Gas mixing device and laser processing equipment

Abstract

The invention discloses a gas mixing device and laser processing equipment. The gas mixing device comprises at least two gas mixing tanks, a first gas inlet channel and a second gas inlet channel. Wherein the at least two gas mixing tanks are sequentially connected in series through a first pipeline, and the gas mixing tank located at the end of the at least two gas mixing tanks connected in series is a first gas mixing tank; the first gas inlet channel is communicated with the first gas mixing tank so as to be used for introducing first gas into the first gas mixing tank; the second gas inlet channel communicates with the gas mixing tanks so as to be used for introducing second gas into the gas mixing tanks. The gas mixing device and the laser processing equipment at least can solve the problems of poor mixing proportion accuracy and poor uniformity of mixed gas in the prior art.

Description

Technical Field

[0001] The present invention relates to the field of laser cutting technology, and in particular to a gas mixing device and laser processing equipment. Background Art

[0002] Laser processing equipment focuses the laser emitted from the laser into a high-power density laser beam through the optical path system. The laser beam irradiates the surface of the workpiece, causing the workpiece to reach the melting point or boiling point, and at the same time, the high-pressure gas coaxial with the beam blows away the molten or vaporized metal. As the relative position of the beam and the workpiece moves, the material eventually forms a slit, thereby achieving the purpose of cutting. Laser cutting replaces the traditional mechanical knife with an invisible beam, and has the characteristics of high precision, fast cutting, no limitation on cutting patterns, automatic typesetting to save materials, smooth incisions, and low processing costs. It will gradually improve or replace traditional metal cutting process equipment.

[0003] However, auxiliary gas is usually required in the laser processing process. The auxiliary gases used in existing laser processing equipment are industrial oxygen, nitrogen and compressed air. The mixed gas needs to be prepared according to the cutting material and cutting environment requirements. In the prior art, the concentration stability and precision of the prepared mixed gas are relatively poor, resulting in a relatively slow laser processing process and increased production costs. Summary of the invention

[0004] The main purpose of the present invention is to provide a gas mixing device and laser processing equipment, which at least solve the problems of poor mixing ratio accuracy and poor uniformity of mixed gases in the prior art.

[0005] According to one aspect of the present invention, there is provided a gas mixing device, comprising:

[0006] At least two gas mixing tanks, wherein the at least two gas mixing tanks are sequentially arranged in series through a first pipeline, wherein one of the at least two gas mixing tanks arranged in series and located at the end is a first gas mixing tank;

[0007] a first air inlet passage, the first air inlet passage being in communication with the first gas mixing tank for introducing a first gas into the first gas mixing tank;

[0008] A second air inlet passage, wherein the second air inlet passage is communicated with each of the gas mixing tanks to be used for introducing a second gas into each of the gas mixing tanks.

[0009] Furthermore, the gas mixing device further comprises a second gas mixing tank, and the first gas mixing tank and the second gas mixing tank are connected through the first pipeline so as to pass the gas in the first gas mixing tank into the second gas mixing tank;

[0010] The second gas mixing tank is also provided with a gas outlet channel, and the gas outlet channel is used to output the gas in the second gas mixing tank for cutting objects.

[0011] Furthermore, along the direction approaching the first gas mixing tank, the first air intake passage is provided with a first control valve, a first pressure reducing valve, a first flow meter, a first flow control valve and a first check valve in sequence.

[0012] Furthermore, the second air intake passage includes a main pipeline, a first branch branch and a second branch branch, the two ends of the first branch branch are respectively connected to the first gas mixing tank and the main pipeline, and the two ends of the second branch branch are respectively connected to the second gas mixing tank and the main pipeline.

[0013] Furthermore, along the direction approaching the first gas mixing tank, a second pressure reducing valve, a second flow meter, a second flow control valve and a second one-way valve are sequentially arranged on the first flow branch.

[0014] Furthermore, along the direction approaching the second gas mixing tank, a third pressure reducing valve, a third flow meter, a third flow control valve and a third one-way valve are sequentially arranged on the second flow branch.

[0015] Furthermore, a second control valve is provided on the main pipeline.

[0016] Furthermore, the second gas mixing tank is in communication with the main pipeline via a second pipeline, a third control valve is further provided on the second pipeline, and the position where the second pipeline is connected to the main pipeline is located at the outlet side of the second control valve.

