Fin type water cooling, heating and power separation copper substrate and LED module manufacturing method

Abstract

The invention relates to the technical field of LED lighting source packaging, and particularly discloses a fin-type water-cooling-heating-power separation copper substrate and an LED module manufacturing method, and the method comprises the following steps: S1, selecting a copper plate, and cutting the copper plate; step S2, etching a boss; step S3, attaching the PCB circuit board; s4, shoveling teeth; s5, CNC machining is carried out; s6, boss surface treatment is carried out; step S7, fixing the LED chip; step S8, welding a wire; s9, dotting / powder spraying; step S10, protecting the glass sheet; and step S11, testing and sorting. According to the invention, the traditional packaging substrate is changed, the fins on the copper substrate are in direct contact with the cooling liquid, the level from the LED chip to the radiator is reduced, the heat flow channel is shortened, the heat resistance of the light source is reduced, and more advanced heat conduction materials are adopted, so that the long-term stable and effective light output of the LED light source is ensured; and the heat dissipation structure and the weight of the lighting device can be greatly reduced.

Description

Technical Field

[0001] The invention belongs to the technical field of LED lighting source packaging, and in particular relates to a fin-type water-cooled thermal-electric separation copper substrate and an LED module manufacturing method. Background Art

[0002] LED consists of two parts, one is a P-type semiconductor and the other is an N-type semiconductor. When these two semiconductors are connected, a PN junction is formed between them. When the current acts on the chip through the wire, it will emit energy in the form of photons and generate light. During the operation of LED, 15%-25% of the electrical energy is converted into light energy, and the rest of the electrical energy is converted into heat energy, which increases the temperature of the LED.

[0003] LED lighting sources in the prior art basically use packaged LED devices, use thermal grease, thermal pads and other materials as the intermediate thermal conductive layer, and then fix them on the heat sink with screws or other fastening devices for heat dissipation. This traditional heat dissipation structure has too many layers and the thermal conductivity of the materials in each layer is different. After the heat emitted by the PN junction of the LED chip is transferred to the heat sink, the thermal resistance is too large, and a bottleneck of heat transfer is formed in the entire heat channel, resulting in the temperature on the PN junction of the LED chip cannot be transferred quickly and smoothly in time. Therefore, it can only be used as a heat dissipation solution for light sources with low power or low power density.

[0004] With the widespread application of LED semiconductor lighting, more and more special fields require higher power density light output. As the light output power per unit area increases, the heat emitted per unit area of ​​the LED chip PN junction will also increase. (For lighting devices that require more than two optical treatments, the larger the LED light-emitting surface, the larger the optical structure, the longer the focal length, and the greater the brightness demand, the larger the light-emitting surface must be, which will inevitably affect the structural size of the device.) Therefore, in lighting devices that require higher light output, in order to achieve higher power light output, the LED power density must be as high as possible to reduce the size of the LED light source. The resulting problem is that for LED light sources with a power of more than 200w, if traditional heat dissipation structures are used, it is difficult to smoothly conduct the heat generated by the LED, thereby affecting the LED life and the stable light output of the lighting device.

[0005] With the continuous emergence of high-power density chips, their packaging and application technologies must also be improved accordingly. Traditional packaging methods, because their thermal management technology is not more perfectly combined with the application end, result in high-power density chips failing to achieve optimal light output, and their application in special lighting devices is also greatly reduced, with limitations in efficiency, life, appearance and other aspects. Summary of the invention

[0006] The purpose of the present invention is to address the deficiencies of the prior art and provide a fin-type water-cooled thermal-electric separation copper substrate and an LED module manufacturing method to solve the technical problem in the prior art that if a high-power LED light source uses a traditional heat dissipation structure, it is difficult to smoothly conduct the heat generated by the LED.

