A structure, packaging mechanism and packaging process of a solid-state relay

Abstract

The present invention relates to a structure, packaging mechanism and packaging process of a solid-state relay, including: a housing; a circuit board; arranged in the housing; a heat sink, attached to the circuit board; a sealing glue, injected into the housing and covering the circuit board; a radiator, arranged on the sealing glue; a fan, arranged on the housing; wherein the radiator is provided with a heat sink foot; the heat sink foot passes through the sealing glue and contacts the heat sink; a first space is formed in the radiator; a second space is formed in the heat sink foot; the first space and the second space are interconnected, and a medium is stored in the first space and the second space; the first space expands, and accordingly, the upper end of the radiator contacts the fan; the first space contracts, and accordingly, the upper end of the radiator is away from the fan. The problem that the heat sink base is large in size in the existing solution, the solid-state relay is further enlarged after the fan is installed, and the solid-state relay cannot be installed in some special positions is solved.

Description

Technical Field

[0001] The invention relates to the field of solid-state relays, and in particular to a structure, a packaging mechanism and a packaging process of a solid-state relay. Background Art

[0002] The input end of the solid-state relay uses a tiny control signal to directly drive a high-current load. The solid-state relay is mainly composed of a housing, a circuit, and a heat sink. The circuit is installed in the housing, and potting glue is injected into the housing to submerge the circuit. The heat sink is installed at the lower end of the housing, and the heat sink is connected to the circuit. When the solid-state relay is working, the heat dissipation of the circuit is completed through the heat sink.

[0003] In order to ensure the heat dissipation of the heat dissipation base, the heat dissipation base is larger in size and has several heat sinks formed on it. The heat is transferred to the heat dissipation base and dissipated through the heat sinks. In order to improve the heat dissipation capacity of the heat dissipation base, a fan is installed on the heat dissipation base to speed up the heat dissipation.

[0004] Since the size of the heat sink is large, the solid-state relay is further enlarged after the fan is installed. The solid-state relay cannot be installed in some special locations. If the fan is removed or the size of the heat sink is reduced, the heat dissipation capacity of the solid-state relay will be reduced.

[0005] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of the present disclosure, and therefore may include information that does not constitute the prior art known to ordinary technicians in the field. Summary of the invention

[0006] In view of the shortcomings of the above-mentioned prior art, the purpose of the present invention is to provide a structure, packaging mechanism and packaging process of a solid-state relay to solve the problems in the prior art that the heat dissipation base is large in size, the solid-state relay is further enlarged after the installation of a fan, and the solid-state relay cannot be installed in some special positions.

[0007] To achieve the above object, the technical solution of the present invention is as follows:

[0008] A structure of a solid state relay;

[0009] The invention comprises: a housing; a circuit board; a heat sink, which is attached to the circuit board; a sealing glue, which is injected into the housing and covers the circuit board; a heat sink, which is arranged on the sealing glue; a fan, which is arranged on the housing; wherein the heat sink is provided with a heat sink foot; the heat sink foot passes through the sealing glue and contacts the heat sink; a first space is formed in the heat sink; a second space is formed in the heat sink foot; the first space and the second space are connected to each other, and a medium is stored in the first space and the second space; the first space expands, and accordingly, the upper end of the heat sink contacts the fan; the first space contracts, and accordingly, the upper end of the heat sink is away from the fan;

[0010] An expansion area is formed at the upper end of the radiator, and a thin sheet is arranged in the expansion area; the thin sheet is connected to the radiator;

[0011] The lower surface of the sheet forms protrusions; the protrusions are arranged in parallel around the middle of the sheet; and the protrusions extend from the middle of the sheet to the edge of the sheet.

[0012] A packaging mechanism for a solid-state relay comprises: a packaging table for placing the solid-state relay; a first clamping device for moving a housing; a second clamping device for moving a circuit board; a third clamping device for moving a heat sink; a pressing mechanism for pressing down the heat sink; a fourth clamping device for moving and pressing down the heat sink; a glue injection mechanism for injecting sealing glue into the housing; a mounting mechanism for moving a fan and fixing the fan on the housing; a turntable relatively arranged on two sides of the packaging table; wherein the first clamping device, the third clamping device and the fourth clamping device are sequentially arranged around the turntable on one side; and the second clamping device, the pressing mechanism, the glue injection mechanism and the mounting mechanism are sequentially arranged around the turntable on the other side.

[0013] A further technical solution is that the pressing mechanism includes: a third mechanical arm; a pressure frame, which is arranged at the driving end of the third mechanical arm; a connecting rod mechanism, which is relatively rotatably arranged on the pressing frame; a moving block, which is movably arranged on the pressing frame; a pressing block, which is arranged on the moving block; a first power device, which is arranged on the pressing frame; wherein the first power device drives the connecting rod mechanism to rotate; adjacent connecting rod mechanisms are meshed with each other; and the connecting rod mechanism is movably connected to the moving block.

[0014] A further technical solution is that the glue injection mechanism includes: a first robotic arm; a glue injection bracket, which is arranged at the driving end of the first robotic arm; a movable bar, which is movably arranged on the glue injection bracket; a glue injection tube, which is arranged on the movable bar; a second power device, which is arranged on the glue injection bracket; wherein the second power device drives the movable bar; the glue injection tube is connected to a sealing glue source; and the glue injection tube outlet is formed on the side of the glue injection tube.

