Hard disk backboard and server

Abstract

The invention provides a hard disk backboard and a server, the hard disk backboard is provided with a plurality of first connectors and a plurality of second connectors, and the hard disk backboard can be switched between a first working mode and a second working mode; in the first working mode, each first connector and each second connector are respectively used for electrically connecting different hard disks, and each hard disk is in communication connection with the mainboard through the first connector or the second connector; in the second working mode, the at least two first connectors are connected with the RAID chip in a matched mode, the other first connectors or the second connectors are used for being electrically connected with different hard disks respectively, the RAID chip is in communication connection with the corresponding hard disk through the corresponding first connector, and the RAID chip is in communication connection with the mainboard through the first connector. According to the hard disk backboard and the server, the expandability and flexibility of the system are improved, efficient management and configuration of the hard disk are achieved, and the effects of fault isolation, hard disk redundancy and stable performance are achieved.

Description

Technical Field

[0001] The present invention relates to the technical field of server equipment, and in particular to a hard disk backplane and a server. Background Art

[0002] With the rapid development of data centers and cloud computing technologies, server systems have increasing requirements for data storage capacity, speed, and reliability. In this context, RAID (Redundant Array of Independent Disks) technology has become a key component of server storage solutions because of its dual advantages of providing data redundancy and performance improvement.

[0003] At present, traditional RAID chips are usually deployed at the back of the server chassis, connected to the motherboard through the PCIe interface or OCP interface, and then connected to the hard disk backplane through a long-distance cable. This design not only increases the complexity and failure points of the system, but also limits the optimal use of the internal space of the server. The method of directly setting the RAID chip on the hard disk backplane is limited to fixed interfaces and configuration options, which is difficult to meet the rapidly changing market needs. At present, there is a lack of mature hard disk backplane design solutions that support multiple working modes on the market. Summary of the invention

[0004] The present invention provides a hard disk backplane and a server to provide a hard disk backplane design solution supporting multiple working modes, thereby solving the problem that the mode of directly setting a RAID chip on the hard disk backplane is limited to fixed interfaces and configuration options and is difficult to meet the rapidly changing market demands.

[0005] In a first aspect, the present invention provides a hard disk backplane, wherein the hard disk backplane is provided with a plurality of first connectors and a plurality of second connectors, and the hard disk backplane can be switched between a first working mode and a second working mode; In the first working mode, each of the first connectors and each of the second connectors are respectively used to electrically connect different hard disks, and each of the hard disks is communicatively connected to the mainboard via the first connector or the second connector; In the second working mode, at least two of the first connectors cooperate to connect to the RAID chip, and the other first connectors or the second connectors are respectively used to electrically connect different hard disks. The RAID chip is communicated with the corresponding hard disks through the corresponding first connectors, and the RAID chip is communicated with the mainboard through the first connector. The RAID chip is configured to configure and manage each hard disk according to the hard disk information of each hard disk read.

[0006] According to a hard disk backplane provided by the present invention, the first connector is provided with a first interface, and the second connector is provided with a second interface; In the first working mode, the first interface and the second interface are both used to connect to the hard disk; In the second working mode, two of the first interfaces are commonly connected to the RAID chip, and the other first interfaces and all of the second interfaces are respectively used to electrically connect to different hard disks.

[0007] According to a hard disk backplane provided by the present invention, the first interface is provided with a first pin and a second pin, and the second interface is provided with a second pin; In the first working mode, the second pin in the first interface and the second pin in the second interface are both used to connect the hard disk; In the second working mode, the first pin and the second pin in two of the first interfaces are used to connect the RAID chip, and the second pin in the other first interface and the second pin in the second interface are used to connect the hard disk.

[0008] According to a hard disk backplane provided by the present invention, the RAID chip is used to obtain the hard disk information of the multiple hard disks connected to the hard disk backplane in the second working mode, receive the instruction to enable the RAID function, select a target hard disk from the multiple hard disks according to a preset RAID level and the hard disk information of the multiple hard disks, and establish an independent hard disk redundant array for the target hard disk.

[0009] According to a hard disk backplane provided by the present invention, a mainboard connector is disposed on the hard disk backplane, the mainboard connector is connected to the mainboard, and the RAID chip is electrically connected to the mainboard connector through the first connector and the second connector at the same time.

[0010] According to a hard disk backplane provided by the present invention, the hard disk backplane is provided with a plurality of backplanes, each of the backplanes is provided with the first connector and a plurality of the second connectors, and each of the backplanes of the hard disk backplane can switch between the first working mode and the second working mode; When any of the backplanes is in the first working mode, the first connector and each of the second connectors in each of the backplanes are respectively used to electrically connect different hard disks; When any of the backplanes is in the second working mode, at least two of the first connectors in the backplane cooperate to connect to the RAID chip, and the other first connectors or the second connectors in the backplane are respectively used to electrically connect different hard disks. The RAID chip in the backplane is communicated with the corresponding hard disks through the corresponding first connectors, and the RAID chip in the backplane is communicated with the mainboard through the corresponding first connectors. The RAID chip is configured to configure and manage each hard disk in the backplane according to the hard disk information of each hard disk in the backplane read.

[0011] According to a hard disk backplane provided by the present invention, a plurality of the first connectors and a plurality of the second connectors are arranged in an array.

[0012] According to a hard disk backplane provided by the present invention, the hard disk backplane further includes: A switching circuit is configured to control the hard disk backplane to switch between the first working mode and the second working mode.

[0013] According to a hard disk backplane provided by the present invention, the hard disk backplane further includes: A switch, electrically connected to the switching circuit, integrated on the hard disk backplane, and configured to receive user input or system instructions to trigger the switching of the working mode; An indicator light is electrically connected to the switching circuit and is used to display the working mode status of the hard disk backplane.

[0014] In a second aspect, the present invention provides a server, comprising: Hard disk backplane; A RAID chip and a main board, wherein the RAID chip is communicatively connected to the main board via the first connector.

[0015] The hard disk backplane and server provided by the present invention can flexibly switch between a first working mode (direct communication mode) and a second working mode (RAID chip management mode). In the first working mode, the first connector and multiple second connectors on the hard disk backplane are directly connected to the hard disk to achieve direct communication between the hard disk and the mainboard. In the second working mode, the two first connectors cooperate to jointly connect the RAID chip, and the RAID chip communicates with the mainboard through the hard disk and the first connector connected to it, so as to achieve efficient management and configuration of the hard disk, isolate the hard disk and the mainboard, and play a role in fault isolation, hard disk redundancy and performance stability. The design on the hard disk backplane allows the user to flexibly insert the RAID chip or hard disk on the backplane according to actual needs, without having to consider complex issues such as cable connection. This plug-and-play design greatly improves the scalability and flexibility of the system and meets the storage needs in different application scenarios.

