Temperature measuring device of semiconductor processing device, adjusting method of temperature measuring device and installation calibration method of temperature measuring device

Abstract

The invention discloses a temperature measuring device of a semiconductor processing device and an adjusting method and an installation calibration method of the temperature measuring device, the temperature measuring device adopts a rotary joint assembly to install a temperature sensor, and the temperature measuring line of the temperature sensor can be adjusted by adjusting the relative position between an installation flange pipe and a ball head flange pipe in the rotary joint assembly. The temperature measuring line is perpendicular to the surface of a component to be subjected to temperature measurement, the temperature measuring accuracy is guaranteed, the installation flange pipe and the ball flange pipe in the rotating connector assembly can rotate by 360 degrees, the adjusting range is wide, and operability is high. According to the invention, the temperature measurement calibration device is adopted to correct the temperature measurement device, and after the temperature sensor is determined to be aligned with the position of the component to be subjected to temperature measurement, the temperature sensor can be directly replaced subsequently without being corrected again, so that the installation repeatability and the consistency of temperature measurement are ensured, and the stability of process manufacturing is further ensured.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing, and in particular to a temperature measuring device for a semiconductor processing device and an adjustment method and an installation and calibration method thereof. Background Art

[0002] When a semiconductor processing device is used to process a substrate, some processes require that the substrate be heated to a desired temperature. In order to monitor the substrate temperature and the temperature inside the reaction chamber, a temperature sensor is used to detect the substrate temperature and the temperature inside the reaction chamber. The temperature sensor is usually an infrared pyrometer, which is fixed on the shell of the reaction chamber. Since the temperature sensor is embedded in an opening on the shell of the reaction chamber, the temperature sensor is almost unable to move. Therefore, the position of the temperature measuring line of the temperature sensor pointing to the part to be measured is generally relatively fixed, and the adjustability is poor, which cannot meet the requirements of measuring the temperature at different positions of the part to be measured. Due to the lack of adjustment means to make the temperature measuring line of the temperature sensor point vertically to the part to be measured, it is also impossible to ensure that the temperature sensor can be aligned with the same position of the part to be measured after each disassembly and reinstallation of the temperature sensor, resulting in poor temperature measurement accuracy and repeatability.

[0003] The statements herein merely provide background art related to the present invention and do not necessarily constitute prior art. Summary of the invention

[0004] The object of the present invention is to provide a temperature measuring device for a semiconductor processing device, an adjustment method and an installation and calibration method thereof, so as to realize the universal adjustment of the 360-degree sphere of the infrared pyrometer, ensure the temperature measurement accuracy and stability, improve the operability, and ensure the installation repeatability.

[0005] In order to achieve the above object, the present invention provides a temperature measuring device for measuring the temperature of a component to be measured in a semiconductor processing device, comprising: a rotary joint assembly and a temperature sensor;

[0006] The rotary joint assembly comprises: a mounting flange pipe and a ball head flange pipe;

[0007] One end of the mounting flange pipe is fixedly mounted on the semiconductor processing device;

[0008] One end of the ball head flange pipe is connected to the temperature sensor;

[0009] The other end of the mounting flange tube has a spherical inner wall, and the other end of the ball head flange tube has a spherical outer wall adapted to the spherical inner wall. The spherical inner wall of the mounting flange tube is sleeved on the outside of the spherical outer wall of the ball head flange tube, and the spherical outer wall of the ball head flange tube can rotate within the spherical inner wall of the mounting flange tube.

[0010] There are multiple angles between the ball head flange tube and the mounting flange tube that are not in the same plane.

[0011] The mounting flange tube comprises: a ball head fixing flange, the ball head fixing flange has a spherical inner wall, and the ball head fixing flange is sleeved on the outside of the spherical outer wall of the ball head flange tube.

[0012] The ball head fixing flange is provided with an adjusting fastener, and the spherical inner wall of the ball head fixing flange and the spherical outer wall of the ball head flange tube are allowed to have a gap or be in close contact by loosening or tightening the adjusting fastener.

[0013] The rotary joint assembly also includes: a liner, which is arranged between the spherical inner wall of the mounting flange tube and the spherical outer wall of the ball head flange tube, and between the ball head fixing flange and the spherical outer wall of the ball head flange tube, and the liner is adapted to the spherical inner wall and the spherical outer wall of the mounting flange tube, and to the ball head fixing flange and the spherical outer wall.

[0014] The ball head flange pipe is connected to the temperature sensor via a connecting flange. The connecting flange is provided with a cooling channel, and a cooling medium is introduced into the cooling channel.

