Semiconductor heating plate and fixing method
By designing fixed structures and heating components in semiconductor heating equipment, the problem of displacement of semiconductor wafers under external force interference is solved, and uniform heating of wafers of different diameters and sizes is achieved, improving product pass rate and equipment applicability .
Patent Information
- Application Number
- CN202411492752.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-24
- Publication Date
- 2024-12-27
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
The lack of fixed components of existing semiconductor heating equipment leads to the wafer displacement under external force interference, reducing product qualification rate, and being unable to uniformly heat wafers of different diameters and sizes, increasing production costs and complexity.
A semiconductor heating disk is designed, including a fixed structure and heating assembly. By fixing components such as electric push rods, moving fixed arc blocks, fixed suction cups and lifting cylinders, the position of the semiconductor wafer can be adjusted and fixed, and the heating area size can be controlled. And uniform heating of wafers of different diameter sizes is achieved through transmission units and conductive blocks.
It effectively prevents defects caused by external force movement during the process of wafers, improves product qualification rate, simplifies equipment use, reduces production costs, and improves processing efficiency and equipment applicability.
Smart Images
Figure CN119212140A_ABST
Abstract
Description
Technical Field
[0001] The present invention belongs to the field of semiconductor heating, and in particular, relates to a semiconductor heating plate and a fixing method thereof. Background Art
[0002] During the production process of semiconductor wafers, a heating plate in semiconductor production and processing equipment is required to soft bake the wafers after the coating process. Chinese patent application CN116489836A discloses a semiconductor heating device, which uses a wafer carrier to load wafers and lacks fixed components. When encountering external force interference during external processing, such as vibration and impact, the wafer will be displaced, causing defects in the semiconductor wafer and reducing the product qualification rate. The wafer carrier of the device can only load wafers of a single diameter size, and the heating range of the semiconductor wafer cannot be controlled. When heating wafers of different diameters, fixed parts and heating parts of different specifications need to be replaced. The replacement steps are cumbersome, which increases production costs and reduces work efficiency. Summary of the invention
[0003] In view of the problems in the related art, the present invention proposes a semiconductor heating plate and a fixing method, which have the functions of adjusting the position of the semiconductor wafer and the fixed heating plate, and can adjust semiconductor wafers of different diameters, and then fix the semiconductor wafer to prevent external force from causing the semiconductor wafer to move during the processing, causing defects in the semiconductor wafer, and reducing the product qualification rate; the size of the heating area of the semiconductor wafer can be controlled, and semiconductor wafers of different diameters can be fixed and heated, without the need to replace heating parts and fixing parts, thereby improving the processing efficiency and the applicability of the equipment, etc., and solves the problem that the wafer carrier lacks a fixed component for loading the wafer, and when encountering external force interference during the processing, such as vibration and impact, the wafer will be displaced, causing defects in the semiconductor wafer, and reducing the product qualification rate; the wafer carrier can only load wafers of a single diameter size, and the heating range of the semiconductor wafer cannot be controlled. When heating different diameter sizes, it is necessary to replace fixed parts and heating parts of different specifications, and the replacement steps are cumbersome, which increases production costs and reduces work efficiency In order to solve the above technical problems, the present invention provides the following technical solutions: The present invention is a semiconductor heating plate, comprising a fixing structure, the fixing structure comprising a mounting barrel, a fixed heating plate and a plurality of fixing components, the fixed heating plate is arranged in the mounting barrel, the fixing components are arranged above the fixed heating plate and are distributed in a circumference, and the top surface of the fixed heating plate is provided with a plurality of suction cup mounting openings; The fixed assembly includes a movable fixed arc block, a fixed electric push rod, a fixed suction cup and a fixed air extraction pipe, wherein the fixed electric push rod is fixedly mounted on the outer wall of the mounting barrel, the movable fixed arc block is arranged in the mounting barrel, the output end of the fixed electric push rod passes through the mounting barrel and is fixedly connected to the movable fixed arc block, the fixed suction cup is arranged in the suction cup mounting port, one end of the fixed air extraction pipe is