Method and device for constructing secondary piping assembly process of semiconductor production line

Abstract

The invention discloses a construction method and device for a secondary piping assembly process of a semiconductor production line, and the method comprises the steps: calling secondary piping assembly data in a pre-constructed database according to the primary input of a user; based on a preset secondary piping assembly assembling logic, giving a two-dimensional pipeline logic relation graph of two-dimensional graph connection of each secondary piping assembly, and forming an initial assembling process of the secondary piping of the semiconductor production line by combining a legend of a corresponding two-dimensional graph; based on the secondary input of the user, the initial assembly process of the secondary piping of the semiconductor production line is optimized, and the assembly process of the secondary piping of the semiconductor production line is constructed. According to the semiconductor production line secondary piping assembly process construction scheme provided by the invention, the standardization and automation degree of assembly process design are improved, the design efficiency is improved, the consistency and expandability of secondary piping assembly are enhanced, the accuracy and readability of the secondary piping assembly process are improved, and the pipeline construction cost of secondary piping is reduced.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor production, and in particular relates to a method and device for constructing a secondary piping assembly process of a semiconductor production line. Background Art

[0002] In the semiconductor manufacturing process, the secondary piping of the semiconductor production line refers to the process of connecting the main process equipment with auxiliary systems (such as gas, chemicals, pure water, etc.). The traditional secondary piping assembly process drawing relies on manual labor, which is not only time-consuming and labor-intensive, but also prone to errors.

[0003] At the same time, with the continuous development of semiconductor manufacturing technology, the complexity of the main process equipment, auxiliary systems and the connections between them in semiconductor manufacturing is increasing, and the traditional secondary piping assembly process drawing method can no longer meet the needs of rapid development.

[0004] At present, there have been some studies on automation software and model platforms for process flow drawing. For example, patent CN117077458A provides a method and device for constructing a dynamic simulation model of an electronic product production line, the method comprising: based on the process route of the electronic product production line, providing the layout information, manufacturing information and logistics task information of the electronic product production line; building an electronic product production line layout model according to the layout information of the electronic product production line; according to the layout model of the electronic product production line, combined with a preset coding strategy, providing the layout link parameters of the electronic product production line, the layout link parameters are used to associate the layout information and manufacturing information of the electronic product production line; embedding a calling module in the layout model of the electronic product production line to obtain a dynamic simulation model of the electronic product production line, the calling module is used to call the logistics task information according to the layout link parameters. This solution quickly and accurately obtains a dynamic simulation model from the layout model of the electronic product production line, has extremely strong universality, and improves the dynamic simulation effect of the electronic product production line.

[0005] However, current automation software, model platforms, etc. lack the corresponding processing capabilities for the graphic conversion, data storage, and standardized output process of secondary piping components.

[0006] Therefore, how to design a secondary piping assembly process construction plan suitable for semiconductor production lines to achieve automated output of the secondary piping assembly process and improve the accuracy and readability of the secondary piping assembly process is an urgent problem to be solved by technical personnel in this field. Summary of the invention

[0007] In view of the defects existing in the above-mentioned prior art, the present invention provides a method and device for constructing the secondary piping assembly process of a semiconductor production line. According to the user's primary input, the secondary piping component data in the pre-constructed database is retrieved; based on the preset secondary piping component assembly logic, a two-dimensional pipeline logic relationship diagram of the two-dimensional graphics connecting each secondary piping component is given, and combined with the legend of the corresponding two-dimensional graphics, the initial assembly process of the secondary piping of the semiconductor production line is formed; based on the user's secondary input, the initial assembly process of the secondary piping of the semiconductor production line is optimized, and the assembly process of the secondary piping of the semiconductor production line is constructed. The semiconductor production line secondary piping assembly process construction scheme provided by the present invention not only improves the degree of automation of assembly process design, but also improves design efficiency through the standardized setting of legends and two-dimensional graphics, enhances the consistency and scalability of the semiconductor production line secondary piping assembly process construction process, and improves the accuracy and readability of the semiconductor production line secondary piping assembly process, and reduces the pipeline construction cost of the secondary piping.

[0008] In a first aspect, the present invention provides a method for constructing a secondary piping assembly process of a semiconductor production line, which specifically comprises the following steps:

[0009] According to the user's input, the secondary piping component data in the pre-built database is retrieved, wherein the secondary piping component data includes a legend and a two-dimensional graphic of the secondary piping component, and the two-dimensional graphic is formed by converting the three-dimensional model of the secondary piping component through a defined model conversion rule;

[0010] Based on the preset secondary piping assembly logic, a two-dimensional pipeline logic relationship diagram of the two-dimensional graphics of each secondary piping component is given, and combined with the legend of the corresponding two-dimensional graphics, the initial assembly process of the secondary piping of the semiconductor production line is formed;

[0011] Based on the user's secondary input, the initial assembly process of the secondary piping of the semiconductor production line is optimized and the assembly process of the secondary piping of the semiconductor production line is constructed.

