Method, device, electronic device and computer readable storage medium for calibrating temperature
By calculating the thermal emissivity of cooking utensils and the temperature to be calibrated, the target temperature of the non-contact temperature measuring device is calibrated, solving the problem of low accuracy and reliability of temperature measurement for cooking utensils made of different materials, and achieving high-precision temperature measurement.
Patent Information
- Application Number
- CN202211239965.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2022-10-11
- Publication Date
- 2026-02-06
- Estimated Expiration
- 2042-10-11
AI Technical Summary
In existing technologies, contact temperature measurement methods are structurally difficult to implement and slow, while non-contact temperature measurement devices have lower temperature accuracy and reliability for cooking utensils made of different materials.
By acquiring the thermal emissivity and calibrated temperature of the object to be measured, the target temperature is calculated using a non-contact temperature measuring device, and the actual temperature of the cooking appliance is calibrated.
It improves the accuracy and reliability of non-contact temperature measurement devices for cooking utensils of different materials, and has strong ease of use and practicality.
Smart Images

Figure CN115655487B_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The application belongs to the technical field of measuring temperature, and particularly relates to a method and device for calibrating temperature, an electronic device and a computer readable storage medium. BACKGROUND
[0002] A delicious dish not only needs superb culinary skills, but also needs accurate control of temperature. However, it is not easy to accurately obtain the temperature of a cooking utensil.
[0003] Currently, the cooking temperature of a cooking utensil such as a pot or a beaker is mainly measured by using a contact type NTC. However, this contact type temperature measurement method is not only difficult to realize in structure, but also slow in obtaining temperature. When a non-contact type temperature measurement device is used to measure the cooking temperature of a cooking utensil, the cooking temperature of the cooking utensil measured is low in accuracy and poor in reliability due to different materials of the cooking utensil. SUMMARY
[0004] The application aims to provide a method and device for calibrating temperature, an electronic device and a computer readable storage medium, which can solve the problem of low accuracy and poor reliability of measured cooking temperature.
[0005] In a first aspect, an embodiment of the application provides a method for calibrating temperature, which comprises the following steps.
[0006] When a to-be-measured object is in a working state, a to-be-calibrated temperature corresponding to the to-be-measured object is obtained.
[0007] According to the thermal emissivity corresponding to the to-be-measured object and the to-be-calibrated temperature, a target temperature of the to-be-measured object is calculated.
[0008] The target temperature is taken as an actual temperature of the to-be-measured object.
[0009] In a possible implementation manner of the first aspect, before the to-be-calibrated temperature corresponding to the to-be-measured object is obtained, the method further comprises the following steps.
[0010] Under current atmospheric pressure, a boiling point temperature of boiling water corresponding to the to-be-measured object is obtained.
[0011] A radiation temperature corresponding to the to-be-measured object is obtained by using a non-contact type temperature measurement device.
[0012] Based on the boiling point temperature and the radiation temperature, the thermal emissivity corresponding to the to-be-measured object is calculated.
[0013] In a possible implementation manner of the first aspect, under current atmospheric pressure, the boiling point temperature of boiling water corresponding to the to-be-measured object is obtained, which comprises the following steps.
[0014] acquire the current atmospheric pressure through a barometric pressure measuring device;
[0015] query the boiling point temperature corresponding to the current atmospheric pressure through a barometric pressure boiling point mapping table.
[0016] In a possible implementation manner of the first aspect, the calculating the thermal emissivity of the object to be measured based on the boiling point temperature and the radiation temperature comprises:
[0017] The thermal emissivity of the object to be measured is calculated according to the following formula:
[0018] wherein r represents the thermal emissivity of the object to be measured; T0 represents the radiation temperature of the current object to be measured, T f represents the boiling point temperature of the boiling water;
[0019] In a possible implementation manner of the first aspect, the calculating the thermal emissivity of the object to be measured comprises:
[0020] The thermal emissivity of the object to be measured and the corresponding relationship between the object to be measured and the thermal emissivity are saved.
[0021] In a possible implementation manner of the first aspect, the acquiring the temperature to be calibrated of the object to be measured comprises:
[0022] The temperature to be calibrated of the object to be measured is acquired through the non-contact temperature measuring device.