[0016] At the same time, by integrating the connection function of the RAID chip on the hard disk backplane, the slot space and position occupied by the traditional RAID chip are significantly saved. At the same time, the connection function of the RAID chip is integrated into the hard disk backplane, which reduces the use of external RAID chips and improves the heat dissipation environment of the RAID chip. For RAID chips with increasing performance and power consumption, this design helps to optimize the heat dissipation design, ensure that the RAID chip maintains a stable temperature while operating efficiently, and prolongs its service life. The multiple cables between the traditional RAID chip and the hard disk backplane are removed, avoiding signal attenuation and link problems caused by long cables or improper layout. This improvement not only ensures the quality of signal transmission, but also reduces the cost caused by the use of a large number of cables. In addition, the simpler cable layout helps to optimize the internal ventilation duct and improve the overall heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the present invention or the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0018] Figure 1 is a schematic diagram of a hard disk backplane in a first working mode according to an embodiment of the present invention.

[0019] Figure 2 is a schematic diagram of a hard disk backplane in a second working mode according to an embodiment of the present invention.

[0020] Figure 3 This is one of the structural schematic diagrams of a hard disk backplane according to an embodiment of the present invention.

[0021] Figure 4 is a schematic diagram of inserting a RAID chip into a hard disk backplane according to an embodiment of the present invention; Figure 5 is a schematic diagram of inserting a RAID chip into a hard disk backplane according to another embodiment of the present invention; Figure 6 It is a schematic diagram of the structure of inserting a RAID chip into a hard disk backplane according to an embodiment of the present invention.

[0022] Figure 7 This is the second structural schematic diagram of a hard disk backplane according to an embodiment of the present invention.

[0023] Figure 8 This is the third structural schematic diagram of a hard disk backplane according to an embodiment of the present invention.

[0024] Reference numerals: 100, first connector; 110, first interface; 200, second connector; 210, second interface; 300, hard disk; 400, mainboard; 500, RAID chip; 600, backplane. DETAILED DESCRIPTION

[0025] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the drawings of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0026] In the existing server hard disk backplane design, the RAID chip is generally located at the rear of the hard disk backplane, and the heat dissipation environment is relatively poor. After the wind passes through the front hard disk and the motherboard, the temperature is relatively high, which has a certain impact on the high-power RAID chip. The RAID chip is connected to the backplane via a cable. For some models with more complex designs, the cable length may exceed 1800mm, which will cause the signal quality to deteriorate and there is a risk of link abnormalities. In addition, the wiring is complicated, and there may be cable bends that cause link abnormalities. In addition, the scalability of this hard disk backplane is not high, and the modification of the cable is required.

[0027] To solve the above problems, in one embodiment of the present invention, Figures 1 to 3 As shown, a hard disk backplane is provided, and a plurality of first connectors 100 and a plurality of second connectors 200 are provided on the hard disk backplane, and the hard disk backplane can switch between a first working mode and a second working mode. In the first working mode, each first connector 100 and each second connector 200 are respectively used to electrically connect different hard disks 300, and each hard disk 300 is connected to the mainboard 400 through the first connector 100 or the second connector 200. In the second working mode, at least two first connectors 100 are used to connect the RAID chip 500 together, and the other first connectors 100 and the second connector 200 are respectively used to electrically connect different hard disks 300, and the RAID chip 500 is connected to the corresponding hard disk 300 through the corresponding first connector 100, and the RAID chip 500 is connected to the mainboard 400 through the first connector 100. The RAID chip 500 is configured to configure and manage each hard disk 300 according to the hard disk 300 information read from each hard disk 300, so as to isolate the hard disk 300 and the mainboard 400, and play the role of fault isolation, hard disk 300 redundancy and stable performance.

[0028] Specifically, if Figure 1 As shown, when the hard disk backplane is switched to the first working mode, in this mode, all the first connectors 100 and all the second connectors 200 on the hard disk backplane are independently used to connect different hard disks 300. Each hard disk 300 communicates directly with the mainboard 400 through its corresponding connector (first connector 100 or second connector 200) to achieve data reading and writing and status feedback. This mode is suitable for application scenarios that do not require complex data redundancy or advanced fault isolation functions, such as a single hard disk 300 storage system or a simple data backup system.

[0029] When the hard disk backplane switches to the second working mode, Figure 2 As shown, in this mode, the working mode of the hard disk backplane changes significantly. The first connector 100 is no longer directly connected to the hard disk 300, but is connected to the RAID chip 500. The RAID chip 500 is a device specifically used for data redundancy and fault recovery, which can manage multiple hard disks 300 to improve data security. At least two first connectors 100 are connected to the RAID chip 500, so that the RAID chip 500 can directly communicate with some hard disks 300 and manage the data reading and writing and fault detection of these hard disks 300. The remaining first connectors 100 and second connectors 200 continue to be used to connect other hard disks 300, but the data processing and management of these hard disks 300 are all performed through the RAID chip 500. The RAID chip 500 communicates with the mainboard 400 through the first connector 100, and is responsible for reporting the status and data of all connected hard disks 300 to the mainboard 400, and also receives instructions from the mainboard 400. The use of the RAID chip 500 can isolate the faulty hard disk 300 to prevent it from affecting the operation of the entire storage system, thereby improving the stability and reliability of the system. The RAID chip 500 can realize redundant storage of data, and even if some hard disks 300 are damaged, the integrity and accessibility of the data can be guaranteed. The RAID chip 500 can optimize data read and write operations and improve the overall performance of the storage system, especially when processing a large number of concurrent read and write requests. This mode is particularly suitable for application scenarios that require high data security, fault isolation and redundant storage, such as servers, data centers, etc.

