Antenna package and image display device

Abstract

According to an embodiment of the present invention, an antenna package and an image display device are provided. The antenna package includes an antenna assembly and a flexible printed circuit board. The antenna assembly includes a dielectric layer, a first antenna element disposed on the dielectric layer, and a second antenna element disposed on the dielectric layer and physically and electrically separated from the first antenna element. The flexible printed circuit board is coupled to the antenna assembly to electrically connect to the first antenna element and electrically separate from the second antenna element.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority from Korean Patent Application No. 10-2020-0089101 filed on July 17, 2020, in the Korean Intellectual Property Office (KIPO), the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0003] The present invention relates to an antenna package and an image display device. More particularly, the present invention relates to an antenna package including an antenna device and a flexible circuit board, and an image display device including the antenna package. Background Art

[0004] With the development of information technology, wireless communication technologies such as Wi-Fi, Bluetooth, etc. are combined with image display devices such as smart phones. In this case, an antenna can be combined with the image display device to provide a communication function.

[0005] With the rapid development of mobile communication technology, an antenna capable of high-frequency or ultra-high-frequency communication corresponding to, for example, 3G, 4G, 5G or higher communication frequency bands is required in image display devices.

[0006] In order to achieve the radiation drive of the antenna, a flexible circuit board for feeding and controlling signal transmission can be connected to the antenna. The antenna can be connected to a driver integrated circuit (IC) chip via a feeding line.

[0007] However, due to space or design limitations of the driver IC chip, the number of feeder lines that can be connected may be limited. Therefore, it may not be easy to obtain high signal efficiency and antenna gain of the antenna package within a limited space.

[0008] For example, Korean Patent Application Publication No. 2013-0095451 discloses an antenna integrated with a display panel, but does not teach an antenna configuration that provides reduced signal loss and improved antenna gain in a high frequency band or an ultra-high frequency band. Summary of the Invention

[0009] According to one aspect of the present invention, an antenna package with improved radiation and operational reliability is provided.

[0010] According to one aspect of the present invention, there is provided an image display device including an antenna package having improved radiation and operational reliability.

[0011] (1) An antenna package comprising: an antenna device including a dielectric layer, a first antenna unit disposed on the dielectric layer, and a second antenna unit disposed on the dielectric layer and physically and electrically separated from the first antenna unit; and a flexible printed circuit board coupled to the antenna device to be electrically connected to the first antenna unit and electrically separated from the second antenna unit.

[0012] (2) The antenna package according to (1) above, wherein the flexible printed circuit board includes a core layer and a feeder line formed on one surface of the core layer and electrically connected to the first antenna element.

[0013] (3) The antenna package according to (2) above, wherein the first antenna unit includes a first radiation pattern, a first transmission line extending from the first radiation pattern, and a first signal pad connected to one end of the first transmission line and thereby electrically connected to the feed line.

[0014] (4) The antenna package according to (3) above, wherein the core layer covers the first signal pad of the first antenna unit and does not cover the second antenna unit in a plan view.

[0015] (5) The antenna package according to (3) above, wherein the second antenna unit includes a second radiation pattern, a second transmission line extending from the second radiation pattern, and a second signal pad connected to one end of the second transmission line.

[0016] (6) The antenna package according to (5) above, wherein the core layer completely covers the first signal pad and at least partially covers the second signal pad in a plan view.

[0017] (7) An antenna package according to (5) above, wherein the first antenna unit further includes a first ground pad arranged around the first signal pad to be separated from the first transmission line and the first signal pad, and the second antenna unit further includes a second ground pad arranged around the second signal pad to be separated from the second transmission line and the second signal pad.

[0018] (8) The antenna package according to (7) above, wherein the core layer covers the first signal pad and the first ground pad of the first antenna unit and the second ground pad of the second antenna unit in a plan view.

[0019] (9) The antenna package according to (8) above, wherein the core layer does not cover the second signal pad of the second antenna unit in a plan view.