[0023] In a possible implementation manner of the first aspect, the calculating the target temperature of the object to be measured according to the thermal emissivity of the object to be measured and the temperature to be calibrated comprises:
[0024] The target temperature of the object to be measured is calculated according to the following formula:
[0025] wherein Tn represents the target temperature of the object to be measured; Tt represents the temperature to be calibrated of the object to be measured, and r represents the thermal emissivity of the object to be measured.
[0026] In a second aspect, an embodiment of the present application provides a device for calibrating temperature, which comprises:
[0027] an acquiring unit, configured to acquire a temperature to be calibrated of an object to be measured when the object to be measured is in a working state;
[0028] a processing unit, configured to calculate a target temperature of the object to be measured according to a thermal emissivity of the object to be measured and the temperature to be calibrated;
[0029] an output unit configured to output the target temperature as an actual temperature of the object to be measured;
[0030] In a third aspect, an embodiment of the present application provides a device for calibrating temperature, which comprises:
[0031] a control key configured to control the non-contact temperature measuring device to start a temperature measuring function;
[0032] a non-contact temperature measuring device configured to measure a temperature to be calibrated of an object to be measured;
[0033] a processor configured to calculate a target temperature of the object to be measured according to a thermal emissivity corresponding to the object to be measured and the temperature to be calibrated.
[0034] In a fourth aspect, an embodiment of the present application provides an electronic device, which comprises a memory, a processor, and a computer program stored in the memory and capable of running on the processor, and the processor implements the method of the first aspect when executing the computer program. The physical structure of the electronic device comprises a main body structure, a display screen, a control key, and a non-contact temperature measuring device. The control key comprises a power on / off key, an automatic thermal emissivity calculation key, and a manual thermal emissivity setting key. The non-contact temperature measuring device comprises a non-contact infrared temperature sensor.
[0035] In a fifth aspect, an embodiment of the present application provides a computer readable storage medium, which stores a computer program, and the computer program is executed by a processor to implement the method of the first aspect.
[0036] In a sixth aspect, an embodiment of the present application provides a computer program product, which, when running on a terminal device, causes the terminal device to execute the method of any one of the first aspect.
[0037] It can be understood that the beneficial effects of the second aspect to the sixth aspect can be referred to the related description in the first aspect, which will not be repeated here.
[0038] Compared with the prior art, the present application has the beneficial effects that: in the present application, when the object to be measured is in a working state, the temperature to be calibrated corresponding to the object to be measured is obtained; the target temperature of the object to be measured is calculated according to the thermal emissivity corresponding to the object to be measured and the temperature to be calibrated; the target temperature is taken as the actual temperature of the object to be measured; when the non-contact temperature measuring device is used to measure the cooking temperature of the cooking appliance, although the material of the cooking appliance is different, the actual temperature is obtained by calibrating and calculating the measured cooking temperature based on the thermal emissivity, the actual temperature is taken as the final cooking temperature, the accuracy of the finally output cooking temperature is higher, and the reliability is better; the present application has strong ease of use and practicality. BRIEF DESCRIPTION OF DRAWINGS
[0039] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or prior art description will be briefly introduced as follows. Obviously, the drawings in the following description only some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained without creative labor on the basis of these drawings.
[0040] Figure 1 is a schematic diagram of measuring radiation temperature provided by the embodiments of the present application;
[0041] Figure 2 is a schematic diagram of measuring the temperature to be calibrated provided by the embodiments of the present application;
[0042] Figure 3 is a schematic diagram of other types of physical devices provided by the embodiments of the present application;
[0043] Figure 4 is a schematic diagram of the implementation process of the calibration temperature method provided by the embodiments of the present application;
[0044] Figure 5 is a schematic diagram of calculating the thermal emissivity provided by the embodiments of the present application;
[0045] Figure 6 is a schematic diagram of the structure of the calibration temperature virtual device provided by the embodiments of the present application;
[0046] Figure 7 is a schematic diagram of the structure of the electronic device provided by the embodiments of the present application;
[0047] Figure 8 is a schematic diagram of the structure of the calibration temperature physical device provided by the embodiments of the present application. DETAILED DESCRIPTION
[0048] In the following description, specific details are set forth in order to provide a thorough understanding of the embodiments of the present application. However, persons skilled in the art should understand that the present application can also be implemented in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, devices, circuits, and methods are omitted so as not to obscure the description of the present application with unnecessary details.
