Camera module and semiconductor cavity

Abstract

The invention provides a camera module and a semiconductor cavity, and the camera module comprises a camera assembly which is used for obtaining an image in the semiconductor cavity; the light source assembly is used for providing light for the semiconductor cavity, and an optical path is formed between the light source assembly and the camera assembly; the shading piece comprises a sleeve part and a shading part, the sleeve part is arranged around the camera body of the camera assembly, the shading part is arranged around the lens end of the camera assembly, and the shading part is used for reducing the luminous flux emitted into the semiconductor cavity by the light source assembly in the optical path; the camera assembly, the light source assembly and the shading part are all arranged in the housing; one end of the sleeve part is connected with the housing, the other end of the sleeve part is connected with the shading part, the sleeve part and the shading part are integrated, and the shading part comprises a metal material. According to the invention, through the arrangement of the shading piece, the irradiation range is enlarged, imaging overexposure caused by light concentration is reduced, and the influence of reflected light on imaging is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor cavities of semiconductor equipment, and in particular to a camera module of a semiconductor cavity and a semiconductor cavity having the camera module. Background Art

[0002] In the prior art, semiconductor cavities are usually provided with multiple observation windows for observing the internal conditions of the cavity. Through the observation windows, process personnel can observe the internal conditions of the cavity with naked eyes. However, by observing the internal conditions through the observation windows, process personnel cannot observe all the time, and there may be problems where abnormalities in the cavity cannot be known in time. In addition, although some prior art technologies use camera technology to obtain the conditions in the cavity, the surface of the camera affects the light, thereby affecting the imaging, making it impossible to obtain a clear internal image, and the installation and maintenance are troublesome. Summary of the invention

[0003] The purpose of the present invention is to provide a camera module and a semiconductor cavity having the camera module, which solves the problem of timely and clear acquisition of the conditions inside the cavity.

[0004] In order to achieve the above objectives, the present invention is implemented by the following technical solutions:

[0005] In one aspect, the present invention provides a camera module for a semiconductor cavity, wherein the semiconductor cavity comprises a hole, and the camera module is disposed in the hole, comprising:

[0006] A camera assembly, used to acquire an image inside the semiconductor cavity;

[0007] a light source assembly, forming an optical path between the light source assembly and the camera assembly, and used for providing illumination into the semiconductor cavity through the optical path;

[0008] a light shielding member, the light shielding member comprising a sleeve portion and a light shielding portion, the sleeve portion being arranged around a body of the camera assembly, the light shielding portion being arranged around a lens end of the camera assembly, the light shielding portion being used to reduce a light flux emitted from the light source assembly in the optical path to the semiconductor cavity;

[0009] A housing, wherein the camera assembly, the light source assembly and the light shielding member are all arranged in the housing;

[0010] One end of the sleeve portion is connected to the cover shell, and the other end of the sleeve portion is connected to the shading portion. The sleeve portion and the shading portion are integrated, and the shading member includes a metal material.

[0011] Preferably, the outer surface of the shading member is mirror-finished, and the inner surface of the shading member is anodized.

[0012] Preferably, the camera module further includes: a light-transmitting component, wherein the light-transmitting component is arranged between the camera component and the hole.

[0013] Preferably, a pad is provided on the light-transmitting component, and the pad is in contact with the edges around the light-shielding portion.

[0014] Preferably, the edges of the shading portion are circular or square.

[0015] Preferably, the light source assembly includes a light source and a reflective plate, the light source and the reflective plate are connected, the light source emits light in the opposite direction of the hole, and the reflective plate reflects the light to the hole to form part of the optical path.

[0016] Preferably, the light source is annular and is arranged around the camera assembly; the reflector is dome-shaped, and the light source is arranged on the dome-shaped edge of the reflector.

[0017] Preferably, the reflective plate is connected to the cover shell.

[0018] Preferably, the cover shell includes a cover body and a fixing portion, and the camera assembly and the sleeve portion are both connected to the cover body via the fixing portion.

[0019] Preferably, the camera module further comprises a light-transmitting component fixing portion, and the light-transmitting component is connected to the semiconductor cavity via the light-transmitting component fixing portion; and the cover shell is fixed on the light-transmitting component fixing portion.