arranged outside the mounting barrel, and the other end passes through the mounting barrel and is fixedly connected to the bottom end of the fixed suction cup; The fixed electric push rod can push the movable fixed arc block to move toward the axis direction of the fixed heating plate, the movable fixed arc block can push the semiconductor wafer to move and limit the position, and the fixed suction cup can adsorb and fix the semiconductor wafer; A heating assembly is arranged in the installation barrel, and the heating assembly includes a heating support plate, an electric heating column, a lifting ring plate, a plurality of lifting cylinders and a plurality of heating units. The heating support plate is fixedly installed inside the installation barrel, the electric heating column is fixedly installed on the top surface of the heating support plate, the lifting ring plate is sleeved on the electric heating column, the lifting cylinder is fixedly installed on the top surface of the heating support plate, and the output end of the lifting cylinder is fixedly connected to the lifting ring plate; The heating unit is distributed in a circumference in the installation barrel, and the heating unit includes a plurality of heating plates, a plurality of electric heating rods, a plurality of conductive blocks, a heating installation plate, a lifting installation plate and a plurality of supporting mechanisms. The heating installation plate is fixedly installed on the inner wall of the installation barrel, the lifting installation plate is arranged below the heating installation plate, the lifting installation plate is fixedly connected to the lifting ring plate, the heating installation plate and the lifting installation plate are both provided with a plurality of heating rod installation grooves, the electric heating rods penetrate the heating rod installation grooves and slide in cooperation with the heating rod installation grooves, the conductive blocks are located above the heating installation plate, the conductive blocks are fixedly connected to the electric heating rods, and the heating plates are fixedly installed on the top ends of the electric heating rods; The supporting mechanism is arranged on the bottom surface of the lifting mounting plate, and the supporting mechanism comprises a supporting baffle, a plurality of supporting mounting blocks, a baffle gear, a spring spring, a rotating gear and a rotating rod, the supporting mounting block is fixedly mounted on the bottom surface of the lifting mounting plate, the supporting baffle is arranged on one side of the electric heating rod, and the two sides of the supporting baffle are respectively rotatably connected with the supporting mounting block, the baffle gear is arranged on one side of the supporting baffle, the baffle gear connecting shaft passes through the supporting mounting block and is fixedly connected with the supporting baffle, the rotating gear is arranged on one side of the supporting baffle, the rotating gear connecting shaft is rotatably connected with the supporting mounting block, the rotating gear is meshed with the baffle gear, the spring spring is sleeved on the rotating gear connecting shaft, the spring spring is fixedly connected with the supporting mounting block, and the rotating rod is fixedly mounted on the rotating gear connecting shaft; The heating assembly also includes a plurality of transmission units, which include a movable baffle rod, a transmission connecting column, a movable arc plate, an arc plate support plate and a movable connecting rod. The arc plate support plate is fixedly mounted on the top surface of the mounting barrel, and the movable arc plate is slidably mounted on the top surface of the arc plate support plate. A plurality of baffle rod mounting holes are provided on the barrel wall of the mounting barrel, and the movable baffle rod passes through the baffle rod mounting holes and slidably cooperates with the baffle rod mounting holes. The bottom end of the transmission connecting column is fixedly connected to an end of the movable baffle rod away from the mounting barrel, the movable arc plate is provided with a movable slot, and the top end of the transmission connecting column passes through the movable slot. One end of the movable connecting rod is rotatably connected to the movable arc plate, and the other end is rotatably connected to the movable fixed arc block.
[0004] Preferably, the bottom end of the fixed air extraction pipe is fixedly connected to an air extraction assembly pipe, an air extraction pump is provided below the mounting barrel, and the air extraction assembly pipe is fixedly connected to the air extraction pump.
[0005] Preferably, a plurality of conductive rods are arranged below the fixed heating plate, and the conductive rods are fixedly connected to the electric heating columns.
[0006] Preferably, the heating plates in the heating units are arranged in sequence and contact each other, and the heating plates of adjacent heating units contact each other. When the top surfaces of the heating plates are the same as the top surface of the fixed heating plate, a circular heating area with a smooth surface is formed.
[0007] Preferably, a heat-resistant rubber block is fixedly mounted on the arc surface of the movable fixed arc block in contact with the semiconductor wafer.