[0007] The purpose of the present invention can be achieved through the following technical solutions:

[0008] A method for manufacturing a fin-type water-cooled thermal-electric separation copper-based LED module, the method comprising the following steps:

[0009] Step S1: Select copper plates for cutting, and cut copper plates of suitable thickness into panels or single pieces of suitable sizes to obtain copper substrates;

[0010] Step S2: etching the boss, coating the boss of designed size in the middle of the cut copper substrate, etching the PCB circuit board pressing area in the area outside the boss on the copper substrate by etching process, and making the boss exposed;

[0011] Step S3: PCB circuit board lamination, laminating or coating the adhesive material in the laminating area of ​​the PCB circuit board, then aligning the PCB circuit board of suitable thickness with the adhesive material in the laminating area of ​​the PCB circuit board for lamination and installation, and finally heating and laminating the laminating PCB circuit board;

[0012] Step S4: tooth-cutting, placing the copper substrate on a tooth-cutting lathe with the side opposite to the corresponding boss facing upward, and starting to perform tooth-cutting operation on the area on this side to form fins;

[0013] Step S5: CNC machining, CNC machining a sealing area, that is, the area of ​​the LED chip to be sealed, machining a suitable edge size, and drilling the required suitable fixing holes;

[0014] Step S6: Surface treatment of the boss: metal plating, roughening, or cleaning the surface of the boss;

[0015] Step S7: Fix the LED chip, fix the LED chip on the boss, and bake the LED chip at a baking temperature within a specific range;

[0016] Step S8: soldering wires, according to the designed serial-parallel circuit mode, bonding gold wires to connect the PCB circuit board and the LED chip, and performing reflow soldering to form a complete circuit;

[0017] Step S9: dotting / powder spraying, dotting / powder spraying operation is performed on the LED chip to obtain a specific color temperature within the range of 1800-15000k, and then baking it to finalize;

[0018] Step S10: Protecting the glass sheet: Protect the product with fixed chip, determined color temperature and wavelength. Use a concave high-temperature resistant glass sheet with air guide holes to put it upside down on the LED chip. The LED chip needs to be placed in the concave range. Use high-temperature resistant glue to bond the glass sheet and bake it to shape.

[0019] Step S11: testing and sorting, testing electrical properties, optical parameters, void ratio, appearance and other technical parameters, and packaging qualified products for use.

[0020] A fin-type water-cooled thermal-electric separation copper substrate, and a method for manufacturing an LED module using the above-mentioned fin-type water-cooled thermal-electric separation copper substrate, comprising:

[0021] Copper substrate;

[0022] Boss, the copper substrate is provided with a boss which is integrated with the copper substrate, a package carrier is provided on the boss, the package carrier has a chip area, and an LED chip is installed in the chip area;

[0023] Fins, a plurality of fins are provided on a side of the copper substrate opposite to the boss, and the plurality of fins are integrally shoveled out on the copper substrate by a shovel-tooth lathe;

[0024] A heat sink is installed on the copper substrate, and a plurality of fins are located inside the heat sink.

[0025] As a preferred embodiment of the above technical solution, the radiator includes a water pump, a water tank, coolant and a cooling fan.

[0026] As a preferred embodiment of the above technical solution, the fins have a thickness of 0.09-1 mm, a spacing of 0.08-2 mm, and a height of 0.5-20 mm.

[0027] As a preferred embodiment of the above technical solution, the boss portion is removed from one side of the copper substrate provided with the boss to etch out a PCB circuit board pressing area, and a PCB circuit board is pressed and installed in the PCB circuit board pressing area.

[0028] As a preferred embodiment of the above technical solution, after the PCB circuit board is pressed on the PCB circuit board pressing area on the copper substrate, the PCB circuit board is flush with the boss, and the depth of the PCB circuit board pressing area after etching is between 0.08-2mm and the thickness of the PCB circuit board.

[0029] As a preferred embodiment of the above technical solution, a bonding adhesive is filled between the packaging carrier on the boss and the LED chip, and a bonding gold wire is connected between the LED chip and the PCB circuit board.

