A fan heat dissipation component applied to a server mainboard

Abstract

The present application relates to the field of server technology, and specifically discloses a fan heat dissipation assembly applied to a server motherboard, including a cabinet, and also including: a plurality of server units can be detachably placed in the cabinet; a fan heat dissipation mechanism, fixedly placed on the inner side of the cabinet; a motherboard is located in the server unit; wherein a back channel plate is provided in the cabinet, and a plurality of groups of deep channels are provided on the back channel plate, and the airflow of the fan heat dissipation mechanism passes through the back channel plate and the plurality of groups of deep channels to reach the processor and memory part in the motherboard. The main purpose of the present invention is to improve the pertinence and efficiency of heat dissipation, reduce costs and noise, and at the same time be easy to maintain, so as to ensure that the server motherboard works in a stable temperature environment.

Description

Technical Field

[0001] The invention relates to the technical field of servers, and in particular to a fan heat dissipation component applied to a server mainboard. Background Art

[0002] With the rapid development of information technology, servers are increasingly used in various fields. The stable operation of servers is crucial to ensuring business continuity, and heat dissipation is one of the key factors affecting server stability.

[0003] At present, in server cooling technology, multiple small fans are usually configured on each server unit for cooling; firstly, the configuration of multiple small fans increases the cost and control complexity of the server, and the cooling effect of each small fan is limited, making it difficult to achieve efficient cooling of key components of the server motherboard; secondly, the operation of a large number of small fans will generate greater noise, affecting the working environment; in addition, the maintenance of multiple small fans is also relatively cumbersome, increasing the maintenance cost and difficulty; in order to solve the problems existing in the prior art, a new server motherboard fan cooling component is needed, which can improve the pertinence and efficiency of cooling, reduce cost and noise, and be easy to maintain, so as to ensure that the server motherboard works in a stable temperature environment. Summary of the invention

[0004] The embodiment of the present application provides a fan heat dissipation assembly applied to a server motherboard, the main purpose of which is to improve the pertinence and efficiency of heat dissipation, reduce costs and noise, and facilitate maintenance, thereby ensuring that the server motherboard operates in a stable temperature environment.

[0005] To achieve the above-mentioned purpose, the embodiment of the present application provides a fan heat dissipation assembly applied to a server motherboard, including a cabinet, and further comprising:

[0006] A plurality of server units are detachably mounted in the cabinet;

[0007] A fan heat dissipation mechanism is fixedly arranged on the inner side of the cabinet;

[0008] A mainboard, located in the server unit;

[0009] Among them, a back channel plate is arranged in the cabinet, and a plurality of deep channels are arranged on the back channel plate. The airflow of the fan heat dissipation mechanism passes through the back channel plate and the plurality of deep channels and penetrates into the processor and memory part in the mainboard.

[0010] In a feasible embodiment, the fan heat dissipation mechanism includes: a fan cover, fixedly disposed in the inner cavity of the cabinet; a driving device, fixedly disposed on the fan cover, and the output end of the driving device extends into the fan cover; a fan shaft, rotatably disposed inside the fan cover and locked to the output end of the driving device through a coupling; an air supply port, located on one side of the fan cover and connected to the inner cavity of the back channel plate; a fan driver, a signal of which is connected to the driving device and is used to change the rotation speed of the driving device.

[0011] In a feasible embodiment, a heat sink is also provided on the mainboard, and the heat sink is fixedly mounted on the processor and / or the memory unit, and the heat sink includes: a cooling seat, fixedly mounted on the processor and / or the memory unit; at least one metal heat pipe, one end of which is fixedly arranged on the processor and / or the memory unit; a medium cavity, formed in the inner cavity of the cooling seat, and all the metal heat pipes are arranged at equal intervals in the medium cavity; a plurality of fins, fixedly mounted on the top end face of the cooling seat, and all the fins are located on the side of the deep channel; a docking column, fixedly mounted on the side of the cooling seat, extending along a side perpendicular to the installation direction of the server unit, and protruding from the side of the cooling seat.

[0012] In a feasible embodiment, the deep channel includes: at least one exhaust port, which is opened on the side of the deep channel, and the exhaust port corresponds to the position of at least one of the heat sink and the memory part; a frame, which is fixedly arranged in the exhaust port; a docking frame, which is fixed on the side of the frame and is clamped on the edge of the deep channel; a shielding member, which is movably arranged in the exhaust port, and the shielding member is used to adjust the size of the current exhaust port opening area.

[0013] In a feasible embodiment, the frame is further provided with: a plurality of planar baffles, which are fixedly arranged in the frame at equal intervals and affixed to the shielding member; an inclined guide sheet, which is fixedly arranged in the frame and located at the end of the planar baffle, the inclined guide sheet is arranged in a one-to-one correspondence with the planar baffle, and a strip-shaped air inlet is formed between the inclined guide sheet and the planar baffle.

