A peak-shift temperature regulation method for substation

Abstract

The present invention relates to the field of electric power automation technology, and specifically discloses a substation peak-shifting temperature control method, wherein the method is applied to the substation control system, and the convective heat transfer of the main control room is calculated; the radiant heat transfer of the main control room is calculated; a heat conduction model of the main control room is constructed according to the convective heat transfer of the main control room, the radiant heat transfer of the main control room, and the power of the refrigeration equipment in the main control room; the temperature change trend in the main control room is determined according to the heat conduction model; the predicted temperature of the heat-generating electronic device in the switch cabinet is calculated according to the temperature change trend in the main control room; the predicted temperature of the heat-generating electronic device in the switch cabinet is compared with the temperature threshold, and the temperature adjustment strategy of the main control room is determined according to the comparison result. The substation peak-shifting temperature control method provided by the present invention can not only realize peak-shifting temperature control, realize temperature rise prediction and heat conduction analysis, accurately ensure the reasonable operating temperature of the equipment, but also reduce the refrigeration energy consumption as much as possible to prevent overcooling waste.

Description

Technical Field

[0001] The present invention relates to the technical field of electric power automation, and in particular to a peak-shifting temperature regulation method for a transformer substation. Background Art

[0002] Substations are the hubs of power transmission and distribution. To ensure their normal operation, the auxiliary production facilities and ancillary production facilities in the substations are divided into production systems, HVAC systems, lighting systems, water supply and drainage systems, etc., including main transformer coolers, equipment heaters, equipment dehumidifiers, air conditioners, lighting lamps, water pumps, fans and other equipment, which constitute the substation power load. The electric energy consumed by the station power load is a component of the energy loss of the power grid, which affects the power supply efficiency of the substation and the power supply benefits of the power company. Therefore, it is of great significance to analyze and classify the power consumption characteristics of the substation power load in operation, propose corresponding energy-saving measures, and reduce the station power loss, which is of great significance to improving the economic benefits of the enterprise.

[0003] With the development of smart substations, the on-site and dispersed layout of smart components can greatly reduce the use of cables (optical cables), reduce secondary circuit interference, and reduce building area, but it also brings new problems. In addition to realizing the alarm, indication, and control functions of the original conventional control cabinet, the smart control cabinet also includes extended functional components such as merging units, smart terminals, protection / measurement and control devices, online monitoring IEDs, metering, switches, etc. according to the actual project. With the development of electronic equipment towards microelectronics, high integration, and high-density assembly, temperature, humidity, and vibration have become important factors affecting the safe operation of electronic equipment. The original control cabinet and secondary equipment panel cabinet cannot meet the requirements of the on-site layout of smart components for protection performance and environmental regulation performance.

[0004] Therefore, how to reduce the power consumption of substations by means of peak-shifting temperature regulation has become a technical problem that needs to be solved urgently by those skilled in the art. Summary of the invention

[0005] The present invention provides a peak-shifting temperature regulation method for a transformer substation, which solves the problem in the related art that the power consumption of the transformer substation cannot be reduced by peak-shifting temperature reduction.

[0006] As one aspect of the present invention, a substation peak-shift temperature control method is provided, wherein the method is applied to a substation control system, wherein the substation control system includes a first temperature monitoring device, a second temperature monitoring device and a third temperature monitoring device, wherein the first temperature monitoring device is arranged in the main control room, and is used to collect the qualitative temperature of the air in the main control room, the second temperature monitoring device is arranged in the switch cabinet of the main control room, and is used to collect the surface temperature of the switch cabinet, and the third temperature monitoring device is arranged on the outer wall of the main control room, and is used to collect the surface temperature of the outer wall of the main control room; the method includes:

[0007] Calculate the convective heat transfer amount of the main control room according to the first temperature monitoring data collected by the first temperature monitoring device and the convective heat transfer area of ​​the main control room;

[0008] Calculating the radiation heat transfer amount of the main control room according to the second temperature monitoring data collected by the second temperature monitoring device and the third temperature monitoring data collected by the third temperature monitoring device;

[0009] Constructing a heat conduction model of the main control room according to the convection heat transfer of the main control room, the radiation heat transfer of the main control room and the power of the refrigeration equipment in the main control room;

[0010] Determining the temperature change trend in the main control room according to the heat conduction model;

[0011] Calculating the predicted temperature of the heat-generating electronic device in the switch cabinet according to the temperature change trend in the main control room;

[0012] The predicted temperature of the heat-generating electronic device in the switch cabinet is compared with a temperature threshold, and a temperature adjustment strategy of the main control room is determined according to the comparison result.

