Crystal oscillator micro shock absorber and method of use

Abstract

The application discloses a crystal oscillator micro shock absorber, and relates to the technical field of crystal oscillator shock absorption, which comprises a bottom plate, a buffer plate and a frame body, the top of the buffer plate is connected with the bottom of the bottom plate, the top of the frame body is connected with the bottom plate, two dampers are arranged in the buffer plate at intervals, the damper comprises a damping cavity, a first piston block and a first piston rod, and damping liquid is arranged in the damping cavity. The application can guarantee the shock absorption effect of the crystal oscillator and reduce vibration. The application further discloses a use method of the crystal oscillator micro shock absorber.

Description

Technical Field

[0001] This invention relates to the field of crystal oscillator damping technology, and more specifically, to a miniature crystal oscillator damper. The invention also relates to a method of using this miniature crystal oscillator damper. Background Technology

[0002] A thermostatic crystal oscillator, or thermostatic crystal resonator for short, is a crystal oscillator that uses a thermostatic bath to keep the temperature of the quartz crystal resonator in the crystal oscillator constant, thereby minimizing the change in the output frequency of the oscillator caused by changes in ambient temperature. Temperature control is usually achieved by using a differential series amplifier composed of a thermistor "bridge".

[0003] Chinese patent application number 202120009204.7 (patent title: A high-heat-dissipation, shock-resistant, constant-temperature crystal oscillator) includes a base block. This base block facilitates effective connection with the upper housing via an adhesive layer and also provides good support for the underlying mechanism. A buffer plate, in conjunction with a movable groove, allows the buffer plate to move effectively within the groove. A support plate, connected and fixed to the lower end of the base block, provides auxiliary support for the lower end of the buffer plate. A connecting rod, effectively connected to the upper wall of the movable groove, and through its movable engagement with the buffer plate, provides good limiting and support for the buffer plate's movement, resulting in good cushioning and shock absorption between the movable groove and the buffer plate. A sliding ball allows for good auxiliary sliding between the buffer plate's sidewall and the inner wall of the movable groove as it moves within the groove. However, this patent relies solely on a spring for shock absorption. The spring itself reciprocates and does not effectively reduce shock; in fact, it may exacerbate vibrations.

[0004] Therefore, it is necessary to develop a miniature crystal oscillator that can effectively reduce the vibration of crystal oscillators. Summary of the Invention

[0005] The primary objective of this invention is to overcome the shortcomings of the aforementioned background technology and to provide a crystal oscillator miniature vibration damper.

[0006] A second objective of this invention is to provide a method of using such a crystal oscillator miniature vibration damper.

[0007] To achieve the aforementioned first objective, the technical solution of the present invention is as follows: a crystal oscillator miniature vibration damper, comprising a base plate, a buffer plate, and a frame, wherein the top of the buffer plate is connected to the bottom of the base plate via a first buffer spring, and the frame is connected to the top of the base plate via an adhesive layer, characterized in that:

[0008] Two dampers are spaced apart inside the buffer plate. Each damper includes a damping cavity, a first piston block located inside the damping cavity and slidably connected to the damping cavity, and a first piston rod with one end connected to the top of the first piston block and the other end passing through the buffer plate and connected to the bottom of the base plate.

[0009] The damping cavity contains damping fluid.

[0010] In the above technical solution, two piston cylinders are spaced apart between the two dampers, and a second piston block is provided in the piston cylinder; one end of the second piston rod is connected to the top of the second piston block, and the other end passes through the buffer plate and is connected to the bottom of the base plate; a second buffer spring is fitted on the second piston rod located between the buffer plate and the base plate.

[0011] The piston cylinder contains heat exchange fluid.

[0012] In the above technical solution, the two dampers are, from left to right, a left damper and a right damper, and the two piston cylinders are, from left to right, a left piston cylinder and a right piston cylinder.

