Electroplating equipment for surface treatment of phosphor copper balls

Abstract

The invention discloses electroplating equipment for phosphor copper ball surface treatment, and relates to the technical field of phosphor copper ball electroplating equipment.The electroplating equipment comprises an electroplating bath body, two vertical plates are symmetrically and fixedly connected to the top of the electroplating bath body, and a supporting shaft is rotationally connected between the two vertical plates in a penetrating mode; a motor is fixedly connected to the end of the supporting shaft and located on one side of the outer wall of the vertical plate, a bearing frame is fixedly connected to the outer wall of the right side of the supporting shaft, a storage plate is rotationally connected into the bearing frame, an auxiliary electroplating mechanism is arranged in the bearing frame, and an auxiliary feeding assembly is arranged at the top of the electroplating bath body and located above the bearing frame. A material draining assembly is arranged on the outer wall of the left side of the electroplating bath body, a storage plate vibrates, the phosphor copper balls immersed in electroplating liquid can shake on the surface of the storage plate and between the two partition plates, the effect of changing the positions of the phosphor copper balls can be achieved, the surfaces of the phosphor copper balls can be completely electroplated, the thickness of the electroplated layers of the phosphor copper balls is kept uniform, and the electroplating quality is improved. And the uneven condition is avoided.

Description

Technical Field

[0001] The invention relates to the technical field of phosphor bronze ball electroplating equipment, in particular to an electroplating equipment for surface treatment of phosphor bronze balls. Background Art

[0002] Phosphor copper balls are made of copper alloys containing phosphorus. Phosphor copper has excellent mechanical properties and corrosion resistance and is often used in various industrial fields, such as the manufacture of bearings, valves, joints and other parts. The main reason for electroplating phosphor copper balls is to improve their surface properties and functions. Electroplating can improve the corrosion resistance, conductivity, appearance and other properties of the material by depositing a layer of metal or alloy on the surface of the material.

[0003] After electroplating, a uniform layer of copper or other metal covering will be formed on the surface of the phosphor copper ball, which effectively improves its corrosion resistance and prolongs its service life. At the same time, the electroplating layer can improve the conductivity of the phosphor copper ball, so that it can better conduct current in electrical equipment or electronic products.

[0004] However, the prior art still has the following defects when used specifically:

[0005] The electroplating treatment of the surface of the phosphor copper ball requires an electroplating tank. Secondly, it is necessary to ensure that the phosphor copper ball is in full contact with the electroplating solution, so as to ensure the formation of an electroplated layer with uniform thickness. However, when too many phosphor copper balls are placed in the existing electroplating tank for electroplating, the excessive number of phosphor copper balls are easily accumulated inside the electroplating tank, so that the phosphor copper balls cannot be fully in contact with the electroplating solution, resulting in uneven composition of the electroplated layer of the phosphor copper ball after electroplating and excessive internal stress, which increases the brittleness of the electroplated layer, cracks or falls off, and appears uneven, thereby reducing the electroplating quality of the phosphor copper ball;

[0006] In view of this, the present invention proposes an electroplating device for surface treatment of phosphor bronze balls to make up for and improve the deficiencies of the prior art. Summary of the invention

[0007] In order to solve the above technical problems, the present invention provides an electroplating device for surface treatment of phosphor bronze balls to solve the technical problems raised in the above background technology.

[0008] In order to achieve the above purpose, the technical solution adopted by the present invention is: an electroplating equipment for surface treatment of phosphor bronze balls, including an electroplating tank body, two vertical plates are symmetrically fixedly connected to the top of the electroplating tank body, a support shaft is rotatably connected between the two vertical plates, a motor is fixedly connected to the end of the support shaft and located on one side of the outer wall of the vertical plate, a support frame is fixedly connected to the right outer wall of the support shaft, a storage plate is rotatably connected inside the support frame, an auxiliary electroplating mechanism is arranged inside the support frame, an auxiliary feeding assembly is arranged on the top of the electroplating tank body and located above the support frame, and a material drainage assembly is arranged on the left outer wall of the electroplating tank body.

