Transfer hand and substrate processing apparatus

Abstract

The present inventive concept provides a transfer hand for transferring a substrate. The transfer hand for transferring a substrate includes a body and a vacuum assembly installed in the body and providing a reduced pressure to a bottom surface of the substrate to support the substrate at an upper portion of the body, wherein the vacuum assembly includes a conductive vacuum pad contacting the substrate and a sealing member disposed between the vacuum pad and the body, the sealing member being electrically connected to the vacuum pad, wherein the sealing member is grounded.

Description

Technical Field

[0001] Exemplary embodiments of the inventive concept disclosed herein relate to a hand-transferring device and a substrate processing apparatus. Background Technology

[0002] Various processes, such as photolithography, etching, ashing, thin-film deposition, and cleaning, are performed to manufacture semiconductor devices or flat panel display panels. Among these processes, photolithography involves supplying photoresist to a semiconductor substrate to form a photoresist film on the substrate surface, exposing the photoresist film using a photomask, and then supplying a developer to the exposed photoresist film to obtain the desired pattern on the substrate. These processes are performed in a processing chamber. Furthermore, typical substrate processing apparatuses have multiple transfer robots to remove processed substrates from or bring substrates into the processing chamber.

[0003] Furthermore, substrates, such as wafers, transferred to and from the substrate processing apparatus may become charged through friction with the processing fluid supplied to the substrate and / or with materials supporting or contacting the substrate (e.g., rotary chucks, heating plates, etc.). When a charged substrate comes into contact with the transfer hand of a transfer robot, an electric arc may occur between the substrate and the transfer hand, which can damage the substrate. Summary of the Invention

[0004] Embodiments of the present invention provide a transfer hand and a substrate handling apparatus capable of efficiently transferring substrates.

[0005] Embodiments of the present invention also provide a hand-transfer and substrate processing apparatus that minimizes the occurrence of electric arcing on the substrate when the hand-transfer is transferred to the substrate.

[0006] Embodiments of the present invention provide a hand-transfer and substrate processing apparatus that can properly adhere to and support the substrate even when warping occurs on the substrate.

[0007] Embodiments of the present invention provide a transfer hand and a substrate processing apparatus capable of appropriately discharging static electricity brought to a substrate.

[0008] Embodiments of the present invention provide a hand-transfer and substrate handling apparatus that minimizes damage to the substrate due to rapid power dissipation and electrostatic resistance applied to the substrate.

[0009] The technical objectives of this invention are not limited to those described above, and other unmentioned technical objectives will become apparent to those skilled in the art from the following description.

[0010] In one aspect of an embodiment of the present invention, a transfer hand for transferring a substrate includes: a body; and a vacuum assembly mounted on the body and providing depressurization to the bottom surface of the substrate to support the substrate on the upper surface of the body, wherein the vacuum assembly includes: a conductive vacuum pad that contacts the substrate; and a sealing member disposed between the vacuum pad and the body and electrically connected to the vacuum pad, wherein the sealing member is grounded.

[0011] In some embodiments, the vacuum pad may be provided to be tiltable relative to an axis perpendicular to the upper surface of the body.

[0012] In some embodiments, the body is grounded and the sealing member is electrically connected to the body and grounded.

[0013] In some embodiments, the sealing member may be provided as a material with a resistance value lower than that of the vacuum pad.

[0014] In some embodiments, the body is provided as a material with a resistance value lower than that of the sealing member.

[0015] In some embodiments, the vacuum pad includes: a head that contacts the bottom surface of the substrate; an insertion portion that is inserted into the body; and a contact portion formed between the head and the insertion portion and contacting the sealing member, wherein the contact portion is configured in a curved shape.

[0016] In some embodiments, the radius of curvature of the sealing member in the cross-section is the same as the radius of curvature of the contact unit in the cross-section.

[0017] In some embodiments, the vacuum pad includes: a hole communicating with a vacuum line disposed in the body to provide decompression to the bottom surface of the substrate; and an annular protrusion formed at an edge region of the upper surface of the vacuum pad.

[0018] In some embodiments, the vacuum pad includes at least one support protrusion formed on the upper surface of the vacuum pad and positioned within the annular protrusion.

[0019] In some embodiments, the height of the top of the support protrusion is lower than the height of the top of the annular protrusion.

[0020] In one aspect of an embodiment of the present invention, a transfer hand for transferring a substrate includes: a body; and a vacuum assembly mounted in the body and supporting the substrate, the vacuum assembly forming at least a portion of a discharge path for removing static charge from the substrate; wherein the vacuum assembly includes: a conductive vacuum pad that contacts the substrate and is configured to be tiltable relative to an axis perpendicular to the upper surface of the body; and a conductive ring disposed at the lower portion of the vacuum pad and electrically connected to the vacuum pad.

[0021] In some embodiments, the conductive ring is provided as a material with a resistance value lower than that of the vacuum pad.

[0022] In some embodiments, the vacuum pad is provided to have a depth of about 10 6 Ω / sq up to 10 9 A material with a resistance value in the range of Ω / sq, wherein the conductive ring is provided having a resistance value in the range of about 10 Ω / sq. 3 Ω / sq up to 10 4 Materials with resistance values ​​in the range of Ω / sq.

[0023] In some embodiments, the vacuum pad includes: an aperture communicating with a vacuum line disposed in the body and providing decompression to the lower surface of the substrate; an annular protrusion formed at an edge region of the upper surface of the vacuum pad; and a plurality of support protrusions disposed on the upper surface of the vacuum pad and positioned further inward than the annular protrusion, wherein the tip height of the support protrusions is lower than the tip height of the annular protrusion.

[0024] In some embodiments, the support protrusions are circumferentially spaced apart from each other on the upper surface of the vacuum pad.

[0025] In some embodiments, the body further includes a base having a mounting portion for mounting the conductive ring thereon, wherein the radius of curvature of the conductive ring in cross-section is smaller than the radius of curvature of the base in cross-section.

[0026] In some embodiments, the vacuum assembly includes a retaining member to prevent the vacuum pad from deviating from the base, wherein the retaining member includes: a main body portion inserted into a through hole formed at the vacuum pad; and a locking portion extending laterally from the main body portion such that the locking portion overlaps with the base when viewed from above.

[0027] In one aspect of an embodiment of the present invention, a substrate processing apparatus includes: a transposition module having a loading port on which a container for storing substrates is placed; and a processing module for performing a processing procedure on the substrate, wherein a robotic hand having a transfer hand for transferring the substrate is provided at the transposition module and / or the processing module, wherein the transfer hand includes: a body having fingers, a main body, and a base mounted on the fingers or the main body; and a vacuum assembly mounted on the body and supporting the substrate on an upper surface of the body by applying vacuum pressure to a bottom surface of the substrate, wherein the vacuum assembly includes: a conductive vacuum pad contacting the substrate and configured to be tiltable relative to an axis perpendicular to the upper surface of the body; and a conductive ring disposed between the vacuum pad and the base, contacting and electrically connected to the vacuum pad and the base, wherein the base is electrically connected to the main body or the fingers, and the main body or the fingers is grounded.

[0028] In some embodiments, the base is provided as an aluminum material, the surface of the base is coated with a material including nickel, the conductive ring is provided as a material including a fluorinated resin, and the vacuum pad is provided as a material including a conductive plastic material.

[0029] In some embodiments, the substrate processing apparatus further includes an interface module that connects the processing module to an external processing device that performs a different processing process than the processing module, wherein any one of the indexing module, the processing module, and the interface module is provided with a robotic arm having the transfer hand.

[0030] In an embodiment of the present invention, the substrate can be transported efficiently.

[0031] Furthermore, in embodiments of the present invention, when transferring a hand onto a substrate, the occurrence of electric arcing on the substrate can be minimized.

[0032] Furthermore, in embodiments of the present invention, even if warping occurs on the substrate, the transfer hand can properly adhere to and support the substrate.

[0033] Furthermore, in embodiments of the present invention, the static electricity carried on the substrate can be appropriately discharged.

[0034] Furthermore, in embodiments of the present invention, damage to the substrate due to rapid dissipation can be minimized when discharging an electrostatically charged substrate.

[0035] The effects of this invention are not limited to those described above; those skilled in the art can clearly understand any effects not mentioned based on this specification and the accompanying drawings. Attached Figure Description

[0036] The above and other objects and features will become apparent from the following description with reference to the accompanying drawings, wherein, unless otherwise stated, the same reference numerals refer to the same parts in all the various drawings, and wherein:

[0037] Figure 1 The figure illustrates a substrate processing apparatus according to an embodiment of the present invention.