[0013] Further, calculating the convective heat transfer amount of the main control room according to the first temperature monitoring data collected by the first temperature monitoring device and the convective heat transfer area of ​​the main control room includes:

[0014] Calculating the air volume expansion coefficient in the main control room according to the first temperature monitoring data;

[0015] Determining a Grashof number based on the air volume expansion coefficient;

[0016] Determine the Nusselt number based on the Grashof number and the Prandtl number;

[0017] calculating a convective heat transfer coefficient based on the Nusselt number;

[0018] The convective heat transfer of the main control room is calculated according to the convective heat transfer coefficient and the convective heat transfer area.

[0019] Furthermore, the calculation formula of the air volume expansion coefficient is:

[0020] α v =1 / T,

[0021] Among them, α v represents the air volume expansion coefficient, and T represents the first temperature monitoring data;

[0022] The calculation formula of the Grashof number is:

[0023] Gr=gαv Δtl 3 / v 2 ,

[0024] Wherein, Gr represents the Grashof number, g represents the acceleration due to gravity, α v represents the air volume expansion coefficient, Δt represents the difference between the third temperature monitoring data and the first temperature monitoring data in the main control room, l represents the length of the switch cabinet, and v represents the kinematic viscosity of the air in the main control room;

[0025] The calculation formula of the Nusselt number is:

[0026]

[0027] Among them, Nu m represents the Nusselt number, C represents a constant, Gr represents the Grashof number, and Pr represents the Prandtl number;

[0028] The calculation formula of the convective heat transfer coefficient is:

[0029] h c =λNu m / l,

[0030] Among them, h c represents the convection heat transfer coefficient, λ represents the thermal conductivity of air, Nu m represents the Nusselt number, l represents the length of the switch cabinet;

[0031] The calculation formula of the convective heat transfer is:

[0032] Φ c =∑h c A c Δt,

[0033] Among them, Φ c represents the convective heat transfer, h c represents the convective heat transfer coefficient, A c represents the convection heat transfer area, and Δt represents the difference between the third temperature monitoring data and the first temperature monitoring data in the main control room.

[0034] Further, the radiation heat transfer amount of the main control room is calculated according to the second temperature monitoring data collected by the second temperature monitoring device and the third temperature monitoring data collected by the third temperature monitoring device, wherein the calculation formula of the radiation heat transfer amount is:

[0035]

[0036] Among them, Φ r represents the radiation heat transfer, ξ wIndicates the surface emissivity of the switch cabinet, A r represents the heat transfer area of ​​the switch cabinet surface, σ represents the Stefan-Boltzmann constant, T w The second temperature monitoring data, T ∞ Indicates the third temperature monitoring data.

[0037] Furthermore, a heat conduction model of the main control room is constructed according to the convection heat transfer of the main control room, the radiation heat transfer of the main control room and the refrigeration equipment power of the main control room, wherein the calculation formula of the heat conduction model is:

[0038] Φ=Φ c +Φ r +Φ z ,

[0039] Wherein, Φ represents the thermal influence efficiency of the main control room, Φ c represents the convective heat transfer, Φ r represents the radiation heat transfer, Φ z Indicates the power of the cooling equipment.

[0040] Further, determining the temperature change trend in the main control room according to the heat conduction model includes:

[0041] When the calculated result of the thermal influence efficiency of the main control room is greater than 0, it is determined that the temperature in the main control room is in a rising trend;

[0042] When the calculated result of the thermal influence efficiency of the main control room is less than 0, it is determined that the temperature inside the main control room is in a cooling trend.

[0043] Further, the predicted temperature of the heat-generating electronic device in the switch cabinet is calculated according to the temperature change trend in the main control room, including:

[0044] Determining the influence factor of the temperature outside the main control room on the temperature inside the main control room according to the temperature change trend inside the main control room;

[0045] Calculate the predicted air temperature in the main control room according to the third temperature monitoring data and the influencing factor;

[0046] Acquire a mapping relationship between the temperature of the heat-generating electronic device in the switch cabinet, the air temperature in the main control room, and the temperature in the switch cabinet;

[0047] The predicted temperature of the heat-generating electronic device in the switch cabinet is determined according to the mapping relationship and the predicted air temperature in the main control.