[0030] The hard disk backplane provided by the embodiment of the present invention can be flexibly switched between the first working mode (direct communication mode) and the second working mode (RAID chip 500 management mode). In the first working mode, the first connector 100 and the plurality of second connectors 200 on the hard disk backplane are directly connected to the hard disk 300 to realize direct communication between the hard disk 300 and the main board 400. In the second working mode, the two first connectors 100 cooperate to connect the RAID chip 500 together, and the RAID chip 500 communicates with the main board 400 through the hard disk 300 and the first connector 100 connected thereto, so as to realize efficient management and configuration of the hard disk 300, isolate the hard disk 300 and the main board 400, and play the role of fault isolation, hard disk 300 redundancy and stable performance. The design of the hard disk backplane allows the user to flexibly insert the RAID chip 500 or the hard disk 300 on the backplane according to actual needs, without having to consider additional complex issues such as cable connection. This plug-and-play design greatly improves the scalability and flexibility of the system and meets the storage requirements in different application scenarios.

[0031] At the same time, by integrating the connection function of the RAID chip 500 on the hard disk backplane, the slot space and position occupied by the traditional RAID chip 500 are significantly saved. At the same time, the connection function of the RAID chip 500 is integrated into the hard disk backplane, which reduces the use of external RAID chips 500, thereby improving the heat dissipation environment of the RAID chip 500. For RAID chips 500 with increasingly higher performance and power consumption, this design helps to optimize the heat dissipation design, ensure that the RAID chip 500 maintains a stable temperature while operating efficiently, and prolongs its service life. Multiple cables between the traditional RAID chip 500 and the hard disk backplane are removed, avoiding signal attenuation and link problems caused by long cables or improper layout. This improvement not only ensures the quality of signal transmission, but also reduces the cost caused by the use of a large number of cables. In addition, a simpler cable layout helps to optimize the internal ventilation duct and improve the overall heat dissipation effect.

[0032] It should be noted that, as required, one or more RAID chips 500 may be provided on a hard disk backplane. Accordingly, more first connectors 100 need to be provided. For example, if the system has high requirements for performance, more RAID chips 500 may need to be provided to share processing tasks, thereby improving overall performance. Providing multiple RAID chips 500 may help to achieve a more complex RAID configuration, thereby providing higher data security.

[0033] In some embodiments, Figure 4 and Figure 5As shown, the first connector 100 is provided with a first interface 110, and the second connector 200 is provided with a second interface 210. When the hard disk backplane is in the first working mode, each first interface 110 and each second interface 210 are used to connect a hard disk 300. When the hard disk backplane is in the second working mode, two first interfaces 110 are connected to the RAID chip 500, and the other first interfaces 110 and all second interfaces 210 are respectively used to electrically connect different hard disks 300.

[0034] Specifically, when the hard disk backplane is in the first working mode, the first interface 110 of each first connector 100 and the second interface 210 of each second connector 200 are directly connected to the hard disk 300. Each interface is responsible for data transmission and power supply (if supported by the interface) to the corresponding hard disk 300. This mode is suitable for scenarios where the number and storage capacity of hard disks 300 need to be maximized.

[0035] When the hard disk backplane is in the second working mode, the two first interfaces 110 are connected to the RAID chip 500 together. The other first interfaces 110 and all the second interfaces 210 are respectively used to electrically connect different hard disks 300. The RAID chip 500 is responsible for combining multiple hard disks 300 into a logical unit, providing data redundancy, improving data transmission rate, or providing both functions at the same time. This mode is suitable for scenarios that require high data availability, fault tolerance or higher performance, such as enterprise servers, high-performance computing clusters, etc. Through the RAID chip 500, the reliability and access speed of data can be improved, while reducing the risk of data loss caused by the failure of a single hard disk 300.

[0036] In this embodiment, the hard disk backplane can flexibly adjust its connection mode according to different working requirements, thereby providing higher flexibility and adaptability. Whether it is a direct hard disk 300 connection mode that requires maximizing storage capacity, or a RAID chip 500 connection mode that requires data redundancy and performance improvement, both can be achieved through this design.

[0037] It should be noted that, according to different specifications of the RAID chip 500 , the RAID chip 500 may be connected to at least two first interfaces 110 .

[0038] For example, Figure 4 As shown, the RAID chip 500 is inserted into two first interfaces 110. This configuration allows the RAID chip 500 to communicate with the mainboard 400 (through the first interface 110) and the hard disk 300 (through the first interface 110) at the same time, and is suitable for a simple RAID configuration.

[0039] Or, if Figure 5As shown, the RAID chip 500 is inserted into three first interfaces 110. This configuration provides higher flexibility, allowing the RAID chip 500 to simultaneously manage more hard disks 300. This is for complex RAID configurations that require higher data redundancy or higher performance.

[0040] Therefore, when designing the hard disk backplane, it is necessary to select a suitable interface connection method according to the specifications of the RAID chip 500, the required RAID configuration, and the overall performance requirements of the system.

[0041] In some embodiments, a first pin and a second pin are provided in the first interface 110, and a second pin is provided in the second interface 210; in the first working mode, the second pin in the first interface 110 and the second pin in the second interface 210 are both used to connect the hard disk 300; in the second working mode, the first pin and the second pin in two first interfaces 110 are both used to connect the RAID chip 500, and the second pin in the other first interface 110 and the second pin in the second interface 210 are both used to connect the hard disk 300.

[0042] Specifically, the first interface 110 is different from the second interface 210, and the first interface 110 is provided with a first pin and a second pin, and the second interface 210 is provided with a second pin. The first pin and the second pin have different functions, and can realize seamless switching of different working modes. In the first working mode, the second pins of all interfaces are used to connect the hard disk 300, ensuring stable communication between the hard disk 300 and the motherboard 400. In the second working mode, a specific first interface 110 (such as two interfaces connected to the RAID chip 500) uses the first pin and the second pin at the same time to support the complex communication requirements between the RAID chip 500 and the hard disk 300 and the motherboard 400, while other interfaces keep the second pin connected to the hard disk 300 to maintain support for additional hard disks 300. This design not only simplifies the hardware connection, but also reduces the compatibility issues that may arise due to changing the working mode, providing users with a more convenient and reliable use experience.

[0043] In addition, with the continuous development of technology, the interface types and pins of the hard disk 300 and the RAID chip 500 may also change. Therefore, the specific settings of the first interface 110 and the second interface 210 can also be adopted in other ways to adapt to hard disks 300 and RAID chips 500 of different models and specifications. For example, additional interfaces or pins can be reserved, or programmable logic circuits can be designed on the control circuit board to cope with possible interface changes or upgrade requirements in the future.

