Hybrid refrigeration base structure based on semiconductor and use method

Abstract

The invention discloses a hybrid refrigeration base structure based on a semiconductor and a using method, and belongs to the technical field of heat dissipation. The hybrid refrigeration base structure comprises a semiconductor refrigeration flat plate and a refrigeration part, and the semiconductor refrigeration flat plate is installed on the outer side of the refrigeration part; the refrigeration part comprises a clamping plate, a cooling pipe and a cooling fin; the clamping plate is detachably installed on the inner side of the cooling fin and comprises a first plane structure, a second plane structure and a cambered surface structure, the cambered surface structure is arranged between the first plane structure and the second plane structure, and the first plane structure, the second plane structure and the cambered surface structure are integrated. The first plane structure and the second plane structure are respectively fixed on two adjacent radiating fins; cooling grooves are formed in the clamping plate at equal intervals; the refrigeration parts are connected in series and then fixed to the heat exchange pipeline curved surface of the converter valve, the converter transformer and other equipment, and the problem that an existing semiconductor refrigeration device can only be fixed to a plane and cannot be fixed to the curved surface is solved.

Description

Technical Field

[0001] The present invention relates to the field of heat dissipation technology, and in particular to a semiconductor-based hybrid refrigeration base structure and a use method thereof. Background Art

[0002] The semiconductor refrigeration equipment currently used in industry mainly adopts direct cooling. The semiconductor adopts a metal plate structure and is attached to the surface of the object to be refrigerated to directly cool the surface. The existing semiconductor refrigeration structure is mainly a flat structure, and there is no specific cooling type for the curved surface structure. The existing semiconductor refrigeration equipment mainly adopts direct cooling, and the disadvantages in use are:

[0003] 1. Limited application environment: Fixed cooling cannot be performed on curved and irregular surfaces.

[0004] 2. Small cooling area: A semiconductor refrigeration structure can only cool one plane and cannot achieve all-round cooling.

[0005] 3. It can only cool solids but not liquids, and cannot achieve the effect of mixed cooling. Summary of the invention

[0006] The present invention provides a hybrid structure based on a semiconductor refrigeration technology solution and a method of use, which is used for auxiliary cooling of cooling pipes of converter valves, converter transformers and phase modulators in converter stations, and solves the problem that the cooling systems of the above-mentioned equipment are difficult to recover quickly in a short time after a failure. The device can be quickly deployed to assist in cooling the equipment cooling system, improve the equipment operating status, and ensure the stability of DC power transmission.

[0007] The present invention adopts the following technical solution:

[0008] A semiconductor-based hybrid refrigeration base structure comprises: a semiconductor refrigeration plate and a refrigeration element, wherein the semiconductor refrigeration plate is installed on the outside of the refrigeration element; the refrigeration element comprises: a first refrigeration element, a second refrigeration element and a third refrigeration element, wherein the first refrigeration element, the second refrigeration element and the third refrigeration element are connected in series to form a whole; the first refrigeration element, the second refrigeration element and the third refrigeration element all comprise: a clamping plate, a cooling pipe and a heat sink; the clamping plate is detachably installed on the inner side of the heat sink, the clamping plate comprises: a first plane structure, a second plane structure and a curved surface structure, the curved surface structure is arranged between the first plane structure and the second plane structure, the first plane structure, the second plane structure and the third plane structure are connected in series to form a whole; ... The surface structure and the arc surface structure are a whole, the first plane structure and the second plane structure are respectively fixed on two adjacent heat sinks; cooling grooves are provided on the clamping plate at equal intervals; the second refrigeration component also includes: a sub-connection structure and a parent connection structure; a sub-connection structure is provided at one end of the first plane structure away from the arc surface structure, and the sub-connection structure is provided with no less than two first protrusions, each of which is penetrated by a fixing hole, and the pin passes through the fixing hole and is detachably fixed, and a parent connection structure is provided at one end of the second plane structure away from the arc surface structure, and a second protrusion is provided on the parent connection structure, which is staggered with the sub-connection structure, and each second protrusion is provided with a rotation hole.

[0009] According to the semiconductor-based hybrid refrigeration base structure, the heat sink is in a rectangular shape, a fin is provided on one side of the heat sink, two edges of a pair of heat sinks are close together, and adjacent surfaces form an angle.

[0010] According to the semiconductor-based hybrid refrigeration base structure, the angle adjustment range is: 60° to 90°.