[0048] Furthermore, obtaining a mapping relationship among the temperature of the heat-generating electronic device in the switch cabinet, the air temperature in the main control room, and the temperature in the switch cabinet includes:

[0049] Obtaining a measured temperature of a heat-generating electronic device in the switch cabinet;

[0050] A mapping relationship is established according to the second temperature monitoring data, the first temperature monitoring data and the measured temperature, wherein the expression of the mapping relationship is:

[0051] T w =aT0+(1-a)T,

[0052] Where T0 represents the measured temperature of the heat-generating electronic device in the switch cabinet, T w represents the second temperature monitoring data, T represents the first temperature monitoring data, and a represents the weight.

[0053] Further, the predicted air temperature in the main control room is calculated according to the third temperature monitoring data and the influencing factor, wherein the calculation formula of the predicted air temperature in the main control room is:

[0054] T'=α·T ∞ ,

[0055] Among them, α represents the impact factor, T ∞ represents the third temperature monitoring data, and T' represents the predicted air temperature in the main control room.

[0056] Furthermore, the predicted temperature of the heat-generating electronic device in the switch cabinet is compared with a temperature threshold, and a temperature adjustment strategy of the main control room is determined according to the comparison result, including:

[0057] When the predicted temperature of the heat-generating electronic device in the switch cabinet is greater than the temperature threshold, starting the refrigeration equipment to reduce the temperature in the main control room;

[0058] When the preset temperature of the heat-generating electronic device in the switch cabinet is not greater than the temperature threshold, the current strategy is maintained unchanged or the refrigeration equipment is turned off.

[0059] The substation peak-shifting temperature control method provided by the present invention can not only realize peak-shifting temperature control, but also realize temperature rise prediction and heat conduction analysis based on the heat conduction model according to the near-body temperature measurement data, accurately ensure the reasonable operating temperature of the equipment, reduce the refrigeration energy consumption as much as possible, and eliminate over-cooling waste. BRIEF DESCRIPTION OF THE DRAWINGS

[0060] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the following specific embodiments, they are used to explain the present invention but do not constitute a limitation of the present invention. In the accompanying drawings:

[0061] Figure 1 A flow chart of the substation peak shifting temperature regulation method provided by the present invention. DETAILED DESCRIPTION

[0062] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments may be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0063] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiment of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiment of the present invention. Obviously, the described embodiment is only a part of the embodiment of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work should fall within the scope of protection of the present invention.

[0064] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so as to describe the embodiments of the present invention described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0065] In this embodiment, a substation peak-shift temperature adjustment method is provided, which is applied to a substation control system. The substation control system includes a first temperature monitoring device, a second temperature monitoring device and a third temperature monitoring device. The first temperature monitoring device is arranged in the main control room and is used to collect the qualitative temperature of the air in the main control room. The second temperature monitoring device is arranged in the switch cabinet of the main control room and is used to collect the surface temperature of the switch cabinet. The third temperature monitoring device is arranged on the outer wall of the main control room and is used to collect the surface temperature of the outer wall of the main control room. Figure 1 : is a flow chart of a substation peak-shift temperature adjustment method provided according to an embodiment of the present invention. Figure 1 As shown, including:

[0066] S100, calculating the convective heat transfer amount of the main control room according to the first temperature monitoring data collected by the first temperature monitoring device and the convective heat transfer area of ​​the main control room;

[0067] In the embodiment of the present invention, the first temperature monitoring device arranged in the main control room, the second temperature monitoring device arranged in the switch cabinet, and the third temperature monitoring device arranged on the outer wall of the main control room can all include temperature sensors. For example, a temperature sensor is arranged at a position 1.5 meters above the ground in the main control room to collect the temperature in the main control room, a temperature sensor is arranged on the outer wall of the main control room to collect the temperature outside the main control room, and a temperature sensor is arranged at a position close to the heat-generating electronic device in the switch cabinet to collect the temperature in the switch cabinet.

