Micro-LED display panel and its fabrication method

Abstract

This application relates to a Micro-LED display panel and its fabrication method. A first through-hole of the substrate is filled with an insulating thermally conductive material. Pads are disposed on the substrate, and a first insulating thermally conductive layer covers the substrate, exposing the side of the pads facing away from the substrate. Electrodes are stacked on the first insulating thermally conductive layer and the pads. The electrodes penetrate through a second through-hole opposite to the first insulating thermally conductive layer, and the second through-hole is filled with a thermally conductive material. Multiple spaced light-emitting layers are disposed on the electrodes. A second insulating thermally conductive layer is filled between adjacent light-emitting layers, and the second insulating thermally conductive layer is opposite to the second through-hole. The sides of the second insulating thermally conductive layer facing the light-emitting layers are opaque. The second insulating thermally conductive layer located between blue LED pixel units and red / green LED pixel units is a right-angled trapezoid in longitudinal section, and the second insulating thermally conductive layer located between green LED pixel units and red LED pixel units is rectangular in longitudinal section. This application improves the heat dissipation performance of the chip.

Description

Technical Field

[0001] This application relates to the field of display device technology, and in particular to a Micro-LED display panel and its manufacturing method. Background Technology

[0002] Micro-LED display technology refers to a display technology that uses self-emissive, micrometer-sized LEDs as light-emitting pixel units, assembling them onto a driving panel to form a high-density LED array. Due to the small size, high integration, and self-emissive nature of micro-LED chips, they have significant advantages over LCD and OLED displays in terms of brightness, resolution, contrast ratio, energy consumption, lifespan, response speed, and thermal stability.

[0003] The principle of Micro-LED display is to thin, miniaturize, and array the traditional LED chip structure design, so that the size of the resulting micro-LED chip is only in the range of 1~10μm. Then, the micro-LED chips are transferred in batches onto a substrate with driving circuits made using PCB, flexible PCB, and CMOS / TFT integrated circuit technology. Then, physical vapor deposition and / or chemical vapor deposition processes are used to complete the preparation of the protective layer and the top electrode. Finally, the top substrate is packaged to obtain a micro-LED display.

[0004] Current Micro-LED displays have poor heat dissipation performance due to the large number of Micro-LED chips. Long-term high-temperature environments may cause LEDs to decay faster, reducing the lifespan of the Micro-LED display. Uneven heat dissipation of LEDs, with red, green, and blue LEDs decaying at different rates, may also cause screen color deviations and lead to screen distortion with long-term use. Summary of the Invention

[0005] To improve the heat dissipation performance of the chip, this application provides a Micro-LED display panel and its fabrication method.

[0006] This application provides a Micro-LED display panel and its fabrication method, which adopts the following technical solution:

[0007] In a first aspect, this application provides a Micro-LED display panel, comprising:

[0008] The substrate includes multiple spaced mounting areas, with a non-mounting area between each two adjacent mounting areas. Each non-mounting area of ​​the substrate is provided with a first through hole, and the first through hole is filled with an insulating heat conductor.

[0009] Each of the mounting areas of the substrate is provided with pads, and a first insulating and thermally conductive layer is covered on the substrate, the first insulating and thermally conductive layer covering the pads so that the side of the pads facing away from the substrate is exposed; and,

[0010] An electrode is stacked on the first insulating and thermally conductive layer and the pad. The electrode has a second through hole opposite to the first insulating and thermally conductive layer. The second through hole is filled with a thermally conductive material.

[0011] The electrode is provided with multiple spaced light-emitting layers, and a second insulating and heat-conducting layer is filled between two adjacent light-emitting layers. The second insulating and heat-conducting layer is opposite to the second through hole, and the side of the second insulating and heat-conducting layer facing the light-emitting layer is opaque.