[0012] Furthermore, the user's input includes process requirements for semiconductor production and attribute information of semiconductor production equipment, and the attribute information of semiconductor production equipment includes interface information and layout information of semiconductor production equipment.

[0013] Further, the database includes a legend library and a two-dimensional graphic library, the legend library includes legends of secondary piping components, and the two-dimensional graphic library includes two-dimensional graphics of secondary piping components;

[0014] The construction of the database includes the following steps:

[0015] Based on the defined legend rules, legends associated with the secondary piping components are given to form a legend library, wherein the graphic rules are the rules between the symbols and colors of the secondary piping components and the corresponding legends;

[0016] Collect the 3D model of the secondary piping components, convert the 3D model into a 2D graphic through the defined model conversion rules, and form a 2D graphic library.

[0017] Furthermore, the definition of the model conversion rules specifically includes the following steps:

[0018] Based on the type of secondary piping components, determine the view type for converting the model into a 2D graphic;

[0019] Define the projection plane with the view type of the 2D graphics, combine the view direction of the 3D model and the preset 2D graphics presentation size, and obtain the initial 2D graphics by offsetting the projection. Specifically, it is expressed as:

[0020]

[0021] Among them, X i , Y i , Z i is the horizontal coordinate, vertical coordinate, and vertical coordinate of point i in the three-dimensional model in three-dimensional space, x i ,y i is the horizontal and vertical coordinates of point i in the three-dimensional model on the projection plane, k x is the scaling ratio of the horizontal coordinate of the projection plane, k y is the scaling ratio of the ordinate of the projection plane, m is the coordinate of the axis corresponding to the abscissa of the projection plane in the three-dimensional space coordinate system, n is the coordinate of the axis corresponding to the ordinate of the projection plane in the three-dimensional space coordinate system, l is the coordinate of the axis other than m and n in the three-dimensional space coordinate system, α m is the angle between the coordinate axis of m and the horizontal coordinate of the projection plane, α n is the angle between the coordinate axis of n and the ordinate of the projection plane, d x is the offset of the horizontal coordinate of point i in the three-dimensional model on the projection plane, d y is the offset of the ordinate of point i in the three-dimensional model on the projection plane;

[0022] The initial two-dimensional graphics are optimized to obtain a two-dimensional graphics.

[0023] Further, the secondary piping assembly includes a secondary piping pipe and a functional control of the secondary piping;

[0024] Based on the preset secondary piping assembly logic, a two-dimensional pipeline logic relationship diagram of the two-dimensional graphic connection of each secondary piping component is given, which specifically includes the following steps:

[0025] Determine the assembly path of the secondary piping pipe according to the attribute information of the semiconductor production equipment;

[0026] Based on the assembly path of the secondary piping pipes, determine the connection relationship between the pipes of the secondary piping and the functional controls of the secondary piping;

[0027] Combined with the connection relationship of each secondary piping component and the attribute information of the secondary piping component, a two-dimensional pipeline logic relationship diagram of the two-dimensional graphic connection of each secondary piping component is given.

[0028] Further, the functional controls of the secondary piping include secondary piping equipment, secondary piping tees, secondary piping valves and associated pipelines;

[0029] Based on the assembly path of the secondary piping pipes, the connection relationship between the pipes of the secondary piping and the functional controls of the secondary piping is determined, which specifically includes the following steps:

[0030] Based on the assembly path of the secondary piping pipes, the semiconductor production area where the secondary piping assembly is performed is determined, and the assembly position of the secondary piping equipment is given;

[0031] Based on the assembly position of the secondary piping equipment, determine the assembly position of the secondary piping tee, and connect the secondary piping equipment, the secondary piping pipes and the secondary piping tee;

[0032] Determine the assembly positions of the secondary piping valves and the associated pipelines, and form the connection relationship between each secondary piping pipeline and the functional controls of the secondary piping.

[0033] Further, determining the semiconductor production area for secondary piping assembly and providing the assembly position of the secondary piping equipment specifically includes the following steps:

[0034] Define the regional level of semiconductor production areas and set the sequence number at the regional level;

[0035] Based on the sequential number of the area level, the first area level is used as the starting point for the assembly position of the secondary piping equipment, and the equipment size and preset interval are laid out from left to right;

[0036] Enter the next regional level, and re-determine the assembly position starting point, assembly orientation and assembly direction of the secondary piping equipment, wherein the assembly orientation and assembly direction of the next regional level are consistent with the assembly orientation and assembly direction of the previous regional level;

[0037] Until the installation of secondary piping equipment at all area levels is completed.