[0068] Specifically, calculating the convective heat transfer amount of the main control room according to the first temperature monitoring data collected by the first temperature monitoring device and the convective heat transfer area of ​​the main control room includes:

[0069] S110, calculating the air volume expansion coefficient in the main control room according to the first temperature monitoring data;

[0070] The calculation formula of the air volume expansion coefficient is:

[0071] α v =1 / T,

[0072] Among them, α v represents the air volume expansion coefficient, and T represents the first temperature monitoring data;

[0073] S120, determining a Grashof number according to the air volume expansion coefficient;

[0074] The calculation formula of the Grashof number is:

[0075] Gr=gα v Δtl 3 / v 2 ,

[0076] Wherein, Gr represents the Grashof number, g represents the acceleration due to gravity, α v represents the air volume expansion coefficient, Δt represents the difference between the third temperature monitoring data and the first temperature monitoring data in the main control room, l represents the length of the switch cabinet, and v represents the kinematic viscosity of the air in the main control room;

[0077] S130, determining the Nusselt number according to the Grashof number and the Prandtl number;

[0078] The calculation formula of the Nusselt number is:

[0079]

[0080] Among them, Nu m represents the Nusselt number, C represents a constant, Gr represents the Grashof number, and Pr represents the Prandtl number;

[0081] In the embodiment of the present invention, m represents the arithmetic mean of the first temperature monitoring data and the third temperature monitoring data. When the vertical plane heat exchange model is adopted, the value of C and n is 0.0292 and the value of n is 0.39.

[0082] S140, calculating the convective heat transfer coefficient according to the Nusselt number;

[0083] The calculation formula of the convective heat transfer coefficient is:

[0084] h c =λNu m / l,

[0085] Among them, h c represents the convection heat transfer coefficient, λ represents the thermal conductivity of air, Nu m represents the Nusselt number, l represents the length of the switch cabinet;

[0086] S150. Calculate the convective heat transfer amount of the main control room according to the convective heat transfer coefficient and the convective heat transfer area.

[0087] The calculation formula of the convective heat transfer is:

[0088] Φ c =∑h c A c Δt,

[0089] Among them, Φ c represents the convective heat transfer, h c represents the convective heat transfer coefficient, A c represents the convection heat transfer area, and Δt represents the difference between the third temperature monitoring data and the first temperature monitoring data in the main control room.

[0090] It should be understood that due to the large internal space of the main control room, the development of the thermal boundary layer on the equipment wall is not disturbed or hindered, and there is no forced blowing of the fan on the equipment wall. The electrical equipment completely relies on natural convection for heat dissipation. Therefore, the large space natural convection heat transfer model is used to calculate its convection heat transfer.

[0091] It should be noted that the convective heat transfer area can be calculated by measuring the actual sun-facing area of ​​the main control room wall.

[0092] S200, calculating the radiation heat transfer amount of the main control room according to the second temperature monitoring data collected by the second temperature monitoring device and the third temperature monitoring data collected by the third temperature monitoring device;

[0093] In the embodiment of the present invention, the calculation formula of the radiation heat transfer is:

[0094]

[0095] Among them, Φ r represents the radiation heat transfer, ξ w Indicates the surface emissivity of the switch cabinet, A r represents the heat transfer area of ​​the switch cabinet surface, and σ represents the Stefan-Boltzmann constant, which is 5.67×10 -8 W / (m 2 ·K 4 ), T w The second temperature monitoring data, T ∞ Indicates the third temperature monitoring data.

[0096] It should be understood that in addition to the wall surface temperature change and heat transfer taken into account in the above step S100, the embodiment of the present invention takes into account that indoor equipment and the roof also release heat into the closed environment by thermal radiation, that is, radiation heat transfer.

[0097] S300, constructing a heat conduction model of the main control room according to the convection heat transfer of the main control room, the radiation heat transfer of the main control room and the power of the refrigeration equipment in the main control room;

[0098] In the embodiment of the present invention, the calculation formula of the heat conduction model is:

[0099] Φ=Φ c +Φ r +Φ z ,

[0100] Wherein, Φ represents the thermal influence efficiency of the main control room, Φ c represents the convective heat transfer, Φ r represents the radiation heat transfer, Φ z Indicates the power of the cooling equipment.

[0101] It should be understood that Φ c It represents the thermal effect of outdoor sunlight on the wall, Φ r Indicates the thermal impact of indoor heating devices on the room, Φ z Indicates the thermal impact of indoor refrigeration equipment on the room.

[0102] S400, determining the temperature change trend in the main control room according to the heat conduction model;

[0103] Specifically, when the calculated result of the thermal influence efficiency of the main control room is greater than 0, it is determined that the temperature in the main control room is in a rising trend;

[0104] When the calculated result of the thermal influence efficiency of the main control room is less than 0, it is determined that the temperature inside the main control room is in a cooling trend.