[0030] As a preferred embodiment of the above technical solution, solder paste is applied to the joint part between the boss and the PCB circuit board, an aluminum nitride ceramic substrate with a fixed LED chip is placed on the boss and the PCB circuit board, and a bonding gold wire is connected between the aluminum nitride ceramic substrate with a fixed LED chip and the PCB circuit board.

[0031] The beneficial effects of the present invention are:

[0032] 1. In the present invention, the traditional package carrier is changed, so that the fins on the copper substrate are directly in contact with the coolant, the layers from the LED chip to the radiator are reduced, the heat flow channel is shortened, the thermal resistance of the light source is reduced, and more advanced thermal conductive materials are used, thereby ensuring the long-term stable and effective light output of the LED light source, and also greatly reducing the heat dissipation structure and weight of the lighting device;

[0033] 2. In the present invention, a number of densely packed fins greatly increase the contact area of ​​the copper substrate. When used, the fins are completely placed in the coolant in the water tank, and all surfaces are wrapped by the coolant, so that the heat derived from the fins is transferred to the water, and the high-temperature water is circulated through the water pump to contact the aluminum water tank, and the high temperature in the water is transferred to the surface of the aluminum water tank, and then the heat is dissipated through the heat dissipation fan, so that the temperature on the fins always maintains a virtuous cycle, and the temperature of the LED pin can also be controlled within 70°C, and the temperature will not gather on the PN junction of the LED chip, thereby protecting the LED chip, making the LED chip more stable, and being able to operate continuously under the optimal light output state;

[0034] 3. In the present invention, the die-bonding adhesive, the copper substrate and the aluminum nitride ceramic substrate with the LED chip fixed thereon are all materials with high thermal conductivity. Therefore, in the entire heat dissipation path, it can ensure that the heat flow is smoothly transferred to the fins on the copper substrate, and then cooperate with the heat sink to dissipate heat, which greatly improves the heat dissipation effect;

[0035] 4. In the present invention, the LED chip combination is denser and more compact. With the same power, the light-emitting surface can be made smaller. Since the light-emitting surface can be made smaller, the focal length of the lighting device that needs to focus light can be made shorter, thereby improving the focusing ability and improving the lighting effect. Since the focusing system with a short focal length often requires a smaller structural size when achieving the same focusing effect, the use of short focal length optical elements can reduce the overall volume and weight of the device, making it easier to carry and use, and also conducive to the installation and integration of the device;

[0036] 5. In the present invention, the packaging process is relatively simple, the material requirements in the application process are more economical, and the amount of copper used is greatly reduced, playing a leading role in truly environmentally friendly green lighting. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 It is a schematic diagram of the structure of the copper substrate from a top view;

[0038] Figure 2 It is a schematic diagram of the front cross-sectional structure of the copper substrate;

[0039] Figure 3 It is a schematic diagram of the structure after the boss die bonding method;

[0040] Figure 4 This is a schematic diagram of the structure after the boss SMT operation;

[0041] Figure 5 This is a schematic diagram of the enlarged structure of the fin;

[0042] Figure 6 It is a schematic diagram of the structure of the pressing area of ​​the PCB circuit board;

[0043] Figure 7 It is a schematic diagram of the heat flow path structure;

[0044] Figure 8 The present invention is a process flow chart of a fin-type water-cooled thermal-electric separation copper substrate and a method for manufacturing an LED module package.

[0045] In the figure:

[0046] 1. LED chip; 2. Bonding gold wire; 3. Die-bonding glue; 4. Package carrier; 5. Solder paste; 8. PCB circuit board; 9. Copper substrate; 10. Fins; 11. Boss; 12. Heat sink; 13. Chip area; 14. PCB circuit board pressing area. DETAILED DESCRIPTION

[0047] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0048] like Figure 1-Figure 8 As shown, a method for manufacturing an LED module with a fin-type water-cooled thermal and electrical separation copper substrate comprises the following steps:

[0049] Step S1: Select copper plates for cutting, and cut copper plates of suitable thickness into panels or single pieces of suitable sizes to obtain copper substrates 9;

[0050] Specifically, a copper plate with a thickness of 2mm-10mm is selected. The material of the copper plate is pure copper, also known as red copper, which has good processing ductility and a thermal conductivity of 401W / MK. Such a high thermal conductivity can transfer heat well, thereby improving the heat dissipation effect.