[0038] Figure 2 It is shown Figure 1 A cross-sectional view of a substrate processing apparatus for coating blocks or developing blocks.

[0039] Figure 3 yes Figure 1 A plan view of the substrate processing apparatus.

[0040] Figure 4 It is shown schematically. Figure 3 A floor plan of the implementation method of the heat treatment chamber.

[0041] Figure 5 yes Figure 4 Front view of the heat treatment chamber.

[0042] Figure 6 Schematic map shows the setting Figure 4 An embodiment of a substrate processing apparatus in a liquid processing chamber.

[0043] Figure 7 yes Figure 6 Floor plan of the liquid handling room.

[0044] Figure 8 This is a perspective view showing the shape of the conveying hand according to an embodiment of the present invention.

[0045] Figure 9 It is shown Figure 8 An exploded perspective view of the vacuum components and the base contained in the body.

[0046] Figure 10 It is shown Figure 8 A cross-sectional view of a portion of the conveyor hand.

[0047] Figure 11 The diagram shows the substrate being placed Figure 8 The state of the transmission hand.

[0048] Figure 12 , Figure 13 and Figure 14The figure illustrates another embodiment of the vacuum assembly.

[0049] Figure 15 This is a plan view showing the shape of the conveying hand according to another embodiment of the concept of the present invention.

[0050] Figure 16 It is shown Figure 15 An exploded perspective view of the vacuum components and the base contained in the body.

[0051] Figure 17 It is shown Figure 15 A cross-sectional view of a portion of the conveyor hand.

[0052] Figure 18 The diagram shows the substrate being placed Figure 15 The state of the hand that transmits information. Detailed Implementation

[0053] The inventive concept can be modified in various ways and can take many forms, and its specific embodiments will be shown and described in detail in the accompanying drawings. However, the embodiments of the inventive concept are not intended to limit the specific forms disclosed, and it should be understood that the inventive concept includes all variations, equivalents, and substitutions contained within the spirit and technical scope of the inventive concept. In the description of the inventive concept, detailed descriptions of relevant known technologies may be omitted where such descriptions may obscure the essence of the inventive concept.

[0054] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the inventive concept. As used herein, the singular forms “a,” “an,” and “described” are also intended to include the plural forms unless the context clearly indicates otherwise. It will be further understood that, when used in this specification, the terms “comprising,” “including,” “containing,” “having,” etc., designate the presence of the stated features, integrals, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or groups thereof. As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items. Moreover, the term “exemplary” is intended to refer to an example or illustration.

[0055] It should be understood that although the terms "first," "second," "third," etc., may be used herein to describe various elements, components, regions, layers, and / or portions, these elements, components, regions, layers, and / or portions should not be limited by these terms. These terms are used only to distinguish one element, component, region, layer, or portion from another region, layer, or portion. Therefore, without departing from the teachings of the inventive concept, the first element, component, region, layer, or portion discussed below may be referred to as the second element, component, region, layer, or portion.

[0056] It should be understood that when a component or layer is referred to as "on," "connected to," "linked to," or "adjacent to" another component or layer, it can be directly on, directly connected to, linked to, or adjacent to other components or layers, or there may be intermediate components or layers. Conversely, when a component is referred to as "directly on," "directly connected to," "directly linked to," or "directly adjacent to" another component or layer, there are no intermediate components or layers.

[0057] In the following text, reference will be made to Figures 1 to 18 To illustrate the implementation of the present invention.

[0058] Figure 1 A substrate processing apparatus according to an embodiment of the present invention. Figure 2 It shows Figure 1 The coating block or developing block, Figure 3 It shows Figure 1 Substrate processing apparatus.

[0059] refer to Figures 1 to 3 According to an embodiment of the present invention, a substrate processing apparatus 10 includes a transposition module 100, a processing module 300, and an interface module 500. According to the embodiment, the transposition module 100, the processing module 300, and the interface module 500 are arranged in a row in sequence. Hereinafter, the arrangement direction of the transposition module 100, the processing module 300, and the interface module 500 will be referred to as a first direction 12, the direction perpendicular to the first direction when viewed from above will be referred to as a second direction 14, and the direction perpendicular to the first direction 12 and the second direction 14 will be referred to as a third direction 16.

[0060] The transposition module 100 transfers the substrate W from the container F containing the substrate W to the processing module 300, retrieves the processed substrate W from the processing module 300, and stores it in the container F. The transposition module 100 is configured to extend its length along the second direction 14. The transposition module 100 has a loading port 110 and a transposition frame 130. The transposition frame 130 is positioned between the loading port 110 and the processing module 300. The container F storing the substrate W is positioned at the loading port 110. Multiple loading ports 110 can be provided, and the multiple loading ports 110 can be positioned along the second direction 14.

[0061] For container F, a closed container F, such as a front-opening standard container (FOUP), can be used. Container F can be placed on loading port 110 by a conveying device (not shown) such as an overhead conveyor, overhead conveyor or automated guided vehicle, or container F can be placed on loading port 110 by an operator.

[0062] A sorting robot 132 is disposed inside a sorting frame 130. In the sorting frame 130, a guide rail 136 is configured to extend its length along a second direction 14, and the sorting robot 132 is configured to be movable on the guide rail 136. The sorting robot 132 includes a hand on which a substrate W is placed, and the hand is configured to be movable back and forth, rotatable about a third direction 16, and movable along the third direction 16.

[0063] The processing module 300 can perform coating and developing processes on the substrate W. The processing module 300 can receive the substrate W stored in the container F and perform substrate processing processes. The processing module 300 has a coating block 300a and a developing block 300b. The coating block 300a performs the coating process on the substrate W, and the developing block 300b performs the developing process on the substrate W. Multiple coating blocks 300a are provided and are stacked vertically on top of each other. Multiple developing blocks 300b are provided and are stacked vertically on top of each other. Figure 1 In this embodiment, two coating blocks 300a and two developing blocks 300b are provided. The coating blocks 300a may be disposed below the developing blocks 300b. In this embodiment, the two coating blocks 300a perform the same process and can be arranged with the same structure. Similarly, the two developing blocks 300b perform the same process and can be arranged with the same structure.

[0064] refer to Figure 3 The coating block 300a includes a heat treatment chamber 320, a transfer chamber 350, a liquid treatment chamber 360, and buffer chambers 312 and 316. The heat treatment chamber 320 may be a cavity for performing heat treatment processes on the substrate W. The heat treatment process may include cooling and heating processes. The liquid treatment chamber 360 supplies liquid onto the substrate W to form a liquid layer. The liquid layer may be a photoresist film or an anti-reflective film. The transfer chamber 350 transfers the substrate W between the heat treatment chamber 320 and the liquid treatment chamber 360 in the coating block 300a.

[0065] The transfer chamber 350 is configured such that its length is parallel to the first direction 12. A transfer robot 352 is provided in the transfer chamber 350. The transfer robot 352 transfers substrates between the heat treatment chamber 320, the liquid treatment chamber 360, and the buffer chambers 312 and 316. In an embodiment, the transfer robot 352 has a hand for placing the substrate W, and this hand can be configured to move forward and backward, rotate about the third direction 16, and move along the third direction 16. A guide rail 356 is provided in the transfer chamber 350, the length of which is parallel to the first direction 12, and the transfer robot 352 can be configured to move on the guide rail 356.

[0066] Multiple heat treatment chambers 320 are provided. The heat treatment chambers 320 are arranged along the first direction 12. The heat treatment chambers 320 are placed on one side of the transfer chamber 350.

[0067] Figure 4 It shows Figure 3 The heat treatment chamber, Figure 5 An embodiment of the invention is shown. Figure 4 The heat treatment chamber.

[0068] refer to Figure 4 and Figure 5 The heat treatment chamber 320 includes a shell 3210, a cooling unit 3220, a heating unit 3230, and a conveyor plate 3240.

[0069] The housing 3210 is configured in a generally cuboid shape. An entrance (not shown) is provided on the side wall of the housing 3210, through which the substrate W enters and exits. The entrance may remain open. Alternatively, a door (not shown) may be provided to open and close the entrance. A cooling unit 3220, a heating unit 3230, and a conveyor plate 3240 are disposed within the housing 3210. The cooling unit 3220 and the heating unit 3230 are arranged side by side along the second direction 14. In an embodiment, the cooling unit 3220 may be placed closer to the conveyor chamber 350 than the heating unit 3230.