[0013] In the above technical solution, a first annular tube and a second annular tube are provided inside the buffer plate;

[0014] The damping cavity is enclosed by the heat exchange cavity; the top side of the heat exchange cavity of the left damper is connected to the first pipe, and the bottom side is connected to the second pipe; the top side of the heat exchange cavity of the right damper is connected to the third pipe, and the bottom side is connected to the fourth pipe; the bottom of the left piston cylinder is connected to the fifth pipe; the bottom of the right piston cylinder is connected to the sixth pipe.

[0015] The first, third, and fifth pipes are all connected to the first annular pipe; the second, fourth, and sixth pipes are all connected to the second annular pipe.

[0016] In the above technical solution, a heat dissipation box is provided in the frame. The heat dissipation box includes a first connecting pipe located on the left side of the heat dissipation box, a second connecting pipe located on the left side of the heat dissipation box, and a heat exchange pipe located inside the heat dissipation box. One end of the heat exchange pipe is connected to the first connecting pipe, and the other end is connected to the second connecting pipe.

[0017] The bottom side of the left piston cylinder is connected to the seventh pipe, the bottom side of the right piston cylinder is connected to the eighth pipe, the seventh pipe is connected to the first connecting pipe, and the eighth pipe is connected to the second connecting pipe.

[0018] One-way valves are installed on the fifth, sixth, seventh, and eighth pipes. The flow direction of the one-way valve in the fifth pipe is towards the first annular pipe, the flow direction of the one-way valve in the sixth pipe is towards the right piston cylinder, the flow direction of the one-way valve in the seventh pipe is towards the left piston cylinder, and the flow direction of the one-way valve in the eighth pipe is towards the second connecting pipe.

[0019] In the above technical solution, the bottom of the base plate is connected to multiple limiting posts, and limiting blocks are provided on the limiting posts. The bottom of the buffer plate is located on the limiting blocks; multiple guide feet are provided at the bottom of the buffer plate.

[0020] The heat exchange chamber is located inside the heat insulation sleeve.

[0021] In the above technical solution, a heat-conducting plate is provided at the top of the heat dissipation box, heat dissipation fins are provided at the top of the heat dissipation box, and multiple heat-conducting columns are connected to the heat-conducting plate, with the heat-conducting columns connected to the heat dissipation fins.

[0022] One end of the heat exchange tube is connected to the first connecting tube, and the other end is connected to the second connecting tube after passing through the left end to the right end of the heat dissipation box multiple times.

[0023] In the above technical solution, a semiconductor cooling chip is provided on the outside of the heat dissipation box.

[0024] To achieve the second objective mentioned above, the technical solution of the present invention is as follows: a method for using a crystal oscillator miniature vibration damper, characterized by comprising the following steps:

[0025] Step 1: Install the crystal oscillator inside the housing;

[0026] Step 2: When the crystal oscillator is vibrated, the base plate applies pressure to the first and second buffer springs, causing the first and second buffer springs to contract. The base plate then pushes the first piston rod and the first piston block downwards in sequence. The damping fluid in the damping chamber dampens the first piston block, which in turn pushes the first piston rod upwards. The first and second buffer springs then push the base plate back to its original position, thus achieving vibration reduction for the crystal oscillator.

[0027] Step 3: When the crystal oscillator is vibrated, the base plate applies pressure to the first and second buffer springs. The base plate then pushes the second piston rod and the second piston block of the left piston cylinder downwards in sequence. The heat exchange liquid in the left piston cylinder is discharged into the first annular tube through the fifth pipe. This allows the heat exchange liquid inside the first annular tube to enter the heat exchange chamber of the left damper through the first pipe. The heat exchange liquid inside the first annular tube enters the heat exchange chamber of the right damper through the third pipe. The heat exchange liquid exchanges heat with the damping liquid in the damping chamber.

[0028] Step 4: When the crystal oscillator is vibrated, the base plate applies pressure to the first and second buffer springs. The base plate then pushes the second piston rod and the second piston block of the right piston cylinder downwards in sequence. The heat exchange liquid in the right piston cylinder is discharged into the second connecting pipe through the eighth pipe. The heat exchange liquid enters the heat exchange tube through the second connecting pipe. The temperature of the heat exchange liquid is conducted to the conductive liquid inside the heat sink. The heat of the conductive liquid is conducted to the heat dissipation fins through the heat conduction plate and heat conduction column. The heat is then dissipated through the heat dissipation fins.