[0051] Step S2: etching the boss 11, coating the boss 11 of designed size in the middle of the cut copper substrate 9, etching the PCB circuit board pressing area 14 in the area outside the boss 11 on the copper substrate 9 by etching process, and making the boss 11 exposed;

[0052] Specifically, the area of ​​the boss 11 on the surface of the copper substrate 9 is coated with a developing corrosion-resistant material, and the area on the copper substrate 9 that is not coated with the developing corrosion-resistant material is etched; the depth of the PCB circuit board pressing area 14 is etched to be 0.08-2mm; the area of ​​the boss 11 is 200-10000 square millimeters, which is determined by the specific power design; the area of ​​the boss 11 is used to directly install the high thermal conductivity nano silver glue solid-crystal LED chip 1 or the aluminum nitride ceramic substrate on which the LED chip 1 is bonded.

[0053] Step S3: PCB circuit board 8 is laminated, the adhesive material is laminated or coated on the PCB circuit board pressing area 14, and then the PCB circuit board 8 of appropriate thickness is aligned with the adhesive material on the PCB circuit board pressing area 14 for lamination and installation, and finally the laminated PCB circuit board 8 is heated and pressed;

[0054] Specifically, the temperature of the PCB circuit board 8 during heating and pressing is 120-150 degrees, and the time is 60-150 minutes; the depth of the pressing area 14 of the PCB circuit board after etching is determined by the thickness of the PCB circuit board 8 matched therewith, and the PCB circuit board 8 can match the depth of the pressing area 14 of the PCB circuit board. Usually, the depth of the pressing area 14 of the PCB circuit board after etching is between 0.08-2mm and the thickness of the PCB circuit board 8; after the PCB circuit board 8 is pressed on the copper substrate 9, the height of the PCB circuit board 8 is flush with the height of the boss 11, and the error is ensured to be within 0.15mm, thereby reducing the void rate during welding; the PCB circuit board 8 and the LED chip 1 on the boss 11 form a complete circuit loop; the material of the PCB circuit board 8 can be all high temperature and high current resistant circuit board materials such as FR-4, TB, FPC, etc.

[0055] Step S4: tooth removal, the copper substrate 9 is placed on a tooth removal lathe with the side opposite to the boss 11 facing upward, and the tooth removal operation is started on the area on this side to form the fin 10;

[0056] Specifically, the fins 10 have a thickness of 0.09-1 mm, a spacing of 0.08-2 mm, and a height of 0.5-20 mm.

[0057] Step S5: CNC machining, CNC machining a sealing area, that is, the area to be sealed of the LED chip 1, machining a suitable edge size, and drilling a suitable fixing hole;

[0058] Step S6: Surface treatment of the boss 11, performing metal plating treatment or roughening and cleaning treatment on the surface of the boss 11;

[0059] Specifically, the metal plating material on the surface of the boss 11 can be gold, nickel, nickel-palladium-gold, silver, tin and other metals, which is determined according to the specific packaging application.

[0060] Step S7: Fix the LED chip 1, fix the LED chip 1 on the boss 11, and bake the LED chip 1 at a baking temperature within a specific range;