[0070] The cooling unit 3220 has a cooling plate 3222. When viewed from above, the cooling plate 3222 may have a generally circular shape. The cooling plate 3222 is provided with a cooling member 3224. In an embodiment, the cooling member 3224 is formed inside the cooling plate 3222 and may be configured as a channel for the flow of cooling fluid.

[0071] The heating unit 3230 includes a heating plate 3232, a cover 3234, and a heater 3233. When viewed from above, the heating plate 3232 has a generally circular shape. The heating plate 3232 has a diameter larger than that of the substrate W. The heating plate 3232 is equipped with the heater 3233. The heater 3233 can be implemented using a resistance heating element to which an electric current is applied. The heating plate 3232 is provided with lifting pins 3238 that can move vertically along a third direction 16. The lifting pins 3238 receive the substrate W from a conveying device outside the heating unit 3230 and place the substrate W downwards onto the heating plate 3232, or lift the substrate W away from the heating plate 3232 and convey the substrate W to a conveying device outside the heating unit 3230. In an embodiment, three lifting pins 3238 may be provided. The cover 3234 has an internal space with an opening at the bottom. The cover 3234 is located above the heating plate 3232 and is moved vertically by a driver 3236. The space formed by the movable cover 3234 and the heating plate 3232 together is used as a heating space, in which the substrate W is heated.

[0072] The conveyor plate 3240 has a substantially circular shape and a diameter corresponding to the diameter of the substrate W. A notch 3244 is formed at the edge of the conveyor plate 3240. The notch 3244 may have a shape corresponding to a protrusion formed on the hand. Furthermore, as many notches 3244 as protrusions are formed on the hand at positions corresponding to the protrusions. The substrate W is conveyed between the hand and the conveyor plate 3240 when the vertical position of the hand and the conveyor plate 3240, which are aligned with each other in the up / down direction, changes. The conveyor plate 3240 can be mounted on a guide rail 3249 and can be moved along the guide rail 3249 between a first region 3212 and a second region 3214 by a driver 3246. A plurality of slit-shaped guide grooves 3242 are provided in the conveyor plate 3240. The guide grooves 3242 extend inwardly from the edge of the conveyor plate 3240. The guide grooves 3242 are configured to extend their length along a second direction 14 and are spaced apart from each other along the second direction 14. When the substrate W is transferred between the conveyor plate 3240 and the heating unit 3230, the guide groove 3242 prevents the conveyor plate 3240 and the lifting pin 3238 from interfering with each other.

[0073] The substrate W is cooled while the transfer plate 3240, on which the substrate W is placed, is in contact with the cooling plate 3222. To ensure effective heat transfer between the cooling plate 3222 and the substrate W, the transfer plate 3240 is formed of a material with high thermal conductivity. In this embodiment, the transfer plate 3240 may be formed of a metallic material.

[0074] Heating units 3230 disposed in some heat treatment chambers 320 can supply gas while heating the substrate W to improve the adhesion of photoresist to the substrate W. In an embodiment, the gas may be hexamethyldisilane (HMDS) gas.

[0075] Multiple liquid handling chambers 360 are provided. Some of the liquid handling chambers 360 can be stacked on top of each other. The liquid handling chambers 360 are located on one side of the transfer chamber 350. The liquid handling chambers 360 are arranged side by side along a first direction 12. Some of the liquid handling chambers 360 are adjacent to the transposition module 100. Hereinafter, these liquid handling chambers 360 are referred to as front liquid handling chambers 362. Some other liquid handling chambers 360 are adjacent to the interface module 500. Hereinafter, these liquid handling chambers 360 are referred to as rear liquid handling chambers 364.

[0076] Each front liquid processing chamber 362 applies a first liquid to the substrate W, and each rear liquid processing chamber 364 applies a second liquid to the substrate W. The first liquid and the second liquid can be different types of liquids. In one embodiment, the first liquid can be a liquid used to form an anti-reflective layer, while the second liquid can be a liquid used to form a photoresist layer. The photoresist liquid can be applied to the substrate W coated with the anti-reflective film. Alternatively, the first liquid can be a photoresist liquid, and the second liquid can be a liquid used to form an anti-reflective layer. In this case, the liquid used to form the anti-reflective layer can be applied to the substrate W coated with the photoresist layer. Alternatively, the first liquid and the second liquid can be the same liquid, and both the first liquid and the second liquid can be liquids used to form photoresist layers.

[0077] Figure 6 Schematic map shows the setting Figure 4 An example of a substrate processing apparatus in a liquid processing chamber. Figure 7 yes Figure 6 Floor plan of the liquid handling room.

[0078] refer to Figure 6 and Figure 7 A substrate processing apparatus 1000 for processing substrate W can be installed in the liquid processing chamber 360. A substrate processing apparatus 100 for performing liquid processing on substrate W can be installed in the liquid processing chamber 360.

[0079] The substrate processing apparatus 1000 disposed in the liquid processing chamber 360 may include a housing 1100, a processing container 1200, a support unit 1300, a flow supply unit 1400, a liquid supply unit 1500, and a controller 1900.

[0080] The housing 1100 may have an internal space 1102. The housing 1100 may be configured as a rectangular container shape with the internal space 1102. An opening (not shown) may be formed in the sidewall of the housing 1100. The opening may serve as an inlet / outlet for the substrate W to enter or leave the internal space 1102. Furthermore, in order to selectively open or close the opening, a door (not shown) may be provided in the area adjacent to the opening. While performing processing on the substrate W placed in the internal space 1102, the door may close the opening to isolate the internal space 1102 from the outside.

[0081] A processing container 1200 can be disposed within the internal space 1102. The processing container 1200 may have a processing space 1202. That is, the processing container 1200 may be a bowl-shaped portion having a processing space 1202. Therefore, the internal space 1102 may be configured to surround the processing space 1202. The processing container 1200 may have a cup shape with a top opening. The processing space 1202 of the processing container 1200 may be the space in which the support unit 1300 supports and rotates the substrate W, as described below. The processing space 1202 may be the space in which the liquid supply unit 1500 and the wetting unit supply processing media to process the substrate W.

[0082] The processing container 1200 may include an inner cup-shaped portion 1210 and an outer cup-shaped portion 1230. The outer cup-shaped portion 1230 may be configured circumferentially around the support unit 1300, and the inner cup-shaped portion 1210 may be located inside the outer cup-shaped portion 1230. When viewed from above, each of the inner cup-shaped portion 1210 and the outer cup-shaped portion 1230 may have an annular hole shape. The space between the inner cup-shaped portion 1210 and the outer cup-shaped portion 1230 may be used as a recycling channel through which the processing medium introduced into the processing space 1202 is recycled.

[0083] When viewed from above, the inner cup-shaped portion 1210 can be shaped around the rotation axis 1330 of the support unit 1300, which will be described later. For example, when viewed from above, the inner cup-shaped portion 1210 can be shaped like a circular plate around the rotation axis 1330. When viewed from above, the inner cup-shaped portion 1210 can be positioned to overlap with the vent 1120 connected to the housing 1100. The inner cup-shaped portion 1210 may have an inner portion and an outer portion. The upper surface of each of the inner and outer portions can be configured to have different angles relative to a virtual horizontal line. For example, when viewed from above, the inner portion can be positioned to overlap with the support plate 1310 of the support unit 1300, which will be described later. The inner portion can be positioned facing the rotation axis 1330. The upper surface of the inner portion can be inclined upward away from the rotation axis 1330, and the outer portion can extend outward from the inner portion. The upper surface of the outer portion can be inclined downward from the rotation axis 1330. The upper end of the inner portion can coincide with the lateral end of the substrate W in the up / down direction. In this embodiment, the point where the outer and inner portions meet can be located lower than the upper end of the inner portion. The point where the inner and outer portions meet can be rounded. The outer portion can be combined with the outer cup-shaped portion 1230 to form a recovery channel through which a processing medium, such as a processing liquid or wetting medium, is recovered.

[0084] The outer cup-shaped portion 1230 can be configured as a cup shape surrounding the support unit 1300 and the inner cup-shaped portion 1210. The outer cup-shaped portion 1230 can have a bottom 1232, a side portion 1234, and an inclined portion 1236. The bottom 1232 can be a circular plate shape with an empty space. A recycling line 1238 can be connected to the bottom 1232. The recycling line 1238 can be used to recycle the processing medium supplied to the substrate W. The processing medium recycled by the recycling line 1238 can be reused by an external regeneration system. The side portion 1234 can have an annular hole shape surrounding the support unit 1300. The side portion 1234 can extend vertically from the side end of the bottom 1232. The side portion 1234 can extend upward from the bottom 1232.