[0017] Furthermore, along the direction approaching the second gas mixing tank, a fourth pressure reducing valve, a fourth flow meter, a fourth flow control valve and a fourth check valve are sequentially arranged on the first pipeline.

[0018] On the other hand, the present application also provides a laser processing equipment, which includes the above-mentioned gas mixing device.

[0019] In the present invention, the gas mixing device can be used to mix at least two gases to achieve precise mixing of small-proportion gases. When the laser processing equipment needs to use a mixed small-proportion auxiliary gas, the first gas is introduced into the first air inlet channel and enters the first gas mixing tank; then the second gas is introduced into the second air inlet channel and also enters the first gas mixing tank, and the first gas and the second gas are fully mixed in the first gas mixing tank to form a mixed gas; then the mixed gas is transported to another gas mixing tank through the first pipeline, and the mixed gas coming out of the first gas mixing tank can be mixed again in another gas mixing tank according to the required ratio of the mixed gas. That is to say, in this embodiment, by setting at least two gas mixing tanks, at least two gases are fully mixed multiple times in different proportions to achieve the required small-proportion gas accuracy during laser processing, and at the same time, the structure of using at least two gas mixing tanks improves the uniformity of the gas mixture and ensures the stability of the processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0021] Figure 1 The present invention discloses a gas mixing principle diagram of a gas mixing device according to an embodiment of the present invention.

[0022] The above drawings include the following reference numerals:

[0023] 10. First gas mixing tank; 20. Second gas mixing tank; 30. First pipeline; 31. Fourth pressure reducing valve; 32. Fourth flow meter; 33. Fourth flow control valve; 34. Fourth non-return valve; 40. First air inlet channel; 41. First control valve; 42. First pressure reducing valve; 43. First flow meter; 44. First flow control valve; 45. First non-return valve; 50. Second air inlet channel; 51. Main pipeline; 511. Second control valve; 52. First flow branch; 521. Second pressure reducing valve; 522. Second flow meter; 523. Second flow control valve; 524. Second non-return valve; 53. Second flow branch; 531. Third pressure reducing valve; 532. Third flow meter; 533. Third flow control valve; 534. Third non-return valve; 60. Air outlet channel; 70. Second pipeline; 71. Third control valve. DETAILED DESCRIPTION

[0024] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0025] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit exemplary embodiments according to the present invention. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprising" and / or "including" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0026] Unless otherwise specifically stated, the relative arrangement of the parts and steps described in these embodiments, numerical expressions and numerical values ​​do not limit the scope of the present invention. At the same time, it should be understood that, for ease of description, the sizes of the various parts shown in the accompanying drawings are not drawn according to the actual proportional relationship. The technology, methods and equipment known to ordinary technicians in the relevant field may not be discussed in detail, but in appropriate cases, the technology, methods and equipment should be regarded as a part of the authorization specification. In all examples shown and discussed here, any specific value should be interpreted as being merely exemplary, rather than as a limitation. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once a certain item is defined in an accompanying drawing, it does not need to be further discussed in subsequent drawings.

[0027] As mentioned in the background technology, in the prior art, auxiliary gas is required in the process of laser processing, but the concentration stability and precision of the prepared mixed gas are relatively poor, resulting in a relatively slow laser processing process and a certain increase in production costs. To this end, the present application provides a gas mixing device, which can perform secondary mixing of gases, improve the precise mixing of small proportions of gases, ensure the uniformity of the mixed gas, and thus help improve the working efficiency of laser processing equipment and reduce production costs. The gas mixing device of the present application will be described in detail below in conjunction with the accompanying drawings.

[0028] like Figure 1 As shown, according to an embodiment of the present application, a gas mixing device is provided. Specifically, the gas mixing device includes at least two gas mixing tanks, a first air intake channel 40 and a second air intake channel 50 .

[0029] In this embodiment, at least two gas mixing tanks are arranged in series in sequence through a first pipe 30, wherein one of the at least two gas mixing tanks arranged in series and located at the end is a first gas mixing tank 10; a first air inlet channel 40 is connected to the first gas mixing tank 10 for introducing the first gas into the first gas mixing tank 10; and a second air inlet channel 50 is connected to each gas mixing tank for introducing the second gas into each gas mixing tank.

