Film coating device of semiconductor laser and film coating method thereof

Abstract

The invention relates to the technical field of semiconductor laser coating, and provides a semiconductor laser coating device and method. The semiconductor laser coating device comprises a coating machine and a door; a door is installed at the front end of the coating machine, a control computer is fixed to one side of the coating machine, cooling fins are fixed to the rear end of the coating machine, and an evaporation assembly is installed at the bottom end in the coating machine. The fixed gear can drive the fluted disc to rotate during rotation, the rotating fluted disc can drive the rotating disc to rotate in the fixed frame, when the rotating disc rotates, the rotating disc can drive the gear rack at the bottom end of the rotating disc to move, and through cooperation between the gear rack and the rotating gear, when the gear rack rotationally moves to pass through the position of the rotating gear, the gear rack is driven to rotate, so that the gear rack is driven to rotate. When the substrate is coated with the film, the rotating gear is driven to rotate, so that the clamping frame is driven to automatically rotate through the fixing shaft, the substrate is automatically turned over, double-sided coating can be automatically performed on the substrate, manual turning is not needed, and the double-sided coating effect is better.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor laser coating, and in particular to a semiconductor laser coating device and a coating method thereof. Background Art

[0002] Semiconductor laser, also known as laser diode, is a laser that uses semiconductor material as working material. Semiconductor laser is a solid-state laser based on semiconductor gain medium. Its optical amplification is usually achieved by excitation emission of inter-band conversion under the condition of high carrier density in the conduction band. When coating the semiconductor laser substrate, it is generally necessary to coat both sides. Double-sided coating can achieve precise control of light reflection and transmission. By adjusting the material and thickness of the coating, the reflection and transmission ratio of light can be optimized, making the optical performance of the laser diode more superior.

[0003] A vacuum coating machine is used for coating. However, there are still some problems with conventional vacuum coating machines when coating semiconductor laser substrates. Conventional coating devices usually coat one side of the substrate, then manually adjust and turn it over, and then coat the other side, which makes double-sided coating more troublesome. Therefore, a semiconductor laser coating device and a coating method thereof are needed to solve the above problems. Summary of the invention

[0004] The object of the present invention is to provide a semiconductor laser coating device and a coating method thereof, so as to solve the defect that the existing coating device needs to coat the double sides of the semiconductor laser substrate, and then manually adjust and turn it over, and then coat the other side, which makes the coating process more troublesome.

[0005] In order to solve the above technical problems, the present invention provides the following technical solutions: a coating device for a semiconductor laser, comprising a coating machine and a door; a door is installed at the front end of the coating machine, a control computer is fixed on one side of the coating machine, a heat dissipation fin is fixed on the rear end of the coating machine, an evaporation component is installed at the bottom end inside the coating machine, a vacuum connector is arranged on one side of the top of the coating machine, an auxiliary component is arranged at the top of the coating machine, the auxiliary component comprises a motor, a mounting frame, an automatic flipping structure, a heat dissipation structure, a fixed gear and a fixed frame, the mounting frame is fixedly installed at the top of the coating machine, the motor is fixed by bolts on the top of the mounting frame, a fixed gear is installed at the bottom end of the motor output shaft, a heat dissipation structure is arranged at the rear end of the fixed gear, the fixed frame is fixed to the top end inside the coating machine, a clamping frame is arranged on the outside of the fixed frame, a clamping structure is arranged inside the clamping frame, a temperature sensor is installed at the bottom end of the fixed frame, and an automatic flipping structure is arranged inside the fixed frame.

[0006] Preferably, the automatic flipping structure includes a toothed disc, a rotating disc, a fixed shaft, a rotating gear and a rack, the toothed disc is installed at the top of the coating machine, the rotating disc is installed inside the fixed frame, the top of the rotating disc is fixed to the bottom end of the toothed disc, a rack is installed on one side of the bottom end of the rotating disc, the fixed shaft is arranged on the outside of the fixed frame, one end of the fixed shaft is fixed to one side of the clamping frame, and the other end of the fixed shaft is fixed to the rotating gear.

