A high-precision chip packaging automatic alignment and calibration device

Abstract

The present invention discloses a high-precision chip packaging automatic alignment and calibration device, which belongs to the field of chip packaging technology. A high-precision chip packaging automatic alignment and calibration device includes a processing table, and also includes: a top frame, fixedly connected to the top of the processing table, wherein a lifting device is fixedly installed on the top frame, and a chip packaging machine is fixedly installed on the telescopic end of the lifting device; a conveyor belt fixedly installed on the processing table, wherein a plurality of cylindrical placement tables arranged at equal intervals are installed on the conveyor belt, each of the cylindrical placement tables is provided with a placement groove, and an alignment component for driving the cylindrical placement table to align with the chip packaging machine is provided on the conveyor belt; the present invention can complete the automatic alignment of the chip and the chip packaging machine, avoid obvious deviations between the chip and the chip packaging machine, and indirectly ensure the final quality of the chip.

Description

Technical Field

[0001] The present invention relates to the technical field of chip packaging, and in particular to a high-precision chip packaging automatic alignment and calibration device. Background Art

[0002] Chip packaging refers to the process of installing a semiconductor integrated circuit chip in a shell. It uses a series of technologies to layout, paste, fix and connect the chip on the frame, lead out the wiring terminals and fix them by potting with a plastic insulating medium to form an overall three-dimensional structure.

[0003] In the prior art, during the chip packaging process, conveying equipment such as conveyor belts are usually used to transport the chips to the bottom of a packaging machine, and then the chip packaging work is completed by the chip packaging machine. Although the conveyor belt is mainly controlled to start and stop by a PLC controller, the conveyor belt will wear out after being used for a period of time. This will cause the chip's stop position to have a small position offset after the conveyor belt has been used for a period of time, which will in turn affect the packaging accuracy of the chip by the packaging machine. Summary of the invention

[0004] The purpose of the present invention is to solve the problem in the prior art that the conveyor belt is easily worn after long-term operation, which may cause the chip's stop position to be offset, and to propose a high-precision chip packaging automatic alignment and calibration device.

[0005] In order to achieve the above object, the present invention adopts the following technical solutions:

[0006] A high-precision chip packaging automatic alignment and calibration device comprises a processing table, and also comprises: a top frame fixedly connected to the top of the processing table, wherein a lifting device is fixedly installed on the top frame, and a chip packaging machine is fixedly installed on the telescopic end of the lifting device; a conveyor belt fixedly installed on the processing table, wherein a plurality of cylindrical placement tables arranged at equal intervals are installed on the conveyor belt, each of the cylindrical placement tables is provided with a placement groove, and the conveyor belt is provided with an alignment component for driving the cylindrical placement table to align with the chip packaging machine.

[0007] In order to facilitate the vertical alignment of the chip packaging machine and the cylindrical placement table, preferably, the alignment component includes a support table connected to the conveyor belt, the support table is provided with a circular groove, the cylindrical placement table is arranged in the circular groove, and alignment springs are installed around the cylindrical placement table and between the inner wall of the circular groove, wherein the sliding sleeve of the outer wall of the lower end of the chip packaging machine is provided with an outer tube, the inner diameter of the outer tube is the same as the outer diameter of the cylindrical placement table, a lifting spring is installed between the outer tube and the top of the chip packaging machine, the upper end of the cylindrical placement table is provided with chamfers around, and the lower end of the outer tube is fixedly provided with a trumpet-shaped skirt.

[0008] In order to clean up the floating dust remaining on the chip, further, air holes are provided around the lower end of the outer tube, and the outer wall of the lower end of the outer tube is rotatably connected to a ring that blocks the air holes, and both sides of the ring are rotatably connected to rotating tubes connected to its inner cavity, and fan blades and filter elements are fixedly installed in the rotating tubes, and the outer wall of the outer tube is provided with a linkage part that drives the ring to rotate.

