A polishing device for silicon carbide wafers

Abstract

A polishing device for silicon carbide wafers disclosed by the present invention relates to the technical field of wafer polishing, and includes a polishing mechanism. A matching mechanism is installed on the polishing mechanism. The polishing mechanism includes a box body. A sliding frame is reciprocally slidably installed on the box body. A matching slider is slidably installed on the sliding frame. An adsorption component is rotatably installed on the matching slider. Trigger rod 1 and trigger rod 2 are respectively located at both ends of the sliding frame. Trigger rod 1 and trigger rod 2 cooperate with the adsorption component. By setting the polishing mechanism in the present invention, the wafer is initially roughly polished and then finely polished, realizing automatic replacement of the polishing disc, with high linkage and improved work efficiency. At the same time, the automatic loading and unloading are realized through the matching mechanism, and the degree of automation is high.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer polishing, and particularly relates to a polishing device for silicon carbide wafers. Background Art

[0002] A qualified silicon carbide wafer requires surface processing procedures such as cutting, grinding, rough polishing, and fine polishing. Existing equipment requires manual grinding of the cut wafers first. After grinding, a rough polishing disc and a fine polishing disc need to be installed on the grinding disc one by one. The sample is bonded to the carrier plate of the press, and the press drives the carrier plate and the sample to contact the polishing bottom sheet for polishing. During grinding and polishing, grinding fluid needs to be continuously added. During fine polishing, the grinding fluid left during rough polishing needs to be treated. The above bonding and replacement work all require manual full-process follow-up and processing, resulting in low work efficiency.

[0003] The Chinese invention patent with the publication number CN117340769B discloses a polishing device for silicon carbide wafers, including a support, a control terminal, a first bracket, a rotating frame, etc. The technical problem to be solved by this invention is the problem of excessive surface temperature of the wafer during polishing. The technical solution of this invention is not the same as that of the present invention, and the technical problems solved are also different. Therefore, the present invention provides a polishing device for silicon carbide wafers. Summary of the Invention

[0004] In view of the defects in the prior art, the present invention provides a polishing device for silicon carbide wafers to overcome the problems in the prior art.

[0005] A polishing device for silicon carbide wafers includes a polishing mechanism, and a matching mechanism is installed on the polishing mechanism. The polishing mechanism includes a box body, and two matching gears II with the same rotation direction are installed on the box body. The two matching gears II are respectively coaxially fixed to a cam II and a cam I. An incomplete tooth ring is respectively arranged on the cam II and the cam I. The incomplete tooth ring on the cam I cooperates with the loading gear, and the incomplete tooth ring on the cam II cooperates with the unloading gear. The loading gear and the unloading gear are rotatably installed on the box body. Eccentric columns I and II are respectively arranged at the eccentric positions of the loading gear and the unloading gear. The eccentric column I is slidably connected to a guide rail I, and a trigger rod I is installed on the guide rail I. The trigger rod I is slidably installed on the box body. The eccentric column II is slidably connected to a guide rail II, and a trigger rod is installed on the guide rail II. The trigger rod is slidably installed on the box body. The cam II and the cam I cooperate with and are corresponding to a sliding frame. The sliding frame is reciprocatingly slidably installed on the box body. A matching slider is slidably installed on the sliding frame. An adsorption component is rotatably installed on the matching slider. The trigger rod I and the trigger rod are respectively located at both ends of the sliding frame, and the trigger rod I and the trigger rod cooperate with the adsorption component.

[0006] Further, the adsorption assembly includes an adsorption rotating shaft, which is rotatably connected to a matching slider. Connecting disks and squares are respectively installed at both ends of the adsorption rotating shaft. Two spring pieces are fixedly installed on the sliding frame, and the two spring pieces are located on both sides of the square to limit the position of the square. An adsorption motor is installed on the connecting disk, and the output shaft of the adsorption motor is connected to the pressure cylinder.

[0007] Further, the pressure cylinder is connected to the suction cup. A piston rod is slidably installed in the pressure cylinder. The first end of the piston rod is in contact with the inner cylinder wall of the pressure cylinder. A disk is installed at the second end of the piston rod. The disk cooperates with the trigger rod 1. A locking slide rod is slidably installed on the disk. The locking slide rod is connected to the disk through a locking spring. A locking block is arranged on the locking slide rod. An inclined surface is arranged on the locking block. The locking block cooperates with the clamping rod. The clamping rod is fixedly installed on the pressure cylinder. The locking slide rod cooperates with the trigger rod.

