Chip pin contact detection device and method

Abstract

The present invention relates to the technical field of chip detection equipment, and in particular to a chip pin contact detection device and method, comprising a test bench, wherein a test board is detachably mounted on the upper surface of the test bench, and a plurality of elastic conductive heads are equidistantly detachably mounted on the edges of the test board. A monitoring mechanism capable of monitoring whether a chip to be tested is docked in place is arranged around the test board. The present invention uses the test board, the monitoring mechanism, the fixing mechanism, the lifting mechanism, the pressurizing mechanism and the elastic conductive head on the test board to confirm the alignment position of the chip to be tested by using the monitoring mechanism. If an offset occurs, the chip position is fine-tuned by using the fixing mechanism, thereby improving the docking accuracy of the chip and the test board to reduce the probability of the chip being crushed, and then providing a certain pressure to the chip to be tested by the pressurizing mechanism to increase the firmness of the chip pins contacting the elastic conductive heads.

Description

Technical Field

[0001] The present invention belongs to the technical field of chip detection equipment, and in particular relates to a chip pin contact detection device and method. Background Art

[0002] In the chip production process, in order to promptly detect and eliminate defective chips, pin contact detection must be performed before welding to prevent these defective products from entering the subsequent packaging and assembly process, thereby ensuring the yield of the final product. If pin problems are found after welding, the entire assembly may need to be reworked or scrapped, which will greatly increase costs.

[0003] Currently, the commonly used chip pin contact detection method is the IC open and short circuit test, which determines whether there is an open circuit or a short circuit by providing a certain current to each pin and measuring the voltage. That is, first install the chip to be tested correctly in the test socket, and make sure that each pin is in good contact with the test fixture, then ground the VDD pin, and then provide 100uA to 500uA of current to each pin. The current flows to VDD through the upper diode and measures the pin voltage. If the voltage is greater than 1.5 volts, it is judged as an open circuit failure; if the voltage is less than 0.2 volts, it is judged as a short circuit failure.

[0004] However, since there are many pins on the chip, there will be a docking deviation when the chip is docked with the test socket, which affects the test efficiency of the chip and may cause the chip to burn out after power is turned on. Therefore, we need to propose a chip pin contact detection device and method to solve the above-mentioned problems, so that it can effectively improve the efficiency of chip docking and reduce the probability of chip burning out due to docking deviation. Summary of the invention

[0005] In view of the above problems, the present invention provides a chip pin contact detection device and method, including a test bench, wherein a test board is detachably mounted on the upper surface of the test bench, and a plurality of elastic conductive heads are equidistantly and detachably mounted on the edges of the test board. The test board is provided with a plurality of mounting holes arranged in a rectangular array for mounting the elastic conductive heads. Monitoring mechanisms capable of monitoring the docking position of a chip to be tested are arranged around the test board. Four monitoring mechanisms are slidably connected to the test bench through two groups of vertically arranged transmission mechanisms, and the transmission mechanisms are located inside the test bench. A bracket is fixed to one side of the test bench, a cylinder is mounted on the upper end of the bracket, and a pressure-applying mechanism capable of applying pressure to the chip to be tested and having adjustable pressure is mounted on the piston rod end of the cylinder. A fixing mechanism capable of clamping and fixing the chip and fine-tuning its position is arranged above the test board, and the fixing mechanism is connected to both sides of the upper end of the bracket through a lifting mechanism, and a reinforcement mechanism for reinforcing the clamped chip is mounted on the fixing mechanism.

[0006] Furthermore, the monitoring mechanism includes a touch sensor and a connecting block, the touch sensor is fixed to one end of the connecting block, the other end of the connecting block is connected to the transmission mechanism, and the touch sensor is located at the center of the side wall of the test board.