[0049] It should be understood that when used in the specification and the appended claims of the present application, the term "comprising" indicates the presence of the described features, integers, steps, operations, elements, and / or components, but does not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or sets thereof.
[0050] It should also be understood that the term "and / or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items, and that the term "at least one of' as used herein means "one, two, three, four, or more" and that the term "one or more of as used herein means "at least one, two, three, four, or more."
[0051] As used in the description of the application and the appended claims, the term "if' can be interpreted to mean "when" or "upon" or "in response to determining" or "in response to detecting," depending on the context. Similarly, the phrase "if it is determined" or "if [a described condition or event] is detected" can be interpreted to mean "upon determining" or "upon detecting [the described condition or event]" or "in response to detecting [the described condition or event]," depending on the context.
[0052] In addition, the terms "first", "second", "third", etc. as used in the description of the application and the claims are merely used to differentiate descriptions, and cannot be understood as indicating or implying relative importance.
[0053] Reference in the specification to "one embodiment" or "some embodiments" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the application. The appearances of the phrase "in one embodiment" or "in some embodiments" in various places in the specification are not necessarily all referring to the same embodiment, although it can. The terms "including," "containing," "comprising," and similar terms are meant to be open-ended, unless otherwise noted, and include but are not limited to the listed items.
[0054] A delicious dish not only needs superb culinary skills, but also needs precise control of temperature, but it is not easy to accurately obtain the temperature of a cooking utensil.
[0055] Currently, the cooking temperature of a cooking utensil is mainly measured by using a contact type NTC, but this method is not only difficult to realize in structure, but also slow to obtain the temperature, so it is improved, that is, a non-contact temperature measuring device is used to measure the cooking temperature of a cooking utensil.
[0056] However, the surface thermal emissivity of different material cooking utensils is not equal, resulting in low accuracy and poor reliability of the measured cooking temperature of the cooking utensil.
[0057] To address the aforementioned deficiencies, this application provides a method for calibrating temperature. When the object to be measured is in operation, the method acquires the temperature to be calibrated corresponding to the object. Based on the thermal emissivity of the object and the temperature to be calibrated, a target temperature is calculated for the object. The target temperature is then used as the actual temperature of the object. When using a non-contact temperature measuring device to measure the cooking temperature of a cooking appliance, although the materials of the cooking appliances may differ, the actual temperature is obtained by calibrating the measured cooking temperature based on the thermal emissivity. Using this actual temperature as the final cooking temperature results in a high accuracy and reliability of the final output cooking temperature. This method is highly user-friendly and practical.
[0058] The temperature calibration method provided in this application is mainly applicable to cooking utensils or cups. The application scenarios of this method are as follows: Figures 1-3 As shown, the specific process is as follows:
[0059] The first step is to obtain the boiling point temperature of the water when the cooking appliance is boiling water, under the current atmospheric pressure.
[0060] In this step, firstly, as follows Figure 1 The cooking appliance shown in Figure (A) is filled with water, but not necessarily completely; next, the appliance is placed on a gas stove, induction cooker, or fireplace to boil the water; then, the current atmospheric pressure is obtained using a pressure measuring device, which can be installed on a stove such as... Figure 1 The calibration temperature device shown in Figure (B) can also exist independently of the calibration temperature device; then, the boiling point temperature corresponding to the current atmospheric pressure is looked up through the pressure boiling point mapping table.
[0061] The second step is to obtain the radiant temperature of the cooking utensils using a non-contact temperature measuring device.
[0062] In this step, first press as follows Figure 1 The on / off switch of the calibration temperature device shown in Figure (C) is as follows: Figure 1 The non-contact temperature measuring device in the calibration temperature apparatus shown in Figure (B) will automatically measure, for example... Figure 1 The cooking appliance in Figure (A) radiates heat; then, as shown in Figure (A), Figure 1 The calibration temperature device shown in Figure (C) displays the radiation temperature measured by the non-contact temperature measuring device on the screen.
[0063] The third step is to calculate the thermal emissivity of the cooking appliance based on the boiling point temperature and radiation temperature.