[0015] The rotary joint assembly comprises: at least three position adjustment assemblies, the position adjustment assembly comprises: an adjustment fixing rod, one end of which is fixedly connected to the ball head fixing flange, and the adjustment fixing rod has at least one adjustment hole; a universal adjustment rod, which is arranged in the adjustment hole, and the universal adjustment rod can move in the adjustment hole to make the universal adjustment rod be in an unlocked position or a locked position;

[0016] The unlocked position means that the end of the universal adjustment rod does not contact the tube wall of the ball head flange tube, and the ball head flange tube can swing axially in the mounting flange tube;

[0017] The locking position means that the end of the universal adjustment rod is in close contact with the tube wall of the ball head flange tube, and the ball head flange tube cannot swing axially in the mounting flange tube.

[0018] The adjusting hole has an internal thread, and the universal adjusting rod has an external thread. The universal adjusting rod and the adjusting hole are connected by threads to achieve movement of the universal adjusting rod between the adjusting holes.

[0019] The plurality of position adjustment components are evenly distributed on the circumference of the tube wall of the ball head flange tube.

[0020] The temperature measuring device comprises: a temperature sensor fixing sleeve, wherein the temperature sensor fixing sleeve is arranged outside the temperature sensor, and the temperature sensor fixing sleeve has a flange portion, and the flange portion is connected to the connecting flange of the ball head flange pipe.

[0021] The temperature measuring device comprises: a positioning device, and the positioning device comprises:

[0022] A positioning pin, which is arranged on the connecting flange of the ball head flange pipe;

[0023] The first positioning hole is located at the flange portion of the temperature sensor fixing sleeve and is used to accommodate the positioning pin.

[0024] The present invention also provides a method for adjusting a temperature measuring device, comprising the following steps:

[0025] Loosen and adjust the fasteners to allow a gap to exist between the ball head fixing flange and the ball head flange tube;

[0026] Moving the universal adjustment levers in the plurality of position adjustment assemblies to an unlocked position;

[0027] After the ball head flange tube is adjusted to the target position, the universal adjustment rods in the plurality of position adjustment assemblies are moved to the locking position;

[0028] Tighten the adjusting fastener to make the ball head fixing flange and the ball head flange tube in close contact and press the spherical outer wall of the ball head flange tube. At this time, the spherical outer wall of the ball head flange tube cannot move.

[0029] The present invention also provides a semiconductor processing device, comprising:

[0030] A reaction chamber surrounded by an upper chamber cover, a lower chamber cover and an intermediate base ring, wherein the upper chamber cover and the lower chamber cover are made of quartz material;

[0031] A base disposed in the reaction chamber, the base being used to carry a substrate;

[0032] a plurality of heaters disposed outside the reaction chamber;

[0033] An air inlet and an air outlet are arranged on the intermediate base ring;

[0034] The temperature measuring device.

[0035] The temperature measuring device is arranged outside the reaction chamber, and the temperature measuring device is connected to the upper chamber cover and / or the lower chamber cover.

[0036] The semiconductor processing device further includes: an upper chamber shell and a lower chamber shell, which are respectively arranged on the outer sides of the upper chamber cover and the lower chamber cover, and the upper chamber shell and the lower chamber shell are made of metal material.

[0037] The upper chamber shell and / or the lower chamber shell is provided with a temperature measuring hole, a transparent observation window is arranged in the temperature measuring hole, and the temperature measuring device is installed at the temperature measuring hole.

[0038] The angle between the temperature measuring device and the upper chamber cover and / or the lower chamber cover is 45° to 90°.

[0039] The angle between the temperature measuring device and the upper chamber shell and / or the lower chamber shell is 45° to 90°.

[0040] The semiconductor processing device includes: a temperature measurement and calibration device, which includes: a calibrator and a calibrator fixing sleeve, wherein the calibrator fixing sleeve is arranged on the outside of the calibrator, and the calibrator fixing sleeve has a flange, which is connected to the connecting flange of the ball head flange tube in the temperature measuring device, and the flange has a second positioning hole, which is used to accommodate the positioning pin on the connecting flange of the ball head flange tube.

[0041] The calibrator is at least one of a visible laser, a laser rangefinder, a visible lens, or a marking camera.

[0042] The present invention also provides a method for installing and calibrating a temperature measuring device in a semiconductor processing device, comprising the following steps:

[0043] installing a mounting flange pipe to the semiconductor processing device;

[0044] Installing the ball head flange pipe into the interior of the mounting flange pipe;

[0045] Install the temperature measurement calibration device onto the ball head flange tube, insert the positioning pin on the connecting flange of the ball head flange tube into the second positioning hole on the flange of the calibrator fixing sleeve;

[0046] The temperature measuring device adjustment method is used to align the target point or the marking point of the calibrator of the temperature measuring calibration device with the designated area of ​​the component to be measured in the semiconductor processing device;

[0047] Remove the temperature measuring calibration device from the ball head flange pipe in the rotary joint assembly;

[0048] The temperature sensor is mounted on the ball head flange tube through the temperature sensor fixing sleeve, and the positioning pin on the connecting flange of the ball head flange tube is inserted into the first positioning hole on the flange part of the temperature sensor fixing sleeve.