[0007] Furthermore, each group of the transmission mechanism includes a first bidirectional screw, both ends of the first bidirectional screw are threadedly connected to a first support plate, and both ends of the first bidirectional screw are connected to the inner top of the test bench through a fixed plate, the first bidirectional screw and the fixed plate are rotatably connected, one end of the first bidirectional screw is installed with a first motor, the upper end of the first support plate passes through the upper surface of the test bench and extends to the outside of the test bench, and a connecting block is installed on the upper end of the first support plate, and a sliding groove for the first support plate to move is opened on the test bench, and the first bidirectional screws of the two groups of the transmission mechanisms are staggered.

[0008] Furthermore, the fixing mechanism includes a second fixing seat with an open side, the second fixing seat is rotatably connected to a second bidirectional screw inside, both ends of the second bidirectional screw are threadedly connected to a clamping plate for clamping the side wall of the chip, and the clamping plate is slidably connected to the second fixing seat, a rubber gasket is attached to the contact surface of the clamping plate and the chip, a third motor is installed at one end of the second bidirectional screw, the seat body of the third motor is installed on the outer wall of the second fixing seat, a first electric push rod is fixed to the side of the second fixing seat opposite to the opening, a fine-tuning mechanism for adjusting the position of the second fixing seat is installed at one end of the first electric push rod, and the fine-tuning mechanism is connected to the piston rod of the second electric push rod.

[0009] Furthermore, the fine-tuning mechanism includes a first fixed seat with an open side and a one-way screw rotatably installed inside the first fixed seat, a slider is threadedly connected to the one-way screw, and the slider is slidably connected to the first fixed seat, one end of the first electric push rod is fixed on the slider, the slider is slidably connected to the first fixed seat, a second motor is installed at one end of the one-way screw, and the seat body of the second motor is connected to the outer wall of the first fixed seat.

[0010] Furthermore, the reinforcement mechanism includes a connecting plate fixed to the middle of the upper end of the second fixing seat, and a plurality of suction nozzles are equidistantly installed on the connecting plate, and one end of the suction nozzle is connected to an air source through an air pump.

[0011] Furthermore, the pressurizing mechanism includes a second support plate, a weighting plate and a pressure plate, the weighting plate is located between the pressure plate and the second support plate, the second support plate is fixed to the piston rod end of the cylinder, a buffer mechanism capable of adjusting the buffering force is installed between the weighting plate and the pressure plate, and a pressure sensor is embedded on the lower surface of the pressure plate.

[0012] Furthermore, the buffer mechanism includes a threaded rod rotatably connected to the four corners of the second support plate, the lower end of the threaded rod passes through the weight plate and extends to the bottom of the weight plate, and a first spring is fixed at the four corners of the lower surface of the weight plate, the first spring is configured as an adaptive spring, the lower end of the first spring is fixed to the pressure plate, the first spring is sleeved on the outside of the threaded rod, and a sprocket is sleeved and fixed on the outer wall of the threaded rod between the weight plate and the second support plate, and the multiple sprockets are connected by chain transmission, and a fourth motor is installed on the upper end of one of the threaded rods.

[0013] Furthermore, the elastic conductive head includes a support column fixed in the mounting hole, the lower end of the support column is connected to a cable, the upper end of the support column is detachably connected to a connector, the upper end of the connector is fixed with a conductive column, the upper end of the conductive column is plugged with a conductive block, the lower end of the conductive block is connected to the upper end of the connector through a second spring, and the second spring is sleeved on the outer wall of the conductive column.

[0014] Based on the above-described chip pin contact detection device, the present invention also provides a chip pin contact detection method, comprising the following steps:

[0015] S1. Install a corresponding number of elastic conductive heads on the test board according to the number of pins of the chip to be tested;

[0016] S2, clamping and fixing the chip to be tested by a fixing mechanism, and then using a lifting mechanism to drive the chip to be tested to dock with the test board, so that the elastic conductive head contacts the pins of the chip to be tested;

[0017] S3, using the monitoring mechanism to confirm the alignment position of the chip to be tested, and if there is a deviation, using the fixing mechanism to fine-tune the chip position until the monitoring mechanisms on all sides detect contact with the side walls on all sides of the chip;

[0018] S4. The pressure provided by the pressure-applying mechanism to the chip to be tested makes the chip pins more firmly contact with the elastic conductive head, so as to perform IC open and short circuit test.

