Rapid and accurate bonding pad repairing method and device

Abstract

The invention belongs to the field of bonding pad repair, and discloses a rapid and accurate bonding pad repair method and equipment, and the method comprises the steps: providing a circuit board with a defective bonding pad; importing the Gerber file of the circuit board into a computer, and preparing to start repairing work; marking a Mark point; carrying out primary mechanical positioning (probe) on the defective bonding pad; performing visual positioning on the defective bonding pad; carrying out secondary mechanical positioning (printing head) on the defective bonding pad; printing a bonding pad; curing the bonding pad; and finishing the shape of the bonding pad. According to the invention, a three-time positioning method is adopted, a mechanical pointer is firstly used for positioning the position of the bonding pad, and then a scanning camera part is used for secondary positioning, so that the positioning precision can be effectively improved; according to the method, the bonding pad repairing speed is high, and the speed advantage is more prominent especially for the condition of large-area bonding pad defect; the electronic additive manufacturing technology is adopted to repair the bonding pad, so that material waste can be reduced, and the method is very environment-friendly.

Description

Technical Field

[0001] The present invention belongs to but is not limited to the field of pad repair technology, and in particular relates to a fast and accurate pad repair method and equipment. Background Art

[0002] Electronic assembly technology is the process of combining and interconnecting the individual components of a product (components, electromechanical parts, structural parts, functional components and modules, etc.) to form a complete product that meets the technical requirements of the system. With the development of electronic assembly technology towards miniaturization, high integration and high density, the number of components has increased significantly, and the reliability problem of electronic products has become more prominent.

[0003] The reliability of solder joints is one of the important factors affecting the reliability of electronic components. Whether solder joints can maintain good mechanical and electrical connections is crucial to the reliability of electronic products. The structure of solder joints mainly includes pads, solder, lead pins and substrates. The damage to the pads can easily cause problems such as unreliable solder joint connections, electronic components falling off, and PCB wire disconnection, which is the main factor affecting the reliability of solder joints. During the assembly or use of electronic products, the pads are affected by mechanical stress, such as improper force during welding, improper component installation, or careless operation during product maintenance. These mechanical stresses cause the pads to crack, deform, fall off, or break. In addition, under harsh environmental conditions, the pads are corroded by chemicals or humidity, causing the pad surface to oxidize, corrode, or lose solderability. This corrosion weakens the mechanical strength and reliability of the pads.

[0004] At present, for a small number of pad defects on the PCB surface, technicians generally use electroplating pens to repair them one by one. This manual pad repair method is time-consuming, difficult to operate and the accuracy is uncontrollable. In addition, some methods and equipment for automatic pad repair are also disclosed: for example, a pad repair method disclosed in CN116896830A mainly includes the following steps: (1) providing a ceramic substrate with a defective pad and removing the defective pad on the ceramic substrate; (2) spin-coating photoresist on the side of the ceramic substrate where the defective pad appears to form a first photoresist layer; (3) using a first drawing to perform a first exposure and development on the ceramic substrate to obtain an opening of the defective pad; (4) baking the ceramic substrate to solidify the first photoresist layer; (5) coating a metal film on the surface of the first photoresist layer; (6) spin-coating photoresist on the metal film to form a second photoresist layer; (7) using a second drawing to perform a second exposure and development on the ceramic substrate to obtain an opening of the defective pad; (8) baking the ceramic substrate to solidify the second photoresist layer; electroplating the ceramic substrate to obtain a repaired pad; (9) removing the first photoresist layer, the second photoresist layer and the metal film on the ceramic substrate. Another example is a pad repair method and repair equipment based on a glass substrate disclosed in CN116845710B, which includes the following steps: (1) detecting and locating the defective part of the pad; (2) pre-treating the defective part; (3) printing a retaining structure around the defective part and curing it; (4) printing a repair slurry in the retaining structure, curing it, trimming it, and completing the pad repair.