[0049] The present invention uses a rotary joint assembly to install a temperature sensor. By adjusting the relative position between the mounting flange tube and the ball head flange tube in the rotary joint assembly, a 360-degree universal adjustment of the sphere of the temperature sensor can be achieved. The temperature measuring line can be made perpendicular to the object to be measured by adjustment, thereby ensuring the accuracy of temperature measurement. The mounting flange tube and the ball head flange tube in the rotary joint assembly can be rotated 360 degrees, with a wide adjustment range and strong operability. The present invention uses a temperature measurement calibration device to calibrate the temperature measuring device. After determining the position of the temperature sensor aligned with the component to be measured, the temperature sensor can be directly replaced without the need for recalibration, thereby ensuring installation repeatability and consistency of temperature measurement, thereby ensuring the stability of the process. BRIEF DESCRIPTION OF THE DRAWINGS

[0050] Figure 1 It is a structural schematic diagram of a semiconductor processing device provided by the present invention.

[0051] Figure 2 It is a structural schematic diagram of a temperature measuring device provided by the present invention.

[0052] Figure 3 It is a schematic diagram of calibrating a temperature measuring device by a temperature measuring calibration device provided by the present invention. DETAILED DESCRIPTION

[0053] The following is based on Figure 1 to Figure 3 , specifically describe the preferred embodiments of the present invention.

[0054] like Figure 1As shown, the present invention provides a semiconductor processing device, comprising an intermediate base ring 1, an upper chamber cover 2 arranged on the upper side of the intermediate base ring 1, and a lower chamber cover 3 arranged on the lower side of the intermediate base ring 1, wherein the upper chamber cover 2 and the lower chamber cover 3 are both made of quartz material, and the intermediate base ring 1, the upper chamber cover 2 and the lower chamber cover 3 together form a reaction chamber 4 of the semiconductor processing device. An upper chamber shell 5 is disposed on the outer side of the upper chamber cover 2, and correspondingly, a lower chamber shell 6 is disposed on the outer side of the lower chamber cover 3. The upper chamber shell 5 and the lower chamber cover 3 together constitute the shell of the semiconductor processing device. The upper chamber shell 5 and the lower chamber cover 6 are both made of metal materials. The outer wall of the upper chamber cover 2 and the inner wall of the upper chamber shell 5 and the outer wall of the lower chamber cover 3 and the inner wall of the lower chamber shell 6 respectively form a receiving space 401 and 402. An air pressure regulating device (not shown) is disposed in the receiving space 401 and 402 to adjust the air pressure of the receiving space 401 and 402 to make it less than the atmospheric pressure. A base 7 is disposed in the reaction chamber 4, the upper surface of the base 7 is used to carry the substrate 8, and the lower surface of the base 7 is supported by a bracket 9, and the bracket 9 is used to drive the base 7 and the substrate 8 to rotate. An air inlet 10 and an air outlet 11 are disposed oppositely on the lateral sides of the intermediate base ring 1. The air inlet 10 is used to introduce process gas, and the air outlet 11 is used to discharge the residual gas after the treatment. A plurality of heaters are disposed outside the reaction chamber 4. Specifically, a first heater 12 is disposed in the accommodation space 401. The first heater 12 can be a heating lamp. The infrared radiation emitted outward by the first heater 12 can pass through the upper chamber cover 2 to reach the substrate 8, and heat the substrate 8 so that a chemical deposition reaction occurs in the process gas environment. A second heater 13 is disposed in the accommodation space 402 between the lower chamber cover 3 and the lower chamber shell 6. The second heater 13 can be a heating lamp. The infrared radiation emitted outward by the second heater 13 can pass through the lower chamber cover 3 to reach the base 7, and heat the base 7, thereby heating the substrate 8 to assist the film-forming reaction on the surface of the substrate 8.

[0055] A temperature measuring device 14 is arranged outside the reaction chamber 4. The number and the position of the temperature measuring device 14 are reasonably arranged according to the number of components to be measured and the specific positions where the components to be measured need to be measured. The component to be measured can be the substrate 8 or the base 7. The temperature measuring device 14 can be arranged on the upper chamber shell 5 and / or the lower chamber shell 6, or on the upper chamber cover 2 and / or the lower chamber cover 3.