[0019] The beneficial effects of the present invention are:

[0020] 1. The present invention cooperates with the elastic conductive head on the test board through the test board, the monitoring mechanism, the fixing mechanism, the lifting mechanism, the pressurizing mechanism, and the fixing mechanism. When in use, the chip to be tested is clamped and fixed by the fixing mechanism, and then the lifting mechanism is used to drive the chip to be tested to dock with the test board, so that the elastic conductive head contacts the pins of the chip to be tested. The monitoring mechanism is used to confirm the alignment position of the chip to be tested. If there is an offset, the fixing mechanism is used to fine-tune the chip position until the monitoring mechanisms around all detect contact with the chip, thereby improving the accuracy of docking the chip with the test board to reduce the probability of the chip being crushed, and then the pressurizing mechanism provides a certain pressure on the chip to be tested to increase the firmness of the chip pins contacting the elastic conductive head.

[0021] 2. The present invention, through the provision of a detachable elastic conductive head, can install different numbers of conductive probes according to the testing requirements of chips with different pins of the same size, so that it can be suitable for testing different chips and improve the versatility of the test board for testing different chips.

[0022] 3. The present invention can change the pressure of the pressure plate on the chip by setting a pressure mechanism, so that the force can be automatically adjusted according to the size of the chip, so that the pressure can be suitable for different chips, preventing the chip from being loosely fixed due to low pressure or damaging the chip pins due to high pressure.

[0023] Other features and advantages of the present invention will be described in the following description, and partly become apparent from the description, or understood by practicing the present invention. The purpose and other advantages of the present invention can be realized and obtained by the structures pointed out in the description, claims and drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0025] Figure 1 A schematic diagram of the structure of an embodiment of the present invention is shown;

[0026] Figure 2 A schematic diagram of the installation structure of a test board and a test bench according to an embodiment of the present invention is shown;

[0027] Figure 3 It shows a schematic diagram of the structure of a monitoring mechanism according to an embodiment of the present invention;

[0028] Figure 4A schematic diagram of the structure of a fixing mechanism and a reinforcement mechanism according to an embodiment of the present invention is shown;

[0029] Figure 5 A schematic diagram of the side structure of a fixing mechanism and a reinforcement mechanism according to an embodiment of the present invention is shown;

[0030] Figure 6 A schematic structural diagram of a pressurizing mechanism according to an embodiment of the present invention is shown;

[0031] Figure 7 A schematic diagram of the side structure of a pressurizing mechanism according to an embodiment of the present invention is shown;

[0032] Figure 8 A schematic diagram of the structure of a test board and an elastic conductive head according to an embodiment of the present invention is shown;

[0033] Fig. 9 A schematic diagram of the structure of an elastic conductive head according to an embodiment of the present invention is shown;

[0034] Fig.10 A schematic diagram of the explosion structure of an elastic conductive head according to an embodiment of the present invention is shown.

[0035] In the figure: 1. test bench; 2. monitoring mechanism; 21. first support plate; 22. fixing plate; 23. first motor; 24. first bidirectional screw; 25. connecting block; 26. touch sensor; 3. lifting mechanism; 4. fixing mechanism; 41. first fixing seat; 42. one-way screw; 43. slider; 44. second motor; 45. second fixing seat; 46. first electric push rod; 47. third motor; 48. second bidirectional screw; 49. clamping plate; 5. sliding groove; 6. reinforcement mechanism; 61. connecting plate; 6 2. Suction nozzle; 7. Pressurizing mechanism; 71. Second support plate; 72. Weighting plate; 73. Pressurizing plate; 74. Pressure sensor; 75. Threaded rod; 76. Sprocket; 77. First spring; 78. Fourth motor; 8. Cylinder; 9. Test board; 10. Bracket; 11. Elastic conductive head; 111. Support column; 112. Cable; 113. Stud; 114. Connector; 115. Conductive column; 116. Second spring; 117. Conductive block; 118. Screw hole; 119. Socket; 12. Mounting hole. DETAILED DESCRIPTION

