Wafer UV film rolling and pasting device and technology thereof

Abstract

The invention relates to a wafer UV film rolling and pasting device and technology. The wafer UV film rolling and pasting device comprises a frame body, a material box, a movable platform, a film rolling assembly, a film pulling assembly, a film cutting assembly, a film throwing assembly, an attaching assembly and an easy-to-tear pasting assembly. The attaching assembly comprises a cavity, a vacuumizing piece and a plurality of attaching rubber rollers; when the moving platform moves to the position below the cavity, the cavity and the moving platform form a sealed cavity. The UV film is guided and tensioned through the film rolling assembly and the film pulling assembly, a wafer is conveyed to the film cutting assembly through the moving platform to be cut, and waste films in the film cutting process are discarded and blown away through the film discarding assembly; the wafer is conveyed to the lower portion of the cavity and the film pasting assembly to be subjected to vacuumizing treatment and film pasting, automatic film rolling, film pulling, film cutting and film pasting are achieved, and the working efficiency is improved. Before film pasting, the wafer is subjected to heating treatment and vacuumizing treatment, bubbles can be avoided, and the film pasting effect is improved; and the easy-to-tear sticker is attached after the film is pasted, so that the easy-to-tear sticker is convenient to tear when in use.

Description

Technical Field

[0001] The present invention relates to the technical field of automation equipment, and more specifically, to a wafer UV roll film laminating device and a process thereof. Background Art

[0002] In semiconductor equipment, wafers are a basic material for manufacturing semiconductor chips. The surface needs to be treated with UV film, which can protect the surface of the wafer. The UV film is in the form of rolls, and the UV film needs to be kept neat and clean for attachment.

[0003] The traditional process is to cut the UV film manually or with tools, and then transport it to the application site. This processing method is inefficient, requires a certain level of worker proficiency, and is prone to cause a large amount of material loss as well as bubbles and scratches on the wafer surface, resulting in poor film application results. Summary of the invention

[0004] The technical problem to be solved by the present invention is that the traditional process is inefficient and easily causes material loss, resulting in bubbles and scratches on the wafer surface, resulting in poor film laminating effect. In view of the above-mentioned defects of the prior art, a wafer UV roll film laminating device and a process thereof are provided.

[0005] The technical solution adopted by the present invention to solve its technical problem is: A wafer UV roll film laminating device is constructed, comprising a frame and a material box for placing wafers, wherein the material box is arranged on the frame; wherein the device comprises a mobile platform, a film rolling assembly, a film pulling assembly, a film cutting assembly, a film throwing assembly, an attaching assembly and an easy-tear laminating assembly for attaching easy-tear laminating adhesives, wherein the mobile platform is movably arranged on the frame and can be displaced to the bottom of the film cutting assembly or to the bottom of the attaching assembly; the film rolling assembly is arranged on the frame, the film pulling assembly is arranged on one side of the film rolling assembly; the film cutting assembly is located above the film pulling assembly; The film throwing assembly is arranged on one side of the film cutting assembly; the attaching assembly is arranged on one side of the film cutting assembly; the easy-tear attaching assembly is arranged on one side of the attaching assembly; the attaching assembly includes a cavity, a vacuum pump and a plurality of attaching rubber rollers, the attaching rubber rollers are respectively located in the cavity, and the vacuum pump is arranged on one side of the cavity; when the movable platform is displaced to the bottom of the cavity, the cavity moves downward and forms a sealed chamber with the movable platform, the vacuum pump operates and extracts the air in the sealed chamber, and the attaching rubber rollers move and attach film to the wafer.

[0006] Furthermore, the mobile platform is provided with a mobile plate, a placement table, a plurality of first guide rails and a support plate, the first guide rails are fixedly arranged on the frame, the mobile plate is movably arranged on the first guide rails, and the support plate is vertically arranged between the mobile plate and the placement table; the placement table is horizontally arranged and used to place wafers.

[0007] Furthermore, the mobile platform is also provided with a heating device, which is arranged on the placement table and attached to the wafer to heat the wafer.

[0008] Furthermore, the heating device includes a heating plate and a plurality of heating rods, wherein the heating rods are arranged around the outside of the heating plate and in contact with the heating plate; and the heating plate is bonded to the bottom surface of the wafer.

[0009] Furthermore, the cavity is provided with a mounting plate, a lifting module for driving the mounting plate to move, a cylinder guide shaft, a pressure gauge, a plurality of first cylinders and second cylinders, the first cylinder and the second cylinder are respectively fixed on the mounting plate; the lifting module is fixedly connected to the mounting plate; one end of the cylinder guide shaft is fixedly connected to the cavity, and the other end is slidably connected to the mounting plate; one end of the second cylinder is fixedly connected to the mounting plate, and the other end is fixedly connected to the cavity; the first cylinder and the second cylinder simultaneously drive the cavity to move along the cylinder guide shaft to apply downward pressure to the attached component; the pressure gauge is fixed on the frame.

