Optical image stabilization devices, electronic devices

Abstract

The present invention provides an optical image stabilization device and an electronic device that use a mobile image sensor chip for motion compensation, the optical image stabilization device comprising: an image sensor chip, a carrier, an elastic conductive member, a lower substrate and a memory alloy driving component; the image sensor chip is arranged on the carrier, the carrier is electrically connected to the external circuit of the lower substrate by means of an elastic conductive member, wherein the carrier is suitable for merging the pins of the image sensor chip; the image sensor chip moves in the X and Y directions and rotates in the plane under the drive of the shape memory alloy driving component to perform motion compensation. The optical image stabilization device provided in the technical solution of the present invention uses an image sensor chip for motion compensation, the image sensor chip is electrically connected to the external circuit by means of metal bonding and / or flip-chip bonding, has a simple structure, can improve product yield, reduce manufacturing costs, and improve image quality.

Description

Technical Field

[0001] The present invention relates to the field of image imaging technology, and in particular to an optical anti-shake device and electronic equipment that uses a mobile image sensor chip for motion compensation. Background Art

[0002] When a handheld portable smart device is used to take photos, the physiological tremor of the human body is unavoidable and cannot be overcome through training. As a result, the handheld portable smart device will inevitably shake along with the human body when taking photos, resulting in a decrease in image quality. The most obvious manifestation is that the image obtained is blurry and unclear.

[0003] Existing handheld portable smart devices use a lens assembly that can move in the XY axis direction in the camera module to compensate for the physiological tremor of the human body and obtain high-quality images. However, with the advancement of technology and the increasing pursuit of images by consumers, the camera module of existing handheld portable smart devices has become larger and heavier due to the increase in the size of the image sensor. The traditional method of moving the lens in the XY axis direction for compensation has become increasingly difficult to push the heavy lens. Moreover, the angle that can be compensated by the method of moving the lens in the XY axis direction for compensation can no longer meet customers' demand for image quality.

[0004] In the prior art, the optical image stabilization method provided by the mobile image sensor chip is complex in structure and is mostly applied to SLR digital cameras, but there are few cases of mass production in handheld portable smart devices. Summary of the invention

[0005] The purpose of the present invention is to solve the technical problem that in the traditional technology, the lens is moved and compensated in the XY axis direction. Because the lens is heavy and difficult to push, and has a large volume, it is difficult to meet the compensation of certain angles, and therefore is not sufficient to meet the higher image quality requirements.

[0006] In order to solve the above technical problems, the present invention provides an optical image stabilization device using a mobile image sensor chip for motion compensation, comprising:

[0007] An image sensor chip, a carrier, an elastic conductive member, a lower substrate and a memory alloy driving component; the image sensor chip is arranged on the carrier, the carrier is electrically connected with the external circuit of the lower substrate by means of the elastic conductive member, wherein the carrier is suitable for merging the pins of the image sensor chip;

[0008] The image sensor chip is driven by the shape memory alloy driving component to move in the X and Y directions and rotate in a plane to perform motion compensation.

[0009] Preferably, the shape memory alloy driving component is adapted to deform when powered on, so as to drive the image sensor chip to move in the X and Y directions and rotate in a plane, so as to perform motion compensation;

[0010] The elastic conductive member is suitable for driving the image sensor chip to return to its original position through a rebound force when the shape memory alloy driving component is powered off.

[0011] Preferably, the elastic conductive member comprises a flexible circuit board flexure.

[0012] Preferably, the shape memory alloy driving component comprises: a shape memory alloy wire, one end of which is electrically connected to the carrier board, and the other end of which is electrically connected to the lower substrate below the image sensor chip so as to be electrically connected to an external circuit; there are at least two shape memory alloy wires.

[0013] Preferably, the shape memory alloy wire is suitable for being arranged on two sides or four sides of the image sensor chip.

[0014] Preferably, the carrier board is further provided with: a capacitor unit and / or a resistor unit, and a circuit wiring unit;

[0015] The circuit wiring unit is adapted to provide a conductive path between the pins of the image sensor chip and the elastic conductive member so as to be electrically connected to the circuit on the lower substrate;

[0016] The resistance unit and / or the capacitance unit are connected to the circuit wiring unit.

[0017] Preferably, the circuit wiring unit is further provided with electrical contact points, the electrical contact points correspond to the elastic conductive members, and the number of the contact points is less than the number of the image sensor pads.

[0018] Preferably, the electrical contact points are pads disposed on the upper surface of the carrier, and the pads are evenly distributed around the image sensor.