[0029] Step 5: When the first and second buffer springs push the base plate upward;

[0030] The base plate drives the second piston rod and the second piston block of the left piston cylinder to move upward, and the heat exchange liquid in the heat exchange tube is drawn into the left piston cylinder through the first connecting pipe and the seventh pipe in sequence.

[0031] At the same time, the base plate drives the second piston rod and the second piston block of the right piston cylinder to move upward. The heat exchange liquid in the heat exchange chamber of the left damper is drawn into the second annular tube through the second pipe. The heat exchange liquid in the heat exchange chamber of the right damper is drawn into the second annular tube through the fourth pipe. The heat exchange liquid in the second annular tube is drawn into the right piston cylinder through the sixth pipe.

[0032] Step 6: Repeat steps 2-5 to complete the damping of the crystal oscillator and the heat exchange of the damping fluid.

[0033] In the above technical solution, in step 4, the semiconductor cooling chip dissipates heat from the conductive liquid.

[0034] Compared with the prior art, the present invention has the following advantages:

[0035] 1) In this invention, the crystal oscillator is installed inside the frame, and the frame is limited by an adhesive layer. When the crystal oscillator is vibrated, the base plate applies pressure to the first buffer spring and the second buffer spring. The first buffer spring and the second buffer spring contract, and the base plate pushes the first piston rod and the first piston block downward in sequence. The damping fluid in the damping cavity dampens the first piston block. The first piston block pushes the first piston rod upward. The first buffer spring and the second buffer spring push the base plate to reset, thereby achieving vibration reduction of the crystal oscillator and ensuring the vibration reduction effect of the crystal oscillator.

[0036] 2) This invention dissipates heat through a heat dissipation box and a heat exchange fluid, and exchanges heat with the damping fluid inside the damping cavity through the heat exchange fluid, so as to keep the oil seal temperature within a safe range and prevent problems such as excessive foaming and oil leakage. Attached Figure Description

[0037] Figure 1 This is a schematic diagram of the internal structure of the present invention.

[0038] Figure 2 This is a schematic diagram of the internal structure of the heat sink.

[0039] Figure 3 for Figure 1 Enlarged view of point A in the middle.

[0040] Figure 4 for Figure 1 Enlarged view of point B in the middle.

[0041] Figure 5 for Figure 1 Enlarged view of point C in the middle.

[0042] Figure 6 This is a schematic diagram of the external structure of the heat sink.

[0043] Among them, 1-base plate, 11-first buffer spring, 12-adhesive layer, 13-limiting post, 14-limiting block, 2-buffer plate, 21-first annular tube, 22-second annular tube, 23-guide foot, 3-frame, 31-heat dissipation box, 311-first connecting pipe, 312-second connecting pipe, 313-heat exchange tube, 314-heat conducting plate, 3141-heat conducting post, 315-heat dissipation fins, 32-semiconductor cooling chip, 4-damper, 41-damping cavity, 4 2-First piston block, 43-First piston rod, 44-Left damper, 45-Right damper, 46-Heat exchange chamber, 5-Piston cylinder, 51-Second piston block, 52-Second piston rod, 53-Second buffer spring, 54-Left piston cylinder, 55-Right piston cylinder, 61-First pipe, 62-Second pipe, 63-Third pipe, 64-Fourth pipe, 65-Fifth pipe, 66-Sixth pipe, 67-Seventh pipe, 68-Eighth pipe, 7-Heat insulation sleeve. Detailed Implementation

[0044] The embodiments of the present invention will be described in detail below with reference to the accompanying drawings, but these descriptions are not intended to limit the invention and are merely illustrative. The advantages of the present invention will become clearer and easier to understand through this description.

