High-heat-dissipation flanging type copper strip frame structure

Abstract

The invention provides a high-heat-dissipation flanging type copper strip frame structure which comprises a frame body, and the surface of the frame body is sequentially connected with frame carriers from left to right. The plurality of flanged copper strips are respectively arranged on the surfaces of the plurality of frame carriers, and a copper strip folding lug is arranged on one side of the surface of each flanged copper strip; the chip main body is arranged on the surface of the edge folding type copper strip and located on one side of the copper strip folding lug, a plurality of copper strip glue locking holes are transversely and longitudinally formed in the surface of the edge folding type copper strip, and a plurality of elastic piece supporting feet are sequentially arranged on the surface of the frame main body from left to right. According to the high-heat-dissipation edge-folded type copper strip frame structure provided by the invention, in the aspect of electrical performance, resistance is reduced, heat generation is reduced, a relatively high packaging resistance value caused by metal wire connection can be avoided, so that heat generated when current passes through is reduced, the performance and the stability of a chip are favorably improved, and the service life of the chip is prolonged. And the limitation of the conductive performance of the metal wire is broken through.

Description

Technical Field

[0001] The invention relates to the field of semiconductor packaging, and in particular to a high heat dissipation folded edge copper strip frame structure. Background Art

[0002] Copper ribbon bonding is a packaging process that uses solid copper bridges welded to solder to connect the chip and pins.

[0003] Limitations of traditional bonding packaging methods:

[0004] Electrical performance

[0005] In traditional chip packaging processes, standard wire bonding is often used between chips and pins. This method uses metal wires as connecting materials, which usually results in higher packaging resistance values. Higher resistance values ​​will generate more heat when current passes through, affecting the performance and stability of the chip. At the same time, due to the limitations of the conductive properties of metal wires, the amount of current they can carry is also relatively limited, which cannot meet some chip application scenarios with higher current requirements.

[0006] Thermal conductivity

[0007] The traditional wire bonding method also has shortcomings in thermal conductivity. The thermal conductivity of metal wires is relatively low, which is not conducive to the rapid dissipation of heat generated when the chip is working. The accumulation of heat inside the chip will cause the chip temperature to be too high, which in turn affects the reliability and life of the chip.

[0008] Cost

[0009] In the traditional wire bonding process, the lead pin welding point usually needs to be silver-plated. The silver plating process not only increases the production cost, but also the silver plating process is complicated and prone to poor silver plating. Poor silver plating will lead to reduced welding quality, affecting the chip packaging quality and performance, further increasing production costs and product defective rates.

[0010] Therefore, it is necessary to provide a high heat dissipation folded edge copper strip frame structure to solve the above technical problems. Summary of the invention

[0011] The present invention provides a high heat dissipation folded edge copper tape frame structure, which solves the problems of poor electrical performance, poor thermal conductivity and high cost easily caused by traditional bonding packaging methods.

[0012] In order to solve the above technical problems, the present invention provides a high heat dissipation folded edge copper strip frame structure, comprising:

[0013] A frame body, wherein frame carriers are sequentially connected to the surface of the frame body from left to right;

[0014] A plurality of folded-edge copper strips, wherein the plurality of folded-edge copper strips are respectively arranged on the surfaces of the plurality of frame carriers, and a copper strip folding ear is arranged on one side of the surface of the folded-edge copper strip;

[0015] The chip body is arranged on the surface of the folded-edge copper strip and is located on one side of the folded ear of the copper strip.

[0016] Preferably, a plurality of copper tape glue locking holes are provided in the horizontal and vertical directions on the surface of the folded edge copper tape.

[0017] Preferably, a plurality of spring support legs are sequentially arranged on the surface of the frame body from left to right.

[0018] Preferably, the plurality of copper tape glue locking holes are used for bonding the frame carrier and the folded edge copper tape.

[0019] Preferably, a plurality of frame positioning holes are sequentially opened on the surface of the frame body from left to right.

[0020] Preferably, a protective cover is provided on the surface of the frame carrier.