[0015] A further technical solution is that the installation mechanism includes: a second mechanical arm; a nailing bracket, which is arranged at the driving end of the second mechanical arm; a clamp, which is arranged on the nailing bracket; a screw driving mechanism, which is relatively arranged on both sides of the clamp on the nailing bracket; wherein the screw driving mechanism is connected to the screw source, and the clamp clamps the fan.

[0016] A further technical solution is that the packaging table includes: a table portion; a first mounting slot for placing a shell; a second mounting slot for placing a fan; a connector for connecting a power supply; wherein the first mounting slot and the second mounting slot are provided on the table portion; and the connector is electrically connected to an input end of the fan.

[0017] A packaging process for a solid-state relay comprises the following steps:

[0018] Simulation steps: simulate the operation of the circuit board to obtain the thermal data of the circuit board, and determine the shape, area, thickness and fitting position of the heat sink based on the thermal data;

[0019] Analysis steps: determine the shape, size and location of the heat sink feet according to the shape, area and fitting position of the heat sink; determine the amount of medium according to the heat data; determine the capacity of the second space according to the amount of medium;

[0020] Calculation steps: determine the injection amount of the sealing glue according to the data of the housing, the data of the circuit board, the data of the heat sink, the data of the heat sink foot and the data of the radiator;

[0021] Determine the expansion degree of the first space and the second space according to the amount of the medium, the capacity of the first space and the second space, and determine the installation height between the fan and the radiator;

[0022] Lamination steps: placing the housing on a packaging platform; placing the circuit board on the housing; laminating the heat sink on the circuit board and pressing down the heat sink;

[0023] Glue injection steps: place the radiator on the heat sink; inject sealing glue into the shell;

[0024] Installation steps: Place the fan in the housing and secure it; start the fan to solidify the sealant.

[0025] A further technical solution is that, in the glue injection step: when the sealing glue submerges the heat sink pin, the heat sink is pressed down.

[0026] Compared with the prior art, the beneficial technical effects of the present invention are as follows: (1) The heat is absorbed by the vaporization of the medium to form steam, and the steam is liquefied and refluxed through the fan, so that a reciprocating cycle is formed to improve the heat dissipation capacity of the radiator; the radiator dissipates heat through the vaporization of the medium and the liquefaction of the steam, and there is no need to increase the size of the radiator to increase the heat dissipation area; the size of the radiator is smaller; at the same time, in order to ensure that the medium is close to the circuit board, the radiator needs to be installed above the circuit board. The radiator is placed in the sealing glue, which further reduces the volume of the structure of the solid-state relay and realizes the miniaturization of the solid-state relay.

[0027] (2) After the first clamping device adsorbs the shell, the turntable on one side rotates to move the first clamping device close to the packaging station, and the first clamping device places the shell in the first mounting groove; after the second clamping device adsorbs the circuit board, the turntable on the other side rotates to move the second clamping device close to the packaging station, and the second clamping device places the shell in the shell; after the third clamping device adsorbs the heat sink, the turntable on one side rotates to move the third clamping device close to the packaging station, and the third clamping device attaches the heat sink to the circuit board; the turntable on the other side rotates to move the pressing mechanism close to the packaging station, and the pressing mechanism presses down the heat sink The heat sink is firmly attached to the circuit board and the groove of the heat sink is finalized; the fourth clamping device places the heat sink on the heat sink after adsorbing the heat sink, and the glue injection mechanism injects sealing glue into the shell. When the sealing glue submerges the heat sink pins, the fourth clamping device presses down the heat sink and the heat sink pins are embedded in the grooves of the heat sink; the glue injection mechanism continues to inject sealing glue into the shell until the sealing glue submerges the side of the heat sink; the installation mechanism clamps the fan and places it on the shell, and fixes the fan to the shell with screws; the fan is connected to the power supply through the connector, and the fan is started to accelerate the flow of air near the sealing glue to complete the curing of the sealing glue.

[0028] (3) If the installation height between the fan and the radiator is relatively low, after the first space and the second space expand and the thin sheet contacts the fan, the first space and the second space will continue to expand, and the thin sheet will be squeezed and ruptured, causing leakage in the first space and the second space; if the installation height between the fan and the radiator is relatively high, after the first space and the second space expand, the thin sheet cannot contact the fan, and the fan's heat dissipation capacity for the thin sheet is weakened, causing the circulation speed of the gasification and liquefaction of the medium in the first space and the second space, and thus weakening the heat dissipation capacity of the solid-state relay; through the expansion degree of the first space and the second space, it can be known that after the first space and the second space expand, the position of the thin sheet makes the thin sheet contact the fan and is not squeezed.

[0029] (4) Since the glue injection tube is located between adjacent support ribs and the outlet of the glue injection tube is not close to the middle position in the shell, the sealing glue flows out from the outlet of the glue injection tube and flows from the edge of the shell to the middle position in the shell; this will cause the liquid level of the sealing glue near the edge of the shell to be higher, and the liquid level of the sealing glue near the middle position in the shell to be lower; when the liquid level of the sealing glue submerges the heat sink foot, a cavity will be formed near the middle position of the lower surface of the radiator, and the volume of the cavity will be further increased after the sealing glue is cooled; the existence of the cavity reduces the thermal conductivity between the sealing glue and the radiator, and the sealing glue cannot firmly fix and restrict the radiator; when the liquid level of the sealing glue submerges the heat sink foot, the fourth clamping device applies a certain pressure to the radiator, so that the heat sink foot is pressed into the groove of the heat sink; the heat sink foot and the radiator move downward a certain distance, and the radiator squeezes out the cavity, so that the lower surface of the radiator contacts the sealing glue. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 A schematic structural diagram of a solid-state relay according to a first embodiment of the present invention is shown.