[0045] Referring to the accompanying drawings: A crystal oscillator miniature vibration damper includes a base plate 1, a buffer plate 2, and a frame 3. The top of the buffer plate 2 is connected to the bottom of the base plate 1 via a first buffer spring 11, and the frame 3 is connected to the top of the base plate 1 via an adhesive layer 12. Its characteristic is that:

[0046] Two dampers 4 are spaced apart inside the buffer plate 2. Each damper 4 includes a damping cavity 41, a first piston block 42 located inside the damping cavity 41 and slidably connected to the damping cavity 41, and a first piston rod 43 with one end connected to the top of the first piston block 42 and the other end passing through the buffer plate 2 and connected to the bottom of the base plate 1. A flow hole is provided on the first piston block 42.

[0047] The damping cavity 41 contains damping fluid.

[0048] Two piston cylinders 5 are spaced apart between the two dampers 4. A second piston block 51 is provided inside the piston cylinder 5. One end of the second piston rod 52 is connected to the top of the second piston block 51, and the other end passes through the buffer plate 2 and is connected to the bottom of the base plate 1. A second buffer spring 53 is fitted on the second piston rod 52 located between the buffer plate 2 and the base plate 1.

[0049] The piston cylinder 5 contains heat exchange fluid.

[0050] Both the first buffer spring 11 and the second buffer spring 53 have a damping effect on the crystal oscillator.

[0051] The two dampers 4 are, from left to right, left damper 44 and right damper 45, and the two piston cylinders 5 are, from left to right, left piston cylinder 54 and right piston cylinder 55.

[0052] The buffer plate 2 is provided with a first annular tube 21 and a second annular tube 22.

[0053] The damping cavity 41 is enclosed by the heat exchange cavity 46; the top side of the heat exchange cavity 46 of the left damper 44 is connected to the first pipe 61, and the bottom side is connected to the second pipe 62; the top side of the heat exchange cavity 46 of the right damper 45 is connected to the third pipe 63, and the bottom side is connected to the fourth pipe 64; the bottom of the left piston cylinder 54 is connected to the fifth pipe 65; the bottom of the right piston cylinder 55 is connected to the sixth pipe 66.

[0054] The first pipe 61, the third pipe 63 and the fifth pipe 65 are all connected to the first annular pipe 21; the second pipe 62, the fourth pipe 64 and the sixth pipe 66 are all connected to the second annular pipe 22.

[0055] The frame 3 is equipped with a heat dissipation box 31. The heat dissipation box 31 includes a first connecting pipe 311 located on the left side of the heat dissipation box 31, a second connecting pipe 312 located on the left side of the heat dissipation box 31, and a heat exchange pipe 313 located inside the heat dissipation box 31. One end of the heat exchange pipe 313 is connected to the first connecting pipe 311, and the other end is connected to the second connecting pipe 312. The heat dissipation box 31 can cool the heat exchange fluid, thereby ensuring the cooling effect on the damping fluid.

[0056] The bottom side of the left piston cylinder 54 is connected to the seventh pipe 67, the bottom side of the right piston cylinder 55 is connected to the eighth pipe 68, the seventh pipe 67 is connected to the first connecting pipe 311, and the eighth pipe 68 is connected to the second connecting pipe 312.

[0057] One-way valves are installed on the fifth pipe 65, the sixth pipe 66, the seventh pipe 67, and the eighth pipe 68. The flow direction of the one-way valve on the fifth pipe 65 is towards the first annular pipe 21, the flow direction of the one-way valve on the sixth pipe 66 is towards the right piston cylinder 55, the flow direction of the one-way valve on the seventh pipe 67 is towards the left piston cylinder 54, and the flow direction of the one-way valve on the eighth pipe 68 is towards the second connecting pipe 312. This achieves the circulation and cooling of the heat exchange fluid, ensuring the cooling effect on the damping fluid.

[0058] The bottom of the base plate 1 is connected to a plurality of limiting posts 13, and a limiting block 14 is provided on the limiting post 13. The bottom of the buffer plate 2 is located on the limiting block 14. A plurality of guide feet 23 are provided at the bottom of the buffer plate 2. The buffer plate 2 is located in the groove formed by the bottom of the base plate 1, the limiting post 13, and the limiting block 14.