[0010] Furthermore, the frame is fixedly provided with a second guide rail, and the second guide rail is vertically arranged on the first guide rail; the cavity and the mounting plate are respectively provided with sliders corresponding to the second guide rail, and the sliders are displaced along the second guide rail.

[0011] Furthermore, the film roll assembly includes a base, a vertical plate, a first film roll barrel, a second film roll barrel, a pressing piece, a fixing piece and a plurality of guide barrels, the base is arranged on the frame, and the vertical plate is vertically arranged on the base; the first film roll barrel and the second film roll barrel are rotatably arranged on one side of the vertical plate; and the guide barrel is detachably connected to the vertical plate; the UV film is respectively wound around the first film roll barrel, the guide barrel, the pressing piece, the fixing piece and the second film roll barrel; the pressing piece is movably arranged on one side of the vertical plate close to the film cutting assembly, and tightens the UV film together with the first film roll barrel; the fixing piece is located below the pressing piece.

[0012] Furthermore, the film-pulling assembly includes a film-pulling module and a film-pulling piece, wherein the film-pulling module is arranged on the frame and located below the film-cutting assembly; the film-pulling piece is displaced along the film-pulling module and is used to pull out the UV film; the film-pulling piece is provided with a suction hole, which is arranged toward the UV film and is used to adsorb the UV film.

[0013] Furthermore, the film cutting assembly includes at least two film cutting components and at least three movable guide rails, and the film cutting components are movably arranged on the movable guide rails.

[0014] Furthermore, the film discarding assembly includes a film discarding part, an air blowing pipe and a waste barrel, the film discarding part is arranged on one side of the film cutting part, and the air blowing pipe faces the waste barrel.

[0015] Furthermore, the easy-tear sticker assembly includes an easy-tear sticker module, which is movably arranged on one side of the attaching rubber roller and is used for conveying and attaching the easy-tear sticker.

[0016] A wafer UV film laminating process comprises the following steps: Step 1: Take the wafer out of the cassette and place it on the mobile platform; Step 2: transporting the wafer to the bottom of the film cutting assembly via the mobile platform; Step 3: straighten the UV film from the film roll assembly by the film pulling assembly, and drive the film cutting assembly to perform primary and secondary cutting of the UV film according to the shape of the wafer; Step 4: transporting the wafer to the bottom of the cavity by the mobile platform, and heating the wafer by a preset heating device; Step 5: driving the cavity to move to a preset height value by means of the first cylinder and the second cylinder, and performing a vacuum process on the cavity by means of a vacuum pump; Step 6: performing film lamination on the wafer by a preset laminating rubber roller to obtain a film laminating wafer; Step 7: attaching an easy-tear sticker to the film wafer using a preset easy-tear sticker assembly.

[0017] Furthermore, after the step of straightening the UV film from the film roll assembly by the film pulling assembly and driving the film cutting assembly to perform primary cutting and secondary cutting of the UV film according to the shape of the wafer, the method further includes: The waste film is discarded through the preset film discarding device; The waste film is blown away through a preset air blowing pipe.

[0018] The beneficial effects of the present invention are: the UV film is guided and tensioned by the film rolling assembly and the film pulling assembly, which is convenient for cutting and recycling; the wafer is transported to the bottom of the film cutting assembly by the mobile platform, and the film cutting assembly can cut the film according to the shape of the wafer. During this period, the film throwing assembly discards and blows away the waste film in the film cutting process; then the wafer is transported to the bottom of the cavity and the film sticking assembly for vacuum treatment and film sticking, which can realize automatic film rolling, film pulling, film cutting and film sticking, greatly improving work efficiency. Before the film sticking process, the present invention heats and vacuums the wafer, so that the UV film can be more accurately attached to the wafer surface, avoid the generation of bubbles, and improve the film sticking effect; after cutting the film, the waste film is discarded and blown away by the provided film throwing assembly, so that the waste film is discarded more thoroughly, and the easy-tear sticker is attached to the wafer after the film is stuck by the easy-tear sticker assembly, which can be easily torn when used. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is an overall structural diagram of a wafer UV roll film laminating device in one embodiment of the present invention; Figure 2 is a three-dimensional schematic diagram of a mobile platform in one embodiment of the present invention; Figure 3 is a three-dimensional schematic diagram of an attachment assembly in one embodiment of the present invention; Figure 4 It is a three-dimensional schematic diagram of a wafer UV film laminating device in one embodiment of the present invention; Figure 5 It is a three-dimensional schematic diagram of a film pulling assembly in one embodiment of the present invention; Figure 6 is a three-dimensional schematic diagram of a film drawing member in one embodiment of the present invention; Figure 7 It is a three-dimensional schematic diagram of another angle of a wafer UV film laminating device in one embodiment of the present invention; Figure 8 It is a three-dimensional schematic diagram of a wafer UV roll film laminating device in another embodiment of the present invention; Fig. 9 The present invention Figure 8 A local enlarged schematic diagram of point I in the middle; Fig.10 is a three-dimensional schematic diagram of a waste barrel in one embodiment of the present invention; Fig.11 It is a three-dimensional schematic diagram of a wafer UV roll film laminating device in another embodiment of the present invention; Fig.12 It is a process flow chart of a wafer UV roll film laminating process in one embodiment of the present invention.