[0036] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0037] The embodiment of the present invention provides a chip pin contact detection device, such as Figure 1-Figure 10 As shown, it includes a test bench 1, a test board 9 is detachably mounted on the upper surface of the test bench 1, and a plurality of elastic conductive heads 11 are equidistantly detachably mounted on the edges of the test board 9. The test board 9 is provided with a plurality of mounting holes 12 arranged in a rectangular array for mounting the elastic conductive heads 11. Monitoring mechanisms 2 capable of monitoring the docking position of the chip to be tested are arranged around the test board 9. Four monitoring mechanisms 2 are slidably connected to the test bench 1 through two groups of vertically arranged transmission mechanisms, and the transmission mechanisms are located inside the test bench 1. A bracket 10 is fixed on one side of the test bench 1, a cylinder 8 is mounted on the upper end of the bracket 10, and a pressure-applying mechanism 7 capable of applying pressure to the chip to be tested and having adjustable pressure is mounted on the piston rod end of the cylinder 8. A fixing mechanism 4 capable of clamping and fixing the chip and fine-tuning the position is arranged above the test board 9, and the fixing mechanism 4 is connected to both sides of the upper end of the bracket 10 through a lifting mechanism 3, and a reinforcement mechanism 6 for reinforcing the clamped chip is installed on the fixing mechanism 4.

[0038] When in use, the chip to be tested is clamped and fixed by the fixing mechanism 4, and then the lifting mechanism 3 is used to drive the chip to be tested to dock with the test board 9, so that the elastic conductive head 11 contacts the pins of the chip to be tested, and the alignment position of the chip to be tested is confirmed by using the monitoring mechanism 2. If there is an offset, the chip position is fine-tuned by the fixing mechanism 4 until the monitoring mechanisms 2 on all sides detect contact with the chip, thereby improving the docking accuracy of the chip and the test board 9 and reducing the probability of burning the chip due to docking offset. Then, a certain pressure is provided to the chip to be tested by the pressurizing mechanism 7 to increase the firmness of the chip pins against the elastic conductive head 11; through the setting of the detachable elastic conductive head 11, different numbers of conductive probes can be installed according to the testing requirements of chips with the same size but different pins, so that it can be suitable for testing different chips, thereby improving the versatility of the test board 9 for testing different chips.

[0039] The monitoring mechanism 2 includes a touch sensor 26 and a connecting block 25. The touch sensor 26 is fixed at one end of the connecting block 25. The other end of the connecting block 25 is connected to the transmission mechanism. The touch sensor 26 is located at the center of the side wall of the test board 9. Through the touch sensors 26 arranged around the test board 9, when the chip is tested, when the sensing surfaces of the touch sensors 26 around are in contact with the side walls of the chip, the four touch sensors 26 transmit the sensed signals to the control system of the detection device, so as to facilitate the test operation through the control system.

[0040] Each group of the transmission mechanism includes a first bidirectional screw 24, both ends of the first bidirectional screw 24 are threadedly connected with a first support plate 21, and both ends of the first bidirectional screw 24 are connected to the inner top of the test bench 1 through a fixed plate 22, the first bidirectional screw 24 is rotatably connected to the fixed plate 22, one end of the first bidirectional screw 24 is installed with a first motor 23, the upper end of the first support plate 21 passes through the upper surface of the test bench 1 and extends to the outside of the test bench 1, and a connecting block 25 is installed on the upper end of the first support plate 21, and a sliding groove 5 for the first support plate 21 to move is provided on the test bench 1. The first bidirectional screws 24 of the two groups of the transmission mechanisms are staggered, and the first motor 23 drives the first bidirectional screws 24 to rotate, so that the first bidirectional screws 24 drive the first support plates 21 at both ends to move relatively, so as to drive the touch sensors 26 on both sides to move relatively through the first support plate 21, so that the touch sensors 26 can touch the side walls of the chip, and at the same time, the positions of the four monitoring mechanisms 2 can be adjusted according to chips of different sizes, so that they can adapt to different chip tests.