[0059] The heat exchange chamber 46 is located inside the heat insulation sleeve 7. The heat insulation sleeve 7 ensures that the temperature of the damping fluid in the damping chamber 41 does not affect the outside environment, while the outside temperature does not affect the damping fluid.

[0060] A heat-conducting plate 314 is provided at the top of the heat dissipation box 31, and heat dissipation fins 315 are provided at the top of the heat dissipation box 31. Multiple heat-conducting columns 3141 are connected to the heat-conducting plate 314, and the heat-conducting columns 3141 are connected to the heat dissipation fins 315.

[0061] One end of the heat exchange tube 313 is connected to the first connecting tube 311, and the other end is connected to the second connecting tube 312 after passing through the left end to the right end of the heat dissipation box 31 multiple times.

[0062] A semiconductor cooling chip 32 is provided on the outside of the heat dissipation box 31.

[0063] The first annular pipe 21, the second annular pipe 22, the first pipe 61, the second pipe 62, the third pipe 63, the fourth pipe 64, the fifth pipe 65, the sixth pipe 66, the seventh pipe 67, and the eighth pipe 68 are all made of heat-insulating material to prevent the heat exchange fluid from being affected by the external temperature, which would cause the temperature to rise and reduce the cooling effect on the damping fluid.

[0064] A method of using a crystal oscillator miniature vibration damper, characterized by comprising the following steps:

[0065] Step 1: Install the crystal oscillator inside the housing 3;

[0066] Step 2: When the crystal oscillator is vibrated, the base plate 1 applies pressure to the first buffer spring 11 and the second buffer spring 53. The first buffer spring 11 and the second buffer spring 53 contract, and the base plate 1 pushes the first piston rod 43 and the first piston block 42 downward in sequence. The damping fluid in the damping cavity 41 dampens the first piston block 42. The first piston block 42 pushes the first piston rod 43 upward. The first buffer spring 11 and the second buffer spring 53 push the base plate 1 to reset, thereby achieving vibration reduction of the crystal oscillator.

[0067] Step 3: When the crystal oscillator is vibrated, the base plate 1 applies pressure to the first buffer spring 11 and the second buffer spring 53. The base plate 1 then pushes the second piston rod 52 and the second piston block 51 of the left piston cylinder 54 downward in sequence. The heat exchange liquid in the left piston cylinder 54 is discharged into the first annular tube 21 through the fifth pipe 65, so that the heat exchange liquid inside the first annular tube 21 enters the heat exchange chamber 46 of the left damper 44 through the first pipe 61. The heat exchange liquid inside the first annular tube 21 enters the heat exchange chamber 46 of the right damper 45 through the third pipe 63. The heat exchange liquid exchanges heat with the damping liquid in the damping chamber 41.

[0068] Step 4: When the crystal oscillator is vibrated, the base plate 1 applies pressure to the first buffer spring 11 and the second buffer spring 53. The base plate 1 then pushes the second piston rod 52 and the second piston block 51 of the right piston cylinder 55 downward in sequence. The heat exchange liquid in the right piston cylinder 55 is discharged into the second connecting pipe 312 through the eighth pipe 68. The heat exchange liquid enters the heat exchange tube 313 through the second connecting pipe 312. The temperature of the heat exchange liquid is conducted to the conductive liquid inside the heat dissipation box 31. The heat of the conductive liquid is conducted to the heat dissipation fins 315 through the heat conduction plate 314 and the heat conduction column 3141. The heat is then dissipated through the heat dissipation fins 315.

[0069] Step 5: When the first buffer spring 11 and the second buffer spring 53 push the base plate 1 upward;

[0070] The base plate 1 drives the second piston rod 52 and the second piston block 51 of the left piston cylinder 54 to move upward, and the heat exchange liquid in the heat exchange tube 313 is sequentially drawn into the left piston cylinder 54 through the first connecting pipe 311 and the seventh pipe 67.