[0056] Specifically, if Figure 2As shown, the upper chamber shell 5 and / or the lower chamber shell 6 are provided with a temperature measuring device installation panel 15, and the temperature measuring device installation panel 15 can be a separate component or a part of the chamber shell. The temperature measuring device installation panel 15 has a temperature measuring hole 16, and the temperature measuring device 14 is installed at the temperature measuring hole 16. When the temperature measuring device 14 is installed on the upper chamber cover 2 and / or the lower chamber cover 3, a transparent observation window 17 and a sealing mechanism (not shown) are provided in the temperature measuring hole 16, which can ensure the sealing of the reaction chamber 4 and will not block the temperature measuring line 191 emitted by the temperature measuring device 14 from passing through.

[0057] The temperature measuring device 14 includes a rotary joint assembly 18 and a temperature sensor 19, and the temperature sensor 19 is an infrared pyrometer. The rotary joint assembly 18 includes a mounting flange tube 20 and a ball flange tube 21, one end of the mounting flange tube 20 is fixedly mounted on the housing of the semiconductor processing device, and one end of the ball flange tube 21 is connected to the temperature sensor 19. Further, one end of the mounting flange tube 20 has a mounting flange 22, and the mounting flange tube 20 is fixedly mounted on the temperature measuring device mounting panel 15 through the mounting flange 22. The inner diameter of the tube body 23 of the mounting flange tube 20 is larger than the diameter of the temperature measuring hole 16, ensuring that the mounting surface of the mounting flange 22 can be fully and effectively contacted with the temperature measuring device mounting panel 15, ensuring the sealing of the reaction chamber 4. The mounting surface of the mounting flange 22 can be perpendicular to the tube body 23 of the mounting flange tube 20 or have a certain tilt angle, so that the temperature measuring device 14 as a whole and the upper chamber shell 5 and / or the lower chamber shell 6 also have a tilt angle, and then the temperature measuring device 14 as a whole and the upper chamber cover 2 and the lower chamber cover 3 also have a tilt angle, and then the temperature measuring line 191 emitted by the temperature measuring device 14 and the surface of the component to be measured also have a tilt angle, and the tilt angle is selected according to the deviation angle of the target point of the object to be measured to avoid the heater and the shielding components on its measurement path. In this embodiment, preferably, the angle between the temperature measuring device 14 and the upper chamber cover 2 and / or the lower chamber cover 3 can be 45° to 90°, and similarly, the angle between the temperature measuring device 14 and the upper chamber shell 5 and / or the lower chamber shell 6 can be 45° to 90°.

[0058] The other end of the mounting flange tube 20 has a spherical inner wall 24, and correspondingly, the other end of the ball-end flange tube 21 has a spherical outer wall 25 adapted to the spherical inner wall 24 of the mounting flange tube 20. The spherical inner wall 24 of the mounting flange tube 20 is adapted to the spherical outer wall 25 of the ball-end flange tube 21, so that the spherical outer wall 25 of the ball-end flange tube 21 can rotate 360 ​​degrees within the spherical inner wall 24 of the mounting flange tube 20, thereby changing the relative position of the ball-end flange tube 21 and the mounting flange tube 20. The change causes the position of the temperature sensor 19 fixed on the ball head flange tube 21 to change. By adjusting the relative position between the mounting flange tube 20 and the ball head flange tube 21 in the rotary joint assembly 18, the temperature measuring line 191 of the temperature sensor 19 can be adjusted to achieve perpendicularity between the temperature measuring line 191 and the surface of the component to be measured, thereby ensuring the accuracy of temperature measurement. The mounting flange tube 20 and the ball head flange tube 21 in the rotary joint assembly 18 can rotate 360 ​​degrees, with a wide adjustment range and strong operability.

[0059] The mounting flange tube 20 also includes a ball head fixing flange 26, which also has a spherical inner wall 261. The spherical inner wall 261 of the ball head fixing flange 26 is also compatible with the spherical inner wall 24 of the mounting flange tube 20. The ball head fixing flange 26 is sleeved on the outside of the spherical outer wall 25 of the ball head flange tube 21 and the spherical inner wall 24 of the mounting flange tube 20. The spherical inner wall 261 of the ball head fixing flange 26 and the spherical inner wall 24 of the mounting flange tube 20 together wrap the spherical outer wall 25 of the ball head flange tube 21. The ball head fixing flange 26 is provided with an adjusting fastener 27, and the adjusting fastener 27 is respectively connected to the ball head fixing flange 26 and one end of the mounting flange tube 20 having the spherical inner wall 24. The adjusting fastener 27 is loosened to allow a gap to exist between the ball head fixing flange 26 and the mounting flange tube 20. At this time, a gap also exists between the spherical inner wall 261 of the ball head fixing flange 26 and the spherical inner wall 24 of the mounting flange tube 20 and the spherical outer wall 25 of the ball head flange tube 21. The ball head flange tube 21 The spherical outer wall 25 can rotate freely in the spherical inner wall 24 of the mounting flange tube 20, and after tightening the adjusting fastener 27, the ball head fixing flange 26 and the mounting flange tube 20 are in close contact, so that the spherical inner wall 261 of the ball head fixing flange 26 and the spherical inner wall 24 of the mounting flange tube 20 press the spherical outer wall 25 of the ball head flange tube 21, so that the position of the spherical outer wall 25 of the ball head flange tube 21 is fixed and cannot rotate freely in the spherical inner wall 24 of the mounting flange tube 20.

