Manufacturing method of photoelectric sensor

Abstract

The invention belongs to the technical field of sensor manufacturing, and particularly relates to a photoelectric sensor manufacturing method which comprises the following steps: 1) forming a mounting through hole and a light outlet hole in a transmitting end shell; 2) arranging a light source seat coaxially matched with the mounting through hole; 3) fixing the light source seat in the mounting through hole by using glue; 4) arranging a light inlet hole and a wire hole on the receiving end shell; (5) fixedly adhering the CMOS sensor to the center of the front surface of the fixed plate; (6) two glue injection holes are formed in the receiving end shell, and gaps are preset between the glue injection holes and the wire holes; 7) arranging a CMOS sensor and a circuit board near the wire hole in the receiving end shell; in the manufacturing process, the light emitted by the light source can be always parallel to the axis of the light outlet hole of the transmitting end shell during assembly by a worker, and the glue cannot be dripped into a sensing area on the CMOS sensor in the glue dripping process by the worker.

Description

Technical Field

[0001] The present application belongs to the field of sensor manufacturing technology, and specifically relates to a method for manufacturing a photoelectric sensor. Background Art

[0002] The photoelectric sensor includes a transmitter and a receiver. The transmitter emits light, and then the receiver receives the light. Therefore, in the process of manufacturing photoelectric sensors, the position of the light source in the transmitter and the light exit hole often deviates, resulting in the emitted light being not parallel to the axis of the light exit hole, which in turn affects the sensing function of the photoelectric sensor. In addition, when the CMOS sensor in the receiver is installed, glue often drips into the sensing area of ​​the CMOS sensor in order to fix the CMOS sensor. Summary of the invention

[0003] The purpose of this application is mainly to address the shortcomings of the prior art. A method for manufacturing a photoelectric sensor is designed by providing a light source mounting seat that matches the mounting through hole on the transmitting end shell and providing a glue injection hole on the receiving end shell. During the manufacturing process, it can be ensured that the light emitted by the light source is always parallel to the axis of the light outlet hole of the transmitting end shell during assembly by workers, and that the workers will not drip glue into the sensing area of ​​the CMOS sensor during the glue dripping process.

[0004] In order to achieve the above purpose, the technical solution adopted in this application is:

[0005] A method for manufacturing a photoelectric sensor comprises the following steps:

[0006] 1) A mounting through hole and a light exit hole are provided on the transmitting end housing so that the light coaxially entering from the mounting through hole can be emitted from the light exit hole;

[0007] 2) providing a light source seat coaxially matched with the mounting through hole and arranging the light source on the light source seat;

[0008] 3) After adjusting the position of the light source holder in the mounting through hole, the light source holder is fixed in the mounting through hole with glue;

[0009] 4) A light inlet and a wire hole are provided on the receiving end housing;

[0010] 5) The CMOS sensor is fixedly bonded to the center of the front side of the fixing plate, and the projection of the CMOS sensor in the fixing plate is located in the front side of the fixing plate;

[0011] 6) Two glue injection holes are provided on the receiving end housing, and a gap is preset between the glue injection holes and the wire hole;

[0012] 7) A CMOS sensor and a circuit board are arranged in the receiving end shell near the wire hole, so that light coaxially entering the receiving end shell from the light inlet hole can irradiate the photosensitive area on the CMOS sensor, the CMOS sensor signal is connected to the signal input end of the circuit board, and the signal output line of the circuit board is extended from the wire hole to the outside of the receiving end shell, and at the same time, the fixing plate is located at the glue injection hole away from the CMOS sensor.

[0013] Preferably, the step 1) also includes: an additional block is provided on the outer side wall of the transmitting end shell, the mounting through hole passes through the side wall of the transmitting end shell and the additional block, a limiting groove is provided on the additional block, and the limiting groove is connected to one side of the mounting through hole; a limiting block is radially arranged on the light source seat, the length of the projection of the limiting block on the axis of the mounting through hole is less than the length of the projection of the limiting groove on the axis of the mounting through hole, an extension groove is provided on the additional block on the side of the mounting through hole facing away from the limiting groove, one end of the extension groove is between the two ends of the additional block, and the other end extends to the outside of the end of the additional block facing away from the transmitting end shell, the width of the extension groove is greater than or equal to the diameter of the mounting through hole, and the projection of the mounting through hole on the plane where the notch of the extension groove is located is located within the extension groove.

