Jet electro-deposition device for programmable additive manufacturing of block nano-metal material
By designing a programmable additive manufacturing jet electrodeposition device in jet electrodeposition technology, using technical means such as cathode disks and plastic deformation modules of rotary structures, the uneven deposited layer and grain eligible growth in the preparation of block nanostructures are solved. The problem of this is to realize the continuous preparation and high-quality deposition of bulk nanometal materials.
Patent Information
- Application Number
- CN202411530099.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-30
- Publication Date
- 2025-02-07
AI Technical Summary
The existing jet electrodeposition technology has problems such as uneven deposit layer, optimal grain growth, cracking caused by residual stress in the preparation of bulk nanostructures, making it difficult to achieve continuous preparation and high-quality deposition.
A programmable additive manufacturing jet electrodeposition device is designed. Through technical means such as cathode disk, plastic deformation module, temperature sensing module and reducer motor with rotary structure, the current density, cathode disk rotation speed and anode nozzle flow rate are adjusted in real time. Destroy the optimal growth of grains, eliminate columnar crystals and growth residual stresses, and realize the continuous preparation of bulk nanometallic materials.
The continuous preparation of bulk nanometallic materials is realized, the microstructure of the deposition layer is adjusted in real time, the uniformity and quality of the deposition layer are improved, and the problems of uneven deposited layer and grain selection growth in traditional technology are solved.
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Figure CN119392321A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of electrodeposition, and in particular to a jet electrodeposition device for programmable additive manufacturing of bulk nanometal materials. Background Art
[0002] Nanometallic materials have a wide range of application potentials due to their excellent comprehensive properties. However, the size of nanometallic materials obtained by current preparation methods is limited, usually below the millimeter level.
[0003] As a local high-precision electrochemical machining method, jet electrodeposition technology is unique in that it can achieve rapid prototyping. This technology uses a high-speed jet of electrolyte to the cathode substrate to induce local concentration polarization, significantly increase the current density, and achieve a faster deposition rate than traditional electrodeposition. The high kinetic energy of the jet not only accelerates the migration of metal cations in the electrolyte to the cathode, but also promotes the discharge of gas, effectively reducing the porosity of the deposited layer and improving the quality of the deposited layer.
[0004] However, conventional jet electrodeposition has limitations when preparing bulk nanostructures, such as uneven deposition layers caused by tip discharge, formation of nodules that destroy deposition, preferential grain orientation to form large-sized columnar crystals that reduce mechanical properties, and cracking caused by growth residual stress.
[0005] The Chinese invention patent with the patent publication number CN112877750A discloses a device and preparation method for a multi-energy field assisted jet electrodeposition nanocomposite layer. This method solves the problem of easy agglomeration of nanoparticles in the electrolyte. By adjusting the pulse parameters, magnetic field intensity, anode-cathode distance, scanning speed and ultrasonic parameters, a nanocomposite deposition layer with good uniformity of deposition layer structure and thickness and good consistency of membrane-base bonding force is prepared. It does not make too many statements about the changes in the internal microstructure of the deposition layer, and the method does not have the ability to prepare samples with large thickness. Increasing the thickness of the deposition layer will cause problems such as uneven thickness, surface defects (such as micro-protrusions, nodules, pores) and preferential growth of grains.
[0006] The Chinese invention patent with patent number CN115558967A discloses a method and device for preparing heterogeneous nanostructures by deformation-assisted jet electrodeposition. This method applies a preset loading force to the deposition layer through a plastic deformation module, causing the deposition layer to undergo plastic deformation to solve the tip discharge problem of the deposition layer and prepare bulk heterogeneous nanostructures. However, the loading force cannot be measured when the device is running, and the deformation module is prone to slipping away from the deposition layer when changing direction. The pause of the three-dimensional mobile platform during operation will cause excessive deposition on both ends of the sample, and it is impossible to continuously prepare uniform bulk nanostructures.