[0007] Preferably, a plurality of the fixed shafts are provided, and the plurality of the fixed shafts are distributed in a ring shape on the outer side of the fixing frame.

[0008] Preferably, a plurality of teeth are arranged on the outer side of the rotating gear, and the rotating gear is meshed with the tooth bar.

[0009] Preferably, the heat dissipation structure includes a belt pulley, a fixed block and a fan, the fixed block is fixed to the top of the rear end of the coating machine, the fan is installed at the bottom end of the fixed block, and the belt pulley is fixed to the top end of the fixed block, and the belt pulley is connected to the output end of the motor through a belt.

[0010] Preferably, the clamping structure includes a handle, a fixing bolt, a screw sleeve, a bidirectional screw, a clamping plate and a connecting plate, the bidirectional screw is installed inside one side of the clamping frame, a screw sleeve is provided on the outside of the bidirectional screw, a clamping plate is fixed to one side of the screw sleeve, a handle is fixed to one end of the bidirectional screw, the connecting plate is fixed to one side of the front end of the clamping frame, and a fixing bolt is provided inside the connecting plate.

[0011] Preferably, the screw sleeve is sleeved on the outside of the bidirectional screw, and a threaded connection is formed between the screw sleeve and the bidirectional screw.

[0012] Preferably, two groups of the clamping plates are provided, and the two groups of the clamping plates are symmetrically distributed inside the clamping frame.

[0013] Preferably, a plurality of the heat dissipation fins are provided, and the plurality of heat dissipation fins are arranged at equal intervals at the rear end of the coating machine.

[0014] Preferably, the method comprises the following steps:

[0015] S1. Before coating the semiconductor laser substrate, place the substrate inside the clamping frame, hold the handle after placing it, and as the handle rotates, the bidirectional screw is driven to rotate. The rotating bidirectional screw cooperates with the screw sleeve, thereby driving the two sets of clamping plates to move to the middle position to clamp the substrate. After clamping, the fixing bolt passes through the connecting plate and rotates into the inside of the handle to fix the handle and prevent it from loosening, thereby completing the clamping of the substrate, so that the substrate is not easy to fall off during rotation, thereby completing the clamping work;

[0016] S2. After the substrate is clamped, place the evaporated coating material inside the evaporation assembly, close the door after placing it, and then connect the vacuum connector to an external vacuum pump to perform a vacuum treatment on the inside of the coating machine;

[0017] S3. After the vacuum extraction is completed, the evaporation component is started to heat, so as to heat and evaporate the coating material. The evaporated coating material is accelerated to fly toward the substrate under the action of the electric field, so that the coating material is deposited on the substrate to form a thin film, thereby completing the coating work;

[0018] S4. During the coating process, an external power source starts the motor, and after the motor is started, it drives the fixed gear to rotate. When the fixed gear rotates, it drives the toothed disc to rotate. The rotating toothed disc drives the rotating disc to rotate inside the fixed frame. When the rotating disc rotates, it drives the toothed bar at its bottom to move. When the toothed bar rotates and moves past the position of the rotating gear, it drives the rotating gear to rotate. The rotating rotating gear drives the clamping frame to rotate automatically through the fixed shaft, so that the substrate is automatically flipped, so that when the substrate is coated, the substrate can be automatically coated on both sides without manual flipping, so that the effect of double-sided coating of the substrate is better, and finally the coating work of the semiconductor laser substrate is completed;

[0019] S5. When the motor starts, it will drive the belt pulley to rotate through the belt on the connecting shaft, and the rotating belt pulley will drive the fan to rotate. The rotating fan will drive the air to flow, so that the air quickly passes through the surface of the heat sink fins, making the heat sink fins dissipate heat more quickly, thereby completing the rapid heat dissipation work.