[0008] A method for fixing a semiconductor heating plate, using the semiconductor heating plate mentioned above, comprises the following steps; Placing a semiconductor wafer on the top surface of the fixed heating plate; The lifting cylinder pushes the lifting ring plate to move upward, the lifting ring plate drives the lifting mounting plate to move upward, and the lifting mounting plate drives the electric heating rod to move upward through the supporting baffle plate, so that the top surface of the heating plate is flush with the top surface of the fixed heating plate; The fixed electric push rod pushes the movable fixed arc block to move toward the fixed heating plate, and the movable fixed arc block drives the semiconductor wafer to move, so that the axis of the semiconductor wafer coincides with the axis of the fixed heating plate, and the fixed suction cup adsorbs and fixes the semiconductor wafer; The movement of the movable fixed arc block drives the movable arc plate to move, and the movable arc plate can drive the movable baffle rod to move. During the movement of the movable baffle rod, it contacts the rotating rod and pushes the rotating rod to rotate. The rotation of the rotating rod drives the rotating gear to rotate, and the rotating gear drives the baffle gear to rotate. The rotation of the baffle gear drives the supporting baffle plate to rotate, so that the top surface of the supporting baffle plate is no longer in contact with the bottom end of the electric heating rod, and the electric heating rod drives the corresponding heating plate to move downward. When the movable fixed arc block stops moving, the electric heating column is energized to generate heat and transfers heat to the fixed heating plate. The electric heating rod corresponding to the heating plate whose top surface is flush with the top surface of the fixed heating plate is energized to generate heat, and transfers heat to the heating plate. The top surface of the heating plate and the top surface of the fixed heating plate form a circular heating area with a smooth surface to heat the semiconductor wafer.
[0009] Beneficial Effects Compared with the prior art, the present invention provides a semiconductor heating plate and a fixing method, which have the following beneficial effects: 1. The semiconductor wafer is placed on the top surface of the fixed heating plate. The fixed electric push rod pushes the movable fixed arc block to move towards the fixed heating plate. The movable fixed arc block drives the semiconductor wafer to move so that the axis of the semiconductor wafer coincides with the axis of the fixed heating plate. The fixed suction cup adsorbs and fixes the semiconductor wafer, adjusts the position of the semiconductor wafer and the fixed heating plate, and can adjust semiconductor wafers of different diameters. Then the semiconductor wafer is fixed to prevent external force from moving the semiconductor wafer during processing, causing defects in the semiconductor wafer and reducing the product qualification rate.
[0010] 2. The lifting ring plate drives the lifting mounting plate to move upward, the lifting mounting plate drives the supporting baffle to move, the supporting baffle drives the electric heating rod to move upward, when the rotating rod rotates, the rotating rod rotates and drives the corresponding rotating gear to rotate, the rotating gear drives the corresponding baffle gear to rotate, the baffle gear rotates and drives the corresponding supporting baffle to rotate, so that the top surface of the supporting baffle is no longer in contact with the bottom end of the corresponding electric heating rod, the electric heating rod drives the corresponding heating plate to move downward, the top surface of the heating plate and the top surface of the fixed heating plate form a circular heating area with a smooth surface to heat the semiconductor wafer; the size of the heating area of the semiconductor wafer can be controlled, and semiconductor wafers of different diameters can be fixedly heated without replacing heating parts and fixed parts, thereby improving processing efficiency and equipment applicability.
[0011] 3. The mobile fixed arc block drives the mobile arc plate to move through the mobile connecting rod. The movement of the mobile arc plate drives the mobile blocking rod to move through the transmission connecting column. During the movement of the mobile blocking rod, it contacts the rotating rod and pushes the rotating rod to rotate. The size of the heating area of the semiconductor wafer is controlled by the movement of the mobile fixed arc block, thereby improving the accuracy of the equipment and improving the applicability of the equipment.
[0012] Of course, any product implementing the present invention does not necessarily need to achieve all of the advantages described above at the same time. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] In order to more clearly illustrate the technical solutions of the embodiments of the invention, the drawings required for describing the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.