[0007] In view of the current difficulties in preparing bulk nanometal materials, the present invention provides a jet electrodeposition device for programmable additive manufacturing of bulk nanometal materials. By designing a cathode disk with a rotating structure, the current density, cathode disk rotation speed, anode nozzle flow rate and other parameters in the jet electrodeposition process are changed, thereby achieving continuous preparation of bulk nanometal materials and real-time adjustment of the microstructure in the deposition layer. Summary of the invention
[0008] The purpose of the present invention is to provide a jet electrodeposition device for programmable additive manufacturing of bulk nanometal materials to solve the above-mentioned problems.
[0009] In order to solve the above technical problems, the present invention adopts the following technical solutions:
[0010] The present invention discloses a jet electrodeposition device for programmable additive manufacturing of bulk nanometal materials, comprising an electrolyte tank, wherein an apparatus body is sheathed on the outer periphery of the electrolyte tank, a plastic deformation module is arranged on the upper end of the apparatus body, and the bottom of the plastic deformation module is located in the electrolyte tank; a deposition area adjustment module is arranged in the electrolyte tank and is located below the plastic deformation module, a pressure sensing module for controlling the pressure is arranged on the plastic deformation module, and a temperature sensing module for detecting temperature changes is arranged on the side wall of the electrolyte tank; the electrolyte tank is connected to a circulating liquid tank through a pipeline, and the circulating liquid tank is connected to the plastic deformation module through a hose, and an acid- and alkali-resistant brushless pump is arranged on the hose.
[0011] Furthermore, the plastic deformation module includes a left-right moving mechanism, a nut 1 on the left-right mechanism is fixedly provided with an up-and-down moving mechanism, a nut 2 on the up-and-down moving mechanism is fixedly provided with a pressure sensing module, the pressure sensing module is connected to a nozzle, and the nozzle is connected to the hose; an anode spraying head is provided at the bottom of the nozzle, an anode platinum sheet layer is inlaid inside the anode spraying head, and the anode platinum sheet layer is externally connected to the positive pole of a DC power supply; symmetrically distributed slot plates are welded and connected to the outer side wall of the bottom of the anode spraying head, rollers are provided in the left and right slot plates, and rollers are sleeved on the rollers.
[0012] Furthermore, a bearing is arranged on the roller shaft between the groove plate and the roller, a shaft sleeve is sleeved around the outer circumference of the bearing, and locking nuts for fixing the roller shaft are symmetrically arranged on the outer side of the groove plate.
[0013] Furthermore, the pressure sensing module includes an upper pressure plate fixedly connected to the nut 2 on the up and down moving mechanism, a through hole 1 that matches the nozzle gap is opened at the center position of the upper pressure plate, limiting columns are symmetrically arranged at the front and rear positions of the through hole 1, a lower pressure plate is slidable at the lower end of the limiting column, and a through hole 2 that interference fits the nozzle is opened at the center position of the lower pressure plate; springs are symmetrically arranged on the opposite surfaces between the upper pressure plate and the lower pressure plate, and the springs are connected together through a pressure sensor.
[0014] Furthermore, the deposition area adjustment module includes a bevel gear cathode disk located in the electrolyte tank, the bevel gear cathode disk is meshed with a cathode driving wheel, the cathode driving wheel is connected to the reduction motor through a transmission shaft and a coupling, and a cathode substrate is provided on the upper end surface of the bevel gear cathode disk, and the cathode substrate is externally connected to the negative pole of a DC power supply.
[0015] Furthermore, the bottom rotating shaft of the bevel gear cathode disk is rotatably arranged in the electrolyte tank, and a cathode disk bearing is sleeved on the bottom rotating shaft of the bevel gear cathode disk.
[0016] Furthermore, a high-purity copper rod is arranged on one side of the cathode substrate.
[0017] Furthermore, the temperature sensing module includes a temperature sensor disposed in the electrolyte tank, and the temperature sensor is electrically connected to the MCU controller.
[0018] Furthermore, a saturated copper sulfate solution is placed in the circulating liquid tank, and the saturated copper sulfate solution contains g / L copper sulfate, g / L sodium chloride, ml / L polyethylene glycol, 1L deionized water and copper sulfate crystals.
[0019] Furthermore, the left-right moving mechanism and the up-down moving mechanism both include a stepping motor and a ball screw driven by the stepping motor.