[0060] The rotary joint assembly 18 also includes at least three position adjustment assemblies 30, and the plurality of position adjustment assemblies 30 can be evenly distributed on the circumference of the tube wall of the ball head flange tube 21. Each position adjustment assembly 30 includes an adjustment fixing rod 31 and a universal adjustment rod 32, one end of the adjustment fixing rod 31 is fixedly connected to the ball head fixing flange 26, the adjustment fixing rod 31 has at least one adjustment hole 311, the universal adjustment rod 32 is arranged in the adjustment hole 311, the adjustment hole 311 has an internal thread, the universal adjustment rod 32 has an external thread, the universal adjustment rod 32 and the adjustment hole 311 are connected by threads, the universal adjustment rod 32 can move in the adjustment hole 311, so that the universal adjustment rod 311 is located in an unlocking position or a locking position. The unlocked position means that the end of the universal adjustment rod 32 does not contact the tube wall of the ball head flange tube 21, and the ball head flange tube 21 can swing axially in the mounting flange tube 20; the locked position means that the end of the universal adjustment rod 32 is in close contact with the tube wall of the ball head flange tube 21, and the ball head flange tube 21 cannot swing axially in the mounting flange tube 20.

[0061] The rotary joint assembly 18 also includes a lining assembly, which includes a mounting flange tube ball head lining 28 and a ball head flange tube ball head lining 29. The mounting flange tube ball head lining 28 is arranged between the spherical inner wall 24 of the mounting flange tube 20 and the spherical outer wall 25 of the ball head flange tube 21. The shape of the mounting flange tube ball head lining 28 is adapted to the spherical inner wall 24 and the spherical outer wall 25. The ball head flange tube ball head lining 29 is arranged in the spherical inner wall of the ball head fixing flange 26. Between the wall 261 and the spherical outer wall 25 of the ball flange tube 21, the shape of the ball flange tube ball lining 29 is adapted to the spherical inner wall 261 and the spherical outer wall 25, and the mounting flange tube ball lining 28 and the ball flange tube ball lining 29 can be made of Teflon material to improve the smoothness of the spherical outer wall 25 of the ball flange tube 21 when it rotates freely and makes axial swing in the spherical inner wall 24 of the mounting flange tube 20, thereby improving the operating comfort of the rotary joint assembly 18.

[0062] A temperature sensor fixing sleeve 33 is provided on the outside of the temperature sensor 19, and the temperature sensor fixing sleeve 33 has a flange portion 331. Accordingly, the ball head flange tube 21 is connected to the flange portion 331 of the temperature sensor fixing sleeve 33 via a connecting flange 211, so that the connection between the ball head flange tube 21 and the temperature sensor 19 is more stable, preventing the temperature sensor 19 from slipping out of the ball head flange tube 21.

[0063] The temperature measuring device 14 also includes a positioning device, which includes a positioning pin 34 arranged on the connecting flange 211 of the ball head flange tube 21 and a first positioning hole 35 located on the flange portion 331 of the temperature sensor fixing sleeve 33. The positions of the positioning pin 34 and the first positioning hole 35 match each other. The first positioning hole 35 is used to accommodate the positioning pin 34. The relative positions of the positioning pin 34 and the first positioning hole 35 are reasonably set to ensure that the temperature sensor 19 is concentric with the ball head flange tube 21, thereby ensuring that the temperature measuring line 191 of the temperature sensor 19 can be emitted into the reaction chamber 4 without being emitted to the tube wall of the ball head flange tube 21 or the mounting flange tube 20.

[0064] A cooling channel 36 is provided on the connecting flange 211 of the ball flange tube 21. A cooling medium is introduced into the cooling channel 36 to cool the temperature sensor 19, thereby ensuring that the temperature sensor 19 works reliably.