[0085] The inclined portion 1236 can extend from the upper end of the side portion 1234 along the direction toward the central axis of the outer cup-shaped portion 1230. The inner surface of the inclined portion 1236 can be configured to be inclined upwards to be close to the support unit 1300. The inclined portion 1236 can be configured to have an annular shape. When processing is performed on the substrate W, the upper end of the inclined portion 1236 can be located at a higher position than the substrate W supported on the support unit 1300.

[0086] The inner lifting member 1242 and the outer lifting member 1244 can raise and lower the inner cup-shaped portion 1210 and the outer cup-shaped portion 1230, respectively. The inner lifting member 1242 can be connected to the inner cup-shaped portion 1210, and the outer lifting member 1244 can be connected to the outer cup-shaped portion 1230 to raise or lower the inner cup-shaped portion 1210 and the outer cup-shaped portion 1230, respectively.

[0087] The support unit 1300 can support and rotate the substrate W. The support unit 1300 can be a chuck for supporting and rotating the substrate W. The support unit 1300 may include a support plate 1310, a rotation shaft 1330, and a rotation shaft driver 1350. The support plate 1310 may have a mounting surface on which the substrate W is mounted. When viewed from above, the support plate 1310 may have a circular shape. When viewed from above, the support plate 1310 may have a diameter smaller than that of the substrate W. A suction hole (not shown) may be formed at the support plate 1310, and the support plate 1310 may clamp the substrate W by vacuum pressure. Alternatively, an electrostatic plate (not shown) may be provided at the support plate 1310 to clamp the substrate W by electrostatic attraction. Alternatively, a support pin may be provided at the support plate 1310 to support the substrate W, such that the support pin can physically contact the substrate W to clamp it.

[0088] The rotating shaft 1330 can be connected to the support plate 1310. The rotating shaft 1330 can be connected to the lower surface of the support plate 1310. The rotating shaft 1330 can be configured such that its length direction is parallel to the up / down direction. The rotating shaft 1330 can be rotated by power transmitted from the rotary driver 1350. Therefore, the rotating shaft 1330 can cause the support plate 1310 to rotate. The rotary driver 1350 can change the rotational speed of the rotating shaft 1330. The rotary driver 1350 can be a motor providing the driving force. However, the inventive concept is not limited thereto, and the rotary driver 1350 can be implemented using various well-known devices for providing driving force.

[0089] The flow supply unit 1400 supplies airflow to the interior space 1102. The flow supply unit 1400 supplies downward airflow to the interior space 1102. The flow supply unit 1400 supplies temperature- and / or humidity-regulated airflow to the interior space. The flow supply unit 1400 can be installed within the housing 1100. The flow supply unit 1400 can be positioned above the processing container 1200 and the support unit 1300. The flow supply unit 1400 may include a fan 1410, an airflow supply line 1430, and a filter 1450. The airflow supply line 1430 supplies temperature- and / or humidity-regulated external airflow to the interior space 1102. The filter 1450 is installed at the airflow supply line 1430 to remove impurities outside the airflow flowing within the airflow supply line 1430. Furthermore, the fan 1410, during operation, can uniformly deliver the external airflow supplied by the airflow supply line 1430 into the interior space 1102.

[0090] The liquid supply unit 1500 can supply the processing liquid PR to the substrate W supported on the support unit 1300. The processing liquid supplied to the substrate W by the liquid supply unit 1500 can be a coating liquid. For example, the coating liquid can be a photosensitive liquid of photoresist. In addition, the liquid supply unit 1500 can supply a pre-wetting liquid TH to the substrate W supported on the support unit 1300. The pre-wetting liquid TH supplied to the substrate W by the liquid supply unit 1500 can be a liquid capable of changing the surface properties of the substrate W. For example, the pre-wetting solution TH can be a diluent that can change the surface properties of the substrate W to hydrophobic properties.

[0091] The liquid supply unit 1500 may include a pre-wetting nozzle 1510, a processing liquid nozzle 1530, an arm 1540, a guide rail 1550, and a driver 1560.

[0092] The pre-wetting nozzle 1510 can supply the pre-wetting liquid TH to the substrate W. The pre-wetting nozzle 1510 can supply the pre-wetting liquid TH to the substrate W in a flow manner. The processing liquid nozzle 1530 can supply the processing liquid PR to the substrate W. The processing liquid nozzle 1530 can be a coating liquid nozzle for supplying coating liquids such as the photoresist described above. The processing liquid nozzle 1530 can supply the processing liquid PR to the substrate W in a flow manner.

[0093] Arm 1540 can support pre-wetting nozzle 1510 and processing fluid nozzle 1530. Pre-wetting nozzle 1510 and processing fluid nozzle 1530 can be mounted at one end of arm 1540. Pre-wetting nozzle 1510 and processing fluid nozzle 1530 can each be mounted on the lower surface of one end of arm 1540. When viewed from above, pre-wetting nozzle 1510 and processing fluid nozzle 1530 can be arranged in a direction parallel to the length direction of guide rail 1550, which will be described later. Opposite ends of arm 1540 can be connected to actuator 1560. Arm 1540 can be moved by actuator 1560, which moves arm 1540. Therefore, the positions of pre-wetting nozzle 1510 and processing fluid nozzle 1530 mounted on arm 1540 can be changed. Arm 1540 can be guided and moved along guide rail 1550, on which actuator 1560 is mounted. Guide rail 1550 can be configured such that its length direction is parallel to the horizontal direction. For example, the guide rail 1550 can be configured such that its length direction is parallel to the first direction 12. Optionally, the arm 1540 can be coupled to and rotated on a rotating shaft having a length direction parallel to a third direction 16. The rotating shaft can be rotated by a driver. Therefore, the positions of the pre-wetting nozzle 1510 and the treatment fluid nozzle 1530 mounted in the arm 1540 can be changed.

[0094] The controller 1900 can control the substrate processing apparatus 10. For example, the controller 1900 can control the substrate processing apparatus 1000 disposed in the liquid processing chamber 360. The controller 1900 can control the substrate processing apparatus 1000 to perform a liquid processing process on the substrate W in the liquid processing chamber 360. The controller 1900 can control the substrate processing apparatus 1000 to perform a coating process to form a liquid layer on the substrate W in the liquid processing chamber 360.

[0095] Refer again Figure 2 and Figure 3Multiple buffer chambers 312 and 316 are provided. Some of the buffer chambers 312 and 316 are located between the indexing module 100 and the transfer chamber 350. Hereinafter, these buffer chambers are referred to as front buffers 312. Multiple front buffers 312 are stacked on top of each other in an upward / downward direction. Some of the other buffer chambers 312 and 316 are located between the transfer chamber 350 and the interface module 500. These buffer chambers are referred to as rear buffers 316. Multiple rear buffers 316 are stacked on top of each other in an upward / downward direction. Each of the front buffers 312 and rear buffers 316 temporarily stores multiple substrates W. The substrates W stored in the front buffer 312 are loaded or unloaded by the indexing robot 132 and the transfer robot 352. The substrates W buffers 316 stored in the rear buffers 312 are loaded or unloaded by the transfer robot 352 and the first robot 552.

[0096] Furthermore, a first front buffer robot 314 and a second front buffer robot 315 are respectively disposed on one side and opposite sides of the front buffer 312, between the front buffer 312, to transfer the substrate W. When viewed from above, the first front buffer robot 314 and the second front buffer robot 315 can be symmetrically positioned, with the front buffer 312 positioned between them. Furthermore, each of the first front buffer robot 314 and the second front buffer robot 315 can have a transfer hand. Additionally, the first front buffer robot 314 and the second front buffer robot 315 can be disposed at different heights.

[0097] Furthermore, a first rear buffer robot 318 and a second rear buffer robot 319, respectively, can be disposed on one side and opposite sides of the rear buffer 316 to transfer the substrate W. When viewed from above, the first rear buffer robot 318 and the second rear buffer robot 319 can be symmetrically positioned, with the rear buffer 316 positioned between them. Furthermore, each of the first rear buffer robot 318 and the second rear buffer robot 319 can have a transfer hand. Additionally, the first rear buffer robot 318 and the second rear buffer robot 319 can be disposed at different heights.