[0020] (10) The antenna package according to (7) above, wherein the flexible printed circuit board further includes a first bonding pad formed on one surface of the core layer and bonded to the first ground pad.

[0021] (11) The antenna package according to (10) above, wherein the flexible printed circuit board further includes a second bonding pad formed on one surface of the core layer and bonded to the second ground pad.

[0022] (12) The antenna package according to (1) above, wherein the first antenna unit includes a plurality of first antenna units forming a horizontal row of first antenna units.

[0023] (13) The antenna package according to (12) above, wherein the second antenna unit is arranged close to one end or both ends of the horizontal row of the first antenna unit.

[0024] (14) The antenna package according to (12) above, further comprising a dummy pattern provided between adjacent first antenna elements among the plurality of first antenna elements.

[0025] (15) The antenna package according to (14) above, wherein the dummy pattern includes a plurality of floating dummy patterns independently provided in a space between the first antenna units and in a space between the first antenna unit and the second antenna unit.

[0026] (16) The antenna package according to (1) above, wherein the first antenna unit and the second antenna unit have the same shape and structure.

[0027] (17) An image display device including the antenna package according to the above embodiment.

[0028] According to an exemplary embodiment of the present invention, an antenna unit array including a first antenna unit and a second antenna unit may be provided on a dielectric layer of an antenna device. The first antenna unit may be connected to a driver IC chip via a feed line of a flexible printed circuit board (FPCB), and the second antenna unit may be electrically and physically separated from the first antenna unit and electrically separated from the FPCB.

[0029] The second antenna element can be used to add antenna radiation from the electric field remaining in the core layer of the flexible printed circuit board and / or the dielectric layer of the antenna device. Therefore, auxiliary radiation or sub-radiation can be added without the need to connect additional feed lines, thereby increasing the overall gain of the antenna device.

[0030] Therefore, even when the number of leads or pads available in the driver IC chip is limited, sufficient antenna gain can be achieved by using the second antenna unit.

[0031] In some embodiments, the second antenna unit may be disposed near a lateral portion or end of the antenna unit row to maintain continuity of antenna radiation while preventing radiation reduction at the lateral portion or end of the image display device. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 and Figure 2 is a schematic top plan view illustrating an antenna package according to an exemplary embodiment.

[0033] Figure 3 is a schematic cross-sectional view illustrating an antenna package according to an exemplary embodiment.

[0034] Figure 4 is a schematic top plan view illustrating an antenna package according to an exemplary embodiment.

[0035] Figure 5 is a schematic top plan view illustrating an antenna package according to some exemplary embodiments.

[0036] Figure 6 and Figure 7 are a schematic top plan view and a schematic cross-sectional view, respectively, illustrating an antenna package according to some exemplary embodiments.

[0037] Figure 8 is a schematic top plan view illustrating an antenna package according to some exemplary embodiments.

[0038] Figure 9 is a schematic top plan view illustrating an image display device according to an exemplary embodiment. DETAILED DESCRIPTION

[0039] According to an exemplary embodiment of the present invention, an antenna package is provided, which includes an antenna device and a flexible printed circuit board. The antenna device may include a first antenna element and a second antenna element, and the flexible printed circuit board may be electrically connected to the first antenna element to provide improved antenna gain.

[0040] Also provided is an image display device including the antenna package.

[0041] Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. However, those skilled in the art should understand that these embodiments described with reference to the accompanying drawings are provided to further understand the spirit of the present invention and are not intended to limit the subject matter disclosed in the detailed description and the appended claims.

[0042] The terms “first”, “second”, “upper”, “lower”, “end”, “top”, “bottom”, etc. used in this application are not used to indicate absolute positions, but are used to relatively distinguish different elements and positions.

[0043] The term "electrically connected" as used in this application refers to a direct connection between different electrical elements as well as a connection via another conductor or wiring.