[0014] Figure 1 It is one of the overall three-dimensional structural schematic diagrams of the present invention; Figure 2 This is the second schematic diagram of the overall three-dimensional structure of the present invention; Figure 3 It is one of the partial three-dimensional structural schematic diagrams of the present invention; Figure 4 For the present invention Figure 3 A schematic diagram of the structure at A; Figure 5 This is the second schematic diagram of the partial three-dimensional structure of the present invention; Figure 6 For the present invention Figure 5 Schematic diagram of the structure at B; Figure 7 This is the third schematic diagram of the partial three-dimensional structure of the present invention; Figure 8 For the present invention Figure 7 Schematic diagram of the structure at C; Fig. 9 This is the fourth schematic diagram of the partial three-dimensional structure of the present invention; Fig.10 For the present invention Fig. 9 Schematic diagram of the structure at D.
[0015] In the accompanying drawings, the components represented by the reference numerals are listed as follows: 1. Install barrel; 101. Fix heating plate; 2. Fix assembly; 201. Move fixed arc block; 202. Fix electric push rod; 203. Fix suction cup; 204. Fix air extraction pipe; 205. Air extraction assembly pipe; 206. Air extraction pump; 3. Heating assembly; 301. Heating support plate; 302. Electric heating column; 303. Lifting ring plate; 304. Lifting cylinder; 305. Conductive rod; 4. Heating unit; 401. Heating plate; 40 2. Electric heating rod; 403. Conductive block; 404. Heating mounting plate; 405. Lifting mounting plate; 5. Support mechanism; 501. Support baffle; 502. Support mounting block; 503. Baffle gear; 504. Clockwork spring; 505. Rotating gear; 506. Rotating rod; 6. Transmission unit; 601. Moving baffle rod; 602. Transmission connecting column; 603. Moving arc plate; 604. Arc plate support plate; 605. Moving connecting rod. DETAILED DESCRIPTION
[0016] The following will be combined with the drawings in the embodiments of the invention to clearly and completely describe the technical solutions in the embodiments of the invention. Obviously, the described embodiments are only part of the embodiments of the invention, not all of the embodiments. Based on the embodiments in the invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the invention.
[0017] In the description of the present invention, it is necessary to understand that the terms "opening", "upper", "lower", "top", "middle", "inside" and the like indicating orientation or positional relationship are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the components or elements referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as limiting the invention.
[0018] For example, see Figure 1-Figure 10 As shown, the present invention is a semiconductor heating plate, comprising a fixing structure, wherein the fixing structure comprises a mounting barrel 1, a fixed heating plate 101 and a plurality of fixing components 2, wherein the fixed heating plate 101 is arranged in the mounting barrel 1, the fixing components 2 are arranged above the fixed heating plate 101 and are distributed in a circumference, and a plurality of suction cup mounting openings are provided on the top surface of the fixed heating plate 101; The fixed component 2 includes a movable fixed arc block 201, a fixed electric push rod 202, a fixed suction cup 203 and a fixed air extraction pipe 204. The fixed electric push rod 202 is fixedly installed on the outer wall of the installation barrel 1. The movable fixed arc block 201 is arranged in the installation barrel 1. The output end of the fixed electric push rod 202 passes through the installation barrel 1 and is fixedly connected to the movable fixed arc block 201. The fixed suction cup 203 is arranged in the suction cup installation port. One end of the fixed air extraction pipe 204 is arranged on the outside of the installation barrel 1, and the other end passes through the installation barrel 1 and is fixedly connected to the bottom end of the fixed suction cup 203; The fixed electric push rod 202 can push the movable fixed arc block 201 to move toward the axis direction of the fixed heating plate 101, the movable fixed arc block 201 can push the semiconductor wafer to move and limit the position, and the fixed suction cup 203 can adsorb and fix the semiconductor wafer; A heating assembly 3 is arranged in the installation barrel 1, and the heating assembly 3 includes a heating support plate 301, an electric heating column 302, a lifting ring plate 303, a plurality of lifting cylinders 304 and a plurality of heating units 4. The heating support plate 301 is fixedly installed inside the installation barrel 1, the electric heating column 302 is fixedly installed on the top surface of the heating support plate 301, the lifting ring plate 303 is sleeved on the electric heating column 302, the lifting cylinder 304 is fixedly installed on the top surface of the heating support plate 301, and the output end of the lifting cylinder 304 is fixedly connected to the lifting ring plate 303; The heating unit 4 is distributed in a circle in the installation barrel 1. The heating unit 4 includes a plurality of heating plates 401, a plurality of electric heating rods 402, a plurality of conductive blocks 403, a heating installation plate 404, a lifting installation plate 405 and a plurality of supporting mechanisms 5. The heating installation plate 404 is fixedly installed on the inner wall of the installation barrel 1. The lifting installation plate 405 is arranged below the heating installation plate 404. The lifting installation plate 405 is fixedly connected to the lifting ring plate 303. The heating installation plate 404 and the lifting installation plate 405 are