[0009] Furthermore, the auxiliary electroplating mechanism includes a flap rotatably connected to the inner wall of the supporting frame on the side away from the support shaft, and the inner wall of the supporting frame close to the flap also penetrates and is rotatably connected to a special-shaped roller shaft, the end of the special-shaped roller shaft and located on the outer wall of the supporting frame is fixedly connected to a first connecting rod, the outer wall of the bottom end of the first connecting rod is rotatably connected to a second connecting rod, and the end of the second connecting rod away from the first connecting rod is rotatably connected to the outer wall of the flap, and two circular grooves are symmetrically provided on the inner wall of the end of the storage plate away from the flap, and support rods are inserted into the two circular grooves, the bottoms of the two support rods are fixedly connected to the inner wall of the bottom of the supporting frame, the top side walls of the two support rods are fixedly connected to support springs, and the bottoms of the two support springs are fixedly connected to the top of the storage plate.

[0010] Furthermore, a torsion spring is sleeved on the rotation connection between the flap and the supporting frame, and one end of the special-shaped roller shaft away from the rotation center point is in abutment with the bottom of the storage plate.

[0011] Furthermore, five partitions are evenly and fixedly connected to the top of the storage plate, and the outer contours of the five partitions are all right-angled trapezoids. The side wall of one end of the electroplating tank body away from the supporting axis is fixedly connected to a rectangular plate, and the rectangular plate is located below the supporting frame.

[0012] Furthermore, a first baffle is symmetrically fixedly connected to the top of the support frame and located on both sides of the storage plate, and a plurality of drainage ports are evenly opened on the inner wall of one end of the support frame away from the support shaft.

[0013] Furthermore, the auxiliary feeding component includes guide rails symmetrically fixedly connected to the top of the electroplating tank body, the top of the guide rails are slidably connected to a support frame, the top of the support frame is fixedly connected to a feeding hopper, the outer wall of the electroplating tank body and located on one side of the motor is fixedly connected to an electric push rod, and the output shaft end of the electric push rod is fixedly connected to the outer wall of the support frame.

[0014] Furthermore, the feeding hopper has a rectangular outline shape, and the feeding hopper is located directly above the storage plate.

[0015] Furthermore, the material drainage assembly includes a material receiving box fixedly connected to the left outer wall of the support shaft, a second baffle is fixedly connected to the top of one end of the material receiving box close to the support shaft, a plurality of drainage holes are evenly arranged on the bottom inner wall of the material receiving box, and an isolation plate is inserted into the end of the material receiving box away from the second baffle.

[0016] Furthermore, the second baffle has a Z-shaped contour, the bottom of the second baffle is configured as an inclined plane, the bottom of the material receiving box is configured as an inclined plane, and the inclined plane is lower on the left and higher on the right.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] (1) By setting up an auxiliary electroplating mechanism, when the placement plate with the phosphor copper ball is immersed in the electroplating solution, the placement plate is used to generate vibration, so that the phosphor copper ball immersed in the electroplating solution can shake on the surface of the placement plate and between the two partitions, thereby playing a role in changing the position of the phosphor copper ball, which is conducive to the complete electroplating of the surface of the phosphor copper ball, so that the thickness of the electroplated layer of the phosphor copper ball remains uniform, avoiding unevenness, and improving the electroplating quality of the phosphor copper ball;

[0019] (2) By providing an auxiliary feeding component, the phosphor copper balls can be evenly dropped onto the surface of the storage plate as the feeding hopper moves slowly, which not only ensures the number of phosphor copper balls that can be electroplated at one time, but also helps the phosphor copper balls to be fully in contact with the electroplating solution, thereby improving the efficiency of the phosphor copper ball electroplating process. Compared with the manual direct pouring method used in some small production lines, this improves the operational safety while avoiding contamination of the phosphor copper balls.