[0030] In actual use, the gas mixing device of this embodiment can be used to mix at least two gases to achieve accurate mixing of small-proportion gases. When the laser processing equipment needs to use a mixed small-proportion auxiliary gas, the first gas is introduced into the first air inlet channel 40 and enters the first gas mixing tank 10; the second gas is introduced into the second air inlet channel 50 and also enters the first gas mixing tank 10, and the first gas and the second gas are fully mixed in the first gas mixing tank 10 to form a mixed gas; the mixed gas is then transported to another gas mixing tank through the first pipeline 30, and the mixed gas coming out of the first gas mixing tank 10 can be mixed again in another gas mixing tank according to the required ratio of the mixed gas. That is to say, in this embodiment, by setting at least two gas mixing tanks, at least two gases are fully mixed multiple times according to different ratios, so as to achieve the required small-proportion gas accuracy during laser processing, and at the same time, the structure of using at least two gas mixing tanks improves the uniformity of the gas mixture and ensures the stability of the processing.

[0031] In this embodiment, at least two gas mixing tanks are provided, and at least two gas mixing tanks are directly provided in series through the first pipe 30. Exemplarily, the number of gas mixing tanks can be 2, 3, 4, 5, etc. In this embodiment, two gas mixing tanks are provided as an example for description.

[0032] Specifically, the gas required for use in the laser cutting process can be industrial oxygen, nitrogen, argon, and compressed air, etc., or a nitrogen-oxygen mixture can be used. This mixed gas is widely used and can take into account both cutting speed and cutting quality to a certain extent. It can also be a combination of argon-oxygen and argon-nitrogen. The mixed gas used in the laser welding process can be a binary mixed gas: including argon-helium, argon-nitrogen, argon-oxygen, etc.; it can also be a ternary mixed gas: argon-helium-nitrogen, argon-helium-oxygen, argon-helium-carbon dioxide, etc.; it can also be a quaternary mixed gas: mainly argon, helium, nitrogen, carbon dioxide, hydrogen, etc. are prepared in a certain proportion, and this mixed gas can be customized according to specific welding requirements. In this way, using several gases for mixing during laser processing can reduce production costs, be green and environmentally friendly, and improve cutting efficiency or welding efficiency. The selection of the first gas and the second gas can be selected according to the specific laser processing equipment and the processed materials, and this application does not make specific restrictions.

[0033] Furthermore, in the present embodiment, the gas mixing device further includes a second gas mixing tank 20, and the first gas mixing tank 10 and the second gas mixing tank 20 are connected through a first pipe 30, so that the mixed gas in the first gas mixing tank 10 can be transported to the second gas mixing tank. An outlet channel 60 is also provided on the second gas mixing tank 20, and the outlet channel 60 is used to output the mixed gas in the second gas mixing tank 20 for cutting objects. According to actual processing needs, if the mixed gas in the first gas mixing tank 10 meets the processing needs, it can be directly used for production and processing; if the mixed ratio of the mixed gas does not meet the actual needs, the mixed gas is transported to the second gas mixing tank 20, the first gas is input through the first gas inlet channel 40 or the second gas is transported through the second gas inlet channel 50, and mixed again in the second gas mixing tank 20 to meet the processing needs.

[0034] See also Figure 1 As shown, along the direction close to the first gas mixing tank 10, the first control valve 41, the first pressure reducing valve 42, the first flow meter 43, the first flow control valve 44 and the first check valve 45 are sequentially arranged on the first gas inlet channel 40. When mixing gas, the first control valve 41 is first opened to allow the first gas to smoothly enter the first gas inlet channel 40; then the first pressure reducing valve 42 is adjusted to keep the gas flow pressure in the first gas inlet channel 40 in a suitable range, within which the required precision can be achieved. According to actual processing needs, the first flow meter 43 cooperates with the first flow control valve 44 to limit the flow of gas entering the first gas mixing tank 10. Specifically, when the first gas passes through the first gas inlet channel 40 and is monitored by the first flow meter 43, if the gas flow exceeds the set value, the flow can be reduced by adjusting the first flow control valve 44; if the gas flow is less than the set value, the gas flow can be increased by adjusting the first flow control valve 44. Then the first gas enters the first gas mixing tank 10 from the first gas inlet channel 40 through the first check valve 45. If the first one-way valve 45 is not provided here, when the gas mixing device is working, the gas in the first gas mixing tank 10 will produce a backflow effect, thereby causing the purity of the gas entering the first gas mixing tank 10 to decrease, thereby affecting the ratio of the mixed gas to deviate from the ratio required by the laser processing equipment, and ultimately causing the working efficiency of the laser processing equipment to decrease.

