Method for manufacturing a connection element for a friction-increasing connection of a component, and use of the connection element

Abstract

The present disclosure relates to an array of connecting elements comprising (i) a support structure, and (ii) a plurality of connecting elements, wherein each connecting element comprises a metal base having a first engagement surface on one side of the base and a second engagement surface on the opposite side of the base, wherein each engagement surface comprises hard particles fixed on the metal base by an adhesive layer; wherein each connecting element is associated with at least one retaining arm integrally linking the connecting element to at least one of (a) the support structure, and (b) one or more other connecting elements. The present disclosure also relates to a method for producing said array and a method for producing a plurality of individual connecting elements, and to the use of a connecting element made from said array for connecting first and second parts to be joined in machine, equipment and motor vehicle construction, in energy generation, or in microelectronic or micromechanical equipment.

Description

Technical Field

[0001] This disclosure relates to a method for manufacturing a connecting element for a friction-increasing connection of parts to be joined. Background Technology

[0002] Force-locked connections are frequently used to transmit force or torque in the construction of machines, equipment, and motor vehicles, as well as in all areas of energy generation. The magnitude of the forces that can be transmitted depends not only on the structural design but also primarily on the static friction values ​​(coefficients of static friction) of the surfaces of the connected components. Therefore, for such force-locked connections, efforts are made to provide friction-enhancing measures that allow the safe transmission of the maximum possible lateral forces and torques. Additionally, force-locked connections can also be referred to as non-positive connections or friction connections.

[0003] Friction-increasing interlayers are known to be used to increase holding force or torque, which can be transmitted in bolted and clamped connections. US 6,347,905 B1 discloses a connecting element for a friction-increasing, gapless, reversible connection of parts to be joined. This connecting element comprises a spring-elastic steel foil with granules of defined size on its surface, which are fixed to the spring-elastic foil by means of an adhesive phase. These granules are composed of a hard material, preferably diamond, cubic boron nitride, alumina, silicon carbide, or boron carbide. By using such a separate connecting element, the static coefficient of friction in a frictional connection can be increased.

[0004] Such connecting elements used for friction-increasing connections between two parts to be joined are typically produced by an electroless plating method. A metal substrate (e.g., steel foil) is coated in an electroless plating bath with hard particles and a metal binder. For this coating method, the metal substrate is placed on a suitable carrier or support to ensure a defined distance between different metal substrates and uniform coating of the metal substrate.

[0005] With the trend towards smaller and more compact products and the demand for extremely small connecting elements with diameters of only a few millimeters (e.g., for applications requiring friction enhancement in automotive electrification or the electronics industry), mounting has become extremely difficult or nearly impossible. Furthermore, production costs are very high because only a relatively small amount of metal substrate can be produced using a single batch of plating baths. This is due to the relatively large volume required for the mounting bracket compared to the size of the very small connecting element, resulting in inefficient use of the plating bath volume.

[0006] There is a need to improve the methods for manufacturing connecting elements for friction-increasing connections of components, so as to allow the manufacture of small-sized connecting elements with a diameter of only about 10 mm.

[0007] As used herein, the term “comprising” should also include the terms “substantially consisting of” and “consisting of”. Summary of the Invention

[0008] In a first aspect, this disclosure relates to an array of connection elements, the array comprising:

[0009] (i) Supporting structure, and

[0010] (ii) Multiple connecting elements, wherein each connecting element

[0011] Includes a metal substrate having a first bonding surface on one side of the substrate.

[0012] and a second mating surface on the opposite side of the substrate,

[0013] Each of the bonding surfaces includes rigid particles fixed to a metal substrate by an adhesive layer;

[0014] Each connecting element is associated with at least one retaining arm, which integrally links the connecting element to at least one of the following:

[0015] (a) Supporting structure, and

[0016] (b) One or more other connecting elements.

[0017] In another aspect, this disclosure also relates to a method for producing such an array of interconnecting elements, the method comprising:

[0018] (a) An array formed of metal sheets, wherein the array comprises:

[0019] (i) Supporting structure, and

[0020] (ii) Multiple metal substrates, each individual metal substrate being a metal substrate used for connecting elements.

[0021] Each metal substrate is associated with at least one retaining arm, which integrally links the metal substrate to at least one of the following:

[0022] (A) Supporting structure, and

[0023] (B) One or more other metal substrates;

[0024] And wherein the array has a first surface on one side of the array and a second surface on the opposite side of the array, and

[0025] (b) The hard particles are fixed to the first and second surfaces of the array using an adhesive layer.

[0026] To form an array of the connecting elements.

[0027] The methods disclosed in this article may also include:

[0028] (c) Connect each connecting element to the support structure or to...

[0029] One or more other connecting elements are separated to form multiple individual connecting elements.

[0030] In another aspect, this disclosure also relates to the use of connecting elements made of the arrays disclosed herein for connecting first and second components to be joined in the construction of machines, equipment and motor vehicles, in energy generation, or in microelectronic or micromechanical equipment.

[0031] Using the methods disclosed herein, very small connecting elements with diameters of only a few millimeters (e.g., at most 10 mm, 5 mm, or even smaller) can be produced. Connecting elements manufactured using the methods disclosed herein can be used for friction-increasing connections between two parts to be joined, such as in applications in automotive electrification or the electronics industry. The arrays disclosed herein can be placed on suitable carriers or supports to ensure defined spacing between different arrays and uniform coating of the arrays; however, for large-volume applications, mounting for very small connecting elements is economically impractical. Using the methods disclosed herein, connecting elements with diameters greater than 10 mm can also be produced, such as connecting elements with diameters of up to 20 mm, 30 mm, or larger.

[0032] By using the connecting elements produced by the methods disclosed herein, the static friction coefficient of the friction connection is increased. Attached Figure Description

[0033] This disclosure will be explained in more detail with reference to the accompanying drawings, in which...

[0034] Figures 1A to 1C The array of the present disclosure and the connecting elements made from the array are shown schematically;

[0035] Figures 2A to 2D The array of this disclosure and the connecting elements made from the array are schematically shown; and

[0036] Figure 3 A cross-sectional view of the connecting elements made from the array of this disclosure is shown schematically. Detailed Implementation

[0037] The individual connecting elements of the array disclosed herein include a metal substrate having a first bonding surface on one side of the substrate and a second bonding surface on the opposite side of the substrate. Each bonding surface includes rigid particles fixed to the metal substrate by an adhesive layer.