[0020] Compared with the prior art, the beneficial technical effects of the present invention are:
[0021] The jet electrodeposition device for programmable additive manufacturing of bulk nanometal materials of the invention is in full contact with the deposition layer through the plastic deformation module, so that the grains in the deposition layer are deformed, refined and turned, thereby destroying the preferential growth of the grains, eliminating columnar crystals and growth residual stress; with the increase of current density, the overpotential of the cathode increases, thereby refining the grains; the real-time display of temperature is achieved through the temperature sensing module; the cathode disk is rotated by a bevel gear driven by a reduction motor to keep the position of the cathode and the anode constant, so that the distance of the salt bridge that is turned on during deposition is stable, and continuous, uniform, and high-quality deposition in the deposition area is achieved. In short, the present invention changes the current density, cathode disk rotation speed, anode nozzle flow rate and other parameters in the jet electrodeposition process by designing a cathode disk with a rotating structure, thereby achieving continuous preparation of bulk nanometal materials and real-time adjustment of the microstructure in the deposition layer. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] The present invention will be further described below in conjunction with the accompanying drawings.
[0023] Figure 1 A front view of the jet electrodeposition device for programmable additive manufacturing of bulk nanometal materials according to the present invention;
[0024] Figure 2 is a cross-sectional view of an anode spraying head;
[0025] Figure 3 This is a bottom view of the anode spraying head;
[0026] Figure 4 It is a front view of the pressure sensing module;
[0027] Figure 5 It is a schematic diagram of the structure of the pressure sensing module;
[0028] Figure 6 Adjust the module elevation view for the deposition area;
[0029] Figure 7 It is a schematic diagram of the structure of the deposition area adjustment module;
[0030] Explanation of the accompanying drawings: 1. stepper motor; 2. ball screw; 3. pressure sensor; 4. anode spraying head; 5. reduction motor; 6. cathode driving wheel; 7. hose; 8. acid and alkali resistant brushless pump; 9. circulating liquid tank; 10. bevel gear cathode disk; 11. temperature sensor; 12. electrolyte tank; 13. MCU controller; 14. locking nut; 15. roller; 16. bearing; 17. anode platinum sheet layer; 18. bushing; 19. roller; 20. upper pressure plate; 21. lower pressure plate; 22. limit column; 23. coupling; 24. transmission shaft; 26. cathode disk bearing; 27. cathode substrate. DETAILED DESCRIPTION
[0031] like Figure 1 As shown, a jet electrodeposition device for programmable additive manufacturing of bulk nanometal materials comprises an electrolyte tank 12, the outer periphery of the electrolyte tank 12 is sheathed with a device body, the upper end of the device body is installed with a plastic deformation module, the bottom of the plastic deformation module is located in the electrolyte tank 12, and the superimposed plastic deformation during deposition can cause the grains in the deposition layer to deform, refine and turn, thereby destroying the preferential growth of the grains, eliminating columnar crystals and growth residual stress. A deposition area adjustment module located below the plastic deformation module is installed in the electrolyte tank 12. The use of the deposition area adjustment module can reduce the problem of uneven thickness faced by jet electrodeposition when making high-performance and thick deposition layers, and avoid excessive deposition of the sample caused by the pause of the three-dimensional mobile platform during operation. A pressure sensing module for controlling the pressure is installed on the plastic deformation module to ensure that the plastic deformation module is in full contact with the deposition layer. A temperature sensing module for detecting temperature changes is installed on the side wall of the electrolyte tank 12. Although temperature can improve conductivity and reduce hydrogen permeation, it may lead to an increase in grain size; conversely, although low temperature needs to balance the effects of temperature on electrolyte conductivity and viscosity, it can increase the nucleation rate and form fine equiaxed crystals. Therefore, the temperature sensing module realizes real-time display of temperature.
[0032] The electrolyte tank 12 is connected to the circulating liquid tank 9 through a pipeline, and the circulating liquid tank 9 is connected to the plastic deformation module through a hose 7, and an acid-base resistant brushless pump 8 is installed on the hose 7. The acid-base resistant brushless pump 8 controls the flow rate of the electrolyte in the circulating liquid tank 9 and the electrolyte tank 12, and the electrolyte in the circulating liquid tank 9 reaches the anode spraying head 4 through the hose 7.