[0035] See again Figure 1As shown, the second air inlet channel 50 includes a main pipeline 51, a first branch branch 52 and a second branch branch 53. The second air inlet channel 50 is used to introduce the second gas into the first gas mixing tank 10 and the second gas mixing tank 20. Specifically, the two ends of the first branch branch 52 are respectively connected to the first gas mixing tank 10 and the main pipeline 51, and the two ends of the second branch branch 53 are respectively connected to the second gas mixing tank 20 and the main pipeline 51. After the second gas is introduced into the main pipeline 51, the second gas can flow from the first branch branch 52 into the first gas mixing tank 10, and enter the second gas mixing tank 20 after mixing with the first gas in the first gas mixing tank 10. According to actual needs, the second gas can be introduced into the second gas mixing tank 20 again through the second branch branch 53 for further mixing, so as to achieve the ratio requirement of the mixed gas required by the laser processing equipment.

[0036] Furthermore, along the direction close to the first gas mixing tank 10, the first flow branch 52 is sequentially provided with a second pressure reducing valve 521, a second flow meter 522, a second flow control valve 523 and a second check valve 524. In this way, the pressure on the second air inlet channel 50 is regulated by adjusting the second pressure reducing valve 521 to ensure the required accuracy of air intake. The flow rate of the second gas is maintained at an appropriate value by adjusting the second flow control valve 523. When both the first gas and the second gas enter the first gas mixing tank 10, the first flow control valve 44 and the second flow control valve 523 can be adjusted respectively to reduce the gas flow rate entering the first gas mixing tank 10; if it is necessary to fully mix the first gas and the second gas in the first gas mixing tank 10, the two flow control valves can be closed respectively. The setting of the flow control valve improves the controllability of the mixed gas ratio to a certain extent. Consistent with the function of the first one-way valve 45, a second one-way valve 524 is also provided on one end of the first branch 52 close to the first gas mixing tank 10 to prevent the gas entering the first gas mixing tank 10 from flowing back, causing the gas concentration to change so that the proportion of the mixed gas changes, thereby affecting the use of the laser processing equipment.

[0037] Further, along the direction close to the second gas mixing tank 20, the second branch flow 53 is sequentially provided with a third pressure reducing valve 531 to ensure that the pressure on the second branch flow 53 is within a precise range. By controlling the third flow control valve 533 to make the flow of the second gas within a suitable range, corresponding adjustments can be made according to the value on the third flow meter 532 to ensure that the proportion of the second gas meets the corresponding requirements; at the same time, a third check valve 534 is also provided on the second branch flow 53 to prevent the gas from flowing back, thereby reducing the purity of the second gas entering the second gas mixing tank 20. When the gas mixing device in this embodiment is working, the first gas and the second gas are first mixed in the first gas mixing tank 10 and then enter the second gas mixing tank 20 through the first pipeline 30 for secondary mixing. At this time, if the mixing ratio of the second gas does not reach the ratio required by the laser processing equipment, the second gas can be introduced again from the second branch flow 53 to mix again with the mixed gas from the first gas mixing tank 10, thereby ensuring a small proportion of gas mixing.

[0038] like Figure 1 As shown, a second control valve 511 is provided on the main pipeline 51 on the second air intake passage 50 . The second control valve 511 can realize effective control of the intake air on the second air intake passage 50 .