[0044] In some embodiments, when the RAID chip 500 is in the second working mode, the RAID chip 500 is used to obtain hard disk 300 information of multiple hard disks 300 connected to the hard disk backplane, receive instructions to enable the RAID function, select a target hard disk 300 from the multiple hard disks 300 according to a preset RAID level and the hard disk 300 information of the multiple hard disks 300, and establish an independent hard disk 300 redundant array for the target hard disk 300.

[0045] Specifically, when the RAID chip 500 is in the second working mode, the primary task of the RAID chip 500 is to obtain detailed information of all hard disks 300 on the hard disk backplane connected to it. This information includes but is not limited to the capacity, model, serial number, health status (such as SMART data), interface type, etc. of the hard disk 300. After collecting the information of all hard disks 300, the RAID chip 500 waits for the RAID function enablement instruction sent by the system or administrator. This instruction tells the RAID chip 500 to start configuring RAID according to the preset RAID level and the currently available hard disk 300 resources. The preset RAID level determines how data is distributed and redundant among multiple hard disks 300. For example, RAID 0 provides data striping to improve performance, but does not provide data redundancy; RAID 1 provides mirror redundancy to ensure high availability of data but sacrifices some storage capacity; RAID 5 combines striping and distributed parity checking to provide good performance and certain redundancy capabilities. The RAID chip 500 selects the most suitable hard disk 300 combination as the target hard disk 300 according to the preset RAID level and the collected hard disk 300 information. Once the target hard disk 300 is determined, the RAID chip 500 will start to configure these hard disks 300 to form a RAID array. This process includes initializing the hard disk 300, allocating storage space, configuring data distribution and redundancy strategies, etc. For example, in a RAID 5 configuration, the RAID chip 500 will configure the data stripes in all hard disks 300 and store parity information on one of the hard disks 300 so that data can be recovered when any hard disk 300 fails. When the RAID array is successfully established and initialized, the RAID chip 500 will notify the system or administrator that the RAID configuration has been successfully completed.

[0046] In one example, if Figures 4 to 6 As shown, the RAID chip 500 uses a 4C or 4C+ interface and can be directly plugged into the first interface 110 reserved on the hard disk backplane. When the RAID chip 500 is not used, the first interface 110 can be compatible with inserting a hard disk 300 with an E3.S interface.

[0047] Specifically, the first interface 110 is a SFF-TA-1002 4C interface. SFF-TA-1002 is a standard for a small form factor - telecom adapter, which is usually used for high-speed data transmission in servers and storage systems. The 4C interface means that the connector supports four channels or connection points. This design allows for higher data transmission rates and more complex signal transmission. Figure 6 As shown, the SFF-TA-1002 4C interface is used as the interface of the RAID chip 500, and the rightmost side thereof is the E3.S interface, which provides sufficient bandwidth and flexibility to support RAID operations.

[0048] The second interface 210 is an E3.S NVMe interface. E3.S is an NVMe (Non-Volatile Memory Express) interface standard for enterprise-level storage, which is based on the M.2 form factor but expanded to support higher performance and data transfer rates. NVMe is a storage access and transmission protocol based on PCIe (Peripheral Component Interconnect Express) designed for solid-state drives 300 (SSDs) to provide lower latency and higher throughput than traditional SATA SSDs. Here, the E3.S NVMe interface is used as the second interface 210, allowing the hard disk backplane to directly connect to the solid-state drive 300 that supports NVMe.

[0049] Since the SFF-TA-1002 4C interface includes an E3.S NVMe interface, this means that at the physical level, the hard disk 300 with an E3.S NVMe interface can be inserted into the first interface 110 reserved for the RAID chip 500. This can greatly improve the scalability and flexibility of the system and meet the storage requirements in different application scenarios.

[0050] In some embodiments, Figure 4 As shown, the two first interfaces 110 form a RAID chip 500 connector for plugging a 16i RAID chip 500 .

[0051] Generally, 16i's RAID chip 500 uses 2x1T EDSFF (Enterprise & Data Center Solid State Form Factor) E3, which is a solid state drive 300 (SSD) form factor standard designed for data centers and enterprise-level applications, with specific dimensions and interface specifications. The 2x1T EDSFF E3 device thickness means that the RAID chip 500 or chip is designed to occupy two E3.S slots. This design helps ensure sufficient physical space and heat dissipation to support high-performance RAID work.

[0052] Among them, the first interface 110 is located at the bottom and is used to connect to the interface of the main board 400 (Host). The first interface 110 is equivalent to the interface of the PCIe (Peripheral Component Interconnect Express, a high-speed serial computer expansion bus standard) end, which is responsible for connecting the RAID chip 500 with the main processing unit (such as the CPU) of the computer system to achieve data transmission and control signal exchange. This is the key path for communication between the RAID chip 500 and the main board 400, which is crucial to ensure the normal operation of the RAID chip 500 and data transmission.

[0053] The second interface 210 is located at the top and is an interface for connecting to the end devices. The second interface 210 is used to connect the hard disk 300 or other storage devices on the hard disk backplane. It can be an interface directly connected to the hard disk backplane, or it can be indirectly connected through the expander backplane to achieve a more complex storage architecture. By supporting direct connection or expander backplane connection, this design provides higher flexibility and scalability, allowing the RAID chip 500 to adapt to different storage requirements and configurations.

[0054] When the hard disk backplane is in the first working mode, the E3.S NVMe interface (or other compatible interface) of each hard disk 300 can be directly inserted into the first interface 110 and the second interface 210 of the hard disk backplane. When the hard disk backplane is in the second working mode, the 4C or 4C+ interface of the RAID chip 500 is inserted into the RAID chip 500 connector on the hard disk backplane. This connector is composed of multiple first interfaces 110.

[0055] In some embodiments, Figure 5 As shown, the three first interfaces 110 form a RAID chip 500 connector for plugging a 32i RAID chip 500 .

[0056] Generally, 32i's RAID chip 500 uses 3x1T EDSFF (Enterprise & Data Center Solid State Form Factor) E3, which is a solid state drive 300 (SSD) form factor standard designed for data centers and enterprise-level applications, with specific dimensions and interface specifications. The 3x1T EDSFF E3 device thickness means that the RAID chip 500 or chip is designed to occupy three E3.S slots. This design can meet complex configurations.

[0057] The first interface 110 is located at the bottom and is used to connect to the interface of the main board 400 (Host). The first interface 110 is equivalent to the interface of the PCIe end, which is responsible for connecting the RAID chip 500 with the main processing unit (such as CPU) of the computer system to realize data transmission and control signal exchange. This is the key path for communication between the RAID chip 500 and the main board 400, which is crucial to ensure the normal operation of the RAID chip 500 and data transmission.