[0041] The lifting mechanism 3 is configured as two second electric push rods, which are installed on both sides of the upper end of the bracket 10, and the piston rod ends of the second electric push rods are connected to the fixing mechanism 4. The fixing mechanism 4 is moved upward or downward by the second electric push rods to facilitate docking of the chip fixed on the fixing mechanism 4 with the test board 9.

[0042] The fixing mechanism 4 includes a second fixing seat 45 with an open side, a second bidirectional screw 48 is rotatably connected inside the second fixing seat 45, two ends of the second bidirectional screw 48 are threadedly connected with a clamping plate 49 for clamping the side wall of the chip, and the clamping plate 49 is slidably connected to the second fixing seat 45, a rubber gasket is attached to the contact surface of the clamping plate 49 and the chip, one end of the second bidirectional screw 48 is installed with a third motor 47, the seat body of the third motor 47 is installed on the outer wall of the second fixing seat 45, a first electric push rod 46 is fixed on the side of the second fixing seat 45 opposite to the open side, one end of the first electric push rod 46 is installed with a fine-tuning mechanism for adjusting the position of the second fixing seat 45, the fine-tuning mechanism is connected to the piston rod of the second electric push rod, the second bidirectional screw 48 is driven to rotate by the third motor 47, and the second bidirectional screw 48 is threadedly connected to the clamping plate 49, so that the second bidirectional screw 48 drives the clamping plate 49 to move in relative directions, so as to clamp and fix the opposite sides of the chip, thereby facilitating the docking of the chip with the test board 9.

[0043] The fine-tuning mechanism includes a first fixed seat 41 with an open side and a one-way screw 42 rotatably installed inside the first fixed seat 41, a slider 43 is threadedly connected to the one-way screw 42, and the slider 43 is slidably connected to the first fixed seat 41, one end of the first electric push rod 46 is fixed on the slider 43, and the slider 43 is slidably connected to the first fixed seat 41, and a second motor 44 is installed at one end of the one-way screw 42, and the seat body of the second motor 44 is connected to the outer wall of the first fixed seat 41, and the one-way screw 42 is driven to rotate by the second motor 44, so that the one-way screw 42 drives the slider 43 to move horizontally in the first fixed seat 41, so that the first slider 43 drives the first electric push rod 46 and the second fixed seat 45 to shift in the Y direction, thereby adjusting the alignment accuracy between the clamped chip and the test board 9.

[0044] The reinforcement mechanism 6 includes a connecting plate 61 fixed to the middle of the upper end of the second fixing seat 45, and a plurality of suction nozzles 62 are equidistantly installed on the connecting plate 61. One end of the suction nozzle 62 is connected to an air source through an air pump. The air pump provides an air source to the suction nozzle 62, so that the suction nozzle 62 can be adsorbed to the upper surface of the chip to improve the firmness of the adsorption of the suction nozzle 62 to the chip.

[0045] The pressurizing mechanism 7 comprises a second supporting plate 71, a weighting plate 72 and a pressurizing plate 73. The weighting plate 72 is located between the pressurizing plate 73 and the second supporting plate 71. The second supporting plate 71 is fixed to the piston rod end of the cylinder 8. A buffer mechanism capable of adjusting the buffering force is installed between the weighting plate 72 and the pressurizing plate 73. A pressure sensor 74 is embedded on the lower surface of the pressurizing plate 73. Through the setting of the buffer mechanism, the pressurizing plate 73 has a certain buffer space to avoid damage to the chip pins caused by rigid extrusion. When the pressurizing plate 73 contacts the upper surface of the chip, the pressure sensor 74 senses the pressure applied to the chip by the pressurizing plate 73. If the pressure provided by the pressure plate 73 is greater than the pressure on the chip, the buffering force of the buffer mechanism is adjusted to change the pressure of the pressure plate 73 on the chip, so that the force can be automatically adjusted according to the size of the chip, so that the pressure can be suitable for different chips to prevent the chip from being loosely fixed due to low pressure or the chip pins from being damaged due to high pressure. Since the stroke of the cylinder 8 is usually troublesome to adjust, it is generally achieved by manually adjusting the installation position of the cylinder 8, and the adjustment accuracy is poor, and it needs to be verified many times. Therefore, the present application does not need to adjust the stroke of the cylinder 8, and can be achieved by adjusting the buffering force of the buffer mechanism.