[0020] Description of reference numerals: frame 1, material box 2, mobile platform 3, film rolling assembly 4, film pulling assembly 5, film cutting assembly 6, attaching assembly 7, easy-tear attaching assembly 9, cavity 701, vacuum pump 702, attaching rubber roller 703, mobile plate 301, placement table 302, first guide rail 303, support plate 304, heating device 305, heating plate 306, heating rod 307, mounting plate 704, lifting module 705, cylinder guide shaft 706, pressure gauge 707 , the first cylinder 708, the second cylinder 709, the second guide rail 101, the slider 102, the base 401, the vertical plate 402, the first film roll barrel 403, the second film roll barrel 404, the pressing piece 405, the fixing piece 406, the guide barrel 407, the UV film 408, the film drawing module 501, the film drawing part 502, the film cutting part 503, the suction hole 504, the film throwing assembly 8, the film throwing part 801, the air blowing pipe 802, the waste barrel 803, and the easy-tear module 901. DETAILED DESCRIPTION

[0021] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0022] Please refer to the attached Figure 1 The present invention proposes a wafer UV roll film laminating device, comprising a frame 1 and a material box 2 for placing wafers, wherein the material box 2 is arranged on the frame 1; wherein the device comprises a mobile platform 3, a film roll assembly 4, a film pulling assembly 5, a film cutting assembly 6, a film throwing assembly 8, an attaching assembly 7 and an easy-to-tear sticking assembly 9 for attaching an easy-to-tear sticking film, wherein the mobile platform 3 is movably arranged on the frame 1, and can be moved to the bottom of the film cutting assembly 6 or to the bottom of the attaching assembly 7; the film roll assembly 4 is arranged on the frame 1, and the film pulling assembly 5 is arranged on one side of the film roll assembly 4; the film cutting assembly 6 is located above the film pulling assembly 5; the film throwing assembly Component 8 is arranged on one side of the film cutting component 6; the attaching component 7 is arranged on one side of the film cutting component 6; the easy-tear attaching component 9 is arranged on one side of the attaching component 7; the attaching component 7 includes a cavity 701, a vacuum component 702 and a plurality of attaching rubber rollers 703, the attaching rubber rollers 703 are respectively located in the cavity 701, and the vacuum component 702 is arranged on one side of the cavity 701; when the moving platform 3 moves to the bottom of the cavity 701, the cavity 701 moves downward and forms a sealed chamber with the moving platform 3, the vacuum component 702 runs and extracts the air in the sealed chamber, and the attaching rubber rollers 703 move and attach the film to the wafer.

[0023] In this embodiment, a material box 2 is provided on the frame 1, and a plurality of wafers are placed in the material box 2; the wafers can be clamped by a robot and placed on the mobile platform 3 or placed on the mobile platform 3 by suction; the mobile platform 3 can move on the frame 1 and transport the wafers to the bottom of the film cutting assembly 6 for film cutting or to the bottom of the attachment assembly 7 for film attachment. The film roll assembly 4 is provided on the frame 1, and the film pulling assembly 5 is provided on one side of the film roll assembly 4 to pull out the UV film of the film roll assembly 4; the film cutting assembly 6 is located above the film pulling assembly 5 to cut the UV film.

[0024] like Figure 3 As shown, the attaching assembly 7 is located on one side of the film cutting assembly 6, including a cavity 701, a vacuum pump 702 and a plurality of attaching rubber rollers 703; the attaching rubber rollers 703 are respectively located in the cavity 701. After the wafer is cut by the film cutting assembly 6, the mobile platform 3 moves the wafer to the bottom of the cavity 701, and then controls the cavity 701 to move downward, so that the cavity 701 and the mobile platform 3 form a sealed chamber, and then the vacuum pump 702 performs a vacuum treatment on the cavity 701, and then the attaching rubber rollers 703 perform film attaching on the wafer. In a specific embodiment, the vacuum pump 702 is a vacuum pump. The vacuum pump 702 is used to evacuate the sealed chamber, and the vacuum adsorption force is used to make the UV film fit more accurately to the wafer surface.