[0058] The second interface 210 is located at the top and is an interface for connecting to the end devices. The second interface 210 is used to connect the hard disk 300 or other storage devices on the hard disk backplane. It can be an interface directly connected to the hard disk backplane, or it can be indirectly connected through the expander backplane to achieve a more complex storage architecture. By supporting direct connection or expander backplane connection, this design provides higher flexibility and scalability, allowing the RAID chip 500 to adapt to different storage requirements and configurations.

[0059] When the hard disk backplane is in the first working mode, the E3.S NVMe interface (or other compatible interface) of each hard disk 300 can be directly inserted into the first interface 110 and the second interface 210 of the hard disk backplane. When the hard disk backplane is in the second working mode, the 4C or 4C+ interface of the RAID chip 500 is inserted into the RAID chip 500 connector on the hard disk backplane. This connector is composed of three first interfaces 110.

[0060] In addition, it should be noted that the E3.S interface, as a high-performance NVMe SSD interface, is similar in form to a conventional 2.5-inch U2 / U3 interface hard disk 300, which makes it very compatible in terms of physical size. Therefore, the hard disk backplane can be flexibly designed according to actual needs to support different quantities and configurations of E3.S hard disks 300.

[0061] Since the E3.S interface supports multiple bandwidth options such as x2, x4, x8, and x16, you can select the appropriate bandwidth configuration based on performance requirements.

[0062] The design of the hard disk backplane usually reserves fixed positions for installing E3.S-type RAID chips 500 of different heights (such as 16i / 32i). These positions are carefully planned to ensure that the hard disk 300 wiring at different positions is as short as possible, thereby reducing signal attenuation and interference and ensuring signal integrity.

[0063] When the E3.S RAID chip 500 is connected, these reserved positions can be directly used to connect the E3.S SSD hard disks 300, and these hard disks 300 can be directly connected to the slots of the motherboard 400 to achieve direct data transmission. This design not only ensures the flexibility of the system, but also improves the utilization rate of hardware resources.

[0064] When the E3.S RAID chip 500 is connected, the RAID chip 500 can automatically identify the uplink and downlink links and isolate them from the host. This automatic identification function simplifies the system configuration process and reduces the risk of human error. At the same time, the isolation function ensures that the data transmission between the RAID chip 500 and the host will not be interfered with by other components, improving the stability and reliability of the system.

[0065] RAID chip 500 also has a lighting function, which is realized by sending relevant signals to the backplane CPLD (Complex Programmable Logic Device). After receiving the signal, the CPLD analyzes it and controls the LED indicator on the hard disk backplane to display different status information, such as normal status (OK), positioning status (Locate), fault status (Fault) and rebuild status (Rebuild). These status information provide system administrators with intuitive monitoring methods, which helps to find and solve problems in a timely manner.

[0066] In summary, the E3.S interface hard disk 300 with the application of RAID chip 500 has high flexibility and scalability, and the design of the hard disk backplane fully considers the utilization of hardware resources, signal integrity and system stability. At the same time, the automatic identification and isolation function and lighting function of the RAID chip 500 further improve the ease of use and maintainability of the system.

[0067] In some embodiments, a motherboard connector is provided on the hard disk backplane, and a motherboard 400 is connected to the motherboard connector. The RAID chip 500 is electrically connected to the motherboard connector through the first connector 100 and the second connector 200. The advantage of this design is that it reduces additional cables and connection points, thereby reducing the risk of signal attenuation and interference, and improving the stability and reliability of the system. At the same time, the RAID chip 500 is electrically connected to the motherboard connector through the first connector 100 and the second connector 200, realizing fast data transmission and efficient management.

[0068] In addition, a cable may be used to connect the mainboard 400 and the hard disk backplane, so that the RAID chip 500 is electrically connected to the cable through the first connector 100 and the second connector 200. This design reduces the overall cost. Through the cable connection, the RAID chip 500 can also be electrically connected to the cable through the first connector 100 and the second connector 200 to achieve data transmission and management.

[0069] In actual applications, the choice of connection method depends on the specific application scenario and requirements. If the system has high requirements for stability and reliability, and the frequency of hardware replacement and upgrade is low, then direct connection (motherboard connector method) may be more suitable. If the system requires high flexibility, or the frequency of hardware replacement and upgrade is high, then cable connection may be more suitable.

[0070] In some embodiments, Figure 7 and Figure 8 As shown, a plurality of first connectors 100 and a plurality of second connectors 200 are arranged in an array, and the first connector 100 is located at one end or the center of the array.

[0071] In this embodiment, the array arrangement can make the physical distance between the multiple first connectors 100 and the multiple second connectors 200 relatively uniform, which helps to reduce the attenuation and interference during the signal transmission process and improve the efficiency and stability of data transmission. By arranging the multiple first connectors 100 and the multiple second connectors 200 in an array, it is easier to achieve modular design. Different components (such as RAID chips 500, hard disks 300, etc.) can be inserted into different positions in the array as needed, thereby improving the scalability and flexibility of the system. In addition, the array arrangement makes the physical positions of the various connectors and components clearer and more orderly, which helps the system administrator to perform daily management and maintenance work. For example, when a component needs to be replaced or upgraded, it can be quickly located at the corresponding position for operation.

[0072] When multiple first connectors 100 are located at one end of the array, not only the entire layout is simplified, but also the location for setting the RAID chip 500 can be easily found. Placing the first connector 100 at the center of the array may help achieve more balanced data transmission. Under this layout, the number of hard disks 300 connected to each second connector 200 on both sides of the multiple first connectors 100 is similar, which helps to reduce the difference in signal transmission and improve the overall performance of the system.