[0064] In this step, press as shown Figure 1calculates and saves the thermal emissivity key, and the calibration temperature device automatically calculates the thermal emissivity based on the boiling point temperature of the boiling water and the radiation temperature of the cooking utensil measured in the above steps, and automatically saves the calculated thermal emissivity in the memory in the calibration temperature device for calling in the subsequent steps.
[0065] Fourthly, when the cooking utensil is in the working state, the corresponding to-be-calibrated temperature of the cooking utensil is obtained.
[0066] In this step, first, the cooking utensil as shown in the (A) of the FIG. 1 is placed on a fire tool such as a gas stove, an electromagnetic oven or a fire stove for cooking, at this time, the cooking utensil will radiate a certain temperature, which is not necessarily the real temperature of the cooking utensil, so it is taken as the to-be-calibrated temperature first, and then it is calibrated in the subsequent steps to calculate the actual temperature of the cooking utensil; secondly, the non-contact temperature measuring device of the calibration temperature device as shown in the (B) of the FIG. 1 automatically measures the to-be-calibrated temperature of the cooking utensil; then, the calibration temperature device as shown in the (C) of the FIG. 1 displays the to-be-calibrated temperature of the cooking utensil on the display screen. Figure 2 Figure 2 Figure 2
[0067] Fifthly, the target temperature of the cooking utensil is calculated according to the thermal emissivity corresponding to the cooking utensil and the to-be-calibrated temperature.
[0068] In this step, first, the calculation target temperature key of the calibration temperature device as shown in the (C) of the FIG. 1 is pressed, the calibration temperature device automatically calculates the target temperature of the cooking utensil as shown in the (A) of the FIG. 1; secondly, the calibration temperature device displays the target temperature of the cooking utensil on the display screen. Figure 2 Figure 2
[0069] Sixthly, the target temperature calculated in the above step is taken as the actual temperature of the cooking utensil.
[0070] The calibration temperature device in the above steps is a desktop device, which can be directly placed in a suitable position beside the cooking utensil, the non-contact temperature measuring device is aimed at the periphery of the cooking utensil, the to-be-calibrated temperature of the cooking utensil is measured, the thermal emissivity is calculated, and finally the target temperature of the cooking utensil is calculated, which is the actual temperature of the cooking utensil.
[0071] The calibration temperature device can also be a handheld device as shown in the (C) of the FIG. 1. Figure 3 The hand-held device shown in (B) of FIG. 1 is used by directly holding the device in hand, aiming the non-contact temperature measuring device of the device at the periphery of the cooking appliance, and then pressing the corresponding control key to measure the temperature to be calibrated of the cooking appliance, calculate the thermal emissivity, and finally calculate the target temperature of the cooking appliance, which is the actual temperature of the cooking appliance.
[0072] The calibration temperature device can also be a hanging device as shown in (D) of FIG. 1, which is used by directly hanging the device on the wall, aiming the non-contact temperature measuring device of the device at the periphery of the cooking appliance, and then pressing the corresponding control key to measure the temperature to be calibrated of the cooking appliance, calculate the thermal emissivity, and finally calculate the target temperature of the cooking appliance, which is the actual temperature of the cooking appliance. Figure 3 The calibration temperature device can also be a hanging device as shown in (D) of FIG. 1, which is used by directly hanging the device on the wall, aiming the non-contact temperature measuring device of the device at the periphery of the cooking appliance, and then pressing the corresponding control key to measure the temperature to be calibrated of the cooking appliance, calculate the thermal emissivity, and finally calculate the target temperature of the cooking appliance, which is the actual temperature of the cooking appliance.
[0073] The above calibration temperature device can also be used to measure and calibrate the temperature to be calibrated of a cup, and finally obtain the actual temperature of the cup, which is substantially the same as the process of calculating the target temperature of the cooking appliance, and will not be described here.
[0074] The implementation process of the calibration temperature method will be described below through specific embodiments.
[0075] Please refer to Figure 4 , Figure 4 is the implementation flowchart of the calibration temperature method provided by the embodiments of the present application. As shown in Figure 4 , the method can include the following steps:
[0076] S401, when the object to be measured is in a working state, obtaining the temperature to be calibrated corresponding to the object to be measured.