[0020] In another aspect, the present invention further provides a semiconductor cavity, comprising:

[0021] a cavity wall, the cavity wall comprising an aperture;

[0022] A camera module is disposed in the hole and is used to obtain the state inside the semiconductor cavity.

[0023] Compared with the prior art, the present invention has the following advantages:

[0024] (1) The present invention can reduce the light flux emitted from the light source component in the optical path to the semiconductor cavity by setting the light shielding member, thereby ensuring that the image captured by the shooting component is clear.

[0025] (2) Since an integrated shading member is provided, the camera component is separated from the light source component. By ensuring the airtight contact between the shading member and the light-transmitting component, it is ensured that light cannot leak out from between the shading member and the light-transmitting component, thereby improving the clarity of the image.

[0026] (3) Since the shading piece is made of metal and is separated from the camera, its outer surface can be surface treated and its inner surface can be anodized. On the one hand, this improves the reflective effect of the shading piece surface, allowing light to enter the semiconductor cavity at multiple angles, thereby increasing the irradiation range and reducing the overexposure of the image caused by light concentration. On the other hand, it improves the light absorption effect inside the shading piece, reducing the impact of the reflected light inside the shading piece on the camera components. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solution of the present invention, the following briefly introduces the drawings required for the description. Obviously, the drawings described below are an embodiment of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative work:

[0028] Figure 1 A schematic diagram of the installation structure of the camera module provided by the present invention;

[0029] Figure 2 is a cross-sectional view of a camera module of the present invention;

[0030] Figure 3 An exploded view of the camera module of the present invention;

[0031] Figure 4 It is an enlarged view of the shading member of the present invention. DETAILED DESCRIPTION

[0032] The scheme proposed by the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods. According to the following description, the advantages and features of the present invention will be clearer. It should be noted that the accompanying drawings are in a very simplified form and use non-precise proportions, which are only used to conveniently and clearly assist in explaining the purpose of the implementation method of the present invention. In order to make the purposes, features and advantages of the present invention more obvious and easy to understand, please refer to the accompanying drawings. It should be noted that the structures, proportions, sizes, etc. illustrated in the accompanying drawings of this specification are only used to match the contents disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the limiting conditions for the implementation of the present invention, so they have no technical substantive significance. Any structural modification, change in proportional relationship or adjustment of size, without affecting the effects that the present invention can produce and the purposes that can be achieved, should still fall within the scope of the technical content disclosed by the present invention.

[0033] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that the process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of more restrictions, the elements defined by the sentence "including one..." do not exclude the existence of other identical elements in the process, method, article or device including the elements. In addition, the term "connection" herein means that A and B are directly connected, or that A and B are indirectly connected, such as A and B are connected through C, or even through more components such as C and D, and A and B can be connected in one piece, or in separate pieces, or removable, or fixed. The term "optional" herein means that the technical feature can be combined or not combined with any feature in the text.

[0034] The camera module can be applied to a semiconductor cavity, which includes a camera module and a cavity wall. The cavity wall includes an upper cavity wall located at the top, a side cavity wall located at the side, and a lower cavity wall located at the bottom. A hole is provided on the cavity wall, and the hole is an image acquisition hole. The hole can be, for example, provided in at least one of the upper cavity wall, the side cavity wall, or the lower cavity wall. The camera module is provided in the hole of the cavity wall. The camera module can be provided on at least one of the upper cavity wall, the side cavity wall, and / or the lower cavity wall, so as to be able to obtain the state inside the cavity from a required viewing angle. Optionally, the semiconductor cavity is, for example, at least one of a vacuum load chamber (Load Lock), a wafer transfer chamber (TM), and a process chamber (PM), wherein the process chamber (PM) can be at least one of CVD, PVD, RTP, epitaxy (Epi), or etching (Etch). Wherein, the cavity wall is a metal material, such as stainless steel or aluminum.

[0035] Figure 1 FIG. 2 shows a schematic diagram of the installation structure of the camera module 200 of the present invention. Figure 1 As shown, the camera module 200 is mounted on the cavity wall 100 of the semiconductor cavity. Figure 1 In the embodiment, as an example, the semiconductor chamber is a wafer transfer chamber (TM), the chamber wall 100 is an upper chamber wall, and the camera module 200 is used to observe the status of the robot and the wafer in the wafer transfer chamber.