[0008] Further, the adsorption rotating shaft is coaxially and fixedly connected to an adsorption gear. Two fixed racks are fixedly installed on the box body. The fixed racks cooperate with the adsorption gear. In the initial state, the two fixed racks are respectively located on both sides of the adsorption gear, and the positions of the fixed racks correspond to those of the adsorption gear.

[0009] Further, both ends of the sliding frame are respectively connected to the first end of a limiting spring. The second end of the limiting spring is installed on the box body. A matching hydraulic cylinder is installed on the sliding frame. The matching hydraulic cylinder corresponds to the matching slider. The matching slider is connected to the sliding frame through a matching spring.

[0010] Further, the feeding gear and the discharging gear are respectively connected to the box body through a torsion spring.

[0011] Further, both of the two matching gears 2 are meshed with the matching gear 1. The matching gear 1 is connected to the output shaft of the matching motor.

[0012] Further, a support frame is installed on the box body. A polishing motor is installed on the support frame. The output shaft of the polishing motor is connected to a grinding disk. The grinding disk cooperates with a rough polishing disk and a fine polishing disk. The rough polishing disk and the fine polishing disk are rotatably installed on a polishing bracket. The polishing bracket is fixedly connected to a polishing gear. The polishing bracket is slidably installed on a connecting platform. The polishing gear cooperates with a polishing rack. The polishing rack is connected to the piston rod of a polishing hydraulic cylinder.

[0013] Further, the polishing rack is fixedly connected to a connecting rod. A polishing inclined block is arranged on the connecting rod. An inclined surface is arranged on the polishing inclined block. The polishing inclined block cooperates with a cross column. The cross column is fixedly installed on a polishing lifting rod. The polishing lifting rod is slidably installed on the connecting platform. The polishing lifting rod corresponds to the polishing bracket. The polishing lifting rod is connected to the first end of a polishing spring. The second end of the polishing spring is installed on the connecting platform. The polishing inclined block is connected to a limiting rod. A straight section and an inclined section are arranged on the limiting rod.

[0014] The beneficial effects of the present invention compared with the prior art are as follows: (1) By setting a polishing mechanism, the sample wafer is first roughly polished preliminarily and then finely polished, and the polishing disc is automatically replaced, with high linkage and improved work efficiency; (2) By starting the cooperation, the hydraulic cylinder extends the piston rod to push the cooperation slider to slide in the sliding frame, driving the adsorption component to move downward, so that the sample on the suction cup contacts the rough polishing disc on the support frame. Start the polishing motor to drive the grinding disc to rotate and drive the rough polishing disc to rotate. At the same time, start the adsorption motor to drive the pressure cylinder, suction cup, and sample to rotate for rough polishing; (3) By starting the cooperation motor to drive the cooperation gear one to rotate, the cooperation gear one rotates to drive the two cooperation gears two to rotate, and the two cooperation gears two respectively drive the cam one and the cam two to rotate; after the cam one rotates a preset angle, it contacts the sliding frame and pushes the sliding frame to slide on the box body in the direction of the eccentric column one. When the sliding frame slides the maximum distance in the direction of the eccentric column one, the arc surface on the cam one contacts the sliding frame, so that the position of the sliding frame remains unchanged within the preset time; (4) By making the locking slide rod correspond to the trigger rod; at this time, the trigger rod sliding in the box body presses down the locking slide rod, compressing the locking spring. The piston rod drives the locking slide rod and the locking block to move under the action of atmospheric pressure, unlocking the relative position of the disc and the pressure cylinder, and the suction cup no longer sucks the sample wafer, and the wafer is collected by the collection mechanism. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the overall structure of the present invention.

[0016] Figure 2 It is a schematic diagram of the partial sectional structure of the polishing mechanism of the present invention.

[0017] Figure 3 It is a schematic diagram of the partial structure of the polishing mechanism of the present invention.

[0018] Figure 4 It is a schematic diagram of the partial structure of the cooperation mechanism of the present invention Figure 1 .

[0019] Figure 5 It is a schematic diagram of the partial structure of the cooperation mechanism of the present invention Figure 2 .

[0020] Figure 6 It is a schematic diagram of the partial structure of the cooperation mechanism of the present invention Figure 3 .

[0021] Figure 7 It is a schematic diagram of the partial sectional structure of the cooperation mechanism of the present invention Figure 1 .