[0021] Preferably, a plurality of partition components are provided on the surface of the folded-edge copper strip, and the partition components are separated, and an adhesive strip is provided at the bottom of the partition block, and the adhesive strip is adhered to the surface of the folded-edge copper strip.

[0022] Preferably, a rubber pad is bonded to the surface of the separation block, and the separation block and the rubber pad are used for heat dissipation between the chip body and the folded-edge copper tape.

[0023] Preferably, a movable component is provided on the surface of the folded-edge copper strip, and the movable component includes two rectangular blocks, and mounting grooves are provided on opposite sides of the two rectangular blocks, mounting blocks are provided inside the two mounting grooves, and a movable stopper is connected between the two mounting blocks via a connecting block.

[0024] Preferably, a fixing component is provided on the surface of the folded-edge copper strip, and the fixing component includes a fixing frame, fixing strips are provided on both sides of the surface of the fixing frame, and a rubber strip is provided between the fixing frame and the fixing strip.

[0025] Compared with the related art, the high heat dissipation folded edge copper strip frame structure provided by the present invention has the following beneficial effects:

[0026] The present invention provides a high heat dissipation folded edge copper strip frame structure.

[0027] Electrical performance: reducing resistance and heat generation can avoid the higher package resistance caused by the use of metal wire connections, thereby reducing the heat generated when current passes through, which helps to improve the performance and stability of the chip.

[0028] Improve current carrying capacity: break through the limitations of metal wire conductivity, meet some chip application scenarios with high current requirements, and ensure the normal operation of the chip in a high current working environment.

[0029] Thermal conductivity: Enhance heat dissipation, improve reliability, and improve thermal conductivity so that the heat generated by the chip when it is working can be quickly dissipated to avoid heat accumulation inside the chip, thereby improving the reliability and life of the chip.

[0030] Cost: Reduce production costs. There is no need to silver-plate the lead pins, which saves the cost of the silver-plating process and avoids the additional costs caused by poor silver plating, including the increased costs of packaging quality and performance problems caused by reduced welding quality, thereby reducing the total cost of chip packaging. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 A schematic structural diagram of a first embodiment of a high heat dissipation folded edge copper strip frame structure provided by the present invention;

[0032] Figure 2 for Figure 1 The structural schematic diagram of the spring support foot shown;

[0033] Figure 3 for Figure 1 The structural schematic diagram of the frame carrier shown;

[0034] Figure 4 for Figure 1 The schematic diagram of the structure installed between the frame carrier and the chip body shown;

[0035] Figure 5 for Figure 1 A side view of the device as a whole is shown;

[0036] Figure 6 for Figure 5 A schematic diagram of the overall external three-dimensional structure of the device shown;

[0037] Figure 7 A schematic structural diagram of a second embodiment of a high heat dissipation folded edge copper strip frame structure provided by the present invention;

[0038] Figure 8 for Figure 7 An enlarged schematic diagram of part A is shown;

[0039] Fig. 9 A schematic structural diagram of a third embodiment of a high heat dissipation folded edge copper strip frame structure provided by the present invention;

[0040] Fig.10 for Fig. 9 An enlarged schematic diagram of part B is shown;

[0041] Fig.11 A schematic structural diagram of a fourth embodiment of a high heat dissipation folded edge copper strip frame structure provided by the present invention;

[0042] Fig.12 for Fig.11 An enlarged schematic diagram of part C is shown.

[0043] Numbers in the figure: 1. Frame body; 2. Frame carrier; 3. Folded copper belt; 4. Folding ears of copper belt; 5. Glue lock hole of copper belt; 6. Spring support foot; 7. Frame positioning hole; 8. Chip body; 9. Protective cover;

[0044] 10. partition assembly; 101. partition block; 102. adhesive strip; 103. rubber pad;

[0045] 11. movable assembly; 111. rectangular block; 112. mounting groove; 113. mounting block; 114. movable stopper;

[0046] 12. fixing assembly; 121. fixing frame; 122. fixing strip; 123. adhesive strip. DETAILED DESCRIPTION

[0047] The present invention will be further described below in conjunction with the accompanying drawings and implementation modes.