[0036] Figure 2 2 shows a cross-sectional view of a camera module 200 of the present invention, Figure 3FIG. 2 shows an exploded view of the camera module 200 of the present invention. Figure 2-3 As shown, the camera module 200 includes a housing 201, a camera assembly 202, a light source assembly 203 and a light shielding member 204; the camera assembly 202 is used to obtain an image in the semiconductor cavity; the light source assembly 203 is used to provide light to the semiconductor cavity to form an optical path S between the camera assembly 202 and the light source assembly 203, the light source assembly 203 illuminates the semiconductor cavity through a portion of the optical path S, and the reflected light in the semiconductor cavity reaches the camera assembly 202 through a portion of the optical path S. The light shielding member 204 includes a sleeve portion 209 and a light shielding portion 208, the sleeve portion 209 is arranged around the body of the camera assembly 202, the light shielding portion 208 is arranged around the lens end of the camera assembly 202, and the light shielding portion 208 is used to reduce the light flux emitted from the light source assembly 203 in the optical path S to the semiconductor cavity. The camera assembly 202, light source assembly 203 and shading member 204 are all arranged in the cover shell 201; one end of the sleeve portion 209 is connected to the cover shell 201, and the other end is connected to the shading portion 208, the sleeve portion 209 and the shading portion 208 are integrated, and the shading member 204 includes metal materials, such as aluminum, stainless steel, etc., to facilitate some optical processing on the metal surface.

[0037] The image captured by the camera component 202 may be in the form of a picture or a video, including but not limited to the above.

[0038] Figure 4 FIG. 2 shows an enlarged view of the light shielding member 204 of the present invention. Figure 4 As shown, the shading portion 208 and the sleeve portion 209 of the shading member 204 are both cylindrical structures made of metal, the two cylindrical structures are roughly coaxial, and the width of the shading portion 208 of the cylindrical structure is greater than the width of the sleeve portion 209. Through the shielding effect of the shielding portion 208, part of the light entering the semiconductor cavity is reduced, the light flux in the semiconductor cavity is reduced, and the appearance of concentrated light spots is avoided. The size and shape of the shielding portion 208 can be adjusted according to the actual shading effect.

[0039] Optionally, the sleeve portion 209 is arranged around the body of the camera assembly 202, and the cylindrical structure of the sleeve portion 209 extends vertically, and it can be at least one of a circular cylinder, a square cylinder or a polygonal cylinder. Preferably, the sleeve portion 205 is a square cylinder. Taking the square cylinder as an example, the sleeve portion 209 includes a cylinder body 215, and a connecting ear 216 is arranged at one end of the sleeve portion 209. The connecting ears 216 are four and are respectively arranged at the inner corners of the square cylinder. The connecting ears 216 are provided with threaded holes; they can be installed on the cover 201 through the threaded holes. The connecting ears 216 are arranged on the inner side of one end of the sleeve portion 209, which can save space and is simple to install.

[0040] The light shielding portion 208 includes an annular surface 210 and a vertical tube. The annular surface 210 is disposed between the sleeve portion 209 and the vertical tube. The annular surface 210, the sleeve portion 209 and the vertical tube form an integrated structure. The annular surface 210 extends in the horizontal direction, and the vertical tube extends in the vertical direction. Optionally, the vertical tube can be at least one of a cylinder, a square tube or a polygonal tube. Preferably, the vertical tube is a cylinder ( Figure 4 The square tube embodiment is only given as an example). The vertical extension of the vertical tube can prevent the light from being reflected upward, thereby increasing the light emission angle.

[0041] Optionally, the camera module 200 further includes a light-transmitting component 206, which is disposed between the camera component 202 and the hole. The light-transmitting component 206 may be quartz glass, which has excellent light transmittance and mechanical properties, which can improve the clarity of the captured image on the one hand, and improve durability on the other hand; at the same time, the light-transmitting component 206 can achieve gas sealing of the semiconductor cavity and achieve the negative pressure required for process treatment; the material of the light-transmitting component 206 includes but is not limited to the above. The light-transmitting component 206 is in close contact with the lower edge of the light-shielding portion 208, thereby ensuring that there is no light leakage at the contact portion between the light-transmitting component 206 and the light-shielding portion 208.