[0038] Further, based on the assembly position of the secondary piping equipment, the assembly position of the secondary piping tee is determined, which specifically includes the following steps:

[0039] Match the regional level of the production area with the assembly position of the secondary piping equipment, and mark the regional level sequence number on the secondary piping equipment;

[0040] Combine the assembled secondary piping pipes to group the secondary piping equipment at adjacent area levels to form a secondary piping equipment group;

[0041] The installation position of the secondary piping tee is determined by the intersection of the secondary piping equipment group and the secondary piping pipe path.

[0042] Furthermore, the secondary input of the user includes at least one of size change information, property change information and assembly position change information of the secondary piping component.

[0043] In a second aspect, the present invention further provides a device for constructing a secondary piping assembly process of a semiconductor production line, using the method for constructing a secondary piping assembly process of a semiconductor production line as described above, specifically comprising:

[0044] The analysis unit is used to retrieve the secondary piping component data in the pre-built database according to the primary input of the user, wherein the secondary piping component data includes the legend and two-dimensional graphics of the secondary piping component, and the two-dimensional graphics are formed by converting the three-dimensional model of the secondary piping component through the defined model conversion rules;

[0045] The automatic generation unit is used to provide a two-dimensional pipeline logic relationship diagram of the two-dimensional graphics connection of each secondary piping component based on the preset secondary piping component assembly logic, and combine the legend of the corresponding two-dimensional graphics to form the initial assembly process of the secondary piping of the semiconductor production line;

[0046] The optimization unit is used to optimize the initial assembly process of the secondary piping of the semiconductor production line based on the user's secondary input and construct the assembly process of the secondary piping of the semiconductor production line.

[0047] The present invention provides a method and device for constructing a secondary piping assembly process of a semiconductor production line, which has at least the following beneficial effects:

[0048] (1) The construction scheme of the secondary piping assembly process of the semiconductor production line provided by the present invention not only improves the degree of automation of the assembly process design, but also enhances the consistency and scalability of the construction of the secondary piping assembly process of the semiconductor production line through the standardized setting of legends and two-dimensional graphics, and improves the accuracy and readability of the secondary piping assembly process of the semiconductor production line, thereby reducing the pipeline construction cost of the secondary piping.

[0049] (2) According to the assembly logic of secondary piping components, the secondary piping assembly process is constructed by calling the secondary piping component data stored in the database. This makes the assembly process construction plan easier to expand, and new legends and two-dimensional graphics can be easily added to adapt to the ever-changing process requirements of semiconductor production; in addition, the automated secondary piping assembly process construction plan can serve as the basis for user collaboration, and different users can work under the same set of standardized processes, which improves the efficiency of user collaboration.

[0050] (3) The assembly of secondary piping equipment will vary according to the different semiconductor production areas. The connection between the secondary piping equipment with different assembly methods and the secondary piping pipes requires the installation of matching secondary piping tees at the corresponding positions. Finally, according to the positions and connection relationships of the secondary piping equipment, the secondary piping pipes, etc., the assembly positions of the secondary piping valves and the auxiliary pipes are determined to form the connection relationship between the pipes of each secondary piping and the functional controls of the secondary piping. In this way, it can be ensured that the secondary piping assembly process meets the process requirements of semiconductor production and can adapt to the attribute information of semiconductor production equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0051] Figure 1 A schematic flow chart of a method for constructing a secondary piping assembly process for a semiconductor production line provided by the present invention;

[0052] Figure 2 A schematic diagram of a process for constructing a database according to a certain embodiment of the present invention;

[0053] Figure 3 A schematic diagram of a flow chart of the definition of a model conversion rule of a certain embodiment provided by the present invention;

[0054] Figure 4 An example diagram of converting the three-dimensional model of the secondary fitting provided by the present invention into a two-dimensional graphic;

[0055] Figure 5 A schematic flow diagram of a two-dimensional pipeline logic relationship diagram of two-dimensional graphical connections of each secondary piping component provided in a certain embodiment of the present invention based on a preset secondary piping component assembly logic;

[0056] Figure 6 An example diagram of a two-dimensional pipeline logic relationship diagram of a two-dimensional graphical connection of a secondary piping assembly provided by the present invention;

[0057] Figure 7 A schematic diagram of a flow chart for determining the connection relationship between the pipelines of each secondary piping and the functional controls of the secondary piping based on the assembly path of the pipelines of the secondary piping according to a certain embodiment of the present invention;

[0058] Figure 8A schematic flow chart of the assembly position of the secondary piping equipment is provided for determining a semiconductor production area for secondary piping assembly in a certain embodiment of the present invention;

[0059] Fig. 9 An example diagram of the assembly position of the secondary piping equipment provided by the present invention;

[0060] Fig.10 A schematic diagram of a flow chart of determining the assembly position of a secondary piping tee based on the assembly position of a secondary piping device according to an embodiment of the present invention;

[0061] Fig.11 A schematic diagram of the architecture of a device for constructing a secondary piping assembly process for a semiconductor production line provided by the present invention. DETAILED DESCRIPTION

[0062] In order to better understand the above technical solution, the above technical solution will be described in detail below in conjunction with the accompanying drawings and specific implementation methods. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0063] The terms used in the embodiments of the present invention are only for the purpose of describing specific embodiments, and are not intended to limit the present invention. The singular forms "a", "said" and "the" used in the embodiments of the present invention and the appended claims are also intended to include plural forms, unless the context clearly indicates other meanings, and "multiple" generally includes at least two.