[0011] According to the semiconductor-based hybrid refrigeration base structure, the semiconductor refrigeration plate is detachably mounted on a side of the heat sink with fins to dissipate heat from the pipeline.

[0012] According to the semiconductor-based hybrid refrigeration base structure, the cooling pipe is arranged in the cooling tank, and the two ends of the cooling pipe are fixedly connected to the conversion joints for docking and converting the transport carrier of the external cooling medium and the cooling pipe; the cooling pipe is arranged in a U shape.

[0013] According to the semiconductor-based hybrid refrigeration base structure, a fixing platform is provided at one end of the first refrigeration component, a connecting hole is opened on the fixing platform, and a female connecting structure is provided at the other end of the first refrigeration component.

[0014] According to the semiconductor-based hybrid refrigeration base structure, a fixing platform is provided at one end of the third refrigeration component, and a female connection structure is provided at the other end.

[0015] According to the semiconductor-based hybrid refrigeration base structure, the sub-connection structure and the mother-connection structure are used for the flexible connection of the first refrigeration component, the second refrigeration component and the third refrigeration component.

[0016] According to the semiconductor-based hybrid refrigeration base structure, a handle is fixedly installed at one end of the clamping plate to facilitate the operator's transportation and assembly.

[0017] A method for using a semiconductor-based hybrid refrigeration base structure comprises the following steps:

[0018] The operator lifts the first refrigeration unit and the fixing platform of the third refrigeration unit by hand and connects them together, and fixes the two together by screws and nuts;

[0019] Connect several of the second refrigeration components in series through the sub-connection structure and the main connection structure according to the needs;

[0020] The operator flexibly connects the parent connection structure of the first refrigeration component to the child connection structure of the second refrigeration component connected in series;

[0021] The operator flexibly connects the sub-connection structure of the third refrigeration component to the main connection structure of the second refrigeration component connected in series;

[0022] The operator fixedly connects the assembled first refrigeration component, the second refrigeration component, and the third refrigeration component to the pipeline through screws and nuts.

[0023] Compared with the prior art, the beneficial effects of the present invention include at least:

[0024] 1. The present application solves the problem that the existing semiconductor refrigeration device can only be fixed on a plane but not on a curved surface by connecting the first refrigeration element, the second refrigeration element and the third refrigeration element in series and fixing them on the curved surface of the heat exchange pipe of the converter valve, converter transformer and other equipment;

[0025] 2. The hybrid refrigeration base structure of the present application can utilize the curvature of the pipe to allow multiple semiconductor refrigeration plates to cool simultaneously, thereby increasing the refrigeration power;

[0026] 3. The present application can utilize the space on the curved surface of the pipe, and can fix two hybrid refrigeration base structures connected in series on the circular pipe to perform all-round refrigeration on the pipe, thereby doubling the refrigeration efficiency;

[0027] 4. In the hybrid refrigeration base structure of the present application, cooling pipes are deployed in the clamping plates of direct refrigeration, and the refrigeration characteristics of semiconductors can be utilized. The refrigerant medium flowing into the cooling pipes performs heat exchange to achieve both direct refrigeration and indirect refrigeration effects. Direct refrigeration and indirect refrigeration coexist in one refrigeration plate, and the two refrigeration modes can coexist or be used separately. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It is a schematic diagram of the structure of the first refrigeration component of the present invention;

[0029] Figure 2 It is a schematic diagram of the structure of the second refrigeration component of the present invention;

[0030] Figure 3 It is a schematic diagram of the structure of the third refrigeration component of the present invention;

[0031] Figure 4 It is a front view of the refrigeration component of the present invention after assembly;

[0032] Figure 5 It is a schematic diagram of the three-dimensional structure of the refrigeration component after assembly of the present invention;

[0033] Figure 6 It is a top view of the refrigeration component of the present invention after assembly.

[0034] In the figure: 100, first refrigeration component; 200, second refrigeration component; 300, third refrigeration component; 1, semiconductor refrigeration plate; 3, clamping plate; 31, first plane structure; 32, second plane structure; 33, arc surface structure; 34, cooling groove; 35, sub-connection structure; 351, first protrusion; 352, latch; 36, mother connection structure; 361, second protrusion; 362, rotating hole; 37, fixing platform; 371, connecting hole; 4, cooling pipe; 5, conversion joint; 6, handle; 7, heat sink; 71, fin; 8, screw; 9, nut. DETAILED DESCRIPTION

[0035] In order to make the purpose, technical scheme and advantages of the present invention clearer, the technical scheme of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. The embodiments described in this application are only part of the embodiments of the present invention, not all of them. Based on the spirit of the present invention, other embodiments obtained by ordinary technicians in this field without creative work are all within the scope of protection of the present invention.