[0009] In order to make the ring rotate on the outer wall of the outer tube, further, the linkage part includes a first gear rotatably connected to the outer wall of the outer tube, the outer wall of the outer tube is rotatably connected to an annular cover, and a passive gear meshing with the first gear is fixedly mounted on the annular cover, wherein the end of the rotating tube is rotatably connected to the annular cover, the shaft end of the first gear is mounted with a second gear through a one-way bearing, and a rack meshing with the second gear is fixedly mounted on the chip packaging machine.

[0010] In order to enable the rotating tube to rotate, further, a driven gear is fixedly mounted on the outer wall of the rotating tube, and a ring gear meshingly connected with the driven gear is fixedly mounted on the outer wall of the outer tube.

[0011] In order to make the alignment efficiency of the chip packaging machine higher, further, the lower end of the annular cover is rotatably mounted with a plurality of circumferentially distributed conical wheels through a bracket, and the outer wall of the cylindrical placement table is fixedly connected with an annular limiting plate. When the outer tube moves downward, the plurality of conical wheels will surround the annular limiting plate.

[0012] In order to prevent the support platform from twisting due to the conveyor belt, further, a support is fixedly connected to the conveyor belt, the support platform is rotatably connected to the support via a rotating rod, and the conveyor belt is fixedly connected to support plates that rest on both sides of the lower end of the support platform.

[0013] In order to facilitate the removal of the chip in the placement groove, preferably, the inner bottom of the placement groove is provided with a device groove, a lifting column is longitudinally slidably connected in the device groove, and the bottom of the conveyor belt is provided with a positive pressure part for blowing air to the device groove.

[0014] In order to facilitate the lifting column to push the chip upward, the positive pressure part further includes an elastic airbag fixedly installed on the inner wall of the conveyor belt, the elastic airbag is connected to the device groove through a hose, and a pressure plate close to the inner wall of the conveyor belt is fixedly connected to the processing table.

[0015] Compared with the prior art, the present invention provides a high-precision chip packaging automatic alignment and calibration device, which has the following beneficial effects:

[0016] 1. The high-precision chip packaging automatic alignment and calibration equipment drives the chip packaging machine downward through the lifting device. The trumpet-shaped skirt at the lower end of the outer tube will be placed on the chamfered surface. The trumpet-shaped skirt that continues to move downward will be guided by the chamfered surface to make the outer tube sleeve around the cylindrical placement table, thereby completing the automatic alignment of the chip and the chip packaging machine, avoiding obvious deviation between the chip and the chip packaging machine, and indirectly ensuring the final quality of the chip.

[0017] 2. The high-precision chip packaging automatic alignment and calibration equipment drives the second gear to rotate through the rack, and the rotating tube drives the internal fan blades and filter element to rotate. One of the rotating tubes will inhale air into the outer tube through the air vent, and the other will exhaust air into the outer tube through the air vent. Therefore, the floating dust on the surface of the chip can be blown out and filtered through the filter element, thereby preventing the floating dust from affecting the chip.

[0018] 3. The high-precision chip packaging automatic alignment and calibration equipment will drive the second gear to rotate through the rack, and the annular cover will drive the two rotating tubes to revolve around the axis of the outer tube. The two rotating tubes revolving around the axis of the outer tube will perform comprehensive air blowing and cleaning on the chip from multiple angles, so that the chip can be fully dust-free, the chip is more tidy, and the quality control is higher.

[0019] 4. The high-precision chip packaging automatic alignment and calibration equipment drives the conical wheel to roll along the edge of the annular limit plate through the rotating annular cover, so that the outer tube can be more efficiently placed on the cylindrical placement table, reducing the occurrence of jamming and improving the efficiency and effect of automatic alignment.