[0064] It should also be noted that the term "includes", "comprising" or any other variation thereof is intended to cover non-exclusive inclusion, so that a commodity or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such commodity or device. In the absence of more restrictions, the elements defined by the sentence "comprising a ..." do not exclude the existence of other identical elements in the commodity or device including the elements.

[0065] For the assembly process of secondary piping in semiconductor production lines, in order to achieve automated output, the entire process needs to be automated and intelligent, from the selection of secondary piping components, the generation of legends and two-dimensional graphics, to the connection of two-dimensional graphics representing secondary piping components.

[0066] Based on the conversion of graphics and legends of secondary piping components, combined with the data storage in the database, the data mapping through graphic logic assembly can realize the automatic drawing of the secondary piping assembly process of the semiconductor production line. Of course, the automatically drawn secondary piping assembly process of the semiconductor production line can be manually / automatically adjusted and optimized in the future to complete the optimized secondary piping component assembly method, and finally obtain a more complete semiconductor production line secondary piping assembly process. Through the construction method of this semiconductor production line secondary piping assembly process, the data mapping and connectivity problems between the secondary piping components and the semiconductor generation line are solved, and the full process coverage of the semiconductor secondary piping design field is achieved.

[0067] like Figure 1 As shown, the present invention provides a method for constructing a secondary piping assembly process of a semiconductor production line, which specifically includes the following steps:

[0068] According to the user's input, the secondary piping component data in the pre-built database is retrieved, wherein the secondary piping component data includes a legend and a two-dimensional graphic of the secondary piping component, and the two-dimensional graphic is formed by converting the three-dimensional model of the secondary piping component through a defined model conversion rule;

[0069] Based on the preset secondary piping assembly logic, a two-dimensional pipeline logic relationship diagram of the two-dimensional graphics of each secondary piping component is given, and combined with the legend of the corresponding two-dimensional graphics, the initial assembly process of the secondary piping of the semiconductor production line is formed;

[0070] Based on the user's secondary input, the initial assembly process of the secondary piping of the semiconductor production line is optimized and the assembly process of the secondary piping of the semiconductor production line is constructed.

[0071] The user's one-time input includes the process requirements of semiconductor production and the attribute information of semiconductor production equipment. The attribute information of semiconductor production equipment includes the interface information and layout information of semiconductor production equipment.

[0072] The process requirements of semiconductor production refer to the specific requirements of each process step of the semiconductor production line, including the types and specifications of gases, liquids, and chemicals to be used, as well as the pressure and flow requirements when using gases, liquids, and chemicals. In addition, the process requirements of semiconductor production also include requirements for pipeline materials, construction technology, etc.

[0073] The interface information of semiconductor production equipment includes the interface position, interface type, interface quantity, interface size and interface model of semiconductor production equipment; the layout information of semiconductor production equipment includes the overall layout diagram of semiconductor production equipment, specifically including the size, position and operation space of semiconductor production equipment. The above semiconductor production equipment attribute information including the interface information and layout information of semiconductor production equipment used for input is crucial for determining the connection method and component size selection of secondary piping components; at the same time, the path distribution and direction of secondary piping components can be accurately planned in the secondary piping assembly process based on the above information.

[0074] The database includes a legend library and a two-dimensional graphic library. The legend library includes legends of secondary piping components, and the two-dimensional graphic library includes two-dimensional graphics of secondary piping components.

[0075] like Figure 2 As shown in the figure, the construction of the database includes the following steps:

[0076] Based on the defined legend rules, legends associated with the secondary piping components are given to form a legend library, wherein the graphic rules are the rules between the symbols and colors of the secondary piping components and the corresponding legends;

[0077] Collect the 3D model of the secondary piping components, convert the 3D model into a 2D graphic through the defined model conversion rules, and form a 2D graphic library.

[0078] The legend is a symbol and color that can visually present the secondary piping components. The legend of the secondary piping components is determined by graphic rules to represent different types of secondary piping components, such as pipes, valves, instruments, etc., to ensure the readability and uniformity of the secondary piping assembly process.

[0079] Generally speaking, there are a lot of 3D model data for secondary piping components. Through the model conversion rules applicable to the secondary piping assembly process, the 3D model can be converted into a 2D graphic, and each secondary piping component can be represented by a 2D graphic, such as Figure 3 As shown in FIG. 1 , the definition of the model conversion rule specifically includes the following steps:

[0080] Based on the type of secondary piping components, determine the view type for converting the model into a 2D graphic;

[0081] The projection plane is defined by the view type of the two-dimensional graphics, and the initial two-dimensional graphics are obtained by offsetting the projection in combination with the view direction of the three-dimensional model and the preset presentation size of the two-dimensional graphics;

[0082] The initial two-dimensional graphics are optimized to obtain a two-dimensional graphics.