[0022] Figure 8 It is a schematic diagram of the partial sectional structure of the cooperation mechanism of the present invention Figure 2 .

[0023] Figure 9 This is a schematic diagram of the partial structure of the adsorption component of the present invention.

[0024] Figure 10 This is a schematic diagram of the positions of parts in one working state of the present invention.

[0025] Figure 11 This is a schematic diagram of the positions of parts in another working state of the present invention.

[0026] Reference numerals: 1 - Polishing mechanism; 2 - Matching mechanism; 101 - Box body; 102 - Cleaning component; 103 - Fine polishing disc; 104 - Coarse polishing disc; 105 - Polishing bracket; 106 - Support frame; 107 - Grinding fluid supply component; 108 - Polishing motor; 109 - Grinding disc; 110 - Polishing gear; 111 - Polishing spring; 112 - Polishing lifting rod; 113 - Horizontal column; 114 - Polishing inclined block; 115 - Limiting rod; 116 - Connecting rod; 117 - Polishing rack; 118 - Polishing hydraulic cylinder; 119 - Connection platform; 201 - Sliding frame; 202 - Matching hydraulic cylinder; 203 - Matching slider; 204 - Matching spring; 205 - Adsorption rotating shaft; 206 - Matching motor; 207 - Matching gear one; 208 - Matching gear two; 209 - Cam two; 210 - Cam one; 211 - Limiting spring; 212 - Guide rail one; 213 - Eccentric column one; 214 - Trigger rod one; 215 - Feeding gear; 216 - Discharging gear; 217 - Guide rail two; 218 - Eccentric column two; 219 - Trigger rod; 220 - Square block; 221 - Spring piece; 222 - Fixed rack; 223 - Adsorption gear; 224 - Connection disc; 225 - Adsorption motor; 226 - Pressure cylinder; 227 - Disc; 228 - Piston rod; 229 - Suction cup; 230 - Locking spring; 231 - Locking slide rod; 232 - Locking block; 233 - Torsion spring; 234 - Locking rod. Detailed implementation manners

[0027] The present invention will be further described below in conjunction with the accompanying drawings and exemplary embodiments. The schematic embodiments and descriptions here are used to explain the present invention, but not to limit the present invention.

[0028] Embodiment: Refer to Figures 1 - 11A polishing device for silicon carbide wafers as shown, comprising a polishing mechanism 1, on which a matching mechanism 2 is installed. The polishing mechanism 1 includes a box body 101, a cleaning component 102, a fine polishing disc 103, a rough polishing disc 104, a polishing bracket 105, a support frame 106, a grinding fluid supply component 107, a polishing motor 108, a grinding disc 109, a polishing gear 110, a polishing spring 111, a polishing lifting rod 112, a cross column 113, a polishing inclined block 114, a limiting rod 115, a connecting rod 116, a polishing rack 117, a polishing hydraulic cylinder 118, and a connecting platform 119; The matching mechanism 2 includes an adsorption component, a sliding frame 201, a matching hydraulic cylinder 202, a matching slider 203, a matching spring 204, a matching motor 206, a first matching gear 207, a second matching gear 208, a second cam 209, a first cam 210, a limiting spring 211, a first guide rail 212, a first eccentric column 213, a first trigger rod 214, a feeding gear 215, a discharging gear 216, a second guide rail 217, a second eccentric column 218, a trigger lever 219, a spring piece 221, a fixed rack 222, and a torsion spring 233; A cleaning component 102 is installed on the box body 101, and two second matching gears 208 with the same rotation direction are installed on the box body 101. The second matching gears 208 are rotatably installed on the box body 101, and the two second matching gears 208 are coaxially and fixedly connected to the second cam 209 and the first cam 210 respectively. An incomplete tooth ring is provided on each of the second cam 209 and the first cam 210. The incomplete tooth ring on the first cam 210 cooperates with the feeding gear 215, and the incomplete tooth ring on the second cam 209 cooperates with the discharging gear 216. The feeding gear 215 and the discharging gear 216 are rotatably installed on the box body 101, and a first eccentric column 213 and a second eccentric column 218 are respectively provided at the eccentric positions of the feeding gear 215 and the discharging gear 216; The first eccentric column 213 is slidably connected to the first guide rail 212, and a first trigger rod 214 is installed on the first guide rail 212. The first trigger rod 214 is slidably installed on the box body 101. The second eccentric column 218 is slidably connected to the second guide rail 217, and a trigger lever 219 is installed on the second guide rail 217. The trigger lever 219 is slidably installed on the box body 101. The second cam 209 and the first cam 210 cooperate with the sliding frame 201 and are correspondingly positioned; The sliding frame 201 is reciprocally slidably installed on the box body 101. A matching slider 203 is slidably installed on the sliding frame 201, and an adsorption component is rotatably installed on the matching slider 203. The first trigger rod 214 and the trigger lever 219 are respectively located at both ends of the sliding frame 201, and the first trigger rod 214 and the trigger lever 219 cooperate with the adsorption component.