[0020] 5. This high-precision chip packaging automatic alignment and calibration equipment drives the internal elastic airbag to press against the pressure plate through the conveyor belt. The elastic airbag will transport the internal gas to the device slot through the hose. The lifting column in the device slot will be lifted upward under the action of air pressure, thereby ejecting the chip in the slot, making it easier to take out the chip and dissipate heat for the chip itself. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 A schematic diagram of the first-perspective isometric structure of a high-precision chip packaging automatic alignment and calibration device proposed by the present invention;

[0022] Figure 2 A schematic diagram of the axonometric structure from a second viewing angle of a high-precision chip packaging automatic alignment and calibration device proposed by the present invention;

[0023] Figure 3 A schematic diagram of the partial isometric structure of a high-precision chip packaging automatic alignment and calibration device proposed by the present invention Figure 1 ;

[0024] Figure 4A schematic diagram of the partial isometric structure of a high-precision chip packaging automatic alignment and calibration device proposed by the present invention Figure 2 ;

[0025] Figure 5 A schematic diagram of a partial cross-section structure of a high-precision chip packaging automatic alignment and calibration device proposed by the present invention;

[0026] Figure 6 This is a schematic diagram of the outer tube axonometric structure of a high-precision chip packaging automatic alignment and calibration device proposed by the present invention;

[0027] Figure 7 A schematic diagram of the axonometric structure of a conveyor belt of a high-precision chip packaging automatic alignment and calibration device proposed by the present invention;

[0028] Figure 8 This is a schematic diagram of the cross-sectional structure of a support table of a high-precision chip packaging automatic alignment and calibration device proposed by the present invention.

[0029] In the figure: 1. processing table; 2. top frame; 3. lifting equipment; 4. chip packaging machine; 5. outer tube; 6. lifting spring; 7. trumpet skirt; 8. cylindrical placement table; 9. placement groove; 10. chamfer; 11. support table; 12. circular groove; 13. alignment spring; 14. annular limit plate; 15. support; 16. rotating rod; 17. support plate; 18. conveyor belt; 19. air vent; 20. circular ring; 21. rotating tube; 22. fan blade; 23. filter element; 24. driven gear; 25. ring gear; 26. ring cover; 27. driven gear; 28. first gear; 29. ​​second gear; 30. rack; 31. conical wheel; 32. bracket; 33. elastic airbag; 34. device groove; 35. lifting column; 36. hose; 37. pressure plate. DETAILED DESCRIPTION

[0030] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0031] In the description of the present invention, it is necessary to understand that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0032] Embodiment 1:

[0033] A high-precision chip packaging automatic alignment and calibration method comprises the following steps:

[0034] Step 1: Place the chip on a horizontal calibration surface;

[0035] Step 2: Apply force towards the center of the chip to the four sides of the calibration surface.

[0036] Embodiment 2:

[0037] Reference Figure 1-Figure 8 A high-precision chip packaging automatic alignment and calibration device comprises a processing table 1, and also comprises: a top frame 2, which is fixedly connected to the top of the processing table 1, wherein a lifting device 3 is fixedly installed on the top frame 2, and the lifting device 3 is an electric telescopic rod. The telescopic end of the lifting device 3 is fixedly installed with a chip packaging machine 4 for packaging chips, and the lower end shell of the chip packaging machine 4 is cylindrical; a conveyor belt 18 fixedly installed on the processing table 1, the conveyor belt 18 mainly comprises a belt, a pulley and a driving source for driving the pulley to rotate, wherein a plurality of cylindrical placement tables 8 arranged at equal intervals are installed on the conveyor belt 18, the number of the cylindrical placement tables 8 is 6-30, and the preferred number of the present application is 8, each cylindrical placement table 8 is provided with a placement groove 9, and the conveyor belt 18 is provided with an alignment component for driving the cylindrical placement table 8 to align with the chip packaging machine 4.

[0038] Specifically, when in use, the chip is placed in the placement groove 9, and then the cylindrical placement table 8 is driven by the conveyor belt 18 to move to the bottom of the chip packaging machine 4. At this time, the chip packaging machine 4 is driven downward by the lifting device 3. At this time, the alignment component will automatically align the chip packaging machine 4 with the chip up and down, avoiding obvious deviations between the chip and the chip packaging machine 4, and indirectly ensuring the final quality of the chip.

[0039] Embodiment three:

[0040] Reference Figure 1-Figure 6 , which is basically the same as the second embodiment, and further discloses a specific implementation scheme of the alignment component.