[0042] Optionally, a pad 2061 is provided on the light-transmitting component 206, and its shape is adapted to the shape of the light-shielding portion 208. Specifically, its shape is adapted to the shape of the lower end of the vertical tube of the light-shielding portion 208. For example, if the vertical tube is a cylinder, the pad is a circular ring. The pad 2061 further ensures that light cannot leak from between the light-shielding portion 208 and the light-transmitting component 206. Optionally, the pad 2061 is a rubber pad.

[0043] Optionally, since the vertical tube of the light shielding portion 208 can be at least one of a circular tube, a square tube or a polygonal tube, the surrounding edges of the vertical tube (the lower end of the vertical tube) are correspondingly at least one of circular, square or polygonal, and the contour of the surrounding edges can be designed according to actual needs, including but not limited to the above. Preferably, the surrounding edges are circular. Figure 4 The edge contour of the square shading portion 213 is only exemplarily shown. Since the pad 2061 is adapted to the shape of the vertical tube of the shading portion 208 of the shading member 204, the pad 2061 can be at least one of a circular ring, a square ring or a polygonal ring.

[0044] Optionally, the outer surface of the shading member 204 is mirror-finished to increase the reflection of light, so that the light entering the semiconductor cavity is more dispersed and has a wider angle, and it is not easy to have overexposed concentrated light, resulting in white light in some areas when the image is acquired. At the same time, the sleeve portion 209 and the shading portion 208 are integrated, and the reflection effect of the mirror is better.

[0045] Optionally, the inner surface of the shading member 204 is anodized to enhance the absorption of light reflected from the semiconductor cavity through the light-transmitting component 206 into the camera component, thereby reducing the influence of stray light on the edge of the camera end of the camera component.

[0046] The light source assembly 203 provided by the present invention is mainly used to illuminate the interior of the semiconductor cavity. In order to prevent the incident light generated by the light source assembly 203 from directly entering the camera assembly 202, the camera assembly 202 is surrounded by the light shielding member 204 to shield the incident light. In addition, the rubber pad 2061 matches the shape of the lower edge of the light shielding portion 211, which can prevent the light shielding member 204 from scratching or breaking the light-transmitting assembly 206, and can also play a sealing role, further preventing the camera assembly 202 from being affected by unexpected light leakage, thereby causing the edge of the image captured by the camera assembly 202 to be overexposed.

[0047] Optionally, the light source assembly 203 includes a light source 218 and a reflective plate 219, the light source 218 and the reflective plate 219 are connected, the light source 218 emits light in the opposite direction of the hole, and the reflective plate 219 reflects the light to the hole, forming part of the optical path S.

[0048] Optionally, the light source 218 is annular and is disposed around the camera assembly 202 to surround the camera assembly 202. Figure 2-3 ,like Figure 2-3As shown, the light source 218 is connected to the reflective plate 219, and the light source 218 emits light in the opposite direction of the hole of the cavity wall 100, and the reflective plate 219 reflects the light to the optical path S formed by the hole; the light source may be annular and arranged around the camera assembly 202; the reflective plate 219 is in a dome shape, and the light source 218 is arranged at the edge of the dome shape of the reflective plate 219. The dome shape includes a first part and a second part connected, the first part and the second part are connected, the cross section of the first part is arc-shaped, and the cross section of the second part is horizontally arranged, the light source 218 is arranged at one end of the first part of the reflective plate 219 away from the second part, and is arranged toward the reflective surface of the reflective plate 219, and a first opening is arranged in the middle of the second part of the reflective plate 219, and the camera assembly 202 and the sleeve portion 209 pass through the first opening. Optionally, the light source 218 may be an LED lamp.

[0049] The complete optical path S includes a first path in which the light source 218 emits light in the opposite direction of the hole to the reflecting plate 219, a second path in which the light is reflected by the reflecting plate 219 and irradiated into the semiconductor cavity, and a third path in which the light is reflected by the semiconductor cavity and irradiated into the camera assembly.

