Display device and method of manufacturing the same

Abstract

This disclosure relates to a display device and its manufacturing method, and pertains to the field of display technology. The display device includes a display panel, a support layer, a circuit board, and a shielding layer. The support layer is disposed on the backlight side of the display panel and is made of a conductive material. The circuit board is disposed on the side of the support layer facing away from the display panel and is electrically connected to the display panel. The shielding layer covers the side of the circuit board facing away from the display panel and includes a first insulating layer and a conductive layer distributed along the direction facing away from the display panel. The conductive layer includes an electrically connected shielding portion and a lead-out portion, with at least a portion of the lead-out portion exposed by the first insulating layer. The orthographic projection of the shielding portion on the display panel is within the orthographic projection of the circuit board on the display panel, and the orthographic projection of the lead-out portion on the display panel is outside the orthographic projection of the circuit board on the display panel. The lead-out portion is electrically connected to the support layer. The display device of this disclosure can shield against electrostatic interference.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular, to a display device and a manufacturing method thereof. Background Art

[0002] At present, in order to reduce the width of the frame of the display panel, the circuit board used to drive the display panel is usually arranged on the back side of the display panel, eliminating the space for arranging the circuit board at the edge of the display panel, thereby reducing the width of the frame. However, since the circuit board is provided with circuits including electronic devices and wiring, it is easily interfered by static electricity, affecting normal display.

[0003] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of the present disclosure, and therefore may include information that does not constitute the prior art known to ordinary technicians in the field. Summary of the invention

[0004] An object of the present disclosure is to provide a display device and a method for manufacturing the same.

[0005] According to one aspect of the present disclosure, there is provided a display device, comprising:

[0006] Display panel;

[0007] A support layer, disposed on the backlight side of the display panel, the support layer being made of a conductive material;

[0008] A circuit board is disposed on a side of the support layer away from the display panel and is electrically connected to the display panel;

[0009] A shielding layer covers the side of the circuit board away from the display panel, and includes a first insulating layer and a conductive layer distributed in a direction away from the display panel; the conductive layer includes an electrically connected shielding portion and a lead-out portion, and the first insulating layer exposes at least a portion of the lead-out portion; the orthographic projection of the shielding portion on the display panel is located within the orthographic projection of the circuit board on the display panel, the orthographic projection of the lead-out portion on the display panel is located outside the orthographic projection of the circuit board on the display panel, and the lead-out portion is electrically connected to the supporting layer.

[0010] In an exemplary embodiment of the present disclosure, the orthographic projection of the first insulating layer on the display panel is located within the orthographic projection of the circuit board on the display panel;

[0011] An orthographic projection of the lead-out portion on the display panel is located outside an orthographic projection of the first insulating layer on the display panel.

[0012] In an exemplary embodiment of the present disclosure, the circuit board includes:

[0013] substrate;

[0014] A circuit layer is provided on a side of the substrate close to the display panel; the circuit layer has a static electricity derivation portion, and the orthographic projection of the static electricity derivation portion on the display panel at least partially overlaps with the orthographic projection of the support layer on the display panel;

[0015] A protective layer covering the circuit layer and exposing the static electricity lead-out portion;

[0016] The static electricity lead-out portion is electrically connected to the support layer.

[0017] In an exemplary embodiment of the present disclosure, the material of the conductive layer includes at least one of conductive glue and conductive fabric.

[0018] In an exemplary embodiment of the present disclosure, the shielding layer further comprises:

[0019] The second insulating layer is disposed on a surface of the conductive layer away from the display panel and covers the shielding portion and the lead-out portion.

[0020] In an exemplary embodiment of the present disclosure, the shielding layer further comprises:

[0021] The absorbing layer is arranged between the conductive layer and the first insulating layer, and the orthographic projection of the absorbing layer on the display panel is located within the orthographic projection of the first insulating layer on the display panel. The material of the absorbing layer includes an absorbing material that can absorb electromagnetic waves.

[0022] In an exemplary embodiment of the present disclosure, the absorbing material includes graphite.

[0023] In an exemplary embodiment of the present disclosure, the shielding layer further comprises:

[0024] The heat dissipation layer is disposed between the absorbing layer and the conductive layer, and the orthographic projection of the heat dissipation layer on the display panel is located within the orthographic projection of the first insulating layer on the display panel.

[0025] In an exemplary embodiment of the present disclosure, the material of the heat dissipation layer includes copper.

[0026] In an exemplary embodiment of the present disclosure, the display panel has a display area and a peripheral area outside the display area; the display panel includes a driving backplane and a light-emitting layer located on one side of the driving backplane, and the light-emitting layer is located in the display area;

[0027] The display device further includes:

[0028] A flexible connecting circuit board has one end stacked on the surface of the driving backplane close to the light-emitting layer in the peripheral area and electrically connected to the driving backplane; and the other end bent to the side of the supporting layer away from the circuit board and electrically connected to the circuit board.