both provided with a plurality of heating rod installation grooves. The electric heating rod 402 passes through the heating rod installation groove and slides with the heating rod installation groove. The conductive block 403 is located above the heating installation plate 404. The conductive block 403 is fixedly connected to the electric heating rod 402. The heating plate 401 is fixedly installed on the top of the electric heating rod 402. The support mechanism 5 is arranged on the bottom surface of the lifting installation plate 405, and the support mechanism 5 includes a support baffle 501, a plurality of support installation blocks 502, a baffle gear 503, a spring spring 504, a rotating gear 505 and a rotating rod 506. The support installation blocks 502 are fixedly installed on the bottom surface of the lifting installation plate 405, the support baffle 501 is arranged between the support installation blocks 502, and is rotatably connected with the support installation blocks 502, the baffle gear 503 is arranged on one side of the support baffle 501, the baffle gear 503 connecting shaft passes through the support installation block 502 and is fixedly connected with the support baffle 501, the rotating gear 505 is arranged on one side of the support baffle 501, the rotating gear 505 connecting shaft is rotatably connected with the support installation block 502, and the rotating gear 505 is meshed with the baffle gear 503, the spring spring 504 is sleeved on the rotating gear 505 connecting shaft, the spring spring 504 is fixedly connected with the support installation block 502, and the rotating rod 506 is fixedly installed on the rotating gear 505 connecting shaft; The heating assembly 3 also includes a plurality of transmission units 6, which include a movable baffle rod 601, a transmission connection column 602, a movable arc plate 603, an arc plate support plate 604 and a movable connection rod 605. The arc plate support plate 604 is fixedly mounted on the top surface of the installation barrel 1, and the movable arc plate 603 is slidably mounted on the top surface of the arc plate support plate 604. A plurality of baffle rod mounting holes are provided on the barrel wall of the installation barrel 1. The movable baffle rod 601 passes through the baffle rod mounting hole and slidably cooperates with the baffle rod mounting hole. The bottom end of the transmission connection column 602 is fixedly connected to one end of the movable baffle rod 601 away from the installation barrel 1. The movable arc plate 603 is provided with a movable notch. The top end of the transmission connection column 602 passes through the movable notch. One end of the movable connection rod 605 is rotatably connected to the movable arc plate 603, and the other end is rotatably connected to the movable fixed arc block 201. When in use, the semiconductor wafer is placed on the top surface of the fixed heating plate 101, the fixed electric push rod 202 pushes the movable fixed arc block 201 to move towards the fixed heating plate 101, the movable fixed arc block 201 drives the semiconductor wafer to move, so that the axis of the semiconductor wafer coincides with the axis of the fixed heating plate 101, the fixed suction cup 203 adsorbs and fixes the semiconductor wafer, and the fixed heating plate 101 heats the semiconductor wafer; the electric heating column 302 is powered on to generate heat and conducts heat to the fixed heating plate 101; the lifting cylinder 304 pushes the lifting ring plate 303 to move upward ; The lifting ring plate 303 drives the lifting installation plate 405 to move upward, and the lifting installation plate 405 drives the electric heating rod 402 to move upward, so that the top surface of the heating plate 401 is flush with the top surface of the fixed heating plate 101, and the conductive blocks 403 contact each other. The electric heating rod 402 corresponding to the heating plate 401 whose top surface is flush with the top surface of the fixed heating plate 101 is energized and heats up, and conducts the heat to the heating plate 401. The top surface of the heating plate 401 and the top surface of the fixed heating plate 101 form a circular heating area with a smooth surface to heat the semiconductor wafer; the lifting ring plate 303 drives the lifting installation plate 4 05 moves upward, the lifting installation plate 405 drives the support baffle 501 to move, and the support baffle 501 drives the electric heating rod 402 to move upward. When the rotating rod 506 rotates, the rotating rod 506 rotates to drive the corresponding rotating gear 505 to rotate, and the rotating gear 505 drives the corresponding baffle gear 503 to rotate, and the baffle gear 503 rotates to drive the corresponding support baffle 501 to rotate, so that the top surface of the support baffle 501 is no longer in contact with the bottom end of the corresponding electric heating rod 402, and the electric heating rod 402 drives the corresponding heating plate 401 to move downward, and the top surface of the heating plate 401 is in contact with the fixed heating plate 1 01 The top surface forms a circular heating area with a smooth surface to heat the semiconductor wafer; the size of the heating area of the semiconductor wafer can be controlled, and semiconductor wafers of different diameters can be heated without replacing heating parts, thereby improving processing efficiency and equipment applicability; the movable fixed arc block 201 drives the movable arc plate 603 to move through the movable connecting rod 605, and the movable arc plate 603 moves through the transmission connecting column 602 to drive the movable blocking rod 601 to move, and the movable blocking rod 601 contacts the rotating rod 506 during the movement and pushes the rotating rod 506 to rotate.