[0038] The hard particles are preferably composed of materials that do not chemically react with the parts to be joined or with the environmental medium under specific operating conditions. This material is preferably an inorganic material.

[0039] Preferably, the hard particles are selected from the group consisting of silicon carbide, aluminum oxide, boron carbide, cubic boron nitride, and diamond. More preferably, diamond is used as the hard particle.

[0040] The size of the hard particles is chosen such that the damage to the mating surface caused by the particles being pressed into it does not reach an unacceptable level. Preferably, this is ensured if the particle size is no greater than approximately three times the peak-valley height of the mating surface, where the peaks and valleys are created by machining the mating surface. An average particle size of 100 μm or less (d...) 50 This requirement is usually met. For example, an average particle size (d) of 10 μm, 25 μm, 35 μm, 55 μm, or 75 μm can be used. 50 Hard particles. In some embodiments, an average particle size (d) of 10 μm to 75 μm or 25 μm to 55 μm is used. 50 Hard particles. The average particle size can be measured by laser diffraction (Cilas, wet method).

[0041] The hard particles should have a narrow particle size range, wherein the dispersion around a given nominal diameter does not exceed about + / - 50%. In some embodiments, the dispersion around a given nominal diameter should not exceed about + / - 25%.

[0042] The number of hard particles per unit surface area of ​​the mating surface of the connecting element can be selected such that the normal force available for joining the parts together is sufficient to ensure that the particles are pressed into the surfaces of the parts to be joined. This is typically the case if the area percentage of the mating surface of the connecting element covered with hard particles is between 3% and 80%. The number of hard particles can be determined based on the average particle size (d...). 50 This allows you to select the percentage of the mating surface area of ​​the connecting element covered with hard particles. For example, for hard particles with an average particle size of 10 μm (d... 50 Approximately 8% to 20% of the mating surface of the connecting element may be covered with hard particles, for an average particle size of 25 μm (d). 50 This area percentage can be approximately 8% to 25% for an average particle size of 35 μm (d). 50 This area percentage can be approximately 10% to 30% for an average particle size of 55 μm (d). 50 This area percentage can be approximately 20% to 60%.

[0043] The metal substrate can be made of steel (e.g., non-alloy steel). High-alloy steel or stainless steel may also be used. Examples of non-alloy steel are C75S-1.1248 grade according to DIN EN 10132-4 or C60S-1.1211 grade according to DIN EN 10132-4.

[0044] Typically, the thickness of the metal substrate is from 0.01 mm to 1 mm. The thickness of the metal substrate is selected depending on the application. In some embodiments, the thickness of the metal substrate is at most 1.0 mm. In other embodiments, the thickness is at most 0.5 mm. In some other embodiments, the thickness is at most 0.2 mm, and in some other embodiments, the thickness is at most 0.1 mm.

[0045] The adhesive layer can be a metal adhesive layer or a polymer adhesive layer.

[0046] The polymer material of the polymer adhesive layer may be selected from the group consisting of: epoxy resin, acrylic resin, polyester, polyurethane, formaldehyde resin, polyvinyl acetate (PVAC) material, polyvinyl chloride (PVC) material, alkyd resin, silicone material, rubber material, fluoropolymer, and combinations thereof.

[0047] Preferably, the adhesive layer is a metallic adhesive layer. The metallic adhesive layer may contain nickel.

[0048] The thickness of the adhesive layer can be 2μm to 70μm, 5μm to 50μm, or 5μm to 30μm.

[0049] In some implementations, the thickness of the adhesive layer does not exceed the average particle size (d) of the hard particles. 50 ) 80%. In some other embodiments, the thickness of the adhesive layer does not exceed the average particle size (d) of the hard particles. 50 The thickness of the adhesive layer does not exceed 60% of the average particle size of the hard particles. In other embodiments, the thickness of the adhesive layer does not exceed the average particle size (d) of the hard particles. 50 The adhesive layer thickness can be at least 2 μm. Hard particles protrude from the adhesive layer. When the connecting element and the parts to be joined are in frictional engagement, the hard particles are pressed into the surface of the parts to be joined, thereby increasing the coefficient of friction of the connection.

[0050] The array of connecting elements disclosed herein includes (i) a support structure and (ii) a plurality of connecting elements. In this array, each connecting element is associated with at least one retaining arm, which integrally links the connecting element to at least one of: (a) the support structure and (b) one or more other connecting elements. In other words, the array is a structure consisting of a plurality of connecting elements that are directly linked to each other or to a common support structure via retaining arms. In this array, there are a plurality of individual retaining arms, and each connecting element is associated with at least one retaining arm. Through the retaining arms, individual connecting elements are linked to the support structure or one or more other connecting elements.

[0051] "Integrated linking" means that the array is made of a single metal sheet, and the support structure and multiple connecting elements are made of a single piece, wherein the connecting elements are integrally linked (i.e., integrally connected) to the support structure or one or more other connecting elements via retaining arms.

[0052] At least one individual connecting element is associated with at least one retaining arm, which integrally links the connecting element to the support structure. This ensures the integrity of the array. Typically, more than one individual connecting element is associated with at least one retaining arm, which integrally links the connecting element to the support structure.

[0053] For example, each connecting element may be associated with a retaining arm that integrally links the connecting element to the support structure. Individual connecting elements may also be associated with one or two or more other retaining arms that integrally link the connecting element to one or two or more other connecting elements. Each individual connecting element may also be associated with only one retaining arm that integrally links the connecting element to the support structure.

[0054] It is also possible that some individual connecting elements are associated with retaining arms that integrally link the connecting elements to the support structure, and further associated with one or more other retaining arms that integrally link the connecting elements to one or more other connecting elements, while some other individual connecting elements are associated with one retaining arm that integrally links the connecting elements to the support structure, and some other individual connecting elements are associated with one or more retaining arms that integrally link the connecting elements to one or more other connecting elements.