[0033] like Figure 2 , 3 As shown, the plastic deformation module includes a left-right moving mechanism, and a screw nut 1 on the left-right mechanism is fixedly installed with an up-down moving mechanism, and the left-right moving mechanism and the up-down moving mechanism both include a stepping motor 1 and a ball screw 2 driven by the stepping motor 1. A pressure sensing module is fixedly installed on the screw nut 2 on the up-down moving mechanism, and the pressure sensing module is connected to a nozzle, and the nozzle is connected to the hose 7. An anode spraying head 4 is installed at the bottom of the nozzle, and an anode platinum sheet layer 17 is embedded inside the anode spraying head 4, and the anode platinum sheet layer 17 is externally connected to the positive pole of a DC power supply. Symmetrically distributed slot plates are welded and connected to the outer side wall of the bottom of the anode spraying head 4, and rollers 15 are installed in the left and right slot plates, and rollers 19 are sleeved on the rollers 15. A bearing 16 is installed on the roller 15 located between the slot plate and the roller 19, and a shaft sleeve 18 is sleeved around the outer periphery of the bearing 16, and a locking nut 14 for fixing the roller 15 is symmetrically installed on the outer side of the slot plate.
[0034] Specifically, the MCU controller 13 can change the rotation direction and speed of the ball screw 2 by changing the rotation of the stepper motor 1 through pulses, directions, and enable signals, thereby realizing the movement of the x-axis and z-axis nuts to adjust the position and pressure of the anode spraying head 4.
[0035] like Figure 4 , 5 As shown, the pressure sensing module includes an upper pressure plate 20 fixedly connected to the nut 2 on the up-and-down moving mechanism, a through hole 1 is provided at the center of the upper pressure plate 20 to match the gap of the nozzle, and a limiting column 22 is symmetrically arranged at the front and rear positions of the through hole 1, and a lower pressure plate 21 is slidably arranged at the lower end of the limiting column 22, and a through hole 2 is provided at the center of the lower pressure plate 21 to interfere with the nozzle. Springs are symmetrically installed on the opposite surfaces between the upper pressure plate 20 and the lower pressure plate 21, and the springs are connected together through a pressure sensor 3. The upper pressure plate 20 moves up and down along the z-axis direction with the plastic deformation module, and the spring generates pressure during the movement, and the magnitude of the pressure can be measured by the pressure sensor 3; at the same time, under the action of the spring, the pressure is transmitted to the lower pressure plate 21. Since the lower pressure plate 21 is fixedly connected to the nozzle, it can drive the nozzle to move downward together, thereby realizing the change of the downward pressure magnitude of the anode spraying head 4.
[0036] Specifically, the pressure sensor 3 adopts a load-tension structure, with a bent metal sheet at both ends, called a beam, one of which is used as a reference and the other feels the load. When working, the beam loaded by the pressure sensor 3 is bent and deformed, and there is a proportional relationship between the restoring force generated by the damping blocker and the force generated by the elastic rod and the load. This proportional relationship can be quantified by the analog-to-digital converter and converted into a digital signal output to the MCU controller 13.
[0037] like Figure 6 , 7 As shown, the deposition area adjustment module includes a bevel gear cathode disk 10 located in the electrolyte tank 12, the bevel gear cathode disk 10 is meshed with a cathode driving wheel 6, the cathode driving wheel 6 is connected to the reduction motor 5 through a transmission shaft 24 and a coupling 23, and a cathode substrate 27 is installed on the upper end surface of the bevel gear cathode disk 10, and the cathode substrate 27 is externally connected to the negative pole of a DC power supply. The bottom rotating shaft of the bevel gear cathode disk 10 is rotatably installed in the electrolyte tank 12, and a cathode disk bearing 26 is sleeved on the bottom rotating shaft of the bevel gear cathode disk 10. A high-purity copper rod is installed on one side of the cathode substrate 27, and the high-purity copper rod is a cathode. The reduction motor 5 drives the rotation speed of the cathode driving wheel 6 to adjust the rotation speed of the bevel gear cathode disk 10, thereby changing the deposition speed of the deposition surface.