[0019] Preferably, the capacitor unit is arranged around the chip.

[0020] Preferably, the capacitor unit includes a plurality of capacitors arranged in a strip shape and disposed on both sides of the chip.

[0021] Preferably, the image sensor chip is electrically connected to the carrier board through metal wire bonding or flip chip bonding.

[0022] Preferably, an external fixing frame is further provided, which is suitable for limiting the movement of the image sensor chip within a certain space; the external fixing frame is provided on the lower substrate.

[0023] Preferably, the displacement of the image sensor chip is fed back through a change in resistance of the shape memory alloy wire after power is supplied.

[0024] Compared with the prior art, the optical image stabilization device of the present invention using a mobile image sensor chip for motion compensation has the following beneficial effects:

[0025] The optical image stabilization device using a mobile image sensor chip for motion compensation provided by the technical solution of the present invention uses an image sensor chip for motion compensation. The image sensor chip is electrically connected to an external circuit by metal bonding and / or flip-chip bonding. Therefore, the structure is simple and the manufacturing process is also simple, which can improve the product yield of the camera module, reduce manufacturing costs, improve reliability, and improve image quality.

[0026] Furthermore, in the technical solution provided by the present invention, the image sensor chip is arranged and electrically connected to the carrier, and the connection ports between the chip and the external circuit are simplified by merging the circuits in the carrier, thereby reducing the circuits between the carrier and the lower substrate, and realizing the electrical connection and elastic contact between the carrier and the lower substrate through the flexible circuit board. Such a design can reduce the circuits and structures outside the chip, thereby reducing the movement resistance of the carrier (including the chip).

[0027] Furthermore, in the technical solution provided by the present invention, a shape memory alloy wire is used to provide a driving force, and an elastic conductive member is used to provide a restoring force, and the structure is light and simple, the volume is small, and the cost is low.

[0028] Furthermore, in the technical solution provided by the present invention, the change in resistance value of the shape memory alloy wire during deformation can reflect the displacement of the chip, and there is no need to set a Hall feedback loop to feedback the displacement. The structure is simple, the volume is small, and the cost is low. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figures 1 to 4 It is a schematic structural diagram of an optical image stabilization device that uses a mobile image sensor chip to perform motion compensation in an embodiment provided by the present invention. DETAILED DESCRIPTION

[0030] Many specific details are set forth in the following description to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways than those described herein, and those skilled in the art can make similar generalizations without violating the connotation of the present invention, so the present invention is not limited to the specific implementation disclosed below.

[0031] Secondly, the present invention is described in detail using schematic diagrams. When describing the embodiments of the present invention in detail, for the convenience of explanation, the schematic diagrams are only examples and should not limit the scope of protection of the present invention.

[0032] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and understandable, the optical image stabilization device of the image sensor of the present invention using a mobile image sensor chip for motion compensation is described in detail below with reference to the accompanying drawings.

[0033] The technical solution of the present invention provides an optical image stabilization device that uses a mobile image sensor chip for motion compensation. The lens does not translate on the XY axis, but the image sensor chip translates on the XY axis and rotates around the optical axis of the chip to achieve the purpose of optical image stabilization compensation.

[0034] The following combination Figures 1 to 4 Specifically, this embodiment provides an optical image stabilization device, including:

[0035] An image sensor chip 111, a carrier 100 carrying the image sensor chip 111, a lower substrate 200, and an elastic conductive member 350 connecting the carrier 100 and the lower substrate 200. A shape memory alloy driving component 300 is also provided between the carrier 100 and the lower substrate 200. The image sensor chip 111 and the carrier 100 move in the X and Y directions and rotate in the plane under the drive of the shape memory alloy driving component 300 to perform motion compensation. The elastic conductive member 350 is suitable for driving the image sensor chip 111 to return to its original position through the rebound force when the shape memory alloy driving component 300 is powered off.

[0036] Specifically, the image sensor chip 111 is fixedly disposed on the carrier 100, and the carrier 100 is connected to the lower substrate 200 through the elastic conductive member 350, so that the image sensor chip 111 is electrically connected to an external circuit (not shown). The image sensor chip 111 and the carrier 100 are driven by the shape memory alloy driving component to move in the X and Y directions and rotate in the plane to perform motion compensation.