[0055] In some embodiments, the support structure may include or may be composed of connecting elements. In some embodiments, the support structure may include or may be composed of multiple connecting elements, each connecting element being associated with at least one retaining arm that integrally links the connecting element to one or more other connecting elements of the support structure.

[0056] The connecting element array disclosed herein has a first surface on one side of the array and a second surface on the opposite side of the array. Each retaining arm of the array has a cross-section perpendicular to the first and second surfaces of the array. The minimum cross-sectional area of ​​each individual retaining arm may be between 0.005 mm. 2 and 10mm 2 Between, or between 0.2mm 2 and 2mm 2 Between. "Minimum cross-sectional area" means that the cross-sectional area of ​​the cross section is measured along the length of the individual retaining arm, and the minimum cross-sectional area is the cross-sectional area of ​​the cross section with the minimum cross-sectional area along the length of the individual retaining arm.

[0057] Typically, the retaining arm has its smallest cross-sectional area at a midpoint between the two connecting elements integrally linked by the retaining arm. Near the connecting elements, the retaining arm usually has a larger cross-sectional area than at the midpoint, because it typically forms a smooth transition from the retaining arm to the connecting element. This smooth transition is advantageous for array fabrication.

[0058] The minimum width of each individual retaining arm, measured on the first or second surface of the array, may be between 0.1 mm and 10 mm, or between 0.2 mm and 5 mm, or between 0.3 mm and 3 mm. “Minimum width” means that the width of the individual retaining arm, measured on the first or second surface of the array, is measured along the length of the individual retaining arm, and the minimum width is the minimum width along the length of the individual retaining arm.

[0059] Typically, the retaining arm has its minimum width at a midpoint between the two connecting elements integrally linked by the retaining arm. Near the connecting elements, the retaining arm usually has a wider width than at the midpoint, as it typically forms a smooth transition from the retaining arm to the connecting element. This smooth transition is advantageous for array fabrication.

[0060] The width of each individual retaining arm, measured on the first or second surface of the array, can be selected according to the size of the connecting element. The array may have individual retaining arms, where each retaining arm has the same width, or different retaining arms may have different widths.

[0061] The length of each individual retaining arm, measured on either the first or second surface of the array, can be selected based on the size of the connecting elements. The array may have individual retaining arms, each with the same length, or different retaining arms with different lengths. The length of each individual retaining arm should not be too large so as not to unnecessarily increase the size of the array.

[0062] Typically, the length of an individual retaining arm is less than the diameter of the circumscribed circle of an individual connecting element, and the individual retaining arm is associated with that individual connecting element. The length of an individual retaining arm may, for example, be between 0.1 mm and 20 mm, or between 0.1 mm and 10 mm, or between 0.2 mm and 5 mm, or between 0.3 mm and 3 mm. In some embodiments, the length of some individual retaining arms may be the same as or greater than the diameter of the circumscribed circle of an individual connecting element, and the individual retaining arm is associated with that individual connecting element. The diameter of the circumscribed circle of an individual connecting element may, for example, be at most 10 mm, or at most 20 mm, or at most 30 mm, or greater.

[0063] Typically, the thickness of the arrays disclosed herein ranges from 0.04 mm to 1.2 mm.

[0064] The thickness of the array is selected based on the application of the connecting elements. In some embodiments, the array thickness is up to 1.2 mm. In other embodiments, the thickness is up to 0.5 mm. In some other embodiments, the thickness is up to 0.2 mm, and in some other embodiments, the thickness is up to 0.1 mm. The thickness of the metal strip can be 0.04 mm to 1.2 mm, or 0.1 mm to 1.0 mm, or 0.04 mm to 0.5 mm, or 0.1 mm to 0.5 mm, or 0.04 mm to 0.2 mm, or 0.1 mm to 0.2 mm, or 0.04 mm to 0.1 mm.

[0065] The thickness of an array is typically constant across the entire array, meaning that the thickness of the array is the same at every individual location within the array.

[0066] The support structure of the array disclosed herein may include at least one of an internal central element or an external peripheral element.

[0067] If the support structure includes an internal central element, such as a central annular element or a central polygonal element, then individual connecting elements are positioned around the internal central element, and each connecting element is associated with a retaining arm that integrally links the connecting element to at least one of the internal central element and one or more other connecting elements. At least one individual connecting element is associated with a retaining arm that integrally links the connecting element to the internal central element. Typically, more than one individual connecting element is associated with a retaining arm that integrally links the connecting element to the internal central element.

[0068] For example, each connecting element placed around the internal central element may be associated with a retaining arm that integrally links the connecting element to the internal central element. Individual connecting elements may also be associated with another retaining arm that integrally links the connecting element to another connecting element, and even more individually, with yet another retaining arm that integrally links the connecting element to another connecting element. Each individual connecting element may also be associated with only one retaining arm that integrally links the connecting element to the internal central element only. Preferably, each individual connecting element is associated with only one retaining arm that integrally links the connecting element to the internal central element only.

[0069] It is also possible that some individual connecting elements are associated with a retaining arm that integrally links the connecting element to the internal central element and with other retaining arms that integrally link the connecting element to one or more other connecting elements, while some other individual connecting elements are associated with only one retaining arm that integrally links the connecting element to the internal central element, and some other individual connecting elements are associated with one or more retaining arms that integrally link the connecting element to one or more other connecting elements without linking to the internal central element.

[0070] In some embodiments, the internal central element may include or may be composed of connecting elements. In some embodiments, the internal central element may include or may be composed of multiple connecting elements, each connecting element being associated with at least one retaining arm that integrally links the connecting element to one or more other connecting elements of the internal central element.

[0071] If the support structure includes an external peripheral element (such as an outer ring), individual connecting elements are placed inside the external peripheral element, for example, around the inner circumference of the external peripheral element, and each connecting element is associated with a retaining arm that integrally links the connecting element to at least one of the external peripheral element and one or more other connecting elements. At least one individual connecting element is associated with a retaining arm that integrally links the connecting element to the external peripheral element. Typically, more than one individual connecting element is associated with a retaining arm that integrally links the connecting element to the external peripheral element.