[0038] The temperature sensing module includes a temperature sensor 11 installed in the electrolyte tank 12. The temperature sensor 11 is electrically connected to the MCU controller 13. The temperature of the temperature sensor 11 can be read by simulating a single bus communication sequence through an IO port of the MCU controller 13.
[0039] On the basis of the above, the embodiment of the device for rolling and preparing heterogeneous plastic deformation to prepare gradient functional nanostructures is as follows:
[0040] Example 1
[0041] Method for preparing gradient functional copper nanostructures by rolling and heterogeneous plastic deformation:
[0042] Step 1: Set the experimental parameters in the macro definition variables in the given program, set the speed of the stepper motor 1, the maximum pressure during the deposition process, whether to preload the force, the pressure increase interval, the serial port data transmission interval, the speed of the reduction motor 5, the current density of the anode spraying head 4 and other parameters, and the MCU controller 13 controls the stepper motor 1 and the reduction motor 5 to adjust the positive and negative voltages;
[0043] Step 2: polish and pickle the cathode substrate 27 with a diameter of Φ150mm, a thickness of 1mm and a square hole of 30mmx30mm in the center, place it on the bevel gear cathode disk 10, and fix the cathode substrate 27 through the square protrusion of the bevel gear cathode disk 10; a high-purity copper rod with a diameter of Φ15mm is fixed on the bevel gear cathode disk 10, which is the cathode and is connected to the negative pole of the external power supply; the anode platinum sheet layer 17 at the anode spraying head 4 is the anode and is connected to the positive pole of the external power supply;
[0044] Step 3: preparing a gradient functional copper nanostructure electroplating solution: a saturated copper sulfate solution is placed in the circulating liquid tank 9, wherein the saturated copper sulfate solution contains 250 g / L copper sulfate, 10 g / L sodium chloride, 10 ml / L polyethylene glycol, and 1 L deionized water, and the mixture is mixed uniformly by stirring;
[0045] Step 4: The MCU controller 13 adjusts the speed of the acid-base resistant brushless pump 8, and the plating liquid flows out from the anode spray head 4 through the hose 7, impacts the cathode substrate 27, and then is collected in the circulating liquid tank 9 and sucked by the water inlet end of the acid-base resistant brushless pump 8 to form a circulating flow; during this process, the MCU controller 13 adjusts the speed of the acid-base resistant brushless pump 8 to make the flow rate within a suitable range; copper sulfate crystals are placed in the circulating liquid tank 9 to replenish the consumption of copper ions at any time;
[0046] Step 5: Set the DC power supply of the MCU controller 13 to a constant current mode, maintain the distance between the anode spraying head 4 and the high-purity copper rod unchanged, and ensure that the current loop is stable when it is turned on; the roller 19 is installed on the anode spraying head 4 to ensure that the inter-electrode distance is constant during operation. After the DC power supply is turned on, copper ion reduction occurs in the area of jet impact to form a pure copper deposition layer. At the beginning of deposition, the pressure needs to be zero so that the deposition layer has a good bonding force with the substrate;
[0047] Then, the rotating cathode disk 10 driven by the reduction motor 5 rotates, and each rotation will cause the anode spraying head 4 to leave a very thin deposition layer on the moving path in the ring. At the same time, the stepper motor 1 of the anode spraying head 4 runs downward, so that the contact surface pressure between the roller 19 and the cathode substrate 27 is increased to eliminate the tip discharge phenomenon and obtain a higher deposition quality; the roller 19 moving with the anode spraying head 4 will plastically deform this layer of deposition layer, and release the residual stress in the deposition layer through plastic deformation layer by layer; in this process, the MCU controller 13 controls the stroke of the stepper motor 1 to change the pressure of the plastic deformation of the deposition layer, forming a nano-pure Cu coating with deeply graded composition, microstructure and performance, so as to realize the spatial gradient of the structure or composition so that it has customized properties;
[0048] In addition, the MCU controller 13 conducts real-time serial communication with the computer through the USB interface. The real-time temperature is displayed on the dynamic digital tube, and the real-time pressure and current density are displayed on the LCD1602 liquid crystal display screen. The returned pressure, temperature and current density data can be used to draw a real-time dynamic line graph through the serial port assistant, which is convenient for observation and recording.