[0048] First embodiment

[0049] Please refer to Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6 ,in, Figure 1 A schematic structural diagram of a first embodiment of a high heat dissipation folded edge copper strip frame structure provided by the present invention; Figure 2 for Figure 1 The structural schematic diagram of the spring support foot shown; Figure 3 for Figure 1 The structural schematic diagram of the frame carrier shown;

[0050] Figure 4 for Figure 1 The schematic diagram of the structure installed between the frame carrier and the chip body shown; Figure 5 for Figure 1 A side view of the device as a whole is shown; Figure 6 for Figure 5 A high heat dissipation folded edge copper tape frame structure, comprising:

[0051] A frame body 1, wherein frame carriers 2 are sequentially connected to the surface of the frame body 1 from left to right;

[0052] A plurality of folded-edge copper strips 3, wherein the plurality of folded-edge copper strips 3 are respectively arranged on the surfaces of the plurality of frame carriers 2, and a copper strip folding ear 4 is arranged on one side of the surface of the folded-edge copper strips 3;

[0053] The chip body 8 is arranged on the surface of the folded copper belt 3 and located on one side of the folded ear 4 of the copper belt.

[0054] The surface of the folded copper tape 3 is provided with a plurality of copper tape glue locking holes 5 in both horizontal and vertical directions.

[0055] A plurality of spring support legs 6 are sequentially arranged on the surface of the frame body 1 from left to right.

[0056] The plurality of copper tape glue locking holes 5 are used for bonding the frame carrier 2 and the folded edge copper tape 3 .

[0057] A plurality of frame positioning holes 7 are sequentially opened on the surface of the frame body 1 from left to right.

[0058] A protective cover 9 is provided on the surface of the frame carrier 2 .

[0059] The newly designed copper tape folding structure adopts a glue locking hole design to enhance the bonding and locking strength between the injection-molded epoxy resin, the copper tape and the chip. It can also promote the discharge of volatile gases on the contact surface between the copper tape and the chip, thereby accelerating production efficiency.

[0060] The newly designed copper tape frame adopts a frame spring support foot design, which can effectively prevent the external packaging force from squeezing and deforming the copper tape unit during the winding process.

[0061] Compared with the conventional flat type, the glue locking area after plastic sealing is increased, and the heat dissipation area is increased. When the product is subjected to large voltage and current applications, it can effectively play a role in heat dissipation and enhance structural stability.

[0062] Compared with the related art, the high heat dissipation folded edge copper strip frame structure provided by the present invention has the following beneficial effects:

[0063] The present invention provides a high heat dissipation folded edge copper strip frame structure.

[0064] Electrical performance: reducing resistance and heat generation can avoid the higher package resistance caused by the use of metal wire connections, thereby reducing the heat generated when current passes through, which helps to improve the performance and stability of the chip.

[0065] Improve current carrying capacity: break through the limitations of metal wire conductivity, meet some chip application scenarios with high current requirements, and ensure the normal operation of the chip in a high current working environment.

[0066] Thermal conductivity: Enhance heat dissipation, improve reliability, and improve thermal conductivity so that the heat generated by the chip when it is working can be quickly dissipated to avoid heat accumulation inside the chip, thereby improving the reliability and life of the chip.

[0067] Cost: Reduce production costs. There is no need to silver-plate the lead pins, which saves the cost of the silver-plating process and avoids the additional costs caused by poor silver plating, including the increased costs of packaging quality and performance problems caused by reduced welding quality, thereby reducing the total cost of chip packaging.

[0068] Second embodiment

[0069] Please refer to Figure 7 and Figure 8 Based on the high heat dissipation folded edge copper strip frame structure provided by the first embodiment of the present application, the second embodiment of the present application proposes another high heat dissipation folded edge copper strip frame structure. The second embodiment is only a preferred embodiment of the first embodiment, and the implementation of the second embodiment will not affect the independent implementation of the first embodiment.