[0072] For example, each connecting element placed inside an external peripheral element may be associated with a retaining arm that integrally links the connecting element to the external peripheral element. Individual connecting elements may also be associated with another retaining arm that integrally links the connecting element to another connecting element, and even more individually, with yet another retaining arm that integrally links the connecting element to another connecting element. Each individual connecting element may also be associated with only one retaining arm that integrally links the connecting element to the internal central element only. Preferably, each individual connecting element is associated with only one retaining arm that integrally links the connecting element to the internal central element only.

[0073] It is also possible that some individual connecting elements are associated with retaining arms that integrally link the connecting elements to external peripheral elements and with other retaining arms that integrally link the connecting elements to one or more other connecting elements, while some other individual connecting elements are associated with only one retaining arm that integrally links the connecting elements to external peripheral elements, and some other individual connecting elements are associated with one or more retaining arms that integrally link the connecting elements to one or more other connecting elements without linking to external peripheral elements.

[0074] The support structure of the array disclosed herein may include an internal central element and external peripheral elements. If the support structure includes an internal central element and external peripheral elements, each connecting element is associated with at least one retaining arm that integrally links the connecting element to at least one of the following:

[0075] -Internal central component,

[0076] -External peripheral components, and

[0077] - One or more other connecting elements.

[0078] If the support structure comprises an inner central element and an outer peripheral element, individual connecting elements are placed around the inner central element and are positioned inside the outer peripheral element, for example, around the inner circumference of the outer peripheral element. Each connecting element is associated with at least one retaining arm that integrally links the connecting element to at least one of the inner central element, the outer peripheral element, and one or more other connecting elements. At least one individual connecting element is associated with at least one retaining arm that integrally links the connecting element to at least one of the inner central element and the outer peripheral element. Typically, more than one individual connecting element is associated with at least one retaining arm that integrally links the connecting element to at least one of the inner central element and the outer peripheral element.

[0079] For example, each connecting element placed around an inner central element and within an outer peripheral element may be associated with a retaining arm integrally linked to the inner central element, and may also be associated with another retaining arm integrally linked to the outer peripheral element. Individual connecting elements may also be associated with another retaining arm integrally linked to another connecting element, and even more individually, with yet another retaining arm integrally linked to another connecting element. It is also possible that each individual connecting element is associated with a retaining arm integrally linked to the inner central element, further associated with another retaining arm integrally linked to the outer peripheral element, and not further linked to one or more other connecting elements via the retaining arm. Preferably, each individual connecting element is associated with a retaining arm integrally linked to the inner central element, further associated with another retaining arm integrally linked to the outer peripheral element, and not further linked to one or more other connecting elements via the retaining arm.

[0080] It is also possible that some individual connecting elements are associated with a retaining arm that integrally links the connecting element to an internal central element and further with one or more other retaining arms that integrally link the connecting element to one or more other connecting elements; some other individual connecting elements are associated with a retaining arm that integrally links the connecting element to an internal central element; some other individual connecting elements are associated with a retaining arm that integrally links the connecting element to an external peripheral element and further with one or more other retaining arms that link to one or more other connecting elements; some other individual connecting elements are associated with a retaining arm that integrally links the connecting element to an external peripheral element; and some other individual connecting elements are associated with one or more retaining arms that integrally link the connecting element to one or more other connecting elements.

[0081] Each individual connecting element of the array disclosed herein may be a flat element. At least one or all individual connecting elements may also have outward extensions pointing from the plane of the connecting element. These extensions may be used for pre-assembling the connecting element, i.e., for engaging the connecting element to one of two parts to be frictionally joined by the connecting element. The outward extensions pointing from the plane of the connecting element are located outside the first and second engagement surfaces of the connecting element, and they are shaped to exhibit resilient or elastic properties, which enables the connecting element to be reversibly locked and thus pre-assembled on one of the two parts to be frictionally joined by the connecting element.

[0082] This document also discloses a method for producing an array of interconnecting elements as disclosed herein, the method comprising:

[0083] (a) An array formed of metal sheets, wherein the array comprises:

[0084] (i) Supporting structure, and

[0085] (ii) Multiple metal substrates, each individual metal substrate being a metal substrate used for connecting elements.

[0086] Each metal substrate is associated with at least one retaining arm, which integrally links the metal substrate to at least one of the following:

[0087] (A) Supporting structure, and

[0088] (B) One or more other metal substrates;

[0089] And wherein the array has a first surface on one side of the array and a second surface on the opposite side of the array, and

[0090] (b) The hard particles are fixed to the first and second surfaces of the array using an adhesive layer.

[0091] To form an array of the connecting elements.

[0092] The metal sheets used to form this array are typically metal plates with a thickness of 0.01 mm to 1 mm. These plates can be made of steel, such as non-alloy steel. High-alloy steel or stainless steel can also be used. Examples of non-alloy steel are C75S-1.1248 grade according to DIN EN 10132-4 or C60S-1.1211 grade according to DIN EN 10132-4.

[0093] An array of metal sheets is formed, comprising (i) a support structure and (ii) multiple metal substrates. Each individual metal substrate is a substrate for connecting elements. The array can be formed by mechanical methods (such as punching, stamping, or die-cutting), or by laser cutting, or by waterjet cutting, or by electrical discharge machining (EDM).

[0094] The resulting array has a first surface on one side of the array and a second surface on the opposite side of the array.

[0095] In the formed array, each metal substrate is associated with at least one retaining arm that integrally links the metal substrate to at least one of: (A) a support structure, and (B) one or more other metal substrates.

[0096] At least one individual metal substrate is associated with at least one retaining arm, which integrally links the metal substrate to the support structure. This ensures the integrity of the metal strip. Typically, more than one individual metal substrate is associated with at least one retaining arm, which integrally links the metal substrate to the support structure.

[0097] For example, each metal substrate may be associated with a retaining arm that integrally links the metal substrate to a support structure. Each metal substrate may also be associated with more than one retaining arm that integrally links the metal substrate to the support structure and to one or more other metal substrates. Each metal substrate may also be associated with one or more retaining arms that integrally link the metal substrate to one or more other metal substrates.

[0098] It is also possible that some individual metal substrates are associated with retaining arms that integrally link the metal substrates to the support structure and further with one or more other retaining arms that integrally link the metal substrates to one or more other metal substrates, while some other individual metal substrates are associated with only one retaining arm that integrally links the metal substrates to the support structure, and some other individual metal substrates are associated with one or more retaining arms that integrally link the metal substrates to one or more other metal substrates.