[0020] (3) By setting up a material draining component, the phosphor copper balls are allowed to enter the material receiving box to drain the electroplating liquid. After the phosphor copper balls are completely drained, the staff removes the isolation plate to open the material receiving box, thereby facilitating the collection of the drained phosphor copper balls. Compared with the traditional phosphor copper ball electroplating collection method, there is no need for manual salvage and collection inside the electroplating tank body, which reduces the labor of the staff and increases the phosphor copper ball electroplating processing speed. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the main stereoscopic structure of the present invention;

[0022] Figure 2 It is a schematic diagram of the three-dimensional structure from another viewing angle of the present invention;

[0023] Figure 3 It is a side view stereoscopic structural diagram of the relevant parts of the supporting frame of the present invention;

[0024] Figure 4 It is a three-dimensional structural schematic diagram of the relevant components of the flap of the present invention;

[0025] Figure 5 It is a three-dimensional structural cross-sectional view of the relevant parts of the supporting frame of the present invention;

[0026] Figure 6 It is a three-dimensional structural schematic diagram of the relevant components of the storage plate of the present invention;

[0027] Figure 7 It is a three-dimensional structural cross-sectional view of the relevant components of the material receiving box of the present invention;

[0028] Figure 8 It is a partial top view of the stereoscopic structure of the electroplating tank body of the present invention.

[0029] The numbers in the figure are: 1. electroplating tank body; 101. vertical plate; 102. support shaft; 2. motor; 3. supporting frame; 301. storage plate; 302. drain port; 401. flap; 402. special-shaped roller; 403. first connecting rod; 404. second connecting rod; 405. circular groove; 406. support rod; 407. support spring; 501. partition; 502. rectangular plate; 601. first baffle; 701. guide rail; 702. support frame; 703. feeding hopper; 704. electric push rod; 801. material collecting box; 802. second baffle; 803. drain hole; 804. isolation plate. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention;

[0031] Embodiments of the present invention

[0032] Please refer to Figures 1 to 6 As shown, an electroplating device for surface treatment of phosphor bronze balls comprises an electroplating tank body 1, two vertical plates 101 are symmetrically fixedly connected to the top of the electroplating tank body 1, a support shaft 102 is rotatably connected between the two vertical plates 101, a motor 2 is fixedly connected to the end of the support shaft 102 and located on one side of the outer wall of the vertical plate 101, a support frame 3 is fixedly connected to the outer wall of the right side of the support shaft 102, a storage plate 301 is rotatably connected inside the support frame 3, and an auxiliary electroplating mechanism is arranged inside the support frame 3;

[0033] The auxiliary electroplating mechanism includes a flap 401 rotatably connected to the inner wall of the supporting frame 3 on the side away from the support shaft 102, and the inner wall of the supporting frame 3 close to the flap 401 is also penetrated and rotatably connected with a special-shaped roller 402, and the end of the special-shaped roller 402 is fixedly connected to the first connecting rod 403 on the outer wall of the supporting frame 3, and the outer wall of the bottom end of the first connecting rod 403 is rotatably connected to the second connecting rod 404, and the end of the second connecting rod 404 away from the first connecting rod 403 is rotatably connected to the outer wall of the flap 401, and the inner wall of the end of the storage plate 301 away from the flap 401 is symmetrically provided with two circular grooves 405, and support rods 406 are inserted in the two circular grooves 405, and the bottoms of the two support rods 406 are fixedly connected to the inner wall of the bottom of the supporting frame 3, and the top side walls of the two support rods 406 are fixedly connected to support springs 407, and the bottoms of the two support springs 407 are fixedly connected to the top of the storage plate 301;