[0020] The present invention provides a semiconductor laser coating device and a coating method thereof, which have the advantages of:

[0021] When the fixed gear rotates, it drives the toothed disc to rotate, and the rotating toothed disc drives the rotating disc to rotate inside the fixed frame. When the rotating disc rotates, it drives the toothed bar at its bottom to move. Through the cooperation between the toothed bar and the rotating gear, when the toothed bar rotates and moves past the position of the rotating gear, it drives the rotating gear to rotate, thereby driving the clamping frame to rotate automatically through the fixed shaft, so that the substrate is automatically turned over, so that when the substrate is coated, the substrate can be automatically coated on both sides without manual turning, so that the double-sided coating effect is better;

[0022] When the screw sleeve and the bidirectional screw are used in cooperation, the two sets of clamping plates can be driven to move to the middle position, so as to clamp the substrate so that the substrate will not fall off when flipped, thereby completing the clamping work. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a schematic diagram of the front view three-dimensional structure of the present invention;

[0024] Figure 2 It is a schematic diagram of the three-dimensional structure of the present invention when viewed from above;

[0025] Figure 3 It is a schematic diagram of the front cross-sectional three-dimensional structure of the present invention;

[0026] Figure 4 It is a schematic diagram of the three-dimensional structure of the automatic flipping structure of the present invention in front view and section;

[0027] Figure 5 It is a schematic diagram of the three-dimensional structure of the automatic flipping structure of the present invention when viewed from above;

[0028] Figure 6 For the present invention Figure 5 A partial enlarged schematic diagram of the three-dimensional structure in the middle;

[0029] Figure 7 It is a schematic diagram of a three-dimensional structure of a partial cross section of the clamping structure of the present invention;

[0030] Figure 8 It is a schematic diagram of a three-dimensional structure of the clamping structure of the present invention from a side view;

[0031] Fig. 9 It is a schematic diagram of a partial three-dimensional structure of the clamping structure of the present invention in a front view.

[0032] Explanation of the reference numerals in the figure: 1. Coating machine; 2. Door; 3. Auxiliary component; 31. Motor; 32. Mounting frame; 33. Automatic flipping structure; 331. Toothed disc; 332. Rotating disc; 333. Fixed shaft; 334. Rotating gear; 335. Toothed bar; 34. Heat dissipation structure; 341. Belt pulley; 342. Fixed block; 343. Fan; 35. Fixed gear; 36. Fixed frame; 4. Vacuum connector; 5. Control computer; 6. Heat dissipation fins; 7. Evaporation component; 8. Clamping frame; 9. Clamping structure; 91. Handle; 92. Fixing bolt; 93. Screw sleeve; 94. Bidirectional screw; 95. Clamping plate; 96. Connecting plate; 10. Temperature sensor. DETAILED DESCRIPTION

[0033] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0034] See also Figure 1-Figure 9 The present invention provides a semiconductor laser coating device, comprising a coating machine 1 and a door 2; the front end of the coating machine 1 is equipped with the door 2, one side of the coating machine 1 is fixed with a control computer 5, the rear end of the coating machine 1 is fixed with a heat dissipation fin 6, the bottom end of the coating machine 1 is equipped with an evaporation component 7, one side of the top of the coating machine 1 is provided with a vacuum connector 4, the top of the coating machine 1 is provided with an auxiliary component 3, the auxiliary component 3 includes a motor 31, a mounting frame 32, an automatic flip structure 33, a heat dissipation structure 34, and a fixed gear 35. And a fixing frame 36, the mounting frame 32 is fixedly installed on the top of the coating machine 1, the motor 31 is fixed by bolts on the top of the mounting frame 32, a fixed gear 35 is installed on the bottom end of the output shaft of the motor 31, a heat dissipation structure 34 is arranged at the rear end of the fixed gear 35, the fixing frame 36 is fixed to the top inside the coating machine 1, a clamping frame 8 is arranged on the outside of the fixing frame 36, a clamping structure 9 is arranged inside the clamping frame 8, a temperature sensor 10 is installed on the bottom end of the fixing frame 36, and an automatic flipping structure 33 is arranged inside the fixing frame 36.