[0019] Embodiment 2 is different from the above embodiment. Please refer to Figure 5 , Figure 6 The bottom end of the fixed air extraction pipe 204 is fixedly connected with an air extraction assembly pipe 205, and an air extraction pump 206 is arranged below the installation barrel 1, and the air extraction assembly pipe 205 is fixedly connected with the air extraction pump 206; When in use, the exhaust pipe assembly 205 is located below the support baffle 501, so that the fixed exhaust pipe 204 will not affect the lifting and lowering of the heating plate 401. The exhaust pump 206 works to extract the gas in the exhaust pipe assembly 205, so that the fixed suction cup 203 can adsorb and fix the semiconductor wafer.
[0020] Embodiment 3 is different from the above embodiment. Please refer to Figure 4 , a plurality of conductive rods 305 are arranged below the fixed heating plate 101, and the conductive rods 305 are fixedly connected to the electric heating column 302; When in use, when the top surface of the heating plate 401 is flush with the top surface of the fixed heating plate 101 , the conductive blocks 403 corresponding to the heating plate 401 contact each other, and the conductive block 403 closest to the conductive rod 305 contacts the conductive rod 305 through the conductive rod 305 and the conductive block 403 .
[0021] Embodiment 4 is different from the above embodiment. Please refer to Figure 6 , Figure 7 The heating plates 401 in the heating units 4 are arranged in sequence and contact each other, and the heating plates 401 of adjacent heating units 4 contact each other. When the top surfaces of the heating plates 401 are the same as the top surface of the fixed heating plate 101, a circular heating area with a smooth surface is formed; When in use, when the top surface of the heating sheet 401 is flush with the top surface of the fixed heating plate 101, the top surface of the heating sheet 401 and the top surface of the fixed heating plate 101 form a circular heating area with a flat surface, and the size of the heating area can be varied.
[0022] Embodiment 5 is different from the above embodiment. Please refer to Figure 6 The arc surface of the movable fixed arc block 201 in contact with the semiconductor wafer is fixedly installed with a heat-resistant rubber block; When in use, the movable fixed arc block 201 contacts the semiconductor wafer and pushes the semiconductor wafer to move, and the heat-resistant rubber block can play a buffering and protective role.