[0061] Specifically, the LED chip 1 can be fixed by a crystal bonding method or by an SMT operation method. If the crystal bonding method is adopted, the LED chip 1 is used. If the SMT operation method is adopted, an aluminum nitride ceramic substrate for fixing the LED chip 1 is used. Wherein, when the crystal bonding method is adopted, it is necessary to perform a metal plating treatment on the surface of the boss 11 in step S6, and then apply a crystal bonding glue 3 on the boss 11. The crystal bonding glue 3 can be a nano silver glue or a sintered silver paste. Then, the LED chip 1 is placed on the boss 11 with the crystal bonding glue 3 applied, and then the crystal bonding glue 3 is baked at a corresponding material temperature. Baking and fixing, wherein the curing temperature of the nano silver glue is 150°C, the curing time is 90-150 minutes, the sintering temperature of the sintered silver is 310°C, the sintering time is 90-150 minutes, the thermal conductivity of the nano silver glue is 220W / MK, and the thermal conductivity of the sintered silver is 310W / MK, both of which are high thermal conductivity materials, thereby improving the heat dissipation effect; in addition, when the solid crystal method is adopted, if the LED chip 1 is a horizontal structure, the solid crystal can be directly carried out, if the LED chip 1 is a vertical structure, the silicon wafer must be placed before the solid crystal, so as to ensure the thermal and electrical separation;

[0062] When SMT is used, the surface of the boss 11 needs to be roughened and cleaned in step S6, and then solder paste 5 is applied to the boss 11 and the PCB circuit board 8, and the aluminum nitride ceramic substrate with the LED chip 1 fixed thereon is placed on the boss 11, and then vacuum reflow soldering is performed to ensure that the void rate is less than 5%; wherein, the thermal conductivity of aluminum nitride ceramic is 320W / (m·K), and its high thermal conductivity can transfer heat very well.

[0063] Step S8: Wire bonding: according to the designed serial-parallel circuit mode, bonding gold wires 2 are used to connect the PCB circuit board 8 and the LED chip 1 or the aluminum nitride ceramic substrate with the LED chip 1 fixed thereon, and reflow soldering is performed to form a complete circuit;

[0064] Specifically, the bonding gold wire 2 has a diameter of 1.0-2.0 mil and a purity of 99.99%. The bonding gold wire 2 serves as a wire connection in the LED package. When current is turned on, the current enters the LED chip 1 through the bonding gold wire 2, thereby making the LED chip 1.

[0065] Step S9: dotting / powder spraying, performing dotting / powder spraying operation on the LED chip 1 to obtain a specific color temperature within the range of 1800-15000k, and baking it to finalize;

[0066] Specifically, according to market demand, a dot / powder spraying operation is performed above the LED chip 1, the purpose of which is to achieve the generation of white light and improve the light color consistency and yield rate of LED products; this step S is limited to the LED white light process, and the LED chip 1 itself can skip this step S if it has different wavelengths of light.

[0067] Step S10: Protecting the glass sheet: Protect the product with fixed chip, determined color temperature and wavelength. Use a concave high temperature resistant glass sheet with air guide holes to put it upside down on the LED chip 1. The LED chip 1 needs to be placed in the concave range. Use high temperature resistant glue to bond the glass sheet and bake to fix it.

[0068] Specifically, the high temperature resistant adhesive uses AB components, which are mixed in a ratio of 1:1 and used with a baking temperature of 150 degrees and a baking time of 60 minutes.

[0069] Step S11: testing and sorting, testing electrical properties, optical parameters, void ratio, appearance and other technical parameters, and packaging qualified products for use.

[0070] A fin-type water-cooled thermal-electric separation copper substrate, and a method for manufacturing an LED module using the above-mentioned fin-type water-cooled thermal-electric separation copper substrate, comprising:

[0071] Copper substrate 9;

[0072] Boss 11, the copper substrate 9 is provided with a boss 11 which is integrated with the copper substrate 9, the boss 11 is provided with a package carrier 4, the package carrier 4 has a chip area 13, and the LED chip 1 is installed in the chip area 13;

[0073] Fins 10, a plurality of fins 10 are provided on a side of the copper substrate 9 opposite to the boss 11, and the plurality of fins 10 are integrally shoveled out on the copper substrate 9 by a shovel-tooth lathe;

[0074] The heat sink 12 is mounted on the copper substrate 9 , and a plurality of fins 10 are located inside the heat sink 12 .

[0075] The radiator 12 includes a water pump, a water tank, coolant and a cooling fan.