[0014] Preferably, the step 1) further includes disposing a first convex lens in the light exit hole, disposing a first plane mirror in the transmitting end housing on a side facing away from the light exit hole, and the image of the light source in the first plane mirror is located at the focus of the first convex lens.

[0015] Preferably, in step 7), the glue injection hole is located on the bottom wall of the receiving end shell, the fixing plate is located on the side wall of the receiving end shell close to the bottom wall, the two ends of the projection of the fixing plate on the bottom wall of the receiving end shell are respectively located at two glue injection holes, and the projection of the CMOS sensor on the bottom wall of the receiving end shell is located between the two glue injection holes.

[0016] Preferably, the signal output line of the CMOS sensor is a flat cable, and a flat cable socket is provided on the circuit board.

[0017] Preferably, a positioning column is provided on the side wall of the receiving end housing, and a positioning hole cooperating with the positioning column is provided on the fixing plate away from the CMOS sensor.

[0018] Preferably, the projection of the positioning column on the bottom wall of the receiving end shell is located at the glue injection hole.

[0019] Preferably, a second convex lens and a second plane mirror are further provided in the receiving end shell. A second convex lens is coaxially provided at the light inlet, and the second plane mirror is provided in the receiving end shell facing away from the light inlet. Light entering the light inlet from outside the receiving end shell can be focused by the second convex mirror and reflected onto the CMOS sensor.

[0020] Compared with the prior art, this application has the following beneficial effects:

[0021] 1. This paper adopts the method of setting a light source mounting seat that matches the mounting through hole on the transmitting end shell and setting a glue injection hole on the receiving end shell, and designs a method for manufacturing a photoelectric sensor, which can ensure that the light emitted by the light source is always parallel to the axis of the light outlet hole of the transmitting end shell during assembly and that the glue will not be dripped into the sensing area of ​​the CMOS sensor during the glue dripping process. In order to make the photoelectric sensor sense accurately, the light emitted by the transmitter must be parallel light, which can increase the cross section of the light between the transmitter and the receiver.

[0022] 2. After the additional block and the limiting groove are set in the present application, after the light source seat is installed in the mounting through hole, the additional block is inserted into the limiting groove to prevent the light source seat from falling off in the axial direction of the mounting through hole. The setting of the expansion groove is to facilitate the placement of the light source seat into the mounting through hole.

[0023] 3. The present application provides positioning holes and positioning posts, thereby facilitating the preliminary fixing of the CMOS sensor in the receiving end housing during assembly (before glue dripping). BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 This is a schematic diagram of the structure inside the shell of a part of the transmitting end in this application;

[0025] Figure 2 This is a schematic diagram of the structure in which the light source seat is taken out from the transmitting end housing in this application;

[0026] Figure 3 It is a schematic diagram of the structure inside the transmitter housing;

[0027] Figure 4 This is a schematic diagram of the structure inside the housing of a portion of the receiving end in this application;

[0028] Figure 5 for Figure 4 Schematic diagram of the structure in which the CMOS sensor is taken out;

[0029] Figure 6 for Figure 4 The structural diagram on the back;

[0030] Figure 7It is a schematic diagram of the structure inside the receiving end shell.

[0031] Among them, 1. Transmitter housing; 2. Mounting through hole; 3. Light outlet hole; 4. Light source seat; 5. Receiver housing; 6. Light inlet hole; 7. Wire hole; 8. CMOS sensor; 9. Fixing plate; 10. Glue injection hole; 11. Circuit board; 12. Additional block; 13. Limiting groove; 14. Expansion slot; 15. First plane mirror; 16. First convex lens; 17. Positioning column; 18. Positioning hole; 19. Second convex lens; 20. Second plane mirror; 21. Limiting block. DETAILED DESCRIPTION

[0032] like Figure 1-7 As shown, a method for manufacturing a photoelectric sensor comprises the following steps:

[0033] 1) A mounting through hole 2 and a light exit hole 3 are provided on the transmitting end housing 1, so that light coaxially entering from the mounting through hole 2 can be emitted from the light exit hole 3;

[0034] 2) a light source seat 4 is provided which is coaxially matched with the mounting through hole 2 and a light source is arranged on the light source seat 4, so that the light emitted by the light source can be irradiated from the light emitting hole 3 to the outside of the emitting end housing 1;