[0098] The developing block 300b includes a heat treatment chamber 320, a transfer chamber 350, and a liquid handling chamber 360. The structure and arrangement of the heat treatment chamber 320 and transfer chamber 350 of the developing block 300b are substantially similar to those of the heat treatment chamber 320 and transfer chamber 350 of the coating block 300a, therefore a description thereof will be omitted. The liquid handling chamber 360 in the developing block 300b is configured as a developing chamber 360, and all of these developing chambers 360 are identically supplied with developing solution to perform the developing process on the substrate W.

[0099] Interface module 500 connects processing module 300 to external exposure device 700. Interface module 500 has interface frame 510, additional processing chamber 520, interface buffer 530 and interface robot 550.

[0100] A fan filter unit that forms a downward airflow can be disposed at the upper end of the interface frame 510. An additional processing chamber 520, an interface buffer 530, and an interface robot 550 are disposed within the interface frame 510. The additional processing chamber 520 can perform a predetermined additional process before the substrate W processed in the coating block 300a is transferred to the exposure apparatus 700. Alternatively, the additional processing chamber 520 can perform a predetermined additional process before the substrate W processed in the exposure apparatus 700 is transferred to the developing block 300b. In an embodiment, the additional process can be an edge exposure process that exposes the edge region of the substrate W, a top-side cleaning process that cleans the top side of the substrate W, or a back-side cleaning process that cleans the back side of the substrate W. Multiple additional processing chambers 520 can be provided, and the additional processing chambers 520 can be stacked vertically on top of each other. All additional processing chambers 520 can be configured to perform the same process. Alternatively, some of the additional processing chambers 520 can be configured to perform different processes.

[0101] Interface buffer 530 provides a space in which a substrate W being transported between coating block 300a, additional processing chamber 520, exposure apparatus 700 and developing block 300b temporarily rests during transport. Multiple interface buffers 530 can be provided, and multiple interface buffers 530 can be stacked on top of each other.

[0102] In one embodiment, the additional processing chamber 520 may be located on the side of the extension line facing the transmission chamber 350 along its length, and the interface buffer 530 may be located on the opposite side of the extension line.

[0103] An interface robot 550 transfers a substrate W between a coating block 300a, an additional processing chamber 520, an exposure apparatus 700, and a developing block 300b. The interface robot 550 may have a transfer hand for transferring the substrate W. The interface robot 550 may be a single robot or multiple robots. In one embodiment, the interface robot 550 has a first robot 552 and a second robot 554. The first robot 552 may be configured to transfer the substrate W between the coating block 300a, the additional processing chamber 520, and the interface buffer 530, and the second robot 554 may transfer the substrate W between the interface buffer 530 and the exposure apparatus 700, and may also transfer the substrate W between the interface buffer 300b and the developing block 300b.

[0104] Each of the first robotic arm 552 and the second robotic arm 554 includes a transfer hand on which the substrate W is placed, and the hand can be configured to move forward and backward, rotate relative to an axis parallel to a third direction 16, and move along the third direction 16.

[0105] The following will describe a conveying hand according to an embodiment of the present invention.

[0106] The first transfer hand 2000 described below according to the embodiment of the present invention can be a transfer hand provided by the interface robot 550. However, the present invention is not limited thereto, and the transfer hand of the first transfer hand 2000 described below according to the embodiment of the present invention can be the transfer hand of the indexing robot 132, the first front buffer robot 314, the second front buffer robot 315, the first rear buffer robot 318, the second rear buffer robot 319, and the transfer robot 352.

[0107] Figure 8 A conveying hand according to an embodiment of the present invention is shown. Specifically, Figure 8 A first transfer hand 2000 according to an embodiment of the present invention is shown. (Reference) Figure 8 According to an embodiment of the present invention, the first conveying hand 2000 may include a first body 2100 and a first vacuum line 2400 (see...). Figure 10 ) and the first vacuum assembly 2500.

[0108] The first body 2100 can be coupled to the actuator of the interface robot 550 to be position-variable. Furthermore, the first body 2100 can be provided as a conductive material. For example, the first body 2100 can be provided as a material including metal. Additionally, the first body 2100 can be grounded. When the charged substrate W is located on the first transfer hand 2000, the grounded first body 2100 can provide at least a portion of a discharge path for removing static electricity from the charged substrate W.

[0109] In addition, the first body 2100 may include a first main body 2102, a first finger portion 2110, a first base portion 2130, and a support pin 2150.

[0110] The first main body 2102 can be grounded. Furthermore, a first base 2130 can be mounted on the first main body 2102, on which a first conductive ring 2550, which will be described later, is placed. The detailed structure of the first base 2130 will be described later.

[0111] Furthermore, the first body 2100 may have at least one first finger-like portion 2110. For example, the first finger-like portion 2110 may extend from the first main body 2102 and be integrally formed with the first main body 2102. Additionally, the first body 2100 may have a 1-1 finger-like portion 2111 and a 1-2 finger-like portion 2112. The 1-1 finger-like portion 2111 and the 1-2 finger-like portion 2112 may have different lengths. For example, the length of the 1-1 finger-like portion 2111 may be longer than the length of the 1-2 finger-like portion 2112.

[0112] Support pins 2150 can be mounted on the first main body 2102 or the first finger portion 2110. The support pins can support the lower surface of the substrate W. Furthermore, the support pins 2150 can support the lower surface of the substrate W, so that the substrate W can be supported more stably when the first vacuum assembly 2500, described later, adsorbs and supports it. Additionally, at least one support pin 2150 can be mounted on the upper surface of the first main body 2102 or the upper surface of the first finger portion 2110. For example, multiple support pins 2150 can be mounted on the upper surface of the first main body 2102 or the upper surface of the first finger portion 2110. Furthermore, multiple support pins 2150 can be mounted on the upper surface of the first main body 2102 or the upper surface of the first finger portion 2110, and at least some of the support pins 2150 can be mounted on at least one of the first fingers 2110. For example, at least some of the support pins 2150 can be mounted on the upper surface of the 1-1 finger portion 2111. Although... Figure 8 The number of support pins 2150 shown is 4, but the concept of the present invention is not limited to this. The number of support pins 2150 can be modified in various ways to stably support the substrate W. Figure 8 At least some of the support pins 2150 are shown mounted on the upper surface of the 1-1 finger portion 211, but the inventive concept is not limited thereto, and the mounting position of the support pins 2150 can be modified in various ways to stably support the substrate W.

[0113] Furthermore, a first vacuum assembly 2500 can be mounted on the first body 2100. The first vacuum assembly 2500 can also adsorb and support the substrate W. The first vacuum assembly 2500 can vacuum-adsorb the lower surface of the substrate W to support it thereon. Furthermore, the first vacuum assembly 2500 can be electrically connected to the grounded first body 2100. Therefore, the first vacuum assembly 2500 can form at least a portion of a discharge path for removing static electricity charged on the substrate W.

[0114] Figure 9 It shows Figure 8 Vacuum components and base included in the body, Figure 10 It shows Figure 8 Part of the hand that transmits information. (The text appears to be incomplete and contains several grammatical errors. A more accurate Figure 9 and Figure 10 A first vacuum assembly 2500 and a first base 2130 included in a first body 2100 are shown as embodiments of a first transfer hand 2000 according to the present invention.

[0115] First, the first base 2130 can be connected to the first main body 2102 and / or the first finger 2110. The first base 2130 can also be connected to a grounded first main body 2102 and / or a grounded first finger 2110. Furthermore, the first base 2130 can be electrically connected to a grounded first main body 2102 or a grounded first finger 2110. A first vacuum pad 2510 and a first conductive ring 2550, which will be described later, can be disposed at the first base 2130. For example, the first conductive ring 2550, described later, can be disposed between the first vacuum pad 2510 and the first base 2130. The first conductive ring 2550 can contact the first vacuum pad 2510 and the first base 2130 for electrical connection thereto.

[0116] When viewed from above, the first base 2130 may have a substantially rectangular shape, and first connecting holes 2134 may be formed at the corners of the first base 2130. Fixing devices such as screws or bolts (not shown) may be inserted into the first connecting holes 2134, and the fixing devices may securely connect the first base 2130 to the first main body 2102 and / or the first finger portion 2110.

[0117] Furthermore, when viewed from above, a first insertion hole 2133 can be formed in the central region of the first base 2130. The first insertion portion 2516 of the first vacuum pad 2510, which will be described later, and the first main body portion 2571 of the first fixing member 2570, which will be described later, can be inserted into the first insertion hole 2133 from the opposite side.