[0035] Reference Figure 1 and Fig. 9As shown: the clamping structure 9 includes a handle 91, a fixing bolt 92, a screw sleeve 93, a bidirectional screw 94, a clamping plate 95 and a connecting plate 96. The bidirectional screw 94 is installed inside one side of the clamping frame 8. The outer side of the bidirectional screw 94 is provided with a screw sleeve 93. A clamping plate 95 is fixed to one side of the screw sleeve 93. One end of the bidirectional screw 94 is fixed with a handle 91. The connecting plate 96 is fixed to one side of the front end of the clamping frame 8. The interior of the connecting plate 96 is provided with a fixing bolt 92. The screw sleeve 93 is sleeved on the outer side of the bidirectional screw 94. A threaded connection is formed between the screw sleeve 93 and the bidirectional screw 94. Two groups of clamping plates 95 are provided. The two groups of clamping plates 95 are symmetrically distributed inside the clamping frame 8. A plurality of heat dissipation fins 6 are provided. The plurality of heat dissipation fins 6 are arranged at equal intervals at the rear end of the coating machine 1.

[0036] Specifically, in this embodiment, before coating the semiconductor laser substrate, the substrate is placed inside the clamping frame 8. After placing it, hold the handle 91. As the handle 91 rotates, the bidirectional screw 94 is driven to rotate. The rotating bidirectional screw 94 cooperates with the screw sleeve 93 to drive the two sets of clamping plates 95 to move to the middle position to clamp the substrate. After clamping, the fixing bolt 92 passes through the connecting plate 96 and rotates into the handle 91 to fix the handle 91 and prevent it from loosening, thereby completing the clamping of the substrate and preventing it from falling off during rotation.

[0037] Reference Figure 1 and Fig. 9 As shown: the automatic flip structure 33 includes a toothed disc 331, a rotating disc 332, a fixed shaft 333, a rotating gear 334 and a toothed bar 335. The toothed disc 331 is installed at the top of the coating machine 1, and the rotating disc 332 is installed inside the fixed frame 36. The top of the rotating disc 332 is fixed to the bottom of the toothed disc 331. A toothed bar 335 is installed on one side of the bottom of the rotating disc 332. The fixed shaft 333 is arranged on the outside of the fixed frame 36. One end of the fixed shaft 333 is fixed to one side of the clamping frame 8. The other end of the fixed shaft 333 is fixed with a rotating gear 334. A plurality of fixed shafts 333 are provided, and the plurality of fixed shafts 333 are distributed in a ring shape on the outer side of the fixed frame 36. A plurality of teeth are provided on the outer side of the rotating gear 334, and the rotating gear 334 is meshed with the tooth bar 335. The heat dissipation structure 34 includes a pulley 341, a fixed block 342 and a fan 343. The fixed block 342 is fixed to the top of the rear end of the coating machine 1, and the fan 343 is installed at the bottom end of the fixed block 342. A pulley 341 is fixed to the top end of the fixed block 342, and the pulley 341 is connected to the output end of the motor 31 through a belt.