[0044] Figure 1 and Figure 2 is a schematic top plan view illustrating an antenna package according to an exemplary embodiment. Figure 3is a schematic cross-sectional view illustrating an antenna package according to an exemplary embodiment.

[0045] Reference Figure 1 and Figure 2 , the antenna package includes an antenna device 100 and a flexible printed circuit board 200 .

[0046] The antenna device 100 may include a dielectric layer 110 and antenna units 120 and 140 disposed on the dielectric layer 110 .

[0047] The dielectric layer 110 may, for example, include a transparent resin film, such as a polyester resin, such as polyethylene terephthalate, polyethylene isophthalate, polyethylene naphthalate, and polybutylene terephthalate; a cellulose resin, such as diacetyl cellulose and triacetyl cellulose; a polycarbonate resin; an acrylic resin, such as polymethyl (meth)acrylate and polyethyl (meth)acrylate; a styrene resin, such as polystyrene and acrylonitrile-styrene copolymer; a polyolefin resin, such as polyethylene, polypropylene, cycloolefin, or polyolefin having a norbornene structure, and an ethylene-propylene copolymer; a vinyl chloride resin; an amide resin, such as nylon and aromatic polyamide; an imide resin; a polyethersulfone resin; a sulfone resin; a polyetheretherketone resin; a polyphenylene sulfide resin; a vinyl alcohol resin; a vinylidene chloride resin; a vinyl butyral resin; an allyl compound resin; a polyoxymethylene resin; an epoxy resin; a polyurethane or acrylic polyurethane resin; a silicone resin, and the like. These may be used alone or in combination of two or more.

[0048] The dielectric layer 110 may include an adhesive material such as an optically clear adhesive (OCA), an optically clear resin (OCR), etc. In some embodiments, the dielectric layer 110 may include an inorganic insulating material such as glass, silicon oxide, silicon nitride, silicon oxynitride, etc.

[0049] In some embodiments, the dielectric constant of the dielectric layer 110 may be adjusted to be within a range of about 1.5 to about 12. When the dielectric constant exceeds about 12, the driving frequency may be excessively reduced, thereby failing to achieve desired high or ultra-high frequency driving.

[0050] The antenna units 120 and 140 may be formed on the top surface of the dielectric layer 110. For example, a plurality of antenna units 120 and 140 may be formed in an array form along a width direction of the dielectric layer 110 or the antenna package.

[0051] In some embodiments, when the wavelength corresponding to the resonant frequency of the antenna units 120 and 140 is λ, the interval between adjacent antenna units 120 and 140 may be 0.4λ to 1.5λ, preferably 0.5λ to λ.

[0052] For example, within the above range of the interval between antenna elements 120 and 140, radiation interference or signal interference between radiation patterns 122 and 142 can be suppressed to improve radiation reliability and directivity in a desired frequency band. In addition, radiation concentration can be increased to improve antenna gain.

[0053] In an exemplary embodiment, the antenna units 120 and 140 may include a first antenna unit 120 and a second antenna unit 140 .

[0054] For example, the first antenna units 120 may be repeatedly and regularly arranged on the dielectric layer 110 to form a horizontal row of first antenna units. In this case, the first antenna units 120 may be uniformly powered via the feeder 220, thereby improving antenna signal efficiency and driving performance, as well as operational reliability.

[0055] In an exemplary embodiment, the second antenna element 140 may be disposed near one or both ends of the horizontal row of first antenna elements. In this case, when power is supplied to the first antenna element 120 via the feed line 220, the second antenna element 140 may couple with the current or electric field remaining in the core layer 210 and the dielectric layer 110.

[0056] Thus, sub-radiation or auxiliary radiation generated by the second antenna element 140 can be added to the main radiation generated by the first antenna element 120 without requiring an additional electrical connection structure formed by the feed line 220. Therefore, the total amount of antenna gain from the antenna device 100 can be increased.