[0031] Figure 2 The schematic diagram of the structure of the housing of the first embodiment of the present invention is shown.

[0032] Figure 3 A schematic top view of a packaging mechanism of a solid-state relay according to a second embodiment of the present invention is shown.

[0033] Figure 4 FIG. 4 is a schematic top view of a packaging station according to a second embodiment of the present invention.

[0034] Figure 5 A right side schematic diagram of the press frame position of the second embodiment of the present invention is shown.

[0035] Figure 6 A front view schematic diagram showing the position of the glue injection bracket according to the second embodiment of the present invention.

[0036] Figure 7 A left schematic diagram showing the position of the nailing bracket according to the second embodiment of the present invention is shown.

[0037] Markings in the accompanying drawings: 1, packaging table; 10, turntable; 101, shell; 1011, support rib; 102, circuit board; 103, heat sink; 104, sealing glue; 105, radiator; 1051, thin sheet; 106, fan; 107, cooling foot; 108, first space; 11, table; 12, first mounting groove; 13, second mounting groove; 14, joint; 2, first clamping device; 3, second clamping device; 4, third clamping device; 5, pressing mechanism; 51, pressing frame; 52, connecting rod mechanism; 521. first rod body; 522. second rod body; 523. first tooth shape; 524. second tooth shape; 53. moving block; 54. pressing block; 55. first power device; 56. third mechanical arm; 6. fourth clamping device; 7. glue injection mechanism; 71. first mechanical arm; 72. glue injection bracket; 73. moving bar; 74. glue injection tube; 75. second power device; 8. installation mechanism; 81. second mechanical arm; 82. nailing bracket; 83. clamping claw; 84. screw driving mechanism; 85. third power device. DETAILED DESCRIPTION

[0038] In order to make the purpose, technical scheme and advantages of the present invention clearer, the device proposed by the present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. According to the following description, the advantages and features of the present invention will be clearer. It should be noted that the accompanying drawings adopt a very simplified form and use non-precise proportions, which are only used to conveniently and clearly assist in explaining the purpose of the embodiments of the present invention. In order to make the purpose, features and advantages of the present invention more obvious and easy to understand, please refer to the accompanying drawings. It should be noted that the structure, proportion, size, etc. illustrated by the accompanying drawings of this specification are only used to match the content disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the limiting conditions for the implementation of the present invention, so they have no technical substantive significance. Any modification of the structure, change of the proportional relationship or adjustment of the size, without affecting the effect that the present invention can produce and the purpose that can be achieved, should still fall within the scope of the technical content disclosed by the present invention.

[0039] First embodiment:

[0040] Figure 1 A schematic structural diagram of a solid-state relay according to a first embodiment of the present invention is shown. Figure 2 FIG. 1 is a schematic diagram showing the structure of the housing of the first embodiment of the present invention. Figure 1 and Figure 2 As shown, the present invention discloses a structure of a solid-state relay.

[0041] The structure of the solid-state relay includes: a housing 101, a circuit board 102 arranged in the housing 101, a heat sink 103 attached to the circuit board 102, a sealing glue 104 injected into the housing 101 and covering the circuit board 102, a heat sink 105 arranged on the sealing glue 104, and a fan 106 arranged at the upper end of the housing 101.

[0042] The inner surface of the housing 101 is provided with supporting ribs 1011 in the up-down direction. The supporting ribs 1011 play a role in strengthening the structure of the housing 101. At the same time, the supporting ribs 1011 abut against the circuit board 102 and the heat sink 105 to restrict the circuit board 102 and the heat sink 105. There is a gap between adjacent supporting ribs 1011, and the gap is connected between the circuit board 102 and the heat sink 105. The sealing glue 104 flows into the gap between the circuit board 102 and the heat sink 105. After the sealing glue 104 is cured, the supporting ribs 1011 are placed on the sealing glue 104, and the supporting ribs 1011 restrict the sealing glue 104 to fix the sealing glue 104 in the housing 101.

[0043] A heat sink foot 107 is provided at the lower end of the heat sink 105. The lower end of the heat sink foot 107 passes through the sealing glue 104 and contacts the heat sink 103. A first space 108 is formed in the heat sink 105. A second space is formed in the heat sink foot 107. The lower end of the first space 108 and the upper end of the second space are connected to each other, and the first space 108 and the second space store medium.

[0044] A groove is formed on the upper surface of the heat sink 103 , and the lower end of the heat sink foot 107 passes through the sealing glue 104 and is placed in the groove of the heat sink 103 .

[0045] When the solid-state relay is working, the circuit board 102 generates heat, which is transferred to the medium through the heat sink 103 and the heat sink foot 107 in sequence. The medium is vaporized by the heat, forming steam that rises to the first space 108. The steam in the first space 108 and the second space gradually increases, and the pressure in the first space 108 increases and expands. Accordingly, the upper end of the heat sink 105 contacts the fan 106.