[0041] The above-mentioned alignment component includes a support platform 11 connected to the conveyor belt 18, and a circular groove 12 is provided on the support platform 11. The cylindrical placement platform 8 is arranged in the circular groove 12, and alignment springs 13 are installed between the four sides of the cylindrical placement platform 8 and the inner wall of the circular groove 12. Among them, the sliding sleeve of the outer wall of the lower end of the chip packaging machine 4 is provided with a cylindrical outer tube 5, and the inner diameter of the outer tube 5 is the same as the outer diameter of the cylindrical placement platform 8. A lifting spring 6 is installed between the outer tube 5 and the top of the chip packaging machine 4, and the upper end of the cylindrical placement platform 8 is provided with a chamfer 10 around the periphery, and the lower end of the outer tube 5 is fixedly provided with a trumpet-shaped skirt 7.

[0042] Specifically, when it is necessary to complete the chip packaging work, the chip packaging machine 4 is driven downward by the lifting device 3, and the chip packaging machine 4 will drive the outer tube 5 to move downward synchronously. When the chip packaging machine 4 is not aligned with the chip below, the trumpet-shaped skirt 7 at the lower end of the outer tube 5 will be placed on the chamfer 10, and the trumpet-shaped skirt 7 that continues to move downward will make the outer tube 5 sleeved on the four sides of the cylindrical placement table 8 under the guidance of the chamfer 10. During this period, the cylindrical placement table 8 will translate in the circular groove 12, and squeeze and stretch part of the alignment spring 13, so as to complete the automatic alignment of the chip and the chip packaging machine 4, avoid obvious deviation between the chip and the chip packaging machine 4, and indirectly ensure the final quality of the chip, and the outer tube 5 that continues to move downward will be limited by the support table 11 and compress the lifting spring 6. When the chip packaging machine 4 that continues to move downward is close to the chip, the chip packaging can be completed by the chip packaging machine 4. After the packaging is completed, the lifting device 3 drives the chip packaging machine 4 to move upward and reset, and the lifting spring 6 will drive the outer tube 5 to slide downward to the initial position.

[0043] The above-mentioned conveyor belt 18 is fixedly connected to a support 15, and the support platform 11 is rotatably connected to the support 15 through a rotating rod 16. The conveyor belt 18 is fixedly connected to a support plate 17 that rests on both sides of the lower end of the support platform 11. When the belt of the conveyor belt 18 is transported to the driving wheel position, the support platform 11 can be rotated on the support 15 through the rotating rod 16, thereby preventing the support platform 11 from being twisted by the bent conveyor belt 18.

[0044] Embodiment 4:

[0045] Reference Figure 3-Figure 6 , which is basically the same as the third embodiment, and further, a specific implementation plan for cleaning the chip is specifically added.

[0046] Air holes 19 are provided around the lower end of the outer tube 5. A circular ring 20 for blocking the air holes 19 is rotatably connected to the outer wall of the lower end of the outer tube 5. Both sides of the circular ring 20 are rotatably connected to a rotating tube 21 communicating with its inner cavity. Fan blades 22 and a filter element 23 for filtering dust are fixedly installed in the rotating tube 21. The outer wall of the outer tube 5 is provided with a linkage part for driving the circular ring 20 to rotate. The linkage part includes a first gear 28 rotatably connected to the outer wall of the outer tube 5. The outer wall of the outer tube 5 is rotatably connected to an annular cover 26. A driven gear 27 meshing with the first gear 28 is fixedly installed on the annular cover 26, wherein the end of the rotating tube 21 is rotatably connected to the annular cover 26, and a second gear 29 is installed on the shaft end of the first gear 28 through a one-way bearing. A rack 30 meshing with the second gear 29 is fixedly installed on the chip packaging machine 4, a driven gear 24 is fixedly installed on the outer wall of the rotating tube 21, and a ring gear 25 meshing with the driven gear 24 is fixedly installed on the outer wall of the outer tube 5.