[0029] The adsorption assembly includes an adsorption rotating shaft 205, a square block 220, an adsorption gear 223, a connecting disc 224, an adsorption motor 225, a pressure cylinder 226, a disc 227, a piston rod 228, a suction cup 229, a locking spring 230, a locking slide rod 231, a locking block 232, and a clamping rod 234; the adsorption rotating shaft 205 is rotatably connected to the mating slider 203, and connecting discs 224 and square blocks 220 are respectively installed at both ends of the adsorption rotating shaft 205. Two spring pieces 221 are fixedly installed on the sliding frame 201, and the two spring pieces 221 are located on both sides of the square block 220 to limit the position of the square block 220. The adsorption motor 225 is installed on the connecting disc 224, and the output shaft of the adsorption motor 225 is connected to the pressure cylinder 226.

[0030] The pressure cylinder 226 is connected to the suction cup 229. A piston rod 228 is slidably installed in the pressure cylinder 226. The first end of the piston rod 228 is in contact with the inner wall of the inner cylinder of the pressure cylinder 226. The second end of the piston rod 228 is installed with a disc 227. The disc 227 cooperates with the trigger rod one 214. A locking slide rod 231 is slidably installed on the disc 227. The locking slide rod 231 is connected to the disc 227 through a locking spring 230. A locking block 232 is arranged on the locking slide rod 231. An inclined surface is arranged on the locking block 232. The locking block 232 cooperates with the clamping rod 234. The clamping rod 234 is fixedly installed on the pressure cylinder 226. The locking slide rod 231 cooperates with the trigger rod 219.

[0031] The adsorption rotating shaft 205 is coaxially and fixedly connected to the adsorption gear 223. Two fixed racks 222 are fixedly installed on the box body 101. The fixed racks 222 cooperate with the adsorption gear 223; in the initial state, the two fixed racks 222 are respectively located on both sides of the adsorption gear 223, and the positions of the fixed racks 222 correspond to those of the adsorption gear 223.

[0032] Both ends of the sliding frame 201 are respectively connected to the first end of a limit spring 211. The second end of the limit spring 211 is installed on the box body 101. A mating hydraulic cylinder 202 is installed on the sliding frame 201. The mating hydraulic cylinder 202 is connected to the mating slider 203. The mating hydraulic cylinder 202 and the mating slider 203 are in corresponding positions. The mating slider 203 is connected to the sliding frame 201 through a mating spring 204.

[0033] The loading gear 215 and the unloading gear 216 are respectively connected to the box body 101 through a torsion spring 233.

[0034] Both of the two mating gears two 208 are meshed with the mating gear one 207. The mating gear one 207 is connected to the output shaft of the mating motor 206. The mating motor 206 is installed on the box body 101.

[0035] A support frame 106 is installed on the box body 101. A water leakage port is provided on the support frame 106. A grinding fluid supply assembly 107 is installed on the support frame 106. A polishing motor 108 is installed on the support frame 106. The output shaft of the polishing motor 108 is connected to a grinding disc 109. The grinding disc 109 cooperates with a rough polishing disc 104 and a fine polishing disc 103. The rough polishing disc 104 and the fine polishing disc 103 are rotatably installed on a polishing bracket 105. In the working state, the grinding disc 109 is in spline fit with the rough polishing disc 104 or the fine polishing disc 103. The polishing bracket 105 is fixedly connected to a polishing gear 110. The polishing bracket 105 is slidably installed on a connecting platform 119. The connecting platform 119 is fixedly installed on the support frame 106. The polishing gear 110 cooperates with a polishing rack 117. The polishing rack 117 is connected to the piston rod of a polishing hydraulic cylinder 118. The polishing hydraulic cylinder 118 is installed on the connecting platform 119.