[0035] 3) After adjusting the position of the light source holder 4 in the mounting through hole 2, the light source holder 4 is fixed in the mounting through hole 2 with glue;

[0036] 4) A light inlet 3 and a wire hole 7 are provided on the receiving end housing 5;

[0037] 5) The CMOS sensor 8 is fixedly bonded to the center of the front surface of the fixing plate 9, and the projection of the CMOS sensor 8 in the fixing plate 9 is located in the front surface of the fixing plate 9;

[0038] 6) Two glue injection holes 10 are provided on the receiving end housing 5, and a gap is preset between the glue injection holes 10 and the wire hole 7. After such a setting, when a worker injects glue to stick the fixing plate 9 into the receiving end housing 5, the glue is prevented from dripping into the sensing area of ​​the CMOS sensor 8;

[0039] 7) A CMOS sensor 8 and a circuit board 11 are arranged in the receiving end shell 5 near the wire hole 7, so that the light coaxially entering the receiving end shell 5 from the light inlet hole 6 can irradiate the photosensitive area on the CMOS sensor 8, and the CMOS sensor 8 signal is connected to the signal input end of the circuit board 11, and the signal output line of the circuit board 11 is extended from the wire hole 7 to the outside of the receiving end shell 5, and at the same time, the fixing plate 9 is located at the injection hole 10 away from the CMOS sensor 8. After such arrangement, the CMOS sensor 8 converts the sensed light into a signal and transmits it to the circuit board 11 for processing, thereby determining whether there is an object (workpiece or part) between the transmitting end shell 1 and the receiving end shell 2.

[0040] In this embodiment, when in use, the cover body (not shown in the figure) on the transmitting end shell 1 is covered, and then the transmitting end shell 1 is installed on one side of the production line, and then the cover body (not shown in the figure) of the receiving end shell 5 is covered, and then the receiving end shell 1 is installed on the other side of the production line, so that the axis of the light outlet hole 3 of the transmitting end shell 1 and the axis of the light inlet hole 6 of the receiving end shell 5 are collinear, and then the light emitted by the transmitting end shell 1 can enter the receiving end shell 1 from the light inlet hole 6 after passing through the light outlet hole 3, so that the light emitted by the transmitting end shell 1 can be irradiated into the photosensitive area on the CMOS sensor 8, and the sensed object is transported on the production line. The CMOS sensor 8 determines whether there is an object by sensing the light, thereby realizing the function of the sensor.

[0041] As a preferred embodiment, the step 1) also includes: an additional block 12 is provided on the outer wall of the transmitting end shell 1, the mounting through hole 2 passes through the side wall of the transmitting end shell 1 and the additional block 12, a limiting groove 13 is provided on the additional block 12, and the limiting groove 13 is connected to one side of the mounting through hole 2; a limiting block 21 is radially arranged on the light source seat 4, the length of the projection of the limiting block 21 on the axis of the mounting through hole 2 is less than the length of the projection of the limiting groove 13 on the axis of the mounting through hole 2, an expansion slot 14 is provided on the additional block 12 on the side of the mounting through hole 2 facing away from the limiting groove 13, one end of the expansion slot 14 is between the two ends of the additional block 12, and the other end extends to the outside of the end of the additional block 12 facing away from the transmitting end shell 1, the width of the expansion slot 14 is greater than or equal to the diameter of the mounting through hole 2, and the projection of the mounting through hole 2 on the plane where the notch of the expansion slot 14 is located is located within the expansion slot 14.

[0042] After the additional block 12 and the limiting groove 13 are arranged in this way, after the light source seat 4 is installed in the mounting through hole 2, the additional block 12 is inserted into the limiting groove 13 to prevent the light source seat 4 from falling off in the axial direction of the mounting through hole 2. The setting of the expansion groove 14 is to facilitate the placement of the light source seat 4 into the mounting through hole 2.