[0034] When the supporting frame 3 is tilted, the flap 401 will contact the rectangular plate 502, and the rectangular plate 502 will be used to squeeze the flap 401, so that the flap 401 will flip toward the side of the partition 501, and the torsion spring arranged at the connection between the flap 401 and the supporting frame 3 will be squeezed. The flipping of the flap 401 will make the second connecting rod 404 push the first connecting rod 403 to rotate in the clockwise direction, so that the special-shaped roller 402 will rotate synchronously with the first connecting rod 403, causing the end of the special-shaped roller 402 away from the rotation center point to collide with the bottom of the storage plate 301 close to the flap 401 side. Since the storage plate 301 is rotatably connected to the inside of the supporting frame 3, the storage plate 301 is squeezed by the special-shaped roller 402 and flipped toward the side of the support rod 406. During this period, the storage plate 301 slides downward on the outer wall of the support rod 406 by cooperating with the circular groove 405, and the support spring 407 is stretched at the same time. , and when the staff manipulates the motor 2 to rotate eight degrees counterclockwise, the flap 401 is in contact with and separated from the rectangular plate 502, so that the flap 401 is reset under the rebound action of the torsion spring, and the storage plate 301 is not affected by the special-shaped roller 402 and is reset under the rebound action of the support spring 407. In addition, the angle formed by the outer wall of the side of the partition 501 away from the flap 401 and the top of the storage plate 301 is a right angle, so that the phosphor copper ball placed on the top of the storage plate 301 inclined to the side of the flap 401 can be limited to prevent the phosphor copper ball from rolling down. The above process is repeated, so that the storage plate 301 vibrates, so that the phosphor copper ball immersed in the electroplating solution can shake on the surface of the storage plate 301 and between the two partitions 501, so as to change the position of the phosphor copper ball, which is conducive to the complete electroplating of the phosphor copper ball surface, so that the thickness of the phosphor copper ball electroplating layer remains uniform, and the unevenness is avoided;

[0035] Please refer to Figures 4 to 5As shown, as a preferred embodiment, a torsion spring is sleeved at the rotation connection between the flap 401 and the supporting frame 3, the end of the special-shaped roller shaft 402 away from the rotation center point is in abutment with the bottom of the storage plate 301, and five partitions 501 are evenly fixedly connected to the top of the storage plate 301. The outer contours of the five partitions 501 are all right-angled trapezoids. A rectangular plate 502 is fixedly connected to the side wall of the end of the electroplating tank body 1 away from the support shaft 102, and the rectangular plate 502 is located below the supporting frame 3. The first baffle 601 is symmetrically fixedly connected to the top of the supporting frame 3 and located on both sides of the storage plate 301. A plurality of drainage ports 302 are evenly opened on the inner wall of the end of the supporting frame 3 away from the support shaft 102;

[0036] Please refer to Figure 1 , Figure 2 As shown, as a preferred embodiment, an auxiliary material adding component is provided on the top of the electroplating tank body 1 and above the supporting frame 3;

[0037] The auxiliary material adding assembly includes guide rails 701 symmetrically fixedly connected to the top of the electroplating tank body 1, the tops of the two guide rails 701 are slidably connected to support frames 702, the tops of the two support frames 702 are fixedly connected to material adding hoppers 703, the outer wall of the electroplating tank body 1 and located on one side of the motor 2 are fixedly connected to an electric push rod 704, the output shaft end of the electric push rod 704 is fixedly connected to the outer wall of the support frame 702, the outline shape of the material adding hopper 703 is rectangular, and the material adding hopper 703 is located directly above the storage plate 301;

[0038] In the initial state, the support frame 3 is parallel to the surface of the electroplating tank body 1. At this time, the electric push rod 704 is started by using the button on the control panel, so that the output shaft end of the electric push rod 704 carries the support frame 702 to slowly slide on the top of the guide rail 701 toward the side of the motor 2, so that the feeding hopper 703 can move slowly above the placement plate 301. Then, the mechanical arm is used to pour the phosphor copper balls to be electroplated into the feeding hopper 703, so that the phosphor copper balls fall through the bottom outlet of the feeding hopper 703. With the slow movement of the feeding hopper 703, the phosphor copper balls can be evenly dropped on the placement plate 301. 1, not only ensures the number of phosphor copper balls that are electroplated at one time, but also helps the phosphor copper balls to be fully in contact with the electroplating solution, thereby improving the efficiency of the phosphor copper ball electroplating treatment. The partition 501 set on the top of the placement plate 301 can separate the phosphor copper balls accumulated on the surface of the placement plate 301, thereby increasing the gap between the phosphor copper balls, facilitating uniform contact between the phosphor copper balls and the electroplating solution, making the thickness of the phosphor copper ball electroplating layer uniform, which is conducive to improving the effect of the phosphor copper ball electroplating treatment. Compared with the manual direct material pouring method used in some small production lines, it improves the operation safety while avoiding the pollution of the phosphor copper balls;