[0012] Each of the light-emitting layers corresponds to a red LED pixel unit, a green LED pixel unit, or a blue LED pixel unit. The second insulating and heat-conducting layer located between the blue LED pixel unit and the red LED pixel unit is a right-angled trapezoid in the longitudinal section. The second insulating and heat-conducting layer located between the blue LED pixel unit and the green LED pixel unit is also a right-angled trapezoid in the longitudinal section. The hypotenuse of the right-angled trapezoidal second insulating and heat-conducting layer faces the blue LED pixel unit. The second insulating and heat-conducting layer located between the green LED pixel unit and the red LED pixel unit is rectangular in the longitudinal section.

[0013] By adopting the above technical solution, the electrodes are stacked on the first insulating and thermally conductive layer and the pads, realizing electrical conduction between multiple chips, which is beneficial to current diffusion and can improve current conduction efficiency. At the same time, the increased cross-section of the electrodes can reduce the resistance of the current conduction layer and improve the brightness uniformity of the display panel. The electrodes are laid on the entire surface of the first insulating and thermally conductive layer, which can enhance the stability of the electrodes mounted on the substrate.

[0014] The electrode is electrically connected to the pad on one hand and thermally connected to the first insulating and thermally conductive layer on the other. The heat in the circumferential direction of the light-emitting layer can be transferred to the second thermally conductive insulating layer, and the heat at the bottom of the light-emitting layer can be transferred to the electrode and the insulator in the second through hole. Then, heat is dissipated through the first insulating and thermally conductive layer and the thermally conductive body in the first through hole, which facilitates the rapid heat dissipation of Micro-LED and can effectively improve its heat dissipation performance. In this way, the lifespan of the Micro-LED display panel can be increased and the possibility of screen distortion can be reduced.

[0015] By setting the second insulating heat-conducting layer between the blue LED pixel unit and the red / green LED pixel unit as a right-angled trapezoid in the longitudinal section, and setting the second insulating heat-conducting layer between the green LED pixel unit and the red LED pixel unit as a rectangle in the longitudinal section, a wide viewing angle emission of blue light is achieved, the brightness of blue light is increased, and the brightness of red and green light is reduced, thereby reducing the difference between the brightness of blue light and the brightness of red and green light, and improving the color mixing balance of red, blue and green light.

[0016] Optionally, the electrode is a conductive reflective layer.

[0017] By adopting the above technical solution, the electrode not only plays a role in conducting electricity, but also in reflecting light, so that the light emitted by the light-emitting layer is reflected by the electrode and emitted from the second semiconductor layer, thereby improving the light extraction efficiency.

[0018] Optionally, the second insulating and thermally conductive surface has a light-absorbing layer on the side facing the green LED pixel unit.

[0019] By adopting the above technical solution, the light emitted by the light-emitting layer of the green LED pixel unit shines on the light-absorbing layer and is absorbed by the light-absorbing layer, blocking the light emitted by the light-emitting layer of the green LED pixel unit from being emitted to the adjacent LED chip, thereby improving the light extraction efficiency of the LED chip and reducing light crosstalk between pixels.

[0020] Optionally, the second insulating and thermally conductive surface has a light-absorbing layer on the side facing the red LED pixel unit.

[0021] By adopting the above technical solution, the light emitted by the light-emitting layer of the red LED pixel unit shines on the light-absorbing layer and is absorbed by the light-absorbing layer, blocking the light emitted by the light-emitting layer of the red LED pixel unit from being emitted to the adjacent LED chip, thereby improving the light extraction efficiency of the LED chip and reducing optical crosstalk between pixels.

[0022] Optionally, the second insulating and thermally conductive surface has a reflective layer on the side facing the blue LED pixel unit.

[0023] By adopting the above technical solution, the light emitted by the light-emitting layer of the blue LED pixel unit shines on the Bragg reflector layer, which will produce periodic reflection, thereby improving the blue light extraction efficiency of the LED chip.

[0024] Optionally, the dimensions of each of the right-angled trapezoidal second insulating heat-conducting layers are the same, and the dimensions of each of the rectangular second insulating heat-conducting layers are the same. Half of the sum of the upper and lower bases of the right-angled trapezoidal second insulating heat-conducting layer is the same as the width of the rectangular second insulating heat-conducting layer.