[0029] In an exemplary embodiment of the present disclosure, a distance between the lead-out portion and the support layer is smaller than a distance between the shielding portion and the support layer.

[0030] In an exemplary embodiment of the present disclosure, the conductive layer located at the lead-out portion is directly attached to the support layer or is electrically connected to the support layer through a conductive medium.

[0031] According to one aspect of the present disclosure, there is provided a method for manufacturing a display device, comprising:

[0032] A display panel, a circuit board and a shielding layer are formed; the shielding layer comprises a first insulating layer and a conductive layer located on one side of the first insulating layer; the conductive layer comprises an electrically connected shielding portion and a lead-out portion, and the first insulating layer exposes at least a portion of the lead-out portion;

[0033] forming a support layer on the backlight side of the display panel;

[0034] The circuit board is electrically connected to the display panel and is placed on the backlight side of the display panel;

[0035] The shielding layer is covered on a side of the circuit board away from the display panel, so that the first insulating layer and the conductive layer are distributed in a direction away from the display panel, the orthographic projection of the shielding portion on the display panel is located within the orthographic projection of the circuit board on the display panel, and the orthographic projection of the lead-out portion on the display panel is located outside the orthographic projection of the circuit board on the display panel;

[0036] The lead-out portion is electrically connected to the support layer.

[0037] The display device and manufacturing method disclosed herein cover the shielding layer on the side of the circuit board away from the display panel, the first insulating layer is located between the conductive layer and the circuit board, the conductive layer is electrically connected to the support layer, and the static electricity can be conducted to the support layer through the conductive layer, and the path of the static electricity outside the display device to the circuit board is blocked by the conductive layer and the support layer, so as to prevent the static electricity outside from interfering with the circuit board, avoid the display abnormality of the display device due to the static electricity interference, and ensure the display effect. At the same time, because the lead-out portion of the conductive layer is located on the outside of the circuit board, opposite to the support layer, the requirements for alignment accuracy are low, and it is easy to install.

[0038] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] The accompanying drawings herein are incorporated into the specification and constitute a part of the specification, illustrate embodiments consistent with the present disclosure, and together with the specification are used to explain the principles of the present disclosure. Obviously, the accompanying drawings described below are only some embodiments of the present disclosure, and for ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without creative work.

[0040] Figure 1 It is a cross-sectional schematic diagram of an embodiment of the display device disclosed in the present invention.

[0041] Figure 2 It is a schematic diagram of the backlight side of a display panel of an embodiment of the display device disclosed herein.

[0042] Figure 3 It is a cross-sectional schematic diagram of another embodiment of the display device disclosed in the present invention.

[0043] Figure 4 It is a cross-sectional schematic diagram of another embodiment of the display device disclosed in the present invention.

[0044] Figure 5 It is a cross-sectional schematic diagram of another embodiment of the display device disclosed in the present invention.

[0045] Figure 6 FIG. 4 is a schematic diagram of a circuit board in an embodiment of the display device disclosed herein.

[0046] Description of reference numerals:

[0047] 1. Display panel; 11. Driving backplane; 12. Light-emitting layer; 101. Display area; 102. Peripheral area;

[0048] 2. Support layer;

[0049] 3. Circuit board; 31. Base; 32. Circuit layer; 321. Electrostatic discharge part; 33. Protective layer;

[0050] 4. Flexible connection circuit board;

[0051] 5. Shielding layer; 51. First insulating layer; 52. Conductive layer; 521. Shielding portion; 522. Leading portion; 53. Second insulating layer; 54. Wave absorbing layer; 55. Heat dissipation layer;

[0052] 6. Conductive medium. DETAILED DESCRIPTION

[0053] Example embodiments will now be described more fully with reference to the accompanying drawings. However, the example embodiments can be implemented in a variety of forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that the present disclosure will be comprehensive and complete and fully convey the concepts of the example embodiments to those skilled in the art. The same reference numerals in the figures represent the same or similar structures, and thus their detailed description will be omitted. In addition, the drawings are only schematic illustrations of the present disclosure and are not necessarily drawn to scale.

[0054] The terms "a", "an", "the", "said" and "at least one" are used to indicate the presence of one or more elements / components / etc.; the terms "including" and "having" are used to express an open-ended inclusive meaning and mean that additional elements / components / etc. may exist in addition to the listed elements / components / etc.; the terms "first", "second" and "third" etc. are used merely as labels and are not intended to limit the quantity of their objects.