[0076] In one case of this embodiment, the water tank is an aluminum water tank with good thermal conductivity; the coolant includes refrigerant, water-cooling liquid, water and other liquids that can quickly reduce the temperature; the water pump drives the high-temperature water flow to circulate; the heat dissipation fan is in contact with the aluminum water tank to dissipate the heat conducted from the aluminum water tank.

[0077] In actual application of this embodiment, a plurality of fins 10 greatly increase the contact area of ​​the copper substrate 9. When in use, the fins 10 are completely placed in the coolant in the water tank, and all surfaces are wrapped by the coolant, so that the heat derived from the fins 10 is transferred to the water, and the high-temperature water is circulated through the water pump to contact the aluminum water tank, and the high temperature in the water is transferred to the surface of the aluminum water tank, and then the heat is dissipated through the heat dissipation fan, so that the temperature on the fins 10 always maintains a virtuous cycle, and the temperature of the LED pin can also be controlled within 70°C, and the temperature will not gather on the PN junction of the LED chip 1, thereby protecting the LED chip 1, making the LED chip 1 more stable and able to operate continuously under the optimal light output state;

[0078] At the same time, the fins 10 on the copper substrate 9 are in direct contact with the coolant, which reduces the number of levels from the LED chip 1 to the heat sink 12, shortens the heat flow channel, reduces the thermal resistance of the light source, and uses more advanced thermal conductive materials, thereby ensuring long-term stable and effective light output of the LED light source, and can also greatly reduce the heat dissipation structure and weight of the lighting device.

[0079] The thickness of the fins 10 is 0.09-1 mm, the spacing is 0.08-2 mm, and the height is 0.5-20 mm. In actual application of this embodiment, the dense fins 10 greatly increase the contact area of ​​the copper substrate 9, thereby improving the heat dissipation effect.

[0080] The copper substrate 9 has a side with the boss 11 on which the boss 11 is removed and a PCB circuit board pressing area 14 is etched out to remove the boss 11. The PCB circuit board 8 is pressed and installed in the PCB circuit board pressing area 14.

[0081] After the PCB circuit board 8 is pressed onto the PCB circuit board pressing area 14 on the copper substrate 9, the PCB circuit board 8 is flush with the boss 11, and the depth of the PCB circuit board pressing area 14 after etching is between 0.08-2mm and the thickness of the PCB circuit board 8.

[0082] A bonding adhesive 3 is filled between the package carrier 4 on the boss 11 and the LED chip 1 , and a bonding gold wire 2 is connected between the LED chip 1 and the PCB circuit board 8 .

[0083] The joint part of the boss 11 and the PCB circuit board 8 is dotted with solder paste 5, and the aluminum nitride ceramic substrate with the LED chip 1 fixed is placed on the boss 11 and the PCB circuit board 8. The bonding gold wire 2 is connected between the aluminum nitride ceramic substrate with the LED chip 1 fixed and the PCB circuit board 8.

[0084] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments, and the above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, and these changes and improvements all fall within the scope of the present invention to be protected.