[0025] By adopting the above technical solution, the conductivity of each second insulating thermal conductive layer is the same, so as to balance the heat dissipation efficiency of each pixel.

[0026] Optionally, the pad protrudes from the first insulating and thermally conductive layer at one end away from the substrate, and the electrode has a groove adapted to the pad on the side facing the first insulating and thermally conductive layer, with the end of the pad protruding from the first insulating and thermally conductive layer located in the groove.

[0027] By adopting the above technical solution, it is easy to position the electrode on the substrate, and it also helps the electrical connection between the pad and the electrode.

[0028] Optionally, the resistivity of the pad is smaller than that of the electrode.

[0029] By adopting the above technical solution, the pads with lower resistivity are inserted into the grooves of the electrodes, which can further reduce the resistance of the current conduction layer and improve the brightness uniformity of the display panel.

[0030] Secondly, this application provides a method for fabricating a Micro-LED display panel, comprising the following steps:

[0031] S1 provides a growth substrate, on which an epitaxial layer is grown. The epitaxial layer is etched to form multiple spaced, protruding light-emitting layers and multiple spaced, columnar light-emitting layers. The protruding light-emitting layers correspond to blue LED pixel units, and the columnar light-emitting layers correspond to red or green LED pixel units. A liquid, curable, insulating, and thermally conductive material is filled between adjacent light-emitting layers until it is flush with the light-emitting layers. After the insulating and thermally conductive material is cured, a full-layer electrode is fabricated on the light-emitting layers and the insulating and thermally conductive material. A second through-hole is formed on the electrode, opposite to the insulating and thermally conductive material, and the second through-hole is filled with thermally conductive material.

[0032] S2 provides a substrate, makes an opening in the substrate to form a first through hole, fills the substrate and the first through hole with a liquid curable insulating and thermally conductive material, so that the pads on the substrate are exposed, and waits for the insulating and thermally conductive material to cure.

[0033] S3 The light-emitting layer is mounted on the substrate by flip-chip bonding, the electrode is electrically connected to the pad, the insulating and thermally conductive material on the substrate is attached to the electrode, and the growth substrate is peeled off.

[0034] By employing the above technical solution, the light-emitting layer is flip-chip bonded to the substrate, enabling the electrodes to be set across the entire surface. This facilitates current diffusion and improves the brightness uniformity of the display panel. First, the light-emitting layer is prepared, followed by a second insulating and thermally conductive layer between the light-emitting layers. This allows the second insulating and thermally conductive layer around the blue light-emitting layer to form a right-angled trapezoid in cross-section, reducing the difference between blue light brightness and red / green light brightness, and improving the uniformity of color mixing of red, blue, and green light.

[0035] In summary, this application includes at least one of the following beneficial technical effects:

[0036] 1. By placing the electrodes across the entire surface, current diffusion is facilitated, improving current conduction efficiency, reducing the resistance of the current-conducting layer, and enhancing the brightness uniformity of the display panel. The electrodes, laid across the entire surface on the first insulating and thermally conductive layer, enhance the stability of the electrodes mounted on the substrate.

[0037] 2. By arranging a second insulating and thermally conductive layer around the light-emitting layer and setting a first insulating and thermally conductive layer under the entire electrode, the Micro-LED can be quickly cooled, which can effectively improve its heat dissipation performance, thereby increasing the service life of the Micro-LED display panel and reducing the possibility of screen distortion.

[0038] 3. By setting the second insulating heat-conducting layer as a right-angled trapezoid and rectangle in the longitudinal section, a wide viewing angle of blue light emission is achieved, the brightness of blue light is increased, and the brightness of red and green light is reduced, thereby reducing the gap between the brightness of blue light and the brightness of red and green light and improving the color mixing balance of red, blue and green light.