[0036] like Figure 1-6 As shown, the present invention provides a semiconductor-based hybrid refrigeration base structure, which can be directly cooled by fitting the pipe at the outer end of the converter valve, and can also be indirectly cooled by a cooling medium through the cooling pipeline on the device. The technical solution of the present invention is explained in detail, and the specific implementation method is explained in conjunction with the accompanying drawings.

[0037] Embodiment 1:

[0038] like Figure 1-6As shown, this embodiment provides a semiconductor-based hybrid refrigeration base structure, including: a semiconductor refrigeration plate 1 and a refrigeration element, the semiconductor refrigeration plate 1 is installed on the outside of the refrigeration element, and the first refrigeration element 100, the second refrigeration element 200 and the third refrigeration element 300 are connected in series to form a whole; the refrigeration element includes: a first refrigeration element 100, a second refrigeration element 200 and a third refrigeration element 300.

[0039] The first refrigeration component 100, the second refrigeration component 200 and the third refrigeration component 300 each include: a clamping plate 3, a cooling tube 4 and a heat sink 7;

[0040] The clamping plate 3 is detachably mounted on the inner side of the heat sink 7. The clamping plate 3 includes: a first plane structure 31, a second plane structure 32 and a curved surface structure 33. The curved surface structure 33 is arranged between the first plane structure 31 and the second plane structure 32. The first plane structure 31, the second plane structure 32 and the curved surface structure 33 are a whole. The first plane structure 31 and the second plane structure 32 are respectively fixed on two adjacent heat sinks 7. Cooling grooves 34 are opened on the clamping plate 3 at equal intervals.

[0041] The cooling pipe 4 is arranged in the cooling groove 34, and the two ends of the cooling pipe 4 are fixedly connected to the conversion joints 5 for docking and converting the transport carrier of the external cooling medium and the cooling pipe 4; a handle 6 is fixedly installed at one end of the clamping plate 3 for facilitating the operator's transportation and assembly.

[0042] The heat sink 7 is in the shape of a rectangular parallelepiped, and a fin 71 is provided on one side of the heat sink 7. The two edges of a pair of heat sinks 7 are close together, and the adjacent surfaces form a certain angle. The angle can be adjusted according to the diameter of the pipeline. When the diameter of the pipeline is large, the angle is small, and vice versa, the angle is large, thereby completely wrapping the pipeline.

[0043] The angle adjustment range is: 60°~90°.

[0044] The semiconductor refrigeration plate 1 is detachably mounted on a side of the heat sink 7 with the fins 71 to dissipate heat from the pipeline.

[0045] like Figure 2 As shown, the second refrigeration component 200 also includes: a sub-connection structure 35 and a parent connection structure 36; the sub-connection structure 35 is arranged at one end of the first planar structure 31 away from the arc surface structure 33, and the sub-connection structure 35 is provided with no less than two first protrusions 351, each of the first protrusions 351 is penetrated with a fixing hole, and the latch 352 passes through the fixing hole and is detachably fixed, and the parent connection structure 36 is arranged at one end of the second planar structure 32 away from the arc surface structure 33, and the parent connection structure 36 is provided with a second protrusion 361 staggered with the sub-connection structure 35, and each second protrusion 361 is provided with a rotation hole 362.

[0046] like Figure 1 As shown, a fixing platform 37 is disposed at one end of the first refrigeration component 100 , a connecting hole 371 is opened on the fixing platform 37 , and a female connecting structure 36 is disposed at the other end of the first refrigeration component 100 .

[0047] like Figure 3 As shown, the third refrigeration component 300 is provided with a fixing platform 37 at one end and a female connection structure 36 at the other end.

[0048] The first protrusion 351 and the second protrusion 361 are staggered, and the latch 352 can be inserted into the rotation hole 362 ; the fixing platform 37 of the first refrigeration component 100 and the third refrigeration component 300 are fixedly connected by the screw 8 passing through the connection hole 371 and the nut 9 .