[0014] In a feasible embodiment, the docking frame is further provided with: a fixed tube, which is straight and fixedly arranged in the inner cavity of the docking frame; a kit, which is movably mounted on the outer wall of the fixed tube, and a magnetic strip is arranged on the inner wall of the kit, and the kit is fixedly connected to the shielding member; so as to change the opening area of ​​the strip-shaped air inlet; a magnet, which is movably arranged in the inner cavity of the fixed tube, and the magnetic strip and the kit can be attracted by the magnet; a docking hole is arranged at the bottom end of the inner cavity of the docking frame, and the docking hole is communicated with the bottom end of the fixed tube, and the docking hole corresponds to the position of the docking column.

[0015] In a feasible embodiment, the docking frame is further provided with: a rotating rod, which can be rotatably arranged around its own axis in the inner cavity of the docking frame; a sleeve, which is threadedly sleeved on the outer side of the outer wall of the upper half of the rotating rod; the sleeve is also fixedly connected to the shielding member to drive the shielding member to move to change the opening area of ​​the strip-shaped air inlet; a magnetic strip, which is arranged in a straight line along the length direction of the rotating rod and fixed on the outer wall of the rotating rod; a fixed tube, which is spirally arranged and fixedly arranged in the inner cavity of the docking frame, and the fixed tube is located on the outer side of the lower half of the rotating rod; a magnet, which is movably arranged in the inner cavity of the fixed tube, and the magnet can seal the inner cavity of the fixed tube; a docking hole, which is arranged at the bottom end of the inner cavity of the docking frame, the docking hole is communicated with the bottom end of the fixed tube, and the docking hole corresponds to the position of the docking column; wherein the number of spiral turns of the fixed tube corresponds to the number of thread turns opened in the upper half of the rotating rod, and the length of the thread interval opened in the upper half of the rotating rod corresponds to the opening height of the strip-shaped air inlet.

[0016] In a feasible implementation manner, the fixed tube, the docking hole and the medium cavity on one side of the magnet are filled with a thermal expansion and contraction liquid, and the magnet can move in the fixed tube following the volume change of the thermal expansion and contraction liquid.

[0017] In a feasible implementation manner, at least one of the docking post and the docking hole is provided with a sealing sheet, and when the docking post and the docking hole are in a combined state, the sealing sheet is opened, and the docking post is communicated with the docking hole.

[0018] In a feasible implementation manner, a plurality of support rails corresponding to the server units are further provided on the inner wall of the cabinet, and an openable and closable door is further provided on the front side of the support rails.

[0019] The present application provides a fan cooling component for a server motherboard. By setting a cabinet as a protective frame for the server unit, multiple server units can be disassembled in the cabinet, which is convenient for maintenance and upgrading, and improves the maintainability and service life of the server; the fan cooling mechanism is fixed on the inside of the cabinet, and generates airflow to dissipate heat from the processor and other heating areas on the motherboard. In conjunction with the multiple sets of deep channels on the back channel plate, the airflow can be accurately guided to key heating parts such as the processor and memory in the motherboard, greatly improving the pertinence and efficiency of heat dissipation, ensuring that the server motherboard works in a stable temperature environment, and reducing the probability of failure due to overheating; the overall server multiple units are only configured with a large-flow fan cooling mechanism once, and there is no need to configure a large number of small fans on each server unit, which reduces cost and complexity, and is also easy to maintain; reducing the number of fans effectively reduces the operating noise of the overall server unit, bringing a better experience to the working environment. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 A schematic structural diagram of a fan heat dissipation assembly applied to a server motherboard provided in an embodiment of the present application is shown;

[0021] Figure 2 A schematic diagram of the structure of a driving device provided in an embodiment of the present application is shown;

[0022] Figure 3 A schematic diagram of the structure of a server unit and a deep channel provided in an embodiment of the present application is shown;

[0023] Figure 4 A schematic diagram of the structure of a fan shaft provided in an embodiment of the present application is shown;

[0024] Figure 5 A schematic diagram of the structure of the air outlet provided in an embodiment of the present application is shown;

[0025] Figure 6 A schematic diagram of the structure of a processor and a memory unit provided in an embodiment of the present application is shown;

[0026] Figure 7 A schematic diagram of the structure of the air outlet provided in an embodiment of the present application is shown;

[0027] Figure 8 A schematic diagram of the structure of a docking column provided in an embodiment of the present application is shown;

[0028] Fig. 9 A schematic diagram of the structure of a shielding member provided in an embodiment of the present application is shown;

[0029] Fig.10 A schematic diagram of the structure of the shielding sheet provided in an embodiment of the present application is shown;

[0030] Fig.11 A schematic diagram showing the structure of a spiral-shaped fixed tube provided in an embodiment of the present application is shown;

[0031] Fig.12 A schematic diagram of the structure of a shielding sheet and a plane shielding sheet provided in an embodiment of the present application is shown;

[0032] Fig.13 A schematic diagram of the cross-sectional structure of the interior of the heat sink provided in an embodiment of the present application is shown;

[0033] Fig.14 A schematic diagram showing a structure in which the fixed tube provided in an embodiment of the present application is in a straight line shape;

[0034] Fig.15 A schematic structural diagram of a fixed tube and a magnet provided in an embodiment of the present application is shown.