[0039] 4. The pads are located in the grooves of the first insulating and thermally conductive layer to facilitate the connection between the electrodes and the substrate. The resistivity of the pads is lower than that of the electrodes, which can improve the brightness uniformity of the display panel. Attached Figure Description

[0040] Figure 1 This is a structural schematic diagram of the first cross-section of the Micro-LED display panel in Embodiment 1 of this application;

[0041] Figure 2 This is a structural schematic diagram of the second cross-section of the Micro-LED display panel in Embodiment 1 of this application;

[0042] Figure 3 This is a structural schematic diagram of the first cross-section of the Micro-LED display panel in Embodiment 2 of this application;

[0043] Figures 4 to 8 This is a schematic flowchart of the Micro-LED display panel fabrication method in Embodiment 3 of this application.

[0044] Explanation of reference numerals in the attached drawings: 1. Substrate; 11. First through-hole; 2. Insulating thermal conductor; 3. Pad; 4. First insulating thermal conductor layer; 5. Electrode; 51. Second through-hole; 52. Groove; 6. Thermal conductor; 7. Light-emitting layer; 8. Second insulating thermal conductor layer; 9. Light-absorbing layer; 10. Reflective layer; 100. Growth substrate; 200. Epitaxial layer; 201. Second semiconductor layer; 202. Quantum hydrazine layer; 203. First semiconductor layer; 300. Blue LED pixel unit; 400. Red LED pixel unit; 500. Green LED pixel unit. Detailed Implementation

[0045] The following is in conjunction with the appendix Figure 1-8 This application will be described in further detail.

[0046] Example 1

[0047] This application discloses a Micro-LED display panel. (Refer to...) Figure 1 A Micro-LED display panel includes a substrate 1 and multiple LED chips. Each LED chip includes an electrode 5 and a light-emitting layer 7. The substrate 1 is used to support the LED chips and control the light emission of the LED chips. The substrate 1 may be a driving backplane, which includes a driving circuit for driving the light-emitting layer 7 of the LED chips to emit light. This driving circuit may be a CMOS driving circuit.

[0048] The substrate 1 includes multiple spaced mounting areas, each used to mount LED chips. There is a non-mounting area between each two adjacent mounting areas. Each mounting area of ​​the substrate 1 is provided with a pad 3, which is used to solder to the electrode 5 of the LED chip to achieve electrical connection between the substrate 1 and the LED chip.

[0049] The non-mounting area of ​​the substrate 1 is provided with a first through hole 11, and the first through hole 11 is filled with an insulating heat conductor 2. The insulating heat conductor 2 can be made of silicone, thermally conductive resin, etc.

[0050] A first insulating and thermally conductive layer 4 is covered on the substrate 1. The first insulating and thermally conductive layer 4 wraps around the pad 3 so that the side of the pad 3 facing away from the substrate 1 is exposed. The first insulating and thermally conductive layer 4 and the insulating and thermally conductive body 2 in the first through hole 11 are thermally connected. The material of the first insulating and thermally conductive layer 4 can be silicone, thermally conductive resin, etc.

[0051] The electrodes 5 of multiple LED chips are integrally formed and stacked on the first insulating and thermally conductive layer 4 and the pads 3. The electrodes 5 are electrically connected to the pads 3 and thermally connected to the first insulating and thermally conductive layer 4. The electrodes 5 have a second through hole 51 opposite to the first insulating and thermally conductive layer 4. The second through hole 51 is filled with a heat conductor 6, which can be either insulating or conductive. The heat conductor 6 in the second through hole 51 is thermally connected to the first insulating and thermally conductive layer 4.

[0052] In one embodiment, an ohmic contact layer may be provided between the electrode 5 and the light-emitting layer 7. The ohmic contact layer is used to enable holes generated in the p-type semiconductor layer and / or electrons generated in the n-type semiconductor layer to be effectively injected into the quantum hydrazine layer 202. In the quantum hydrazine layer 202, electrons and holes recombine to emit photons, completing the conversion of electrical energy into light energy, realizing the first color pixel 111 to emit light, thereby increasing the luminous efficiency of the Micro-LED display panel.