[0099] In some embodiments, the support structure may include or be composed of metal substrates, wherein each individual metal substrate is a metal substrate for connecting elements. In some embodiments, the support structure may include or be composed of multiple metal substrates, each metal substrate being associated with at least one retaining arm that integrally links the metal substrate to one or more other metal substrates of the support structure, and each individual metal substrate is a metal substrate for connecting elements.

[0100] Each individual retaining arm has a minimum width and minimum cross-sectional area as detailed above.

[0101] After the array is formed from the metal sheets, in the second method step, rigid particles are fixed to the first and second surfaces of the array using an adhesive layer. By fixing the rigid particles to the first and second surfaces of the array using the adhesive layer, a connecting element is formed from each metal substrate. By fixing the rigid particles to the first and second surfaces of the array using the adhesive layer, an array of connecting elements is formed.

[0102] The hard particles and adhesive layer are described in more detail above.

[0103] If the adhesive layer is a polymer adhesive layer, the rigid particles can be fixed to the first and second surfaces of the array by cathode dip coating using the polymer adhesive layer.

[0104] If the adhesive layer is a metallic adhesive layer, the hard particles can be fixed to the first and second surfaces of the array by electroless or electroplating methods using the metallic adhesive layer.

[0105] For example, the hard particles can be fixed to the first and second surfaces of the array using an external current-free (=chemical) electroplating method (also known as an electroplating method), preferably a nickel electroless plating method, using a chemical nickel plating bath with dispersed hard particles, and utilizing a metal binder layer. This type of electroplating method is commonly used in coating techniques. The chemical nickel layer can be hardened at temperatures up to about 400°C by heat treatment, resulting in improved adhesion to the array substrate and increased inherent hardness of the metal binder layer.

[0106] For this coating method using a chemical nickel plating bath with dispersed hard particles, the array is placed on a suitable carrier or support to ensure a defined distance between different arrays and uniform coating of the arrays, i.e., uniform thickness of the metal binder layer and uniform distribution of the hard particles.

[0107] After the hard particles are fixed to the first and second surfaces of the array using an adhesive layer, the array typically has a thickness of 0.04 mm to 1.2 mm.

[0108] The methods for producing arrays of interconnecting elements disclosed herein may also include:

[0109] (c) Connect each connecting element to the support structure or to...

[0110] One or more other connecting elements are separated to form multiple individual connecting elements.

[0111] After the array of connecting elements has been obtained by fixing the rigid particles to the first and second surfaces of the array using an adhesive layer, individual connecting elements can be separated from the support structure or from one or more other connecting elements.

[0112] Separation of a separate connecting element from the support structure or from one or more other connecting elements can be accomplished at the retaining arm associated with the separate connecting element or at the connecting element itself. For example, a separate connecting element can be separated from the support structure or from one or more other connecting elements at a location on the end of the retaining arm integrally linked to the connecting element (i.e., at the transition zone from the retaining arm to the connecting element). Separation of a separate connecting element from the support structure or from one or more other connecting elements is also possible at the location of the connecting element, for example, at a location up to 1 mm inward from the outer contour of the connecting element.

[0113] Preferably, each connecting element is separated from the support structure or from one or more other connecting elements at the retaining arm.

[0114] Typically, each connecting element is separated from the support structure or from one or more other connecting elements outside the transition zone from the retaining arm to the connecting element.

[0115] More preferably, each connecting element is separated from the support structure or from one or more other connecting elements at the position where the retaining arm has a minimum width.

[0116] Separation of individual connecting elements can be performed manually by breaking off the individual connecting element at the retaining arm, or by an automated process (such as punching or stamping), or by laser cutting, or by waterjet cutting, or by electrical discharge machining (EDM).

[0117] Multiple individual connecting elements are obtained by separating each connecting element from the support structure or from one or more other connecting elements.

[0118] After a single connecting element is separated from the support structure or from one or more other connecting elements, each of the plurality of connecting elements typically includes at least one portion of a retaining arm extending from the connecting element. The at least one portion of the retaining arm extending from the connecting element extends in the plane of the connecting element. The at least one portion of the retaining arm extending from the connecting element is produced by manufacturing the connecting elements from an array of connecting elements, wherein the connecting elements have been integrally linked to the support structure or another connecting element via at least one retaining arm, and from each of these at least one retaining arm, a portion remains attached to the connecting element after separation.

[0119] Compared to the size of the connecting element, the portion of the retaining arm extending from the connecting element is typically relatively small. Generally, the length of the portion of the retaining arm extending from the connecting element, after separation, is between 0.2% and 30% of the diameter of the circumcircle of the connecting element, preferably between 0.2% and 10%.

[0120] If a single connecting element is associated only with a retaining arm that integrally links the connecting element to the support structure or to another connecting element, then after the single connecting element is separated from the support structure or from another connecting element, the single connecting element consists only of a portion of the retaining arm extending from the connecting element.

[0121] If an individual connecting element is associated with more than one retaining arm that integrally links the connecting element to a support structure or to one or more other connecting elements, then after the individual connecting element is separated from the support structure or from one or more other connecting elements, the individual connecting element includes more than one portion of the retaining arm extending from the connecting element. This means that after the connecting element is separated from the support structure or from one or more other connecting elements, a portion of each retaining arm associated with the individual connecting element in the array will remain attached to the connecting element.

[0122] After the connecting element is separated from the support structure or from one or more other connecting elements, one or more portions of the retaining arm extending from the connecting element remain outside the first and second engagement surfaces of the connecting element.

[0123] After a separate connecting element is separated from the support structure or from one or more other connecting elements, each of the multiple connecting elements includes at least one separation edge. This separation edge is located at the portion of the retaining arm extending from the connecting element. This separation edge is a result of the separate connecting element from the support structure or from one or more other connecting elements. The separately separated connecting element includes a region located at the separation edge, wherein the metal substrate does not include hard particles fixed to each mating surface of the metal substrate by an adhesive layer; that is, this region is not coated with hard particles fixed by the adhesive layer.