[0065] When it is necessary to adjust the temperature measuring line 191 of the temperature sensor 19 to point to the position of the component to be temperature measured, first loosen the adjusting fastener 27 to allow a gap to exist between the ball head fixing flange 26 and the mounting flange tube 20. At this time, there is also a gap between the spherical inner wall 261 of the ball head fixing flange 26 and the spherical inner wall 24 of the mounting flange tube 20 and the spherical outer wall 25 of the ball head flange tube 21. The spherical outer wall 25 of the ball head flange tube 21 can rotate freely in the spherical inner wall 24 of the mounting flange tube 20. Then, move the universal adjustment rod 32 in the multiple position adjustment assemblies 30 to the unlocked position, so that the ball head flange tube 21 can swing axially in the mounting flange tube 20. Then, make the ball head flange tube 21 swing axially or / and rotate freely in the mounting flange tube 20 to adjust the temperature measuring line of the temperature sensor 19. 191 points to the position of the component to be temperature measured until the temperature measuring line 191 is adjusted to the target position. At this time, the ball head flange tube 21 is also located at the target position. At this time, it is necessary to lock the position adjustment component 30 and the adjustment fastener 27 in sequence. First, move the universal adjustment rod 32 in the multiple position adjustment components 30 to the locking position to ensure that the ball head flange tube 21 cannot make axial swing in the mounting flange tube 20, and then tighten the adjustment fastener 27 to make the ball head fixing flange 26 and the mounting flange tube 20 in close contact, so that the spherical inner wall 261 of the ball head fixing flange 26 and the spherical inner wall 24 of the mounting flange tube 20 respectively press the spherical outer wall 25 of the ball head flange tube 21, so that the position of the spherical outer wall 25 of the ball head flange tube 21 is fixed and cannot rotate freely in the spherical inner wall 24 of the mounting flange tube 20.

[0066] Furthermore, before using the temperature measuring device 14 to detect the temperature of the component to be measured, the temperature measuring device 14 needs to be installed and calibrated in advance. Figure 3 As shown, the semiconductor processing device further includes a temperature measurement calibration device 37, and the temperature measurement calibration device 37 includes: a calibrator 38 and a calibrator fixing sleeve 39. The calibrator fixing sleeve 39 is sleeved on the outside of the calibrator 38, and the calibrator 38 is at least one of a visible laser, a laser rangefinder, a visible lens, or a marking camera. The calibrator fixing sleeve 39 has a flange 391, and the flange 391 is connected to the connecting flange 211 of the ball head flange tube 21 in the temperature measuring device 14, and the flange 391 has a second positioning hole 40, and the second positioning hole 40 is used to accommodate the positioning pin 34 set on the connecting flange 211 of the ball head flange tube 21.

[0067] After the temperature measuring device 14 is installed at different test positions on the semiconductor processing device, the temperature measuring device 14 needs to be calibrated in advance. The specific steps include: fixing one end of the mounting flange tube 20 having the mounting flange 22 on the temperature measuring device mounting panel 15 of the semiconductor processing device; installing the ball head flange tube 21 into the interior of the mounting flange tube 20, and the adjusting fastener 27 is respectively connected to the ball head fixing flange 26 and one end of the mounting flange tube 20 having the spherical inner wall 24, and the spherical inner wall 261 of the ball head fixing flange 26 is fixed to the mounting flange tube 20. The spherical outer wall 25 of the ball head flange tube 21 is wrapped together with the spherical inner wall 24 of the mounting flange tube 20; then the temperature measurement calibration device 37 is installed, the calibrator fixing sleeve 39 is sleeved on the outside of the calibrator 38, the flange 391 on the calibrator fixing sleeve 39 is connected to the connecting flange 211 of the ball head flange tube 21, and the positioning pin 34 on the connecting flange 211 of the ball head flange tube 21 is inserted into the second positioning hole 40 on the flange 391 of the calibrator fixing sleeve 39; adjust the target point or marking point of the calibrator 38 to align with the designated area of ​​the component to be measured. Domain: first loosen the adjustment fastener 27, then move the universal adjustment rod 32 in the plurality of position adjustment components 30 to the unlocked position, then make the ball head flange tube 21 axially swing or / and freely rotate in the mounting flange tube 20 to adjust the target point or marking point of the calibrator 38 to align with the designated area of ​​the component to be temperature measured, then move the universal adjustment rod 32 in the plurality of position adjustment components 30 to the locked position, and then tighten the adjustment fastener 27 to ensure that the relative position of the mounting flange tube 20 and the ball head flange tube 21 in the rotary joint assembly 18 cannot be changed. At this point, the calibration work is completed. At this time, the connecting flange 211 on the ball flange tube 21 is in the position required for process testing. The temperature measurement calibration device 37 is removed from the ball flange tube 21 in the rotary joint assembly 18, and the temperature sensor fixing sleeve 33 is sleeved on the outside of the temperature sensor 19. The flange part 331 on the temperature sensor fixing sleeve 33 is connected to the connecting flange 211 of the ball flange tube 21, and the positioning pin 34 on the connecting flange 211 of the ball flange tube 21 is inserted into the first positioning hole 35 on the temperature sensor fixing sleeve 33. The temperature measurement device is calibrated using the temperature measurement calibration device. After determining the position of the temperature sensor aligned with the component to be measured, the temperature sensor can be directly replaced later without the need for recalibration, which ensures the installation repeatability and consistency of temperature measurement, and thus ensures the stability of the process.