[0055] The present disclosure provides a display device, which can be used in electronic devices with display functions such as mobile phones, tablet computers, and televisions. Figure 1-Figure 5 As shown, the display device may include a display panel 1, a support layer 2, a circuit board 3 and a shielding layer 5, wherein:

[0056] The support layer 2 is disposed on the backlight side of the display panel 1, and the support layer 2 is made of a conductive material;

[0057] The circuit board 3 is disposed on a side of the support layer 2 away from the display panel 1 and is connected to the display panel 1;

[0058] The shielding layer 5 covers the side of the circuit board 3 away from the display panel 1, and includes a first insulating layer 51 and a conductive layer 52 distributed in a direction away from the display panel 1; the conductive layer 52 includes an electrically connected shielding portion 521 and a lead-out portion 522, and the first insulating layer 51 exposes at least a portion of the lead-out portion 522; the orthographic projection of the shielding portion 521 on the display panel 1 is located within the orthographic projection of the circuit board 3 on the display panel 1, and the orthographic projection of the lead-out portion 522 on the display panel 1 is located outside the orthographic projection of the circuit board 3 on the display panel 1, and the lead-out portion 522 is electrically connected to the support layer 2.

[0059] In the display device of the embodiment of the present disclosure, the circuit board 3 is used to drive the display panel 1 to emit light to display an image. Since the shielding layer 5 covers the side of the circuit board 3 facing away from the display panel 1, the first insulating layer 51 is located between the conductive layer 52 and the circuit board 3, and the conductive layer 52 is electrically connected to the support layer 2, so that static electricity can be conducted to the support layer 2 through the conductive layer 52, and the conductive layer 52 and the support layer 2 block the path of static electricity from the outside of the display device to the circuit board 3, preventing static electricity from the outside from interfering with the circuit board 3, avoiding display abnormalities of the display device due to static electricity interference, and ensuring the display effect. At the same time, since the lead-out portion 522 of the conductive layer 52 is located on the outside of the circuit board 3, opposite to the support layer 2, the requirements for alignment accuracy are low, which is convenient for installation.

[0060] The structure of the display device of the present disclosure to realize the display function is described in detail below:

[0061] like Figure 1 As shown, the display device of the present disclosure may include a display panel 1 and a circuit board 3. The display panel 1 may emit light to one side, and the side away from the light emitting direction is the backlight side. The display panel 1 may be a liquid crystal display panel, an OLED (Organic Light-Emitting Diode) display panel, or a Micro LED display panel, etc., and their types are not specifically limited here. The circuit board 3 is connected to the display panel 1 and is used to drive the display panel 1 to emit light. This article takes an OLED display panel using OLED as a light-emitting device as an example for explanation.

[0062] The display panel 1 may include a driving backplane 11 and a light-emitting layer 12. The light-emitting layer 12 is disposed on one side of the driving backplane 11. The light-emitting layer 12 includes a plurality of light-emitting devices. The side of the driving backplane 11 away from the light-emitting layer 12 is the backlight side of the display panel 1.

[0063] The driving backplane 11 may include a substrate and a driving circuit layer. The substrate is a plate-like structure, and its material may be a hard material such as glass, or a soft material such as polyimide. The driving circuit layer may be arranged on one side of the substrate away from the light-emitting layer 12 and include a driving circuit. Figure 1 and Figure 2As shown, the display panel 1 can be divided into at least a display area 101 and a peripheral area 102 outside the display area 101. Accordingly, the driving circuit layer may include a pixel circuit at least partially located in the display area 101 and a peripheral circuit located in the peripheral area 102, wherein the pixel circuit may be a 6T1C, 6T2C, 7T1C, 7T2C or other pixel circuit, as long as it can drive the light-emitting device to emit light, and its structure is not specifically limited here. The number of pixel circuits is the same as the number of light-emitting devices, and is connected to each light-emitting device in a one-to-one correspondence so as to control each light-emitting device to emit light respectively. Among them, nTmC means that a pixel circuit includes n transistors (represented by the letter "T") and m capacitors (represented by the letter "C").

[0064] The peripheral circuit is located in the peripheral area 102, and is connected to the pixel circuit, and is used to input a driving signal to the pixel circuit so as to control the light-emitting device to emit light. The peripheral circuit is connected to the pixel circuit and includes a light-emitting control circuit, a gate driving circuit, a source driving circuit, and a power supply circuit, etc., and its structure is not specifically limited here.

[0065] The above-mentioned driving circuit layer may include multiple thin film transistors and capacitors, wherein the thin film transistors may be top-gate or bottom-gate thin film transistors, and each thin film transistor may include an active layer, a gate, a source and a drain, wherein the gate may be a double gate or a single gate, and the active layer of each thin film transistor is arranged on the same layer, the gate is arranged on the same layer, and the source and the drain are arranged on the same layer to simplify the process.