[0105] It should be understood that when Φ is a positive value, it means that the indoor temperature is in a rising trend. If the indoor temperature is higher than the outdoor temperature, accelerating the fluidity and diffusion (i.e. turning on the fan) will reduce the rising trend. On the contrary, if the indoor temperature is lower than the outdoor temperature, accelerating the fluidity and diffusion (i.e. turning on the fan) will strengthen the rising trend. If Φ is a negative value, the indoor temperature is in a cooling state. At this time, you can reduce Φ z Refrigeration means reducing the refrigeration output to ensure energy saving. At this time, temperature control can also be achieved by accelerating air flow according to the temperature difference between indoors and outdoors.

[0106] S500, calculating the predicted temperature of the heat-generating electronic device in the switch cabinet according to the temperature change trend in the main control room;

[0107] Specifically, determining the influence factor of the temperature outside the main control room on the temperature inside the main control room according to the temperature change trend inside the main control room;

[0108] Calculate the predicted air temperature in the main control room according to the third temperature monitoring data and the influencing factor;

[0109] Acquire a mapping relationship between the temperature of the heat-generating electronic device in the switch cabinet, the air temperature in the main control room, and the temperature in the switch cabinet;

[0110] The predicted temperature of the heat-generating electronic device in the switch cabinet is determined according to the mapping relationship and the predicted air temperature in the main control.

[0111] Specifically, obtaining a mapping relationship between the temperature of the heat-generating electronic device in the switch cabinet, the air temperature in the main control room, and the temperature in the switch cabinet includes:

[0112] Obtaining a measured temperature of a heat-generating electronic device in the switch cabinet;

[0113] A mapping relationship is established according to the second temperature monitoring data, the first temperature monitoring data and the measured temperature, wherein the expression of the mapping relationship is:

[0114] T w =aT0+(1-a)T,

[0115] Where T0 represents the measured temperature of the heat-generating electronic device in the switch cabinet, T w represents the second temperature monitoring data, T represents the first temperature monitoring data, and a represents the weight.

[0116] In the embodiment of the present invention, the formula is first transformed, [T w -(1-a)T] / a=T0. The ultimate goal is to solve the temperature of the electronic heating device. Since it is a temperature trend prediction, here T w It can be understood as the outdoor temperature, which can be measured. In this formula, T w It is replaced by meteorological data, such as the temperature forecast for the next few hours, which is substituted into this formula to predict the temperature of the electronic heating device. The measured data is then used to correct the forecast in real time. For example, if the forecast for the next hour is 30 degrees and the actual measurement is 28 degrees, the forecast data can be corrected.

[0117] The predicted air temperature in the main control room is calculated according to the third temperature monitoring data and the influencing factor, wherein the calculation formula of the predicted air temperature in the main control room is:

[0118] T'=α·T ∞ ,

[0119] Among them, α represents the impact factor, T ∞ represents the third temperature monitoring data, and T' represents the predicted air temperature in the main control room.

[0120] In the embodiment of the present invention, the temperature difference between the third temperature monitoring data and the first temperature monitoring data is assumed to be Δt, then α=1 / Δt.

[0121] It should be noted that the influencing factor α is a combination of factors affecting heat conduction such as walls, convection, and roof.

[0122] It should be understood that by predicting the indoor temperature to obtain the predicted temperature, and then substituting the predicted temperature into the mapping relationship obtained above, the predicted temperature of the heat-generating electronic device in the switch cabinet can be obtained, thereby providing a basis for temperature control of the heat-generating electronic device.

[0123] In an embodiment of the present invention, the mapping relationship described above can be obtained by constructing a stable mapping model. Since the switch cabinet is a closed space and the thermal model is stable, a stable mapping model can be constructed. First, the temperature of the device in the switch cabinet is obtained by measuring the temperature of the heat-generating electronic device. The heat-generating electronic device here can be specifically a secondary microcomputer relay protection device. These devices are generally equipped with a chip temperature measurement function, which is similar to the CPU temperature of a computer.