[0039] Please refer to Figures 1 to 3 , Figure 7 As shown, as a preferred embodiment, a material drain assembly is provided on the left outer wall of the electroplating tank body 1;

[0040] The material drainage component includes a material receiving box 801 fixedly connected to the left outer wall of the support shaft 102, a second baffle 802 is fixedly connected to the top of one end of the material receiving box 801 close to the support shaft 102, a plurality of drainage holes 803 are evenly opened on the inner wall of the bottom of the material receiving box 801, an isolation plate 804 is inserted into the end of the material receiving box 801 away from the second baffle 802, the second baffle 802 has a Z-shaped contour, the bottom of the second baffle 802 is set as an inclined surface, and the bottom of the material receiving box 801 is set as an inclined surface, and the inclined surface is lower on the left and higher on the right;

[0041] Among them, after the electroplating is completed, the staff controls the motor 2 to rotate counterclockwise to reset the supporting frame 3. In this process, the holes on the surface of the storage plate 301 and the partition 501 can be used to separate the electroplating liquid from the phosphor bronze balls and flow into the inside of the supporting frame 3, which has the effect of preliminary drainage. At the same time, the drain port 302 can be used to discharge the electroplating liquid inside the supporting frame 3 into the inside of the electroplating tank body 1 to avoid wasting the electroplating liquid. Then, the motor 2 is controlled to rotate five degrees counterclockwise to make the phosphor bronze balls on the top of the storage plate 301 gradually roll down to the inside of the material receiving box 801. The Z-shaped second baffle 802 is used in conjunction with the material receiving box 801 to play a protective role at the opening of the material receiving box 801, thereby preventing the phosphor bronze balls from falling out of the device and onto the ground outside the device while sliding into the material receiving box 801. While reducing safety hazards in production, it also avoids damage to the finished electroplated phosphor bronze balls. In addition, the outer wall of the partition 501 on the side close to the flap 401 is an inclined surface, so that when the supporting frame 3 and the storage plate 301 are tilted five degrees away from the flap 401, it is convenient for the phosphor copper balls to roll toward the material receiving box 801. By opening the drain hole 803, the phosphor copper balls that have rolled into the material receiving box 801 can continue to drain the electroplating liquid, and the material receiving box 801 is also located above the electroplating tank body 1, so that the drained electroplating liquid can directly fall into the electroplating tank body 1, which is convenient for recycling. After the phosphor copper balls are completely drained, the staff will remove the isolation plate 804 at this time, so that the opening of the material receiving box 801 is opened, so as to facilitate the collection of the drained phosphor copper balls, which plays a role in facilitating collection. Compared with the traditional phosphor copper ball electroplating collection method, there is no need for manual salvage and collection inside the electroplating tank body 1, which reduces the labor of personnel and increases the phosphor copper ball electroplating processing speed.