[0005] In view of the above analysis, the technical problems that need to be solved urgently in the prior art are:

[0006] (1) The current method for locating damaged pads by automatic pad repair technology is usually to use a scanning camera component for one-time positioning. Although this positioning method can accurately locate the damaged part, the accuracy is not high (about ±50μm), resulting in a large offset between the position of the repaired pad and the original pad, affecting the secondary welding after repair;

[0007] (2) Many current pad repair technologies (such as CN116347783A "A method for repairing scratches and detachment of miniaturized pads on PCB boards") take 2-3 hours to repair, which is slow;

[0008] (3) Currently, many pad repair technologies (such as CN116896830A "A pad repair method") use processes such as copper deposition, electroplating, and etching. The chemical reagents required in the process will have an adverse impact on the environment. Summary of the invention

[0009] In view of the problems existing in the prior art, the present invention provides a fast and accurate pad repair method and equipment.

[0010] The present invention is implemented as follows: a fast and accurate pad repair method, characterized in that the fast and accurate pad repair method specifically comprises:

[0011] S1: Provide a circuit board with defective pads;

[0012] S2: Import the Gerber file of the circuit board into the computer and prepare to start the repair work;

[0013] S3: Mark the point;

[0014] S4: Mechanically locate the defective pad (probe);

[0015] S5: Visually locate the defective pad;

[0016] S6: Perform secondary mechanical positioning of the defective pad (print head);

[0017] S7: pad printing;

[0018] S8: pad curing;

[0019] S9: Pad topography trimming.

[0020] Further, in said S4, the specific primary mechanical positioning method is:

[0021] S41: Fixing screw positioning, mainly to check whether the PCB is firmly installed;

[0022] S42: Probe XY direction positioning, mainly determining the origin position of the probe in the XY direction;

[0023] S43: Positioning the probe in the Z-axis direction, mainly determining the origin position of the probe in the Z-axis direction;

[0024] S44: Bottom surface flatness detection, mainly to detect whether the equipment platform is flat;

[0025] S45: PCB flatness detection, mainly detects whether the PCB surface is flat.

[0026] Further, in S5, the specific visual positioning method is: the camera scans the mark points marked in step S3 in the order of upper right, upper middle, upper left, middle left 1, middle left 2, lower right, lower middle, lower right, and middle right.

[0027] Further, in S6, the specific secondary mechanical positioning method is:

[0028] S61. Print head XY direction positioning, mainly determining the XY direction origin position of the print head;

[0029] S62. Positioning the print head in the Z direction, mainly determining the origin position of the print head in the Z direction.

[0030] Furthermore, the S7, before the pad printing, also includes a printing parameter debugging process, and the printing parameter debugging is mainly divided into two parts:

[0031] (1) Height compensation adjustment: mainly adjust the height of the print head from the PCB surface;

[0032] (2) Ink output compensation adjustment: mainly adjusts the ink output of the print head.

[0033] Another object of the present invention is to provide a fast and accurate pad repair device, including a base 1, an upper cover 2, a printing platform 3, a calibration component 4, a debugging area 5, an X-axis 6, a clamping component 7, a print head 8, a gas support 9, a power switch 10, an indicator light 11, and an emergency stop button 12.

[0034] Furthermore, the positioning mechanism of the pad repairing device includes a camera 13 , a telescopic probe 14 , a print head 15 , an XY four-quadrant limiter 16 , and a height limiter 17 .

[0035] In combination with the above technical solutions and the technical problems solved, the advantages and positive effects of the technical solutions to be protected by the present invention are as follows:

[0036] First, high positioning accuracy: the present invention adopts the "three-positioning method", firstly using a mechanical pointer to position the pad, and then using a scanning camera component for secondary positioning, which can effectively improve the positioning accuracy;

[0037] Fast repair speed: The invention can repair the pad quickly, especially for the case of large pad defects, the speed advantage is more prominent and has a very obvious speed advantage;

[0038] Environmentally friendly: The present invention adopts electronic additive manufacturing technology to repair the pad, which not only reduces material waste but is also very environmentally friendly.

[0039] Second, the technical solution of the present invention solves the technical problems that people have been eager to solve but have never been able to solve successfully:

[0040] In this era of increasing popularity of electronic products, all electronic products are basically composed of electronic components and PCBs. The production and manufacturing process of PCBs is a very demanding and rigorous process. It is often very easy to cause PCB pads to fall off during production, maintenance, debugging, and use. Traditional maintenance often uses the flying wire method, which greatly reduces the quality of PCBs. Therefore, it is urgent to find an efficient, low-cost, and highly automated PCB pad repair method.