[0036] The polishing rack 117 is fixedly connected to a connecting rod 116. A polishing inclined block 114 is provided on the connecting rod 116. An inclined surface is provided on the polishing inclined block 114. The polishing inclined block 114 cooperates with a cross column 113. The cross column 113 is fixedly installed on a polishing lifting rod 112. The polishing lifting rod 112 is slidably installed on the connecting platform 119. The polishing lifting rod 112 corresponds to the position of the polishing bracket 105. The polishing lifting rod 112 is connected to the first end of a polishing spring 111. The second end of the polishing spring 111 is installed on the connecting platform 119. The polishing inclined block 114 is connected to a limiting rod 115. A straight section and an inclined section are provided on the limiting rod 115.

[0037] The working principle of the present invention is as follows: Start the cooperation motor 206 to drive the cooperation gear one 207 to rotate. The rotation of the cooperation gear one 207 drives the two cooperation gears two 208 to rotate. The two cooperation gears two 208 respectively drive the cam one 210 and the cam two 209 to rotate. After the cam one 210 rotates a preset angle, it contacts the sliding frame 201 and pushes the sliding frame 201 to slide on the box body 101 in the direction of the eccentric column one 213. When the sliding frame 201 slides the maximum distance in the direction of the eccentric column one 213, the arc surface on the cam one 210 contacts the sliding frame 201, so that the position of the sliding frame 201 remains unchanged within a preset time. After the sliding frame 201 remains stationary for a certain period of time, the incomplete tooth ring section on the rotating cam one 210 meshes with the feeding gear 215, driving the feeding gear 215 and the eccentric column one 213 to rotate, and driving the guide rail one 212 and the trigger rod one 214 to slide on the box body 101.

[0038] During the process of the sliding carriage 201 moving towards the eccentric column 1 213, the sliding carriage 201 drives the mating slider 203 and the adsorption assembly to move synchronously. At this time, the adsorption gear 223 in the adsorption assembly meshes with the fixed rack 222 in the direction of the eccentric column 1 213 and rotates, driving the adsorption rotating shaft 205 and the connecting disc 224 to rotate by 90 degrees, driving the square block 220 to rotate by 90 degrees. During the rotation of the square block 220, the spring pieces 221 on both sides are pushed. After the square block 220 completes a 90-degree rotation, the spring pieces 221 restrict the position of the square block 220 again.

[0039] When the arc surface on the cam 1 210 contacts the sliding carriage 201, feeding is performed at the feeding position, so that a wafer sample is attached to the suction cup 229. At this time, the trigger rod 1 214 corresponds to the position of the disc 227. Subsequently, the trigger rod 1 214 sliding in the box body 101 pushes the disc 227 to move, driving the piston rod 228 to move, so that a negative pressure is formed in the pressure cylinder 226 to suck the sample. The disc 227 drives the locking slide rod 231 to move, driving the locking block 232 to move. The inclined surface on the locking block 232 contacts the locking rod 234, compressing the locking spring 230. Subsequently, the locking block 232 moves together with the locking slide rod 231 under the action of the spring, so that the locking block 232 is caught by the locking rod 234, locking the position of the disc 227.

[0040] Subsequently, the continuously rotating cam 1 210 disengages from the sliding carriage 201. The sliding carriage 201 returns to the initial position under the elastic force of the limit spring 211. During the reset process of the sliding carriage 201, the adsorption gear 223 in the adsorption assembly meshes with the fixed rack 222 again, and the adsorption assembly rotates 90 degrees in the reverse direction to return to the initial position.

[0041] Start the mating hydraulic cylinder 202 to extend the piston rod to push the mating slider 203 to slide in the sliding carriage 201, driving the adsorption assembly to move downward, so that the sample on the suction cup 229 contacts the rough polishing disc 104 on the support frame 106. Start the polishing motor 108 to drive the grinding disc 109 to rotate, driving the rough polishing disc 104 to rotate. At the same time, start the adsorption motor 225 to drive the pressure cylinder 226, the suction cup 229, and the sample to rotate for rough polishing. After the preset rough polishing time, the polishing motor 108 and the adsorption motor 225 stop operating.