[0057] The second antenna unit 140 may function as a floating radiation pattern or a sub-radiation pattern, for example, independent of an electrical connection portion formed by the flexible printed circuit board 200 .

[0058] In some embodiments, an antenna element row including first antenna elements 120 and second antenna elements 140 arranged in a width direction may be formed on dielectric layer 110. In some embodiments, a plurality of first antenna elements 120 may be arranged between a pair of second antenna elements 140.

[0059] The first antenna unit 120 may include a first radiation pattern 122 and a first transmission line 124. The second antenna unit 140 may include a second radiation pattern 142 and a second transmission line 144. The radiation patterns 122 and 142 may have a shape of, for example, a polygonal flat plate, and the first transmission line 124 and the second transmission line 144 may extend from one side or one end of each of the first radiation pattern 122 and the second radiation pattern 142. The transmission lines 124 and 144 may be formed as a single member substantially integral with the radiation patterns 122 and 142.

[0060] The first antenna unit 120 and the second antenna unit 140 may further include a first signal pad 126 and a second signal pad 146. The first signal pad 126 and the second signal pad 146 may be connected to one end of the first transmission line 124 and one end of the second transmission line 144, respectively.

[0061] In some embodiments, the signal pads 126 and 146 may be formed as a substantially unitary member with the transmission lines 124 and 144 , and terminal portions of the transmission lines 124 and 144 may serve as the signal pads 126 and 146 .

[0062] In some embodiments, ground pads 128 and 148 may be disposed around the signal pads 126 and 146. For example, a pair of first ground pads 128 may be disposed so as to face each other with the first signal pad 126 interposed therebetween. A pair of second ground pads 148 may be disposed so as to face each other with the second signal pad 146 interposed therebetween. The ground pads 128 and 148 may be electrically and physically separated from the transmission lines 124 and 144 and the signal pads 126 and 146.

[0063] In some embodiments, antenna elements 120 and 140 or radiation patterns 122 and 142 can provide signal transmission / reception in high frequency bands or ultra-high frequency bands (e.g., 3G, 4G, 5G, or higher communications). In one non-limiting example, the resonant frequency of antenna elements 120 and 140 can be approximately 20 to 45 GHz.

[0064] Antenna elements 120 and 140 may include silver (Ag), gold (Au), copper (Cu), aluminum (Al), platinum (Pt), palladium (Pd), chromium (Cr), titanium (Ti), tungsten (W), niobium (Nb), tantalum (Ta), vanadium (V), iron (Fe), manganese (Mn), cobalt (Co), nickel (Ni), zinc (Zn), tin (Sn), molybdenum (Mo), calcium (Ca), or an alloy containing at least one of these metals. These may be used alone or in combination.

[0065] In one embodiment, the antenna units 120 and 140 may include silver (Ag) or a silver alloy (eg, silver-palladium-copper (APC)) or copper (Cu) or a copper alloy (eg, copper-calcium (CuCa)) to achieve low resistance and fine line width patterns.

[0066] The antenna unit 120 may include a transparent conductive oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnOx), indium zinc tin oxide (IZTO), or the like.

[0067] In some embodiments, antenna units 120 and 140 may include a stacked structure of a transparent conductive oxide layer and a metal layer. For example, antenna unit 120 may include a double-layer structure of a transparent conductive oxide layer and a metal layer, or a triple-layer structure of a transparent conductive oxide layer, a metal layer, and a transparent conductive oxide layer. In this case, the metal layer can improve flexibility, and the low resistance of the metal layer can also increase signal transmission speed. The transparent conductive oxide layer can also improve corrosion resistance and transparency.

[0068] In some embodiments, the signal pads 126 and 146 and the ground pads 128 and 148 may be solid patterns formed of the above metals or alloys in consideration of reducing feeding resistance, improving noise absorption efficiency, etc.