[0083] For secondary piping components, the conversion of 3D models to 2D graphics requires the determination of the projection plane, the change of the view direction when converting from 3D to 2D, and the size requirements of the 2D graphics. In this way, the 3D models of all secondary piping components can be presented in the appropriate proportions and positions, and all key features can be clearly displayed.

[0084] Here, taking point i in a three-dimensional model as an example, the transformation process of position coordinates when converting from a three-dimensional model to a two-dimensional graphic is explained, which is specifically expressed as:

[0085]

[0086] Among them, X i , Y i , Z i is the horizontal coordinate, vertical coordinate, and vertical coordinate of point i in the three-dimensional model in three-dimensional space, x i ,y i is the horizontal and vertical coordinates of point i in the three-dimensional model on the projection plane, k x is the scaling ratio of the horizontal coordinate of the projection plane, k y is the scaling ratio of the ordinate of the projection plane, m is the coordinate of the axis corresponding to the abscissa of the projection plane in the three-dimensional space coordinate system, n is the coordinate of the axis corresponding to the ordinate of the projection plane in the three-dimensional space coordinate system, l is the coordinate of the axis other than m and n in the three-dimensional space coordinate system, α m is the angle between the coordinate axis of m and the horizontal coordinate of the projection plane, α n is the angle between the coordinate axis of n and the ordinate of the projection plane, d x is the offset of the horizontal coordinate of point i in the three-dimensional model on the projection plane, d y is the offset of the ordinate of point i in the three-dimensional model on the projection plane;

[0087] like Figure 4 As shown, for the three-dimensional model of the right-angled prism, select the appropriate view direction (that is, determine the view type of the model converted into a two-dimensional graphic), for example, determine the top view direction, define the projection plane with the top view type, and project the three-dimensional model of the right-angled prism onto the two-dimensional plane along the selected view direction. After that, according to the intended use of the right-angled prism and the detail requirements of the edge lines, the size is transformed by the appropriate scaling ratio. Finally, set the appropriate offset to ensure that all important features can be clearly displayed in the two-dimensional graphics.

[0088] In a semiconductor production line, the required secondary piping components include secondary piping pipes and secondary piping functional controls, wherein the secondary piping functional controls include secondary piping equipment, secondary piping tees, secondary piping valves and auxiliary pipes.

[0089] like Figure 5 As shown, based on the preset secondary piping assembly logic, a two-dimensional pipeline logic relationship diagram of the two-dimensional graphic connection of each secondary piping component is given, which specifically includes the following steps:

[0090] Determine the assembly path of the secondary piping pipe according to the attribute information of the semiconductor production equipment;

[0091] Based on the assembly path of the secondary piping pipes, determine the connection relationship between the pipes of the secondary piping and the functional controls of the secondary piping;

[0092] Combined with the connection relationship of each secondary piping component and the attribute information of the secondary piping component, a two-dimensional pipeline logic relationship diagram of the two-dimensional graphic connection of each secondary piping component is given.

[0093] The assembly logic of secondary piping components is to determine the assembly path of the secondary piping pipeline, and then determine the positions of the secondary piping equipment, secondary piping tees, secondary piping valves and auxiliary pipelines in turn, and complete the connection of all secondary piping components, and give a two-dimensional pipeline logic relationship diagram of the two-dimensional graphic connection of each secondary piping component. Figure 6 The figure shows an example of a two-dimensional pipeline logic relationship diagram formed by connecting the two-dimensional graphics of secondary piping components in a certain application scenario.

[0094] The assembly path of the secondary piping pipes must meet the following conditions: avoid interfering with the operating area and maintenance area of ​​the semiconductor production equipment, have an appropriate safety distance and direction, and follow the best flow path. The best flow path requires the shortest path and the least elbows. For example, in a certain application scenario, the semiconductor production equipment is a chemical vapor deposition equipment. The secondary piping pipes of the chemical vapor deposition equipment mainly supply gas. The secondary piping pipes are directly connected to the gas input interface of the chemical vapor deposition equipment, and all secondary piping pipes are guaranteed to be flexible enough to adapt to the slight movement of the chemical vapor deposition equipment.

[0095] like Figure 7 As shown, based on the assembly path of the secondary piping pipes, determining the connection relationship between the pipes of each secondary piping and the functional controls of the secondary piping specifically includes the following steps:

[0096] Based on the assembly path of the secondary piping pipes, the semiconductor production area where the secondary piping assembly is performed is determined, and the assembly position of the secondary piping equipment is given;

[0097] Based on the assembly position of the secondary piping equipment, determine the assembly position of the secondary piping tee, and connect the secondary piping equipment, the secondary piping pipes and the secondary piping tee;

[0098] Determine the assembly positions of the secondary piping valves and the associated pipelines, and form the connection relationship between each secondary piping pipeline and the functional controls of the secondary piping.