[0066] Taking the top-gate thin film transistor as an example, the driving circuit layer may include an active layer, a first gate insulating layer, a gate electrode, a second gate insulating layer, an interlayer dielectric layer, a source-drain layer and a flat layer. The active layer is arranged on one side of the substrate, and the first gate insulating layer covers the active layer and the substrate; the gate electrode is arranged on the surface of the first gate insulating layer away from the substrate, and is directly opposite to the active layer; the second gate insulating layer covers the gate electrode and the first gate insulating layer; the interlayer dielectric layer covers the second gate insulating layer; the source-drain layer is arranged on the surface of the interlayer dielectric layer away from the substrate, and includes a source electrode and a drain electrode, and the source electrode and the drain electrode are connected to the two ends of the active layer through contact holes; the flat layer covers the source-drain layer and the interlayer dielectric layer. Of course, the driving circuit layer may also include other film layers, as long as they can drive the light-emitting device to emit light, which will not be described in detail here.

[0067] like Figure 1 As shown, the light-emitting layer 12 is disposed on one side of the driving backplane 11, for example, the light-emitting layer 12 is disposed on the surface of the flat layer away from the substrate. And at least part of the light-emitting layer 12 is located within the display area 101. The light-emitting layer 12 may include a plurality of light-emitting devices distributed in an array. For example, the light-emitting device is an OLED, which may include a first electrode, a light-emitting functional layer, and a second electrode stacked in sequence in a direction away from the driving backplane 11, wherein:

[0068] The first electrode may be disposed on the side of the flat layer away from the substrate and connected to a pixel circuit through a contact hole. The light-emitting functional layer may include a hole injection layer, a hole transport layer, a light-emitting material layer, an electron transport layer and an electron injection layer stacked in sequence in a direction away from the driving backplane 11. The second electrode may cover the light-emitting functional layer and extend to the peripheral area 102. The specific principle of OLED light emission is not described in detail here.

[0069] In addition, in order to facilitate the definition of the range of each light-emitting device, the light-emitting layer 12 may also include a pixel definition layer, which may be arranged on the surface of the driving circuit layer away from the substrate together with the first electrode, and is provided with a plurality of openings that expose each first electrode in a one-to-one correspondence. The light-emitting functional layer is stacked on the area where the first electrode is located in the opening. The light-emitting functional layers of each light-emitting device are distributed independently at intervals. The light-emitting colors of different light-emitting functional layers may be different. The second electrode covers the light-emitting functional layer, so that each light-emitting device can share the same second electrode. Each light-emitting device can be defined by the above-mentioned multiple openings, and the boundary of any light-emitting device is the boundary of the light-emitting functional layer in its corresponding opening.

[0070] Of course, in some embodiments of the present disclosure, the light-emitting functional layer of each light-emitting device may belong to the same continuous light-emitting film layer, which simultaneously covers the surface of each first electrode and the pixel definition layer away from the substrate. The area where the light-emitting film layer is located in the opening and stacked on the first electrode is the light-emitting functional layer of the light-emitting device, and two adjacent light-emitting functional layers are connected through other areas of the light-emitting film layer. In other words, each light-emitting device can share the light-emitting film layer, so the light-emitting color of each light-emitting device is the same. Accordingly, in order to achieve color display, a color filter layer can be provided on the side of the light-emitting layer 12 away from the driving backplane 11. The color filter layer has a plurality of filter parts, each filter part is provided in a one-to-one correspondence with each light-emitting unit, and the color of light that can be transmitted by different filter parts can be different, so that color display can be achieved by combining the color filter layer with the light-emitting layer 12.

[0071] In addition, the display panel 1 may further include an encapsulation layer, which may cover the surface of the light-emitting layer 12 away from the driving backplane 11 and cover all light-emitting devices, thereby protecting the light-emitting layer 12 and preventing the light-emitting devices from being corroded by water and oxygen from the outside. At the same time, the boundary of the encapsulation layer extends into the peripheral area 102, but does not exceed the peripheral area 102, and can also protect the peripheral circuits of the peripheral area 102.

[0072] In some embodiments of the present disclosure, encapsulation may be achieved by thin-film encapsulation (TFE), and the encapsulation layer may include a first inorganic layer, an organic layer, and a second inorganic layer. The first inorganic layer covers the surface of the light-emitting layer 12 away from the driving backplane 11, the organic layer may be arranged on the surface of the first inorganic layer away from the driving backplane 11, and the boundary of the organic layer is limited to the inner side of the boundary of the first inorganic layer. The second inorganic layer covers the organic layer and the first inorganic layer not covered by the organic layer, and the intrusion of water and oxygen can be blocked by the second inorganic layer, and planarization can be achieved by the flexible organic layer.