[0069] In an exemplary embodiment, the first antenna unit 120 and the second antenna unit 140 may have substantially the same shape and structure.

[0070] In this case, the first antenna element 120 and the second antenna element 140 may be formed on the dielectric layer 110 through a substantially single etching process. In addition, the lengths of the radiation patterns 122 and 142 may be substantially uniformly maintained, thereby maintaining a desired antenna resonant frequency constant.

[0071] The flexible printed circuit board 200 may include a core layer 210 and a feed line 220 formed on the core layer 210. The core layer 210 may include, for example, a flexible resin such as polyimide resin, modified polyimide (MPI), epoxy resin, polyester, cycloolefin polymer (COP), liquid crystal polymer (LCP), etc. The core layer 210 may include an internal insulating layer included in the flexible printed circuit board 200.

[0072] The feeding line 220 may include, for example, a microstrip line, a stripline, a CPW (coplanar waveguide) line, or a GCPW (grounded coplanar waveguide) line.

[0073] In an exemplary embodiment, the flexible printed circuit board 200 may be disposed on one surface of the core layer 210 and may further include a cover film covering the feeding line 220 .

[0074] In an exemplary embodiment, the core layer 210 of the flexible printed circuit board 200 may cover the first signal pad 126 of the first antenna unit 120 in a planar direction.

[0075] In some embodiments, the flexible printed circuit board 200 may also overlap with the second antenna unit 140 in a plan view. For example, the core layer 210 may completely cover the first signal pad 126 in a plan view and cover at least a portion of the second signal pad 146. In this case, current coupling generated by the second antenna unit 140 via the core layer 210 when feeding the first antenna unit 120 can be further promoted.

[0076] like Figure 2 As shown, in some embodiments, the core layer 210 may be superimposed on the first signal pad 126 , the first ground pad 128 , and the second ground pad 148 of the second antenna unit 120 in a plan view.

[0077] The feed line 220 may be connected or bonded to the first signal pad 126 of the first antenna unit 120. For example, one end of the feed line 220 may be exposed by partially removing the cover film of the flexible printed circuit board 200. The exposed end of the feed line 220 may be bonded to the signal pad 126.

[0078] For example, a conductive intermediate structure 150 such as an anisotropic conductive film (ACF) (see Figure 3 ) is attached to the first signal pad 126, and then a bonding region BR of the flexible circuit board 200, where one end of the feed line 220 is located, may be provided on the conductive intermediate structure 150. Thereafter, the bonding region BR of the flexible printed circuit board 200 may be attached to the antenna device 100 through a heating and pressurizing process, thereby electrically connecting the feed line 220 to the first signal pad 126.

[0079] like Figure 1 and Figure 2 As shown, each feed line 220 can be individually and independently connected to each first antenna unit 120. Therefore, power / drive control can be performed independently for each first antenna unit 120. For example, signals of different phases can be applied to the first antenna unit 120 via the feed line 220 connected to each first antenna unit 120.

[0080] In some embodiments, the core layer 210 may not cover the second signal pad 146 of the second antenna unit 140 in a plan view. In this case, for example, the electric field for the first antenna unit 120 serving as the main antenna can be more concentrated, and auxiliary radiation generated by indirect coupling of the second antenna unit 140 can be added.

[0081] The feed line 220 may be physically and electrically separated from the second signal pad 146 of the second antenna unit 140. As described above, for example, when power is supplied to the first antenna unit 120 via the feed line 220 extending from the driver IC chip 290, a current generated may be coupled to the second antenna unit 140 via the core layer 210 or the dielectric layer 110, so that radiation may also be generated through the second radiation pattern 142.

[0082] Therefore, sub-radiation or auxiliary radiation can be added even without an additional feeder connected to the second radiation pattern 142. Therefore, the antenna gain can be improved without changing the number / arrangement of connection leads, connection pads, or connection channels included in the driver IC chip 290.