[0042] The following are the complete usage steps and working principles of the above embodiment:

[0043] When the device is used, the staff adds an appropriate amount of electroplating solution into the electroplating tank body 1, firstly uses chemical cleaning or mechanical polishing to clean and treat the surface of the phosphor copper ball to ensure that the surface is clean and smooth without grease, dirt or oxides, then immerses the surface-treated phosphor copper ball in a pretreatment solution to remove residual dirt and oxides, which can promote the adhesion of the electroplating solution to the surface, and finally puts the phosphor copper ball that has been pretreated and pre-plated into the electroplating tank body 1, and deposits metal ions in the electroplating solution on the surface of the phosphor copper ball by applying a suitable current and voltage to form a uniform electroplating layer, thereby completing the work of electroplating the surface of the phosphor copper ball;

[0044] Please refer to Figure 1 , evenly add phosphor bronze balls:

[0045] First, when the support frame 3 is parallel to the surface of the electroplating tank body 1, the electric push rod 704 is started by using the button on the control panel, so that the output shaft end of the electric push rod 704 brings the support frame 702 to slowly slide on the top of the guide rail 701 toward the side of the motor 2, so that the feeding hopper 703 can be slowly moved above the storage plate 301;

[0046] Then, a mechanical arm is used to pour the phosphor copper balls to be electroplated into the inside of the feeding hopper 703, and more than two outlets are arranged at the bottom of the feeding hopper 703. At the same time, the internal contour of the feeding hopper 703 is funnel-shaped, so that the phosphor copper balls are concentrated and piled above the outlets inside the feeding hopper 703. With the weight of the phosphor copper balls themselves, they can fall in sequence and evenly through the outlet at the bottom of the feeding hopper 703. With the slow movement of the feeding hopper 703, the phosphor copper balls can fall evenly on the surface of the storage plate 301, which not only ensures the one-time electroplating of the phosphor copper balls, but also ensures the smooth operation of the phosphor copper balls. The number of phosphor copper balls is increased, and the phosphor copper balls are in full contact with the electroplating solution, which improves the efficiency of the phosphor copper ball electroplating treatment. The partition plate 501 set on the top of the storage plate 301 can be used to separate the phosphor copper balls accumulated on the surface of the storage plate 301, thereby increasing the gap between the phosphor copper balls, facilitating uniform contact between the phosphor copper balls and the electroplating solution, so that the thickness of the phosphor copper ball electroplating layer is uniform, which is conducive to improving the effect of the phosphor copper ball electroplating treatment. Compared with the manual direct material pouring method used in some small production lines, it improves the operation safety and avoids the pollution of the phosphor copper balls.

[0047] The motor 2 is started by using the button on the control panel, so that the output shaft end of the motor 2 rotates 30 degrees clockwise with the support shaft 102, so as to achieve the purpose of tilting the support frame 3 and the placement plate 301, so that the phosphor bronze balls placed on the surface of the placement plate 301 are completely immersed in the electroplating solution inside the electroplating tank body 1, and the first baffles 601 on both sides of the top of the support frame 3 are used to prevent the phosphor bronze balls from rolling down and falling into the deepest part of the electroplating solution during the tilting of the support frame 3, thereby affecting the subsequent collection of the electroplated phosphor bronze balls;

[0048] Please refer to Figure 5 , simulated vibration to improve electroplating effect:

[0049] When the supporting frame 3 is tilted, the flap 401 will contact the rectangular plate 502, and the rectangular plate 502 will be used to squeeze the flap 401, so that the flap 401 will flip toward the side of the partition 501, and the torsion spring arranged at the connection between the flap 401 and the supporting frame 3 will be squeezed. The flipping of the flap 401 will make the second connecting rod 404 push the first connecting rod 403 to rotate in the clockwise direction, so that the special-shaped roller shaft 402 will rotate synchronously with the first connecting rod 403, causing the end of the special-shaped roller shaft 402 away from the rotation center point to collide with the bottom of the side of the storage plate 301 close to the flap 401. Since the storage plate 301 is rotatably connected to the inside of the supporting frame 3, the storage plate 301 is squeezed by the special-shaped roller shaft 402 and flipped toward the side of the support rod 406. During this period, the storage plate 301 slides downward on the outer wall of the support rod 406 through the matching circular groove 405, and the supporting spring 407 is stretched at the same time. When the staff manipulates the motor 2 to rotate eight degrees counterclockwise, the flap 401 is in contact with and separated from the rectangular plate 502, so that the flap 401 is reset under the rebound action of the torsion spring, and the storage plate 301 is not affected by the special-shaped roller 402 and is reset under the rebound action of the support spring 407. In addition, the angle formed by the outer wall of the side of the partition 501 away from the flap 401 and the top of the storage plate 301 is a right angle, so that the phosphor copper ball placed on the top of the storage plate 301 inclined to the side of the flap 401 can be limited to prevent the phosphor copper ball from rolling down. The above process is repeated, so that the storage plate 301 vibrates, so that the phosphor copper ball immersed in the electroplating solution can shake on the surface of the storage plate 301 and between the two partitions 501, so as to change the position of the phosphor copper ball, which is conducive to the complete electroplating of the phosphor copper ball surface, so that the thickness of the phosphor copper ball electroplating layer is kept uniform, and the unevenness is avoided.

