Wafer sorting system and sorting method

Abstract

The invention relates to the technical field of wafer manufacturing, in particular to a wafer sorting system and method. The invention aims to solve the problem of low sorting efficiency of the existing wafer sorting. In order to achieve the purpose, the wafer sorting system comprises a detection module used for detecting wafers to be detected; the first wafer receiving box is used for receiving a first type of wafers; the second wafer receiving box is used for receiving a second type of wafers; the conveying part is used for conveying the wafer to be detected to the detection module and conveying the wafer detected by the detection module; the transfer part is used for transferring the detected wafers to the first wafer receiving box or the second wafer receiving box; the number of the first wafer receiving boxes is multiple, and the transfer part can transfer at least two first-type wafers into the first wafer receiving boxes with the corresponding number in the one-time transfer process. According to the wafer receiving device, one-time receiving of multiple wafers can be achieved, the waiting time in the independent receiving process is shortened, and the wafer sorting efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of chip manufacturing, and in particular to a chip sorting system and a chip sorting method. Background Art

[0002] Wire cutting is a processing method that uses a cutting wire to reciprocate at high speed and move relative to the workpiece to be cut (such as photovoltaic silicon rods, semiconductors, silicon carbide, sapphire or magnetic materials) to cut the workpiece into multiple wafers.

[0003] In the actual production process, the processed wafers cannot be used directly, but need to be sorted, and the wafers of different quality grades are transported to the corresponding receiving boxes. In the current wafer sorting process, the wafers to be inspected are transported to the sorting and detection module through a conveying mechanism, and then the wafers of different quality grades inspected by the sorting and detection module are further transported to the lifting mechanism through a conveying mechanism, and the lifting mechanism lifts the wafers to the corresponding receiving boxes. However, the biggest problem in the current wafer sorting process is the low sorting efficiency. It is often necessary to transport a wafer to the corresponding receiving box before the next wafer can be transported, which seriously affects the transportation efficiency.

[0004] Accordingly, the art needs a new technical solution to solve the above problems. Summary of the invention

[0005] In order to solve at least one of the above problems in the prior art, that is, to solve the problem of low sorting efficiency in the prior art wafer sorting, the first aspect of the present application provides a wafer sorting system, the wafer sorting system comprising:

[0006] A detection module, used for detecting the wafer to be detected;

[0007] A first wafer receiving box, used for receiving a first type of wafers;

[0008] A second wafer receiving box, used for receiving the second type of wafers;

[0009] A conveying unit, used to convey the wafer to be inspected to the inspection module, and to convey the wafer inspected by the inspection module;

[0010] A transfer unit, used for transferring the wafers after inspection to the first wafer receiving box or the second wafer receiving box;

[0011] There are a plurality of first wafer receiving boxes, and the transfer unit can transfer at least two first-type wafers to a corresponding number of the first wafer receiving boxes during one transfer process.

[0012] The chip sorting system of the present application provides a new chip sorting method. By setting up multiple first chip receiving boxes and transferring at least two first-type chips to a corresponding number of first chip receiving boxes during one transfer process, multiple chips can be continuously transported and multiple chips can be received at one time, thereby reducing the waiting time in the individual receiving process and improving the chip sorting efficiency.

[0013] In a preferred technical solution of the above-mentioned wafer sorting system, a plurality of the first wafer receiving boxes are arranged adjacent to each other.

[0014] Multiple first wafer receiving boxes are arranged adjacent to each other, which can reduce the difficulty of receiving materials and facilitate centralized material receiving.

[0015] In a preferred technical solution of the above-mentioned wafer sorting system, the transfer unit can transfer the same number of first-category wafers as the first wafer receiving boxes to a corresponding number of the first wafer receiving boxes during one transfer process.

[0016] The above setting method can maximize the material collection speed and sorting efficiency.

[0017] In the preferred technical solution of the above-mentioned chip sorting system, the conveying part includes a main conveying component, a first sub-conveying component and a second sub-conveying component, one end of the main conveying component is used to receive the chip to be inspected, and the other end is docked with the inspection module, the first sub-conveying component is docked with the main conveying component, and the second sub-conveying component is docked with the first sub-conveying component. A plurality of the first chip receiving boxes correspond to one of the first sub-conveying component and the second sub-conveying component, and the second chip receiving box corresponds to another one of the first sub-conveying component and the second sub-conveying component.