[0099] The assembly of secondary piping equipment will vary according to different semiconductor production areas, which is specifically reflected in the different rotation angles and assembly directions of the secondary piping equipment. The connection between the secondary piping equipment of different assembly methods and the secondary piping pipes requires the setting of matching secondary piping tees at the corresponding positions. Finally, according to the positions and connection relationships of the secondary piping equipment, the secondary piping pipes, etc., the assembly positions of the secondary piping valves and the auxiliary pipes are determined to form the connection relationship between the pipes of each secondary piping and the functional controls of the secondary piping. In this way, it can be ensured that the secondary piping assembly process meets the process requirements of semiconductor production and can adapt to the attribute information of semiconductor production equipment.

[0100] like Figure 8 As shown, determining the semiconductor production area for secondary piping assembly and providing the assembly position of the secondary piping equipment specifically includes the following steps:

[0101] Define the regional level of semiconductor production areas and set the sequence number at the regional level;

[0102] Based on the sequential number of the area level, the first area level is used as the starting point for the assembly position of the secondary piping equipment, and the equipment size and preset interval are laid out from left to right;

[0103] Enter the next regional level, and re-determine the assembly position starting point, assembly orientation and assembly direction of the secondary piping equipment, wherein the assembly orientation and assembly direction of the next regional level are consistent with the assembly orientation and assembly direction of the previous regional level;

[0104] Until the installation of secondary piping equipment at all area levels is completed.

[0105] In addition, a supply point area is set between two adjacent area levels, and the arrangement orientation and arrangement direction of the supply point are 90° rotated from the assembly orientation and assembly direction of the adjacent area level. The supply point is a connection point for the reserved secondary piping pipeline and the functional control of the secondary piping.

[0106] In a certain application scenario, the semiconductor production area is divided by floors. The semiconductor production area has three floors, of which the first floor is the first area level, the second floor is the supply point area (taking factory fluid as an example), and the third floor is the second area level. The three areas share a set of plane coordinate systems. When assembling the secondary piping equipment on one floor (also known as arrangement), determine the starting point of the assembly position and lay it out from left to right according to the equipment size and preset intervals. Among them, the equipment size of the secondary piping equipment can be pre-set, for example, Fig. 9As shown, the equipment length of the secondary piping equipment is a, the width is b, and the preset interval is determined according to the specific application. After completing the assembly of the first layer, enter the second layer, determine the arrangement starting point, arrangement orientation and arrangement direction of the supply points, and the arrangement orientation and arrangement direction of the supply points of the second layer are rotated 90° clockwise compared with the assembly orientation and assembly direction of the first layer. Finally, the third layer is assembled. The assembly orientation and assembly direction of the second regional level are rotated 90° clockwise compared with the arrangement orientation and arrangement direction of the supply points of the second layer, and finally the assembly of the three-layer secondary piping equipment is completed. By setting the assembly position, assembly orientation, and assembly direction, the secondary piping components of each semiconductor production area can be arranged on the same two-dimensional plane.

[0107] like Fig.10 As shown, based on the assembly position of the secondary piping equipment, the assembly position of the secondary piping tee is determined, which specifically includes the following steps:

[0108] Match the regional level of the production area with the assembly position of the secondary piping equipment, and mark the regional level sequence number on the secondary piping equipment;

[0109] Combine the assembled secondary piping pipes to group the secondary piping equipment at adjacent area levels to form a secondary piping equipment group;

[0110] The installation position of the secondary piping tee is determined by the intersection of the secondary piping equipment group and the secondary piping pipe path.

[0111] The secondary input of the user includes at least one of the size change information, property change information and assembly position change information of the secondary piping assembly. The size change information of the secondary piping assembly generally includes the change in the diameter size of the secondary piping pipe, the property change information includes the change in flow rate, pressure, temperature, etc., and the assembly position change information includes the position change information of the secondary piping valve and the attached pipe.

[0112] The user's secondary input mainly provides a step for re-drawing, modification, and improvement, allowing the user to fine-tune and optimize the automatically generated secondary piping assembly process.