[0039] In this embodiment, the second gas mixing tank 20 is connected to the main pipeline 51 through the second pipeline 70. In this way, when the mixing ratio of the mixed gas in the second gas mixing tank 20 does not meet the use requirements of the laser processing equipment, the mixed gas needs to be mixed again. After the second gas mixing tank 20 is connected to the main pipeline 51, the gas after the secondary mixing is mixed again through the first branch branch 52 or the second branch branch 53 until the requirements of the equipment are met. In addition, a third control valve 71 is also provided on the second pipeline 70, and the position where the second pipeline 70 is connected to the main pipeline 51 is located at the outlet side of the second control valve 511. In this way, when the mixed gas in the second gas mixing tank 20 needs to be mixed, the flow of gas is realized by adjusting and controlling the second control valve 511 and the third control valve 71. When the gas is mixed in the second gas mixing tank 20, closing the third control valve 71 can ensure that the gas is fully mixed and improve the uniformity of the gas mixture. When the gas mixture is evenly mixed, the mixed gas can be provided to the laser processing equipment for use through the gas outlet channel 60 on the second gas mixing tank 20 to improve the efficiency of laser processing and ensure the quality of processed products. In other embodiments, the second gas mixing tank 20 may not be connected to the main pipeline 51, and the mixed gas can be directly output for use by the equipment after the gas mixing in the second gas mixing tank 20 is completed.

[0040] Furthermore, along the direction close to the second gas mixing tank 20, the first pipeline 30 is sequentially provided with a fourth pressure reducing valve 31, a fourth flow meter 32, a fourth flow control valve 33 and a fourth check valve 34. Just like the functions of the pressure reducing valve, flow meter, flow control valve and check valve, the fourth pressure reducing valve 31 can ensure that the pressure on the first pipeline 30 is in a suitable range, so as to ensure that the mixed gas in the first gas mixing tank 10 can smoothly enter the second gas mixing tank 20. At the same time, the flow rate of the corresponding mixed gas can be adjusted by controlling the fourth flow control valve 33 according to the proportion of the gas that needs to be secondary mixed in the second gas mixing tank 20. The fourth check valve 34 can prevent the mixed gas from flowing back, causing the proportion of the gas in the second gas mixing tank 20 to change, thereby affecting the final mixing ratio of the mixed gas. Through the above-mentioned settings, the controllability of the gas mixture is guaranteed, the small proportion of gas mixture is achieved, and the uniformity of the gas mixture is guaranteed.

[0041] That is to say, in this embodiment, the above-mentioned setting can realize multiple gas mixing, which can be mainly divided into the following types: (1) the first gas enters the first gas mixing tank 10 through the first gas inlet channel 40, and the second gas enters the first gas mixing tank 10 through the first branch branch 52 of the second gas inlet channel 50 for mixing; (2) the mixed gas coming out of the first gas mixing tank 10 meets the second gas passing through the second branch branch 53 on the second gas inlet channel 50 in the pipeline and enters the second gas mixing tank 20 for secondary mixing, so that a small proportion of gas mixing can be realized. If the proportion of the mixed gas at this time meets the use requirements of the laser processing equipment, it can be directly The mixed gas is output for production and processing; (3) If the proportion of the first gas in the secondary mixed mixed gas needs to be smaller, the second mixed gas is passed through the second pipeline 70 through the first branch 52 into the first gas mixing tank 10, and the second gas is introduced again through the second branch 53 to achieve a smaller mixing ratio; (4) If the proportion of the second gas in the secondary mixed mixed gas needs to be smaller, the secondary mixed gas can be introduced into the second branch 53 again, and the first gas is introduced through the first air inlet channel 40 and through the first pipeline 30, and mixed again in the second gas mixing tank 20 to achieve a smaller mixing ratio. If more small-proportion mixed gases are needed, the above method can be continued. Only some embodiments are listed in this embodiment. In actual production and processing, corresponding mixing methods can be adopted according to actual use requirements.

[0042] Specifically, this embodiment uses the principle of multiple mixed gas control structure design to ensure small-proportion gas mixing. By setting at least two gas mixing tanks, the uniformity of the gas mixing is ensured, and a first gas intake channel 40 and a second gas intake channel 50 are set between the two gas mixing tanks, wherein the second gas intake channel 50 includes a main pipeline 51, a first branch branch 52 and a second branch branch 53, and the first pipeline 30, a four-way flow control design is realized to ensure the accurate gas mixing ratio.