[0035] In the figure: 10, cabinet, 20, server unit, 30, fan cooling mechanism, 40, motherboard, 11, door, 12, support rail, 13, back channel plate, 14, deep channel, 31, fan cover, 32, drive device, 33, fan shaft, 34, air supply port, 35, fan driver, 41, processor, 42, radiator, 43, memory unit, 44, heat sink, 141, exhaust port, 142 , frame, 143, docking frame, 144, shielding piece, 421, cooling seat, 422, metal heat pipe, 423, dielectric cavity, 424, fin, 425, docking column, 1421, flat baffle, 1422, inclined guide plate, 1431, rotating rod, 1432, kit, 1433, magnetic strip, 1434, fixing tube, 1435, magnet, 1436, docking hole, 1441, shielding plate. DETAILED DESCRIPTION

[0036] In order to better understand the technical solutions provided by the embodiments of this specification, the technical solutions of the embodiments of this specification are described in detail below through the accompanying drawings and specific embodiments. It should be understood that the embodiments of this specification and the specific features in the embodiments are detailed descriptions of the technical solutions of the embodiments of this specification, rather than limitations on the technical solutions of this specification. In the absence of conflict, the embodiments of this specification and the technical features in the embodiments can be combined with each other.

[0037] In this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply that there is any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that the process, method, article or equipment including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or equipment. In the absence of more restrictions, the elements limited by the statement "comprise one..." do not exclude the existence of other identical elements in the process, method, article or equipment including the elements. The term "more than two" includes two or more than two situations.

[0038] like Figures 1 to 15 As shown, the fan heat dissipation assembly applied to a server motherboard 40 in the embodiment of the present application includes a cabinet 10, and also includes: a plurality of server units 20, a fan heat dissipation mechanism 30 and a motherboard 40, wherein the plurality of server units 20 can be detachably arranged in the cabinet 10; the fan heat dissipation mechanism 30 is fixedly arranged on the inner side of the cabinet 10; the motherboard 40 is located in the server unit 20;

[0039] Among them, a back channel plate 13 is set in the cabinet 10, and multiple groups of deep channels 14 are set on the back channel plate 13. The airflow of the fan heat dissipation mechanism 30 passes through the back channel plate 13 and the multiple groups of deep channels 14 and penetrates into the processor 41 and the memory part 43 in the motherboard 40.

[0040] The present application provides a fan heat dissipation assembly for a server motherboard 40, which includes a cabinet 10, and the cabinet 10 is a protective frame for a server unit 20. Multiple server units 20 are placed in the cabinet 10 and can be disassembled for maintenance and upgrading. The motherboard 40 is responsible for the core computing and other functions of the server. The fan heat dissipation mechanism 30 is fixed on the inside of the cabinet 10, and its function is to generate airflow to dissipate heat in the heat-generating area, including the high-temperature area commonly found in the server (one or more processors 41 on the motherboard 40). The back channel plate 13 is disposed in the cabinet 10, and the multiple groups of deep channels 14 arranged on the back channel plate 13 can guide the airflow generated by the fan heat dissipation mechanism 30 to penetrate into the processor 41 and the memory unit 43 in the motherboard 40.

[0041] The working principle and process are as follows: After the server unit 20 is installed and started. The fan heat dissipation mechanism 30 generates airflow when in operation. The airflow passes through multiple groups of deep channels 14 on the back channel plate 13, and accurately reaches the heat-generating parts such as the processor 41 and the memory unit 43 of the mainboard 40 in the server unit 20, takes away the heat, and realizes efficient heat dissipation of the key components of the server mainboard 40. Thereby improving the pertinence and efficiency of heat dissipation, the overall server multiple units are only configured with a large flow fan heat dissipation mechanism 30 once, and it is easy to maintain, without the need to configure a large number of small fans on each server unit 20, reducing the probability of failure caused by overheating. By reducing the number of fans, the operating noise of the overall server unit 20 is simultaneously reduced, thereby ensuring that the server mainboard 40 works in a stable temperature environment.

[0042] like Figures 1 to 5 As shown, in some examples, further, the fan heat dissipation mechanism 30 includes: a fan cover 31, a driving device 32, a fan shaft 33, an air outlet 34 and a fan driver 35, the fan cover 31 is fixedly arranged in the inner cavity of the cabinet 10; the driving device 32 is fixedly arranged on the fan cover 31, and the output end of the driving device 32 extends into the fan cover 31; the fan shaft 33 is rotatably arranged inside the fan cover 31, and is locked to the output end of the driving device 32 through a coupling; the air outlet 34 is located on one side of the fan cover 31, and is connected to the inner cavity of the back channel plate 13; the fan driver 35 signal is connected to the driving device 32 for changing the rotation speed of the driving device 32.