[0046] The fan 106 starts to dissipate heat from the upper end of the radiator 105. The steam in the first space 108 is cooled and liquefied to form a medium, which falls back into the second space. The medium in the first space 108 and the second space gradually increases, and the pressure in the first space 108 decreases and shrinks. Accordingly, the upper end of the radiator 105 moves away from the fan 106.

[0047] An expansion area is formed at the upper end of the radiator 105, and a thin sheet 1051 is disposed in the expansion area. The thin sheet 1051 is connected to the radiator 105. The thickness of the thin sheet 1051 is relatively thin, and the thin sheet 1051 will be deformed under the influence of the pressure in the first space 108.

[0048] When the pressure in the first space 108 increases, the sheet 1051 bulges upward and deforms to expand the first space 108. When the sheet 1051 deforms to a certain extent, the sheet 1051 contacts the fan 106, and the fan 106 directly acts on the sheet 1051 to accelerate the heat dissipation of the sheet 1051 and prevent the pressure in the first space 108 from being too high.

[0049] When the pressure in the first space 108 decreases, the thin sheet 1051 bulges downward and deforms, completing the contraction of the first space 108. The thin sheet 1051 gradually moves away from the fan 106, and the heat dissipation capacity of the thin sheet 1051 gradually returns to normal.

[0050] Protrusions are formed on the lower surface of the sheet 1051. The protrusions are arranged in parallel around the middle of the sheet 1051. The protrusions extend from the middle of the sheet 1051 to the edge of the sheet 1051. The medium vaporizes to form steam that rises and adheres to the lower surface of the sheet 1051. The steam cools and liquefies and accumulates on the protrusions, flows along the protrusions to the edge of the sheet 1051, and then drips downward.

[0051] The protrusions accelerate the accumulation and flow of steam on the sheet 1051 , thereby speeding up the medium circulation process. The heat on the sheet 1051 can be efficiently dissipated through the fan 106 .

[0052] Compared with the profile radiator, the heat dissipation efficiency of the radiator 105 of the present application is higher. The heat is absorbed by the vaporization of the medium to form steam, and the steam is liquefied and refluxed through the fan 106, so that a reciprocating cycle is formed to improve the heat dissipation capacity of the radiator 105. The radiator 105 completes the heat dissipation through the vaporization of the medium and the liquefaction of the steam. There is no need to increase the size of the radiator 105 to increase the heat dissipation area. The size of the radiator 105 is made smaller. At the same time, in order to ensure that the medium is close to the circuit board 102, the radiator 105 needs to be installed above the circuit board 102. The radiator 105 is placed in the sealing glue 104, which further reduces the volume of the structure of the solid-state relay and realizes the miniaturization of the solid-state relay.

[0053] Second embodiment:

[0054] Figure 3 A schematic top view of a packaging mechanism of a solid-state relay according to a second embodiment of the present invention is shown. Figure 4 FIG. 4 is a schematic top view of a packaging station according to a second embodiment of the present invention. Figure 5 A right side schematic diagram of the press frame position of the second embodiment of the present invention is shown. Figure 6 A front view schematic diagram showing the position of the glue injection bracket according to the second embodiment of the present invention. Figure 7 The left side schematic diagram of the position of the nailing bracket of the second embodiment of the present invention is shown. Figure 1-Figure 7 As shown:

[0055] The packaging mechanism of the solid-state relay includes: a packaging table 1 for placing the solid-state relay, a first clamping device 2 for moving the shell 101, a second clamping device 3 for moving the circuit board 102, a third clamping device 4 for moving the heat sink 103, a pressing mechanism 5 for pressing down the heat sink 103, a fourth clamping device 6 for moving and pressing down the heat sink 105, a glue injection mechanism 7 for injecting sealing glue 104 into the shell 101, a mounting mechanism 8 for moving the fan 106 and fixing the fan 106 on the shell 101, and a turntable 10 relatively arranged on both sides of the packaging table 1.

[0056] Exemplarily, the turntable 10 is an electric rotary worktable. There are two sets of turntables 10, which are respectively located on the left and right sides of the packaging station 1.

[0057] The first clamping device 2, the third clamping device 4 and the fourth clamping device 6 are sequentially arranged around the turntable 10 on one side. The second clamping device 3, the pressing mechanism 5, the glue injection mechanism 7 and the installation mechanism 8 are sequentially arranged around the turntable 10 on the other side.

[0058] The first clamping device 2 places the shell 101 on the packaging table 1, the second clamping device 3 places the circuit board 102 in the shell 101, the third clamping device 4 fits the heat sink 103 on the circuit board 102, the pressing mechanism 5 presses down the heat sink 103, the fourth clamping device 6 places the radiator 105 on the heat sink 103, the glue injection mechanism 7 injects sealing glue 104 into the shell 101, when the sealing glue 104 submerges the cooling foot 107, the fourth clamping device 6 presses down the radiator 105, the heat sink 103 buckles the radiator 105, the glue injection mechanism 7 continues to inject sealing glue 104 into the shell 101, when the sealing glue 104 submerges the side of the radiator 105, the glue injection mechanism 7 stops injecting sealing glue 104 into the shell 101, the installation mechanism 8 places the fan 106 on the shell 101 and fixes it with screws, the fan 106 starts to accelerate the flow of air near the sealing glue 104, and completes the curing of the sealing glue 104.