[0038] Specifically, in the present embodiment, after the substrate is clamped, the evaporated coating material is placed inside the evaporation component 7, and after that, the door 2 is closed, and then the external vacuum pump of the vacuum connector 4 is used to perform a vacuum treatment on the inside of the coating machine 1. After the vacuum extraction is completed, the evaporation component 7 is started for heating, so as to heat and evaporate the coating material. The evaporated coating material is accelerated to fly toward the substrate under the action of the electric field, so that the coating material is deposited on the substrate to form a thin film, thereby completing the coating work. During the coating process, the external power supply starts the motor 31, and the motor 31 will drive the fixed gear 35 to rotate after starting, and the fixed gear 35 will drive the fixed gear 35 to rotate when rotating. The toothed disc 331 rotates, and the rotating toothed disc 331 drives the rotating disc 332 to rotate inside the fixed frame 36. When the rotating disc 332 rotates, it drives the toothed bar 335 at its bottom end to move. When the toothed bar 335 rotates and moves past the position of the rotating gear 334, it drives the rotating gear 334 to rotate. The rotating rotating gear 334 drives the clamping frame 8 to rotate automatically through the fixed shaft 333, so that the substrate is automatically flipped over, so that when the substrate is coated, the substrate can be automatically coated on both sides without manual flipping, so that the effect of double-sided coating of the substrate is better, and finally the coating work of the semiconductor laser substrate is completed.

[0039] When the motor 31 is started, it will drive the belt pulley 341 to rotate through the belt on the connecting shaft. The rotating belt pulley 341 will drive the fan 343 to rotate. The rotating fan 343 will drive the air to flow, so that the air quickly passes through the surface of the heat sink fins 6, making the heat sink fins 6 dissipate heat more quickly, thereby completing the rapid heat dissipation work.

[0040] Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments, or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A semiconductor laser coating device, comprising a coating machine (1) and a door (2); Features: The coating machine (1) is provided with a door (2) at the front end, a control computer (5) is fixed on one side of the coating machine (1), a heat dissipation fin (6) is fixed on the rear end of the coating machine (1), an evaporation component (7) is installed at the bottom end of the coating machine (1), a vacuum connector (4) is provided on one side of the top of the coating machine (1), and an auxiliary component (3) is provided at the top of the coating machine (1), wherein the auxiliary component (3) comprises a motor (31), a mounting frame (32), an automatic flipping structure (33), a heat dissipation structure (34), a fixed gear (35) and a fixed frame (36), wherein the mounting frame (32) is fixed The fixing frame (36) is fixed to the top of the coating machine (1), the top of the fixing frame (32) is bolted with a motor (31), the bottom end of the output shaft of the motor (31) is installed with a fixed gear (35), the rear end of the fixed gear (35) is provided with a heat dissipation structure (34), the fixing frame (36) is fixed to the top of the coating machine (1), the outer side of the fixing frame (36) is provided with a clamping frame (8), the inside of the clamping frame (8) is provided with a clamping structure (9), the bottom end of the fixing frame (36) is installed with a temperature sensor (10), and the inside of the fixing frame (36) is provided with an automatic flipping structure (33).

2. The semiconductor laser coating device according to claim 1, characterized in that: The automatic flipping structure (33) includes a toothed disc (331), a rotating disc (332), a fixed shaft (333), a rotating gear (334) and a toothed bar (335), wherein the toothed disc (331) is installed at the top of the coating machine (1), the rotating disc (332) is installed inside the fixed frame (36), the top of the rotating disc (332) is fixed to the bottom of the toothed disc (331), a toothed bar (335) is installed on one side of the bottom of the rotating disc (332), the fixed shaft (333) is arranged on the outside of the fixed frame (36), one end of the fixed shaft (333) is fixed to one side of the clamping frame (8), and the other end of the fixed shaft (333) is fixed to the rotating gear (334).

3. The semiconductor laser coating device according to claim 2, characterized in that: A plurality of the fixed shafts (333) are provided, and the plurality of the fixed shafts (333) are distributed in a ring shape on the outer side of the fixed frame (36).

4. The semiconductor laser coating device according to claim 2, characterized in that: A plurality of teeth are arranged on the outer side of the rotating gear (334), and the rotating gear (334) is meshed with the tooth bar (335).

5. The semiconductor laser coating device according to claim 1, characterized in that: The heat dissipation structure (34) comprises a belt pulley (341), a fixed block (342) and a fan (343); the fixed block (342) is fixed to the top of the rear end of the coating machine (1); the fan (343) is installed at the bottom end of the fixed block (342); the belt pulley (341) is fixed to the top end of the fixed block (342); and the belt pulley (341) is connected to the output end of the motor (31) via a belt.