[0124] The area located at the separation edge and not coated with hard particles held in place by the adhesive layer includes the separation edge. This separation edge is perpendicular to or substantially perpendicular to the first and second mating surfaces of the connecting element. The area located at the separation edge and not coated with hard particles held in place by the adhesive layer may also include portions of the first or second surface of the connecting element very close to the separation edge, as the coating on these portions may have peeled off due to separation of the connecting element from the support structure or from one or more other connecting elements. These portions of the area at the separation edge that are not coated with hard particles held in place by the adhesive layer and located on the first or second surface of the connecting element are relatively small compared to the total surface area of ​​the first or second surface of the connecting element. Typically, the total surface area of ​​the area located at the separation edge and not coated with hard particles held in place by the adhesive layer is at most 10%, or at most 5%, or at most 3%, or at most 2%, or at most 1% of the total surface area of ​​the first or second surface of the connecting element. Since the total surface area of ​​the area at the separation edge that is not coated with hard particles fixed by the adhesive layer is relatively small, it is ensured that the friction-enhancing function of the connecting element is not adversely affected.

[0125] The connecting element made from the array disclosed herein can be used in a method for frictionally connecting a first component and a second component to the connecting element, the method comprising:

[0126] Connecting elements made from the arrays disclosed herein are provided.

[0127] The hard particles of the first mating surface of the connecting element are pressed into the component mating surface of the first component, and

[0128] The hard particles on the second mating surface of the connecting element are pressed into the component mating surface of the second component.

[0129] This allows the first and second components to be frictionally connected to the connecting element.

[0130] Various embodiments of the connecting elements according to this disclosure are shown in the accompanying drawings.

[0131] Figures 1A to 1C The first embodiment of the array 1 of this disclosure and the connecting element 3 made of the array is schematically shown. Figure 1A A top view of array 1 of connecting elements is shown schematically. Figure 1B The connecting element 3, made of array 1, is shown schematically. Figure 1C It shows Figure 1A Details. Array 1 includes a support structure 2 and three connecting elements 3. The support structure 2 has a triangular shape. Each connecting element 3 is associated with a retaining arm 9, which integrally links the connecting element 3 to the support structure 2. Each connecting element 3 is a flat element. The support structure 2, the three retaining arms 9, and array 1 are also flat, with no extensions extending out of the plane of array 1. The support structure 2 is the internal central element of array 1. The support structure 2 may include a central hole 18. The central hole 18 reduces the surface area to be coated. The support structure may also be without a central hole.

[0132] Array 1 has a first surface 10 on one side of array 1 and a second surface 11 on the opposite side of the array. Figure 1A A top view of the first surface 10 of array 1 is also shown, which is identical to the top view of the second surface 11 of array 1. The thickness of array 1 is 0.16 mm. The thickness of the array is measured perpendicular to the first surface 10 and the second surface 11 of array 1 and is not shown in the figures. The thickness can also be from 0.04 mm to 1.2 mm. The minimum width 13 of each of the three retaining arms 9 measured on the first surface 10 or the second surface 11 of array 1 can be 0.5 mm (see figure). Figure 1B , Figure 1C The length 12 of each of the three retaining arms 9, measured on the first surface 10 or the second surface 11 of array 1, can be 0.5 mm (see...). Figure 1B , Figure 1C The diameter of the circumcircle 14 of the connecting element 3 can be 25mm.

[0133] Figure 3 schematically shown Figures 1A to 1C A cross-sectional view of the connecting element 3. Each connecting element 3 includes a metal substrate 4 having a first engagement surface 5 on one side of the substrate and a second engagement surface 6 on the opposite side of the substrate, wherein each engagement surface 5, 6 includes hard particles 7 fixed to the metal substrate 4 by an adhesive layer 8, which may be a metal adhesive layer 8.

[0134] In order to produce Figures 1A to 1C arrays, such as Figure 1A The array 1 shown is formed from a metal plate with a thickness of 0.1 mm or 0.01 mm to 1.0 mm. This metal plate includes a support structure 2 and three metal substrates 4, each of which serves as a base for connecting elements 3. Each metal substrate 4 is associated with a retaining arm 9 that integrally links the metal substrate 4 to the support structure 2. The array 1 has a first surface 10 on one side of the array and a second surface 11 on the opposite side. After forming the array 1, hard particles 7 are fixed to the first surface 10 and the second surface 11 of the array 1 using a metal adhesive layer 8 to form the array 1 of connecting elements 3. The hard particles 7 can be, for example, diamond particles, and can be fixed to the first surface 10 and the second surface 11 of the array 1 using an electroless plating method with the metal adhesive layer 8. Figure 1A and Figure 1C The diagram shows the array 1 after the step of fixing the hard particles 7 to the first surface 10 and the second surface 11 of the array 1 using a metal adhesive layer 8, and... Figure 1A and Figure 1C The array prior to fixing the hard particles to the first and second surfaces of the array using the metal adhesive layer 8 is also shown, namely, an array including the support structure 2 and a plurality of metal substrates 4, wherein each individual metal substrate 4 is a metal substrate for connecting the element 3.

[0135] In another method step, the three connecting elements 3 are separated from the support structure 2 at the position where the individual retaining arms 9 have a minimum width 13, to form three individual connecting elements 3. This separation can be performed manually by breaking off the individual connecting elements at the retaining arms, or by an automated process (such as punching or stamping), or by laser cutting, or by waterjet cutting, or by electrical discharge machining (EDM).