[0025] Furthermore, the cavity 701 may be provided with a plurality of transparent plates, which can facilitate the operator to check the attachment status of the wafers; the plates may be fixed to the cavity 701 by rivets or screws, and can be disassembled and replaced when replacement is required.

[0026] The UV film is guided and tensioned by the film rolling component 4 and the film pulling component 5, which is convenient for cutting and recycling. The wafer is transported to the bottom of the film cutting component 6 by the mobile platform 3. The film cutting component 6 can cut the film according to the shape of the wafer. During this period, the film throwing component 8 discards and blows away the waste film in the film cutting process; then the wafer is transported to the cavity 701 and the bottom of the film sticking component for vacuum treatment and film sticking, which can realize automatic film rolling, film pulling, film cutting and film sticking, greatly improving work efficiency. Before the film sticking process, the present invention heats and vacuums the wafer, so that the UV film can be more accurately attached to the wafer surface, avoid the generation of bubbles, and improve the film sticking effect; after cutting the film, the waste film is discarded and blown away by the provided film throwing component 8, so that the waste film is discarded more thoroughly, and an easy-to-tear sticker is attached after the wafer is filmed, which can be easily torn when used.

[0027] Please refer to Figure 2The mobile platform 3 is provided with a mobile plate 301, a placement table 302, a plurality of first guide rails 303 and a support plate 304. The first guide rails 303 are fixed on the frame 1, the mobile plate 301 is movably arranged on the first guide rails 303, and the support plate 304 is vertically arranged between the mobile plate 301 and the placement table 302; the placement table 302 is horizontally arranged and used for placing wafers.

[0028] In specific implementation: two first guide rails 303 are provided and located on the frame 1, and a moving block cooperating with the first guide rail 303 is provided at the bottom of the moving plate 301, and the moving block moves along the first guide rail 303 to transport the wafer. The support plate 304 is fixed on the moving plate 301 and is arranged vertically with the moving plate 301, so as to set up the placement table 302. The placement table 302 is arranged horizontally and is used to place the wafer.

[0029] Please refer to Figure 2 The mobile platform 3 is also provided with a heating device 305, which is arranged on the placement table 302 and is attached to the wafer to heat the wafer.

[0030] In specific implementation: the placement table 302 is made of high temperature resistant material. After the wafer is placed on the placement table 302, it is heated by the heating device 305. Under the action of high temperature, the generation of bubbles is avoided during the film pasting process.

[0031] Please refer to Figure 2 The heating device 305 includes a heating plate 306 and a plurality of heating rods 307 . The heating rods 307 are wound around the outside of the heating plate 306 and contact the heating plate 306 . The heating plate 306 is in contact with the bottom surface of the wafer.

[0032] In specific implementation: the heating plate 306 is arranged below the wafer and fits with the placement table 302 to conduct heat transfer to the placement table 302 and transfer heat to the wafer on the placement table 302. A plurality of heating rods 307 are provided and arranged around the outside of the heating plate 306. The heating rods 307 can heat the entire heating plate 306. The placement table 302 is fixed on the heating plate 306. After the wafer is transported from the material box 2 to the placement table 302, it can be adsorbed on the placement table 302.

[0033] Furthermore, during the heating process of the heating rod 307, the temperature of the heating rod 307 is controlled to ensure that the UV film 408 and the wafer surface are maintained at a set temperature during the film application process, which is conducive to improving the adhesion of the UV film 408. In a specific embodiment, the heating plate 306 is provided with a plurality of heat dissipation holes, which can dissipate heat after the heating of the heating plate 306 is completed.

[0034] Please refer to Figure 3The cavity 701 is provided with a mounting plate 704, a lifting module 705 for driving the mounting plate 704 to move, a cylinder guide shaft 706, a pressure gauge 707, a plurality of first cylinders 708 and second cylinders 709, and the first cylinders 708 and the second cylinders 709 are respectively fixed on the mounting plate 704; the lifting module 705 is fixedly connected to the mounting plate 704; one end of the cylinder guide shaft 706 is fixedly connected to the cavity 701, and the other end is slidably connected to the mounting plate 704; one end of the second cylinder 709 is fixedly connected to the mounting plate 704, and the other end is fixedly connected to the cavity 701; the first cylinder 708 and the second cylinder 709 simultaneously drive the cavity 701 to move along the cylinder guide shaft 706 to apply downward pressure to the attached component 7; the pressure gauge 707 is fixedly mounted on the frame 1.