[0059] The packaging platform 1 includes: a platform portion 11, a first mounting groove 12 for placing the housing 101, a second mounting groove 13 for placing the fan 106, and a connector 14 for connecting a power source.

[0060] The first mounting groove 12 and the second mounting groove 13 are formed on the upper surface of the platform 11. The connector 14 is electrically connected to the input end of the fan 106. The connector 14 is disposed on the platform 11.

[0061] Before the solid-state relay is packaged, the fan 106 is placed in the second installation groove 13, and the input end of the fan 106 is inserted into the connector 14, and the connector 14 is not connected to the power supply at this time.

[0062] The packaging table 1 is mounted on a linear module, and the linear module moves the packaging table 1 to between the turntables 10 .

[0063] The first vibration plate and the label separator are respectively arranged around the turntable 10 on one side. The housing 101 and the heat sink 105 are respectively placed in each first vibration plate, and the housing 101 and the heat sink 105 are loaded through the first vibration plate. The heat sink 103 is attached to the material belt in parallel, and the heat sink 103 can be separated from the material belt by the label separator, so that the third clamping device 4 can take it conveniently.

[0064] A second vibration plate is arranged at the edge of the other side of the turntable 10. The circuit board 102 is placed in the second vibration plate, and the circuit board 102 is loaded through the second vibration plate.

[0065] The first clamping device 2, the second clamping device 3, the third clamping device 4 and the fourth clamping device 6 are identical or similar in structure, and all adopt the structure of the fourth mechanical arm, the clamping bracket and the suction cup. The suction cup is installed on the clamping bracket. The clamping bracket is installed at the driving end of the fourth mechanical arm.

[0066] The selection of the fourth robot arm, the structural dimensions of the clamping bracket, and the number, specifications, and positions of the suction cups will be adjusted accordingly according to different clamping targets.

[0067] The pressing mechanism 5 includes: a third mechanical arm 56, a pressing frame 51 arranged at the driving end of the third mechanical arm 56, a connecting rod mechanism 52 relatively rotatably arranged on the pressing frame 51, a moving block 53 movably arranged on the pressing frame 51, a pressing block 54 arranged on the moving block 53 and a first power device 55 arranged on the pressing frame 51.

[0068] The first power device 55 drives the connecting rod mechanism 52 to rotate. Adjacent connecting rod mechanisms 52 are meshed with each other. The connecting rod mechanism 52 is movably connected to the moving block 53.

[0069] The connecting rod mechanism 52 includes a first rod body 521 and a second rod body 522 that are movably connected to each other. A first tooth shape 523 is set at the position where the first rod body 521 is movably connected to the press frame 51. The first tooth shapes 523 on adjacent first rod bodies 521 are meshed with each other. A second tooth shape 524 is set at the position where the second rod body 522 is movably connected to the moving block 53. The second tooth shapes 524 on adjacent second rod bodies 522 are meshed with each other. The driving end of the first power device 55 is connected to the position where the first rod body 521 is movably connected to the press frame 51.

[0070] The lower surface of the lower pressing block 54 is provided with a protrusion. The position of the protrusion of the lower pressing block 54 corresponds to the position of the groove of the heat sink 103. When the lower pressing block 54 presses down the heat sink 103, the protrusion of the lower pressing block 54 is placed in the groove of the heat sink 103.

[0071] The first power device 55 drives the first rod 521 to rotate downward, the first rod 521 drives the second rod 522 to move downward, the second rod 522 drives the moving block 53 and the pressing block 54 to move downward, the pressing block 54 presses the heat sink 103 downward, and the protrusion of the pressing block 54 presses down into the groove of the heat sink 103.

[0072] The first power device 55 drives the first rod 521 to rotate upward, the first rod 521 drives the second rod 522 to move upward, the second rod 522 drives the moving block 53 and the pressing block 54 to move upward, the pressing block 54 moves away from the heat sink 103, and the protrusion of the pressing block 54 is out of the groove of the heat sink 103.

[0073] The heating positions of circuit boards 102 of different specifications are different, and the shape of the heat sink 103 changes according to the circuit boards 102 of different specifications. By replacing the pressing block 54, the pressing mechanism 5 can adapt to different heat sinks 103.

[0074] The glue injection mechanism 7 includes: a first mechanical arm 71, a glue injection bracket 72 arranged at the driving end of the first mechanical arm 71, a moving bar 73 arranged on the glue injection bracket 72 for moving in the up and down directions, a glue injection tube 74 arranged on the moving bar 73 and a second power device 75 arranged on the glue injection bracket 72.

[0075] The driving end of the second power device 75 is provided with a gear, and the gear meshes with the moving bar 73. The second power device 75 drives the moving bar 73 through the gear. The upper end of the glue injection tube 74 is connected to the sealing glue source. The outlet of the glue injection tube 74 is formed at the lower end of the side of the glue injection tube 74.

[0076] The first mechanical arm 71 moves the glue injection tube 74 into the housing 101, and the glue injection tube 74 is located between adjacent support ribs 1011. The second power device 75 drives the moving bar 73 and the glue injection tube 74 to move downward, so that the outlet of the glue injection tube 74 is located between the circuit board 102 and the heat sink 105. The sealing glue 104 flows into the space between the circuit board 102 and the heat sink 105 through the glue injection tube 74. In this process, the second power device 75 drives the moving bar 73 and the glue injection tube 74 to move upward to prevent the lower end of the glue injection tube 74 from being immersed in the sealing glue 104.