[0118] Furthermore, when viewed from above, a first recess 2131 can be formed in the central region of the first base 2130, recessed downward from the first base 2130. Additionally, a first mounting portion 2132 can be formed at the first base 2130 to bend downward from the first recess 2131 (indentation), on which a first conductive ring 2550, which will be described later, is mounted.

[0119] Furthermore, the first base 2130 can be provided as a conductive material. For example, the first base 2130 can be provided as a metallic material. For example, the first base 2130 can be provided as a material including aluminum, and the surface of the first base 2130 can be coated with a material including nickel (Ni). Furthermore, the first base 2130 can be provided as a material having a resistance value lower than that of the first vacuum pad 2510 (described later) and the first conductive ring 2550 (described later). Furthermore, the first base 2130 can be electrically connected to the first main body 2102 and / or the first finger portion 2110 described above, and can be electrically connected to the first conductive ring 2550 disposed on the first mounting portion 2132.

[0120] The first vacuum assembly 2500 may have a first vacuum pad 2510, a first conductive ring 2550, and a first fixing member 2570.

[0121] The first vacuum pad 2510 can contact the substrate W. For example, the first vacuum pad 2510 can contact the lower surface of the substrate W. The first vacuum pad 2510 may be provided with a first head 2511, a first insertion portion 2516, and a first contact portion 2517.

[0122] The first head 2511 can contact the lower surface of the substrate W. The first insertion portion 2516 can be inserted into the first insertion hole 2133 of the first base 2130. In addition, the first contact portion 2517 can contact the first conductive ring 2550, which will be described later.

[0123] Furthermore, the first contact portion 2517 can have a curved shape. For example, when viewed in cross-section from the first contact portion 2517 and the first conductive ring 2550, the radius of curvature of the first conductive ring 2550 can have the same size as the radius of curvature of the first contact portion 2517. As described above, since the radius of curvature R of the first conductive ring 2550 and the radius of curvature of the first contact portion 2517 are the same, the contact area between the first conductive ring 2550 and the first conductive ring 2550 can be increased. Therefore, static electricity charged on the substrate W can be removed more effectively.

[0124] Furthermore, a first through hole 2514 may be formed at the first vacuum pad 2510. The first through hole 2514 may form at least a portion of the decompression path to the lower surface of the substrate W. When viewed from above, the first through hole 2514 may be formed in the central region of the first vacuum pad 2510. For example, the first through hole 2514 may extend from the upper surface of the first vacuum pad 2510 to the lower surface of the first vacuum pad 2510. The first main body portion 2571 of the first fixing member 2570, which will be described later, may be inserted into the first through hole 2514. Furthermore, the first through hole 2514 is provided at the first body 2100 and may communicate with the first vacuum line 2400, thereby providing decompression to the lower surface of the substrate W. Therefore, the decompression provided by the first vacuum line 2400 may be transmitted to the lower surface of the substrate W through the first through hole 2514, so that the substrate W may be adsorbed and supported on the first transfer hand 2000.

[0125] Furthermore, a first annular protrusion 2512 may be formed on the upper surface of the first vacuum pad 2510. The first annular protrusion 2512 may be formed in the upper edge region of the first vacuum pad 2510. For example, when viewed from above, the first annular protrusion 2512 may be formed along the outer periphery of the upper surface of the first vacuum pad 2510. The first annular protrusion 2512 may form a vacuum region in the space between the lower surface of the substrate W and the first vacuum pad, such that the depressurization provided by the first vacuum line 2400 is sufficiently transmitted to the lower surface of the substrate W.

[0126] Furthermore, a first support protrusion 2513 may be formed on the upper surface of the first vacuum pad 2510. A plurality of first support protrusions 2513 may be formed on the upper surface of the first vacuum pad 2510. When viewed from above, the first support protrusions 2513 may be formed inside the first annular protrusion 2512 and on the upper surface of the first vacuum pad 2510. Furthermore, when viewed from above, the first support protrusions 2513 may be arranged to be circumferentially spaced apart from each other at equal intervals on the upper surface of the first vacuum pad 2510. Additionally, the upper end height of the first support protrusions 2513 may be lower than the upper end height of the first annular protrusion 2512. Therefore, when the first vacuum line 2400 provides depressurization, a vacuum region may be formed by the first annular protrusion 2512, the upper surface of the first vacuum pad 2510, and the lower surface of the substrate W, and the vacuum region may be maintained at a negative pressure by the depressurization provided by the first vacuum line 2400. Therefore, the substrate W may be properly supported and held by the first transfer hand 2500. Furthermore, since the first support protrusion 2513 is disposed inside the first annular protrusion 2512, a groove can be defined between the first support protrusions 2513 and / or between the first support protrusion 2513 and the first annular protrusion 2512. Therefore, when the first vacuum line 2400 stops providing depressurization, air easily enters the groove, thus allowing the substrate W to be easily separated from the first vacuum pad 2510. Additionally, when the first vacuum pad 2510 is formed of a material with low elasticity, the first support protrusion 2513 transmits a small force to push the substrate W upwards, allowing the substrate W to be easily separated from the first vacuum pad 2510.

[0127] Furthermore, the first vacuum pad 2510 can be configured to tilt relative to an axis horizontal to the upper surface of the first body 2100. That is, the first vacuum pad 2510 can be configured to tilt at an angle relative to an axis perpendicular to the upper surface of the first body 2100. For example, the first vacuum pad 2510 is fixed to the first base 2130 by a first fixing member 2570 and a first conductive ring 2550 (the first conductive ring 2550 has a slightly elastic O-ring disposed between the first vacuum chuck 2510 and the first base 2130, which will be described later) such that the first vacuum chuck 2510 can tilt relative to the upper axis of the first body 2100. For example, the first vacuum pad 2510 can be configured to tilt at an angle relative to an axis perpendicular to the upper surface of the first body 2100.

[0128] Furthermore, the first vacuum pad 2510 can be provided as a conductive material. The first vacuum pad 2510 can be provided as a material comprising a conductive material. For example, the first vacuum pad 2510 can be provided as a material comprising either conductive PBI or conductive PI. Furthermore, the first vacuum pad 2510 can be provided as having a conductivity of approximately 10... 6 Ω / sq up to 10 9Materials with resistance values ​​in the range of Ω / sq. When the first vacuum pad 2510 has a resistance value of approximately 10... 6 Ω / sq up to 10 9 When materials in the Ω / sq range are formed, a slight current can flow through the first vacuum pad 2510, so that almost no static electricity is generated due to friction between the substrate W and the first vacuum pad 2510.

[0129] A first conductive ring 2550 may be disposed between the first base 2130 and the first vacuum pad 2510. The first conductive ring 2550 may also be disposed between the first base 2130 of the first body 2100 and the first vacuum pad 2510. For example, the first conductive ring 2550 may be disposed above the first base 2130 and below the first head 2511 of the first vacuum pad 2510. Furthermore, the first conductive ring 2550 may be a sealing member electrically connected to the first vacuum pad 2510. The first conductive ring 2550 may be provided as an elastic material. Therefore, the first conductive ring 2550 may improve the airtightness of the decompression path formed by the first vacuum assembly 2500 and the first body 2100. For example, the first conductive ring 2550 may improve the airtightness of the decompression path formed by the first vacuum assembly 2500 (e.g., the decompression path leading to the first through hole 2514 or the first vacuum hole 2572 and the first vacuum line 2400).

[0130] Furthermore, the first conductive ring 2550 can be electrically connected to the first vacuum pad 2510 and the first base 2130. The first conductive ring 2550 can be an O-ring with a substantially circular cross-section. Furthermore, the first conductive ring 2550 can be provided as a conductive material. Moreover, when viewed from the cross-section of the first conductive ring 2550 and the first base 2130, the radius of curvature R of the first conductive ring 2550 can be smaller than the radius of curvature of the first mounting portion 2132, which is configured as a curved shape. Therefore, when the first vacuum pad 2510 is placed on the first conductive ring 2550, the first vacuum pad 2510 can have a predetermined degree of freedom (e.g., 0.5 mm or greater) and thus can be tiltable.