[0053] Multiple LED chips have light-emitting layers 7 spaced apart and disposed on electrodes 5. The light-emitting layers 7 include a first semiconductor layer 203, a quantum hydrazine layer 202, and a second semiconductor layer 201 stacked together (which can be combined). Figures 5 to 7 A second insulating and thermally conductive layer 8 is filled between each of two adjacent light-emitting layers 7. The second insulating and thermally conductive layer 8 is opposite to the second through hole 51. The second insulating and thermally conductive layer 8 and the thermally conductive body 6 in the second through hole 51 are thermally connected. The material of the second insulating and thermally conductive layer 8 can be silicone, thermally conductive resin, etc.

[0054] Each light-emitting layer 7 corresponds to a red LED pixel unit 400, a green LED pixel unit 500, or a blue LED pixel unit 300. In one optional embodiment, the light-emitting layer 7 corresponding to the red LED pixel unit 400 emits red light, the light-emitting layer 7 corresponding to the blue LED pixel unit 300 emits blue light, and the light-emitting layer 7 corresponding to the green LED pixel unit 500 emits green light. The sides of the second insulating and thermally conductive layer 8 facing the light-emitting layer 7 are all opaque. In another optional embodiment, the light-emitting layers 7 corresponding to each pixel unit have the same structure and can all emit blue light. Color conversion can be achieved simply by providing a red quantum dot conversion layer corresponding to the light-emitting layer 7 in the red LED pixel unit 400 and a green quantum dot conversion layer corresponding to the light-emitting layer 7 in the green LED pixel unit 500.

[0055] The second insulating heat-conducting layer 8 located between the blue LED pixel unit 300 and the red LED pixel unit 400 is a right-angled trapezoid in its longitudinal section. The second insulating heat-conducting layer 8 located between the blue LED pixel unit 300 and the green LED pixel unit 500 is also a right-angled trapezoid in its longitudinal section. The hypotenuses of the right-angled trapezoidal second insulating heat-conducting layer 8 all face towards the blue LED pixel unit 300. (Refer to...) Figure 2 The second insulating and heat-conducting layer 8, located between the green LED pixel unit 500 and the red LED pixel unit 400, is rectangular in longitudinal section.

[0056] Understandably, the side of each light-emitting layer 7 facing away from the electrode 5 also needs to be electrically connected to the conductive layer. In order to avoid affecting the luminous efficiency of the light-emitting layer 7, the conductive layer can be disposed on the second insulating and heat-conducting layer 8, or the material of the conductive layer can be selected as a light-transmitting material, such as indium tin oxide, indium zinc oxide, zinc oxide, indium oxide, indium gallium oxide and zinc aluminum oxide.

[0057] In this application, the electrodes 5 of multiple LED chips are integrally formed and laid on the first insulating and thermally conductive layer 4, which can ensure the stability of the LED chips. At the same time, the entire electrode 5 is conducive to current diffusion and can improve the current conduction efficiency. The entire electrode 5 serves as a current conducting layer connecting the light-emitting layer 7 and the substrate 1, which can reduce the resistance of the current conducting layer and improve the brightness uniformity of the display panel.

[0058] Each light-emitting layer 7 is surrounded by a second insulating and thermally conductive layer 8. The heat from the LED chip can be transferred to the first insulating and thermally conductive layer 4 through the second insulating and thermally conductive layer 8, the thermally conductive body 6 in the second through hole 51, and the electrode 5. Then, the heat is dissipated through the insulating thermally conductive body 2 in the first through hole 11, which facilitates the rapid heat dissipation of Micro-LED and can effectively improve its heat dissipation performance. This can improve the lifespan of the Micro-LED display panel and reduce the possibility of screen flickering.

[0059] Because blue light has the shortest wavelength, there is a problem of insufficient blue light among the three colors of red, blue, and green. By setting a right-angled trapezoidal second insulating heat-conducting layer 8, on the one hand, the pixel area of ​​blue light is larger than that of red light and green light, realizing a wide viewing angle emission of blue light and improving the brightness of blue light; on the other hand, part of the light emitted by the red LED and part of the light emitted by the green LED are blocked by the right-angled sides of the right-angled trapezoidal second insulating heat-conducting layer 8, and part of the light is emitted from the middle of two adjacent second insulating heat-conducting layers 8, reducing the brightness of red and green light, thereby reducing the difference between the brightness of blue light and the brightness of red and green light, and improving the color mixing balance of red, blue, and green light.