6. The semiconductor laser coating device according to claim 1, characterized in that: The clamping structure (9) comprises a handle (91), a fixing bolt (92), a screw sleeve (93), a bidirectional screw (94), a clamping plate (95) and a connecting plate (96); the bidirectional screw (94) is installed inside one side of a clamping frame (8); a screw sleeve (93) is arranged on the outer side of the bidirectional screw (94); a clamping plate (95) is fixed to one side of the screw sleeve (93); a handle (91) is fixed to one end of the bidirectional screw (94); the connecting plate (96) is fixed to one side of the front end of the clamping frame (8); and a fixing bolt (92) is arranged inside the connecting plate (96).

7. The semiconductor laser coating device according to claim 6, characterized in that: The screw sleeve (93) is sleeved on the outer side of the bidirectional screw rod (94), and a threaded connection is formed between the screw sleeve (93) and the bidirectional screw rod (94).

8. The semiconductor laser coating device according to claim 6, characterized in that: The clamping plates (95) are provided in two groups, and the two groups of clamping plates (95) are symmetrically distributed inside the clamping frame (8).

9. The semiconductor laser coating device according to claim 1, characterized in that: A plurality of the heat dissipation fins (6) are provided, and the plurality of the heat dissipation fins (6) are arranged at equal intervals at the rear end of the coating machine (1).

10. A film coating method using the film coating device of a semiconductor laser as claimed in claim 6, comprising the following steps characterized in that: S1. Before coating the semiconductor laser substrate, place the substrate inside the clamping frame (8), hold the handle (91) after placing it, and as the handle (91) rotates, the bidirectional screw (94) is driven to rotate. The rotating bidirectional screw (94) cooperates with the screw sleeve (93) to drive the two sets of clamping plates (95) to move to the middle position to clamp the substrate. After clamping, the fixing bolt (92) passes through the connecting plate (96) and rotates into the handle (91) to fix the handle (91) and prevent it from loosening, thereby completing the clamping of the substrate, so that the substrate is not easy to fall off during rotation, thereby completing the clamping work; S2. After the substrate is clamped, the evaporated coating material is placed inside the evaporation assembly (7). After placing it, the door (2) is closed, and then the vacuum pump connected to the vacuum connector (4) is used to perform a vacuum treatment on the inside of the coating machine (1); S3. After the vacuum extraction is completed, the evaporation component (7) is started to heat, so as to heat and evaporate the coating material. The evaporated coating material is accelerated to fly toward the substrate under the action of the electric field, so that the coating material is deposited on the substrate to form a thin film, thereby completing the coating work; S4. During the coating process, the motor (31) is started by an external power supply. After the motor (31) is started, it drives the fixed gear (35) to rotate. When the fixed gear (35) rotates, it drives the toothed disc (331) to rotate. The rotating toothed disc (331) drives the rotating disc (332) to rotate inside the fixed frame (36). When the rotating disc (332) rotates, it drives the toothed bar (335) at its bottom to move. When the toothed bar (335) rotates and moves past the position of the rotating gear (334), it drives the rotating gear (334) to rotate. The rotating rotating gear (334) drives the clamping frame (8) to rotate automatically through the fixed shaft (333), so that the substrate is automatically turned over. When the substrate is coated, the substrate can be automatically coated on both sides without manual flipping, so that the effect of coating the substrate on both sides is better, and finally the coating work of the semiconductor laser substrate is completed; S5. When the motor (31) is started, the belt on the connecting shaft drives the belt pulley (341) to rotate, and the rotating belt pulley (341) drives the fan (343) to rotate. The rotating fan (343) drives the air to flow, so that the air quickly passes through the surface of the heat dissipation fins (6), so that the heat dissipation fins (6) are faster, thereby completing the rapid heat dissipation work.

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