[0043] Preferably, a limiting protrusion 22 is provided on the two side walls of the expansion slot 14 parallel to the axis of the mounting through hole 2, near the opening of the expansion slot 14, and a convex ridge 23 is provided on the side of the light source seat 4 facing away from the limiting block 12. When the light source seat 4 is installed in the mounting through hole 2, the two side walls of the convex ridge 23 parallel to the axis of the light source seat 4 fit with the two side walls of the convex ridge 23 parallel to the axis of the light source seat 4, so that during assembly, after the worker presses the light source seat 4 into the mounting through hole 2 by hand, he presses the side of the convex ridge 23 facing away from the limiting block 21 by hand, so that the light source seat 4 can be limited so that the axis of the light source seat 4 is parallel to the axis of the mounting through hole 2, and the setting of the limiting protrusion 22 is to prevent the light source seat 4 from radially falling off from the opening of the expansion slot 14. The distance from one side of the limiting protrusion 22 facing the mounting hole 2 to the side of the mounting hole 2 facing away from the limiting protrusion 22 is greater than the diameter of the mounting hole 2 plus the height of the limiting block 21 on the light source seat 4. This makes it convenient to install the light source seat 4 into the mounting hole 2 and insert the limiting block 21 into the limiting groove 13 at the same time during assembly.

[0044] As a preferred mode, the step 1) further includes arranging a first convex lens 16 in the light exit hole 3, arranging a first plane mirror 15 on a side of the transmitting end housing 1 facing away from the light exit hole 3, and the image of the light source in the first plane mirror 15 is located at the focus of the first convex lens 16. After such arrangement, the light emitted by the light source enters the first convex lens 16 after being emitted by the first plane mirror 15, and then is emitted from the first convex lens 16. The image of the light source in the first plane mirror 15 is located at the focus of the first convex lens 16, so that the light emitted from the first convex lens 16 is parallel light, and it is convenient for the receiving end to aggregate the light emitted by the light source through the second convex lens 19, thereby facilitating the light to be concentrated to the sensing area of ​​the CMOS sensor 8.

[0045] As a preferred mode, in the step 7), the glue injection hole 10 is located on the bottom wall of the receiving end housing 5, the fixing plate 9 is located on the side wall of the receiving end housing 5 near the bottom wall, the two ends of the projection of the fixing plate 9 on the bottom wall of the receiving end housing 5 are respectively located at two glue injection holes 10, and the projection of the CMOS sensor 8 on the bottom wall of the receiving end housing 5 is located between the two glue injection holes 10. After such arrangement, the glue injected from the glue injection hole 10 will not drip onto the CMOS sensor 8.

[0046] As a preferred embodiment, the signal output line of the CMOS sensor 8 is a flat cable, and a flat cable socket is provided on the circuit board 11 .

[0047] As a preferred mode, a positioning column 17 is provided on the side wall of the receiving end housing 5, and a positioning hole 18 cooperating with the positioning column 17 is provided on the fixing plate 9 away from the CMOS sensor 8. By providing the positioning hole 18 and the positioning column 17, it is convenient to initially fix the CMOS sensor 8 in the receiving end housing 5 during assembly. Preferably, an elastic rubber sleeve is sleeved on the outer circumference of the positioning column 17, and the outer diameter of the positioning column 17 is smaller than the inner diameter of the positioning hole 18. The outer diameter of the outer circumference of the positioning column 17 after the rubber sleeve is sleeved is larger than the inner diameter of the positioning hole 18. In this way, the CMOS sensor 8 can be stably fixed in the receiving end housing 5 during initial fixation.

[0048] As a preferred embodiment, the projection of the positioning column 17 on the bottom wall of the receiving end housing 5 is located at the glue injection hole 10. After such arrangement, the glue can enter the gap between the positioning column 17 and the positioning hole 18, thereby making the CMOS sensor 8 more stable.

[0049] As a preferred mode, a second convex lens 19 and a second plane mirror 20 are further provided in the receiving end housing 5. The second convex lens 19 is coaxially provided at the light inlet 6. The second plane mirror 20 is provided in the receiving end housing 5 at a position facing away from the light inlet 6. The light entering the light inlet 6 from the outside of the receiving end housing 5 can be reflected onto the CMOS sensor 8 after being focused by the second convex mirror 19. After such arrangement, the light entering the light inlet 16 is focused and emitted onto the CMOS sensor 8 after passing through the second convex lens 19, so that the CMOS sensor 8 can sense the light emitted by the light source, and the sensing surface of the CMOS sensor 8 does not need to be made very large during manufacturing, so that the volume of the receiving end housing 5 does not need to be made very large.