[0060] In an optional embodiment, electrode 5 is a conductive reflective layer. Electrode 5 can be Ag, Al, etc. In a specific embodiment, electrode 5 is made of mirror silver. In addition to its conductive function, electrode 5 can also reflect light, so that the light emitted by the light-emitting layer 7 is reflected by electrode 5 and emitted from the side of the second semiconductor layer 201, thereby improving the light extraction efficiency.

[0061] In an optional embodiment, a reflective layer 10 is provided on the side of the second insulating and thermally conductive layer 8 facing the blue LED pixel unit 300. The reflective layer 10 is a Bragg reflective layer. The light emitted by the light-emitting layer 7 of the blue LED pixel unit 300 shines on the Bragg reflective layer, and the Bragg reflective layer will produce periodic reflection, which improves the blue light extraction efficiency of the LED chip.

[0062] A light-absorbing layer 9 is provided on the side of the second insulating and thermally conductive layer 8 facing the green LED pixel unit 500, and another light-absorbing layer 9 is provided on the side of the second insulating and thermally conductive layer 8 facing the red LED pixel unit 400. The light-absorbing layer 9 can be made of a light-absorbing black material. The light emitted by the light-emitting layers 7 of the red LED pixel unit 400 and the green LED pixel unit 500 shines on the light-absorbing layer 9 and is absorbed by the light-absorbing layer 9, blocking the light emitted by the light-emitting layers 7 of the red LED pixel unit 400 and the green LED pixel unit 500 from being emitted to adjacent LED chips, thereby improving the light extraction efficiency of the LED chips and reducing optical crosstalk between pixels.

[0063] In one optional embodiment, each of the right-angled trapezoidal second insulating heat-conducting layers 8 has the same size, and each of the rectangular second insulating heat-conducting layers 8 has the same size. Half of the sum of the upper and lower bases of the right-angled trapezoidal second insulating heat-conducting layer 8 is the same as the width of the rectangular second insulating heat-conducting layer 8, so that the cross-sectional area of ​​the right-angled trapezoidal second insulating heat-conducting layer 8 is equal to the cross-sectional area of ​​the rectangular second insulating heat-conducting layer 8, and so that the conductivity of each second insulating heat-conducting layer 8 is the same, so as to balance the heat dissipation efficiency of each pixel.

[0064] Example 2

[0065] Reference Figure 3 The difference between Embodiment 2 and Embodiment 1 is that the end of the pad 3 facing away from the substrate 1 protrudes from the first insulating and heat-conducting layer 4, and the side of the electrode 5 facing the first insulating and heat-conducting layer 4 has a groove 52 adapted to the pad 3. The end of the pad 3 protruding from the first insulating and heat-conducting layer 4 is located in the groove 52, which is filled with conductive silver paste. The pad 3 and the electrode 5 are electrically connected through the conductive silver paste. By recessing the groove 52 on the electrode 5, it is easier to position the electrode 5 on the substrate 1, and it also facilitates the electrical connection between the pad 3 and the electrode 5.

[0066] The resistivity of the pad 3 is related to its material and can be selected according to actual needs. In an optional embodiment, the resistivity of the pad 3 is smaller than that of the electrode 5. Compared with the electrode 5 without a groove 52, the pad 3 with a smaller resistivity is inserted into the groove 52 of the electrode 5, which can further reduce the resistance of the current conduction layer and improve the brightness uniformity of the display panel.

[0067] Example 3

[0068] Reference Figures 4 to 8 Example 3 provides a method for preparing a Micro-LED display panel, comprising the following steps:

[0069] Reference Figure 4S1: Provide a growth substrate 100, and grow an epitaxial layer 200 on the growth substrate 100. The epitaxial layer 200 includes a second semiconductor layer 201, a quantum hydrazine layer 202 and a first semiconductor layer 203 stacked sequentially.