[0073] In addition, the display panel 1 may further include a transparent cover plate, which may cover the side of the encapsulation layer away from the driving backplane 11 ; or, if a color filter layer exists in the display panel 1 , the transparent cover plate covers the side of the color filter layer away from the driving backplane 11 .

[0074] like Figure 1 As shown, in order to provide support for the display panel 1, especially for a flexible display panel 1 whose substrate is a flexible material, in order to prevent it from being damaged due to bending, a support layer 2 may be provided on the backlight side of the display panel 1, and the support layer 2 may be attached to the display panel 1, and the material thereof may be stainless steel or other materials having a higher strength than the display panel 1. The thickness of the support layer 2 is lower than the thickness of the display panel 1, and if the display panel 1 is a flexible display panel 1, the support layer 2 may bend as the display panel 1 bends.

[0075] like Figure 1 and Figure 6 As shown, the circuit board 3 can be connected to the display panel 1. Specifically, the circuit board 3 can be connected to the peripheral area 102 of the display panel 1 to input signals to the peripheral circuit so as to drive the display panel 1 to emit light. At the same time, the circuit board 3 can be arranged on the side of the support layer 2 away from the display panel 1, and the orthographic projection of the circuit board 3 on the display panel 1 at least partially overlaps with the orthographic projection of the support layer 2 on the display panel 1. The circuit board 3 can be a flexible circuit board 3 (FPC), of course, it can also be other structures without special limitation here.

[0076] In order to realize the connection between the peripheral area 102 of the display panel 1 and the circuit board 3, the circuit board 3 is placed on the side of the support layer 2 away from the display panel 1, such as Figure 1 As shown, in some embodiments of the present disclosure, a binding area connected to the peripheral circuit is provided in the peripheral area 102, and the binding area and the circuit board 3 are connected by a flexible connection circuit board 4 to realize the electrical connection between the circuit board 3 and the peripheral circuit. For example, the flexible connection circuit board 4 is a chip-on-film. The flexible connection circuit board 4 can be bent toward the backlight side of the display panel 1 while realizing the electrical connection, so that the circuit board 3 can be located on the side of the support layer 2 away from the display panel 1. For example: Figure 1As shown, one end of the flexible connection circuit board 4 is stacked on the surface of the driving back plate 11 close to the light-emitting layer 12 and located in the peripheral area 102, and is electrically connected to the binding area of ​​the driving back plate 11, and can be connected to the peripheral circuit through the binding area. Of course, the end of the flexible connection circuit board 4 electrically connected to the driving back plate 11 can be located on the same surface of the driving back plate 11 as the light-emitting layer 12. The other end of the flexible connection circuit board 4 is bent to the side of the supporting layer 2 away from the circuit board 3, and is electrically connected to the circuit board 3, thereby electrically connecting the circuit board 3 and the peripheral circuit.

[0077] like Figure 3 As shown, in some other embodiments of the present disclosure, the substrate of the driving backplane 11 can be made of a flexible material, so that the driving backplane 11 is a flexible structure. The peripheral area 102 is provided with a binding area connected to the peripheral circuit, and the circuit board 3 can be directly electrically connected to the binding area of ​​the peripheral circuit. Since the driving backplane 11 is flexible, at least the binding area can be bent toward the backlight side of the display panel 1, so that the circuit board 3 can be located on the side of the support layer 2 away from the display panel 1.

[0078] Of course, in other embodiments of the present disclosure, other methods may be used to electrically connect the circuit board 3 to the display panel 1, as long as the circuit board 3 is located on the side of the support layer 2 away from the display panel 1 while achieving electrical connection.

[0079] like Figure 1 As shown, in some embodiments of the present disclosure, the circuit board 3 may include a substrate 31, a circuit layer 32 and a protective layer 33, wherein:

[0080] The substrate 31 may be made of an insulating material. For the flexible circuit board 3, the substrate 31 may be made of a flexible material such as polyimide. The circuit layer 32 may be disposed on a side of the substrate 31 close to the display panel 1. The pattern of the circuit layer 32 and the electronic devices contained therein are not particularly limited herein. The protective layer 33 may cover the circuit layer 32, and the material of the protective layer 33 is an insulating material to prevent the circuit layer 32 from contacting the outside.

[0081] The following is a detailed description of the solution for realizing the electrostatic shielding function of the display panel 1 disclosed in the present invention:

[0082] like Figure 1 As shown, in order to prevent static electricity outside the display device from interfering with the circuits and electronic components on the circuit board 3, the circuit board 3 can be covered by a shielding layer 5 from the side of the circuit board 3 facing away from the display panel 1, and the supporting layer 2 can be made of a metal material such as stainless steel. The shielding layer 5 can be electrically connected to the supporting layer 2, thereby conducting external static electricity to the supporting layer 2 without interfering with the circuit board 3.