[0037] Specifically, in this embodiment, the carrier board 100 is further provided with: a capacitor unit and / or a resistor unit and / or an inductor unit and / or an auxiliary chip, and a circuit wiring unit;

[0038] The circuit wiring unit is suitable for realizing the electrical connection between the image sensor chip and the capacitor unit and / or resistor unit and / or inductor unit and / or auxiliary chip; in the present embodiment, the circuit wiring unit on the carrier 100 merges the pins of the image sensor chip 111 through lines, thereby simplifying the external circuit of the chip and reducing the connection points between the carrier 100 and the circuit on the lower substrate 200.

[0039] Then, an elastic conductive member is used to realize the electrical connection between the carrier 100 and the lower substrate 200. This design eliminates the gold wire connection between the carrier 100 and the lower substrate 200, thereby reducing the motion resistance of the carrier 100 carrying the image sensor chip 111 in the motion compensation required for anti-shake, and increasing flexibility.

[0040] Specifically, in this embodiment, the capacitor unit 330 is disposed around the image sensor chip 111. Preferably, the capacitor unit 330 includes a plurality of capacitors arranged in a strip shape and disposed on both sides of the image sensor chip 111.

[0041] Specifically, in this embodiment, the image sensor chip 111 is electrically connected to the carrier 100 by flip chip bonding or metal wire bonding.

[0042] Specifically, in this embodiment, the material of the metal wire is any one of gold, copper, silver, and aluminum.

[0043] Combination Figure 2 ,refer to Figure 4 As shown, specifically, in this embodiment, the shape memory alloy driving component 300 includes: a shape memory alloy wire, one end of which is electrically connected to the carrier 100, and the other end of which is electrically connected to the lower substrate 200 below the image sensor chip 111, so as to be electrically connected to the external circuit; there are at least two shape memory alloy wires, which are distributed on two opposite sides of the carrier 100 to maintain the balance of the movement of the carrier. Preferably, there are four shape memory alloy wires, which are evenly distributed on the four sides of the carrier 100.

[0044] The shape memory alloy driving component 300 is adapted to deform when powered on, so as to drive the image sensor chip 111 to move in the X and Y directions and to rotate in a plane, so as to perform motion compensation.

[0045] In addition, continue to refer to Figure 1 As shown, in this embodiment, the elastic conductive member is a flexible circuit board flexure member. Specifically, in one implementation, the flexible circuit board flexure member is an FPC.

[0046] In addition to providing an electrical connection function between the carrier board 100 and the lower substrate 200 , the flexible circuit component is also suitable for driving the image sensor chip 111 to return to its original position through a rebound force when the shape memory alloy driving component 300 is powered off.

[0047] Specifically, in this embodiment, one end of the flexible circuit board flexure is fixedly connected to the carrier 100, and the other end of the flexible circuit board flexure is fixed to the lower substrate 200, and the image sensor chip 111 is suitable for restoring the initial position under the action of the elastic cantilever. In this embodiment, the flexible circuit board flexure has at least one bending portion that half surrounds the carrier. In some embodiments, at least two flexible circuit board flexures are arranged in sequence in the same direction and manner, and the adjacent two flexible circuit board flexures are connected end to end.

[0048] Specifically, in this embodiment, the shape memory alloy wire is suitable for being arranged around the image sensor chip 111 and corresponding to the elastic conductive member.

[0049] Specifically, the rebound force of the elastic conductive component is in the opposite direction to the traction force generated by the contraction of the shape memory alloy wire when power is supplied. Thus, when the shape memory alloy wire is powered off and restored to its original state, the rebound force provided by the elastic conductive component can quickly drive the carrier to return to its original position, thereby ensuring that the position of the image sensor chip 111 is quickly restored to its original position.

[0050] Furthermore, in the technical solution provided by the present invention, the shape memory alloy wire and the elastic conductive member are arranged between the carrier 100 and the lower substrate 200 in cooperation with each other, ensuring that the carrier 100 can drive the image sensor chip 111 to move to complete the anti-shake position compensation function through the shape memory alloy wire when the power is on, and can also drive the image sensor chip 111 to return to its original position more quickly under the action of the rebound force of the elastic conductive member when the power is off.

[0051] Furthermore, the shape memory alloy wire and the elastic conductive member are both slender components, which are arranged on both sides or around the carrier 100 in cooperation with each other, and do not occupy too much space of the entire optical image stabilization device that uses a mobile image sensor chip for motion compensation, thereby saving the overall volume of the optical image stabilization device.