[0018] By arranging the first wafer receiving box and the second wafer receiving box respectively and correspondingly at the first auxiliary conveying assembly and the second auxiliary conveying assembly, it is possible to achieve parallel conveyance and collection of wafers of different categories, further improving the wafer sorting efficiency.

[0019] In a preferred technical solution of the above-mentioned wafer sorting system, a transfer mechanism is provided at the joint between the first sub-transfer assembly and the second sub-transfer assembly, and the transfer mechanism is used to transfer the wafers on the first sub-transfer assembly to the second sub-transfer assembly.

[0020] By setting up the transfer mechanism, the wafer transfer between the first auxiliary transfer assembly and the second auxiliary transfer assembly is facilitated, thereby improving the transfer efficiency.

[0021] In the preferred technical solution of the above-mentioned chip sorting system, the transfer mechanism is a lifting and transfer mechanism, which has a first position not higher than the first sub-transfer component and a second position which is lifted to the top of the first sub-transfer component under the action of a driving force and docked with the second sub-transfer component.

[0022] In the preferred technical solution of the above-mentioned chip sorting system, the conveying components corresponding to the plurality of first chip receiving boxes in the first sub-conveying component and the second sub-conveying component include a plurality of independent conveying belts, and each of the first chip receiving boxes corresponds to one conveying belt.

[0023] Each first wafer receiving box corresponds to a conveyor belt, which is convenient for individual parking control of the first type of wafers and improves the sorting control accuracy.

[0024] In the preferred technical solution of the above-mentioned chip sorting system, the transfer part includes a lifting and transfer mechanism, which has a third position not higher than the conveying part and a fourth position which is lifted to the top of the conveying part under the action of a driving force and docked with the first chip receiving box or the second chip receiving box.

[0025] In the preferred technical solution of the above-mentioned wafer sorting system, each of the first wafer receiving boxes is correspondingly equipped with one of the above-mentioned lifting and transferring mechanisms.

[0026] Each first wafer receiving box is equipped with a lifting and transferring mechanism, which can realize the separate transfer of multiple first-type wafers and improve the adaptability of wafer sorting scenarios.

[0027] In the preferred technical solution of the above-mentioned chip sorting system, the chip sorting system also includes a loading assembly, which is docked with one end of the conveying part and is located upstream of the detection module, and the loading assembly is used to transport the chip to be detected to the conveying part.

[0028] By setting up the loading component, it is beneficial to realize the automatic loading of the wafers to be inspected, thereby improving the degree of automation and sorting efficiency.

[0029] In a second aspect of the present application, a wafer sorting method is further provided, the sorting method comprising:

[0030] Acquire the number of first-type wafers parked on the conveying part;

[0031] Determine the magnitude of the quantity and a preset quantity threshold;

[0032] When the quantity is equal to the preset quantity threshold, controlling the transfer unit to transfer all the first type of wafers to the corresponding first wafer receiving box;

[0033] Among them, the preset quantity threshold is greater than or equal to 2.

[0034] The above-mentioned wafer sorting method provides a new wafer sorting idea, which can realize the simultaneous parking of multiple first-class wafers and the one-time collection of multiple first-class wafers, thereby improving the sorting efficiency.

[0035] In a preferred technical solution of the above-mentioned wafer sorting method, the preset quantity threshold is equal to the quantity of the first wafer receiving boxes.

[0036] The above setting method can maximize the material collection efficiency and sorting efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] The present application is described below with reference to the accompanying drawings. In the accompanying drawings:

[0038] Figure 1 A system diagram of a first embodiment of a wafer sorting system of the present application;

[0039] Figure 2 A schematic diagram of a wafer of the wafer sorting system of the present application when the wafer is parked on a conveyor belt;

[0040] Figure 3 A schematic diagram of a wafer receiving process of a wafer sorting system of the present application;

[0041] Figure 4 A system diagram of a second embodiment of the wafer sorting system of the present application;

[0042] Figure 5 A system diagram of a third embodiment of the wafer sorting system of the present application;

[0043] Figure 6 The flowchart of the wafer sorting method of the present application is shown in FIG.