[0070] Specifically, the difference of the high heat dissipation folded copper strip frame structure provided in the second embodiment of the present application is that, in a high heat dissipation folded copper strip frame structure, a plurality of partition components 10 are arranged on the surface of the folded copper strip 3, and the partition component 10 includes a partition 101, and an adhesive strip 102 is arranged at the bottom of the partition block 101, and the adhesive strip 102 is bonded to the surface of the folded copper strip 3.

[0071] A rubber pad 103 is bonded to the surface of the separation block 101 , and the separation block 101 and the rubber pad 103 are used for heat dissipation between the chip body 8 and the folded copper tape 3 .

[0072] The rubber pad 103 is made of graphite material and can play a role in conducting electricity. The use of the rubber pad 103 can play a role in buffering protection and increasing friction when the chip body 8 is connected to the surface of the folded copper belt 3 .

[0073] The working principle of a high heat dissipation folded edge copper strip frame structure provided by the present invention is as follows:

[0074] When in use, after the chip body 8 is installed between multiple partition blocks 101 on the surface of the folded copper tape 3, when the chip body 8 works for a long time and generates heat, the heat flows through the gaps between the multiple partition blocks 101 and the folded copper tape 3.

[0075] Compared with the related art, the high heat dissipation folded edge copper strip frame structure provided by the present invention has the following beneficial effects:

[0076] The present invention provides a high heat dissipation folded copper tape frame structure, in which a plurality of partition blocks 101 with adhesive strips 102 and rubber pads 103 are arranged on the surface of the folded copper tape 3. When the chip body 8 is installed on the surface of the folded copper tape 3, the distance between the chip body 8 and the folded copper tape 3 can be reduced, thereby allowing heat to flow.

[0077] Third embodiment

[0078] Please refer to Fig. 9 and Fig.10 Based on the high heat dissipation folded edge copper belt frame structure provided by the first embodiment of the present application, the third embodiment of the present application proposes another high heat dissipation folded edge copper belt frame structure. The third embodiment is only a preferred embodiment of the first embodiment, and the implementation of the third embodiment will not affect the independent implementation of the first embodiment.

[0079] Specifically, the difference of a high heat dissipation folded-edge copper strip frame structure provided in the third embodiment of the present application is that, in a high heat dissipation folded-edge copper strip frame structure, a movable component 11 is provided on the surface of the folded-edge copper strip 3, and the movable component 11 includes two rectangular blocks 111, and mounting grooves 112 are provided on opposite sides of the two rectangular blocks 111, and mounting blocks 113 are provided inside the two mounting grooves 112, and a movable stopper 114 is connected between the two mounting blocks 113 through a connecting block.

[0080] The rectangular block 111 is connected to the surface of the folded copper strip 3. The use of the mounting groove 112 and the mounting block 113 facilitates the movable adjustment of the movable stopper 114, which is a thin sheet.

[0081] The working principle of a high heat dissipation folded edge copper strip frame structure provided by the present invention is as follows:

[0082] When in use, after the chip body 8 is bonded to the surface of the folded copper tape 3 , the movable stopper 114 is pushed to move to contact one side of the chip body 8 under the action of the mounting block 113 and the mounting groove 112 for fixing.

[0083] Compared with the related art, the high heat dissipation folded edge copper strip frame structure provided by the present invention has the following beneficial effects:

[0084] The present invention provides a high heat dissipation folded copper belt frame structure, wherein a movable component 11 is arranged on the surface of the folded copper belt 3 so that chip bodies 8 of different sizes can be squeezed and fixed after being installed on the surface of the folded copper belt 3 .

[0085] Fourth embodiment

[0086] Please refer to Fig.11 and Fig.12Based on the high heat dissipation folded edge copper strip frame structure provided by the first embodiment of the present application, the fourth embodiment of the present application proposes another high heat dissipation folded edge copper strip frame structure. The fourth embodiment is only a preferred embodiment of the first embodiment, and the implementation of the fourth embodiment will not affect the independent implementation of the first embodiment.