[0071] At the same time, the base plate 1 drives the second piston rod 52 and the second piston block 51 of the right piston cylinder 55 to move upward. The heat exchange liquid in the heat exchange chamber 46 of the left damper 44 is drawn into the second annular pipe 22 through the second pipe 62. The heat exchange liquid in the heat exchange chamber 46 of the right damper 45 is drawn into the second annular pipe 22 through the fourth pipe 64. The heat exchange liquid in the second annular pipe 22 is drawn into the right piston cylinder 55 through the sixth pipe 66.

[0072] Step 6: Repeat steps 2-5 to complete the vibration damping of the crystal oscillator and the heat exchange of the damping fluid.

[0073] In step 4, the semiconductor cooling chip 32 dissipates heat from the conductive liquid.

[0074] Example 1

[0075] A method of using a crystal oscillator miniature vibration damper, characterized by comprising the following steps:

[0076] The crystal oscillator is installed inside the housing 3;

[0077] When the crystal oscillator is vibrated, the base plate 1 applies pressure to the first buffer spring 11 and the second buffer spring 53:

[0078] The first buffer spring 11 and the second buffer spring 53 contract, and the base plate 1 pushes the first piston rod 43 and the first piston block 42 downward in sequence. The damping fluid in the damping cavity 41 dampens the first piston block 42. The first piston block 42 pushes the first piston rod 43 upward, and the first buffer spring 11 and the second buffer spring 53 push the base plate 1 to reset, thereby achieving vibration reduction of the crystal oscillator.

[0079] At the same time, the base plate 1 pushes the second piston rod 52 and the second piston block 51 of the left piston cylinder 54 downward in sequence. The heat exchange liquid in the left piston cylinder 54 is discharged into the first annular pipe 21 through the fifth pipe 65, so that the heat exchange liquid inside the first annular pipe 21 enters the heat exchange chamber 46 of the left damper 44 through the first pipe 61. The heat exchange liquid inside the first annular pipe 21 enters the heat exchange chamber 46 of the right damper 45 through the third pipe 63. The heat exchange liquid exchanges heat with the damping liquid in the damping chamber 41.

[0080] Simultaneously, the base plate 1 sequentially pushes the second piston rod 52 and the second piston block 51 of the right piston cylinder 55 downwards. The heat exchange liquid in the right piston cylinder 55 is discharged into the second connecting pipe 312 through the eighth pipe 68. The heat exchange liquid enters the heat exchange tube 313 through the second connecting pipe 312. The temperature of the heat exchange liquid is conducted to the conductive liquid inside the heat dissipation box 31. The heat of the conductive liquid is conducted to the heat dissipation fins 315 through the heat conduction plate 314 and the heat conduction column 3141. The heat is then dissipated through the heat dissipation fins 315.

[0081] When the first buffer spring 11 and the second buffer spring 53 push the base plate 1 upward:

[0082] The base plate 1 drives the second piston rod 52 and the second piston block 51 of the left piston cylinder 54 to move upward, and the heat exchange liquid in the heat exchange tube 313 is sequentially drawn into the left piston cylinder 54 through the first connecting pipe 311 and the seventh pipe 67.

[0083] Simultaneously, the base plate 1 drives the second piston rod 52 and the second piston block 51 of the right piston cylinder 55 to move upward. The heat exchange fluid in the heat exchange chamber 46 of the left damper 44 is drawn into the second annular pipe 22 through the second pipe 62. The heat exchange fluid in the heat exchange chamber 46 of the right damper 45 is drawn into the second annular pipe 22 through the fourth pipe 64. The heat exchange fluid in the second annular pipe 22 is drawn into the right piston cylinder 55 through the sixth pipe 66. This completes the damping of the crystal oscillator and the heat exchange of the damping fluid.

[0084] Example 2

[0085] The difference between this embodiment and embodiment 1 is that a semiconductor cooling chip 32 is provided on the outside of the heat sink 31. When the heat exchange liquid in the heat exchange tube 313 is dissipated, the heat exchange liquid in the heat exchange tube 313 conducts heat to the conductive liquid in the heat sink 31. The semiconductor cooling chip 32 cools the conductive liquid in the heat sink 31, thereby increasing the rate at which the temperature of the heat exchange liquid is reduced.