[0044] Reference numerals list

[0045] 1. Inspection module; 2. First wafer receiving box; 3. Second wafer receiving box; 4. Conveying unit; 41. Main conveying assembly; 42. First auxiliary conveying assembly; 43. Second auxiliary conveying assembly; 431. Conveyor belt; 5. Transfer unit; 51. Lifting and transferring mechanism; 511. Hydraulic cylinder; 512. Driving motor; 513. Belt; 6. Cleaning basket; 7. Transfer mechanism; 8. Wafer to be inspected; 9. First type of wafer. DETAILED DESCRIPTION

[0046] The preferred embodiments of the present application are described below with reference to the accompanying drawings. It should be understood by those skilled in the art that these embodiments are only used to explain the technical principles of the present application and are not intended to limit the scope of protection of the present application. For example, although there are two second wafer receiving boxes in the accompanying drawings, this quantitative relationship is not fixed, and those skilled in the art can make adjustments as needed to adapt to specific application scenarios. For example, the number of second wafer receiving boxes can be one, three or more.

[0047] It should be noted that, in the description of the present application, the terms "upper", "lower", "left", "inner", "outer", etc. indicating directions or positional relationships are based on the directions or positional relationships shown in the drawings, which are merely for the convenience of description, and do not indicate or imply that the device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", "third", and "fourth" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance. In addition, in the description of the present application, "multiple" refers to at least two.

[0048] In addition, it should be noted that in the description of this application, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For those skilled in the art, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0049] In order to solve the problem of low sorting efficiency in the existing wafer sorting, the present application provides a wafer sorting system, including: a detection module, a first wafer receiving box, a second wafer receiving box, a conveying unit and a transfer unit. Among them, the detection module is used to detect the wafers to be detected; the first wafer receiving box is used to receive the first type of wafers; the second wafer receiving box is used to receive the second type of wafers; the conveying unit is used to transfer the wafers to be detected to the detection module, and to transfer the wafers detected by the detection module; the transfer unit is used to transfer the wafers that have been detected to the first wafer receiving box or the second wafer receiving box. Among them, there are multiple first wafer receiving boxes, and the transfer unit can transfer at least two first type wafers to the corresponding number of first wafer receiving boxes during one transfer process.

[0050] Thus, in the wafer sorting process, the conveying unit first conveys the wafers to be inspected to the inspection module, the inspection module inspects the wafers to be inspected, the inspected wafers are classified according to the quality level, and then conveyed to different receiving boxes through the conveying unit, wherein at least two wafers with the inspection result of the first type of wafers are conveyed to different first wafer receiving boxes respectively. Subsequently, the transfer unit simultaneously transfers at least two wafers to the first wafer receiving box, completing the simultaneous receiving of multiple wafers.

[0051] The chip sorting system of the present application provides a new chip sorting method. By setting up multiple first chip receiving boxes and transferring at least two first-type chips to a corresponding number of first chip receiving boxes during one transfer process, multiple chips can be continuously transported and multiple chips can be received at one time, thereby reducing the waiting time in the individual receiving process and improving the chip sorting efficiency.

[0052] Next, refer to Figures 1 to 3 , the first preferred implementation mode of the chip sorting system of the present application is introduced.

[0053] like Figure 1 As shown, in a preferred embodiment, the wafer sorting system includes a detection module 1, a first wafer receiving box 2, a second wafer receiving box 3, a conveying part 4, a transfer part 5, a transfer mechanism 7 and a loading assembly.

[0054] The detection module 1 is used to detect the wafer 8 to be detected, and then classify the wafer 8 to be detected according to the quality grade. In the present application, the wafer 8 to be detected can be divided into at least a first type of wafer 9 and a second type of wafer according to the quality grade, wherein the first type of wafer 9 is a wafer with qualified quality, and the second type of wafer is a wafer with unqualified quality. The specific detection method and classification method of the detection module 1 are conventional technologies in the art, and the detection method and classification method are not the focus of improvement of the present application, so they are not repeated here.

[0055] Of course, the method of classifying chips according to quality level is not the only one. In other embodiments, the second type of chips can be further refined into different types according to the defect type, or the first type of chips 9 can be further refined into different qualified categories according to more specific classification rules, and then collected into different receiving boxes.