[0050] Please refer to Figure 7 , finished product drain and collect:

[0051] In addition, when the electroplating is completed, the staff controls the motor 2 to rotate counterclockwise to reset the support frame 3. During this process, the holes on the surface of the storage plate 301 and the partition 501 can be used to separate the electroplating liquid from the phosphor bronze balls and flow into the support frame 3, thereby achieving a preliminary draining effect. At the same time, the drain port 302 can be used to discharge the electroplating liquid in the support frame 3 into the electroplating tank body 1 to avoid wasting the electroplating liquid. Subsequently, the motor 2 is controlled to rotate counterclockwise by five degrees, so that the top of the storage plate 301 The phosphor bronze balls gradually roll down to the inside of the material receiving box 801. The Z-shaped second baffle plate 802 cooperates with the material receiving box 801 to protect the opening of the material receiving box 801, thereby preventing the phosphor bronze balls from falling out of the device and onto the ground outside the device during the process of sliding into the material receiving box 801. This reduces safety hazards in production and also avoids damage to the phosphor bronze ball electroplating products. In addition, the outer wall of the partition plate 501 close to the flap 401 is an inclined surface, so that the supporting frame 3 and the storage plate 301 are inclined when they are away from the flap 401. When the material receiving box 801 is tilted five degrees, the phosphor copper balls can roll down toward the receiving box 801. The drain holes 803 are provided so that the phosphor copper balls that have rolled down into the receiving box 801 can continue to drain the electroplating solution. The receiving box 801 is also located above the electroplating tank body 1, so that the drained electroplating solution can directly fall into the electroplating tank body 1 for easy recycling. The bottom of the second baffle 802 is an inclined surface, which can facilitate the phosphor copper balls to slide down and prevent the phosphor copper balls from blocking the opening of the receiving box 801. When the bottom of the receiving box 801 is an inclined surface, The phosphor copper balls can be easily slid into the collecting box 801. During the sliding process, the drain holes 803 can be used to accelerate the separation from the electroplating solution. After the phosphor copper balls are completely drained, the staff will remove the isolation plate 804 to open the collecting box 801, thereby facilitating the collection of the drained phosphor copper balls. Compared with the traditional phosphor copper ball electroplating collection method, there is no need for manual salvage and collection inside the electroplating tank body 1, which reduces the labor of personnel and increases the phosphor copper ball electroplating processing speed.

[0052] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An electroplating device for surface treatment of phosphor bronze balls, comprising an electroplating tank body (1), characterized in that: Two vertical plates (101) are symmetrically fixedly connected to the top of the electroplating tank body (1), a support shaft (102) is rotatably connected to the two vertical plates (101), a motor (2) is fixedly connected to the end of the support shaft (102) and located on one side of the outer wall of the vertical plate (101), a support frame (3) is fixedly connected to the right outer wall of the support shaft (102), and a storage plate (301) is rotatably connected inside the support frame (3); Wherein, an auxiliary electroplating mechanism is arranged inside the supporting frame (3); Wherein, an auxiliary material adding component is arranged on the top of the electroplating tank body (1) and above the supporting frame (3); Wherein, a material drain assembly is provided on the left outer wall of the electroplating tank body (1).