[0113] like Fig.11 As shown, the present invention also provides a device for constructing a secondary piping assembly process of a semiconductor production line, which adopts the method for constructing the secondary piping assembly process of a semiconductor production line as described above, specifically comprising:

[0114] The analysis unit is used to retrieve the secondary piping component data in the pre-built database according to the primary input of the user, wherein the secondary piping component data includes the legend and two-dimensional graphics of the secondary piping component, and the two-dimensional graphics are formed by converting the three-dimensional model of the secondary piping component through the defined model conversion rules;

[0115] The automatic generation unit is used to provide a two-dimensional pipeline logic relationship diagram of the two-dimensional graphics connection of each secondary piping component based on the preset secondary piping component assembly logic, and combine the legend of the corresponding two-dimensional graphics to form the initial assembly process of the secondary piping of the semiconductor production line;

[0116] The optimization unit is used to optimize the initial assembly process of the secondary piping of the semiconductor production line based on the user's secondary input and construct the assembly process of the secondary piping of the semiconductor production line.

[0117] The present invention provides a method and device for constructing a secondary piping assembly process of a semiconductor production line, which has at least the following beneficial effects:

[0118] (1) The construction scheme of the secondary piping assembly process of the semiconductor production line provided by the present invention not only improves the degree of automation of the assembly process design, but also enhances the consistency and scalability of the construction of the secondary piping assembly process of the semiconductor production line through the standardized setting of legends and two-dimensional graphics, and improves the accuracy and readability of the secondary piping assembly process of the semiconductor production line, thereby reducing the pipeline construction cost of the secondary piping.

[0119] (2) According to the assembly logic of secondary piping components, the secondary piping assembly process is constructed by calling the secondary piping component data stored in the database. This makes the assembly process construction plan easier to expand, and new legends and two-dimensional graphics can be easily added to adapt to the ever-changing process requirements of semiconductor production; in addition, the automated secondary piping assembly process construction plan can serve as the basis for user collaboration, and different users can work under the same set of standardized processes, which improves the efficiency of user collaboration.

[0120] (3) The assembly of secondary piping equipment will vary according to the different semiconductor production areas. The connection between the secondary piping equipment with different assembly methods and the secondary piping pipes requires the installation of matching secondary piping tees at the corresponding positions. Finally, according to the positions and connection relationships of the secondary piping equipment, the secondary piping pipes, etc., the assembly positions of the secondary piping valves and the auxiliary pipes are determined to form the connection relationship between the pipes of each secondary piping and the functional controls of the secondary piping. In this way, it can be ensured that the secondary piping assembly process meets the process requirements of semiconductor production and can adapt to the attribute information of semiconductor production equipment.

[0121] Although preferred embodiments of the present invention have been described, additional changes and modifications may be made to these embodiments by those skilled in the art once the basic inventive concepts are known. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the present invention. Obviously, those skilled in the art may make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

Claims

1. A method for constructing a secondary piping assembly process for a semiconductor production line, characterized in that: The specific steps include: According to the user's input, the secondary piping component data in the pre-built database is retrieved, wherein the secondary piping component data includes a legend and a two-dimensional graphic of the secondary piping component, and the two-dimensional graphic is formed by converting the three-dimensional model of the secondary piping component through a defined model conversion rule; Based on the preset secondary piping assembly logic, a two-dimensional pipeline logic relationship diagram of the two-dimensional graphics of each secondary piping component is given, and combined with the legend of the corresponding two-dimensional graphics, the initial assembly process of the secondary piping of the semiconductor production line is formed; Based on the user's secondary input, the initial assembly process of the secondary piping of the semiconductor production line is optimized and the assembly process of the secondary piping of the semiconductor production line is constructed.

2. The method for constructing a secondary piping assembly process of a semiconductor production line according to claim 1, characterized in that: The user's one-time input includes the process requirements of semiconductor production and the attribute information of semiconductor production equipment. The attribute information of semiconductor production equipment includes the interface information and layout information of semiconductor production equipment.

3. The method for constructing the secondary piping assembly process of a semiconductor production line according to claim 1, characterized in that: The database includes a legend library and a two-dimensional graphic library, the legend library includes legends of secondary piping components, and the two-dimensional graphic library includes two-dimensional graphics of secondary piping components; The construction of the database includes the following steps: Based on the defined legend rules, legends associated with the secondary piping components are given to form a legend library, wherein the graphic rules are the rules between the symbols and colors of the secondary piping components and the corresponding legends; Collect the 3D model of the secondary piping components, convert the 3D model into a 2D graphic through the defined model conversion rules, and form a 2D graphic library.

4. The method for constructing a secondary piping assembly process of a semiconductor production line as claimed in claim 3, characterized in that: The definition of model transformation rules includes the following steps: Based on the type of secondary piping components, determine the view type for converting the model into a 2D graphic; Define the projection plane with the view type of the 2D graphics, combine the view direction of the 3D model and the preset 2D graphics presentation size, and obtain the initial 2D graphics by offsetting the projection. Specifically, it is expressed as: Among them, X i , Y i , Z i is the horizontal coordinate, vertical coordinate, and vertical coordinate of point i in the three-dimensional model in three-dimensional space, x i ,y i is the horizontal and vertical coordinates of point i in the three-dimensional model on the projection plane, k x is the scaling ratio of the horizontal coordinate of the projection plane, k y is the scaling ratio of the ordinate of the projection plane, m is the coordinate of the axis corresponding to the abscissa of the projection plane in the three-dimensional space coordinate system, n is the coordinate of the axis corresponding to the ordinate of the projection plane in the three-dimensional space coordinate system, l is the coordinate of the axis other than m and n in the three-dimensional space coordinate system, α m is the angle between the coordinate axis of m and the horizontal coordinate of the projection plane, α n is the angle between the coordinate axis of n and the ordinate of the projection plane, d x is the offset of the horizontal coordinate of point i in the three-dimensional model on the projection plane, d y is the offset of the ordinate of point i in the three-dimensional model on the projection plane; The initial two-dimensional graphics are optimized to obtain a two-dimensional graphics.