[0041] At present, many experts and scholars have conducted research on pad repair methods: Hou Keyu et al. used two layers of photoresist and one layer of metal film to repair imperfect pads, effectively reducing the defective rate of products. However, this method requires the damaged pads to be completely removed before the repair work can continue; the equipment developed by Zhang Wei et al. combines components such as desoldering and cleaning, shortens the process flow, and saves time and labor costs, but this method cannot accurately locate the damaged pads and requires all pads to be repaired, which undoubtedly increases the repair time; Jixiang et al. used hydrofluoric acid etching to repair the pads. Although the pads can be repaired quickly and effectively, harmful gases such as ammonia and silicon tetrafluoride will be generated in the process, causing environmental pollution. It can be seen that the current methods for repairing pads mainly have problems such as long repair time, difficulty in accurate positioning, and unfriendly process environment.

[0042] Therefore, this paper proposes a fast and accurate pad repair method. This method not only has high positioning accuracy and can accurately repair defective pads, but also has a fast repair speed and an environmentally friendly process, which greatly solves the PCB pad repair problem that the industry has always desired but has not been able to solve efficiently.

[0043] Third, the present invention solves the problem of low positioning accuracy of pad repair in the prior art. In traditional pad repair technology, it usually relies on one-time visual positioning. This single positioning method is difficult to meet the high-precision requirements and easily leads to offset or incompleteness of the pad after repair, affecting the overall performance and service life of the circuit board. The present invention introduces a combination of primary mechanical positioning, visual positioning and secondary mechanical positioning through the "three-positioning method", which greatly improves the accuracy of pad repair and effectively avoids the error accumulation problem in traditional methods.

[0044] In industrial applications, the technical solution of the present invention improves the accuracy of pad repair, and is particularly suitable for pad repair needs of precision circuit boards. This has significant application value for the manufacture and maintenance of electronic products, especially in the fields of semiconductors, aerospace, medical equipment, etc. with high precision requirements. The present invention can reduce the failure rate of pad repair, reduce the cost of product rework and maintenance for enterprises, and improve production efficiency and yield rate.

[0045] In addition, the present invention also solves the problem of repair failure caused by inappropriate spacing between the print head and the circuit board, excessive or insufficient ink output during the pad repair process through height compensation debugging and ink output compensation adjustment. This flexible parameter adjustment mechanism not only improves the quality of pad repair, but also can adapt to circuit boards of different thicknesses and materials, increasing the applicability and application scope of the technology.

[0046] The present invention has achieved remarkable technological progress in industrial applications. Through high-precision pad positioning methods and intelligent printing parameter debugging, the accuracy and success rate of pad repair are improved, the cost of manufacturing enterprises is significantly reduced, the quality and reliability of products are improved, and the technological upgrading and industrial development of the electronic manufacturing industry are promoted. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] Figure 1 It is a flow chart of a fast and accurate pad repair method provided by an embodiment of the present invention;

[0048] Figure 2 It is a schematic diagram of the overall structure of a fast and accurate pad repair device provided by an embodiment of the present invention;

[0049] Figure 3 It is a structural schematic diagram of a fast and accurate pad repair equipment positioning mechanism provided by an embodiment of the present invention;

[0050] Figure 4 is a schematic diagram of the repair effect provided by an embodiment of the present invention;

[0051] Figure 5 This is a schematic diagram of the repair accuracy provided by an embodiment of the present invention:

[0052] In the figure: 1. Base; 2. Upper cover; 3. Printing platform; 4. Calibration component; 5. Debugging area; 6. X-axis; 7. Clamping component; 8. Print head; 9. Gas support; 10. Power switch; 11. Indicator light; 12. Emergency stop button; 13. Camera; 14. Telescopic probe; 15. Print head; 16. XY four-quadrant limiter; 17. Height limiter. DETAILED DESCRIPTION

[0053] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0054] Application Example 1: Pad repair of high-precision electronic equipment

[0055] In the production of high-end electronic devices, such as smart phones, laptops, etc., the pads on the circuit boards often have defects due to wear and tear during manufacturing or use, causing the equipment to malfunction. The "three-positioning method" pad repair technology of the present invention can be applied to the pad repair of such precision electronic equipment. Through this method, manufacturers can perform high-precision repairs on defective pads during equipment production or rework, ensuring that the connection quality between the pads and components will not be affected by the repair, avoiding equipment malfunction or shortened service life. This application has significant application value in the electronics manufacturing industry, especially in the field of high-end consumer electronics, and can greatly improve the reliability of equipment and customer satisfaction.