[0023] A method for fixing a semiconductor heating plate, using the semiconductor heating plate based on the fixing mechanism, comprises the following steps; Placing a semiconductor wafer on the top surface of the fixed heating plate 101; The lifting cylinder 304 pushes the lifting ring plate 303 to move upward, and the lifting ring plate 303 drives the lifting installation plate 405 to move upward. The lifting installation plate 405 drives the electric heating rod 402 to move upward through the support baffle 501, so that the top surface of the heating plate 401 is flush with the top surface of the fixed heating plate 101; The fixed electric push rod 202 pushes the movable fixed arc block 201 to move towards the fixed heating plate 101, and the movable fixed arc block 201 drives the semiconductor wafer to move, so that the axis of the semiconductor wafer coincides with the axis of the fixed heating plate 101, and the fixed suction cup 203 adsorbs and fixes the semiconductor wafer; The movement of the movable fixed arc block 201 drives the movable arc plate 603 to move, and the movable arc plate 603 drives the movable baffle rod 601 to move. During the movement of the movable baffle rod 601, it contacts the rotating rod 506 and pushes the rotating rod 506 to rotate. The rotation of the rotating rod 506 drives the rotating gear 505 to rotate, and the rotating gear 505 drives the baffle gear 503 to rotate. The rotation of the baffle gear 503 drives the supporting baffle plate 501 to rotate, so that the top surface of the supporting baffle plate 501 is no longer in contact with the bottom end of the electric heating rod 402, and the electric heating rod 402 drives the corresponding heating plate 401 to move downward. When the movable fixed arc block 201 stops moving, the electric heating column 302 is energized to generate heat and conduct the heat to the fixed heating plate 101, and the electric heating rod 402 corresponding to the heating plate 401 whose top surface is flush with the top surface of the fixed heating plate 101 is energized to generate heat, and conducts the heat to the heating plate 401. The top surface of the heating plate 401 and the top surface of the fixed heating plate 101 form a circular heating area with a smooth surface to heat the semiconductor wafer.
[0024] In the description of this specification, the description with reference to the terms "one embodiment", "example", "specific example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.
[0025] The preferred embodiments of the invention disclosed above are only used to help illustrate the invention. The preferred embodiments do not describe all the details in detail, nor do they limit the invention to the specific embodiments described. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the invention, so that those skilled in the art can better understand and use the invention. The invention is limited only by the claims and their full scope and equivalents.
Claims
1. A semiconductor heating plate, characterized in that: It comprises a fixed structure, which comprises a mounting barrel, a fixed heating plate and a plurality of fixed components, wherein the fixed heating plate is arranged in the mounting barrel, the fixed components are arranged above the fixed heating plate and are distributed in a circumference, and a plurality of suction cup mounting openings are opened on the top surface of the fixed heating plate; The fixed assembly includes a movable fixed arc block, a fixed electric push rod, a fixed suction cup and a fixed air extraction pipe, wherein the fixed electric push rod is fixedly mounted on the outer wall of the mounting barrel, the movable fixed arc block is arranged in the mounting barrel, the output end of the fixed electric push rod passes through the mounting barrel and is fixedly connected to the movable fixed arc block, the fixed suction cup is arranged in the suction cup mounting port, one end of the fixed air extraction pipe is arranged outside the mounting barrel, and the other end passes through the mounting barrel and is fixedly connected to the bottom end of the fixed suction cup; The fixed electric push rod can push the movable fixed arc block to move toward the axis direction of the fixed heating plate, the movable fixed arc block can push the semiconductor wafer to move and limit the position, and the fixed suction cup can adsorb and fix the semiconductor wafer; A heating assembly is arranged in the installation barrel, and the heating assembly includes a heating support plate, an electric heating column, a lifting ring plate, a plurality of lifting cylinders and a plurality of heating units. The heating support plate is fixedly installed inside the installation barrel, the electric heating column is fixedly installed on the top surface of the heating support plate, the lifting ring plate is sleeved on the electric heating column, the lifting cylinder is fixedly installed on the top surface of the heating support plate, and the output end of the lifting cylinder is fixedly connected to the lifting ring plate; The heating unit is distributed in a circumference in the installation barrel, and the heating unit includes a plurality of heating plates, a plurality of electric heating rods, a plurality of conductive blocks, a heating installation plate, a lifting installation plate and a plurality of supporting mechanisms. The heating installation plate is fixedly installed on the inner wall of the installation barrel, the lifting installation plate is arranged below the heating installation plate, the lifting installation plate is fixedly connected to the lifting ring plate, the heating installation plate and the lifting installation plate are both provided with a plurality of heating rod installation grooves, the electric heating rods penetrate the heating rod installation grooves and slide