[0043] In this example, it can be understood that the fan cover 31 plays a role in fixing and protecting internal components, wrapping the drive device 32, fan shaft 33, etc. therein to ensure their stable operation and prevent accidental touch and exposure; the drive device 32 is a core component for generating power, which can be configured as a drive motor, the drive motor is fixed on the fan cover 31, and its output end extends into the fan cover 31, and is connected to the fan shaft 33 through a coupling to provide power for the rotation of the fan shaft 33; the fan shaft 33 rotates driven by the drive device 32, thereby generating a cooling airflow; the airflow enters from below the fan cover 31, and a dust removal net can be provided on the air inlet side below the fan cover 31, and the air supply port 34 of the fan cover 31 is located on one side of the fan cover 31, connecting to the inner cavity of the back channel plate 13 , so that the airflow generated by the fan shaft 33 can enter the back channel plate 13 through the air supply port 34; the fan driver 35 signal is connected to the driving device 32, and the rotation speed of the driving device 32 can be changed according to actual needs, so as to adjust the air supply of the fan. The driving device 32 is connected to the server BMC management module. By setting the BMC management module to sense the current operating status of the server, the BMC management module dynamically adjusts the operating speed of the overall drive motor according to the operating status of the server, thereby achieving a dynamic heat dissipation adjustment effect, and flexibly adjusting the air supply according to actual heat dissipation needs, improving heat dissipation efficiency and accuracy, ensuring that the server motherboard 40 can maintain a suitable temperature under different workloads, and further extending the service life and stability of the server.

[0044] like Figure 6 , Figure 7 , Figure 8 and Fig.13 As shown, in some examples, further, a heat sink 42 is further provided on the mainboard 40, and the heat sink 42 is fixedly mounted on the processor 41 and / or the memory unit 43. The heat sink 42 includes: a cooling seat 421, at least one metal heat pipe 422, a dielectric cavity 423, a plurality of fins 424 and a docking post 425. The cooling seat 421 is fixedly mounted on the processor 41 and / or the memory unit 43; one end of at least one metal heat pipe 422 is fixedly arranged on the processor 41 and / or the memory unit 43; the dielectric cavity 423 is formed in the inner cavity of the cooling seat 421, and all the metal heat pipes 422 are arranged in the dielectric cavity 423 at equal intervals; a plurality of fins 424 are fixedly mounted on the top end surface of the cooling seat 421, and all the fins 424 are located on the side of the deep channel 14; the docking post 425 is fixedly mounted on the side of the cooling seat 421, and extends along a side perpendicular to the installation direction of the server unit 20, and protrudes from the side of the cooling seat 421.

[0045] In this example, in order to further improve the heat dissipation effect of the mainboard 40, a radiator 42 is configured on the mainboard 40. The heat on the mainboard 40 is output through the radiator 42, and the generated heat is taken away by the air flow. Specifically, the cooling seat 421 is directly fixed on the processor 41 and / or the memory unit 43, and its function is to be in close contact with the heat-generating components and receive the heat generated by the processor 41 and the memory unit 43. One end of the metal heat pipe 422 is fixedly arranged on the processor 41 and / or the memory unit 43, and its contact surface connected to the processor 41 or the memory unit 43 is a plane. Thereby, the heat is better and more quickly conducted to the medium cavity 423 and the fins 424 of the cooling seat 421. The metal heat pipes 422 in the medium cavity 423 are arranged at equal intervals, which helps to evenly conduct heat, so that the heat is more evenly distributed in the cooling seat 421, thereby quickly heating the medium in the cooling seat 421. A plurality of fins 424 are fixed on the top end surface of the cooling seat 421 and are located on the side of the deep channel 14, which increases the contact area with the air and improves the heat dissipation efficiency under the action of air flow. The docking column 425 is fixed on the side of the cooling seat 421. As a part of the server unit 20, when the server unit 20 is installed on the inside of the cabinet 10, as the server unit 20 is installed, the docking column 425 will also gradually dock to the docking frame 143, thereby opening up the connection between the medium cavity 423 and the docking frame 143, so that the docking frame 143 can take further adjustment measures according to the inflow of the medium;

[0046] The remaining locations on the mainboard where heat is generated less frequently can be covered with heat sinks 44 to conduct the remaining heat away and dissipate it through airflow.

[0047] like Figure 5 , Figure 6 , Figure 7 , Figure 8 , Fig. 9 , Fig.10 , Fig.11 , Fig.12 , Fig.14 and Fig.15 As shown, in some examples, further, the deep channel 14 includes: at least one exhaust port 141, a frame 142, a docking frame 143 and a shielding member 144, at least one exhaust port 141 is opened on the side of the deep channel 14, and the exhaust port 141 corresponds to the position of at least one of the heat sink 42 and the memory unit 43; the frame 142 is fixedly arranged in the exhaust port 141; the docking frame 143 is fixed on the side of the frame 142 and is clamped on the edge of the deep channel 14; the shielding member 144 is movably arranged in the exhaust port 141, and a shielding piece 1441 is further provided on the shielding member 144, and the size of the opening area of ​​the current exhaust port 141 is adjusted by moving the shielding piece 1441.

[0048] In this example, the exhaust port 141 on the deep channel 14 is opened on the side of the deep channel 14 and corresponds to the position of at least one of the heat sink 42 and the memory part 43, so that the airflow can be blown more accurately to the core heating part that needs heat dissipation; the frame 142 is fixedly arranged in the exhaust port 141, which plays a role in supporting and fixing the inner parts thereof and enhancing the firmness of the structure of the exhaust port 141; the docking frame 143 is fixed on the side of the frame 142, which can be connected with the docking column 425 on the one hand to receive the heat from The heating medium in the medium cavity 423, on the other hand, the docking frame 143 is also used to change the size of the airflow at the exhaust port 141; when high temperature is sensed at the corresponding position, the docking frame 143 is used to further dynamically adjust the current air volume at the exhaust port 141, and this adjustment process relies on the shielding member 144, which is placed in the exhaust port 141 to adjust the shielding area of ​​the exhaust port 141, thereby changing the size of the opening area of ​​the exhaust port 141, and achieving the purpose of adjusting the current air volume of the exhaust port 141.