[0056] Application Example 2: Pad Repair of Aerospace Circuit Boards

[0057] The circuit boards in aerospace equipment have extremely high quality requirements for pads. Any slight error will lead to equipment failure and even endanger flight safety. The pad repair method of the present invention can be applied to circuit board maintenance in the aerospace field. When the pads on the circuit board are damaged due to long-term use or external factors, the high-precision "three-positioning method" of the present invention is used for repair, which can ensure that the repaired pads are consistent with the original design, meet the strict standards of the aerospace industry, reduce the risk of equipment failure due to pad defects, and improve the service life and safety of the equipment.

[0058] like Figure 1 As shown, an embodiment of the present invention provides a fast and accurate pad repair method, which specifically includes:

[0059] S1: Provide a circuit board with defective pads;

[0060] S2: Import the Gerber file of the circuit board into the computer and prepare to start the repair work;

[0061] S3: Mark the point;

[0062] S4: Mechanically locate the defective pad (probe);

[0063] S5: Visually locate the defective pad;

[0064] S6: Perform secondary mechanical positioning of the defective pad (print head);

[0065] S7: pad printing;

[0066] S8: pad curing;

[0067] S9: Pad topography trimming.

[0068] The prior art usually uses a camera to locate the defective pad once, but this one-time positioning method may result in insufficient accuracy. The embodiment of the present invention uses a "three-time positioning method" to locate the defective pad.

[0069] In S4, the specific primary mechanical positioning method is:

[0070] S41: Fixing screw positioning, mainly to check whether the PCB is firmly installed;

[0071] S42: Probe XY direction positioning, mainly determining the origin position of the probe in the XY direction;

[0072] S43: Positioning the probe in the Z-axis direction, mainly determining the origin position of the probe in the Z-axis direction;

[0073] S44: Bottom surface flatness detection, mainly to detect whether the equipment platform is flat;

[0074] S45: PCB flatness detection, mainly detects whether the PCB surface is flat.

[0075] In S5, the specific visual positioning method is: the camera scans the mark points marked in step S3 in the order of upper right, upper middle, upper left, middle left 1, middle left 2, lower right, lower middle, lower right, and middle right.

[0076] In S6, the specific secondary mechanical positioning method is:

[0077] S61: Positioning the print head in the XY direction, mainly determining the origin position of the print head in the XY direction;

[0078] S62: Positioning the print head in the Z direction, mainly determining the origin position of the print head in the Z direction.

[0079] The S7, before the pad printing, also includes the printing parameter debugging process, which is mainly divided into two parts:

[0080] (1) Height compensation adjustment: mainly adjust the height of the print head from the PCB surface. If the height is too high, the printing accuracy will be reduced; but if the height is too low, the print needle will carry the ink on the circuit board to other places and form ink marks in the middle.

[0081] (2) Ink output compensation adjustment: Mainly adjust the ink output of the print head. If the ink output is too large, the pad will become larger and affect the accuracy; if the ink output is too small, the ink output of the print head will not be able to form a complete pad.

[0082] The fast and accurate pad repair method of the embodiment of the present invention improves the accuracy of pad repair through the "three-positioning method", solving the problem of low positioning accuracy in the prior art. First, in step S4, the probe is positioned on the circuit board through a mechanical positioning, including fixing screw positioning, probe XY and Z axis positioning, equipment platform and PCB flatness detection. This step ensures that the circuit board is stable, the axes of the probe are accurately positioned, and the platform and flatness meet the requirements, thereby laying the foundation for subsequent visual positioning and printing operations.

[0083] Next, in step S5, the camera is used to scan the Mark points on the circuit board in a predetermined order to complete visual positioning. Scanning the Mark points at multiple locations can more accurately determine the specific position of the pad, making up for the shortcomings of mechanical positioning. This step ensures that the pad position is accurately captured, reduces positioning errors, and ensures the accuracy of the next step of printing.