[0049] The sub-connection structure 35 and the main connection structure 36 are used for flexible connection of the first refrigeration component 100 , the second refrigeration component 200 and the third refrigeration component 300 .

[0050] The first refrigeration component 100, the second refrigeration component 200 and the third refrigeration component 300 are all processed with curved surfaces by plate cutting, and embedded 8 mm cooling pipes 4 are used inside.

[0051] The cooling tube 4 is made of copper and is fixed in the cooling groove 34 on the clamping plate 3 by using a brazing process.

[0052] The cooling pipes 4 are arranged in a U shape, with a total length of 1.8 m, to increase the cooling area; a conversion joint 5 is used for connecting an external cooling medium.

[0053] Use the handle 6 for assembly and debugging. When in use: two semiconductor refrigeration plates 1 are used to cool the first plane structure 31 and the second plane structure 32 of the clamping plate 3, respectively. The clamping plate 3 is made of copper. At the same time, the cooling medium inside the cooling tube 4 can also be used for cooling.

[0054] Embodiment 2:

[0055] This embodiment provides a method for using a semiconductor-based hybrid refrigeration base structure, comprising the following steps:

[0056] S1. The operator lifts the first refrigeration component 100 and the fixing platform 37 of the third refrigeration component 300 by the handle 6 and connects them together, and fixes them together by the screw 8 and the nut 9;

[0057] S2, connecting several second refrigeration components 200 in series through the sub-connection structure 35 and the main connection structure 36 according to the needs;

[0058] S3, the operator flexibly connects the main connection structure 36 of the first refrigeration component 100 with the sub-connection structure 35 of the second refrigeration component 200 connected in series;

[0059] S4, the operator flexibly connects the sub-connection structure 35 of the third refrigeration component 300 to the main connection structure 36 of the second refrigeration component 200 connected in series;

[0060] S5. The operator fixes the assembled first refrigeration component 100, the second refrigeration component 200, and the third refrigeration component 300 to the pipeline through the screw rod 8 and the nut 9.

[0061] When in use: the first refrigeration element 100, the second refrigeration element 200, the third refrigeration element 300 and the pipeline are fixedly connected and fixed by means of screw rods 8 and nuts 9, and the curvature of the first refrigeration element 100, the second refrigeration element 200 and the third refrigeration element 300 is accurately fitted to the pipeline. The semiconductor refrigeration plate 1 is used to cool the first refrigeration element 100, the second refrigeration element 200 and the third refrigeration element 300. The cold energy is transferred to the pipeline to complete the pipeline refrigeration.

[0062] Compared with the prior art, the beneficial effects of the present invention include at least:

[0063] 1. The present application solves the problem that the existing semiconductor refrigeration device can only be fixed on a plane but not on a curved surface by connecting the first refrigeration element, the second refrigeration element and the third refrigeration element in series and fixing them on the curved surface of the heat exchange pipe of the converter valve, converter transformer and other equipment;

[0064] 2. The hybrid refrigeration base structure of the present application can utilize the curvature of the pipe to allow multiple semiconductor refrigeration plates to cool simultaneously, thereby increasing the refrigeration power;

[0065] 3. The present application can utilize the space on the curved surface of the pipe, and can fix two hybrid refrigeration base structures connected in series on the circular pipe to perform all-round refrigeration on the pipe, thereby doubling the refrigeration efficiency;

[0066] 4. In the hybrid refrigeration base structure of the present application, cooling pipes are deployed in the clamping plates of direct refrigeration, and the refrigeration characteristics of semiconductors can be utilized. The refrigerant medium flowing into the cooling pipes performs heat exchange to achieve both direct refrigeration and indirect refrigeration effects. Direct refrigeration and indirect refrigeration coexist in one refrigeration plate, and the two refrigeration modes can coexist or be used separately.

[0067] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the above embodiments, ordinary technicians in the relevant field should understand that the specific implementation methods of the present invention can still be modified or replaced by equivalents, and any modifications or equivalent replacements that do not depart from the spirit and scope of the present invention should be covered within the scope of protection of the claims of the present invention.