[0083] In an exemplary embodiment, the intermediate circuit board 280 may be disposed on the flexible printed circuit board 200 , and the driving IC chip 290 may be mounted on the intermediate circuit board 280 by, for example, surface mounting technology (SMT).

[0084] The term “intermediate circuit board” used herein may generally refer to a circuit structure or circuit board located between the flexible printed circuit board 200 and the driving IC chip 290 .

[0085] For example, the intermediate circuit board 280 may include a main board of the image display device, a rigid printed circuit board, and various antenna packaging boards.

[0086] If the intermediate circuit board 280 is a rigid printed circuit board, the intermediate circuit board 280 may have higher strength or lower ductility than the flexible printed circuit board 200. Therefore, the mounting stability of the driver IC chip 290 may be improved. For example, the intermediate circuit board 280 may include a core layer formed of a resin (e.g., prepreg) impregnated with an inorganic material such as glass fiber, and an intermediate circuit formed in the core layer.

[0087] Feeding and driving signals may be applied from the driving IC chip 290 to the first antenna unit 120 through the feeding line 220. For example, the flexible printed circuit board 200 may further include a circuit or contact electrically connecting the driving IC chip 290 and the feeding line 220.

[0088] Reference Figure 3 A ground layer 230 may be provided on the opposite surface or top surface of the core layer 210. The ground layer 230 may cover the feed line 220 in plan view. Noise and signal interference around the feed line 220 may be absorbed or shielded by the ground layer 230. In addition, the ground layer 230 may promote the formation of an electric field through the feed line 220, thereby improving signal transmission efficiency.

[0089] In some embodiments, the antenna ground layer 130 may be formed on the bottom surface of the dielectric layer 110. The antenna ground layer 130 may overlap with the radiation patterns 122 and 142 of the antenna elements 120 and 140 in a plan view. An antenna that radiates substantially vertically may be realized by forming an electric field between the radiation patterns 122 and 142 and the antenna ground layer 130.

[0090] In some embodiments, the antenna ground layer 130 may completely cover the radiation patterns 122 and 142 in plan view and may not overlap with the pads 126 , 128 , 146 , and 148 .

[0091] The antenna ground layer 130 may be included as a separate element of the antenna device 100. In some embodiments, a conductive member of a display device to which the antenna device 100 is applied may serve as the antenna ground layer.

[0092] The conductive member may include, for example, a gate electrode of a thin film transistor (TFT) included in the display panel, various wirings such as a scan line and a data line, or various electrodes such as a pixel electrode and a common electrode.

[0093] In one embodiment, various structures including a conductive material disposed below the display panel may be used as the antenna ground layer 130. For example, a metal plate (e.g., a stainless steel plate such as a SUS plate), a pressure sensor, a fingerprint sensor, an electromagnetic wave shielding layer, a heat sink, a digitizer, etc. may be used as the antenna ground layer 130.

[0094] The feed line 220 , the ground layer 230 and the antenna ground layer 130 may include the above-mentioned metals and / or alloys.

[0095] Figure 4 is a schematic top plan view illustrating an antenna package according to an exemplary embodiment.

[0096] Reference Figure 4 , the plurality of first antenna units 120 may be coupled via a feed line. For example, the feed line may include combined lines 222 and 224 and a driving signal line 226 integrally connected to each other.

[0097] Merging lines 222 and 224 may be disposed on the bottom surface of core layer 210 and may include a first merging line 222 and a second merging line 224. First merging line 222 may be coupled to first signal pad 126 of first antenna element 120. For example, two first antenna elements 120 may be coupled via first merging line 222 to form a radiating group. Second merging line 224 may be connected to multiple first merging lines 222 to couple multiple radiating groups.

[0098] One end portion of the driving signal line 226 may branch from the second merging line 224. The driving signal line 226 may extend on the bottom surface of the core layer 210, and opposite ends of the driving signal line 226 may be electrically connected to the driving IC chip 290.