[0050] Optionally, the reflective plate 219 is connected to the cover 201, specifically, connected to the cover 201 via a second part.

[0051] The housing 201 includes a housing body 223 and a fixing portion 224 . The camera assembly 202 , the light source assembly 203 , and the light shielding member 204 are all disposed in the housing 201 . The cover body 223 may be barrel-shaped, such as a round barrel, a square barrel or a polygonal barrel, including but not limited to the above; the cover body 223 may include a first connection part, a second connection part and a third connection part, the first connection part is an annular lug arranged on the barrel edge of the barrel of the cover body 223, the second connection part is arranged between the first connection part and the third connection part, the second connection part is a barrel wall, and the third connection part is a barrel top; the first connection part is used to connect the light-transmitting component 206, the second connection part is connected to the first connection part in an "L" shape in cross section, the third connection part is connected to the second connection part and forms the top of the cover body 223, the third connection part is provided with a second opening in the third connection part of the cover body 223, the second opening is arranged corresponding to the first opening, the camera component 202 and the sleeve part 209 are both connected to the cover shell 201 through the second opening. The second part of the reflective plate 219 is fixed to the inner surface of the edge of the second opening of the third connecting part of the cover body 223. The camera assembly 202 and the sleeve part 209 are respectively connected to the fixing part 224 through the first opening and the second opening. The fixing part 224 is arranged on the outer surface of the cover body 223 corresponding to the second opening, and the fixing part 224 is connected to the cover body 223.

[0052] The camera module 200 further includes a light-transmitting component fixing portion 207, through which the light-transmitting component 206 is connected to the cavity wall 100. The light-transmitting component fixing portion 207 includes a first ring portion 221 and a second ring portion 222, the first ring portion 221 and the second ring portion 222 are connected, and the light-transmitting component 206 is connected to the second ring portion 222. The first ring portion 221 and the second ring portion 222 may both be annular, the first ring portion 221 forms an upper ring, the second ring portion 222 forms a lower ring, the light-transmitting component fixing portion 207 is formed as a ring including the upper ring and the lower ring, and the cross-sections of the upper ring and the lower ring are formed as a "Z" shape as a whole. Specifically, the inner side of the lower surface and the outer side of the upper surface of the ring are both formed as an "L" shape. The upper surface of the light-transmitting component 206 is connected to the lower surface of the first ring portion 221 , and a gap is formed between the outer edge of the light-transmitting component 206 and the second ring portion 222 on one side thereof facing the second ring portion 222 , and the gap matches with the hole.

[0053] Optionally, the light-transmitting component 206 is arranged flush with the lower surface of the second ring portion 222 away from the lower surface of the camera component. The light-transmitting component 206 is circular, and a sealing ring (O-ring) is arranged between the light-transmitting component 206 and the first ring portion 221 to achieve gas sealing.

[0054] The light-transmitting component fixing part 207 detachably connects the light-transmitting component 206 to the semiconductor cavity by means of screws, etc. At the same time, the cover 201 detachably fixes the camera component 202, the light source component 203 and the light shielding member 204 to the upper surface of the second ring part 222 of the light-transmitting component fixing part 207 to facilitate inspection and maintenance. For example, when inspecting or maintaining the camera component, or when installing the camera component, it is only necessary to remove the bolts connecting the cover 201 and the upper surface of the first ring part 221 of the light-transmitting component fixing part 207.

[0055] Optionally, the first connecting portion of the cover body 223 is connected to the upper surface of the second ring portion 222 of the light-transmitting component fixing portion 207 , and specifically, can be connected to the “L” shape outside the upper surface of the light-transmitting component fixing portion 207 .

[0056] Optionally, the detachable connection between the second portion of the reflector 219 and the third connection portion of the cover 223 may be bolted. The connection between the fixing portion 224 and the cover 223 is bolted. The connection between the camera assembly 202, the sleeve portion 209 and the fixing portion 224 is bolted.