[0047] Specifically, after the outer tube 5 is limited by the support platform 11, the air hole 19 will be just flush with the upper end surface of the chip, and the chip packaging machine 4 that continues to move downward will first drive the rack 30 to slide downward, and the rack 30 will drive the second gear 29 to rotate, and the second gear 29 will drive the passive gear 27 to rotate through the first gear 28, and the passive gear 27 will drive the annular cover 26 to rotate, and the annular cover 26 will drive the two rotating tubes 21 to revolve around the axis of the outer tube 5, and drive the ring 20 to rotate on the outer wall of the outer tube 5, and the rotating tube 21 will drive the driven gear 24 to roll along the annular gear 25, so the driven gear 24 will drive the rotating tube 21 to rotate, and the rotating tube 21 will drive the internal fan blades 22 and the filter element 23 to rotate, and one of the rotating tubes 21 will rotate. 21 will inhale air into the outer tube 5 through the air vent 19, while the other will exhaust air into the outer tube 5 through the air vent 19, so that the dust on the surface of the chip can be blown out and filtered through the filter element 23, thereby preventing the dust from affecting the chip, and the two rotating tubes 21 revolving around the axis of the outer tube 5 will perform comprehensive air blowing and cleaning on the chip from multiple angles, so that the chip can be fully dust-free, the chip is more neat, and the quality control is higher. When the chip packaging machine 4 is reset upward, the rack 30 will drive the second gear 29 to rotate reversely. Since the second gear 29 is installed on the first gear 28 through a one-way bearing, the second gear 29 will not drive the first gear 28 to reverse, thereby preventing the dust in the filter element 23 from being blown onto the chip again.

[0048] The lower end of the annular cover 26 is rotatably mounted with a plurality of circumferentially distributed conical wheels 31 via a bracket 32. The number of the conical wheels 31 is 4 to 10, and the preferred number in the present application is 6. The outer wall of the cylindrical placement table 8 is fixedly connected with an annular limiting plate 14. When the outer tube 5 moves downward, the plurality of conical wheels 31 will surround the annular limiting plate 14.

[0049] Specifically, after the outer tube 5 is pressed down, the trumpet-shaped skirt 7 at the lower end of the outer tube 5 will eventually rest on the annular limit plate 14, and the conical wheel 31 will rest on the four sides of the annular limit plate 14. When the annular cover 26 rotates, the annular cover 26 will drive the conical wheel 31 to roll along the edge of the annular limit plate 14 through the bracket 32, so that the outer tube 5 can be more efficiently placed on the cylindrical placement table 8, reducing the occurrence of jamming and improving the efficiency and effect of automatic alignment.

[0050] Embodiment five:

[0051] Reference Figure 1 , Figure 2 , Figure 7 as well as Figure 8 , which is basically the same as the fourth embodiment, and further, a specific implementation scheme for facilitating the removal of the chip is specifically added.

[0052] The inner bottom of the above-mentioned placement groove 9 is provided with an installation groove 34, and a lifting column 35 is longitudinally slidably connected in the installation groove 34. The bottom of the conveyor belt 18 is provided with a positive pressure part for blowing air into the installation groove 34; the positive pressure part includes an elastic airbag 33 fixedly installed on the inner wall of the conveyor belt 18, and the elastic airbag 33 is connected to the installation groove 34 through a hose 36. A pressure plate 37 close to the inner wall of the conveyor belt 18 is fixedly connected in the processing table 1.

[0053] Specifically, when the support table 11 moves from the bottom of the chip packaging machine 4 to the next workstation, the conveyor belt 18 will drive the internal elastic airbag 33 to press against the pressure plate 37, and the elastic airbag 33 will transport the internal gas to the device slot 34 through the hose 36. The lifting column 35 in the device slot 34 will be lifted upward under the action of air pressure, thereby ejecting the chip in the placement slot 9, thereby facilitating the subsequent removal of the chip and the heat dissipation of the chip itself.