[0077] In some embodiments, the object to be measured can be a cooking appliance or a cup, etc. The object to be measured in a working state means that the object to be measured is being used to realize its functions.
[0078] The temperature to be calibrated of the object to be measured is the radiation temperature of the object to be measured in the working state, which is not necessarily the actual temperature of the object to be measured, so calibration is needed. The temperature to be calibrated of the object to be measured can be obtained by a non-contact temperature measuring device.
[0079] For example, the object to be measured is a cooking utensil. When the cooking utensil is used for cooking, it is placed on a gas stove, an induction cooker or a fire stove, and the fire tool conducts heat to the cooking utensil. The cooking utensil radiates a certain temperature, which can be measured by a non-contact infrared temperature sensor. However, due to the different materials and thermal radiation rates of different cooking utensils, the radiation temperature is not necessarily the actual temperature of the cooking utensil. Therefore, the actual temperature of the cooking utensil needs to be calculated by using the thermal radiation rate of the cooking utensil. Therefore, the radiation temperature of the cooking utensil in the working state is taken as the temperature to be calibrated, and then the temperature to be calibrated is calibrated. The temperature to be calibrated of the cooking utensil can be measured by a non-contact infrared temperature sensor. For example, the temperature to be calibrated of the cooking utensil is 70℃.
[0080] In S402, a target temperature of the object to be measured is calculated according to the thermal radiation rate corresponding to the object to be measured and the temperature to be calibrated.
[0081] In some embodiments, the thermal radiation rate corresponding to the object to be measured can be measured and calculated by a merchant in advance according to different materials of the object to be measured and stored in the calibration temperature device provided in the embodiments of the present application. Alternatively, the thermal radiation rate can be calculated by a user according to the material of the object to be measured and by using a thermal radiation rate formula when the user actually uses the calibration temperature device. The calculated target temperature is the actual temperature of the object to be measured.
[0082] For example, the merchant can calculate the corresponding thermal radiation rate according to different materials of the cooking utensil, and store the calculated thermal radiation rate in the calibration temperature device. When the user uses the calibration temperature device, the user can directly call the thermal radiation rate measured in advance by the merchant. If the merchant does not measure the thermal radiation rate of the cooking utensil of any material in advance, the user can calculate the thermal radiation rate corresponding to the cooking utensil according to the material of the cooking utensil owned by the user and by using a thermal radiation rate calculation formula. If the merchant only measures the thermal radiation rate of the cooking utensil of some materials, and the material of the cooking utensil owned by the user does not belong to the materials, the user can calculate the thermal radiation rate corresponding to the cooking utensil owned by the user according to the material of the cooking utensil owned by the user and by using a thermal radiation rate calculation formula. For example, the merchant only measures the thermal radiation rate corresponding to the cooking utensil of stainless steel and / or iron, and the material of the cooking utensil owned by the user is aluminum. Therefore, the user can calculate the thermal radiation rate corresponding to the cooking utensil owned by the user according to the cooking utensil of aluminum and by using a thermal radiation rate calculation formula.
[0083] In S403, the target temperature is taken as the actual temperature of the object to be measured.
[0084] In some embodiments, the target temperature calculated by the above embodiments is the actual temperature of the object to be measured. The actual temperature can be output on the electronic device provided by the embodiments of the present application, and the output mode can be display on the display screen, voice broadcast, warning sound or warning light, etc.
[0085] For example, the target temperature calculated by the above embodiments is the actual temperature of the cooking appliance during cooking, and the actual temperature is displayed on the display screen of the electronic device.
[0086] As shown in Figure 5 The flowchart for calculating the thermal emissivity of the object to be measured provided by the embodiments of the present application can include the following steps:
[0087] S501, under the current atmospheric pressure, the boiling point temperature of the boiling water corresponding to the object to be measured is obtained.
[0088] In some embodiments, the current atmospheric pressure is obtained by the air pressure measuring device, and the boiling point temperature of the boiling water corresponding to the current atmospheric pressure is obtained by the air pressure boiling point mapping table.
[0089] For example, first, tap water or other unboiled water is filled in a cooking appliance, which can not be filled to the brim, but only a certain amount of water is filled; second, the water is boiled by using a gas stove, an electromagnetic oven or a fire stove; third, the current atmospheric pressure is obtained by using an air pressure measuring device, which can be independent or installed in a non-contact infrared temperature sensor; finally, the boiling point temperature of the boiling water corresponding to the current atmospheric pressure is obtained by using an air pressure boiling point mapping table.
