting device comprising: A light-emitting element having a first main surface provided with an electrode, a second main surface opposite to the first main surface, and a first side surface continuous with the first main surface and the second main surface; a wavelength conversion member having a third main surface, a fourth main surface opposite to the third main surface, and a second side surface continuous with the third main surface and the fourth main surface, and converting the wavelength of light emitted by the light emitting element to emit light of a different wavelength, wherein the third main surface is a rectangular shape having a larger area than the second main surface and is bonded to the second main surface; a light-transmitting adhesive member that continuously covers the second main surface side of the first side surface and a portion of the third main surface; a first light reflective member covering the first side surface on which the light-transmitting adhesive member is provided and having a third side surface therearound; The first light reflective component contains a first filler having light reflectivity, The distance between the third side surfaces in a cross section in a direction perpendicular to the second main surface is smaller than the distance between the second side surfaces on the fourth main surface side of the second side surface. The wavelength conversion member has a first inclined surface inclined toward a region of the second side surface close to the third main surface, The wavelength conversion member has light reflective particles on a surface of the first inclined surface.

2. The light emitting device according to claim 1, wherein: The first light reflecting member includes a second inclined surface inclined toward a region of the third side surface close to the third main surface, and the second inclined surface is continuous with the first inclined surface.

3. The light emitting device according to claim 2, wherein: The first inclined surface is at least partially formed into a curved surface.

4. The light emitting device according to any one of claims 1 to 3, wherein: The light reflective particles are made of the same material as that of the first filler.

5. The light emitting device according to claim 4, wherein: The first filler comprises TiO2.

6. A light emitting device comprising: A light-emitting element having a first main surface provided with an electrode, a second main surface opposite to the first main surface, and a first side surface continuous with the first main surface and the second main surface; a wavelength conversion member having a third main surface, a fourth main surface opposite to the third main surface, and a second side surface continuous with the third main surface and the fourth main surface, and converting the wavelength of light emitted by the light emitting element to emit light of a different wavelength, wherein the third main surface is a rectangular shape having a larger area than the second main surface and is bonded to the second main surface; a light-transmitting adhesive member that continuously covers the second main surface side of the first side surface and a portion of the third main surface; a first light reflective member covering the first side surface on which the light-transmitting adhesive member is provided and having a third side surface therearound; The first light reflective component contains a first filler having light reflectivity, The distance between the third side surfaces in a cross section in a direction perpendicular to the second main surface is smaller than the distance between the second side surfaces on the fourth main surface side of the second side surface. The first light reflecting member has a second inclined surface that is inclined toward a region of the third side surface that is close to the third main surface.

7. The light emitting device according to claim 6, wherein: The first filler comprises TiO2.

8. A light emitting module comprising: The light emitting device according to any one of claims 1 to 7; A light-transmitting light guide plate having a first main surface of the light guide plate and a second main surface of the light guide plate, wherein the first main surface of the light guide plate is a light-emitting surface that radiates light to the outside, and the second main surface of the light guide plate is a surface on the side opposite to the first main surface of the light guide plate and has a recessed portion for arranging the light-emitting device; The second light reflective member covers the second main surface of the light guide plate and the light emitting device.

9. The light emitting module according to claim 8, wherein: In cross-sectional view, at least a portion of the first light reflective component is located outside the recessed portion. a light-transmitting joining member connected to the inner side surface of the recess and the outer side surface of the light-emitting device, The engaging member extends toward the third side surface located outside the recess.

10. A method for manufacturing a light emitting device, the light emitting device comprising a light emitting element, a wavelength conversion member, a light transmissive adhesive member, and a first light reflective member, The manufacturing method of the light emitting device comprises the following steps: A first resin layer, a plurality of the light-emitting elements, and a second resin layer are prepared, wherein the first resin layer becomes the wavelength conversion member, and a fluorescent substance is mixed in the first resin, and the plurality of the light-emitting elements are arranged separately from each other on the upper surface of the resin layer, and the second resin layer is arranged between adjacent light-emitting elements, becomes the first light-reflective member, and contains a first filler having light reflectivity; Cutting the second resin layer at a certain interval using a first cutting tool having a first thickness to form a first cutting area; A second tool having a second thickness thinner than the first thickness is inserted into the first cutting area, and the first resin layer directly below the first cutting area is cut to form a second cutting area, thereby separating each light-emitting device, and in the side surface of each light-emitting device, a first inclined surface inclined from the plane of the second side surface is formed near the area joined to the first light-reflective component in the second side surface serving as the side surface of the wavelength conversion component, and light-reflective particles are attached to the first inclined surface.

11. The method for manufacturing a light emitting device according to claim 10, In the step of forming the first cutting region in the second resin layer, a portion of the first resin layer is cut using the tip of the first blade.

12. A method for manufacturing a light emitting device, the light emitting device comprising: a light emitting element, a wavelength conversion member, a light transmissive adhesive member, and a first light reflective member, The manufacturing method of the light emitting device comprises the following steps: A first resin layer, a plurality of the light-emitting elements, and a second resin layer are prepared, wherein the first resin layer becomes the wavelength conversion member, and a fluorescent substance is mixed in the first resin, and the plurality of the light-emitting elements are arranged separately from each other on the upper surface of the resin layer, and the second resin layer is arranged between adjacent light-emitting elements, becomes the first light-reflective member, and contains a first filler having light reflectivity; Cutting the second resin layer at a certain interval using a first cutting tool having a first thickness to form a first cutting area; A second tool having a second thickness thinner than the first thickness is inserted into the first cutting area, and the first resin layer directly below the first cutting area is cut to form a second cutting area, thereby separating each light-emitting device, and in the side of each light-emitting device, a second inclined surface inclined from the plane of the third side surface is formed near the area joined to the wavelength conversion component in the third side surface which is the side surface of the first light-reflective component.

13. The method for manufacturing a light emitting device according to claim 12, wherein: In the step of forming the first cutting region in the second resin layer, cutting is stopped before the tip of the first blade reaches the first resin layer.

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