[0131] Furthermore, the first conductive ring 2550 can be provided as a material through which current can flow. Additionally, the first conductive ring 2550 can be provided as a material with a resistance value lower than that of the first vacuum pad 2510. For example, the first conductive ring 2550 can be provided as having a resistance value of 10... 3 Ω / sq up to 10 4 The material has a resistance value in the range of Ω / sq. Furthermore, the first conductive ring 2550 can be provided as a material with slight elasticity. For example, the first conductive ring 2550 can be provided as a material including a fluorinated resin.

[0132] Furthermore, the first fixing member 2570 prevents the first vacuum pad 2510, placed on the first base 2130 and the first conductive ring 2550, from deviating from the first base 2130. The first fixing member 2570 may include a first main body portion 2571 and a first locking portion 2576 extending laterally from the first main body portion 2571, the first main body portion 2571 being inserted into a first through hole 2514 formed in the first vacuum pad 2510. When viewed from above, the first locking portion 2576 may be configured to overlap with the first base 2130. For example, the first locking portion 2576 may be configured to overlap with a step portion formed in the bottom of the first base 2130; for example, the first locking portion 2576 may be located in the space defined by the step portion of the first base 2130. Therefore, the first fixing member 2570 prevents the first conductive ring 2550 and the first vacuum pad 2510, placed on the first base 2130, from separating from the first base 2130.

[0133] Furthermore, a first vacuum hole 2572 may be formed at the first fixing member 2570. The first vacuum hole 2572 may communicate with the aforementioned first vacuum line 2400. Additionally, the first fixing member 2570 may be formed of the same or similar material as the aforementioned first vacuum pad 2510.

[0134] Figure 11 The substrate is shown to be placed Figure 8 The status of the hand that transmits information. (See reference) Figure 11 When the substrate W is placed on the first transfer hand 2000, the first vacuum line 2400 provides decompression to the bottom surface of the substrate W. The decompression provided by the first vacuum line 2400 can be transferred to the bottom surface of the substrate W through the first vacuum hole 2572 (or the first through hole 2514 of the first vacuum pad 2510) of the first fixing member 2570 communicating with the first vacuum line 2400. Therefore, the substrate W can be supported on the first transfer hand 2000 by a vacuum gripping method. Furthermore, in some cases, although a warped substrate W can be placed on the first transfer hand 2000, the first vacuum pad 2510 can be tiltable to support the substrate W, thereby providing decompression to the area below the substrate W, thus adsorbing / supporting the warped wafer W. Moreover, as described above, a plurality of first support protrusions 2513 are formed on the upper surface of the first vacuum pad 2510, and the substrate W and the first vacuum pad 2510 can be more easily separated when the first vacuum line 2400 stops providing decompression.

[0135] Furthermore, the first conductive ring 2550 is an O-ring disposed between the first vacuum pad 2510 and the first base 2130 in the first vacuum assembly 2500 of this application, and is made of a conductive material to form part of a static electricity removal path. As described above, in order to provide a first vacuum pad 2510 that is tiltable (movable) relative to an axis perpendicular to the upper surface of the first body 2100, an O-ring must be installed between the first base 2130 and the first vacuum pad 2510. However, when such an O-ring is provided as an insulator, in some cases it may not be possible to properly form a discharge path for removing static electricity from the charged substrate W. For example, when the O-ring is provided as an insulator, the discharge path is formed by any one of the first vacuum pad 2510, the first fixing member 2570, the first base 2130, and the first main body 2102. If the warped substrate W is placed on the first vacuum pad 2510 or if pressure is not properly applied to the bottom surface of the substrate W, resulting in the first vacuum pad 2510 not being properly positioned, the first fixing member 2570 and the first main body 2102 may not be electrically connected. Similarly, since the first vacuum pad 2510 and the first base 2130 are not always in contact with each other, in some cases a discharge path for removing static electricity from the charged substrate W may not be properly formed. Therefore, according to an embodiment of the present invention, the first conductive ring 2550, which is part of the O-ring disposed between the first vacuum pad 2510 and the first base 2130, is made of a conductive material, thereby forming part of the static electricity conduction path of the charged substrate W.

[0136] Furthermore, according to an embodiment of the present invention, the first vacuum pad 2510 can be electrically connected to the first conductive ring 2550. Furthermore, the first conductive ring 2550 can be electrically connected to the first base 2130. Furthermore, the first base 2130 can be electrically connected to the first main body 2102. Furthermore, the first main body 2102 can be grounded. That is, when the charged substrate W comes into contact with the first vacuum pad 2510, the static electricity of the charged substrate W can be removed by any one of the first vacuum pad 2510, the first conductive ring 2550, the first base 2130, the first main body 2102, the first finger portion 2102, or a combination thereof.

[0137] Furthermore, as described above, the first vacuum pad 2510 and the first fixing member 2570 can be made of the same or similar materials. Additionally, the first conductive ring 2550 can be provided with a material whose resistance is less than that of the first vacuum pad 2510. The first base 2130 can be provided with a material whose resistance is less than that of the first conductive ring 2550. Furthermore, the first main body 2102 can be provided with a material whose resistance is less than that of the first base 2130. That is, the resistance of these parts decreases as they move closer to the grounded first main body 2102 from the substrate W. In other words, the closer the part is to the substrate W, the greater its resistance. Therefore, since the resistance of the first vacuum pad 2510, which directly contacts the substrate W, is relatively high, the problem of arcing caused by rapid electrostatic discharge from the substrate W can be minimized. Furthermore, since current has the characteristic of flowing towards the side with lower resistance, static charge can flow out sequentially from any one of the first vacuum chuck 2510, the first conductive ring 2550, the first base 2130, the first main body 2102, and the first finger portion 2110, which have higher resistance values.

[0138] In addition, such as Figure 12 and Figure 13 As shown, the ring diameter of the first conductive ring 2550 of the first vacuum assembly 2500 can be modified in various ways according to the size of the substrate W placed on the first transfer hand 2000. Furthermore, as... Figure 14 As shown, the position where the first conductive ring 2550 is installed can be located below the first mounting portion 2132.

[0139] The following section illustrates another embodiment of the present invention's conception, specifically the transfer hand.

[0140] The second transfer hand 3000 according to another embodiment of the inventive concept described below may be the transfer hand of the transfer robot 352. Furthermore, the second transfer hand 3000 according to another embodiment of the inventive concept may be the transfer hand of at least one of the first front buffer robot 314, the second front buffer robot 315, the first rear buffer robot 318, and the second rear buffer robot 319. However, the inventive concept is not limited thereto, and the second transfer hand 3000 according to the embodiment of the inventive concept described below may be the transfer hand of the indexing robot 132 or the interface robot 550.

[0141] Figure 15 This is a plan view illustrating the shape of a conveying hand according to another embodiment of the concept of the present invention. Specifically, Figure 15 The shape of a second conveying hand 3000 according to another embodiment of the present invention is shown. (Reference) Figure 15According to an embodiment of the present invention, the second transmission hand 3000 may include a second body 3100 and a second vacuum line 3400 (see...). Figure 17 ), and the second vacuum component 3500.

[0142] The second body 3100 can be connected to a driver of the transfer robot 352, the first front buffer robot 314, the second front buffer robot 315, the first rear buffer robot 318, or the second rear buffer robot 319 so that its position can be changed.

[0143] In addition, the second body 3100 may include a second main body 3102, a second finger portion 3110, a second base portion 3130, and a cover plate 3140.

[0144] The second main body 3102 may be formed of a conductive material. For example, the second main body 3102 may be made of a material including metal. Furthermore, the second main body 3102 may be grounded. When the second main body 3102 is grounded and the charged substrate W is placed on the second transfer hand 3000, at least some of the discharge paths for removing static electricity from the charged substrate W can be provided. Additionally, the second body 3100 may have at least one second finger portion 3110. For example, the second body 3100 may have a 2-1 finger portion 3111 and a 2-2 finger portion 3112. The 2-1 finger portion 3111 and the 2-2 finger portion 3112 may have the same length. For example, the 2-1 finger portion 3111 and the 2-2 finger portion 3112 may have a symmetrical shape.

[0145] Furthermore, the second base 3130 can be mounted on the lower surface of the second main body 3102 and / or the second finger portion 3110. The second base 3130 can perform functions substantially the same as / similar to those of the first base 2130. The detailed structure of the second base 3130 will be described later.

[0146] Furthermore, a second vacuum assembly 3500 can be installed at the second body 3100. The second vacuum assembly 3500 can also adsorb and support the substrate W. The second vacuum assembly 3500 can vacuum-adsorb the lower surface of the substrate W to support the substrate W above the second body 3100. Furthermore, the second vacuum assembly 3500 can be electrically connected to the grounded second body 2100. Therefore, the second vacuum assembly 3500 can form at least a portion of a discharge path for removing static electricity from the charged substrate W.