[0046] The first spring 77 is arranged on the outer wall of the threaded rod 75, and the first spring 77 is arranged on the outer wall of the threaded rod 75. When the pressure plate 73 is not pressed, the first spring 77 is used to connect the pressure plate 73 to the weight plate 72. When the pressure plate 73 is pressed, the lower end of the threaded rod 75 contacts the upper surface of the pressure plate 73. The first spring 77 is limited by the length of the threaded rod 75 between the weight plate 72 and the pressure plate 73 to provide different pressures to the pressure plate 73, so as to avoid damage to the chip pins caused by rigid extrusion. A sprocket 76 is fixed to the top, and multiple sprockets 76 are connected by chain transmission. A fourth motor 78 is installed on the upper end of one of the threaded rods 75. The fourth motor 78 drives the four threaded rods 75 to rotate simultaneously through a chain (not shown in the figure) and a transmission connection with the sprocket 76. The threaded connection between the weight plate 72 and the threaded rod 75 is used to adjust the position of the weight plate 72 on the threaded rod 75, thereby adjusting the length of the threaded rod 75 between the weight plate 72 and the pressure plate 73. When the length of the threaded rod 75 between the weight plate 72 and the pressure plate 73 is the smallest, when the pressure plate 73 is pressurized, the elastic expansion amount that can be provided by the first spring 77 is the largest. Using the rebound force of the first spring 77, the pressure applied to the chip by the first spring 77 is the largest. When the length of the threaded rod 75 between the weight plate 72 and the pressure plate 73 is the largest, the elastic expansion amount that can be provided by the first spring 77 is the smallest, and the pressure provided to the pressure plate 73 is the smallest.

[0047] The elastic conductive head 11 includes a support column 111 fixed in the mounting hole 12, the lower end of the support column 111 is connected to a cable 112, the upper end of the support column 111 is detachably connected to a connector 114, the upper end of the connector 114 is fixed with a conductive column 115, the upper end of the conductive column 115 is plugged with a conductive block 117, the lower end of the conductive block 117 is connected to the upper end of the connector 114 through a second spring 116, and the second spring 116 is sleeved on the outer wall of the conductive column 115. When the chip is tested, the pin of the chip compresses the second spring 116 through the conductive block 117, so that the second spring 116 is in a compressed state and the upper end of the conductive column 115 is plugged into the inside of the conductive block 117, so that the conductive column 115 is connected to the conductive block 117. Through the detachable setting of the connector 114 and the support column 111, it is convenient to install the connector 114 at the corresponding position according to the number of pins of the actual detection chip, so that it is suitable for different chip tests.

[0048] A stud 113 is fixed to the upper end of the support column 111 , and a screw hole 118 is opened at the lower end of the connector 114 . The screw hole 118 cooperates with the thread of the stud 113 to make the connector 114 detachable, which is convenient for disassembly and installation of the connector 114 .

[0049] The lower end of the conductive block 117 is provided with a socket 119 for inserting the upper end of the conductive column 115. The inner diameter of the second spring 116 is larger than the diameter of the socket 119. When the conductive block 117 is not under pressure, the upper end of the conductive column 115 is located at the lower end of the socket 119, and the upper end of the conductive column 115 does not conflict with the inner top of the socket 119. When the conductive block 117 is under pressure, the upper end of the conductive column 115 conflicts with the inner top of the socket 119, thereby increasing the contact area with the conductive block 117 to improve the conductivity between the conductive column 115 and the conductive block 117.