[0073] Specifically, if Figure 7 As shown, the hard disk backplane is designed to accommodate eight 2.5-inch hard disks 300. In this scenario, six second interfaces 210 and two first interfaces 110 are provided in sequence. The first four second interfaces 210 are used to place PCIe 5.0 x4 NVMe SSDs with E3.S interfaces, while the last two interfaces are first interfaces 110, which are reserved for RAID chips 500 in the form of E3.S. This design not only ensures sufficient storage capacity, but also reserves expansion space to support more advanced data management functions. After inserting the RAID chips 500 in the form of E3.S into the last two reserved positions, the RAID chips 500 will be responsible for managing the first four PCIe 5.0 x4 NVMe SSDs with E3.S interfaces. The RAID chip 500 can identify the hard disks 300 on the backplane and form various RAID arrays (such as RAID 0, 1, 5, 10, etc.) through its internal logic to provide data redundancy, improve performance, or balance the two. The isolation between the RAID chip 500 and the Host side ensures that the performance of the NVMe SSD will not fluctuate due to changes in CPU utilization. This is because the RAID chip 500 independently processes data read and write requests and communicates directly with the hard disk 300, reducing the involvement of the CPU. In addition, this isolation also implements fault isolation so that the failure of a single NVMe SSD will not affect the entire system. Since the RAID chip 500 is responsible for managing the NVMe SSD, there is no need to set up interrupts for each NVMe SSD separately. The interrupt management and error handling mechanisms have been integrated into the RAID chip 500, which can more effectively handle concurrent requests and abnormal situations of multiple hard disks 300.

[0074] After normal startup, the RAID chip 500 automatically identifies the E3.S hard disk 300 on the same hard disk backplane and isolates it from the Host. The Host manages the four E3.S NVMes through the RAID chip 500. This ensures that their performance will not fluctuate due to changes in CPU utilization, and can also achieve fault isolation without the need to set interrupts for each NVMe.

[0075] In this embodiment, the E3.S interface hard disk 300 is directly isolated from the Host (mainboard 400) system through the RAID chip 500, which can ensure that the performance of these hard disks 300 is not affected by changes in CPU utilization. The RAID chip 500 usually has its own processing unit and cache mechanism, which can directly manage the read and write operations of the hard disk 300, reduce the intervention of the CPU, and thus improve the overall system performance.

[0076] When the hard disk 300 is managed by the RAID chip 500, the failure of any single hard disk 300 will not immediately affect the operation of the entire system, because the RAID chip 500 can perform data redundancy and recovery according to the configured RAID level. At the same time, this architecture also simplifies the replacement and repair process of the failed hard disk 300. In addition, since the RAID chip 500 directly handles the I / O requests of the hard disk 300, it reduces the number of interrupts that the CPU needs to handle. In high-performance computing or large-scale data storage environments, reducing the interrupt processing burden of the CPU can significantly improve the response speed and stability of the system.

[0077] Specifically, if Figure 8 As shown, the hard disk backplane design can accommodate 25 (5*5) 2.5-inch hard disks 300, that is, 5 rows and 5 columns, forming a square layout. In this scenario, there are twenty-two second interfaces 210 and three first interfaces 110, and the first interface 110 is located between the twenty-two second interfaces 210. The first eleven second interfaces 210 are used to place the PCIe 5.0 x4 NVMe SSD of the E3.S interface, and the last eleven second interfaces 210 are used to place the PCIe 5.0 x4NVMe SSD of the E3.S interface. The three first interfaces 110 in the middle are reserved for the RAID chip 500 in the E3.S form. Among them, a first interface 110 near the front is used to electrically connect to the front eleven connected SSDs, a first interface 110 near the back is used to electrically connect to the back eleven connected SSDs, and the first interface 110 is electrically connected to the motherboard 400. The isolation between the RAID chip 500 and the Host end of this embodiment ensures the performance stability of the SSD and realizes fault isolation. The host manages the SSDs through the RAID chip 500, and does not need to directly process the interrupts and requests of each SSD, thereby reducing the burden on the CPU and improving system efficiency.

[0078] In some embodiments, Figure 7As shown, the hard disk backplane is provided with a plurality of backplanes 600, each backplane 600 is provided with a plurality of first connectors 100 and a plurality of second connectors 200, and each backplane 600 of the hard disk backplane can be switched between a first working mode and a second working mode; when any backplane 600 is in the first working mode, each first connector 100 and each second connector 200 in the backplane 600 are respectively used to electrically connect different hard disks 300; when any backplane 600 is in the second working mode, at least two first connectors 100 in the backplane 600 cooperate to connect R The AID chip 500 and other first connectors 100 or second connectors 200 in the backplane 600 are respectively used to electrically connect different hard disks 300. The RAID chip 500 in the backplane 600 is communicated with the corresponding hard disk 300 through the corresponding first connector 100. The RAID chip 500 in the backplane 600 is communicated with the mainboard 400 through the corresponding first connector 100. The RAID chip 500 is configured to configure and manage each hard disk 300 in the backplane 600 according to the hard disk information of each hard disk 300 in the backplane 600 read.

[0079] Specifically, in this embodiment, three backplanes 600 are provided, and each backplane 600 can be switched between the first working mode and the second working mode.

[0080] When the backplane 600 is in the first working mode, each first connector 100 and each second connector 200 in the backplane 600 are respectively used to electrically connect different hard disks 300. All hard disks 300 are directly connected to the mainboard 400 or connected to the mainboard 400 through the backplane, without the intervention of the RAID chip 500, which is suitable for simple storage scenarios that do not require data redundancy or high performance.

[0081] When the backplane 600 is in the second working mode, the multiple first connectors 1 in the backplane 600 cooperate together to connect the RAID chip 500. The other first connectors 100 and second connectors 200 in the backplane 600 continue to be used to electrically connect different hard disks 300. At this time, the RAID chip 500 communicates with each hard disk 300 through the corresponding first connector 100, and communicates with the mainboard 400 through the first connector 100 in the backplane 600, realizing the advanced management function of the hard disk 300. For example, the RAID chip 500 can read the hard disk 300 information of each hard disk 300 in the backplane 600, including capacity, type, status, etc., which is the basis for configuring and managing the hard disk 300. According to the hard disk 300 information read, the RAID chip 500 can configure and manage each hard disk 300 in the backplane 600. For example, it can create a RAID array (such as RAID 0, 1, 5, 10, etc.) to provide data redundancy, improve performance, or balance the two. Moreover, the RAID chip 500 is not only responsible for data communication between the hard disks 300, but also serves as a communication bridge between the hard disks 300 and the mainboard 400. It can transmit data from the hard disks 300 to the mainboard 400, and can also convey control instructions from the mainboard 400 to the hard disks 300.

[0082] In some embodiments, Figure 1 and Figure 2 As shown, the hard disk backplane further includes a switching circuit configured to control the hard disk backplane to switch between the first working mode and the second working mode.

[0083] In this embodiment, the switching circuit can quickly and accurately control the working mode conversion of the hard disk backplane according to system requirements or administrator's instructions.