[0084] In step S6, secondary mechanical positioning is performed, mainly to position the print head in the XY and Z directions. By accurately positioning the print head, the print head is ensured to be in the correct position in the pad area, thereby avoiding misalignment or deviation during the printing process. Secondary positioning further improves the accuracy of the operation and provides a guarantee for the accuracy of printing.

[0085] Finally, before S7 pad printing, the system debugs the printing parameters. This debugging mainly includes the adjustment of height compensation and ink output compensation. Height compensation debugging ensures that the print head maintains a suitable distance from the PCB surface to avoid precision loss or ink diffusion; ink output compensation adjustment ensures that the print head outputs the right amount of ink to form a complete pad by adjusting the output of ink. These detailed debugging ensures high precision and high quality during the pad repair process.

[0086] like Figure 2 As shown, a fast and accurate pad repair device provided by an embodiment of the present invention includes a base 1, an upper cover 2, a printing platform 3, a calibration component 4, a debugging area 5, an X-axis 6, a clamping component 7, a print head 8, a gas support 9, a power switch 10, an indicator light 11, and an emergency stop button 12.

[0087] The schematic diagram of the positioning mechanism structure of the pad repair device is as follows Figure 3 As shown, it includes a camera 13, a telescopic probe 14, a print head 15, an XY four-quadrant limiter 16, and a height limiter 17.

[0088] The working principle of this fast and accurate pad repair equipment is as follows:

[0089] First, the base 1 of the device serves as the supporting structure of the entire device and is equipped with multiple key components. The upper cover 2 is connected to the base 1 through the air support 9, ensuring that the device can be easily opened and closed during operation and providing protection for the internal components. The printing platform 3 is installed in the central area of ​​the base 1 and serves as the main working area for pad repair, responsible for carrying the pad or circuit board to be repaired.

[0090] Secondly, the calibration component 4 and the debugging area 5 of the equipment are respectively installed on one side of the printing platform 3, which are used for accurate calibration and testing of the equipment before repairing the pad. The X-axis 6 is connected to the bottom of the printing platform 3, which is used to control the left and right movement of the clamping component 7 and the print head 8 to ensure accurate positioning during the repair process. The XY four-quadrant stopper 16 is fixed on the printing platform 3 to limit the range of movement of the print head 15 during the repair process to avoid exceeding the printing area.

[0091] Next, the clamping component 7 is used to fix the circuit board to be repaired to ensure that it does not move during the repair process. The print head 15 is connected to the clamping component 7 through the X-axis 6 and can be flexibly moved in the three directions of X, Y, and Z. It cooperates with the telescopic probe 14 and the height limiter 17 to achieve accurate repair of the pad. The height limiter 17 is installed on the print head 15 to control the distance between the print head 15 and the circuit board to ensure that the height of the pad is consistent during the repair process.

[0092] Finally, the camera 13 is installed on the base 1 through the connecting bracket, which is responsible for monitoring every detail of the repair process and feeding back the image to the operator. The power switch 10, the indicator light 11 and the emergency stop button 12 are respectively installed on one side of the base 1, which are used to control the start-up of the equipment, the display of the operating status and the stop operation in an emergency, so as to ensure the safety and reliability of the equipment during use.

[0093] The repair effect of the embodiment of the present invention is as follows Figure 4 shown. Figure 4 (a) There are two small defects in the center of the pad. After repair, the effect is as follows Figure 4 (b) as shown. Figure 4 (c) A large area of ​​defect appears in the lower right corner of the pad. Figure 4 In (d), the defect was perfectly repaired.

[0094] To prove the technical advantage of the invention embodiment of "high repair accuracy", the invention embodiment measures the positioning accuracy of the pad repair by comparing the distances between the two groups of pads before and after repair and the reference point, such as Figure 5 shown. Figure 5 (a) shows that the distance between the defective pad and the reference line of the first group before repair is 1.006 mm. Figure 5(b) shows that the distance between the first group of repaired pads and the reference line is 1.002mm, and the repair accuracy is about 4μm. Figure 5 (c) shows that the distance between the defective pad and the reference line of the second group before repair is 1.596 mm. Figure 5 (d) shows that the distance between the second group of repaired pads and the reference line is 1.600mm, and the repair accuracy is about 4μm. It can be seen that the positioning accuracy of the repaired pads in the embodiment of the present invention is relatively high, about 4-5μm, which is significantly improved compared with the pad repair accuracy of the current technology (about ±50μm).