[0136] exist Figure 1BThe diagram shows a top view of one of the three connecting elements 3 after separation from the support structure 2. The connecting element 3 includes a portion of one of the retaining arms 9 extending from the connecting element 3. The connecting element 3 includes a separation edge 19. The separation edge 19 is located at the portion of the retaining arm 9 extending from the connecting element 3. The separation edge 19 is a result of the separation of the connecting element 3 from the support structure 2. The separated connecting element 3 includes a region located at the separation edge 19, wherein the metal substrate 4 does not include the hard particles 7 fixed to each mating surface 5, 6 of the metal substrate 4 by means of a metal adhesive layer 8; that is, this region is not coated with the hard particles 7 fixed by the metal adhesive layer 8. The region located at the separation edge 19 and not coated with the hard particles 7 fixed by the metal adhesive layer 8 includes the separation edge 19. The separation edge 19 is perpendicular to or substantially perpendicular to the first mating surface 5 and the second mating surface 6 of the connecting element 3 (e.g., Figure 1B A top view of connecting element 3 is shown. Figure 1B Also shown is a top view of the first mating surface 5 of the connecting element 3, which is the same as the top view of the second mating surface 6 of the connecting element 3. The area located at the separation edge 19 and not coated with hard particles fixed by the metal adhesive layer may also include portions of the first surface 5 or the second surface 6 of the connecting element, because these portions of the coating including the hard particles and the metal adhesive layer may have been peeled off due to the separation of the connecting element 3 from the support structure 2. Compared to the total surface area of ​​the first or second surface of the connecting element, these portions at the separation edge that are not coated with hard particles fixed by the metal adhesive layer and located on the first or second surface of the connecting element are relatively small and not... Figure 1B As shown in the diagram, because the total surface area of ​​the region at the separation edge not coated with hard particles fixed by the metal adhesive layer is relatively small, the friction-enhancing function of the connecting element is ensured not to be adversely affected.

[0137] The connecting element 3 may also include a hole 17 for inserting a bolt or screw shaft to mechanically engage the connecting element 3 with two parts to be frictionally joined. One of the two parts contacts the first surface 5 of the connecting element 3, while the other part contacts the second surface 6 of the connecting element 3.

[0138] Figures 2A to 2D A second embodiment of the array 1 of this disclosure and the connecting element 3 made of the array is schematically shown. Figure 2A A top view of array 1 of connecting elements is shown schematically. Figure 2B The connecting element 3, made of array 1, is shown schematically. Figure 2C and Figure 2D They are shown respectively Figure 2ADetails. Array 1 includes a support structure 2 and ten connecting elements 3. The support structure 2 includes an inner central element 15 and an outer peripheral element 16. The inner central element 15 and the outer peripheral element 16 are annular elements.

[0139] Each connecting element 3 is associated with a retaining arm 9, which integrally links the connecting element to the internal central element 15 of the support structure 2. Each connecting element 3 is also associated with another retaining arm 9, which integrally links the connecting element to the external peripheral element 16 of the support structure 2. Each connecting element 3 is a flat element. The support structure 2, the three retaining arms 9, and the array 1 are also flat, with no extensions extending out of the plane of the array 1. The internal central element 15 of the support structure 2 may include a central hole 18. The central hole 18 reduces the surface area to be coated. The support structure may also be without a central hole.

[0140] Array 1 has a first surface 10 on one side of array 1 and a second surface 11 on the opposite side of the array. Figure 2A A top view of the first surface 10 of array 1 is also shown, which is identical to the top view of the second surface 11 of array 1. The thickness of array 1 is 0.16 mm. The thickness of the array is measured perpendicular to the first surface 10 and the second surface 11 of array 1 and is not shown in the figures. The thickness can also be from 0.04 mm to 1.2 mm. The minimum width 13 of each retaining arm 9, measured on the first surface 10 or the second surface 11 of array 1, can be 0.6 mm (see figure). Figure 2B , Figure 2C , Figure 2D The length 12 of each retaining arm 9, measured on the first surface 10 or the second surface 11 of array 1, can be 0.8 mm respectively. Figure 2C ) and 0.4mm ( Figure 2D The diameter of the circumcircle 14 of the connecting element 3 can be 35mm.

[0141] Figure 3 The cross-sectional view of the connecting element 3 shown is also presented. Figures 2A to 2D A cross-sectional view of the connecting element 3. Each connecting element 3 includes a metal substrate 4 having a first engagement surface 5 on one side of the substrate and a second engagement surface 6 on the opposite side of the substrate, wherein each engagement surface 5, 6 includes hard particles 7 fixed to the metal substrate 4 by an adhesive layer 8, which may be a metal adhesive layer 8.

[0142] In order to produce Figures 2A to 2D arrays, such as Figure 2AThe array 1 shown is formed from a metal plate with a thickness of 0.1 mm or 0.01 mm to 1.0 mm. This metal plate includes a support structure 2 and ten metal substrates 4, each individual substrate serving as a connecting element 3. Each metal substrate 4 is associated with a retaining arm 9, which integrally links the metal substrate 4 to the inner central element 15 of the support structure 2. Each metal substrate 4 is also associated with another retaining arm 9, which integrally links the metal substrate 4 to the outer peripheral element 16 of the support structure 2. The array 1 has a first surface 10 on one side of the array and a second surface 11 on the opposite side of the array 1. After forming the array 1, hard particles 7 are fixed to the first surface 10 and the second surface 11 of the array 1 using a metal adhesive layer 8 to form the array 1 of connecting elements 3. The hard particles 7 can be, for example, diamond particles, and can be fixed to the first surface 10 and the second surface 11 of the array 1 using an electroless plating method with the metal adhesive layer 8. Figure 2A , Figure 2C and Figure 2D The diagram shows the array 1 after the step of fixing the hard particles 7 to the first surface 10 and the second surface 11 of the array 1 using a metal adhesive layer 8, and... Figure 2A , Figure 2C and Figure 2D The array prior to fixing the hard particles to the first and second surfaces of the array using the metal adhesive layer 8 is also shown, namely, an array including the support structure 2 and a plurality of metal substrates 4, wherein each individual metal substrate 4 is a metal substrate for connecting the element 3.

[0143] In another method step, the ten connecting elements 3 are separated from the inner central element 15 and outer peripheral element 16 of the support structure 2 at the position where the individual retaining arms 9 have a minimum width 13, to form ten individual connecting elements 3. This separation can be performed manually by breaking off the individual connecting elements at the retaining arms, or by an automated process (such as punching or stamping), or by laser cutting, or by waterjet cutting, or by electrical discharge machining (EDM).