[0068] The present invention uses a rotary joint assembly to install a temperature sensor. By adjusting the relative position between the mounting flange tube and the ball flange tube in the rotary joint assembly, the temperature measuring line of the temperature sensor can be adjusted to achieve the perpendicularity of the temperature measuring line to the surface of the component to be measured, thereby ensuring the accuracy of temperature measurement. The mounting flange tube and the ball flange tube in the rotary joint assembly can be rotated 360 degrees, with a wide adjustment range and strong operability. The present invention uses a temperature measurement calibration device to calibrate the temperature measuring device. After determining the position of the temperature sensor aligned with the component to be measured, the temperature sensor can be directly replaced without the need for recalibration, thereby ensuring installation repeatability and consistency of temperature measurement, thereby ensuring the stability of the process.

[0069] It should be noted that, in the embodiments of the present invention, the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the embodiments, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0070] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0071] Although the content of the present invention has been described in detail through the above preferred embodiments, it should be appreciated that the above description should not be considered as a limitation of the present invention. After reading the above content, it will be apparent to those skilled in the art that various modifications and substitutions of the present invention will occur. Therefore, the protection scope of the present invention should be limited by the appended claims.

Claims

1. A temperature measuring device for measuring the temperature of a component to be measured in a semiconductor processing device, characterized in that: Includes: rotary joint assembly and temperature sensor; The rotary joint assembly comprises: a mounting flange pipe and a ball head flange pipe; One end of the mounting flange pipe is fixedly mounted on the semiconductor processing device; One end of the ball head flange pipe is connected to the temperature sensor; The other end of the mounting flange tube has a spherical inner wall, and the other end of the ball head flange tube has a spherical outer wall adapted to the spherical inner wall. The spherical inner wall of the mounting flange tube is sleeved on the outside of the spherical outer wall of the ball head flange tube, and the spherical outer wall of the ball head flange tube can rotate within the spherical inner wall of the mounting flange tube.

2. The temperature measuring device according to claim 1, characterized in that: There are multiple angles between the ball head flange tube and the mounting flange tube that are not in the same plane.

3. The temperature measuring device according to claim 1, characterized in that: The mounting flange tube comprises: a ball head fixing flange, the ball head fixing flange has a spherical inner wall, and the ball head fixing flange is sleeved on the outside of the spherical outer wall of the ball head flange tube.

4. The temperature measuring device according to claim 3, characterized in that: The ball head fixing flange is provided with an adjusting fastener, and the spherical inner wall of the ball head fixing flange and the spherical outer wall of the ball head flange tube are allowed to have a gap or be in close contact by loosening or tightening the adjusting fastener.

5. The temperature measuring device according to claim 3, characterized in that: The rotary joint assembly also includes: a liner, which is arranged between the spherical inner wall of the mounting flange tube and the spherical outer wall of the ball head flange tube, and between the ball head fixing flange and the spherical outer wall of the ball head flange tube, and the liner is adapted to the spherical inner wall and the spherical outer wall of the mounting flange tube, and to the ball head fixing flange and the spherical outer wall.

6. The temperature measuring device according to claim 3, characterized in that: The ball head flange pipe is connected to the temperature sensor via a connecting flange. The connecting flange is provided with a cooling channel, and a cooling medium is introduced into the cooling channel.

7. The temperature measuring device according to claim 3, characterized in that: The rotary joint assembly comprises: at least three position adjustment assemblies, the position adjustment assembly comprises: an adjustment fixing rod, one end of which is fixedly connected to the ball head fixing flange, and the adjustment fixing rod has at least one adjustment hole; a universal adjustment rod, which is arranged in the adjustment hole, and the universal adjustment rod can move in the adjustment hole to make the universal adjustment rod be in an unlocking position or a locking position; The unlocked position means that the end of the universal adjustment rod does not contact the tube wall of the ball head flange tube, and the ball head flange tube can swing axially in the mounting flange tube; The locking position means that the end of the universal adjustment rod is in close contact with the tube wall of the ball head flange tube, and the ball head flange tube cannot swing axially in the mounting flange tube.

8. The temperature measuring device according to claim 7, characterized in that: The adjusting hole has an internal thread, and the universal adjusting rod has an external thread. The universal adjusting rod and the adjusting hole are connected by threads to achieve movement of the universal adjusting rod between the adjusting holes.