[0147] Figure 16 yes Figure 15 An exploded view of the vacuum components and the base of the main body. Figure 17 It shows Figure 15 It is part of the hand that transmits information.

[0148] The second base 3130 may include a connecting portion 3131 connected to the second main body 3102 and a support portion 3136 on which a second vacuum pad 3510 and a second conductive ring 3550 are placed. The connecting portion 3131 may be provided with a vacuum hole 3135, which performs the same or similar function as the first vacuum line 2400 and communicates with the second vacuum line 3400 provided at the second body 3100. In addition, a second connecting hole 3134 may be formed in the connecting portion 3131 for inserting a connecting device that connects the second main body 3102 and the second base 3130 to each other into the second connecting hole 3134.

[0149] Furthermore, the cover plate 3140 can be combined with the second base 3130 to form a vacuum space A. The vacuum space A can communicate with a through hole in the second vacuum pad 3510 or a vacuum hole in the second fixing member 3570. Additionally, the cover plate 3140 can be made of a conductive material. The cover plate 3140 can be made of a material including metals. The cover plate 3140 can be made of a material including stainless steel.

[0150] The second vacuum assembly 3500 may include a second vacuum pad 3510, a second conductive ring 3550, and a second fixing member 3570. The structure and function of the second vacuum pad 3510, the second conductive ring 3550, and the second fixing member 3570 of the second vacuum assembly 3500 are substantially the same as or similar to the first vacuum pad 2510, the first conductive ring 2550, and the first fixing member 2570 of the first vacuum assembly described above, therefore, repeated descriptions will be omitted.

[0151] Figure 18 The substrate is shown to be placed Figure 15 The state of the hand that is being transferred. (See reference) Figure 18 When the charged substrate W is placed on the second transfer hand 3000, which is a transfer hand according to another embodiment of the present invention, the static electricity of the charged substrate W can sequentially pass through the second vacuum pad 3510, the second conductive ring 3550, the second base 3130, and the grounded second main body 3102 of the second vacuum assembly 3500. Furthermore, the reduced pressure provided by the second vacuum line 3400 is sequentially transferred to the lower surface of the substrate W through the through-hole of the vacuum region A and the second vacuum pad 3510 or the vacuum hole of the second fixing member 3570, thereby vacuum adsorbing and supporting the substrate W.

[0152] The effects of this invention are not limited to those described above. Those skilled in the art can clearly understand the effects not mentioned from the specification and drawings.

[0153] Although preferred embodiments of the inventive concept have been illustrated and described to date, the inventive concept is not limited to the specific embodiments described above, and it should be noted that those skilled in the art to which the inventive concept pertains can implement the inventive concept in various ways without departing from the essence of the inventive concept claimed in the claims, and modifications should not be interpreted separately from the technical spirit or prospect of the inventive concept.

Claims

1. A transfer hand for transferring a substrate, comprising: a body, the body being grounded; and a vacuum assembly installed at the body and providing a reduced pressure to a bottom surface of the substrate to support the substrate on an upper surface of the body, wherein the vacuum assembly comprises: a conductive vacuum pad contacting the substrate; and a sealing member disposed between the vacuum pad and the body and electrically connected to the body and the vacuum pad, wherein the sealing member is grounded, the sealing member is made of a material having an electrical resistance value smaller than that of the vacuum pad, and the body is made of a material having an electrical resistance value smaller than that of the sealing member.

2. The transfer hand according to claim 1, wherein the vacuum pad is disposed to be tiltable with respect to an axis perpendicular to the upper surface of the body.

3. The transfer hand according to claim 1 or 2, wherein the vacuum pad comprises: a head portion contacting the bottom surface of the substrate; an insertion portion inserted into the body; and a contact portion formed between the head portion and the insertion portion and contacting the sealing member, and wherein the contact portion is disposed in a curved shape.

4. The transfer hand according to claim 3, wherein a radius of curvature of the sealing member in a cross section is the same as a radius of curvature of the contact portion in a cross section.

5. The transfer hand according to claim 1 or 2, wherein the vacuum pad comprises: a hole communicating with a vacuum line disposed in the body to provide a reduced pressure to the bottom surface of the substrate; and an annular protrusion formed at an edge region of an upper surface of the vacuum pad.

6. The transfer hand according to claim 5, wherein the vacuum pad comprises at least one support protrusion formed at the upper surface of the vacuum pad and placed within the annular protrusion.

7. The transfer hand according to claim 6, wherein a height of a top end of the support protrusion is lower than a height of a top end of the annular protrusion.

8. A transfer hand for transferring a substrate, comprising: a body, the body being grounded; and a vacuum assembly installed in the body and supporting the substrate, the vacuum assembly forming at least a portion of a discharge path for removing electrostatic charges from the substrate; wherein the vacuum assembly comprises: a conductive vacuum pad contacting the substrate and disposed to be tiltable with respect to an axis perpendicular to an upper surface of the body; and a conductive ring disposed at a lower portion of the vacuum pad and electrically connected to the vacuum pad, and electrically connected to the body and the vacuum pad, the conductive ring is made of a material having an electrical resistance value smaller than that of the vacuum pad, and the body is made of a material having an electrical resistance value smaller than that of the conductive ring.

10. The transfer hand according to claim 8 or 9, wherein the vacuum pad comprises: a hole communicating with a vacuum line disposed in the body and providing a reduced pressure to the lower surface of the substrate; 9. The transfer hand according to claim 8, wherein the vacuum pad is provided as a material having an electrical resistance value in the range of 10 6 Ω / sq to 10 9 Ω / sq. wherein the electrically conductive ring is provided as a material having an electrical resistance value in the range of 10 3 Ω / sq to 10 4 Ω / sq. ​ ​ a ring-shaped protrusion formed at an edge region of the upper surface of the vacuum pad; and a plurality of support protrusions provided at the upper surface of the vacuum pad and placed more inward than the ring-shaped protrusion, wherein a top end height of the support protrusions is lower than a top end height of the ring-shaped protrusion.

11. The transfer hand according to claim 10, wherein the support protrusions are spaced apart from each other in a circumferential direction at the upper surface of the vacuum pad.

12. The transfer hand according to claim 8 or 9, wherein the body further includes a base portion having a seating portion for seating the conductive ring thereon, wherein a radius of curvature of the conductive ring in a cross section is smaller than a radius of curvature of the seating portion in a cross section.

13. The transfer hand according to claim 12, wherein the vacuum assembly includes a fixing member to prevent the vacuum pad from deviating from the base portion, wherein the fixing member includes: a main body portion inserted into a through-hole formed at the vacuum pad; and a locking portion laterally extending from the main body portion such that the locking portion overlaps with the base portion when viewed from above.

14. A substrate processing apparatus comprising: an indexing module having a load port on which a container storing a substrate is placed; and a processing module for performing a processing process on the substrate, wherein a robot having a transfer hand for transferring the substrate is provided at the indexing module and / or the processing module, wherein the transfer hand includes: a body having a finger portion, a main body, and a base portion mounted at the finger portion or the main body, and the body is grounded; and a vacuum assembly mounted at the body and supporting the substrate on an upper surface of the body by a vacuum pressure to a bottom surface of the substrate, wherein the vacuum assembly includes: a conductive vacuum pad contacting the substrate and provided to be tiltable with respect to an axis perpendicular to the upper surface of the body; and a conductive ring provided between the vacuum pad and the base portion, contacting and electrically connecting to the vacuum pad and the base portion, wherein the base portion is electrically connected to the main body or the finger portion, which is grounded, wherein the conductive ring is made of a material having an electrical resistance value smaller than that of the vacuum pad, and wherein the body is made of a material having an electrical resistance value smaller than that of the conductive ring.

15. The substrate processing apparatus according to claim 14, wherein the base portion is provided as an aluminum material, a surface of the base portion is coated with a material including nickel, wherein the conductive ring is provided as a material including a fluorine-based resin, and wherein the vacuum pad is provided as a material including a conductive plastic material.

16. The substrate processing apparatus according to claim 14 or 15, further comprising an interface module connecting the processing module with an external processing apparatus performing a processing process different from that of the processing module, ​ Among them, any one of the orientation module, the processing module and the interface module is provided with a manipulator with the conveying hand.

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