[0077] The installation mechanism 8 includes: a second mechanical arm 81, a nailing bracket 82 arranged at the driving end of the second mechanical arm 81, a clamping claw 83 arranged on the nailing bracket 82, and a screwing mechanism 84 arranged on both sides of the clamping claw 83 on the nailing bracket 82. The screwing mechanism 84 is connected to a screw source, and the clamping claw 83 clamps the fan 106.

[0078] Exemplarily, the screw driving mechanism 84 is an automatic screw locking machine. The screw driving mechanism 84 is air blowing feeding. Exemplarily, the clamping jaw 83 is a clamping jaw cylinder. The third power device 85 is provided on the nailing bracket 82. Exemplarily, the third power device 85 is a cylinder. The screw driving mechanism 84 is provided on both sides of the driving end of the third power device 85.

[0079] The second mechanical arm 81 drives the clamping claw 83 and the screw driving mechanism 84 to approach the fan 106, and the clamping claw 83 clamps the fan 106 and places the fan 106 on the housing 101. The third power device 85 drives the screw driving mechanism 84 to descend, and the screw driving mechanism 84 screws the screws into the fan 106 and the housing 101 to fix the fan 106 on the housing 101, and the clamping claw 83 releases the fan 106.

[0080] After the first clamping device 2 adsorbs the housing 101, the turntable 10 on one side rotates to move the first clamping device 2 close to the packaging station 1, and the first clamping device 2 places the housing 101 in the first mounting groove 12. After the second clamping device 3 adsorbs the circuit board 102, the turntable 10 on the other side rotates to move the second clamping device 3 close to the packaging station 1, and the second clamping device 3 places the housing 101 in the housing 101. After the third clamping device 4 adsorbs the heat sink 103, the turntable 10 on one side rotates to move the third clamping device 4 close to the packaging station 1, and the third clamping device 4 attaches the heat sink 103 to the circuit board 102. The turntable 10 on the other side rotates to move the pressing mechanism 5 close to the packaging station 1, and the pressing mechanism 5 presses down the heat sink 103, firmly attaches the heat sink 103 to the circuit board 102, and shapes the groove of the heat sink 103. After the fourth clamping device 6 adsorbs the radiator 105, it places the radiator 105 on the heat sink 103, and the glue injection mechanism 7 injects the sealing glue 104 into the housing 101. When the sealing glue 104 submerges the cooling pin 107, the fourth clamping device 6 presses down the radiator 105, and the cooling pin 107 is embedded in the groove of the heat sink 103. The glue injection mechanism 7 continues to inject the sealing glue 104 into the housing 101 until the sealing glue 104 submerges the side of the radiator 105. The mounting mechanism 8 clamps the fan 106 and places it on the housing 101, and fixes the fan 106 to the housing 101 with screws. The fan 106 is connected to the power supply through the connector 14, and the fan 106 is started to accelerate the flow of air near the sealing glue 104, and complete the curing of the sealing glue 104.

[0081] Third embodiment:

[0082] The packaging process of solid-state relays includes the following steps:

[0083] Simulation steps: simulate the operation of the circuit board 102 to obtain the thermal data of the circuit board 102, and determine the shape, area, thickness and fitting position of the heat sink 103 according to the thermal data.

[0084] In the simulation step, by simulating the circuit board 102, the heat distribution of the circuit board 102 can be obtained, and the heat dissipation area and the non-heat dissipation area can be delineated on the circuit board 102. A temperature value is set, and the area reaching the set temperature is delineated as the heat dissipation area, and the area below the set temperature is delineated as the non-heat dissipation area.

[0085] The shape of the heat sink 103 is similar to the shape of the heat dissipation area, and the area of ​​the heat sink 103 is larger than the area of ​​the heat dissipation area, so that the heat sink 103 can completely cover the heat dissipation area. When the heat sink 103 is attached to the circuit board 102, it needs to avoid the components on the circuit board 102.

[0086] Analysis steps: determine the shape, size and location of the heat sink 107 according to the shape, area and attachment location of the heat sink 103. Determine the amount of medium according to the heat data. Determine the capacity of the second space according to the amount of medium.

[0087] In the analysis step, the data of the heat sink pin 107 needs to be determined according to the data of the heat sink 103. The shape and area of ​​the lower surface of the heat sink pin 107 are the same as the shape and area of ​​the heat sink 103. The capacity of the second space is determined according to the amount of the medium, and the capacity of the second space is changed by changing the height of the heat sink pin 107.

[0088] Calculation steps: Determine the injection amount of the sealing glue 104 according to the data of the housing 101 , the data of the circuit board 102 , the data of the heat sink 103 , the data of the heat sink pin 107 and the data of the heat sink 105 .

[0089] By calculating the above data, it can be known how much space is left in the housing 101 for accommodating the sealing glue 104 after the circuit board 102 , the heat sink 103 , the heat sink pins 107 and the heat sink 105 are placed in the housing 101 .

[0090] The expansion degree of the first space 108 and the second space is determined according to the amount of the medium and the capacities of the first space 108 and the second space, and the installation height between the fan 106 and the heat sink 105 is determined.