[0087] Specifically, the difference of the high heat dissipation folded copper strip frame structure provided in the fourth embodiment of the present application is that, in a high heat dissipation folded copper strip frame structure, a fixing component 12 is provided on the surface of the folded copper strip 3, and the fixing component 12 includes a fixing frame 121, and fixing strips 122 are provided on both sides of the surface of the fixing frame 121, and a rubber strip 123 is provided between the fixing frame 121 and the fixing strip 122.

[0088] The use of adhesive strip 123 facilitates bonding of fixing strip 122 to the surface of fixing frame 121. The use of fixing strip 122 facilitates preventing chip body 8 from falling after chip body 8 is installed inside fixing frame 121. Fixing frame 121 is connected to the surface of folded copper tape 3.

[0089] The working principle of a high heat dissipation folded edge copper strip frame structure provided by the present invention is as follows:

[0090] When in use, after the chip body 8 is bonded to the surface of the folded copper tape 3 and located inside the fixing frame 121 , the fixing strip 122 is bonded to the surface of the fixing frame 121 through the adhesive strip 123 .

[0091] Compared with the related art, the high heat dissipation folded edge copper strip frame structure provided by the present invention has the following beneficial effects:

[0092] The present invention provides a high heat dissipation folded copper belt frame structure, wherein a fixing component 12 is arranged between the folded copper belt 3 and the chip body 8 so as to limit the chip body 8 after it is installed inside the folded copper belt 3, thereby preventing the chip body 8 from loosening.

[0093] The above descriptions are merely embodiments of the present invention and are not intended to limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A high heat dissipation folded edge copper belt frame structure, characterized in that: include: A frame body, wherein frame carriers are sequentially connected to the surface of the frame body from left to right; A plurality of folded-edge copper strips, wherein the plurality of folded-edge copper strips are respectively arranged on the surfaces of the plurality of frame carriers, and a copper strip folding ear is arranged on one side of the surface of the folded-edge copper strip; The chip body is arranged on the surface of the folded-edge copper strip and is located on one side of the folded ear of the copper strip.

2. The high heat dissipation folded edge copper strip frame structure according to claim 1, characterized in that: A plurality of copper belt glue locking holes are arranged horizontally and vertically on the surface of the folded edge copper belt.

3. The high heat dissipation folded edge copper strip frame structure according to claim 1, characterized in that: A plurality of spring support legs are arranged in sequence from left to right on the surface of the frame body.

4. The high heat dissipation folded edge copper strip frame structure according to claim 1, characterized in that: The plurality of copper tape glue locking holes are used for bonding the frame carrier and the folded edge copper tape.

5. The high heat dissipation folded edge copper strip frame structure according to claim 1, characterized in that: A plurality of frame positioning holes are sequentially opened on the surface of the frame body from left to right.

6. The high heat dissipation folded edge copper strip frame structure according to claim 1, characterized in that: A protective cover is provided on the surface of the frame carrier.

7. The high heat dissipation folded edge copper strip frame structure according to claim 1, characterized in that: A plurality of partition components are arranged on the surface of the folded-edge copper strip, and the partition components are separated, and an adhesive strip is arranged at the bottom of the partition block, and the adhesive strip is adhered to the surface of the folded-edge copper strip.

8. The high heat dissipation folded edge copper strip frame structure according to claim 7, characterized in that: A rubber pad is bonded to the surface of the separation block, and the separation block and the rubber pad are used for heat dissipation between the chip body and the folded-edge copper tape.

9. The high heat dissipation folded edge copper strip frame structure according to claim 1, characterized in that: A movable component is arranged on the surface of the folded copper strip, and the movable component includes two rectangular blocks, and mounting grooves are provided on opposite sides of the two rectangular blocks, and mounting blocks are arranged inside the two mounting grooves, and a movable stopper is connected between the two mounting blocks through a connecting block.

10. The high heat dissipation folded edge copper strip frame structure according to claim 1, characterized in that: A fixing component is arranged on the surface of the folded copper strip, and the fixing component comprises a fixing frame, fixing strips are arranged on both sides of the surface of the fixing frame, and a rubber strip is arranged between the fixing frame and the fixing strip.

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