5. The method for constructing a secondary piping assembly process of a semiconductor production line according to claim 1, characterized in that: The secondary piping assembly includes pipes for the secondary piping and functional controls for the secondary piping; Based on the preset secondary piping assembly logic, a two-dimensional pipeline logic relationship diagram of the two-dimensional graphic connection of each secondary piping component is given, which specifically includes the following steps: Determine the assembly path of the secondary piping pipe according to the attribute information of the semiconductor production equipment; Based on the assembly path of the secondary piping pipes, determine the connection relationship between the pipes of the secondary piping and the functional controls of the secondary piping; Combined with the connection relationship of each secondary piping component and the attribute information of the secondary piping component, a two-dimensional pipeline logic relationship diagram of the two-dimensional graphic connection of each secondary piping component is given.

6. The method for constructing a secondary piping assembly process of a semiconductor production line according to claim 5, characterized in that: Functional controls for secondary piping include secondary piping equipment, secondary piping tees, secondary piping valves and associated pipelines; Based on the assembly path of the secondary piping pipes, the connection relationship between the pipes of the secondary piping and the functional controls of the secondary piping is determined, which specifically includes the following steps: Based on the assembly path of the secondary piping pipes, the semiconductor production area where the secondary piping assembly is performed is determined, and the assembly position of the secondary piping equipment is given; Based on the assembly position of the secondary piping equipment, determine the assembly position of the secondary piping tee, and connect the secondary piping equipment, the secondary piping pipes and the secondary piping tee; Determine the assembly positions of the secondary piping valves and the associated pipelines, and form the connection relationship between each secondary piping pipeline and the functional controls of the secondary piping.

7. The method for constructing a secondary piping assembly process of a semiconductor production line according to claim 6, characterized in that: Determine the semiconductor production area for secondary piping assembly and provide the assembly location of the secondary piping equipment, which specifically includes the following steps: Define the regional level of semiconductor production areas and set the sequence number at the regional level; Based on the sequential number of the area level, the first area level is used as the starting point for the assembly position of the secondary piping equipment, and the equipment size and preset interval are laid out from left to right; Enter the next regional level, and re-determine the assembly position starting point, assembly orientation and assembly direction of the secondary piping equipment, wherein the assembly orientation and assembly direction of the next regional level are consistent with the assembly orientation and assembly direction of the previous regional level; Until the installation of secondary piping equipment at all area levels is completed.

8. The method for constructing a secondary piping assembly process of a semiconductor production line according to claim 7, characterized in that: Based on the assembly position of the secondary piping equipment, determine the assembly position of the secondary piping tee, which specifically includes the following steps: Match the regional level of the production area with the assembly position of the secondary piping equipment, and mark the regional level sequence number on the secondary piping equipment; Combine the assembled secondary piping pipes to group the secondary piping equipment at adjacent area levels to form a secondary piping equipment group; The installation position of the secondary piping tee is determined by the intersection of the secondary piping equipment group and the secondary piping pipe path.

9. The method for constructing a secondary piping assembly process of a semiconductor production line according to claim 1, characterized in that: The secondary input of the user includes at least one of the size change information, property change information and assembly position change information of the secondary piping component.

10. A device for constructing a secondary piping assembly process of a semiconductor production line, characterized in that: A method for constructing a secondary piping assembly process for a semiconductor production line according to any one of claims 1 to 9, specifically comprising: The analysis unit is used to retrieve the secondary piping component data in the pre-built database according to the primary input of the user, wherein the secondary piping component data includes the legend and two-dimensional graphics of the secondary piping component, and the two-dimensional graphics are formed by converting the three-dimensional model of the secondary piping component through the defined model conversion rules; The automatic generation unit is used to provide a two-dimensional pipeline logic relationship diagram of the two-dimensional graphics connection of each secondary piping component based on the preset secondary piping component assembly logic, and combine the legend of the corresponding two-dimensional graphics to form the initial assembly process of the secondary piping of the semiconductor production line; The optimization unit is used to optimize the initial assembly process of the secondary piping of the semiconductor production line based on the user's secondary input and construct the assembly process of the secondary piping of the semiconductor production line.

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