[0049] The working principle and process are as follows: when the fan cooling mechanism 30 is working, the airflow enters the deep channel 14 through the back channel plate 13, and then blows out from the exhaust port 141 to the heat sink 42, the memory unit 43 and other heat-generating parts; the BMC management module dynamically adjusts the airflow generated by the fan cooling mechanism 30 according to the actual heat dissipation demand. For example, if the BMC management module senses that the motherboard 40 is at a high temperature or is about to run a high-computation task, it will change the operating state of the drive device 32 in the fan cooling mechanism 30 accordingly to increase the airflow entering the back channel plate 13. At the same time, through the adjustment mechanism of the docking frame 143, the shielding member 144 is adaptively moved to adjust the current The opening area of ​​the exhaust port 141 is adjusted to enhance the flow rate and velocity of the air flow in the current area; for example, when the temperature of the heating part is high, the opening area of ​​the exhaust port 141 can be adaptively increased, and the air flow rate can be increased to improve the heat dissipation efficiency without affecting the air flow rate supplied in the other exhaust ports 141; when the temperature is low or the task is not complicated, the opening area can be adaptively reduced, and the working speed of the drive device 32 can be controlled to reduce the air flow rate and reduce energy consumption, so as to achieve precise control of the heat dissipation airflow, improve the pertinence and flexibility of heat dissipation, better adapt to the heat dissipation requirements of the server motherboard 40 under different working conditions, and save energy to a certain extent.

[0050] like Fig. 9 and Fig.11As shown, in some examples, further, the frame 142 is further provided with: a plurality of planar baffles 1421 and an inclined guide sheet 1422; the plurality of planar baffles 1421 are fixedly arranged at equal intervals in the frame 142 and can be movably fitted on the shielding member 144; the inclined guide sheet 1422 is fixedly arranged in the frame 142 and is located at the end of the planar baffle 1421; the inclined guide sheet 1422 is arranged one-to-one with the planar baffle 1421, and a strip-shaped air inlet is formed between the inclined guide sheet 1422 and the planar baffle 1421.

[0051] In this example, the specific shape structure in the frame 142 is further disclosed, including a plurality of planar baffles 1421, which are attached to the shielding member 144, and their function is to cooperate with the shielding member 144 to further adjust the size of the gap through which the airflow passes, and also to support and guide the movement of the shielding member. The inclined guide piece 1422 is fixed in the frame 142 and is located at the end of the planar baffle 1421, so that the airflow in the deep channel 14 can be directly blown to the location of the radiator 42 through the guidance of the inclined guide piece 1422. The airflow is blown more concentratedly to the heat generating parts such as the radiator 42 and the memory unit 43.

[0052] The working principle and process are as follows: after the airflow enters the deep channel 14, it passes through the strip air inlet in the frame 142; by adjusting the position of the shielding member 144, the gap size between the plane shielding piece 1421 and the shielding member 144 can be changed, thereby controlling the flow rate of the airflow; the inclined guide piece 1422 guides the airflow to blow toward the heat-generating part at a suitable angle to improve the heat dissipation efficiency.

[0053] like Fig.14 and Fig.15 As shown, in some examples, further, the docking frame 143 may be provided with: a kit 1432, a fixed tube 1434, a magnet 1435 and a docking hole 1436, the fixed tube 1434 is linear and fixedly arranged in the inner cavity of the docking frame 143; the kit 1432 can be movably mounted on the outer wall of the fixed tube 1434, a magnetic strip 1433 is arranged on the inner wall of the kit 1432, and the kit 1432 is fixedly connected to the shielding member 144; so as to change the opening area of ​​the strip-shaped air inlet; the magnet 1435 can be movably arranged in the inner cavity of the fixed tube 1434, the magnetic strip 1433 and the kit 1432 can be attracted by the magnet 1435; the docking hole 1436 is arranged at the bottom end of the inner cavity of the docking frame 143, the docking hole 1436 is communicated with the bottom end of the fixed tube 1434, and the docking hole 1436 corresponds to the position of the docking column 425.

[0054] In this example, the fixed tube 1434 is fixed in a straight line in the inner cavity of the docking frame 143 as a supporting component, providing a stable moving track for the kit 1432 and the magnet 1435. The kit 1432 can move on the outer wall of the fixed tube 1434, and the magnetic strip 1433 on its inner wall can interact with the magnet 1435 located on the inner side of the fixed tube 1434. The kit 1432 moves synchronously with the movement of the magnet 1435, and then the movement of the kit 1432 drives the shielding member 144 to move, thereby changing the opening area of ​​the strip-shaped air inlet, and adjusting the air flow entering the exhaust port 141.

