Method for setting molding parameters of micro-light-emitting semiconductor chip and method for preparing the same

Abstract

The present invention relates to the field of LED semiconductor manufacturing technology, solves the problem of insufficient performance and stability of chip packaging in the prior art, and provides a method for setting molding parameters of a micro-light-emitting semiconductor chip and a preparation method. The method comprises determining mold parameters according to chip size parameters, thermal performance parameters, and luminous characteristic parameters; obtaining packaging material parameters according to luminous characteristic parameters, electrical characteristic parameters, and thermal performance parameters; obtaining molding temperature range according to the packaging material parameters and the thermal performance parameters; determining molding pressure range according to chip size parameters and chip material parameters; determining pressure holding time range according to packaging material parameters, thermal performance parameters, and the molding temperature range; and setting molding parameters according to molding temperature range, molding pressure range, and pressure holding time range. The present invention ensures the rationality of various parameters during the molding process, and avoids packaging defects or performance degradation caused by unreasonable parameters.

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