[0083] like Figure 1 As shown, the shielding layer 5 may include a first insulating layer 51 and a conductive layer 52, wherein:

[0084] The first insulating layer 51 covers at least a portion of the surface of the circuit board 3 facing away from the display panel 1; the material of the first insulating layer 51 may be a polyester material, such as polyimide, etc., of course, it may also be other insulating materials. The first insulating layer 51 may completely cover the circuit board 3, or may only cover a portion of the circuit board 3. Furthermore, in some embodiments of the present disclosure, the orthographic projection of the first insulating layer 51 on the display panel 1 is located within the orthographic projection of the circuit board 3 on the display panel 1, that is, the boundary of the first insulating layer 51 is limited to the boundary of the circuit board 3, and the boundary of the first insulating layer 51 is at most aligned with the boundary of the circuit board 3, and does not exceed the boundary of the circuit board 3.

[0085] The conductive layer 52 is disposed on the side of the first insulating layer 51 away from the display panel 1. The conductive layer 52 can be separated from the circuit board 3 by the first insulating layer 51 to prevent the circuit board 3 from being electrically connected to the conductive layer 52, thereby causing the conductive layer 52 to short-circuit the circuit board 3. At the same time, the conductive layer 52 can be electrically connected to the supporting layer 2 to conduct static electricity from the outside. Specifically, the conductive layer 52 can include a shielding portion 521 and a lead-out portion 522, wherein:

[0086] The orthographic projection of the shielding portion 521 on the display panel 1 is located within the orthographic projection of the circuit board 3 on the display panel 1, that is, the range of the shielding portion 521 does not exceed the boundary of the circuit board 3. At the same time, the boundary of the shielding portion 521 can be aligned with the boundary of the first insulating layer 51, or located within the boundary of the first insulating layer 51, that is, the first insulating layer 51 completely covers the shielding portion 521, avoiding direct contact between the shielding portion 521 and the circuit board 3, and preventing the shielding portion 521 from contacting the circuit board 3 and causing a short circuit in the circuit board 3.

[0087] like Figure 1 and Figure 2 As shown, the lead-out portion 522 is electrically connected to the shielding portion 521, and the two may be different regions of the same continuous film layer, or may be electrically connected independent structures. The orthographic projection of the lead-out portion 522 on the display panel 1 is located outside the orthographic projection of the circuit board 3 on the display panel 1, that is, the lead-out portion 522 extends out of the boundary of the circuit board 3. At the same time, the first insulating layer 51 exposes at least part of the lead-out portion 522, that is, at least part of the lead-out portion 522 is not covered by the first insulating layer 51; for example, the orthographic projection of the lead-out portion 522 on the display panel 1 may be located outside the orthographic projection of the first insulating layer 51 on the display panel 1, that is, the lead-out portion 522 is located outside the boundary of the first insulating layer 51, and is not completely covered by the first insulating layer 51; or, the first insulating layer 51 may cover the lead-out portion 522, but a through hole exposing the lead-out portion 522 may be opened in the first insulating layer 51, thereby exposing part of the lead-out portion 522.

[0088] The material of the conductive layer 52 can be at least one of conductive adhesive and conductive fabric, the conductive adhesive can include a substrate and conductive particles such as metal particles in the substrate, and the conductive fabric can be conductive cloth. Of course, the conductive layer 52 can also be made of other materials as long as it can achieve a conductive effect.

[0089] The lead-out portion 522 not covered by the first insulating layer 51 can be electrically connected to the support layer 2 to form a path for conducting static electricity. Further, in order to facilitate connection, the lead-out portion 522 can be bent in the direction close to the support layer 2, so that the distance between the lead-out portion 522 and the support layer 2 is less than the distance between the shielding portion 521 and the support layer 2, and the lead-out portion 522 can be directly attached to the support layer 2 to achieve electrical connection, or it can be electrically connected to the support layer 2 through the conductive medium 6. For example: if the material of the conductive layer 52 is conductive glue, the lead-out portion 522 can be directly bent toward the support layer 2 so that the lead-out portion 522 and the support layer 2 are attached and bonded. If the material of the conductive layer 52 is conductive cloth or other conductive materials, the lead-out portion 522 can be electrically connected to the support layer 2 through the conductive medium 6, and the conductive medium 6 can be conductive glue. Of course, whether or not the lead-out portion 522 and the support layer 2 are electrically connected using the conductive medium 6, the lead-out portion 522 can be bent toward the support layer 2.