2. The electroplating equipment for surface treatment of phosphor bronze balls according to claim 1, characterized in that: The auxiliary electroplating mechanism comprises a flap (401) rotatably connected to the inner wall of a supporting frame (3) away from the support shaft (102); the inner wall of the supporting frame (3) close to the flap (401) is also penetrated by a rotatably connected special-shaped roller shaft (402); the end of the special-shaped roller shaft (402) is fixedly connected to a first connecting rod (403) located on one side of the outer wall of the supporting frame (3); the outer wall of the bottom end of the first connecting rod (403) is rotatably connected to a second connecting rod (404); the second connecting rod (404) is located away from the first connecting rod (403) on one side. The end is rotatably connected to the outer wall of the flap (401); the inner wall of one end of the storage plate (301) away from the flap (401) is symmetrically provided with two circular grooves (405); support rods (406) are inserted into the two circular grooves (405); the bottoms of the two support rods (406) are fixedly connected to the inner wall of the bottom of the supporting frame (3); the top side walls of the two support rods (406) are fixedly connected to support springs (407); the bottoms of the two support springs (407) are fixedly connected to the top of the storage plate (301).

3. The electroplating equipment for surface treatment of phosphor bronze balls according to claim 2, characterized in that: A torsion spring is sleeved on the rotation connection between the flap (401) and the supporting frame (3), and one end of the special-shaped roller shaft (402) away from the rotation center point is in abutment with the bottom of the storage plate (301).

4. The electroplating equipment for surface treatment of phosphor bronze balls according to claim 2, characterized in that: Five partitions (501) are evenly and fixedly connected to the top of the storage plate (301), and the outer contours of the five partitions (501) are all right-angled trapezoids. A rectangular plate (502) is fixedly connected to the side wall of one end of the electroplating tank body (1) away from the support shaft (102), and the rectangular plate (502) is located below the supporting frame (3).

5. The electroplating equipment for surface treatment of phosphor bronze balls according to claim 1, characterized in that: A first baffle (601) is symmetrically fixedly connected to the top of the support frame (3) and located on both sides of the storage plate (301). A plurality of drainage ports (302) are evenly arranged on the inner wall of one end of the support frame (3) away from the support shaft (102).

6. The electroplating equipment for surface treatment of phosphor bronze balls according to claim 1, characterized in that: The auxiliary material adding component comprises a guide rail (701) symmetrically fixedly connected to the top of the electroplating tank body (1); the top of the guide rail (701) is slidably connected to a support frame (702); the top of the support frame (702) is fixedly connected to a material adding hopper (703); an electric push rod (704) is fixedly connected to the outer wall of the electroplating tank body (1) and located on one side of the motor (2); the output shaft end of the electric push rod (704) is fixedly connected to the outer wall of the support frame (702).

7. The electroplating equipment for surface treatment of phosphor bronze balls according to claim 6, characterized in that: The feeding hopper (703) has a rectangular outline shape and is located directly above the storage plate (301).

8. The electroplating equipment for surface treatment of phosphor bronze balls according to claim 1, characterized in that: The material drainage component includes a material receiving box (801) fixedly connected to the left outer wall of the support shaft (102), a second baffle (802) is fixedly connected to the top of one end of the material receiving box (801) close to the support shaft (102), a plurality of drainage holes (803) are evenly arranged on the bottom inner wall of the material receiving box (801), and an isolation plate (804) is inserted into the end of the material receiving box (801) away from the second baffle (802).

9. The electroplating equipment for surface treatment of phosphor bronze balls according to claim 8, characterized in that: The second baffle (802) has a Z-shaped outline, the bottom of the second baffle (802) is arranged as an inclined surface, and the bottom of the material receiving box (801) is arranged as an inclined surface, and the inclined surface is lower on the left and higher on the right.

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