9. The temperature measuring device according to claim 8, characterized in that: The plurality of position adjustment components are evenly distributed on the circumference of the tube wall of the ball head flange tube.

10. The temperature measuring device according to claim 1, characterized in that: The temperature measuring device comprises: a temperature sensor fixing sleeve, wherein the temperature sensor fixing sleeve is arranged outside the temperature sensor, and the temperature sensor fixing sleeve has a flange portion, and the flange portion is connected to the connecting flange of the ball head flange pipe.

11. The temperature measuring device according to claim 10, characterized in that: The temperature measuring device comprises: a positioning device, and the positioning device comprises: A positioning pin, which is arranged on the connecting flange of the ball head flange pipe; The first positioning hole is located at the flange portion of the temperature sensor fixing sleeve and is used to accommodate the positioning pin.

12. A method for adjusting a temperature measuring device according to any one of claims 1 to 11, characterized in that: The following steps are involved: Loosen and adjust the fasteners to allow a gap to exist between the ball head fixing flange and the ball head flange tube; Moving the universal adjustment levers in the plurality of position adjustment assemblies to an unlocked position; After the ball head flange tube is adjusted to the target position, the universal adjustment rods in the plurality of position adjustment assemblies are moved to the locking position; Tighten the adjusting fastener to make the ball head fixing flange and the ball head flange tube in close contact and press the spherical outer wall of the ball head flange tube. At this time, the spherical outer wall of the ball head flange tube cannot move.

13. A semiconductor processing device, characterized in that: Include: A reaction chamber surrounded by an upper chamber cover, a lower chamber cover and an intermediate base ring, wherein the upper chamber cover and the lower chamber cover are made of quartz material; A base disposed in the reaction chamber, the base being used to carry a substrate; a plurality of heaters disposed outside the reaction chamber; An air inlet and an air outlet are arranged on the intermediate base ring; A temperature measuring device as claimed in any one of claims 1 to 11.

14. The semiconductor processing apparatus according to claim 13, wherein: The temperature measuring device is arranged outside the reaction chamber, and the temperature measuring device is connected to the upper chamber cover and / or the lower chamber cover.

15. The semiconductor processing apparatus according to claim 13, wherein: It also includes: an upper chamber shell and a lower chamber shell, which are respectively arranged on the outer sides of the upper chamber cover and the lower chamber cover, and the upper chamber shell and the lower chamber shell are made of metal material.

16. The semiconductor processing apparatus according to claim 15, wherein: The upper chamber shell and / or Or the lower chamber shell is provided with a temperature measuring hole, a transparent observation window is arranged in the temperature measuring hole, and the temperature measuring device is installed at the temperature measuring hole.

17. The semiconductor processing apparatus according to claim 14, wherein: The angle between the temperature measuring device and the upper chamber cover and / or the lower chamber cover is 45° to 90°.

18. The semiconductor processing apparatus according to claim 16, wherein: The angle between the temperature measuring device and the upper chamber shell and / or the lower chamber shell is 45° to 90°.

19. The semiconductor processing apparatus according to claim 13, wherein: The semiconductor processing device includes: a temperature measurement and calibration device, which includes: a calibrator and a calibrator fixing sleeve, wherein the calibrator fixing sleeve is arranged on the outside of the calibrator, and the calibrator fixing sleeve has a flange, which is connected to the connecting flange of the ball head flange tube in the temperature measuring device, and the flange has a second positioning hole, which is used to accommodate the positioning pin on the connecting flange of the ball head flange tube.

20. The semiconductor processing apparatus according to claim 19, wherein: The calibrator is at least one of a visible laser, a laser rangefinder, a visible lens, or a marking camera.

21. A method for installing and calibrating a temperature measuring device in a semiconductor processing device according to any one of claims 19 to 20, characterized in that: The following steps are involved: installing a mounting flange pipe to the semiconductor processing device; Installing the ball head flange pipe into the interior of the mounting flange pipe; Install the temperature measurement calibration device onto the ball head flange tube, insert the positioning pin on the connecting flange of the ball head flange tube into the second positioning hole on the flange of the calibrator fixing sleeve; Adopting the adjustment method as claimed in claim 12, aligning the target point or the marking point of the calibrator of the temperature measurement calibration device with the designated area of ​​the component to be temperature measured in the semiconductor processing device; Remove the temperature measuring calibration device from the ball head flange pipe in the rotary joint assembly; The temperature sensor is mounted on the ball head flange tube through the temperature sensor fixing sleeve, and the positioning pin on the connecting flange of the ball head flange tube is inserted into the first positioning hole on the flange part of the temperature sensor fixing sleeve.

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