[0086] All other unspecified parts belong to the prior art.

Claims

1. A crystal oscillator miniature vibration damper, comprising a base plate (1), a buffer plate (2), and a frame (3), wherein the top of the buffer plate (2) is connected to the bottom of the base plate (1) via a first buffer spring (11), and the frame (3) is connected to the top of the base plate (1) via an adhesive layer (12), characterized in that: Two dampers (4) are spaced apart inside the buffer plate (2). The damper (4) includes a damping cavity (41), a first piston block (42) located inside the damping cavity (41) and slidably connected to the damping cavity (41), and a first piston rod (43) with one end connected to the top of the first piston block (42) and the other end passing through the buffer plate (2) and connected to the bottom of the base plate (1). The damping cavity (41) contains damping fluid; Two piston cylinders (5) are spaced apart between the two dampers (4), and a second piston block (51) is provided inside the piston cylinder (5); one end of the second piston rod (52) is connected to the top of the second piston block (51), and the other end passes through the buffer plate (2) and is connected to the bottom of the base plate (1). A second buffer spring (53) is fitted on the second piston rod (52) located between the buffer plate (2) and the base plate (1); The piston cylinder (5) contains heat exchange fluid; The two dampers (4) are, from left to right, a left damper (44) and a right damper (45), and the two piston cylinders (5) are, from left to right, a left piston cylinder (54) and a right piston cylinder (55); The buffer plate (2) is provided with a first annular tube (21) and a second annular tube (22); The damping cavity (41) is enclosed by the heat exchange cavity (46); the top side of the heat exchange cavity (46) of the left damper (44) is connected to the first pipe (61), and the bottom side is connected to the second pipe (62); the top side of the heat exchange cavity (46) of the right damper (45) is connected to the third pipe (63), and the bottom side is connected to the fourth pipe (64); the bottom of the left piston cylinder (54) is connected to the fifth pipe (65); the bottom of the right piston cylinder (55) is connected to the sixth pipe (66). The first pipe (61), the third pipe (63) and the fifth pipe (65) are all connected to the first annular pipe (21); the second pipe (62), the fourth pipe (64) and the sixth pipe (66) are all connected to the second annular pipe (22).

2. The crystal oscillator miniature vibration damper according to claim 1, characterized in that: The frame (3) is provided with a heat dissipation box (31). The heat dissipation box (31) includes a first connecting pipe (311) located on the left side of the heat dissipation box (31), a second connecting pipe (312) located on the left side of the heat dissipation box (31), and a heat exchange pipe (313) located inside the heat dissipation box (31). One end of the heat exchange pipe (313) is connected to the first connecting pipe (311), and the other end is connected to the second connecting pipe (312). The bottom side of the left piston cylinder (54) is connected to the seventh pipe (67), the bottom side of the right piston cylinder (55) is connected to the eighth pipe (68), the seventh pipe (67) is connected to the first connecting pipe (311), and the eighth pipe (68) is connected to the second connecting pipe (312). One-way valves are provided on the fifth pipe (65), the sixth pipe (66), the seventh pipe (67), and the eighth pipe (68). The flow direction of the one-way valve of the fifth pipe (65) is to flow into the first annular pipe (21), the flow direction of the one-way valve of the sixth pipe (66) is to flow into the right piston cylinder (55), the flow direction of the one-way valve of the seventh pipe (67) is to flow into the left piston cylinder (54), and the flow direction of the one-way valve of the eighth pipe (68) is to flow into the second connecting pipe (312).

3. A crystal oscillator miniature vibration damper according to claim 2, characterized in that: The bottom of the base plate (1) is connected to a plurality of limiting posts (13), and a limiting block (14) is provided on the limiting post (13). The bottom of the buffer plate (2) is located on the limiting block (14); a plurality of guide feet (23) are provided on the bottom of the buffer plate (2). The heat exchange chamber (46) is located inside the heat insulation sleeve (7).