[0099] Figure 4 The coupling structure of the antenna unit 110 shown is an exemplary embodiment and may be appropriately modified in consideration of the size and radiation shape of the antenna device.

[0100] Figure 5 is a schematic top plan view illustrating an antenna package according to some exemplary embodiments.

[0101] Reference Figure 5 , a dummy pattern 160 may be formed between adjacent radiation patterns 122 and 142 .

[0102] In some embodiments, the radiation patterns 122 and 142 may include a mesh pattern structure. In this case, the dummy pattern 160 may also include a mesh pattern structure.

[0103] like Figure 5 As shown, the dummy pattern 160 may be used as a floating dummy pattern independently provided in a space between adjacent first antenna units 120 and / or in a space between the first antenna unit 120 and the second antenna unit 140 .

[0104] The dummy pattern 160 can be disposed around the radiation patterns 122 and 142 to prevent visual recognition of the pattern caused by distribution deviation of the conductive pattern. In addition, the dummy pattern 160 can be used as an independent floating pattern, thereby reducing or suppressing current absorption and radiation interference generated by the dummy pattern 160.

[0105] Figure 6 and Figure 7 are a schematic top plan view and a schematic cross-sectional view, respectively, illustrating an antenna package according to some exemplary embodiments.

[0106] Reference Figure 6 and Figure 7 , the flexible printed circuit board 200 may include a first bonding pad disposed in the bonding region BR and bonded to the first ground pad 128 of the first antenna unit 120 .

[0107] For example, a pair of first bonding pads 223 may be provided on one surface of the core layer 210 with the feed line 220 interposed therebetween, and may be electrically and physically separated from the feed line 220. The first bonding pads 223 may be bonded to the first ground pad 128 included in the first antenna unit 120 through the conductive intermediate structure 150.

[0108] In some embodiments, the flexible printed circuit board 200 may further include a contact 235 electrically connecting the ground layer 230 and the first bonding pad 223 .

[0109] Figure 8 is a schematic top plan view illustrating an antenna package according to some exemplary embodiments.

[0110] Reference Figure 8 The flexible printed circuit board 200 further includes a second bonding pad 225 disposed in the bonding region BR and bonded to the second signal pad 146 and the second ground pad 148 .

[0111] In some embodiments, the conductive intermediate structure 150 may extend to cover the second signal pad 146 and the second ground pad 148. In this case, for example, the second bonding pad 225 may be bonded to the second signal pad 146 and the second ground pad 148 via the conductive intermediate structure 150.

[0112] For example, the bonding pads 223 and 225 can be provided on the elongated conductive intermediate structure 150 and then attached to the antenna device 100 through a heating / pressurization process. Thus, the bonding stability between the antenna device 100 and the flexible printed circuit board 200 can be further improved. Furthermore, the current or electric field remaining in the core layer 210 when feeding power to the first antenna element 120 can be more effectively coupled to the second antenna element 140 through the conductive intermediate structure 150 and the second bonding pads 225.

[0113] Figure 9 is a schematic top plan view illustrating an image display device according to an exemplary embodiment.

[0114] Reference Figure 9 , the image display device 300 may be manufactured in the form of a smart phone, for example, and Figure 9 The front portion or window surface of the image display device 300 is shown. The front portion of the image display device 300 may include a display area 310 and a peripheral area 320. The peripheral area 320 may correspond to a light shielding portion or a frame portion of the image display device, for example.

[0115] The antenna device 100 included in the antenna package may be disposed toward the front portion of the image display device 300 and, for example, on the display panel. In one embodiment, the radiation patterns 122 and 142 may at least partially overlap the display area 310 in a plan view.

[0116] In an exemplary embodiment, the second radiation pattern 142 of the second antenna unit 140 may be close to one end or both ends of the first antenna unit row. Therefore, it is possible to prevent radiation reduction at the side portion or end of the image display device 300.