[0056] The conveying part 4 is used to convey the wafer 8 to be inspected to the inspection module 1, and to convey the wafer inspected by the inspection module 1. Specifically, the conveying part 4 includes a main conveying component 41, a first sub-conveying component 42, and a second sub-conveying component 43. One end of the main conveying component 41 is used to receive the wafer 8 to be inspected, and the other end is docked with the inspection module 1. The first sub-conveying component 42 is docked with the main conveying component 41, and the second sub-conveying component 43 is docked with the first sub-conveying component 42. Figure 1In the embodiment shown, the second auxiliary conveying assembly 43 is perpendicular to the first auxiliary conveying assembly 42. In the present application, the main conveying assembly 41, the first auxiliary conveying assembly 42 and the second auxiliary conveying assembly 43 are all conveyor belts 431. The method of conveying wafers by conveyor belts 431 is a conventional method in the art and will not be described in detail in the present application.

[0057] The first wafer receiving box 2 is used to receive and store the first type of wafers 9. Figure 1 In the embodiment shown, four first wafer receiving boxes 2 are provided, and the four first wafer receiving boxes 2 are provided corresponding to the second auxiliary conveying assembly 43, and the four first wafer receiving boxes 2 are provided adjacent to each other on the same side of the second auxiliary conveying assembly 43 ( Figure 1 The second wafer receiving box 3 is used to receive and store the second type of wafers. Figure 1 In the illustrated embodiment, two second wafer receiving boxes 3 are provided, and the two second wafer receiving boxes 3 are provided corresponding to the first auxiliary conveying assembly 42, and are both provided on one side of the first auxiliary conveying assembly 42 ( Figure 1 on the left side of the image).

[0058] By arranging the first wafer receiving box 2 and the second wafer receiving box 3 respectively in the first auxiliary conveying assembly 42 and the second auxiliary conveying assembly 43, it is possible to realize parallel conveying and receiving of wafers of different categories, further improving the wafer sorting efficiency. Multiple first wafer receiving boxes 2 are arranged adjacent to each other, which can reduce the difficulty of receiving and facilitate centralized receiving.

[0059] Of course, the specific number and setting position of the first wafer receiving box 2 and the second wafer receiving box 3 are not unique, and those skilled in the art can adjust them based on specific application scenarios. For example, at least two first wafer receiving boxes 2 can be set, or three, five or other numbers can be set. At least one second wafer receiving box 3 can be set, or three or more can be set. In the case of setting multiple, the first wafer receiving box 2 or the second wafer receiving box 3 can be set on the same side of the corresponding conveying component, or on different sides, wherein setting on the same side is a preferred embodiment.

[0060] In addition, the first wafer receiving box 2 is arranged corresponding to the second auxiliary conveying assembly 43, and the second wafer receiving box 3 is arranged corresponding to the first auxiliary conveying assembly 42, which is only a possible implementation mode, and the corresponding relationship between the two can also be interchanged.

[0061] Further references Figure 1A transfer mechanism 7 is also provided at the joint of the first sub-conveying assembly 42 and the second sub-conveying assembly 43, and the transfer mechanism 7 is used to transfer the wafer on the first sub-conveying assembly 42 to the second sub-conveying assembly 43. Specifically, the transfer mechanism 7 is a lifting and transferring mechanism 51, and the lifting and transferring mechanism 51 has a first position not higher than the first sub-conveying assembly 42 and a second position lifted to the top of the first sub-conveying assembly 42 and docked with the second sub-conveying assembly 43 under the action of the driving force. In this way, after the wafer is inspected by the inspection module 1, if it needs to be transferred to the first sub-conveying assembly 42, the lifting and transferring mechanism 51 is controlled to be located at the first position, and at this time, the wafer is transported by the conveyor belt 431 of the first sub-conveying assembly 42 to the side of the second wafer receiving box 3. If the chip needs to be transferred to the second sub-transmission component 43 after being inspected by the inspection module 1, the lifting and transfer mechanism 51 is controlled to be located at the second position when the chip passes through the transfer mechanism 7. At this time, the chip is lifted and docked with the second sub-transmission component 43. The lifting and transfer mechanism 51 transfers the chip to the second sub-transmission component 43 and arrives at the side of the first chip receiving box 2 under the transmission of the second sub-transmission component 43.