[0035] In specific implementation: the mounting plate 704 is horizontally arranged on the cavity 701, the first cylinder 708 and the second cylinder 709 are respectively mounted on the mounting plate 704, the second cylinder 709 is a constant pressure cylinder, one end of the second cylinder 709 is fixed on the mounting plate 704, and the other end is fixed on the cavity 701. The mounting plate 704 is provided with a plurality of through holes, and the cylinder guide shafts 706 are respectively located in the through holes and fixedly connected to the cavity 701. The provision of the cylinder guide shaft 706 enables the cavity 701 to move smoothly along the cylinder guide shaft 706 to prevent tilting. One end of the second cylinder 709 is located on the mounting plate 704, and the other end is fixedly connected to the cavity 701. The lifting module 705 is provided with a servo motor, which can drive the mounting plate 704 to perform lifting and lowering movements. When the lifting module 705 drives the mounting plate 704 to move to a preset height value, it drives the first cylinder 708 to operate and press the cavity 701 downward, so that the attachment component 7 has downward pressure when attaching, avoiding bubbles when attaching the film. During this period, the second cylinder 709 can maintain the pressure within the set range to ensure the accuracy and stability of the operation. In a specific embodiment, the lifting module 705 drives the first cylinder 708, the second cylinder 709 provided on the mounting plate 704, and the cavity 701 to perform lifting and lowering movements at the same time. The first cylinder 708 applies downward pressure to the attachment component 7, and the second cylinder 709 adjusts the pressure to maintain it within the set pressure range. The pressure gauge 707 can display the vacuum negative pressure inside the cavity 701 in real time.

[0036] Please refer to Figure 3 The frame 1 is fixed with a second guide rail 101, and the second guide rail 101 is vertically arranged on the first guide rail 303; the cavity 701 and the mounting plate 704 are respectively provided with sliders 102 corresponding to the second guide rail 101, and the slider 102 moves along the second guide rail 101.

[0037] In specific implementation: the mounting plate 704 and the cavity 701 are respectively provided with a slider 102 corresponding to the second guide rail 101, which can be displaced along the second guide rail 101 under the drive of the lifting module 705, and at the same time, the first cylinder 708 can cooperate with the second cylinder 709 to drive the slider 102 provided on the cavity 701 to move along the second guide rail 101. Then the cavity 701 can be displaced to the mobile platform 3. In a specific embodiment, a rubber ring is provided on the mobile platform 3, and after the cavity 701 is displaced to fit with the rubber ring, a sealed chamber can be formed to prevent air from entering again after vacuuming.

[0038] Please refer to Figure 4 The film roll assembly 4 includes a base 401, a vertical plate 402, a first film roll barrel 403, a second film roll barrel 404, a pressing piece 405, a fixing piece 406 and a plurality of guide barrels 407. The base 401 is arranged on the frame 1, and the vertical plate 402 is vertically arranged on the base 401; the first film roll barrel 403 and the second film roll barrel 404 are rotatably arranged on one side of the vertical plate 402; and the guide barrel 407 is detachably connected to the vertical plate 402; the UV film 408 is respectively wound around the first film roll barrel 403, the guide barrel 407, the pressing piece 405, the fixing piece 406 and the second film roll barrel 404; the pressing piece 405 is movably arranged on one side of the vertical plate 402 close to the film cutting assembly 6, and tightens the UV film 408 together with the first film roll barrel 403; the fixing piece 406 is located below the pressing piece 405.

[0039] In specific implementation: the first film roll barrel 403 is a UV film 408 roll barrel, and the second film roll barrel 404 is a waste film roll barrel; the base 401 is arranged on the frame 1, and the vertical plate 402 is vertically arranged and fixed on the base 401. The first film roll barrel 403 and the second film roll barrel 404 are respectively arranged on the vertical plate 402, and are driven by servo motors. The servo motor can drive the first film roll barrel 403 and the second film roll barrel 404 to rotate to rotate or tighten the UV film 408. There are multiple fixing holes on the vertical plate 402, and the guide barrel 407 can be fixed on the fixing holes by screw threads, and the installation position can be adjusted in actual use. The guide barrel 407 can guide the UV film 408 so that the UV film 408 is transmitted along the guide barrel 407. The pressing member 405 is movably arranged below the first film roll barrel 403 and is located next to the film drawing assembly 5. Before the film drawing assembly 5 pulls out the UV film 408, the pressing member 405 can press the UV film 408 by pressing down, so that the film drawing assembly 5 can keep the UV film 408 in tension during the film drawing process, so as to facilitate subsequent cutting and recycling of the waste film. The pressing member 405 can be provided with a servo motor or a cylinder for movement. The fixing member 406 is located below the pressing member 405 and is used to wind up the pulled out waste film, and surround it along the guide barrel 407 to the second film roll barrel 404. The second film roll barrel 404 rotates and winds up the pulled out waste film.