[0054] When the high-precision chip packaging automatic alignment and calibration equipment is used, the chip is placed in the placement groove 9, and then the cylindrical placement table 8 is driven by the conveyor belt 18 to move to the bottom of the chip packaging machine 4. At this time, the chip packaging machine 4 is driven downward by the lifting device 3, and the chip packaging machine 4 will drive the outer tube 5 to move downward synchronously. When the chip packaging machine 4 is not aligned with the chip below, the trumpet-shaped skirt 7 at the lower end of the outer tube 5 will be placed on the bevel chamfer 10, and the trumpet-shaped skirt 7 that continues to move downward will make the outer tube 5 sleeved on the four sides of the cylindrical placement table 8 under the guidance of the bevel chamfer 10. During this period, the column The shaped placement table 8 will translate in the circular groove 12, and squeeze and stretch part of the alignment spring 13, so as to complete the automatic alignment of the chip and the chip packaging machine 4, avoid obvious deviation between the chip and the chip packaging machine 4, and indirectly ensure the final quality of the chip, and the outer tube 5 that continues to move downward will be limited by the support table 11 and compress the lifting spring 6. When the chip packaging machine 4 that continues to move downward approaches the chip, the chip packaging machine 4 can complete the packaging of the chip. After the packaging is completed, the lifting device 3 drives the chip packaging machine 4 to move upward and reset, and the lifting spring 6 drives the outer tube 5 to slide downward to the initial position.

[0055] After the outer tube 5 is limited by the support platform 11, the air hole 19 will be just flush with the upper end surface of the chip. The chip packaging machine 4 that continues to move downward will first drive the rack 30 to slide downward, and the rack 30 will drive the second gear 29 to rotate. The second gear 29 will drive the passive gear 27 to rotate through the first gear 28, and the passive gear 27 will drive the annular cover 26 to rotate. The annular cover 26 will drive the two rotating tubes 21 to revolve around the axis of the outer tube 5, and drive the ring 20 to rotate on the outer wall of the outer tube 5. The rotating tube 21 will drive the driven gear 24 to roll along the annular gear 25, so the driven gear 24 will drive the rotating tube 21 to rotate, and the rotating tube 21 will drive the internal fan blades 22 and the filter element 23 to rotate. One of the rotating tubes 21 One will inhale air into the outer tube 5 through the air vent 19, while the other will exhaust air into the outer tube 5 through the air vent 19, so that the dust on the surface of the chip can be blown out and filtered through the filter element 23, thereby preventing the dust from affecting the chip, and the two rotating tubes 21 revolving around the axis of the outer tube 5 will perform comprehensive air blowing and cleaning on the chip from multiple angles, so that the chip can be fully dusted, the chip is more neat, and the quality control is higher. When the chip packaging machine 4 is reset upward, the rack 30 will drive the second gear 29 to rotate reversely. Since the second gear 29 is installed on the first gear 28 through a one-way bearing, the second gear 29 will not drive the first gear 28 to reverse, thereby preventing the dust in the filter element 23 from being blown onto the chip again.

[0056] After the outer tube 5 is pressed down, the trumpet-shaped skirt 7 at the lower end of the outer tube 5 will eventually rest on the annular limiting plate 14, and the conical wheel 31 will rest on the four sides of the annular limiting plate 14. When the annular cover 26 rotates, the annular cover 26 will drive the conical wheel 31 to roll along the edge of the annular limiting plate 14 through the bracket 32, so that the outer tube 5 can be more efficiently placed on the cylindrical placement table 8, reducing the occurrence of jamming and improving the efficiency and effect of automatic alignment.

[0057] When the conveyor belt 18 is transported to the driving wheel position, the support platform 11 can be rotated on the support 15 by the rotating rod 16, so as to prevent the support platform 11 from being twisted by the bent conveyor belt 18. When the support platform 11 moves from the bottom of the chip packaging machine 4 to the next workstation, the conveying conveyor belt 18 will drive the internal elastic airbag 33 to press against the pressure plate 37, and the elastic airbag 33 will transport the internal gas to the device groove 34 through the hose 36. The lifting column 35 in the device groove 34 will be lifted upward under the action of air pressure, thereby ejecting the chip in the placement groove 9, thereby facilitating the subsequent removal of the chip and the heat dissipation of the chip itself.