[0062] It should be noted that the specific structure of the lifting and transferring mechanism 51 in the present application is the same as the lifting and transferring mechanism 51 of the transfer part 5 , and the following implementation manner will introduce its structure in conjunction with the transfer part 5 .

[0063] By providing the transfer mechanism 7 , wafer transfer between the first auxiliary conveying assembly 42 and the second auxiliary conveying assembly 43 is facilitated, thereby improving the conveying efficiency.

[0064] Of course, the specific setting of the transfer mechanism 7 is not unique. As long as the function of transferring the wafer can be realized, the above-mentioned lifting and transferring mechanism 51 can be replaced. For example, a suction cup manipulator can be set to suck up the wafer on the first auxiliary conveying component 42 and transfer it to the second auxiliary conveying component 43. In addition, the setting of the transfer mechanism 7 is not necessary. When the first auxiliary conveying component 42 also has a bidirectional conveying function, the setting of the transfer mechanism 7 can be omitted. For example, a rotating table can be set at the position where the first auxiliary conveying component 42 and the second auxiliary conveying component 43 are connected to control the rotation of the conveyor belt 431, thereby realizing the change of the conveying direction.

[0065] Still refer to Figure 1 In a preferred embodiment, the first sub-transmission assembly 42 includes a plurality of independently operated conveyor belts 431, which are connected in sequence to form a complete first sub-transmission assembly 42, wherein each of the two second wafer receiving boxes 3 corresponds to a conveyor belt 431. Similarly, the second sub-transmission assembly 43 includes a plurality of independently operated conveyor belts 431, which are connected in sequence to form a complete second sub-transmission assembly 43, wherein each first wafer receiving box 2 corresponds to a conveyor belt 431.

[0066] Thus, in the process of conveying the wafer, the wafer can be parked at a preset position by controlling the operation and stopping of each independent conveyor belt 431. For example, when the wafer is conveyed to one side of a first wafer receiving box 2, the conveyor belt 431 under the wafer is controlled to stop working, so that the wafer can be parked and temporarily stored.

[0067] By configuring each first wafer receiving box 2 to correspond to a conveyor belt 431 and each second wafer receiving box 3 to correspond to a conveyor belt 431, it is convenient to perform separate parking control on the first type of wafers 9 and the second type of wafers, thereby improving the sorting control accuracy.

[0068] Of course, the above-mentioned setting is only preferred, and those skilled in the art can adjust it so that the present application is applicable to more specific application scenarios. For example, all first wafer receiving boxes 2 can correspond to a complete conveyor belt 431, and multiple wafers can be parked on one side of the corresponding first wafer receiving box 2 by controlling the wafer transmission interval and the start and stop of the conveyor belt 431. For another example, it can also be set that some first wafer receiving boxes 2 correspond to one conveyor belt 431, etc. The second wafer receiving box 3 is the same, and will not be described in detail.

[0069] Reference Figures 1 to 3 The transfer part 5 is used to transfer the wafers that have been inspected to the first wafer receiving box 2 or the second wafer receiving box 3. Specifically, the transfer part 5 includes a lifting and transferring mechanism 51, which has a third position not higher than the conveying part 4 and a fourth position lifted to the top of the conveying part 4 under the action of the driving force and docked with the first wafer receiving box 2 or the second wafer receiving box 3. More specifically, each first wafer receiving box 2 and each second wafer receiving box 3 corresponds to a lifting and transferring mechanism 51. In other words, the number of lifting and transferring mechanisms 51 is equal to the sum of the number of first wafer receiving boxes 2 and second wafer receiving boxes 3. Figure 1 In the illustrated embodiment, the transfer unit 5 includes six lifting and transfer mechanisms 51 , wherein four lifting and transfer mechanisms 51 are disposed corresponding to the first wafer receiving box 2 , and two lifting and transfer mechanisms 51 are disposed corresponding to the second wafer receiving box 3 .

