A semiconductor water-cooling ring part machining process method

Abstract

The application discloses a kind of semiconductor water-cooled ring part machining process method, and semiconductor water-cooled ring part includes two parts of water-cooled ring main body and a cover plate, and the body is opened with annular groove feature, cover plate is placed in ring groove, and sealed water channel structure is formed by welding method, and processing method includes twice machining and once welding. Among them, first machining processes water-cooled ring main body and cover plate respectively, and annular groove feature is machined on the front and back of water-cooled ring main body respectively, and cover plate is assembled on both sides during welding, and the front and back are welded respectively, and second machining cuts open the part after welding in the center position of main body thickness direction using wire cutting method, to form two water-cooled ring parts.The process method of the application is welded on both sides, which can effectively reduce the welding deformation, and there is no need for straightening after welding, and two water-cooled rings can be formed after machining once, which can improve production efficiency.

Description

Technical Field

[0001] This invention relates to the technical field of water-cooled ring component processing methods, specifically a semiconductor water-cooled ring component processing method, mainly used for semiconductor water-cooled ring components with water channel grooves on only one side, which can effectively reduce welding deformation and improve production efficiency. Background Technology

[0002] Water-cooled rings are widely used components in semiconductor equipment, mainly consisting of a main body and a cover plate. Depending on equipment requirements, they can be configured with double-sided or single-sided water channels. For water-cooled rings with single-sided water channels, the conventional processing method is to first machine the main body and cover plate, then weld them together using methods such as argon arc welding, laser welding, and electron beam welding. Afterward, machining is performed to remove excess material and create features such as holes and grooves. During the welding process, argon arc welding, due to its high heat input and large filler volume, can cause significant deformation. Similarly, laser welding or electron beam welding, especially with long welds and large filler volumes, can also result in substantial deformation, often failing to meet dimensional accuracy requirements. Post-weld straightening processes are typically necessary for correction.

[0003] This invention proposes a processing method for semiconductor water-cooled ring components, which can effectively control welding deformation, reduce the impact of welding on the dimensional accuracy of the components, eliminate the need for post-weld straightening, and process multiple components simultaneously. Summary of the Invention

[0004] The purpose of this invention is to propose a processing method for semiconductor water-cooled ring parts, specifically applicable to the processing of semiconductor water-cooled ring parts with water channels on only one side. This method can effectively reduce welding deformation, eliminate the need for a straightening process after welding, and allow for the simultaneous processing of multiple parts, thereby improving production efficiency.

[0005] To achieve the above objectives, the technical solution adopted by the present invention is as follows:

[0006] A manufacturing process for a semiconductor water-cooled ring component is disclosed. The component comprises a water-cooled ring body and a cover plate. The body has an annular groove, and the cover plate is placed within the groove, forming a sealed water channel structure through welding. The manufacturing process includes two machining operations and one welding operation. The first machining operation processes the water-cooled ring body and the cover plate separately, machining two annular grooves on the body. The thickness of the body must be greater than twice the thickness of the component. During welding, the cover plate is inserted into both annular grooves of the water-cooled ring body, welding the front and back sides respectively. The second machining operation cuts the welded component at the center of the body's thickness direction using wire cutting to form two water-cooled ring components. The remaining features on the components, such as holes, grooves, and excess material, are then machined one by one.

[0007] During the welding process, double-sided welding effectively controls welding deformation. Furthermore, the part thickness is twice that of the product part, resulting in good overall rigidity and further reducing welding deformation, thus meeting the dimensional accuracy requirements of the part. No additional straightening process is needed after welding; the part is then cut into two pieces through a second machining process, and multiple pieces can be cut simultaneously, improving overall production efficiency.

[0008] The beneficial effects of this invention are:

[0009] 1. This invention is applicable to the processing of semiconductor water-cooled ring parts with water channels on one side. The process is simple and easy to implement.

[0010] 2. The present invention can weld parts with large thickness and can weld on both sides, which can effectively reduce welding deformation and reduce the impact of welding on the dimensional accuracy of the parts. It does not require post-weld straightening and can meet the dimensional accuracy requirements of the parts.

[0011] 3. The present invention does not require a straightening process during processing and can process multiple parts at the same time, which can improve the overall production efficiency. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the first machining of the water-cooling ring body and cover plate according to the present invention.

[0013] Figure 2 This is a cross-sectional view of the first machined water-cooling ring body and cover plate of the present invention.

[0014] Figure 3 This is a schematic diagram of the cover plate of the present invention.

[0015] Figure 4 This is a schematic diagram of the part cutting process according to the present invention. Detailed Implementation

[0016] To make the objectives, technical solutions, and advantages of this invention clearer, the following description is provided in conjunction with the appendix. Figure 1-4 The present invention will be further described in detail with reference to specific embodiments.

[0017] A stainless steel semiconductor water-cooling ring component with a water channel groove on one side includes a water-cooling ring body and a cover plate. The upper surface of the body has an annular groove, and the cover plate is placed in the annular groove and connected by welding to form a sealed water channel groove. The overall thickness of the component is 20mm. The component processing technology includes two machining processes and one welding process.

[0018] The first machining process involves machining the main body of the water-cooling ring and the cover plate separately. Two annular grooves are machined on both the upper and lower surfaces of the main body of the water-cooling ring, and the main body thickness is 45mm.

[0019] During welding, cover plates are installed in the upper and lower annular grooves of the water-cooled ring body, and the front and back sides are welded respectively. Laser welding is used for welding.

[0020] The second machining process involves cutting the welded part at the center of its thickness direction using wire cutting, such as... Figure 4 As shown, two water-cooled ring parts are formed, and then the remaining features on the parts, such as holes, grooves, and removal of excess material, are machined.

[0021] During the welding process, the part is quite thick, twice the thickness of the product part, resulting in good overall rigidity. Double-sided welding effectively reduces welding deformation, eliminating the need for post-weld straightening. The part undergoes a second machining process, cutting it from one piece into two, and multiple pieces can be cut simultaneously, improving overall production efficiency.

Claims

1. A manufacturing process for a semiconductor water-cooled ring component, the semiconductor water-cooled ring component comprising a water-cooled ring body and a cover plate, characterized in that, The main body has an annular groove feature, and the cover plate is placed inside the annular groove to form a sealed waterway structure by welding. The processing method includes two machining operations and one welding operation. The first machining operation processes the water-cooling ring body and the cover plate separately, and two annular groove features are machined on the water-cooling ring body. During welding, the two cover plates are assembled and welded. The second machining operation cuts the welded parts at the center position of the body thickness direction using wire cutting to form two water-cooling ring parts.

2. The semiconductor water-cooled ring component processing method according to claim 1, characterized in that: The first machining operation involves machining an annular groove on both the front and back sides of the water-cooled ring body. The thickness of the main body must be more than twice the thickness of the part.

3. The processing method for a semiconductor water-cooled ring component according to claim 1, characterized in that: During the welding process, cover plates are installed in the annular grooves on both sides of the water-cooled ring body, and the front and back sides are welded respectively. Double-sided welding effectively reduces welding deformation, and at this time the thickness of the part is twice the thickness of the product part, resulting in good overall rigidity and playing a positive role in controlling deformation. The welding method adopts laser welding or electron beam welding.

4. The processing method for a semiconductor water-cooled ring component according to claim 1, characterized in that: The second machining process involves first cutting the welded parts from the center of the body thickness direction using wire cutting to form two water-cooling ring parts, and then machining the holes and grooves on the parts one by one, removing the excess material.

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