[0058] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A high-precision chip packaging automatic alignment and calibration device, comprising a processing table (1), characterized in that: Also includes: A top frame (2) is fixedly connected to the top of the processing table (1). Wherein, a lifting device (3) is fixedly mounted on the top frame (2), and a chip packaging machine (4) is fixedly mounted on the telescopic end of the lifting device (3); a conveyor belt (18) fixedly mounted on the processing table (1), Wherein, a plurality of columnar placement platforms (8) arranged at equal intervals are installed on the conveyor belt (18), each columnar placement platform (8) is provided with a placement groove (9), and an alignment component for driving the columnar placement platform (8) to align with the chip packaging machine (4) is provided on the conveyor belt (18); The alignment component comprises a support platform (11) connected to a conveyor belt (18), the support platform (11) being provided with a circular groove (12), the columnar placement platform (8) being arranged in the circular groove (12), and alignment springs (13) being installed between the periphery of the columnar placement platform (8) and the inner wall of the circular groove (12), The outer wall sliding sleeve at the lower end of the chip packaging machine (4) is provided with an outer tube (5), the inner diameter of the outer tube (5) is the same as the outer diameter of the columnar placement platform (8), a lifting spring (6) is installed between the outer tube (5) and the top of the chip packaging machine (4), the upper end of the columnar placement platform (8) is provided with a chamfer (10) around the periphery, and the lower end of the outer tube (5) is fixedly provided with a trumpet-shaped skirt (7); The lower end of the outer tube (5) is provided with air holes (19) around its periphery; the outer wall of the lower end of the outer tube (5) is rotatably connected to a circular ring (20) for blocking the air holes (19); both sides of the circular ring (20) are rotatably connected to rotating tubes (21) communicating with its inner cavity; the rotating tube (21) is fixedly mounted with fan blades (22) and a filter element (23); and the outer wall of the outer tube (5) is provided with a linkage portion for driving the circular ring (20) to rotate; The linkage portion comprises a first gear (28) rotatably connected to the outer wall of the outer tube (5); the outer wall of the outer tube (5) is rotatably connected to an annular cover (26); a driven gear (27) meshing with the first gear (28) is fixedly mounted on the annular cover (26); The end of the rotating tube (21) is rotatably connected to the annular cover (26), the shaft end of the first gear (28) is mounted with a second gear (29) via a one-way bearing, and a rack (30) meshingly connected to the second gear (29) is fixedly mounted on the chip packaging machine (4).

2. The high-precision chip packaging automatic alignment and calibration device according to claim 1, characterized in that: A driven gear (24) is fixedly mounted on the outer wall of the rotating tube (21), and a ring gear (25) meshingly connected with the driven gear (24) is fixedly mounted on the outer wall of the outer tube (5).

3. The high-precision chip packaging automatic alignment and calibration device according to claim 2, characterized in that: The lower end of the annular cover (26) is rotatably mounted with a plurality of circumferentially distributed conical wheels (31) via a bracket (32); the outer wall of the columnar placement platform (8) is fixedly connected with an annular limiting plate (14); when the outer tube (5) moves downward, the plurality of conical wheels (31) surround the annular limiting plate (14).

4. The high-precision chip packaging automatic alignment and calibration device according to claim 1, characterized in that: The conveyor belt (18) is fixedly connected to a support (15), the support platform (11) is rotatably connected to the support (15) via a rotating rod (16), and the conveyor belt (18) is fixedly connected to support plates (17) that abut against both sides of the lower end of the support platform (11).

5. The high-precision chip packaging automatic alignment and calibration device according to claim 1, characterized in that: The inner bottom of the placement groove (9) is provided with a device groove (34), and a lifting column (35) is longitudinally slidably connected in the device groove (34). The bottom of the conveyor belt (18) is provided with a positive pressure part for blowing air into the device groove (34).

6. The high-precision chip packaging automatic alignment and calibration device according to claim 5, characterized in that: The positive pressure section comprises an elastic airbag (33) fixedly mounted on the inner wall of the conveyor belt (18); the elastic airbag (33) is connected to the device groove (34) via a hose (36); and a pressure plate (37) in close contact with the inner wall of the conveyor belt (18) is fixedly connected to the processing table (1).

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