[0049] Example 2
[0050] Method for preparing Ni-Cu functional gradient functional nanostructure by rolling and heterogeneous plastic deformation:
[0051] Step 1: Set the experimental parameters in the macro definition variables in the given program, set the speed of the stepper motor 1, the maximum pressure during the deposition process, whether to preload the force, the pressure increase interval, the serial port data transmission interval, the speed of the reduction motor 5, the current density of the anode spraying head 4 and other parameters, and the MCU controller 13 controls the stepper motor 1 and the reduction motor 5 to adjust the positive and negative voltages;
[0052] Step 2: The Ni cathode substrate 27 is polished, activated with hydrochloric acid, and cleaned with deionized water, and then fixed on the bevel gear cathode disk 10. Ni and Cu are deposited on the surface of the cathode substrate 27 in sequence using an anode spraying head 4 with a partition. The spraying pipe is connected to the respective independent electroplating liquid circulation tanks 9 through an acid-base resistant brushless pump 8; the anode spraying head 4 is connected to the positive pole of the DC power supply of the MCU controller 13, and the cathode substrate 27 is externally connected to the negative pole of the DC power supply of the MCU controller 13;
[0053] Step 3: The copper plating solution formula of the Ni-Cu functional gradient material with different thickness characteristics is as follows: the copper sulfate saturated solution contains 250g / L copper sulfate, 10g / L sodium chloride, 10ml / L polyethylene glycol, and 1L deionized water; the nickel plating solution formula is as follows: the copper sulfate saturated solution contains 625g / L nickel sulfate hexahydrate, 10g / L sodium chloride, 10ml / L polyethylene glycol, and 1L deionized water;
[0054] Step 4: The MCU controller 13 adjusts the speed of the acid-base resistant brushless pump 8, and the copper electroplating solution and the nickel electroplating solution flow out from the anode spray head 4 through the hose 7, impact the cathode substrate 27, and then collect in different circulation liquid tanks 9, and are sucked by the water inlet end of the acid-base resistant brushless pump 8 to form a circulation flow; during this process, the MCU controller 13 adjusts the speed of the acid-base resistant brushless pump 8 to make the flow rate within a suitable range; as the experiment proceeds, the DC power supply of the MCU controller 13 will increase the deposition rate by increasing the current density at the nozzle opening;
[0055] Step five, when the device starts to run, the acid and alkali resistant brushless pump 8 connected to the nozzle is turned on to output copper electroplating solution and nickel electroplating solution, and the DC regulated power supply is kept in constant current mode. At the beginning of the experiment, the power output is 50mA; and the roller load is set to 0N, and the reciprocating frequency of the bevel gear cathode disk 10 is 6 rpm; at this time, a copper-nickel composite deposition layer with good bonding with the substrate is formed on the cathode plate. As the experiment proceeds, the MCU controller 13 increases the power output, increases the deposition layer load, causes plastic deformation of the deposition layer, and forms a Ni-Cu functional gradient material with different thickness characteristics.
[0056] The embodiments described above are only descriptions of the preferred modes of the present invention, and are not intended to limit the scope of the present invention. Without departing from the design spirit of the present invention, various modifications and improvements made to the technical solutions of the present invention by ordinary technicians in this field should all fall within the protection scope determined by the claims of the present invention.
Claims
1. A jet electrodeposition device for programmable additive manufacturing of bulk nanometal materials, characterized by: The invention comprises an electrolyte tank (12), wherein the outer periphery of the electrolyte tank (12) is sheathed with a device body, the upper end of the device body is provided with a plastic deformation module, and the bottom of the plastic deformation module is located in the electrolyte tank (12); the electrolyte tank (12) is provided with a deposition area adjustment module located below the plastic deformation module, the plastic deformation module is provided with a pressure sensing module for controlling the pressure, and the side wall of the electrolyte tank (12) is provided with a temperature sensing module for detecting temperature changes; the electrolyte tank (12) is connected to a circulating liquid tank (9) through a pipeline, the circulating liquid tank (9) is connected to the plastic deformation module through a hose (7), and the hose (7) is provided with an acid and alkali resistant brushless pump (8).