[0042] The polishing hydraulic cylinder 118 starts to extend the piston rod, driving the polishing rack 117, connecting rod 116, limit rod 115, and polishing inclined block 114 to move, so that the inclined surface on the polishing inclined block 114 contacts the cross column 113, pushing the cross column 113 and the polishing lifting rod 112 to slide upward on the connecting platform 119, compressing the polishing spring 111, separating the rough polishing disc 104 from the grinding disc 109. Subsequently, the continuously moving polishing rack 117 contacts the polishing gear 110, driving the polishing gear 110 and the polishing bracket 105 to rotate, driving the rough polishing disc 104 and the fine polishing disc 103 to rotate. At this time, the cross column 113 is located at the straight section position of the limit rod 115. After the fine polishing disc 103 rotates to the corresponding position of the grinding disc 109, the cross column 113 contacts the inclined section position of the limit rod 115, driving the fine polishing disc 103 and the polishing bracket 105 to move downward, so that the fine polishing disc 103 is spline - fitted with the grinding disc 109. Then, start the polishing motor 108 and the adsorption motor 225, driving the fine polishing disc 103 and the sample to rotate. The principle is the same as above, and the sample is finely polished. When switching between the fine polishing disc 103 and the rough polishing disc 104, the non - working fine polishing disc 103 or rough polishing disc 104 can be cleaned by the cleaning component 102.

[0043] During the polishing process, the grinding fluid supply component 107 supplies an appropriate amount of grinding fluid.

[0044] After polishing is completed, the continuously rotating second cam 209 contacts the sliding frame 201, pushing the sliding frame 201 to slide on the box body 101 in the direction of the second guide rail 217. When the sliding frame 201 slides the maximum distance in the direction of the second guide rail 217, the arc surface on the second cam 209 contacts the sliding frame 201, keeping the position of the sliding frame 201 unchanged for a preset time. After the sliding frame 201 remains stationary for the preset time, the incomplete gear ring section on the rotating second cam 209 meshes with the blanking gear 216, driving the blanking gear 216 and the eccentric column two 218 to rotate, driving the second guide rail 217 and the trigger rod 219 to slide on the box body 101.

[0045] During the process of the sliding frame 201 moving in the direction of the second guide rail 217, the sliding frame 201 drives the mating slider 203 and the adsorption component to move synchronously. The principle is the same as above. When the adsorption component rotates ninety degrees in the direction of the second guide rail 217, the locking slide rod 231 corresponds to the position of the trigger rod 219. At this time, the trigger rod 219 sliding in the box body 101 presses down the locking slide rod 231, compressing the locking spring 230. The piston rod 228 drives the locking slide rod 231 and the locking block 232 to move under the action of atmospheric pressure, unlocking the relative position between the disc 227 and the pressure cylinder 226, and the suction cup 229 no longer sucks the sample wafer, and the wafer is collected by the collection mechanism.

[0046] After the feeding gear 215 and the blanking gear 216 rotate, they are reset by the torsion spring 233.

[0047] It should be understood that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit them. For those skilled in the art, the technical solutions described in the above embodiments can be modified, or some of the technical features can be equivalently replaced; and all such modifications and replacements should fall within the protection scope of the appended claims of the present invention.

Claims

1. A polishing device for silicon carbide wafers, comprising a polishing mechanism (1), and a matching mechanism (2) is installed on the polishing mechanism (1), characterized in that: The polishing mechanism (1) includes a box body (101). Two mating gears II (208) with the same rotation direction are installed on the box body (101). The two mating gears II (208) are respectively coaxially and fixedly connected to a cam II (209) and a cam I (210). An incomplete tooth ring is respectively arranged on the cam II (209) and the cam I (210). The incomplete tooth ring on the cam I (210) cooperates with a feeding gear (215), and the incomplete tooth ring on the cam II (209) cooperates with a discharging gear (216). The feeding gear (215) and the discharging gear (216) are rotatably installed on the box body (101). Eccentric columns I (213) and eccentric columns II (218) are respectively arranged at the eccentric positions of the feeding gear (215) and the discharging gear (216); the eccentric column I (213) is slidably connected to a guide rail I (212), a trigger rod I (214) is installed on the guide rail I (212), and the trigger rod I (214) is slidably installed on the box body (101). The eccentric column II (218) is slidably connected to a guide rail II (217), a trigger rod (219) is installed on the guide rail II (217), and the trigger rod (219) is slidably installed on the box body (101). The cam II (209) and the cam I (210) cooperate with a sliding frame (201) and are in corresponding positions; a sliding frame (201) is reciprocally slidably installed on the box body (101), a mating slider (203) is slidably installed on the sliding frame (201), an adsorption assembly is rotatably installed on the mating slider (203), the trigger rod I (214) and the trigger rod (219) are respectively located at both ends of the sliding frame (201), and the trigger rod I (214) and the trigger rod (219) cooperate with the adsorption assembly.