Claims

1. A semiconductor-based hybrid refrigeration base structure, comprising: A semiconductor refrigeration plate (1) and a refrigeration component, wherein the semiconductor refrigeration plate (1) is installed on the outside of the refrigeration component; the characteristics are: The refrigeration element comprises: a first refrigeration element (100), a second refrigeration element (200) and a third refrigeration element (300); the first refrigeration element (100), the second refrigeration element (200) and the third refrigeration element (300) are connected in series to form a whole; The first refrigeration element (100), the second refrigeration element (200) and the third refrigeration element (300) each include: A clamping plate (3), a cooling tube (4) and a heat sink (7); The clamping plate (3) is detachably mounted on the inner side of the heat sink (7), and the clamping plate (3) comprises: a first plane structure (31), a second plane structure (32) and a curved surface structure (33), wherein the curved surface structure (33) is arranged between the first plane structure (31) and the second plane structure (32), the first plane structure (31), the second plane structure (32) and the curved surface structure (33) are a whole, and the first plane structure (31) and the second plane structure (32) are respectively fixed on two adjacent heat sinks (7); cooling grooves (34) are provided on the clamping plate (3) at equal intervals; The second refrigeration component (200) further comprises: a sub-connection structure (35) and a mother-connection structure (36); a sub-connection structure (35) is arranged at one end of the first planar structure (31) away from the arc surface structure (33); the sub-connection structure (35) is provided with no less than two first protrusions (351); each first protrusion (351) is penetrated by a fixing hole; a latch (352) passes through the fixing hole and is detachably fixed; a mother-connection structure (36) is arranged at one end of the second planar structure (32) away from the arc surface structure (33); a second protrusion (361) is arranged on the mother-connection structure (36) and is offset from the sub-connection structure (35); each second protrusion (361) is provided with a rotation hole (362).

2. A semiconductor-based hybrid refrigeration base structure according to claim 1, characterized in that: The heat sink (7) is in the shape of a rectangular parallelepiped, and a fin (71) is provided on one side of the heat sink (7). Two edges of a pair of heat sinks (7) are closely attached to each other, and adjacent surfaces form an angle.

3. The semiconductor-based hybrid refrigeration base structure according to claim 2, characterized in that: The angle adjustment range is: 60°~90°.

4. The semiconductor-based hybrid refrigeration base structure according to claim 2, characterized in that: The semiconductor refrigeration plate (1) is detachably mounted on a side of the heat sink (7) with fins (71) to dissipate heat from the pipeline.

5. The semiconductor-based hybrid refrigeration base structure according to claim 1, characterized in that: The cooling pipe (4) is arranged in the cooling tank (34), and the two ends of the cooling pipe (4) are fixedly connected to the conversion joints (5) for docking and converting the transport carrier of the external cooling medium and the cooling pipe (4); The cooling pipes (4) are arranged in a U shape.

6. The semiconductor-based hybrid refrigeration base structure according to claim 1, characterized in that: A fixing platform (37) is provided at one end of the first refrigeration component (100), a connection hole (371) is provided on the fixing platform (37), and a female connection structure (36) is provided at the other end of the first refrigeration component (100).

7. The semiconductor-based hybrid refrigeration base structure according to claim 6, characterized in that: The third refrigeration component (300) is provided with a fixing platform (37) at one end and a female connection structure (36) at the other end.

8. The semiconductor-based hybrid refrigeration base structure according to claim 1, characterized in that: The sub-connection structure (35) and the main connection structure (36) are used for the flexible connection of the first refrigeration component (100), the second refrigeration component (200) and the third refrigeration component (300).

9. The semiconductor-based hybrid refrigeration base structure according to claim 1, characterized in that: A handle (6) is fixedly mounted on one end of the clamping plate (3) to facilitate handling and assembly by operators.

10. A method for using a semiconductor-based hybrid refrigeration base structure, characterized in that: A semiconductor-based hybrid refrigeration base structure according to any one of claims 1 to 9, comprising the following steps: The operator lifts the first refrigeration unit (100) and the fixing platform (37) of the third refrigeration unit (300) by the handle (6), connects them together, and fixes the two together by the screw rod (8) and the nut (9); According to the demand, a plurality of second refrigeration components (200) are connected in series via the sub-connection structure (35) and the main connection structure (36); An operator flexibly connects the mother connection structure (36) of the first refrigeration component (100) to the child connection structure (35) of the second refrigeration component (200) connected in series; The operator flexibly connects the sub-connection structure (35) of the third refrigeration component (300) to the main connection structure (36) of the second refrigeration component (200) connected in series; The operator fixedly connects the assembled first refrigeration component (100), the second refrigeration component (200), and the third refrigeration component (300) to the pipeline via a screw rod (8) and a nut (9).

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