[0091] If the installation height between the fan 106 and the radiator 105 is relatively short, after the first space 108 and the second space expand, the thin sheet 1051 contacts the fan 106, and the first space 108 and the second space continue to expand, and the thin sheet 1051 will be squeezed and ruptured, causing leakage between the first space 108 and the second space.

[0092] If the installation height between the fan 106 and the radiator 105 is high, after the first space 108 and the second space expand, the thin film 1051 cannot contact the fan 106, and the heat dissipation ability of the fan 106 to the thin film 1051 is weakened, which makes the circulation speed of the gasification and liquefaction of the medium in the first space 108 and the second space increase, and the heat dissipation ability of the solid-state relay is weakened.

[0093] The expansion degree of the first space 108 and the second space can be used to determine the position of the sheet 1051 after the first space 108 and the second space expand, so that the sheet 1051 contacts the fan 106 and is not squeezed.

[0094] Laminating step: the housing 101 is placed on the packaging platform 1. The circuit board 102 is placed on the housing 101. The heat sink 103 is laminated on the circuit board 102 and pressed down.

[0095] The circuit board 102 and the heat sink 105 are fixed in the housing 101 of the solid-state relay not by screws, but by sealing glue 104 .

[0096] After the heat sink 103 is attached to the circuit board 102, the circuit board 102 is placed at the bottom of the housing 101 by pressing the heat sink 103 downward. At the same time, the heat sink 103 is completely attached to the circuit board 102 to prevent the edge of the heat sink 103 from warping and wrinkling.

[0097] Glue injection step: placing the heat sink 105 on the heat sink 103 and injecting sealing glue 104 into the housing 101 .

[0098] In the glue injection step: when the sealing glue 104 submerges the heat sink pin 107 , the heat sink 105 is pressed down.

[0099] There are two injection processes in the injection step. During the first injection, the fourth clamping device 6 only places the heat sink 105 on the heat sink 103, and the heat sink foot 107 shields the groove of the heat sink 103 to prevent the sealing glue 104 from flowing into the groove of the heat sink 103. The injection tube 74 moves into the housing 101, and the outlet of the injection tube 74 is located between the circuit board 102 and the heat sink 105. During the injection process, the liquid level of the sealing glue 104 gradually rises, and the injection tube 74 gradually moves upward.

[0100] Since the glue injection tube 74 is located between adjacent support ribs 1011, the outlet of the glue injection tube 74 is not close to the middle position in the shell 101, so the sealant 104 flows out from the outlet of the glue injection tube 74 and flows from the edge of the shell 101 to the middle position in the shell 101. This will cause the liquid level of the sealant 104 near the edge of the shell 101 to be higher, and the liquid level of the sealant 104 near the middle position in the shell 101 to be lower. When the liquid level of the sealant 104 submerges the heat sink foot 107, a cavity will be formed near the middle of the lower surface of the radiator 105, and the volume of the cavity will be further increased after the sealant 104 is cooled. The existence of the cavity reduces the thermal conductivity between the sealant 104 and the radiator 105, and the sealant 104 cannot firmly fix and restrict the radiator 105.

[0101] When the liquid level of the sealing glue 104 submerges the heat sink pin 107, the fourth clamping device 6 applies a certain pressure to the heat sink 105, so that the heat sink pin 107 is pressed into the groove of the heat sink 103. The heat sink pin 107 and the heat sink 105 move downward a certain distance, and the heat sink 105 squeezes out the cavity, so that the lower surface of the heat sink 105 contacts the sealing glue 104.

[0102] Installation steps: Place the fan 106 in the housing 101 and fix it. Start the fan 106 to solidify the sealant 104.

[0103] The mounting mechanism 8 clamps the fan 106 and places the fan 106 on the housing 101, and screws the screws into the fan 106 and the housing 101 respectively through the screwing mechanism 84 to fix the fan 106 on the housing 101. There is a certain distance between the lower end of the fan 106 and the upper surface of the heat sink 105. The fan 106 is powered on and started, and the fan 106 generates airflow to solidify the sealant 104.

[0104] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0105] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A structure of a solid-state relay, characterized in that: include: Housing (101); A circuit board (102) is arranged in the housing (101); A heat sink (103) is attached to the circuit board (102); Sealing glue (104) is injected into the housing (101) and covers the circuit board (102); A heat sink (105) is arranged on the sealing glue (104); A fan (106) is arranged on the housing (101); The heat sink (105) is provided with a heat sink foot (107); the heat sink foot (107) passes through the sealing glue (104) and contacts the heat sink (103); a first space (108) is formed in the heat sink (105); a second space is formed in the heat sink foot (107); the first space (108) and the second space are interconnected, and a medium is stored in the first space (108) and the second space; the first space (108) expands, and accordingly, the upper end of the heat sink (105) contacts the fan (106); the first space (108) contracts, and accordingly, the upper end of the heat sink (105) moves away from the fan (106); An expansion area is formed at the upper end of the radiator (105), and a thin sheet (1051) is provided in the expansion area; the thin sheet (1051) is connected to the radiator (105); The lower surface of the thin sheet (1051) forms a protrusion; the protrusions are arranged in parallel around the middle position of the thin sheet (1051); the protrusions extend from the middle position of the thin sheet (1051) to the edge of the thin sheet (1051); Support ribs (1011) are arranged in the up-down direction on the inner surface of the housing (101); gaps exist between adjacent support ribs (1011), the gaps are connected between the circuit board (102) and the heat sink (105), and the sealing glue (104) flows into between the circuit board (102) and the heat sink (105) through the gaps; A groove is formed on the upper surface of the heat sink (103), and the lower end of the heat sink foot (107) passes through the sealing glue (104) and is placed in the groove of the heat sink (103).