[0070] In an optional embodiment, a buffer layer is first fabricated on the growth substrate 100. The material of the buffer layer may be, for example, aluminum nitride (AlN) or gallium nitride (GaN). Providing a buffer layer between the growth substrate 100 and the epitaxial layer 200 helps to improve the lattice mismatch between the growth substrate 100 and the epitaxial layer 200.

[0071] Reference Figure 5 The epitaxial layer 200 is etched to form multiple spaced, protruding light-emitting layers 7 and multiple spaced, columnar light-emitting layers 7. The protruding light-emitting layers 7 correspond to the blue LED pixel unit 300, and the protruding light-emitting layers 7 can be frustum-shaped or truncated cone-shaped. The columnar light-emitting layers 7 correspond to the red LED pixel unit 400 or the green LED pixel unit 500. (Refer to...) Figure 6 Liquid, curable, insulating, and thermally conductive material is filled between adjacent light-emitting layers 7 until it is flush with the first semiconductor layer 203. After the insulating and thermally conductive material cures, refer to... Figure 7 An electrode 5 is fabricated on the first semiconductor layer 203 and the insulating and thermally conductive material. A second through hole 51 is formed on the electrode 5 opposite to the insulating and thermally conductive material, and a thermally conductive body 6 is filled in the second through hole 51.

[0072] Electrode 5 can be fabricated by vapor deposition or sputtering to create conductive material on the light-emitting layer 7 and the second insulating and thermally conductive layer 8; photoresist is coated on the conductive material, patterned using photolithography, and electrode 5 is patterned using dry etching or wet etching to form the second through-hole 51. Alternatively, electrode 5 can be fabricated by placing a fine metal mask on the light-emitting layer 7 and the second insulating and thermally conductive layer 8, and vapor-depositing conductive material onto the upper surfaces of the light-emitting layer 7 and the second insulating and thermally conductive layer 8 to form electrode 5 with the second through-hole 51.

[0073] Reference Figure 8 S2: Provide a substrate 1 and an annular enclosure, make an opening in the substrate 1 to form a first through hole 11, place the annular enclosure around the substrate 1 to form an injection space, fill the injection space and the first through hole 11 with liquid curable insulating and thermally conductive material to expose the pads 3 on the substrate 1, after the insulating and thermally conductive material is cured, form an insulating and thermally conductive body 2, and remove the annular enclosure.

[0074] Specifically, to form the insulating heat conductor 2, a chemical mechanical polishing process can be used to grind the insulating heat conductor 2 flat, so that the height of the insulating heat conductor 2 is consistent with the height of the pad 3.

[0075] S3: The light-emitting layer 7 is mounted on the substrate 1 by flip-chip bonding, the electrode 5 is electrically connected to the pad 3, the insulating heat conductor 2 on the substrate 1 is attached to the electrode 5, and the growth substrate 100 is peeled off.

[0076] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A Micro-LED display panel, characterized in that, include: The substrate (1) includes multiple spaced mounting areas, and a non-mounting area is between each two adjacent mounting areas. The non-mounting areas of the substrate (1) are provided with a first through hole (11), and the first through hole (11) is filled with an insulating heat conductor (2). Each of the mounting areas of the substrate (1) is provided with a pad (3), and a first insulating and thermally conductive layer (4) is covered on the substrate (1). The first insulating and thermally conductive layer (4) wraps around the pad (3) so that the side of the pad (3) facing away from the substrate (1) is exposed; and, An electrode (5) is stacked on the first insulating and heat-conducting layer (4) and the pad (3). The electrode (5) has a second through hole (51) opposite to the first insulating and heat-conducting layer (4). The second through hole (51) is filled with a heat conductor (6). The electrode (5) is provided with a plurality of spaced light-emitting layers (7), and a second insulating and heat-conducting layer (8) is filled between two adjacent light-emitting layers (7). The second insulating and heat-conducting layer (8) is opposite to the second through hole (51), and the side of the second insulating and heat-conducting layer (8) facing the light-emitting layer (7) is opaque. Each of the light-emitting layers (7) corresponds to a red LED pixel unit (400), a green LED pixel unit (500), or a blue LED pixel unit (300). The second insulating and heat-conducting layer (8) located between the blue LED pixel unit (300) and the red LED pixel unit (400) is a right trapezoid in the longitudinal section. The second insulating and heat-conducting layer (8) located between the blue LED pixel unit (300) and the green LED pixel unit (500) is a right trapezoid in the longitudinal section. The hypotenuse of the right trapezoidal second insulating and heat-conducting layer (8) faces the blue LED pixel unit (300). The second insulating and heat-conducting layer (8) located between the green LED pixel unit (500) and the red LED pixel unit (400) is rectangular in the longitudinal section.