in cooperation with the heating rod installation grooves, the conductive blocks are located above the heating installation plate, the conductive blocks are fixedly connected to the electric heating rods, and the heating plates are fixedly installed on the top ends of the electric heating rods; The supporting mechanism is arranged on the bottom surface of the lifting mounting plate, and the supporting mechanism comprises a supporting baffle, a plurality of supporting mounting blocks, a baffle gear, a spring spring, a rotating gear and a rotating rod, the supporting mounting block is fixedly mounted on the bottom surface of the lifting mounting plate, the supporting baffle is arranged on one side of the electric heating rod, and the two sides of the supporting baffle are respectively rotatably connected with the supporting mounting block, the baffle gear is arranged on one side of the supporting baffle, the baffle gear connecting shaft passes through the supporting mounting block and is fixedly connected with the supporting baffle, the rotating gear is arranged on one side of the supporting baffle, the rotating gear connecting shaft is rotatably connected with the supporting mounting block, the rotating gear is meshed with the baffle gear, the spring spring is sleeved on the rotating gear connecting shaft, the spring spring is fixedly connected with the supporting mounting block, and the rotating rod is fixedly mounted on the rotating gear connecting shaft; The heating assembly also includes a plurality of transmission units, which include a movable baffle rod, a transmission connecting column, a movable arc plate, an arc plate support plate and a movable connecting rod. The arc plate support plate is fixedly mounted on the top surface of the mounting barrel, and the movable arc plate is slidably mounted on the top surface of the arc plate support plate. A plurality of baffle rod mounting holes are provided on the barrel wall of the mounting barrel, and the movable baffle rod passes through the baffle rod mounting holes and slidably cooperates with the baffle rod mounting holes. The bottom end of the transmission connecting column is fixedly connected to an end of the movable baffle rod away from the mounting barrel, the movable arc plate is provided with a movable slot, and the top end of the transmission connecting column passes through the movable slot. One end of the movable connecting rod is rotatably connected to the movable arc plate, and the other end is rotatably connected to the movable fixed arc block.
2. A semiconductor heating plate according to claim 1, characterized in that: The bottom end of the fixed air extraction pipe is fixedly connected with an air extraction assembly pipe, an air extraction pump is arranged below the mounting barrel, and the air extraction assembly pipe is fixedly connected with the air extraction pump.
3. A semiconductor heating plate according to claim 2, characterized in that: A plurality of conductive rods are arranged below the fixed heating plate, and the conductive rods are fixedly connected to the electric heating columns.
4. A semiconductor heating plate according to claim 3, characterized in that: The heating plates in the heating units are arranged in sequence and contact each other, and the heating plates of adjacent heating units contact each other. When the top surfaces of the heating plates are the same as the top surface of the fixed heating plate, a circular heating area with a smooth surface is formed.
5. A semiconductor heating plate according to claim 4, characterized in that: A heat-resistant rubber block is fixedly mounted on the arc surface of the movable fixed arc block that contacts the semiconductor wafer.
6. A method for fixing a semiconductor heating plate, characterized in that: Using a semiconductor heating plate as described in any one of claims 1 to 5, comprising the following steps; Placing a semiconductor wafer on the top surface of the fixed heating plate; The lifting cylinder pushes the lifting ring plate to move upward, the lifting ring plate drives the lifting mounting plate to move upward, and the lifting mounting plate drives the electric heating rod to move upward through the supporting baffle plate, so that the top surface of the heating plate is flush with the top surface of the fixed heating plate; The fixed electric push rod pushes the movable fixed arc block to move toward the fixed heating plate, and the movable fixed arc block drives the semiconductor wafer to move, so that the axis of the semiconductor wafer coincides with the axis of the fixed heating plate, and the fixed suction cup adsorbs and fixes the semiconductor wafer; The movement of the movable fixed arc block drives the movable arc plate to move, and the movable arc plate can drive the movable baffle rod to move. During the movement of the movable baffle rod, it contacts the rotating rod and pushes the rotating rod to rotate. The rotation of the rotating rod drives the rotating gear to rotate, and the rotating gear drives the baffle gear to rotate. The rotation of the baffle gear drives the supporting baffle plate to rotate, so that the top surface of the supporting baffle plate is no longer in contact with the bottom end of the electric heating rod, and the electric heating rod drives the corresponding heating plate to move downward. When the movable fixed arc block stops moving, the electric heating column is energized to generate heat and transfers heat to the fixed heating plate. The electric heating rod corresponding to the heating plate whose top surface is flush with the top surface of the fixed heating plate is energized to generate heat, and transfers heat to the heating plate. The top surface of the heating plate and the top surface of the fixed heating plate form a circular heating area with a smooth surface to heat the semiconductor wafer.