[0084] In this embodiment, the switching circuit is usually integrated with the monitoring and management software, and can obtain the status information of the hard disk backplane and the connected hard disk 300 in real time, such as temperature, rotation speed, read and write speed, error log, etc., and intelligently decide whether to switch the working mode based on this information. When the insertion of the RAID chip 500 is detected, the switching circuit can quickly switch the affected backplane to the second working mode, and perform data redundancy and recovery operations through the RAID chip 500, thereby avoiding data loss and ensuring the continuous operation of the system. When the insertion of the RAID chip 500 is not detected, the switching circuit can switch more backplanes to the first working mode, so that the hard disk 300 communicates directly with the mainboard 400, reducing data delays and losses in the intermediate links.

[0085] In some embodiments, the switching circuit has built-in intelligent sensors and processors that can monitor the status of the hard disk backplane and the hard disk 300 connected to it in real time, including key indicators such as temperature, humidity, vibration, read and write speeds, and error rates.

[0086] Based on real-time monitoring data, the switching circuit uses built-in intelligent algorithms to quickly analyze and make decisions to determine the current optimal working mode.

[0087] When the system detects an abnormality in the hard disk backplane or hard disk 300 (such as performance degradation, reaching the life limit, error code, etc.), the switching circuit will automatically trigger a mode switch, switching the affected backplane from the first working mode to the second working mode, and using the RAID chip 500 for data protection and recovery.

[0088] At the same time, the switching circuit can dynamically adjust the working mode according to the system load and performance requirements to ensure that the storage system always operates in the optimal state.

[0089] In addition to automatic switching, the switching circuit also supports manual control and remote management functions. Administrators can directly control the operation of the switching circuit through the management interface or API interface to achieve more flexible system configuration and management. The remote management function allows administrators to monitor and manage the hard disk backplane system through a network connection at any location and at any time, improving the maintainability and availability of the system.

[0090] When a hard disk 300 fails, the switching circuit can quickly isolate the failed hard disk 300 and reorganize the remaining hard disks 300 into a new RAID array through the RAID chip 500 to ensure data security and accessibility.

[0091] The switching circuit can intelligently allocate the hard disk 300 bandwidth and cache resources according to system performance requirements and resource utilization, optimizing data transmission efficiency and response speed. By dynamically adjusting the working mode and resource configuration of different backplanes, the switching circuit can ensure that critical tasks are supported by sufficient resources while avoiding resource waste and bottleneck problems.

[0092] In addition, the switching circuit also supports switching the entire hard disk backplane to a safe mode under specific circumstances (such as system maintenance, upgrades, etc.), restricting access to and modification of the hard disk 300 to ensure data security.

[0093] In one example, the hard disk backplane further includes: a switch and an indicator light. The switch is electrically connected to the switching circuit, integrated on the hard disk backplane, and configured to receive user input or system instructions to trigger the switching of the working mode; the indicator light is electrically connected to the switching circuit, and is used to display the working mode status of the hard disk backplane.

[0094] Generally, the switch is integrated on the upper part of the hard disk backplane or in an easily accessible location so that users or system administrators can operate it conveniently. This plug-and-play design allows users to quickly switch working modes without opening the chassis or performing complex settings.

[0095] The switching switch is electrically connected to the switching circuit, and triggers the switching of the working mode by receiving user input or system instructions. The user can send the switching signal through physical operations (such as toggling a switch, pressing a button, etc.), and the instruction may come from the BIOS settings on the motherboard 400, the driver in the operating system, or the remote management interface. The introduction of the switching switch greatly improves the flexibility and user-friendliness of the hard disk backplane. The user can switch the working mode at any time according to actual needs without worrying about the complicated configuration process or the potential risk of data loss.

[0096] The indicator light is also integrated into the hard disk backplane, usually located near the switch or in an easily visible position. The design of the indicator light should be eye-catching enough to clearly display the current working mode status in different working environments.

[0097] The indicator light is electrically connected to the switching circuit and is used to display the current working mode status of the hard disk backplane. According to the state change of the switching circuit, the indicator light will light up, go out or change color to intuitively reflect whether the hard disk backplane is in the first working mode (direct communication mode) or the second working mode (RAID chip 500 management mode).

[0098] The indicator light setting provides users with instant status feedback. Users do not need to enter system settings or view complex log information. They can quickly understand the working status of the hard disk backplane by the color or flashing mode of the indicator light. This not only improves the ease of use of the system, but also reduces the risk of data loss or system failure due to misoperation.

[0099] In another embodiment of the present invention, a server is provided, which includes a hard disk backplane, a RAID chip 500 and a mainboard 400. The RAID chip 500 is connected to the mainboard 400 through a first connector 100. The structure of the hard disk backplane can refer to the above embodiment, which will not be repeated here.

[0100] Specifically, if Figure 1 As shown, when the hard disk backplane is switched to the first working mode, in this mode, all first connectors 100 and all second connectors 200 on the hard disk backplane are independently used to connect different hard disks 300. Each hard disk 300 communicates directly with the mainboard 400 through its corresponding connector (first connector 100 or second connector 200) to achieve data reading and writing and status feedback. This mode is suitable for application scenarios that do not require complex data redundancy or advanced fault isolation functions, such as a single hard disk 300 storage system or a simple data backup system.

[0101] When the hard disk backplane switches to the second working mode, Figure 2As shown, in this mode, the working mode of the hard disk backplane of the server changes significantly. The first connector 100 is no longer directly connected to the hard disk 300, but is connected to the RAID chip 500. The RAID chip 500 is a device specially used for data redundancy and fault recovery, which can manage multiple hard disks 300 to improve data security. At least two first connectors 100 are connected to the RAID chip 500, so that the RAID chip 500 can directly communicate with some hard disks 300 and manage the data reading and writing and fault detection of these hard disks 300. The remaining first connectors 100 and second connectors 200 continue to be used to connect other hard disks 300, but the data processing and management of these hard disks 300 are all performed through the RAID chip 500. The RAID chip 500 communicates with the mainboard 400 through the first connector 100, and is responsible for reporting the status and data of all connected hard disks 300 to the mainboard 400, and also receives instructions from the mainboard 400. The use of the RAID chip 500 can isolate the faulty hard disk 300 to prevent it from affecting the operation of the entire storage system, thereby improving the stability and reliability of the system. The RAID chip 500 can realize redundant storage of data, and even if some hard disks 300 are damaged, the integrity and accessibility of the data can be guaranteed. The RAID chip 500 can optimize data read and write operations and improve the overall performance of the storage system, especially when processing a large number of concurrent read and write requests. This mode is particularly suitable for application scenarios that require high data security, fault isolation and redundant storage, such as servers, data centers, etc.