[0040] Please refer to Figure 5 and Figure 6 The film-pulling assembly 5 includes a film-pulling module 501 and a film-pulling member 502. The film-pulling module 501 is arranged on the frame 1 and is located below the film-cutting assembly 6; the film-pulling member 502 is displaced along the film-pulling module 501 and is used to pull out the UV film; the film-pulling member 502 is provided with a suction hole 504, the suction hole 504 is arranged toward the UV film, and is used to adsorb the UV film.

[0041] In the specific implementation: the film drawing module 501 is horizontally arranged on the frame 1, and the film drawing module 501 is provided with a movable slide rail, and the film drawing member 502 is installed in cooperation with the movable slide rail and can be displaced horizontally along the movable slide rail. The film drawing member 502 is a suction plate and is provided with a plurality of suction holes 504, which can suck and pull out the UV film 408 at the film roll assembly 4. The film drawing assembly 5 is located below the film cutting assembly 6. After the film drawing member 502 sucks the UV film 408, it moves along the movable slide rail and takes out the UV film 408 at the same time. During this period, the UV film 408 is kept in tension together with the pressing member 405. Then, the film cutting assembly 6 cuts the UV film 408, which is not easy to deform and cause the waste of the UV film 408. Among them, the suction plate can be a vacuum suction plate and is provided with a plurality of suction holes 504, and the suction holes 504 are respectively arranged toward the UV film 408.

[0042] Please refer to Figure 7 The film cutting assembly 6 includes at least two film cutting components 503 and at least three movable guide rails, and the film cutting components 503 are movably arranged on the movable guide rails.

[0043] In specific implementation: the film cutting member 503 can move along the movable guide rail and cut the UV film. The movable guide rail can be set horizontally, vertically, or circular, so that the film cutting member 503 can cut the UV film into a square or a circle. The film cutting member 503 can be a film cutting knife or a laser beam, which can cut the UV film according to the shape of the wafer to better perform the film pasting process. The film cutting knife can be single or multiple. In a specific embodiment, the wafer is cylindrical, and the film cutting knife includes a first film cutting knife and a second film cutting knife. First, the first film cutting knife is driven to cut the UV film into a rectangular sheet, and then the second film cutting knife is driven to move along the circular movable guide rail and cut the sheet-shaped rectangular film into a circle, which can better adapt to the shape of the wafer for film pasting processing.

[0044] Please refer to Figure 8-Figure 10 The film discarding assembly 8 includes a film discarding part 801 , an air blowing pipe 802 and a waste barrel 803 . The film discarding part 801 is arranged on one side of the film cutting part 503 , and the air blowing pipe 802 faces the waste barrel 803 .

[0045] In the specific implementation: the air blowing tube 802 can be single or multiple; after the film cutting component 6 cuts the UV film 408, the film discarding part 801 clamps the waste film remaining after cutting and moves it to the waste bucket 803 for disposal, and then starts the air blowing tube 802 to blow air towards the waste bucket 803, so that the waste film can be completely entered into the waste bucket 803, avoiding the phenomenon of unclean disposal.

[0046] Please refer to Fig.11 The easy-tear sticker assembly 9 includes an easy-tear sticker module 901, which is movably arranged on one side of the adhesive roller 703 and is used for conveying and attaching the easy-tear sticker.

[0047] In specific implementation: the easy-tear sticker module 901 is provided with a stepper motor for driving. After the wafer is attached, the easy-tear sticker module 901 transports the easy-tear sticker to the wafer and sticks the easy-tear sticker on the wafer with the film attached. The easy-tear sticker is attached to the wafer after the film is attached, which makes it easy to tear off the UV film when in use.

[0048] Please refer to the attached Fig.12 The present invention proposes a wafer UV roll film laminating process, comprising the following steps: S1: taking the wafer out of the material box 2 and placing it on the moving platform 3; S2: transporting the wafer to the bottom of the film cutting assembly 6 via the mobile platform 3; S3: straightening the UV film 408 from the film roll assembly 4 by the film pulling assembly 5, and driving the film cutting assembly 6 to perform primary and secondary cutting of the UV film 408 according to the shape of the wafer; S4: transporting the wafer to the bottom of the cavity 701 through the mobile platform 3, and heating the wafer through the preset heating device 305; S5: driving the cavity 701 to move to a preset height value through the first cylinder 708 and the second cylinder 709, and performing a vacuum process on the cavity 701 through the vacuum pump 702; S6: performing film lamination on the wafer by using a preset laminating rubber roller 703 to obtain a film laminating wafer; S7: attaching an easy-tear sticker to the film wafer through the preset easy-tear sticker module 901.