[0055] The specific working process is as follows: the magnet 1435 can move in the inner cavity of the fixed tube 1434, and according to the volume change of the medium in the medium cavity 423 caused by heating, the increased part of the medium is gradually moved upward in the fixed tube 1434, and the movement of the magnet 1435 is pushed, and the control kit 1432 and the shielding member 144 are moved; the gap between the planar baffle 1421 and the shielding member 144 and the opening area of ​​the strip air inlet are changed; when the opening area changes, the air flow rate entering the exhaust port 141 also changes accordingly, so as to adapt to the different heating conditions of different positions of the current server motherboard 40; the actual heating condition of the server motherboard 40 allows the air flow rate to be flexibly adjusted, thereby improving the adaptability and efficiency of the cooling system, and ensuring that the server can maintain a suitable temperature under various working conditions.

[0056] like Fig. 9 , Fig.10 , Fig.11 , Fig.12 and Fig.15As shown, in this example, unlike the previous example, the docking frame 143 may also be provided with: a rotating rod 1431, a sleeve 1432, a magnetic strip 1433, a fixed tube 1434, a magnet 1435 and a docking hole 1436. The rotating rod 1431 can be rotatable around its own axis and is arranged in the inner cavity of the docking frame 143; the sleeve 1432 is threadedly sleeved on the outer side of the upper half of the outer wall of the rotating rod 1431; the sleeve 1432 is also fixedly connected to the shielding member 144 to drive the shielding member 144 to move to change the opening area of ​​the strip-shaped air inlet; the magnetic strip 1433 is arranged in a straight line along the length direction of the rotating rod 1431 and is fixed on the outer wall of the rotating rod 1431; the fixed tube 143 4 is spirally arranged in the inner cavity of the docking frame 143, and the fixed tube 1434 is located on the outer side of the lower half of the rotating rod 1431; the magnet 1435 is movably arranged in the inner cavity of the fixed tube 1434, and the magnet 1435 can seal the inner cavity of the fixed tube 1434; the docking hole 1436 is arranged at the bottom end of the inner cavity of the docking frame 143, the docking hole 1436 is communicated with the bottom end of the fixed tube 1434, and the docking hole 1436 corresponds to the position of the docking column 425; wherein the number of spiral turns of the fixed tube 1434 corresponds to the number of thread turns opened on the upper half of the rotating rod 1431, and the length of the thread section opened on the upper half of the rotating rod 1431 corresponds to the opening height of the strip-shaped air inlet.

[0057] In this example, the fixed tube 1434 adopts a spiral structure, and a rotating rod 1431 is added, wherein the rotating rod 1431 can rotate around its own axis, and its function is to drive the kit 1432 to move up and down through the threaded structure and rotational motion. In addition, the kit 1432 is threadedly sleeved on the outer side of the outer wall of the upper half of the rotating rod 1431 and is fixedly connected to the shielding member 144. When the rotating rod 1431 rotates, the kit 1432 moves linearly on the rotating rod 1431, thereby driving the shielding member 144 to move to change the opening area of ​​the strip-shaped air inlet and adjust the air flow rate. The magnetic strip 1433 is fixed on the outer wall of the rotating rod 1431 in a linear shape, and it rotates in coordination with the magnet 1435 in the fixed tube 1434. The fixed tube 1434 is spirally fixed to the inner cavity of the docking frame 143 and is located on the outer side of the lower half of the rotating rod 1431, providing a moving path for the magnet 1435. The magnet 1435 can be movably disposed in the inner cavity of the fixing tube 1434 and can seal the inner cavity of the fixing tube 1434 .

[0058] The working principle and process are as follows: when there is a local overtemperature on the mainboard 40 and the heat dissipation airflow needs to be adjusted, the principle of thermal expansion and contraction of the medium can be used to push the magnet 1435 to move in the fixed tube 1434; the magnet 1435 moves in the spiral-shaped fixed tube 1434, and the magnetic force it generates acts on the magnetic strip 1433, thereby driving the rotating rod 1431 to rotate through the magnetic strip 1433; when the rotating rod 1431 rotates, since the kit 1432 is screwed to the upper half of the rotating rod 1431, the kit 1432 will move up and down along the rotating rod 1431, thereby driving the shielding member 144 to move, thereby changing the opening area of ​​the strip-shaped air inlet.

[0059] According to the design that the number of spiral turns of the fixed tube 1434 corresponds to the number of thread turns of the upper half of the rotating rod 1431, the number of turns that the magnet 1435 rotates in the fixed tube 1434 will be the same as the number of turns of the rotating rod 1431, which is a reasonable design. The design that the length of the thread interval of the upper half of the rotating rod 1431 corresponds to the height of the strip air inlet opening allows the kit 1432 to have a sufficient linear movement driving stroke during the rotation of the rotating rod 1431, thereby achieving the accuracy of adjusting the corresponding strip air inlet opening area; thereby ensuring that the server motherboard 40 can maintain a suitable temperature under various working conditions, extending the service life and stability of the server, and also helping to optimize energy utilization.