Claims

1. A method for manufacturing a photoelectric sensor, characterized in that: The steps include: 1) A mounting through hole (2) and a light exit hole (3) are provided on the transmitting end housing (1), so that light coaxially entering from the mounting through hole (2) can be emitted from the light exit hole (3); 2) providing a light source seat (4) coaxially matched with the mounting through hole (2) and arranging the light source on the light source seat (4); 3) After adjusting the position of the light source holder (4) in the mounting through hole (2), the light source holder (4) is fixed in the mounting through hole (2) using glue; 4) A light inlet hole (3) and a wire hole (7) are provided on the receiving end housing (5); 5) The CMOS sensor (8) is fixedly bonded to the center of the front surface of the fixing plate (9), and the projection of the CMOS sensor (8) in the fixing plate (9) is located in the front surface of the fixing plate (9); 6) Two glue injection holes (10) are provided on the receiving end housing (5), and a preset gap is provided between the glue injection holes (10) and the wire hole (7); 7) A CMOS sensor (8) and a circuit board (11) are arranged in the receiving end housing (5) near the wire hole (7), so that light coaxially entering the receiving end housing (5) from the light inlet hole (6) can irradiate the photosensitive area on the CMOS sensor (8), the signal of the CMOS sensor (8) is connected to the signal input end of the circuit board (11), and the signal output line of the circuit board (11) is extended from the wire hole (7) to the outside of the receiving end housing (5), and at the same time, the fixing plate (9) is located at the glue injection hole (10) away from the CMOS sensor (8).

2. The method for manufacturing a photoelectric sensor according to claim 1, characterized in that: The step 1) further comprises: an additional block (12) is provided on the outer side wall of the transmitting end housing (1), the mounting through hole (2) penetrates the side wall of the transmitting end housing (1) and the additional block (12), a limiting groove (13) is provided on the additional block (12), and the limiting groove (13) is communicated with one side of the mounting through hole (2); a limiting block (21) is radially provided on the light source seat (4), and the length of the projection of the limiting block (21) on the axis of the mounting through hole (2) is less than the length of the limiting groove (13) on the mounting through hole (2). The additional block (12) is provided with an expansion slot (14) on a side of the mounting through hole (2) facing away from the limiting slot (13); one end of the expansion slot (14) is between the two ends of the additional block (12), and the other end extends outside an end of the additional block (12) facing away from the transmitting end housing (1); the width of the expansion slot (14) is greater than or equal to the diameter of the mounting through hole (2); and the projection of the mounting through hole (2) on the plane where the notch of the expansion slot (14) is located is located within the expansion slot (14).

3. The method for manufacturing a photoelectric sensor according to claim 1, characterized in that: The step 1) also includes arranging a first convex lens (16) in the light exit hole (3), arranging a first plane mirror (15) on a side of the emission end housing (1) facing away from the light exit hole (3), and the image of the light source in the first plane mirror (15) is located at the focus of the first convex lens (16).

4. The method for manufacturing a photoelectric sensor according to claim 1, characterized in that: In the step 7), the glue injection hole (10) is located on the bottom wall of the receiving end housing (5), the fixing plate (9) is located on the side wall of the receiving end housing (5) close to the bottom wall, the two ends of the projection of the fixing plate (9) on the bottom wall of the receiving end housing (5) are respectively located at the two glue injection holes (10), and the projection of the CMOS sensor (8) on the bottom wall of the receiving end housing (5) is located between the two glue injection holes (10).

5. The method for manufacturing a photoelectric sensor according to claim 1, characterized in that: The signal output line of the CMOS sensor (8) is a flat cable, and a flat cable socket is provided on the circuit board (11).

6. The method for manufacturing a photoelectric sensor according to claim 4, characterized in that: A positioning column (17) is provided on the side wall of the receiving end housing (5), and a positioning hole (18) cooperating with the positioning column (17) is provided on the fixing plate (9) away from the CMOS sensor (8).

7. The method for manufacturing a photoelectric sensor according to claim 4, characterized in that: The projection of the positioning column (17) on the bottom wall of the receiving end housing (5) is located at the glue injection hole (10).

8. The method for manufacturing a photoelectric sensor according to claim 3, characterized in that: A second convex lens (19) and a second plane mirror (20) are also provided in the receiving end housing (5); the second convex lens (19) is coaxially provided at the light inlet (6); the second plane mirror (20) is provided in the receiving end housing (5) at a position facing away from the light inlet (6); and light entering the light inlet (6) from outside the receiving end housing (5) can be reflected onto the CMOS sensor (8) after being focused by the second convex mirror (19).

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