2. The jet electrodeposition device for programmable additive manufacturing of bulk nanometal materials according to claim 1, characterized in that: The plastic deformation module comprises a left-right moving mechanism, a nut 1 on the left-right mechanism is fixedly provided with an up-down moving mechanism, a nut 2 on the up-down moving mechanism is fixedly provided with a pressure sensing module, the pressure sensing module is connected to a nozzle, and the nozzle is connected to the hose (7); an anode spraying head (4) is provided at the bottom of the nozzle, an anode platinum sheet layer (17) is embedded inside the anode spraying head (4), and the anode platinum sheet layer (17) is externally connected to the positive pole of a direct current power supply; symmetrically distributed slot plates are welded and connected to the outer side wall of the bottom of the anode spraying head (4), rollers (15) are provided in the left and right slot plates, and rollers (19) are sleeved on the rollers (15).
3. The jet electrodeposition device for programmable additive manufacturing of bulk nanometal materials according to claim 2, characterized in that: A bearing (16) is arranged on the roller (15) between the groove plate and the roller (19), a shaft sleeve (18) is sleeved around the outer circumference of the bearing (16), and locking nuts (14) for fixing the roller (15) are symmetrically arranged on the outer side of the groove plate.
4. The jet electrodeposition device for programmable additive manufacturing of bulk nanometal materials according to claim 2, characterized in that: The pressure sensing module comprises an upper pressure plate (20) fixedly connected to the nut 2 on the up-and-down moving mechanism, a through hole 1 which matches with the nozzle gap is provided at the center of the upper pressure plate (20), limiting posts (22) are symmetrically arranged at the front and rear positions of the through hole 1, a lower pressure plate (21) is slidably provided at the lower end of the limiting post (22), and a through hole 2 which matches with the nozzle interference is provided at the center of the lower pressure plate (21); springs are symmetrically arranged on opposite surfaces between the upper pressure plate (20) and the lower pressure plate (21), and the springs are connected together via a pressure sensor (3).
5. The jet electrodeposition device for programmable additive manufacturing of bulk nanometal materials according to claim 1, characterized in that: The deposition area adjustment module comprises a bevel gear cathode disk (10) located in the electrolyte tank (12), the bevel gear cathode disk (10) is meshed with a cathode driving wheel (6), the cathode driving wheel (6) is connected to a reduction motor (5) via a transmission shaft (24) and a coupling (23), and a cathode substrate (27) is provided on the upper end surface of the bevel gear cathode disk (10), and the cathode substrate (27) is externally connected to the negative pole of a DC power supply.
6. The jet electrodeposition device for programmable additive manufacturing of bulk nanometal materials according to claim 5, characterized in that: The bottom rotating shaft of the bevel gear cathode disk (10) is rotatably arranged in the electrolyte tank (12), and a cathode disk bearing (26) is sleeved on the bottom rotating shaft of the bevel gear cathode disk (10).
7. The jet electrodeposition device for programmable additive manufacturing of bulk nanometal materials according to claim 5, characterized in that: A high-purity copper rod is arranged on one side of the cathode substrate (27).
8. The jet electrodeposition device for programmable additive manufacturing of bulk nanometal materials according to claim 1, characterized in that: The temperature sensing module comprises a temperature sensor (11) arranged in the electrolyte tank (12), and the temperature sensor (11) is electrically connected to an MCU controller (13).
9. The jet electrodeposition device for programmable additive manufacturing of bulk nanometal materials according to claim 1, characterized in that: A saturated copper sulfate solution is placed in the circulating liquid tank (9), wherein the saturated copper sulfate solution contains 250 g / L copper sulfate, 10 g / L sodium chloride, 10 ml / L polyethylene glycol, 1 L deionized water and copper sulfate crystals.
10. The jet electrodeposition device for programmable additive manufacturing of bulk nanometal materials according to claim 2, characterized in that: The left-right moving mechanism and the up-down moving mechanism both comprise a stepping motor (1) and a ball screw (2) driven by the stepping motor (1).
Citation Information
Patent Citations
Device and preparation method for multi-energy-field auxiliary jet flow electro-deposition nano-composite layer
CN112877750A
Method and device for preparing heterogeneous nanostructure through deformation-assisted jet electrodeposition
CN115558967A