[0052] Specifically, in this embodiment, the optical image stabilization device using a mobile image sensor chip for motion compensation also includes: feedback of the displacement of the image sensor chip through the change in resistance of the shape memory alloy wire after power is applied. In this way, in the technical solution provided by the present invention, the displacement of the image sensor chip 111 can be reflected by the resistance value of the shape memory alloy wire, and there is no need to set a Hall feedback loop to feedback the displacement, which has a simple structure, a small size, and a low cost.

[0053] In addition, an embodiment provided by the present invention also includes an electronic device, including: an optical image stabilization device that uses the mobile image sensor chip as described above to perform motion compensation.

[0054] Although the present invention has been disclosed as above in the form of a preferred embodiment, it is not intended to limit the present invention. Any person skilled in the art may make possible changes and modifications to the technical solution of the present invention by using the methods and technical contents disclosed above without departing from the spirit and scope of the present invention. Therefore, any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention shall fall within the protection scope of the technical solution of the present invention.

Claims

1. An optical image stabilization device using a mobile image sensor chip for motion compensation, characterized in that: include: Image sensor chip, carrier board, elastic conductive member, lower substrate and shape memory alloy driving assembly; The image sensor chip is arranged on the carrier, and the carrier is electrically connected with the external circuit of the lower substrate by means of an elastic conductive member, wherein the carrier is suitable for merging the pins of the image sensor chip into circuits; The image sensor chip moves in the X and Y directions and rotates in the plane under the drive of the shape memory alloy drive component to perform motion compensation; The elastic conductive member is suitable for driving the image sensor chip to return to its original position through a rebound force when the shape memory alloy driving component is powered off.

2. The optical image stabilization device using a mobile image sensor chip for motion compensation according to claim 1, characterized in that: The shape memory alloy driving component is suitable for deforming when powered on to drive the image sensor chip to move in the X and Y directions and rotate in a plane to perform motion compensation.

3. The optical image stabilization device using a mobile image sensor chip for motion compensation according to claim 2, characterized in that: The elastic conductive member includes a flexible circuit board flexure.

4. The optical image stabilization device using a mobile image sensor chip for motion compensation according to claim 2, characterized in that: The shape memory alloy driving component includes: a shape memory alloy wire, one end of which is electrically connected to the carrier board, and the other end of which is electrically connected to the lower substrate below the image sensor chip to be electrically connected to an external circuit; there are at least two shape memory alloy wires.

5. The optical image stabilization device using a mobile image sensor chip for motion compensation according to claim 4, characterized in that: The shape memory alloy wire is suitable for being arranged on two sides or four sides of the image sensor chip.

6. The optical image stabilization device using a mobile image sensor chip for motion compensation according to claim 1, characterized in that: The carrier board is also provided with: a capacitor unit and / or a resistor unit, and a circuit wiring unit; The circuit wiring unit is adapted to provide a conductive path between the pins of the image sensor chip and the elastic conductive member so as to be electrically connected to the circuit on the lower substrate; The resistance unit and / or the capacitance unit are connected to the circuit wiring unit.

7. The optical image stabilization device using a mobile image sensor chip for motion compensation according to claim 6, characterized in that: The circuit wiring unit is also provided with electrical contact points, the electrical contact points correspond to the elastic conductive members, and the number of the contact points is less than the number of the image sensor pads.

8. The optical image stabilization device for motion compensation using a mobile image sensor chip according to claim 7, characterized in that: The electrical contact points are pads arranged on the upper surface of the carrier, and the pads are evenly distributed around the image sensor.

9. The optical image stabilization device using a mobile image sensor chip for motion compensation according to claim 6, characterized in that: The capacitor unit is arranged around the chip.

10. The optical image stabilization device using a mobile image sensor chip for motion compensation according to claim 9, characterized in that: The capacitor unit includes a plurality of capacitors arranged in a strip shape and disposed on both sides of the chip.

11. The optical image stabilization device for motion compensation using a mobile image sensor chip according to claim 1, characterized in that: The image sensor chip is electrically connected to the carrier board by metal wire bonding or flip-chip bonding.

12. The optical image stabilization device using a mobile image sensor chip for motion compensation according to claim 1, characterized in that: An external fixing frame is also provided, which is suitable for limiting the movement of the image sensor chip within a certain space; the external fixing frame is provided on the lower substrate.

13. The optical image stabilization device using a mobile image sensor chip for motion compensation according to claim 4, characterized in that: The displacement of the image sensor chip is fed back through the change in resistance of the shape memory alloy wire after power is supplied.

14. An electronic device, characterized in that: The invention comprises an optical image stabilization device for performing motion compensation using a mobile image sensor chip as claimed in claim 1.

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