[0117] In some embodiments, the radiation patterns 122 and 142 may have a mesh pattern structure and may prevent a decrease in transmittance caused by the radiation patterns 122 and 142. The driver IC chip 290 included in the antenna package may be disposed in the peripheral area 320 to prevent image degradation in the display area 310.

[0118] As described above, the antenna device 100 may include the second antenna unit 140 electrically and physically separated from the first antenna unit 120 and the feed line 220. Therefore, even if the number of leads or pads that can be accommodated in the driver IC chip 290 is limited, improved radiation performance and antenna gain can be achieved.

Claims

1. An antenna package, characterized in that: It includes: An antenna device comprising: a dielectric layer; a first antenna element provided on the dielectric layer; a second antenna element provided on the dielectric layer and physically and electrically separated from the first antenna element; an antenna ground layer provided on a bottom surface of the dielectric layer; and a flexible printed circuit board coupled to the antenna device so as to be electrically connected to the first antenna unit and electrically separated from the second antenna unit, The first antenna unit includes a first radiator, a first transmission line extending from the first radiator, and a first signal pad connected to one end of the first transmission line. The first radiator, the first transmission line, and the first signal pad are disposed only on the top surface of the dielectric layer and are disposed on the same layer. The second antenna unit includes a second radiator, a second transmission line extending from the second radiator, and a second signal pad connected to one end of the second transmission line. The second radiator, the second transmission line and the second signal pad are disposed only on the top surface of the dielectric layer and are disposed on the same layer, and The antenna ground layer overlaps the first radiator and the second radiator in a plan view, and does not overlap the first signal pad and the second signal pad in a plan view.

2. The antenna package according to claim 1, wherein: The flexible printed circuit board includes a core layer and a feeding line formed on one surface of the core layer and electrically connected to the first antenna unit.

3. The antenna package according to claim 2, wherein: The first signal pad of the first antenna unit is electrically connected to the feeding line.

4. The antenna package according to claim 3, wherein: The core layer covers the first signal pad of the first antenna unit and does not cover the second antenna unit in a plan view.

5. The antenna package according to claim 3, wherein: The core layer completely covers the first signal pad and at least partially covers the second signal pad in a plan view.

6. The antenna package according to claim 3, wherein: The first antenna unit further includes a first ground pad disposed around the first signal pad and separated from the first transmission line and the first signal pad, and The second antenna unit further includes a second ground pad disposed around the second signal pad and separated from the second transmission line and the second signal pad.

7. The antenna package according to claim 6, wherein: The core layer covers the first signal pad and the first ground pad of the first antenna unit and the second ground pad of the second antenna unit in a plan view.

8. The antenna package according to claim 7, wherein: The core layer does not cover the second signal pad of the second antenna unit in a plan view.

9. The antenna package according to claim 6, wherein: The flexible printed circuit board further includes a first bonding pad formed on the one surface of the core layer and bonded to the first ground pad.

10. The antenna package according to claim 9, wherein: The flexible printed circuit board further includes a second bonding pad formed on the one surface of the core layer and bonded to the second ground pad.

11. The antenna package according to claim 1, wherein: The first antenna unit includes a plurality of first antenna units forming a first antenna unit row.

12. The antenna package according to claim 11, wherein: The second antenna unit is arranged close to one end or both ends of the horizontal row of the first antenna units.

13. The antenna package according to claim 11, wherein: The device further includes a dummy pattern arranged between adjacent first antenna units among the plurality of first antenna units.

14. The antenna package according to claim 13, wherein: The dummy pattern includes a plurality of floating dummy patterns independently provided in a space between the first antenna elements and in a space between the first antenna element and the second antenna element.

15. The antenna package according to claim 1, wherein: The first antenna unit and the second antenna unit have the same shape and structure.

16. An image display device, characterized in that: It comprises the antenna package according to claim 1 .

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