4. A crystal oscillator miniature vibration damper according to claim 3, characterized in that: A heat-conducting plate (314) is provided at the top of the heat dissipation box (31), and heat dissipation fins (315) are provided at the top of the heat dissipation box (31). Multiple heat-conducting columns (3141) are connected to the heat-conducting plate (314), and the heat-conducting columns (3141) are connected to the heat dissipation fins (315). One end of the heat exchange tube (313) is connected to the first connecting tube (311), and the other end is connected to the second connecting tube (312) after passing through the left end to the right end of the heat dissipation box (31) multiple times.

5. A crystal oscillator miniature vibration damper according to claim 4, characterized in that: A semiconductor cooling chip (32) is provided on the outside of the heat sink (31).

6. The method of using a crystal oscillator miniature vibration damper according to claim 5, characterized in that, Includes the following steps: Step 1: Install the crystal oscillator inside the housing (3); Step 2: When the crystal oscillator is vibrated, the base plate (1) applies pressure to the first buffer spring (11) and the second buffer spring (53). The first buffer spring (11) and the second buffer spring (53) contract, and the base plate (1) pushes the first piston rod (43) and the first piston block (42) downward in sequence. The damping fluid in the damping cavity (41) dampens the first piston block (42). The first piston block (42) pushes the first piston rod (43) upward. The first buffer spring (11) and the second buffer spring (53) push the base plate (1) to reset, thereby achieving vibration reduction of the crystal oscillator. Step 3: When the crystal oscillator is vibrated, the base plate (1) applies pressure to the first buffer spring (11) and the second buffer spring (53). The base plate (1) pushes the second piston rod (52) and the second piston block (51) of the left piston cylinder (54) downward in sequence. The heat exchange liquid in the left piston cylinder (54) is discharged into the first annular tube (21) through the fifth pipe (65). The heat exchange liquid in the first annular tube (21) enters the heat exchange chamber (46) of the left damper (44) through the first pipe (61). The heat exchange liquid in the first annular tube (21) enters the heat exchange chamber (46) of the right damper (45) through the third pipe (63). The heat exchange liquid exchanges heat with the damping liquid in the damping chamber (41). Step 4: When the crystal oscillator is vibrated, the base plate (1) applies pressure to the first buffer spring (11) and the second buffer spring (53). The base plate (1) pushes the second piston rod (52) and the second piston block (51) of the right piston cylinder (55) downward in sequence. The heat exchange liquid in the right piston cylinder (55) is discharged into the second connecting pipe (312) through the eighth pipe (68). The heat exchange liquid enters the heat exchange tube (313) through the second connecting pipe (312). The temperature of the heat exchange liquid is conducted to the conductive liquid inside the heat sink (31). The heat of the conductive liquid is conducted to the heat dissipation fins (315) through the heat conduction plate (314) and the heat conduction column (3141). The heat is dissipated through the heat dissipation fins (315). Step 5: When the first buffer spring (11) and the second buffer spring (53) push the base plate (1) upward; The base plate (1) drives the second piston rod (52) and the second piston block (51) of the left piston cylinder (54) to move upward, and the heat exchange liquid in the heat exchange tube (313) is sucked into the left piston cylinder (54) through the first connecting pipe (311) and the seventh pipe (67) in sequence; At the same time, the base plate (1) drives the second piston rod (52) and the second piston block (51) of the right piston cylinder (55) to move upward. The heat exchange liquid in the heat exchange chamber (46) of the left damper (44) is drawn into the second annular pipe (22) through the second pipe (62). The heat exchange liquid in the heat exchange chamber (46) of the right damper (45) is drawn into the second annular pipe (22) through the fourth pipe (64). The heat exchange liquid in the second annular pipe (22) is drawn into the right piston cylinder (55) through the sixth pipe (66). Step 6: Repeat steps 2-5 to complete the vibration damping of the crystal oscillator and the heat exchange of the damping fluid.

7. The method of using a crystal oscillator miniature vibration damper according to claim 6, characterized in that: In step 4, the semiconductor cooling chip (32) dissipates heat from the conductive liquid.

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