[0060] It should also be noted that the spiral setting of the fixed tube 1434, compared with the straight-line configuration in the previous example, allows the magnet 1435 to more powerfully adsorb the magnetic strip 1433 and follow the movement of the magnet 1435 during the movement. The longer moving distance is converted into a short-distance linear movement through the setting of the spiral structure, ensuring that the magnetic strip 1433 can better follow the magnet 1435. The threaded setting allows the kit 1432 and the shielding member 144 to have a self-locking effect in position. Therefore, the strip-shaped air inlet will not be affected by the change of airflow deep in the channel 14, and the structural stability is better.

[0061] like Fig.15As shown, in some examples, further, the fixed tube 1434, the docking hole 1436 and the medium cavity 423 on one side of the magnet 1435 are filled with thermal expansion and contraction liquid, and the magnet 1435 can move in the fixed tube 1434 following the volume change of the thermal expansion and contraction liquid. The server motherboard 40 generates heat, and the heat is transferred to the cooling seat 421 and the medium cavity 423, so that the temperature of the thermal expansion and contraction liquid increases and expands, pushing the magnet 1435 to move, and the movement of the magnet 1435 causes the rotating rod 1431 to rotate, and the kit 1432 drives the shielding member 144 to change the opening area of ​​the strip air inlet. As the temperature changes, the thermal expansion and contraction liquid continuously adjusts the position of the magnet 1435 to achieve automatic adjustment of the heat dissipation airflow. This example adopts a low-cost simple structure configuration to improve the intelligence and efficiency of the heat dissipation system, ensure that the server can maintain a suitable heat dissipation state at different operating temperatures, and does not need to use other active control programs or sensors to achieve the function of automatically adjusting the heat dissipation airflow according to the temperature of the server motherboard 40 without active intervention.

[0062] The thermal expansion and contraction liquid in this example can preferably be dimethyl silicone oil; on the one hand, the thermal expansion coefficient of dimethyl silicone oil is relatively moderate, and it can produce a relatively obvious volume change when the temperature changes, thereby effectively driving the magnet 1435 to move in the fixed tube 1434 to achieve the adjustment of the heat dissipation airflow; on the other hand, its chemical properties are very stable and it is not easy to react with other components in the device, which can ensure the long-term stable operation of the device; at the same time, dimethyl silicone oil has good fluidity and can flow smoothly in the fixed tube 1434, the docking hole 1436 and the medium cavity 423 to quickly transmit the temperature change signal; dimethyl silicone oil is non-toxic, non-flammable, and has high safety, which meets the safety requirements of the device for thermal expansion and contraction liquids.

[0063] like Fig.12 and Fig.14 As shown, in some examples, further, at least one of the docking column 425 and the docking hole 1436 is provided with a sealing sheet, and when the docking column 425 and the docking hole 1436 are in a combined state, the sealing sheet is opened, and the docking column 425 is connected to the docking hole 1436.

[0064] In this example, the docking post 425 and the docking hole 1436 play the role of connection and conduction. In the unassembled state, the sealing sheet prevents external impurities from entering the docking post 425 or the docking hole 1436, thereby ensuring the cleanliness and stability of the interior. When connection is required, the server unit 20 is installed in the cabinet 10, and the docking post 425 is inserted into the docking hole 1436. The contact between the two causes the sealing sheet to open, thereby achieving the connection between the docking post 425 and the docking hole 1436. At this time, if there is a medium such as a liquid that expands with heat and contracts with cold, it can flow in the channel connecting the docking post 425 and the docking hole 1436, thereby achieving the function of pushing the magnet 1435 to move. At the same time, the provision of the sealing sheet also helps to improve the safety and reliability of the system, and avoid failures caused by leakage and other problems.

[0065] like Figure 1 As shown, in some examples, further, a plurality of support rails 12 corresponding to the server unit 20 are provided on the inner wall of the cabinet 10, and a door body 11 that can be opened and closed is provided on the front side of the support rails 12; the plurality of support rails 12 corresponding to the server unit 20 provided on the inner wall of the cabinet 10 provide a stable installation and support position for the server unit 20, so that the server unit 20 can be accurately placed in the cabinet 10, and is convenient for disassembly and maintenance; when the server unit 20 needs to be installed or replaced, the server unit 20 can be pushed into or pulled out of the cabinet 10 along the support rails 12, and the operation is more convenient; the door body 11 mainly plays the role of protecting the server unit 20 and facilitating operation; in normal times, the door body 11 can be closed to prevent external dust, debris, etc. from entering the interior of the cabinet 10 and causing damage to the server unit 20; when the server unit 20 needs to be operated, maintained or overhauled, the door body 11 can be opened to directly operate the server unit 20.

[0066] Those skilled in the art will appreciate that the embodiments of the present application may be provided as methods, systems or computer program products. Therefore, the present application may adopt the form of a complete hardware embodiment, a complete software embodiment or an embodiment in combination with software and hardware. Moreover, the present application may adopt the form of a computer program product implemented on one or more computer-usable computer-readable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program codes.

[0067] The above are only embodiments of the present application and are not intended to limit the present application. For those skilled in the art, the present application may have various changes and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included within the scope of the claims of the present application.