[0124] Assume that the measured temperature is T0, and the temperature of the corresponding temperature sensor in the cabinet is T w , the indoor ambient temperature is T, thus constructing T0, T w And the heat conduction model between T is shown in the following formula:

[0125] T w =aT0+(1-a)T,

[0126] Here a represents the weight. Since the temperature of the measurement point is only related to two heat sources, namely the heat generated by the device and the ambient temperature, the above mathematical model can be constructed. Through measurement and statistics, a can be calculated.

[0127] After obtaining the predicted air temperature T', the predicted air temperature is substituted into the above formula to obtain the predicted temperature of the heat-generating electronic device in the cabinet.

[0128] S600: Compare the predicted temperature of the heat-generating electronic device in the switch cabinet with a temperature threshold, and determine a temperature adjustment strategy for the main control room according to the comparison result.

[0129] In an embodiment of the present invention, it includes:

[0130] When the predicted temperature of the heat-generating electronic device in the switch cabinet is greater than the temperature threshold, starting the refrigeration equipment to reduce the temperature in the main control room;

[0131] When the preset temperature of the heat-generating electronic device in the switch cabinet is not greater than the temperature threshold, the current strategy is maintained unchanged or the refrigeration equipment is turned off.

[0132] It should be understood that the temperature of the temperature sensor in the cabinet is T w , adjust the refrigeration output in real time, and according to factors such as peak electricity consumption, use high-power refrigeration in advance to stagger electricity consumption.

[0133] In summary, the substation peak-shifting temperature control method provided by the embodiment of the present invention can not only realize peak-shifting temperature control, but also realize temperature rise prediction and heat conduction analysis based on the heat conduction model according to the near-body temperature measurement data, so as to accurately ensure the reasonable operating temperature of the equipment while reducing the refrigeration energy consumption as much as possible and eliminating over-cooling waste.

[0134] In addition, combined with the fluidity and diffusion of indoor air, under specific environmental characteristics, ventilation is used to replace air conditioning and refrigeration. The formula for measuring indoor air quality and flow field distribution is shown below:

[0135] σ n =V n / Q v ,

[0136]

[0137] Among them, V n Indicates the effective ventilation volume in the room; Q v represents the ventilation volume; τ n Indicates the theoretical ventilation time; represents the average air age in the room; η represents the ventilation efficiency, and its value range is between 0 and 1. The closer it is to 1, the better the ventilation effect is, and the closer the indoor air distribution is to the ideal piston flow. Among them, the air age represents the residence time of air at a certain point in the room, which is a key factor in measuring indoor air quality.

[0138] It is to be understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of the present invention, but the present invention is not limited thereto. For those of ordinary skill in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A peak-shift temperature control method for a substation, characterized in that: Applied to a substation control system, the substation control system includes a first temperature monitoring device, a second temperature monitoring device and a third temperature monitoring device, the first temperature monitoring device is arranged in a main control room, and is used to collect the qualitative temperature of the air in the main control room, the second temperature monitoring device is arranged in a switch cabinet in the main control room, and is used to collect the surface temperature of the switch cabinet, and the third temperature monitoring device is arranged on the outer wall of the main control room, and is used to collect the surface temperature of the outer wall of the main control room; the method includes: Calculate the convective heat transfer amount of the main control room according to the first temperature monitoring data collected by the first temperature monitoring device and the convective heat transfer area of ​​the main control room; Calculating the radiation heat transfer amount of the main control room according to the second temperature monitoring data collected by the second temperature monitoring device and the third temperature monitoring data collected by the third temperature monitoring device; Constructing a heat conduction model of the main control room according to the convection heat transfer of the main control room, the radiation heat transfer of the main control room and the power of the refrigeration equipment in the main control room; Determining the temperature change trend in the main control room according to the heat conduction model; Calculating the predicted temperature of the heat-generating electronic device in the switch cabinet according to the temperature change trend in the main control room; Comparing the predicted temperature of the heat-generating electronic device in the switch cabinet with a temperature threshold, and determining a temperature adjustment strategy for the main control room according to the comparison result; The convective heat transfer amount of the main control room is calculated according to the first temperature monitoring data collected by the first temperature monitoring device and the convective heat transfer area of ​​the main control room, including: Calculating the air volume expansion coefficient in the main control room according to the first temperature monitoring data; Determining a Grashof number based on the air volume expansion coefficient; Determine the Nusselt number based on the Grashof number and the Prandtl number; calculating a convective heat transfer coefficient based on the Nusselt number; Calculate the convective heat transfer of the main control room according to the convective heat transfer coefficient and the convective heat transfer area; The calculation formula of the air volume expansion coefficient is: , in, represents the air volume expansion coefficient, represents the first temperature monitoring data; The calculation formula of the Grashof number is: , in, represents the Grashof number, represents the acceleration due to gravity, represents the air volume expansion coefficient, represents the difference between the third temperature monitoring data and the first temperature monitoring data in the main control room, Indicates the length of the switch cabinet, Indicates the kinematic viscosity of the air in the main control room; The calculation formula of the Nusselt number is: , in, represents the Nusselt number, and All represent constants, represents the Grashof number, represents the Prandtl number; The calculation formula of the convective heat transfer coefficient is: , in, represents the convective heat transfer coefficient, represents the thermal conductivity of air, represents the Nusselt number, Indicates the length of the switch cabinet; The calculation formula of the convective heat transfer is: , in, represents the convective heat transfer, represents the convective heat transfer coefficient, represents the convective heat transfer area, Indicates the difference between the third temperature monitoring data and the first temperature monitoring data in the main control room; The radiation heat transfer amount of the main control room is calculated according to the second temperature monitoring data collected by the second temperature monitoring device and the third temperature monitoring data collected by the third temperature monitoring device, wherein the calculation formula of the radiation heat transfer amount is: , in, represents the radiation heat transfer, represents the surface emissivity of the switchgear, Indicates the heat transfer area of ​​the switch cabinet surface, represents the Stefan-Boltzmann constant, represents the second temperature monitoring data, Indicates the third temperature monitoring data; A heat conduction model of the main control room is constructed according to the convection heat transfer of the main control room, the radiation heat transfer of the main control room and the power of the refrigeration equipment in the main control room, wherein the calculation formula of the heat conduction model is: , in, represents the thermal influence efficiency of the main control room, represents the convective heat transfer, represents the radiation heat transfer, Indicates the power of the cooling equipment.