[0090] In the above embodiment, on the basis of shielding external static electricity by the shielding layer 5, static electricity inside the circuit board 3 can also be guided out to prevent interference to the circuit board 3. Figure 1 As shown, in some embodiments of the present disclosure, the circuit layer 32 of the circuit board 3 can be electrically connected to the support layer 2 to guide the static electricity generated inside the circuit board 3, further improving the static electricity shielding effect. For example, the circuit layer 32 can have a static electricity guide portion 321, the orthographic projection of the static electricity guide portion 321 on the display panel 1 and the orthographic projection of the support layer 2 on the display panel 1 at least partially overlap, the protective layer 33 exposes the static electricity guide portion 321, and the static electricity guide portion 321 can be electrically connected to the support layer 2 through the conductive medium 6 to guide the static electricity in the circuit board 3. The pattern of the static electricity guide portion 321 is not particularly limited here, as long as it can guide the static electricity in the circuit board 3.

[0091] The shielding layer 5 of the present disclosure may also include other film layers, which are illustrated below by way of example:

[0092] like Figure 4 and Figure 5As shown, in some embodiments of the present disclosure, the shielding layer 5 further includes a second insulating layer 53, which can be disposed on the surface of the conductive layer 52 away from the display panel 1, and covers the shielding portion 521 and the lead-out portion 522, to prevent the conductive layer 52 from contacting the outside, and plays a role of insulation and isolation. The boundary of the second insulating layer 53 can be aligned with the boundary of the conductive layer 52, that is, the orthographic projection of the second insulating layer 53 on the display panel 1 can coincide with the orthographic projection of the conductive layer 52 on the display panel 1.

[0093] like Figure 4 As shown, in some embodiments of the present disclosure, the shielding layer 5 may further include an absorbing layer 54, which may be disposed between the conductive layer 52 and the first insulating layer 51, and the orthographic projection of the absorbing layer 54 on the display panel 1 is located within the orthographic projection of the first insulating layer 51 on the display panel 1, that is, the boundary of the absorbing layer 54 does not exceed the boundary of the first insulating layer 51, so as to avoid blocking the lead-out portion 522. At the same time, the material of the absorbing layer 54 includes an absorbing material that can absorb electromagnetic waves, so as to absorb electromagnetic waves that may interfere with the operation of the circuit board 3. For example, the absorbing material may be graphite, and of course, it may also be a material having similar functions such as silicon carbide and ferrite.

[0094] like Figure 5 As shown, in some embodiments of the present disclosure, the shielding layer 5 may further include a heat dissipation layer 55, which may be disposed between the absorbing layer 54 and the conductive layer 52. The heat generated by the circuit board 3 may be absorbed by the heat dissipation layer 55 and conducted outwardly to avoid excessive temperature of the circuit board 3. At the same time, the orthographic projection of the heat dissipation layer 55 on the display panel 1 is located within the orthographic projection of the first insulating layer 51 on the display panel 1, and the boundary of the heat dissipation layer 55 does not exceed the boundary of the first insulating layer 51 to avoid blocking the lead-out portion 522. The material of the heat dissipation layer 55 includes copper, and of course, it may also be aluminum or other materials.

[0095] The present disclosure also provides a method for manufacturing a display device, which may be a display device of any of the above embodiments, and its structure is not described in detail here. The manufacturing method may include steps S110 to S150, wherein:

[0096] Step S110, forming a display panel, a circuit board and a shielding layer; the shielding layer includes a first insulating layer and a conductive layer located on one side of the first insulating layer; the conductive layer includes an electrically connected shielding part and a lead-out part, and the first insulating layer exposes at least a portion of the lead-out part.

[0097] Step S120: forming a support layer on the backlight side of the display panel.

[0098] Step S130: connecting the circuit board to the display panel and placing it on the backlight side of the display panel.

[0099] Step S140, covering the shielding layer on the side of the circuit board away from the display panel, so that the first insulating layer and the conductive layer are distributed in a direction away from the display panel, the orthographic projection of the shielding portion on the display panel is located within the orthographic projection of the circuit board on the display panel, and the orthographic projection of the lead-out portion on the display panel is located outside the orthographic projection of the circuit board on the display panel.

[0100] Step S150: electrically connecting the lead-out portion to the support layer.

[0101] The specific structure and beneficial effects of the display device involved in each of the above steps have been described in detail in the above embodiment of the display device, and will not be repeated here.

[0102] It should be noted that, although the steps of the manufacturing method in the present disclosure are described in a specific order in the drawings, this does not require or imply that the steps must be performed in this specific order, or that all the steps shown must be performed to achieve the desired results. Additionally or alternatively, some steps may be omitted, multiple steps may be combined into one step, and / or one step may be decomposed into multiple steps, etc.