[0102] The server provided by the embodiment of the present invention can flexibly switch between the first working mode (direct communication mode) and the second working mode (RAID chip 500 management mode) due to the provision of the above-mentioned hard disk backplane. In the first working mode, the first connector 100 and the plurality of second connectors 200 on the hard disk backplane are directly connected to the hard disk 300, so as to realize direct communication between the hard disk 300 and the main board 400. In the second working mode, the plurality of first connectors 100 cooperate to jointly connect the RAID chip 500, and the RAID chip 500 communicates with the main board 400 through the hard disk 300 and the first connector 100 connected thereto, so as to realize efficient management and configuration of the hard disk 300, isolate the hard disk 300 and the main board 400, and play the role of fault isolation, hard disk 300 redundancy and stable performance. The design on the hard disk backplane allows the user to flexibly insert the RAID chip 500 or the hard disk 300 on the backplane according to actual needs, without having to consider complex issues such as cable connection. This plug-and-play design greatly improves the scalability and flexibility of the system and meets the storage requirements in different application scenarios.

[0103] At the same time, by integrating the connection function of the RAID chip 500 on the hard disk backplane, the slot space and position occupied by the traditional RAID chip 500 are significantly saved. At the same time, the connection function of the RAID chip 500 is integrated into the hard disk backplane, which reduces the use of external RAID chips 500, thereby improving the heat dissipation environment of the RAID chip 500. For RAID chips 500 with increasingly higher performance and power consumption, this design helps to optimize the heat dissipation design, ensure that the RAID chip 500 maintains a stable temperature while operating efficiently, and prolongs its service life. Multiple cables between the traditional RAID chip 500 and the hard disk backplane are removed, avoiding signal attenuation and link problems caused by long cables or improper layout. This improvement not only ensures the quality of signal transmission, but also reduces the cost caused by the use of a large number of cables. In addition, a simpler cable layout helps to optimize the internal ventilation duct and improve the overall heat dissipation effect.

[0104] The device embodiments described above are merely illustrative, wherein the units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, they may be located in one place, or they may be distributed on multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the scheme of this embodiment. Ordinary technicians in this field can understand and implement it without paying creative labor.

[0105] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A hard disk backplane, characterized in that: The hard disk backplane is provided with a plurality of first connectors and a plurality of second connectors, and the hard disk backplane can be switched between a first working mode and a second working mode; In the first working mode, each of the first connectors and each of the second connectors are respectively used to electrically connect different hard disks, and each of the hard disks is communicatively connected to the mainboard via the first connector or the second connector; In the second working mode, at least two of the first connectors cooperate to connect to the RAID chip, and the other first connectors or the second connectors are respectively used to electrically connect different hard disks. The RAID chip is communicated with the corresponding hard disks through the corresponding first connectors, and the RAID chip is communicated with the mainboard through the first connector. The RAID chip is configured to configure and manage each hard disk according to the hard disk information of each hard disk read.

2. The hard disk backplane according to claim 1, characterized in that: The first connector is provided with a first interface, and the second connector is provided with a second interface; In the first working mode, the first interface and the second interface are both used to connect to the hard disk; In the second working mode, two of the first interfaces are commonly connected to the RAID chip, and the other first interfaces and all of the second interfaces are respectively used to electrically connect to different hard disks.

3. The hard disk backplane according to claim 2, characterized in that: The first interface is provided with a first pin and a second pin, and the second interface is provided with a second pin; In the first working mode, the second pin in the first interface and the second pin in the second interface are both used to connect the hard disk; In the second working mode, the first pin and the second pin in two of the first interfaces are used to connect the RAID chip, and the second pin in the other first interface and the second pin in the second interface are used to connect the hard disk.

4. The hard disk backplane according to claim 1, characterized in that: When the RAID chip is in the second working mode, it is used to obtain the hard disk information of the multiple hard disks connected to the hard disk backplane, receive the instruction to enable the RAID function, select a target hard disk from the multiple hard disks according to the preset RAID level and the hard disk information of the multiple hard disks, and establish an independent hard disk redundant array for the target hard disk.

5. The hard disk backplane according to claim 1, characterized in that: The hard disk backplane is provided with a mainboard connector, the mainboard is connected to the mainboard connector, and the RAID chip is electrically connected to the mainboard connector through the first connector and the second connector at the same time.

6. The hard disk backplane according to any one of claims 1 to 5, characterized in that: The hard disk backplane is provided with a plurality of backplanes, each of the backplanes is provided with a plurality of the first connectors and a plurality of the second connectors, and each of the backplanes of the hard disk backplane can be switched between the first working mode and the second working mode; When any of the backplanes is in the first working mode, the first connector and each of the second connectors in each of the backplanes are respectively used to electrically connect different hard disks; When any of the backplanes is in the second working mode, at least two of the first connectors in the backplane cooperate to connect to the RAID chip, and the other first connectors or the second connectors in the backplane are respectively used to electrically connect different hard disks. The RAID chip in the backplane is communicated with the corresponding hard disks through the corresponding first connectors, and the RAID chip in the backplane is communicated with the mainboard through the corresponding first connectors. The RAID chip is configured to configure and manage each hard disk in the backplane according to the hard disk information of each hard disk in the backplane read.

7. The hard disk backplane according to any one of claims 1 to 5, characterized in that: A plurality of the first connectors and a plurality of the second connectors are arranged in an array.

8. The hard disk backplane according to any one of claims 1 to 5, characterized in that: The hard disk backplane also includes: A switching circuit is configured to control the hard disk backplane to switch between the first working mode and the second working mode.

9. The hard disk backplane according to claim 8, characterized in that: The hard disk backplane also includes: A switch, electrically connected to the switching circuit, integrated on the hard disk backplane, and configured to receive user input or system instructions to trigger the switching of the working mode; An indicator light is electrically connected to the switching circuit and is used to display the working mode status of the hard disk backplane.

10. A server, characterized in that: include: The hard disk backplane according to any one of claims 1 to 9; A RAID chip and a main board, wherein the RAID chip is communicatively connected to the main board via the first connector.

Images