[0050] Based on the above-described chip pin contact detection device, the present invention also provides a chip pin contact detection method, comprising the following steps:

[0051] S1, installing a corresponding number of elastic conductive heads 11 on the test board 9 according to the number of pins of the chip to be tested;

[0052] S2, clamp and fix the chip to be tested by the fixing mechanism 4, and then use the lifting mechanism 3 to drive the chip to be tested to dock with the test board 9, so that the elastic conductive head 11 contacts the pins of the chip to be tested;

[0053] S3, using the monitoring mechanism 2 to confirm the alignment position of the chip to be tested, and if there is a deviation, using the fixing mechanism 4 to fine-tune the chip position until the monitoring mechanisms 2 on all sides detect contact with the side walls of the chip;

[0054] S4. The pressure applied to the chip to be tested by the pressure applying mechanism 7 makes the chip pins more firmly contact with the elastic conductive head 11, so as to perform an open and short circuit test on the IC.

[0055] In this way, the displacement of the chip and the test board 9 when docking is greatly reduced, so as to improve the accuracy of chip docking and reduce the probability of burning the chip due to docking offset.

[0056] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent substitutions for some of the technical features therein; and these modifications or substitutions do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A chip pin contact detection device, characterized in that: The invention comprises a test bench (1), wherein a test board (9) is detachably mounted on the upper surface of the test bench (1), and a plurality of elastic conductive heads (11) are equidistantly and detachably mounted on the edges of the test board (9). The test board (9) is provided with a plurality of mounting holes (12) arranged in a rectangular array for mounting the elastic conductive heads (11). Monitoring mechanisms (2) capable of monitoring the docking position of a chip to be tested are arranged around the test board (9), and four monitoring mechanisms (2) are slidably connected to the test bench (1) via two sets of vertically arranged transmission mechanisms, and the transmission mechanisms are located Inside the test bench (1), a support (10) is fixed on one side of the test bench (1), a cylinder (8) is installed on the upper end of the support (10), a pressure mechanism (7) capable of applying pressure to the chip to be tested and having adjustable pressure is installed on the piston rod end of the cylinder (8), a fixing mechanism (4) capable of clamping and fixing the chip and capable of fine-tuning the position is arranged above the test plate (9), the fixing mechanism (4) is connected to both sides of the upper end of the support (10) through a lifting mechanism (3), and a reinforcement mechanism (6) for reinforcing the clamped chip is installed on the fixing mechanism (4); The fixing mechanism (4) comprises a second fixing seat (45) with an open side, a second bidirectional screw (48) being rotatably connected inside the second fixing seat (45), a clamping plate (49) for clamping the side wall of the chip being threadedly connected at both ends of the second bidirectional screw (48), and the clamping plate (49) is slidably connected to the second fixing seat (45), a rubber gasket is attached to the contact surface of the clamping plate (49) and the chip, a third motor (47) is installed at one end of the second bidirectional screw (48), the seat body of the third motor (47) is installed on the outer wall of the second fixing seat (45), a first electric push rod (46) is fixed on the side of the second fixing seat (45) opposite to the open side, a fine-tuning mechanism for adjusting the position of the second fixing seat (45) is installed at one end of the first electric push rod (46), and the fine-tuning mechanism is connected to the piston rod of the second electric push rod; The pressurizing mechanism (7) comprises a second supporting plate (71), a weighting plate (72) and a pressurizing plate (73); the weighting plate (72) is located between the pressurizing plate (73) and the second supporting plate (71); the second supporting plate (71) is fixed to the piston rod end of the cylinder (8); a buffer mechanism capable of adjusting the buffering force is installed between the weighting plate (72) and the pressurizing plate (73); and a pressure sensor (74) is embedded on the lower surface of the pressurizing plate (73).

2. A chip pin contact detection device according to claim 1, characterized in that: The monitoring mechanism (2) comprises a touch sensor (26) and a connecting block (25), wherein the touch sensor (26) is fixed to one end of the connecting block (25), and the other end of the connecting block (25) is connected to the transmission mechanism, and the touch sensor (26) is located at the center of the side wall of the test plate (9).