[0057] Specifically, the sleeve portion 209 is connected to the fixing portion 224 through the threaded hole on the connecting ear 216, and the camera assembly 202 is connected to the fixing portion 224 through a bolt. With such a design, when it is necessary to replace either the camera assembly 202 or the light shielding member 204, the fixing portion 224 can be separated from the cover body 223 first, and then the fixing portion 224 can be pulled upwards, and the camera assembly 202 and the light shielding member 204 can be taken out from the second outlet of the cover body 223, so that the camera assembly 202 and the light shielding member 204 can be quickly replaced.

[0058] In summary, the present invention can reduce the light flux emitted from the light source component in the optical path to the semiconductor cavity by setting the shading member, thereby ensuring that the shooting component takes clear pictures. Since the shading member is set, the camera component is separated from the light source component, and the airtight contact between the shading member and the light-transmitting component is ensured, thereby ensuring that light cannot leak out from between the shading member and the light-transmitting component. The outer surface of the shading member can be surface treated, and the inner surface can be anodized. On the one hand, the light is incident at multiple angles into the semiconductor cavity, which increases the irradiation range and reduces the concentration of light and causes overexposure of the imaging. On the other hand, it reduces the multiple reflections of the reflected light on the inner surface of the shading member, thereby affecting the imaging effect.

[0059] Although the content of the present invention has been described in detail through the above content, it should be recognized that the above description should not be considered as a limitation of the present invention. After reading the above content, various modifications and substitutions of the present invention will be obvious to those skilled in the art. Therefore, the protection scope of the present invention should be limited by the attached patent application scope. The above is only an example of a preferred embodiment of the present invention, and is not intended to limit the scope of implementation. All simple replacements and equivalent changes made according to the patent application scope of this creation and the content of the patent specification belong to the scope of the patent application of this creation.

Claims

1. A camera module for a semiconductor cavity, wherein the semiconductor cavity comprises a hole, and the camera module is arranged in the hole, wherein: include: A camera assembly, used to acquire an image inside the semiconductor cavity; a light source assembly, forming an optical path between the light source assembly and the camera assembly, and used for providing illumination into the semiconductor cavity through the optical path; a light shielding member, the light shielding member comprising a sleeve portion and a light shielding portion, the sleeve portion being arranged around a body of the camera assembly, the light shielding portion being arranged around a lens end of the camera assembly, the light shielding portion being used to reduce a light flux emitted from the light source assembly in the optical path to the semiconductor cavity; A housing, wherein the camera assembly, the light source assembly and the light shielding member are all disposed in the housing; One end of the sleeve portion is connected to the cover shell, and the other end of the sleeve portion is connected to the shading portion. The sleeve portion and the shading portion are integrated, and the shading member includes a metal material.

2. The camera module according to claim 1, wherein: The outer surface of the shading member is mirror-finished, and the inner surface of the shading member is anodized.

3. The camera module according to claim 1, wherein: Also includes: A light-transmitting component is disposed between the camera component and the hole.

4. The camera module according to claim 3, wherein: A pad is arranged on the light-transmitting component, and the pad is in contact with the edges around the light-shielding portion.

5. The camera module according to any one of claims 1 to 4, characterized in that: The edges of the shading portion are circular or square.

6. The camera module according to any one of claims 1 to 4, characterized in that: The light source assembly includes a light source and a reflective plate, wherein the light source and the reflective plate are connected, the light source emits light in the opposite direction of the hole, and the reflective plate reflects the light to the hole to form part of the optical path.

7. The camera module according to claim 6, wherein: The light source is annular and is arranged around the camera assembly; the reflector is dome-shaped, and the light source is arranged on the dome-shaped edge of the reflector.

8. The camera module according to claim 7, wherein: The reflective plate is connected to the cover shell.

9. The camera module according to claim 8, wherein: The cover shell comprises a cover body and a fixing portion, and the camera assembly and the sleeve portion are both connected to the cover body through the fixing portion.

10. The camera module according to claim 9, wherein: The camera module also includes a light-transmitting component fixing portion, and the light-transmitting component is connected to the semiconductor cavity through the light-transmitting component fixing portion; the cover shell is fixed on the light-transmitting component fixing portion.

11. A semiconductor cavity, characterized in that: include: a cavity wall, the cavity wall comprising an aperture; The camera module as described in any one of claims 1-10, wherein the camera module is arranged in the hole to obtain the state inside the semiconductor cavity.

Images