[0049] In this embodiment, the wafer is first taken out from the material box 2, and the wafer is placed on the mobile platform 3 by a manipulator, a mechanical clamp or a suction cup. The mobile platform 3 is provided with a first guide rail 303, which can transport the wafer to the bottom of the film cutting component 6. Then the film pulling component 5 pulls out the UV film 408 wrapped around the film roll component 4, and the UV film 408 is located above the wafer. The film cutting component 6 is driven to cut the UV film 408 according to the shape of the wafer. The cut UV film 408 will fall on the wafer. It is worth mentioning that when the mobile platform 3 moves to the bottom of the film cutting component 6, the distance between it and the UV film 408 is small, so the UV film 408 can fall directly on the wafer. Cutting the UV film 408 according to the shape of the wafer can reduce waste and facilitate subsequent film processing. Among them, cutting according to the shape of the wafer can be a pre-set mobile guide rail, that is, the moving trajectory of the film cutting component 503 is set in advance, such as moving 2 units in the X-axis direction.

[0050] In this embodiment, the UV film 408 is cut multiple times. The first cutting is to cut the UV film 408 into a sheet-like rectangular shape. Then, a second cutting is performed on the basis of the first cutting to cut the rectangular UV film 408 into a circular shape. At this time, the UV film 408 is consistent with the shape of the wafer and is circular, which can better cover the wafer. In a specific embodiment, the movement trajectory of the film cutting member 503 can be a circular motion cutting with a radius of 5 cm. Then the wafer is transported to the bottom of the cavity 701, and the wafer is heated by the heating device 305 provided at the same time, so that no bubbles are generated when the wafer is bonded, thereby enhancing the bonding effect. After the wafer moves to the bottom of the cavity 701 under the transportation of the mobile platform 3, the first cylinder 708 and the second cylinder 709 drive the cavity 701 to move to the height value set in advance, and drive the vacuum pump 702 to evacuate the cavity 701, and use the vacuum adsorption force to make the UV film 408 fit more accurately to the wafer surface; then the adhesive roller 703 rolls and applies the film to the wafer to obtain a film-attached wafer. Since the cavity 701 is pressed downward, the pressing part 405 will have downward pressure when attaching, which can avoid the generation of bubbles. Finally, an easy-tear sticker is attached to the film-attached wafer to facilitate tearing off the UV film 408 when using the wafer.

[0051] In one embodiment, after the steps of straightening the UV film 408 from the film roll assembly 4 by the film pulling assembly 5 and driving the film cutting assembly 6 to perform a primary cutting and a secondary cutting on the UV film 408 according to the shape of the wafer, the method further includes: The waste film is discarded through the preset film discarding part 801; The waste film is blown away through the preset blowing pipe 802.

[0052] In specific implementation: after the cutting of the UV film 408 is completed, the film discarding component 8 is required to discard the waste film, that is, the waste film is clamped by the film discarding component 801 and placed in the waste bucket 803, and then the air blowing pipe 802 is started and the waste film is blown into the waste bucket 803 to prevent the waste film from remaining outside the waste bucket 803.

[0053] It should be noted that, in this article, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, device, article or method including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, device, article or method. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the presence of other identical elements in the process, device, article or method including the element.

[0054] The above description is only a preferred embodiment of the present application, and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A wafer UV film laminating device, comprising a frame and a material box for placing wafers, wherein the material box is arranged on the frame; It is characterized in that It comprises a mobile platform, a film rolling assembly, a film pulling assembly, a film cutting assembly, a film throwing assembly, an attaching assembly and an easy-tear sticker assembly for attaching an easy-tear sticker, wherein the mobile platform is movably arranged on the frame and can be moved to the bottom of the film cutting assembly or to the bottom of the attaching assembly; the film rolling assembly is arranged on the frame, the film pulling assembly is arranged on one side of the film rolling assembly; the film cutting assembly is located above the film pulling assembly; the film throwing assembly is arranged on one side of the film cutting assembly; the attaching assembly is arranged on one side of the film cutting assembly; the easy-tear sticker assembly is arranged on one side of the attaching assembly; The attachment assembly comprises a cavity, a vacuum pump and a plurality of attachment rubber rollers, wherein the attachment rubber rollers are respectively located in the cavity, and the vacuum pump is arranged on one side of the cavity; When the movable platform is displaced to below the cavity, the cavity moves downward and forms a sealed chamber with the movable platform, the vacuum pump operates and extracts the air in the sealed chamber, and the adhesive roller moves and applies film to the wafer.

2. The wafer UV film laminating device according to claim 1, It is characterized in that The mobile platform is provided with a mobile plate, a placement table, a plurality of first guide rails and a support plate. The first guide rails are fixedly arranged on the frame, the mobile plate is movably arranged on the first guide rails, and the support plate is vertically arranged between the mobile plate and the placement table. The placement table is horizontally arranged and used for placing wafers.