2. The Micro-LED display panel according to claim 1, characterized in that, The electrode (5) is a conductive reflective layer.

3. The Micro-LED display panel according to claim 1, characterized in that, The second insulating and thermally conductive layer (8) has a light-absorbing layer (9) on the side facing the green LED pixel unit (500).

4. The Micro-LED display panel according to claim 1, characterized in that, The second insulating and thermally conductive layer (8) has a light-absorbing layer (9) on the side facing the red LED pixel unit (400).

5. The Micro-LED display panel according to claim 1, characterized in that, The second insulating and thermally conductive layer (8) has a reflective layer (10) on the side facing the blue LED pixel unit (300).

6. The Micro-LED display panel according to claim 1, characterized in that, Each of the right-angled trapezoidal second insulating heat-conducting layers (8) has the same size, and each of the rectangular second insulating heat-conducting layers (8) has the same size. Half of the sum of the upper and lower bases of the right-angled trapezoidal second insulating heat-conducting layer (8) is the same as the width of the rectangular second insulating heat-conducting layer (8).

7. The Micro-LED display panel according to claim 1, characterized in that, The pad (3) is disposed on the side away from the substrate (1) that protrudes from the first insulating and heat-conducting layer (4). The electrode (5) is provided with a groove (52) on the side facing the first insulating and heat-conducting layer (4) that is adapted to the pad (3). The end of the pad (3) that protrudes from the first insulating and heat-conducting layer (4) is located in the groove (52).

8. The Micro-LED display panel according to claim 7, characterized in that, The resistivity of the pad (3) is smaller than that of the electrode (5).

9. A method for manufacturing a Micro-LED display panel, characterized in that, Includes the following steps: S1 provides a growth substrate (100), grows an epitaxial layer (200) on the growth substrate (100), etches the epitaxial layer (200) to form a plurality of spaced, protruding light-emitting layers (7) and a plurality of spaced, columnar light-emitting layers (7), the protruding light-emitting layers (7) correspond to blue LED pixel units (300), and the columnar light-emitting layers (7) correspond to red LED pixel units (400) or green LED pixel units (500); fills the space between adjacent light-emitting layers (7) with a liquid curable insulating and thermally conductive material until it is flush with the light-emitting layer (7), after the insulating and thermally conductive material is cured, prepares a whole layer of electrodes (5) on the light-emitting layer (7) and the insulating and thermally conductive material, opens holes in the electrodes (5) to form a second through hole (51) opposite to the insulating and thermally conductive material, and fills the second through hole (51) with thermally conductive material; S2 provides a substrate (1), makes an opening in the substrate (1) to form a first through hole (11), fills the substrate (1) and the first through hole (11) with a liquid curable insulating and thermally conductive material, so that the pads (3) on the substrate (1) are exposed, and waits for the insulating and thermally conductive material to cure. S3 The light-emitting layer (7) is mounted on the substrate (1) by flip-chip bonding. The electrode (5) is electrically connected to the pad (3). The insulating and thermally conductive material on the substrate (1) is attached to the electrode (5). The growth substrate (100) is peeled off.

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