Claims

1. A fan heat dissipation assembly applied to a server motherboard, comprising a cabinet (10), characterized in that: Also includes: A plurality of server units (20) are detachably arranged in the cabinet (10); A fan heat dissipation mechanism (30) is fixedly arranged on the inner side of the cabinet (10); A mainboard (40) located in the server unit (20); The cabinet (10) is provided with a back channel plate (13), and the back channel plate (13) is provided with a plurality of groups of deep channels (14), and the airflow of the fan heat dissipation mechanism (30) passes through the back channel plate (13) and the plurality of groups of deep channels (14) and penetrates into the processor (41) and the memory unit (43) in the mainboard (40); A heat sink (42) is also provided on the mainboard (40), and the heat sink (42) is fixedly mounted on the processor (41) and / or the memory unit (43). The heat sink (42) comprises: A cooling seat (421) fixedly mounted on the processor (41) and / or the memory unit (43); at least one metal heat conducting pipe (422), one end of which is fixedly arranged on the processor (41) and / or the memory unit (43); A medium cavity (423) is formed in the inner cavity of the cooling seat (421), and all the metal heat-conducting pipes (422) are arranged at equal intervals in the medium cavity (423); A plurality of fins (424) are fixedly mounted on the top end surface of the cooling seat (421), and all of the fins (424) are located on the side of the deep channel (14); A docking column (425) is fixedly arranged on the side of the cooling seat (421), extends along a side perpendicular to the installation direction of the server unit (20), and protrudes from the side of the cooling seat (421); The deep channel (14) comprises: at least one exhaust port (141) is disposed on a side of the deep channel (14), the exhaust port (141) corresponding to a position of at least one of the heat sink (42) and the memory portion (43); A frame (142) fixedly disposed in the air outlet (141); A docking frame (143) is fixed to the side of the frame (142) and is clamped to the edge of the deep channel (14); A shielding member (144) is movably disposed in the air outlet (141), and the shielding member (144) is used to adjust the size of the opening area of ​​the current air outlet (141); The frame (142) is also provided with: A plurality of planar baffles (1421) are fixedly arranged at equal intervals in the frame (142) and affixed to the shielding member (144); An inclined guide piece (1422) is fixedly arranged in the frame (142) and is located at the end of the planar baffle (1421); the inclined guide piece (1422) and the planar baffle (1421) are arranged in a one-to-one correspondence, and a strip-shaped air inlet is formed between the inclined guide piece (1422) and the planar baffle (1421); The docking frame (143) is further provided with: A rotating rod (1431), the rotating rod (1431) being rotatable about its own axis and arranged in the inner cavity of the docking frame (143); A sleeve (1432) is threadedly sleeved on the outer side of the upper half outer wall of the rotating rod (1431); the sleeve (1432) is also fixedly connected to the shielding member (144) to drive the shielding member (144) to move and thus change the opening area of ​​the strip-shaped air inlet; The magnetic strip (1433) is arranged in a straight line along the length direction of the rotating rod (1431) and is fixed on the outer wall of the rotating rod (1431); A fixed tube (1434) is spirally shaped and fixedly disposed in the inner cavity of the docking frame (143); the fixed tube (1434) is located outside the lower half of the rotating rod (1431); A magnet (1435) is movably disposed in the inner cavity of the fixed tube (1434), and the magnet (1435) is capable of sealing the inner cavity of the fixed tube (1434); A docking hole (1436) is disposed at the bottom end of the inner cavity of the docking frame (143), the docking hole (1436) is communicated with the bottom end of the fixing tube (1434), and the docking hole (1436) corresponds to the position of the docking column (425); The number of spiral turns of the fixed tube (1434) corresponds to the number of spiral turns of the upper part of the rotating rod (1431), and the length of the spiral section of the upper part of the rotating rod (1431) corresponds to the opening height of the strip-shaped air inlet; The fixed tube (1434), the docking hole (1436) and the medium cavity (423) on one side of the magnet (1435) are filled with a thermal expansion and contraction liquid, and the magnet (1435) can move in the fixed tube (1434) following the volume change of the thermal expansion and contraction liquid.

2. A fan heat dissipation assembly applied to a server motherboard according to claim 1, characterized in that: The fan heat dissipation mechanism (30) comprises: A fan cover (31) is fixedly disposed in the inner cavity of the cabinet (10); A driving device (32) is fixedly mounted on the fan cover (31), and an output end of the driving device (32) extends into the fan cover (31); A fan shaft (33) is rotatably disposed inside the fan cover (31) and is locked to the output end of the driving device (32) via a coupling; An air supply port (34) is located on one side of the fan cover (31) and is connected to the inner cavity of the back channel plate (13); A fan driver (35) is signal-connected to the driving device (32) and is used to change the rotation speed of the driving device (32).

3. The fan heat dissipation assembly applied to a server motherboard according to claim 1, characterized in that: At least one of the docking column (425) and the docking hole (1436) is provided with a sealing sheet, and when the docking column (425) and the docking hole (1436) are in a combined state, the sealing sheet is opened, and the docking column (425) is connected to the docking hole (1436).

4. The fan heat dissipation assembly applied to a server motherboard according to claim 1, characterized in that: A plurality of support rails (12) corresponding to the server units (20) are also provided on the inner wall of the cabinet (10), and an openable and closable door (11) is also provided on the front side of the support rails (12).

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