[0090] S502, the radiation temperature corresponding to the object to be measured is obtained by using a non-contact temperature measuring device.
[0091] In some embodiments, when the object to be measured boils water, the object to be measured will radiate a certain temperature, which can be measured by using a non-contact temperature measuring device.
[0092] For example, when the water is boiled by using a cooking appliance, the cooking appliance will radiate a certain temperature, which can be measured by using a non-contact infrared temperature sensor.
[0093] S503, based on the boiling point temperature and the radiation temperature, the thermal emissivity corresponding to the object to be measured is calculated.
[0094] In some embodiments, the thermal emissivity of the object to be measured is calculated according to the following formula: Wherein, r represents the thermal emissivity of the object to be measured; T0 represents the radiation temperature of the current object to be measured, T frepresents the boiling point temperature of boiling water.
[0095] For example, the thermal emissivity of the cooking utensil is calculated according to the following formula: For example, the thermal emissivity of the cooking utensil is calculated according to the following formula: f For example, the thermal emissivity of the cooking utensil is calculated according to the following formula:
[0096] After the calculation of the thermal emissivity of the object to be measured in S503, the corresponding thermal emissivity of the object to be measured and the correspondence between the object to be measured and the thermal emissivity are also saved.
[0097] In some embodiments, after the thermal emissivity of the object to be measured is calculated, the thermal emissivity must be saved in order to calculate the target temperature of the object to be measured using the thermal emissivity and the calibrated temperature calculated in the above steps in the subsequent steps. If the calculated thermal emissivity is not saved, the target temperature of the object to be measured cannot be calculated in the subsequent steps. In addition, the correspondence between the object to be measured and the thermal emissivity is also saved, because the thermal emissivity is different for different materials of the object to be measured, so the correspondence is saved for use in the subsequent steps.
[0098] For example, after the thermal emissivity of the cooking utensil is calculated, it is saved in the electronic device in order to calculate the target temperature of the cooking utensil, i.e. the actual temperature of the cooking utensil, using the thermal emissivity and the calibrated temperature of the cooking utensil calculated in the above embodiments in the subsequent steps.
[0099] In S402, the target temperature of the object to be measured is calculated according to the corresponding thermal emissivity of the object to be measured and the calibrated temperature, which can be calculated according to the following formula: wherein T n represents the target temperature of the object to be measured; T t represents the calibrated temperature of the object to be measured, and r represents the thermal emissivity of the object to be measured.
[0100] In some embodiments, the target temperature of the object to be measured is calculated according to the thermal emissivity and the calibrated temperature of the object to be measured calculated in the above embodiments according to the following formula:
[0101] For example, the thermal emissivity of the cooking utensil calculated in the above embodiments is 0.8, and the calibrated temperature T t The temperature is 70℃. Using the above formula, the target temperature of the cooking appliance can be calculated to be 87.5℃.
[0102] Corresponding to the calibration temperature method described in the above embodiments, Figure 6 A structural block diagram of the temperature calibration device provided in the embodiments of this application is shown. For ease of explanation, only the parts related to the embodiments of this application are shown.
[0103] Reference Figure 6 The device includes:
[0104] The acquisition unit 601 is used to acquire the temperature to be calibrated corresponding to the object to be measured when the object to be measured is in a working state.
[0105] Processing unit 602 is used to calculate the target temperature of the object to be measured based on the thermal emissivity of the object to be measured and the temperature to be calibrated.
[0106] The output unit 603 is used to use the target temperature as the actual temperature of the object to be measured.
[0107] Figure 7 This is a schematic diagram of the structure of an electronic device 7 provided in an embodiment of this application. For example... Figure 7 As shown, the electronic device 7 of this embodiment includes: at least one processor 701 ( Figure 7 Only one is shown in the diagram), memory 703, and computer program 702 stored in said memory 703 and executable on said at least one processor 701, which, when executed by said processor 701, implements the steps in the above embodiments.