2. A packaging structure of a solid-state relay, using the structure of the solid-state relay as claimed in claim 1; characterized in that: include: A packaging platform (1) for placing solid-state relays; A first clamping device (2), a movable housing (101); A second clamping device (3) for moving the circuit board (102); A third clamping device (4) moves the heat sink (103); A pressing mechanism (5) pressing down the heat sink (103); A fourth clamping device (6) moves and presses down the heat sink (105); A glue injection mechanism (7) for injecting sealing glue (104) into the housing (101); A mounting mechanism (8) moves the fan (106) and fixes the fan (106) on the housing (101); A turntable (10) is arranged opposite to each other on two sides of the packaging platform (1); Wherein, the first clamping device (2), the third clamping device (4) and the fourth clamping device (6) are sequentially arranged around the turntable (10) on one side; the second clamping device (3), the pressing mechanism (5), the glue injection mechanism (7) and the installation mechanism (8) are sequentially arranged around the turntable (10) on the other side; The pressing mechanism (5) comprises: A third robotic arm (56); A pressing frame (51) arranged at a driving end of the third mechanical arm (56); A connecting rod mechanism (52) is relatively rotatably arranged on the pressing frame (51); A moving block (53) movably arranged on the pressing frame (51); A pressing block (54) is arranged on the moving block (53); A first power device (55) is arranged on the pressing frame (51); Wherein, the first power device (55) drives the connecting rod mechanism (52) to rotate; adjacent connecting rod mechanisms (52) are meshed with each other; and the connecting rod mechanism (52) is movably connected to the moving block (53); The connecting rod mechanism (52) comprises a first rod body (521) and a second rod body (522) which are movably connected to each other; a first tooth shape (523) is arranged at a position where the first rod body (521) is movably connected to the pressing frame (51); the first tooth shapes (523) on adjacent first rod bodies (521) are meshed with each other; a second tooth shape (524) is arranged at a position where the second rod body (522) is movably connected to the moving block (53); the second tooth shapes (524) on adjacent second rod bodies (522) are meshed with each other; a driving end of the first power device (55) is connected to a position where the first rod body (521) is movably connected to the pressing frame (51); The glue injection mechanism (7) comprises: A first robotic arm (71); A glue injection bracket (72) disposed at a driving end of the first mechanical arm (71); A movable bar (73) movably disposed on the glue injection bracket (72); A glue injection tube (74) disposed on the moving bar (73); A second power device (75) is arranged on the glue injection bracket (72); Wherein, the second power device (75) drives the moving bar (73); the glue injection tube (74) is connected to a sealing glue source; and the outlet of the glue injection tube (74) is formed on the side of the glue injection tube (74); The mounting mechanism (8) comprises: A second robotic arm (81); A nailing bracket (82) is arranged at a driving end of the second mechanical arm (81); A clamping claw (83) is arranged on the nailing bracket (82); A screw driving mechanism (84) is arranged on both sides of the clamping claw (83) on the nail driving bracket (82); The screw driving mechanism (84) is connected to a screw source, and the clamping claw (83) clamps the fan (106).

3. The packaging structure of the solid-state relay according to claim 2; characterized in that: The packaging station (1) comprises: Taiwan Department (11); A first mounting groove (12) for accommodating the housing (101); A second mounting slot (13) for accommodating a fan (106); Connector (14), connected to a power source; The first mounting groove (12) and the second mounting groove (13) are provided on the platform (11); and the connector (14) is electrically connected to an input end of the fan (106).

4. A packaging process for a solid-state relay, using the packaging mechanism for a solid-state relay as claimed in claim 2; characterized in that: The steps include: Simulation step: simulating the operation of the circuit board (102) to obtain thermal data of the circuit board (102), and determining the shape, area, thickness and bonding position of the heat sink (103) according to the thermal data; Analysis steps: determining the shape, size and setting position of the heat sink (107) according to the shape, area and fitting position of the heat sink (103); determining the amount of the medium according to the heat data; and determining the capacity of the second space according to the amount of the medium; Calculation step: determining the injection amount of the sealing glue (104) according to the data of the housing (101), the data of the circuit board (102), the data of the heat sink (103), the data of the heat sink foot (107) and the data of the heat sink (105); Determining the expansion degree of the first space (108) and the second space according to the amount of the medium, the capacity of the first space (108) and the second space, and determining the installation height between the fan (106) and the heat sink (105); Laminating step: placing the housing (101) on the packaging platform (1); placing the circuit board (102) on the housing (101); laminating the heat sink (103) on the circuit board (102) and pressing the heat sink (103) downward; Glue injection step: placing the heat sink (105) on the heat sink (103); injecting sealing glue (104) into the housing (101); Installation steps: placing the fan (106) on the housing (101) and fixing it; starting the fan (106) to solidify the sealing glue (104).

5. The packaging process of the solid-state relay according to claim 4, characterized in that: In the glue injection step: When the sealing glue (104) covers the heat sink foot (107), the heat sink (105) is pressed downward.

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