Claims

1. A method for manufacturing a fin-type water-cooled thermal and electrical separation copper substrate LED module, characterized in that: The method comprises the following steps S: Step S1: Select copper plates for cutting, and cut copper plates of suitable thickness into panels or single pieces of suitable sizes to obtain copper substrates (9); Step S2: etching the boss (11), coating the boss (11) of designed size in the middle of the cut copper substrate (9), etching the PCB circuit board pressing area (14) in the area outside the boss (11) on the copper substrate (9) by etching process, and exposing the boss (11); Step S3: PCB circuit board (8) is bonded, bonding or coating the adhesive material in the PCB circuit board pressing area (14), and then aligning the PCB circuit board (8) of suitable thickness with the adhesive material in the PCB circuit board pressing area (14) for bonding and installation, and finally heating and bonding the bonded PCB circuit board (8); Step S4: tooth removal, placing the copper substrate (9) on a tooth removal lathe with the side opposite to the boss (11) facing upward, and starting tooth removal operation on the area on this side to form fins (10); Step S5: CNC machining, CNC machining a sealing area, that is, the area of ​​the LED chip (1) to be sealed, machining a suitable edge size, and drilling a suitable fixing hole; Step S6: Surface treatment of the boss (11), performing metal plating treatment or roughening and cleaning treatment on the surface of the boss (11); Step S7: Fixing the LED chip (1) to the boss (11); Step S8: soldering wires, bonding gold wires (2) to connect the PCB circuit board (8) and the LED chip (1) according to the designed serial-parallel circuit mode, and performing reflow soldering to form a complete circuit; Step S9: dotting / powder spraying, performing dotting / powder spraying operation on the LED chip (1) to obtain a specific color temperature within the range of 1800-15000k, and baking it to finalize the color temperature; Step S10: glass sheet protection, to protect the product with fixed chip, determined color temperature and wavelength, using a concave high temperature resistant glass sheet with air guide holes to be inverted on the LED chip (1), the LED chip (1) needs to be placed in the concave range, and the glass sheet is bonded with high temperature resistant glue and baked to shape; Step S11: testing and sorting, testing electrical properties, optical parameters, void ratio, appearance and other technical parameters, and packaging qualified products for use.

2. A fin-type water-cooled thermal-electric separation copper substrate, characterized in that: A method for manufacturing an LED module using a fin-type water-cooled thermal and electrical separation copper substrate as described in claim 1, comprising: Copper substrate (9); A boss (11), wherein the copper substrate (9) is provided with a boss (11) which is integral with the copper substrate (9), a packaging carrier (4) is provided on the boss (11), a chip area (13) is provided on the packaging carrier (4), and an LED chip (1) is installed in the chip area (13); Fins (10), a plurality of fins (10) are provided on a surface of the copper substrate (9) opposite to the boss (11), and the plurality of fins (10) are integrally shoveled out and formed on the copper substrate (9) by a shovel-tooth lathe; A heat sink (12), wherein the copper substrate (9) is provided with the heat sink (12), and a plurality of fins (10) are located inside the heat sink (12).

3. The fin-type water-cooled thermal-electric separation copper substrate according to claim 2, characterized in that: The radiator (12) comprises a water pump, a water tank, coolant and a cooling fan.

4. The fin-type water-cooled thermal-electric separation copper substrate according to claim 3, characterized in that: The fins (10) have a thickness of 0.09-1 mm, a spacing of 0.08-2 mm, and a height of 0.5-20 mm.

5. The fin-type water-cooled thermal-electric separation copper substrate according to claim 2, characterized in that: The copper substrate (9) is provided with a boss (11) on one side thereof, and the boss (11) is partially removed and etched to form a PCB circuit board pressing area (14), wherein a PCB circuit board (8) is pressed and installed in the PCB circuit board pressing area (14).

6. The fin-type water-cooled thermal-electric separation copper substrate according to claim 5, characterized in that: After the PCB circuit board (8) is pressed onto the PCB circuit board pressing area (14) on the copper substrate (9), the PCB circuit board (8) is flush with the boss (11), and the depth of the PCB circuit board pressing area (14) after etching is within a range of 0.08-2 mm from the thickness of the PCB circuit board (8).

7. The fin-type water-cooled thermal-electric separation copper substrate according to claim 2, characterized in that: A crystal bonding adhesive (3) is filled between the packaging carrier board (4) on the boss (11) and the LED chip (1), and a bonding gold wire (2) is connected between the LED chip (1) and the PCB circuit board (8).

8. The fin-type water-cooled thermal-electric separation copper substrate according to claim 2, characterized in that: The joint portion between the boss (11) and the PCB circuit board (8) is dotted with solder paste (5), an aluminum nitride ceramic substrate with an LED chip (1) fixed thereon is placed on the boss (11) and the PCB circuit board (8), and a bonding gold wire (2) is connected between the aluminum nitride ceramic substrate with the LED chip (1) fixed thereon and the PCB circuit board (8).

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