[0108] The electronic device 7 can be a desktop, handheld, or wall-mounted device. The electronic device 7 may include, but is not limited to, a processor 701 and a memory 703. Those skilled in the art will understand that... Figure 7 This is merely an example of electronic device 7 and does not constitute a limitation on electronic device 7. It may include more or fewer components than shown, or combine certain components, or different components, such as input / output devices, network access devices, etc.
[0109] The processor 701 can be a central processing unit (CPU), and can also be other general-purpose processors, a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA) or other programmable logic device, discrete gate or transistor logic, discrete hardware components, etc. The general-purpose processor can be a microprocessor or the processor can also be any conventional processor.
[0110] The memory 703 can be an internal storage unit of the electronic device 7 in some embodiments, such as a hard disk or a memory of the electronic device 7. The memory 703 can also be an external storage device of the electronic device 7 in other embodiments, such as a plug-in hard disk, a smart media card (SMC), a secure digital (SD), a flash card, etc. equipped on the electronic device 7. Further, the memory 703 can include both an internal storage unit and an external storage device of the electronic device 703. The memory 703 is used to store an operating system, an application program, a boot loader, data, and other programs, such as program codes of the computer program, etc. The memory 703 can also be used to temporarily store data that has been output or will be output.
[0111] The integrated unit, if implemented in the form of a software function unit and sold or used as an independent product, can be stored in a computer readable storage medium. Based on such understanding, all or part of the processes in the above-mentioned embodiment methods can be implemented by a computer program instructing related hardware, and the computer program can be stored in a computer readable storage medium. The computer program can implement the steps of each method embodiment when executed by a processor. The computer program includes computer program code, which can be in the form of source code, object code, executable files, or some intermediate forms. The computer readable storage medium at least includes any entity or device capable of carrying the computer program code to the measuring temperature device / electronic equipment, recording medium, computer memory, read-only memory (ROM), random access memory (RAM), electrical carrier signal, telecommunication signal, and software distribution medium, such as a U disk, mobile hard disk, magnetic disk or optical disk, etc. In some jurisdictions, according to legislation and patent practice, the computer readable storage medium can not be an electrical carrier signal and a telecommunication signal.
[0112] The embodiments of the present application also provide a computer readable storage medium, which stores a computer program. The computer program is executed by a processor to implement the steps in each method embodiment.
[0113] Figure 8 An entity structure diagram for calibrating a temperature device is provided in the embodiments of the present application. As shown in the figure, the device includes a processor 801, a control key 802, and a non-contact temperature measuring device 803. Figure 8
[0114] The processor 801 is configured to calculate a target temperature of the object to be measured according to a thermal emissivity corresponding to the object to be measured and the temperature to be calibrated.
[0115] The control key 802 includes a power on / off key 8021, a thermal emissivity calculation and saving key 8022, and a target temperature calculation key 8023, and is configured to control the non-contact temperature measuring device 803 to start the temperature measuring function.
[0116] The non-contact temperature measuring device 803 can be a non-contact infrared temperature sensor, and is configured to measure the temperature to be calibrated of the object to be measured.
[0117] The device 8 can further include a main body structure 804 and a display screen 805.
[0118] The main body structure 804 of the device 8 is designed in a triangular rhombus shape, small and exquisite, convenient to use, one side is convenient for the non-contact temperature measuring device 803 to align the bottom of the cooking utensil, and the other side is to display the temperature of the cooking utensil in real time on the display screen 805; and the control key 802 is added, which is convenient for setting different thermal radiation rates for different cooking utensils, or putting boiling water in the cooking utensil, and automatically matching the thermal radiation rate of the cooking utensil by one key.
[0119] The device 8 can be independently arranged on a gas stove or an induction cooker, or integrated into a gas stove or an induction cooker. If integrated into a gas stove, the display screen 805 and the control key 802 can be integrated into the control panel of the gas stove, as shown in (C) and (D) of FIG. 1. Figure 8
[0120] In the above embodiments, the description of each embodiment has its own focus, and the parts not described or recorded in a certain embodiment can be referred to the related description of other embodiments.
[0121] Those skilled in the art can realize that the units and algorithm steps of each example described in combination with the embodiments disclosed herein can be realized by electronic hardware or a combination of computer software and electronic hardware. Whether the functions are realized in hardware or software depends on the specific application and design constraints of the technical solution. Professional technicians can use different methods to realize the described functions for each specific application, but such implementation should not be considered beyond the scope of the present application.