2. The method according to claim 1, characterized in that Determining the temperature change trend in the main control room according to the heat conduction model includes: When the calculated result of the thermal influence efficiency of the main control room is greater than 0, it is determined that the temperature in the main control room is in a rising trend; When the calculated result of the thermal influence efficiency of the main control room is less than 0, it is determined that the temperature inside the main control room is in a cooling trend.

3. The method according to claim 1, characterized in that: Calculating the predicted temperature of the heat-generating electronic device in the switch cabinet according to the temperature change trend in the main control room includes: Determining the influence factor of the temperature outside the main control room on the temperature inside the main control room according to the temperature change trend inside the main control room; Calculate the predicted air temperature in the main control room according to the third temperature monitoring data and the influencing factor; Acquire a mapping relationship between the temperature of the heat-generating electronic device in the switch cabinet, the air temperature in the main control room, and the temperature in the switch cabinet; The predicted temperature of the heat-generating electronic device in the switch cabinet is determined according to the mapping relationship and the predicted air temperature in the main control.

4. The method according to claim 3, characterized in that Obtaining a mapping relationship between the temperature of the heat-generating electronic device in the switch cabinet, the air temperature in the main control room, and the temperature in the switch cabinet, including: Obtaining a measured temperature of a heat-generating electronic device in the switch cabinet; A mapping relationship is established according to the second temperature monitoring data, the first temperature monitoring data and the measured temperature, wherein the expression of the mapping relationship is: , in, Indicates the measured temperature of the heat-generating electronic device in the switch cabinet, Indicates the second temperature monitoring data, represents the first temperature monitoring data, Represents weight.

5. The method according to claim 3, characterized in that: The predicted air temperature in the main control room is calculated according to the third temperature monitoring data and the influencing factor, wherein the calculation formula of the predicted air temperature in the main control room is: , in, represents the impact factor, Indicates the third temperature monitoring data, Indicates the predicted air temperature in the main control room.

6. The method according to claim 1, characterized in that Comparing the predicted temperature of the heat-generating electronic device in the switch cabinet with a temperature threshold, and determining a temperature adjustment strategy for the main control room according to the comparison result, including: When the predicted temperature of the heat-generating electronic device in the switch cabinet is greater than the temperature threshold, starting the refrigeration equipment to reduce the temperature in the main control room; When the preset temperature of the heat-generating electronic device in the switch cabinet is not greater than the temperature threshold, the current strategy is maintained unchanged or the refrigeration equipment is turned off.

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