[0095] To prove the technical advantage of the embodiment of the present invention, "fast repair speed", the embodiment of the present invention records the time required to repair 25, 50, 100, 150 and 200 pads, as shown in Table 1. At present, many pad repair technologies have a long repair time, such as CN116347783A "A method for repairing scratches and detachment of miniaturized pads on PCB boards", in which one step of front photolithography takes about 1 hour. When repairing 200 pads in the embodiment of the present invention, the entire process does not exceed 30 minutes, which can greatly improve efficiency. In addition, the more the number of pads to be repaired, the less significant the increase in the repair time of the embodiment of the present invention. It can be seen that the embodiment of the present invention has more prominent advantages in repairing large-area pads.

[0096] Table 1 Repair time of different number of pads

[0097] Number of pads 25 50 100 150 200 time 19 minutes 35 seconds 21 minutes 57 seconds 25 minutes 9 seconds 28 minutes 27 seconds 29 minutes 44 seconds

[0098] The above description is only a specific implementation mode of the present invention, but the protection scope of the present invention is not limited thereto. Any modifications, equivalent substitutions and improvements made by any technician familiar with the technical field within the technical scope disclosed by the present invention and within the spirit and principle of the present invention should be covered by the protection scope of the present invention.

Claims

1. A fast and accurate pad repair method, characterized in that: The method specifically includes: S1: Provide a circuit board with defective pads; S2: Import the Gerber file of the circuit board into the computer and prepare to start the repair work; S3: Mark the point; S4: Mechanically locate the defective pad (probe); S5: Visually locate the defective pad; S6: Perform secondary mechanical positioning of the defective pad (print head); S7: pad printing; S8: pad curing; S9: Pad topography trimming.

2. The fast and accurate pad repair method as claimed in claim 1, characterized in that: In S4, the specific primary mechanical positioning method is: S41: Fixing screw positioning, mainly to check whether the PCB is firmly installed; S42: Probe XY direction positioning, mainly determining the origin position of the probe in the XY direction; S43: Positioning the probe in the Z-axis direction, mainly determining the origin position of the probe in the Z-axis direction; S44: Bottom surface flatness detection, mainly to detect whether the equipment platform is flat; S45: PCB flatness detection, mainly detects whether the PCB surface is flat.

3. The fast and accurate pad repair method as claimed in claim 1, characterized in that: In S5, the specific visual positioning method is: the camera scans the mark points marked in step S3 in the order of upper right, upper middle, upper left, middle left 1, middle left 2, lower right, lower middle, lower right, and middle right.

4. The fast and accurate pad repair method as claimed in claim 1, characterized in that: In S6, the specific secondary mechanical positioning method is: S61: Positioning the print head in the XY direction, mainly determining the origin position of the print head in the XY direction; S62: Positioning the print head in the Z direction, mainly determining the origin position of the print head in the Z direction.

5. The fast and accurate pad repair method as claimed in claim 1, characterized in that: The S7, before the pad is printed, also includes a printing parameter debugging process, which is mainly divided into two parts: (1) Height compensation adjustment: mainly adjust the height of the print head from the PCB surface; (2) Ink output compensation adjustment: mainly adjusts the ink output of the print head.

6. A fast and accurate pad repair device according to claims 1-5, comprising a base (1) and an upper cover (2), characterized in that: The upper cover (2) is connected to the base (1) via a gas support (9), can be easily opened and closed during operation, and provides protection for internal components.

7. The fast and accurate pad repair equipment according to claim 6, characterized in that: The device comprises a calibration component (4) and a debugging area (5) installed on one side of a printing platform (3); an X-axis (6) connected to the bottom of the printing platform (3) for controlling the left and right movement of a clamping component (7) and a print head (15); and limiting the movement range of the print head (15) by an XY four-quadrant limiter (16) installed on the printing platform (3) to ensure accurate positioning of the repair process.

8. The fast and accurate pad repair equipment according to claim 6, characterized in that: The print head (15) of the device is connected to the clamping component (7) via an X-axis (6) and is equipped with a telescopic probe (14) and a height limiter (17) to achieve accurate repair of the pad. The camera (13) is installed above the base (1) to monitor the details of the repair process and provide real-time image feedback to the operator via a display screen.

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