3. The wafer UV film laminating device according to claim 2, It is characterized in that The movable platform is also provided with a heating device, which is arranged on the placement table and attached to the wafer to heat the wafer.

4. The wafer UV film laminating device according to claim 3, It is characterized in that The heating device comprises a heating plate and a plurality of heating rods, wherein the heating rods are arranged around the outside of the heating plate and in contact with the heating plate; the heating plate is in contact with the bottom surface of the wafer.

5. The wafer UV film laminating device according to claim 4, It is characterized in that The cavity is provided with a mounting plate, a lifting module for driving the mounting plate to move, a cylinder guide shaft, a pressure gauge, a plurality of first cylinders and a second cylinder, wherein the first cylinder and the second cylinder are respectively fixed on the mounting plate; The lifting module is fixedly connected to the mounting plate; One end of the cylinder guide shaft is fixedly connected to the cavity, and the other end is slidably connected to the mounting plate; One end of the second cylinder is fixedly mounted on the mounting plate, and the other end is fixedly connected to the cavity; The first cylinder and the second cylinder simultaneously drive the cavity to move along the cylinder guide shaft to apply downward pressure to the attachment component; The pressure gauge is fixed on the frame.

6. The wafer UV film laminating device according to claim 5, It is characterized in that The frame is fixedly provided with a second guide rail, and the second guide rail is vertically arranged on the first guide rail; the cavity and the mounting plate are respectively provided with sliders corresponding to the second guide rail, and the sliders are displaced along the second guide rail.

7. The wafer UV film laminating device according to claim 1, It is characterized in that The film roll assembly includes a base, a vertical plate, a first film roll barrel, a second film roll barrel, a pressing member, a fixing member and a plurality of guide barrels, the base is arranged on the frame, and the vertical plate is vertically arranged on the base; The first film roll barrel and the second film roll barrel are rotatably arranged on one side of the vertical plate; The guide barrel is detachably connected to the vertical plate; UV films are respectively wound around the first film roll barrel, the guide barrel, the pressing member, the fixing member and the second film roll barrel; The pressing member is movably disposed on a side of the vertical plate close to the film cutting assembly, and tightens the UV film together with the first film rolling barrel; The fixing member is located below the pressing member.

8. The wafer UV film laminating device according to claim 7, It is characterized in that The film-drawing assembly comprises a film-drawing module and a film-drawing member, wherein the film-drawing module is arranged on the frame and is located below the film-cutting assembly; the film-drawing member is displaced along the film-drawing module and is used to draw out the UV film; The film-drawing member is provided with a suction hole, the suction hole is arranged toward the UV film, and is used for absorbing the UV film.

9. The wafer UV film laminating device according to claim 1, It is characterized in that The film cutting assembly comprises at least two film cutting components and at least three movable guide rails, and the film cutting components are movably arranged on the movable guide rails.

10. The wafer UV film laminating device according to claim 9, It is characterized in that The film throwing assembly comprises a film throwing piece, an air blowing pipe and a waste bucket. The film throwing piece is arranged on one side of the film cutting piece, and the air blowing pipe faces the waste bucket.

11. The wafer UV film laminating device according to claim 1, It is characterized in that The easy-tear sticker assembly comprises an easy-tear sticker module, which is movably arranged on one side of the attaching rubber roller and is used for conveying and attaching the easy-tear sticker.

12. A wafer UV film laminating process, It is characterized in that The following steps are involved: Step 1: Take the wafer out of the cassette and place it on the mobile platform; Step 2: transporting the wafer to the bottom of the film cutting assembly via the mobile platform; Step 3: straighten the UV film from the film roll assembly by the film pulling assembly, and drive the film cutting assembly to perform primary and secondary cutting of the UV film according to the shape of the wafer; Step 4: transporting the wafer to the bottom of the cavity by the mobile platform, and heating the wafer by a preset heating device; Step 5: driving the cavity to move to a preset height value by means of the first cylinder and the second cylinder, and performing a vacuum process on the cavity by means of a vacuum pump; Step 6: performing film lamination on the wafer by a preset laminating rubber roller to obtain a film laminating wafer; Step 7: attaching an easy-tear sticker to the film wafer using a preset easy-tear sticker assembly.

13. The wafer UV roll film laminating process according to claim 12, It is characterized in that After the step of straightening the UV film from the film roll assembly by the film pulling assembly and driving the film cutting assembly to perform primary cutting and secondary cutting of the UV film according to the shape of the wafer, the method further includes: The waste film is discarded through the preset film discarding device; The waste film is blown away through a preset air blowing pipe.

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