[0103] Those skilled in the art will readily appreciate other embodiments of the present disclosure after considering the specification and practicing the invention disclosed herein. This application is intended to cover any modification, use or adaptation of the present disclosure, which follows the general principles of the present disclosure and includes common knowledge or customary techniques in the art that are not disclosed in the present disclosure. The specification and examples are intended to be exemplary only, and the true scope and spirit of the present disclosure are indicated by the appended claims.

Claims

1. A display device, characterized in that: include: Display panel; A support layer, disposed on the backlight side of the display panel, the support layer being made of a conductive material; A circuit board is disposed on a side of the support layer away from the display panel and is electrically connected to the display panel; a shielding layer, covering a side of the circuit board away from the display panel, and comprising a first insulating layer and a conductive layer distributed in a direction away from the display panel; The conductive layer comprises an electrically connected shielding portion and a lead-out portion, the first insulating layer exposes at least a portion of the lead-out portion; the orthographic projection of the shielding portion on the display panel is located within the orthographic projection of the circuit board on the display panel, the orthographic projection of the lead-out portion on the display panel is located outside the orthographic projection of the circuit board on the display panel, and the lead-out portion is electrically connected to the support layer; The orthographic projection of the first insulating layer on the display panel is located within the orthographic projection of the circuit board on the display panel; the orthographic projection of the lead-out portion on the display panel is located outside the orthographic projection of the first insulating layer on the display panel.

2. The display device according to claim 1, characterized in that The circuit board comprises: substrate; A circuit layer is provided on a side of the substrate close to the display panel; the circuit layer has a static electricity decoupling portion, and the orthographic projection of the static electricity decoupling portion on the display panel at least partially overlaps with the orthographic projection of the support layer on the display panel; A protective layer covering the circuit layer and exposing the static electricity lead-out portion; The static electricity lead-out portion is electrically connected to the support layer.

3. The display device according to claim 1, characterized in that The material of the conductive layer includes at least one of conductive glue and conductive fabric.

4. The display device according to any one of claims 1 to 3, characterized in that: The shielding layer also includes: The second insulating layer is disposed on a surface of the conductive layer away from the display panel and covers the shielding portion and the lead-out portion.

5. The display device according to any one of claims 1 to 3, characterized in that: The shielding layer also includes: The absorbing layer is arranged between the conductive layer and the first insulating layer, and the orthographic projection of the absorbing layer on the display panel is located within the orthographic projection of the first insulating layer on the display panel. The material of the absorbing layer includes an absorbing material that can absorb electromagnetic waves.

6. The display device according to claim 5, characterized in that: The absorbing material includes graphite.

7. The display device according to claim 5, characterized in that: The shielding layer also includes: The heat dissipation layer is disposed between the absorbing layer and the conductive layer, and the orthographic projection of the heat dissipation layer on the display panel is located within the orthographic projection of the first insulating layer on the display panel.

8. The display device according to claim 7, characterized in that: The material of the heat dissipation layer includes copper.

9. The display device according to claim 1, characterized in that: The display panel has a display area and a peripheral area outside the display area; the display panel includes a driving backplane and a light-emitting layer located on one side of the driving backplane, and the light-emitting layer is located in the display area; The display device further includes: A flexible connecting circuit board has one end stacked on the surface of the driving backplane close to the light-emitting layer in the peripheral area and electrically connected to the driving backplane; and the other end bent to the side of the supporting layer away from the circuit board and electrically connected to the circuit board.

10. The display device according to claim 9, characterized in that: The distance between the lead-out portion and the support layer is smaller than the distance between the shielding portion and the support layer.

11. The display device according to claim 10, characterized in that: The conductive layer located at the lead-out portion is directly attached to the support layer or is electrically connected to the support layer through a conductive medium.

12. A method for manufacturing a display device, characterized in that: include: A display panel, a circuit board and a shielding layer are formed; the shielding layer comprises a first insulating layer and a conductive layer located on one side of the first insulating layer; The conductive layer comprises an electrically connected shielding portion and a lead-out portion, and the first insulating layer exposes at least a portion of the lead-out portion; forming a support layer on the backlight side of the display panel; The circuit board is electrically connected to the display panel and is placed on the backlight side of the display panel; The shielding layer is covered on a side of the circuit board away from the display panel, so that the first insulating layer and the conductive layer are distributed in a direction away from the display panel, the orthographic projection of the shielding portion on the display panel is located within the orthographic projection of the circuit board on the display panel, and the orthographic projection of the lead-out portion on the display panel is located outside the orthographic projection of the circuit board on the display panel; the orthographic projection of the first insulating layer on the display panel is located within the orthographic projection of the circuit board on the display panel; the orthographic projection of the lead-out portion on the display panel is located outside the orthographic projection of the first insulating layer on the display panel; The lead-out portion is electrically connected to the support layer.

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