2. The polishing device for a silicon carbide wafer according to claim 1, characterized in that: The adsorption assembly includes an adsorption rotating shaft (205). The adsorption rotating shaft (205) is rotatably connected to the mating slider (203). Connection disks (224) and blocks (220) are respectively installed at both ends of the adsorption rotating shaft (205). Two spring pieces (221) are fixedly installed on the sliding frame (201). The two spring pieces (221) are located on both sides of the block (220) to limit the position of the block (220). An adsorption motor (225) is installed on the connection disk (224). The output shaft of the adsorption motor (225) is connected to a pressure cylinder (226).

3. A polishing device for silicon carbide wafers according to claim 2, characterized in that: The pressure cylinder (226) is connected to the suction cup (229). A piston rod (228) is slidably installed in the pressure cylinder (226). The first end of the piston rod (228) is in contact with the inner cylinder wall of the pressure cylinder (226). A disc (227) is installed at the second end of the piston rod (228). The disc (227) cooperates with the first trigger rod (214). A locking slide rod (231) is slidably installed on the disc (227). The locking slide rod (231) is connected to the disc (227) through a locking spring (230). A locking block (232) is provided on the locking slide rod (231). An inclined surface is provided on the locking block (232). The locking block (232) cooperates with a locking rod (234). The locking rod (234) is fixedly installed on the pressure cylinder (226). The locking slide rod (231) cooperates with the trigger rod (219).

4. The polishing apparatus for a silicon carbide wafer according to claim 3, characterized in that: The adsorption rotating shaft (205) is coaxially and fixedly connected to the adsorption gear (223). Two fixed racks (222) are fixedly installed on the box body (101). The fixed racks (222) cooperate with the adsorption gear (223). In the initial state, the two fixed racks (222) are respectively located on both sides of the adsorption gear (223), and the positions of the fixed racks (222) and the adsorption gear (223) correspond to each other.

5. The polishing apparatus for a silicon carbide wafer according to claim 4, wherein: Both ends of the sliding frame (201) are respectively connected to the first end of a limit spring (211). The second end of the limit spring (211) is installed on the box body (101). A cooperating hydraulic cylinder (202) is installed on the sliding frame (2). The cooperating hydraulic cylinder (202) corresponds to the position of the cooperating slider (203). The cooperating slider (203) is connected to the sliding frame (201) through a cooperating spring (204).

6. The polishing apparatus for a silicon carbide wafer according to claim 5, wherein: The loading gear (215) and the unloading gear (216) are respectively connected to the box body (101) through a torsion spring (233).

7. The polishing apparatus for a silicon carbide wafer according to claim 6, wherein: Both of the two second cooperating gears (208) are meshed with the first cooperating gear (207). The first cooperating gear (207) is connected to the output shaft of the cooperating motor (206).

8. The polishing apparatus for a silicon carbide wafer according to claim 7, wherein: A support frame (106) is installed on the box body (101). A polishing motor (108) is installed on the support frame (106). The output shaft of the polishing motor (108) is connected to a grinding disc (109). The grinding disc (109) cooperates with a rough polishing disc (104) and a fine polishing disc (103). The rough polishing disc (104) and the fine polishing disc ( ) are rotatably installed on a polishing bracket (105). The polishing bracket (105) is fixedly connected to a polishing gear (110). The polishing bracket (105) is slidably installed on a connecting platform (119). The polishing gear (110) cooperates with a polishing rack (117). The polishing rack (117) is connected to the piston rod of a polishing hydraulic cylinder (118).

9. A polishing apparatus for a silicon carbide wafer according to claim 8, characterized in that: The polishing rack (117) is fixedly connected to the connecting rod (116). A polishing inclined block (114) is provided on the connecting rod (116). An inclined surface is provided on the polishing inclined block (114). The polishing inclined block (114) cooperates with the cross column (113). The cross column (113) is fixedly installed on the polishing lifting rod (112). The polishing lifting rod (112) is slidably installed on the connecting platform (119). The polishing lifting rod (112) corresponds to the position of the polishing bracket (105). The polishing lifting rod (112) is connected to the first end of the polishing spring (111). The second end of the polishing spring (111) is installed on the connecting platform (119). The polishing inclined block (114) is connected to the limiting rod (115). The limiting rod (115) is provided with a straight section and an inclined section.

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