[0122] In the embodiments provided in the present application, it should be understood that the disclosed devices / network equipment and methods can be implemented in other ways. The device / network equipment embodiments described above are only schematic. The division of the modules or units is only a logical function division, and actual implementation can have another division manner. For example, multiple units, components can be combined or integrated into another system, and some features can be omitted or not executed. In addition, the indirect coupling, direct coupling or communication connection between the units shown or discussed can be indirect coupling, direct coupling or communication connection through some interfaces, devices or units, and can be electrical, mechanical or other forms.
[0123] The units described as separate components can or can not be physically separated, and the components shown as units can or can not be physical units, that is, they can be located in one place, or can be distributed on multiple network units. According to actual needs, part or all of the units can be selected to achieve the purpose of the present embodiment.
[0124] The above-described embodiments are merely used to illustrate the technical solutions of the present application, but not to limit the present application. Although the present application is described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that the technical solutions recorded in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalent technical features, and these modifications or replacements will not change the essence of the corresponding technical solutions, and should be included in the protection scope of the present application.
Claims
1. A method of calibrating temperature, characterized by, The method comprises: acquiring a to-be-calibrated temperature corresponding to the to-be-measured object when the to-be-measured object is in a working state; calculating a target temperature of the to-be-measured object according to the thermal emissivity corresponding to the to-be-measured object and the to-be-calibrated temperature; taking the target temperature as an actual temperature of the to-be-measured object; before acquiring the to-be-calibrated temperature corresponding to the to-be-measured object, the method further comprises: acquiring a current atmospheric pressure through an air pressure measuring device; acquiring a boiling water boiling point temperature corresponding to the to-be-measured object when boiling water under the current atmospheric pressure; acquiring a current radiation temperature corresponding to the to-be-measured object through a non-contact temperature measuring device; calculating the thermal emissivity corresponding to the to-be-measured object based on the boiling point temperature and the radiation temperature; saving the thermal emissivity corresponding to the to-be-measured object and a correspondence between the to-be-measured object and the thermal emissivity; calculating the thermal emissivity corresponding to the to-be-measured object based on the boiling point temperature and the radiation temperature comprises: The thermal emissivity of the object under test is calculated according to the following formula: wherein r represents the thermal emissivity of the object to be measured; T0represents the radiative temperature of the object to be measured at the current time; T f represents the boiling point temperature of boiling water; calculating a target temperature of the to-be-measured object according to the thermal emissivity corresponding to the to-be-measured object and the to-be-calibrated temperature comprises: The target temperature of the object to be measured is calculated according to the following formula: wherein Tn represents the target temperature of the to-be-measured object, Tt represents the to-be-calibrated temperature of the to-be-measured object, and r represents the thermal emissivity of the to-be-measured object.
2. The method of claim 1, wherein, The acquiring of the boiling water boiling point temperature corresponding to the to-be-measured object when boiling water under the current atmospheric pressure comprises: acquiring the current atmospheric pressure through an air pressure measuring device; querying the boiling point temperature corresponding to the current atmospheric pressure through an air pressure boiling point mapping table.
3. The method of claim 1, wherein, The acquiring of the to-be-calibrated temperature of the to-be-measured object comprises: acquiring the to-be-calibrated temperature of the to-be-measured object through the non-contact temperature measuring device.
4. A device for calibrating temperature, characterized in that The device adopts the method according to any one of claims 1-3 for temperature calibration, and comprises a processor, a control key, and a non-contact temperature measuring device. The control key is used to control the non-contact temperature measuring device to start a temperature measuring function. The non-contact temperature measuring device is used to measure a to-be-calibrated temperature of a to-be-measured object. The processor is used to calculate a target temperature of the to-be-measured object according to the thermal emissivity corresponding to the to-be-measured object and the to-be-calibrated temperature.
5. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that, The processor implements the method according to any one of claims 1-3 when executing the computer program.
6. A computer-readable storage medium, characterized in that, The computer readable storage medium stores a computer program, and the computer program is executed by the processor to implement the method according to any one of claims 1-3.
Citation Information
Patent Citations
Infrared temperature measurement method and system used for cooking utensils, and cooking utensil
CN108991905A