[0144] exist Figure 2BThe diagram shows a top view of one of the ten connecting elements 3 after separation from the array 1. The connecting element 3 includes a portion of each of the two retaining arms 9 extending from the connecting element 3. The connecting element 3 includes two separation edges 19. The separation edges 19 are located at the portions of the retaining arms 9 extending from the connecting element 3. The separation edges 19 are the result of the separation of the connecting element 3 from the inner central element 15 and the outer peripheral element 16 of the support structure 2. The separated connecting element 3 includes two regions located at each of the two separation edges 19, wherein the metal substrate 4 does not include the hard particles 7 fixed to each mating surface 5, 6 of the metal substrate 4 using a metal adhesive layer 8; that is, these two regions are not coated with the hard particles 7 fixed by the metal adhesive layer 8. Each of the two regions located at the separation edge 19 and not coated with the hard particles 7 fixed by the metal adhesive layer 8 includes the separation edge 19. The separation edges 19 are perpendicular to or substantially perpendicular to the first mating surface 5 and the second mating surface 6 of the connecting element 3 (e.g., ...). Figure 2B A top view of connecting element 3 is shown. Figure 2B Also shown is a top view of the first mating surface 5 of the connecting element 3, which is the same as the top view of the second mating surface 6 of the connecting element 3. The area located at the separation edge 19 and not coated with hard particles fixed by the metal adhesive layer may also include portions of the first surface 5 or the second surface 6 of the connecting element, because these portions of the coating including the hard particles and the metal adhesive layer may have been peeled off due to the separation of the connecting element 3 from the support structure 2. Compared to the total surface area of ​​the first or second surface of the connecting element, these portions at the separation edge that are not coated with hard particles fixed by the metal adhesive layer and located on the first or second surface of the connecting element are relatively small and not... Figure 2B As shown in the diagram, because the total surface area of ​​the region at the separation edge not coated with hard particles fixed by the metal adhesive layer is relatively small, the friction-enhancing function of the connecting element is ensured not to be adversely affected.

[0145] The connecting element 3 may also include a hole 17 for inserting a bolt or screw shaft to mechanically engage the connecting element 3 with two parts to be frictionally joined. One of the two parts contacts the first surface 5 of the connecting element 3, while the other part contacts the second surface 6 of the connecting element 3.

[0146] The connecting elements fabricated from the arrays disclosed herein can be used to connect first and second components to be joined in machine, equipment, and motor vehicle constructions, in energy generation, or in microelectronic or micromechanical devices. The connecting elements fabricated from the arrays disclosed herein can be used to perform friction-increasing connections between first and second components to be joined in machine, equipment, and motor vehicle constructions, in energy generation, or in microelectronic or micromechanical devices. The connecting elements fabricated from the arrays disclosed herein can be used to perform friction-increasing, gapless, and / or reversible connections between first and second components to be joined in machine, equipment, and motor vehicle constructions, in energy generation, or in microelectronic or micromechanical devices.

[0147] In principle, the connecting elements disclosed herein can be used for any type of friction connection in the entire field of mechanical engineering.

[0148] For example, the connecting elements disclosed herein can be used for friction connections (such as bolted or clamped connections) between parts or components of a vehicle, or for friction connections in microelectronic or micromechanical equipment.

Claims

1. An array of connecting elements, the array comprising: (i) a support structure, and (ii) a plurality of connecting elements, wherein each connecting element comprises a metal base having a first bonding surface on one side of the base and a second bonding surface on the opposite side of the base, wherein each bonding surface comprises hard particles secured to the metal base by an adhesive layer; wherein each connecting element is associated with at least one retention arm that integrally links the connecting element to at least one of: (a) the support structure, and (b) one or more other connecting elements.

2. The array of claim 1, wherein the array has a first surface on one side of the array and a second surface on an opposite side of the array, and wherein each individual retention arm has a cross-section perpendicular to the first and second surfaces of the array, and wherein the minimum cross-sectional area of each individual retention arm is between 0.005 mm 2 and 10 mm 2 .

3. The array of claim 1, wherein the array has a first surface on one side of the array and a second surface on the opposite side of the array, and wherein the minimum width of each individual retention arm, measured on the first or second surface of the array, is between 0.1 mm and 10 mm.

4. The array of claim 1, wherein the thickness of the array is 0.04 mm to 1.2 mm.

5. The array of claim 1, wherein the support structure comprises at least one of an inner center element or an outer perimeter element.

6. The array of claim 1, wherein the support structure comprises an inner center element and an outer perimeter element, and wherein each connecting element is associated with at least one retention arm that integrally links the connecting element to at least one of: - the inner center element, - the outer perimeter element, and - one or more other connecting elements.

7. The array of claim 1, wherein each connecting element is a flat element.

8. The array of claim 1, wherein the hard particles are selected from the group consisting of silicon carbide, aluminum oxide, boron carbide, cubic boron nitride, and diamond.

9. A method for producing an array of connecting elements according to any one of claims 1 to 8, the method comprising; (a) forming an array from a metal sheet, wherein the array comprises: (i) a support structure, and (ii) a plurality of metal bases, each individual metal base being a metal base for a connecting element, wherein each metal base is associated with at least one retention arm that integrally links the metal base to at least one of: (A) the support structure, and (B) one or more other metal bases; and wherein the array has a first surface on one side of the array and a second surface on the opposite side of the array, and (b) securing hard particles to the first and second surfaces of the array with an adhesive layer to form the array of connecting elements.

10. The method of claim 9, further comprising: (c) separating each connecting element from the support structure or from one or more other connecting elements to form a plurality of individual connecting elements.

11. The method of claim 10, wherein each connecting element is separated from the support structure or from one or more connecting elements at the retention arm.

12. The method of claim 11, wherein each connecting element is separated from the support structure or from one or more connecting elements at a location where the holding arm has a minimum width.

13. The method of claim 11, wherein each individual connecting element of the plurality of connecting elements comprises at least one portion of a holding arm extending out of the connecting element.

14. The method of claim 13, wherein each individual connecting element of the plurality of connecting elements comprises at least one separation edge, wherein the separation edge is located at the portion of the holding arm extending out of the connecting element, and wherein the connecting element comprises an area located at the separation edge, wherein the metal base does not comprise hard particles secured with an adhesive layer on each joint surface of the metal base.

15. The method of claim 9, wherein the hard particles are secured with a metal adhesive layer on the first and second surfaces of the array by an electroless plating method or by an electroplating method.

16. Use of a connecting element made from the array according to any one of claims 1 to 8 for connecting first and second parts to be joined in machine, device and motor vehicle construction, in energy generation, or in microelectronic or micromechanical equipment.

Images