3. A chip pin contact detection device according to claim 2, characterized in that: Each group of the transmission mechanisms comprises a first bidirectional screw (24), both ends of which are threadedly connected to a first support plate (21), and both ends of the first bidirectional screw (24) are connected to the inner top of the test bench (1) through a fixing plate (22), the first bidirectional screw (24) and the fixing plate (22) are rotationally connected, one end of the first bidirectional screw (24) is mounted with a first motor (23), the upper end of the first support plate (21) passes through the upper surface of the test bench (1) and extends to the outside of the test bench (1), and a connecting block (25) is mounted on the upper end of each of the first support plates (21), the test bench (1) is provided with a sliding groove (5) for the first support plate (21) to move, and the first bidirectional screws (24) of the two groups of the transmission mechanisms are staggered.

4. A chip pin contact detection device according to claim 1, characterized in that: The fine adjustment mechanism comprises a first fixed seat (41) with one side being open, and a one-way screw (42) rotatably mounted inside the first fixed seat (41); a slider (43) is threadedly connected to the one-way screw (42), and the slider (43) is slidably connected to the first fixed seat (41); one end of the first electric push rod (46) is fixed to the slider (43), and the slider (43) is slidably connected to the first fixed seat (41); a second motor (44) is mounted on one end of the one-way screw (42), and a seat body of the second motor (44) is connected to an outer wall of the first fixed seat (41).

5. A chip pin contact detection device according to claim 4, characterized in that: The reinforcement mechanism (6) comprises a connection plate (61) fixed to the middle of the upper end of the second fixing seat (45), a plurality of suction nozzles (62) are equidistantly mounted on the connection plate (61), and one end of the suction nozzle (62) is connected to an air source via an air pump.

6. A chip pin contact detection device according to claim 1, characterized in that: The buffer mechanism comprises a threaded rod (75) rotatably connected to four corners of the second support plate (71); the lower end of the threaded rod (75) passes through the weight plate (72) and extends to the bottom of the weight plate (72); first springs (77) are fixed at the four corners of the lower surface of the weight plate (72); the first spring (77) is configured as an adaptive spring; the lower end of the first spring (77) is fixed to the pressure plate (73); the first spring (77) is sleeved on the outside of the threaded rod (75); a sprocket (76) is sleeved and fixed on the outer wall of the threaded rod (75) between the weight plate (72) and the second support plate (71); the plurality of sprockets (76) are connected by chain transmission; a fourth motor (78) is installed on the upper end of one of the threaded rods (75).

7. A chip pin contact detection device according to claim 6, characterized in that: The elastic conductive head (11) comprises a support column (111) fixed in the mounting hole (12); the lower end of the support column (111) is connected to a cable (112); the upper end of the support column (111) is detachably connected to a connector (114); the upper end of the connector (114) is fixed with a conductive column (115); the upper end of the conductive column (115) is plugged with a conductive block (117); the lower end of the conductive block (117) is connected to the upper end of the connector (114) via a second spring (116); and the second spring (116) is sleeved on the outer wall of the conductive column (115).

8. A chip pin contact detection method, based on a chip pin contact detection device according to any one of claims 1 to 7, characterized in that: The steps include: S1. Install a corresponding number of elastic conductive heads on the test board according to the number of pins of the chip to be tested; S2, clamping and fixing the chip to be tested by a fixing mechanism, and then using a lifting mechanism to drive the chip to be tested to dock with the test board, so that the elastic conductive head contacts the pins of the chip to be tested; S3, using the monitoring mechanism to confirm the alignment position of the chip to be tested, and if there is a deviation, using the fixing mechanism to fine-tune the chip position until the monitoring mechanisms on all sides detect contact with the side walls on all sides of the chip; S4. The pressure provided by the pressure-applying mechanism to the chip to be tested makes the chip pins more firmly contact with the elastic conductive head, so as to perform IC open and short circuit test.

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