[0043] On the other hand, Figure 1 As shown, the present application also provides a laser processing equipment. Specifically, the laser processing equipment can be a laser welder or a laser cutting machine. A laser welder is a device that uses a laser beam as a heat source to melt and connect metals or other materials. It has the characteristics of high precision, high efficiency, high degree of automation, and small deformation of workpieces. A laser cutting machine is a device that uses the high energy density of a laser beam to cut metal or non-metallic materials. The main features of a laser gas cutting machine are: high-precision cutting, high speed, flexibility, non-contact processing, and applicability to a variety of materials.

[0044] The above two types of laser processing equipment require the use of mixed gases for assistance during use. Among them, the auxiliary gases required for the laser cutting machine include industrial oxygen, nitrogen, argon and compressed air, among which nitrogen-oxygen mixture is widely used and can take into account both cutting speed and cutting quality to a certain extent. The mixed gases used in the laser welding process include argon-helium, argon-nitrogen, argon-oxygen, etc. In the actual production and processing process, the required mixed gas is customized according to actual needs. In this embodiment, whether the above-mentioned gas mixing device is used in a laser welder or a laser cutting machine, it can reduce production costs, achieve green environmental protection, and improve cutting efficiency or welding efficiency.

[0045] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A gas mixing device, characterized in that: include: At least two gas mixing tanks, the at least two gas mixing tanks being sequentially arranged in series via a first pipeline (30), wherein one of the at least two gas mixing tanks arranged in series and located at an end is a first gas mixing tank (10); a first air inlet passage (40), the first air inlet passage (40) being in communication with the first gas mixing tank (10) so as to be used for introducing a first gas into the first gas mixing tank (10); A second air inlet passage (50), wherein the second air inlet passage (50) is in communication with each of the gas mixing tanks so as to be used for introducing a second gas into each of the gas mixing tanks.

2. The gas mixing device according to claim 1, characterized in that: The gas mixing device further comprises a second gas mixing tank (20), wherein the first gas mixing tank (10) and the second gas mixing tank (20) are connected via the first pipeline (30) so as to pass the gas in the first gas mixing tank (10) into the second gas mixing tank (20); The second gas mixing tank (20) is also provided with a gas outlet channel (60), and the gas outlet channel (60) is used to output the gas in the second gas mixing tank (20) for cutting objects.

3. The gas mixing device according to claim 2, characterized in that: Along a direction close to the first gas mixing tank (10), the first air inlet passage (40) is provided with a first control valve (41), a first pressure reducing valve (42), a first flow meter (43), a first flow control valve (44) and a first check valve (45) in sequence.

4. The gas mixing device according to claim 2, characterized in that: The second air intake passage (50) comprises a main pipeline (51), a first branch flow path (52) and a second branch flow path (53); two ends of the first branch flow path (52) are respectively connected to the first gas mixing tank (10) and the main pipeline (51); and two ends of the second branch flow path (53) are respectively connected to the second gas mixing tank (20) and the main pipeline (51).

5. The gas mixing device according to claim 4, characterized in that: Along the direction approaching the first gas mixing tank (10), the first flow branch (52) is provided with a second pressure reducing valve (521), a second flow meter (522), a second flow control valve (523) and a second check valve (524) in sequence.

6. The gas mixing device according to claim 4, characterized in that: Along the direction approaching the second gas mixing tank (20), the second flow branch (53) is provided with a third pressure reducing valve (531), a third flow meter (532), a third flow control valve (533) and a third non-return valve (534) in sequence.

7. The gas mixing device according to any one of claims 4, characterized in that: The main pipeline (51) is provided with a second control valve (511).

8. The gas mixing device according to claim 7, characterized in that: The second gas mixing tank (20) is in communication with the main pipeline (51) via a second pipeline (70); a third control valve (71) is also provided on the second pipeline (70); and the position where the second pipeline (70) is connected to the main pipeline (51) is located at the outlet side of the second control valve (511).

9. The gas mixing device according to any one of claims 2 to 7, characterized in that: Along the direction approaching the second gas mixing tank (20), the first pipeline (30) is provided with a fourth pressure reducing valve (31), a fourth flow meter (32), a fourth flow control valve (33) and a fourth check valve (34) in sequence.

10. A laser processing device, characterized in that: The laser processing equipment includes the gas mixing device according to any one of claims 1 to 9.

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