[0070] Furthermore, the lifting and transferring mechanism 51 is arranged between several adjacent conveyor belts 431. Figure 2 and Figure 3Taking the lifting and transporting mechanism 51 on the second auxiliary conveying assembly 43 as an example (the lifting and transporting mechanism 51 of the first auxiliary conveying assembly 42 is the same), the lifting and transporting mechanism 51 includes a hydraulic cylinder 511, a driving motor 512 and a belt 513. The hydraulic cylinder 511 is connected to the belt 513 (such as connected to the frame of the belt 513) to drive the belt 513 to rise and fall. The driving motor 512 is connected to the belt 513 in a transmission manner (such as installed on the frame of the belt 513 and the output shaft is connected to the belt 513 in a transmission manner) to drive the belt 513 to rotate. Figure 2 and Figure 3 As shown, three adjacent independent conveyor belts 431 are formed with two gaps, and a hydraulic cylinder 511, a drive motor 512 and a belt 513 are correspondingly arranged in each gap, and the two belts 513 are connected by a transmission rod, so that two synchronous belts 513 can be driven to rotate simultaneously by a drive motor 512. In the present application, the transmission direction of the belt 513 is perpendicular to the transmission direction of the conveyor belt 431, so that the wafer can be transmitted to the first wafer receiving box 2 on one side of the conveyor belt 431.

[0071] like Figure 2 As shown, during the conveying process of the first type of wafer 9, the lifting and transferring mechanism 51 is controlled to be located at the third position. At this time, the first type of wafer 9 is conveyed by the conveyor belt 431 of the second sub-conveying component 43 to the side of a first wafer receiving box 2. At this time, the conveyor belt 431 on the lower side of the first type of wafer 9 stops running, so that the first type of wafer 9 is temporarily stored on the conveyor belt 431.

[0072] See also Figure 3 , then the lifting and transferring mechanism 51 is controlled to be located at the fourth position, at which time the first type of wafer 9 is lifted and docked with the first wafer receiving box 2, and then the driving motor 512 is controlled to run, and the first type of wafer 9 is transported to the first wafer receiving box 2 through the belt 513.

[0073] Preferably, the transfer unit 5 can transfer the same number of first-type wafers 9 as the number of first wafer receiving boxes 2 to a corresponding number of first wafer receiving boxes 2 during one transfer process. Figure 1 In the embodiment, whenever four first-type wafers 9 are parked on the second auxiliary conveying assembly 43 , four lifting and transferring mechanisms 51 are started to receive the four first-type wafers 9 into four first wafer receiving boxes 2 .

[0074] Each first wafer receiving box 2 is equipped with a lifting and transporting mechanism 51, which can realize the separate transport of multiple first-type wafers 9 and improve the scene adaptability of wafer sorting. Transporting the same number of first-type wafers 9 as the first wafer receiving box 2 at one time can maximize the receiving speed and sorting efficiency.

[0075] Of course, the lifting and transporting mechanism 51 is only a specific implementation of the transporting unit 5. Without departing from the principle of the present application, those skilled in the art can adjust the setting of the transporting unit 5. For example, a rotating table can be set under the conveyor belt 431 to realize the wafer receiving. Alternatively, instead of setting the hydraulic cylinder 511, only a motor and a belt 513 are set, and a protrusion higher than the conveyor belt 431 is set at a certain position on the belt 513, and the wafer is "pushed" into the receiving box by the process of the protrusion rotating with the belt 513.

[0076] Furthermore, the way in which the transfer unit 5 transfers the same number of first-category wafers 9 as the first wafer receiving box 2 at one time is not fixed. Technical personnel in this field can adjust the number arbitrarily, but transferring the same number of first-category wafers 9 as the first wafer receiving box 2 at one time is the most efficient.

[0077] In one embodiment, the loading assembly is docked with one end of the conveying part 4 and is located upstream of the detection module 1, and the loading assembly is used to convey the wafers 8 to be detected to the conveying part 4. Usually, the wafers to be detected are placed in the cleaning basket 6. After the cleaning basket 6 is installed on the loading assembly, the loading assembly conveys the wafers in the cleaning basket 6 to the main conveying assembly 41 one by one. Preferably, the loading assembly can accommodate two cleaning baskets 6 at the same time, and the loading assembly controls the two cleaning baskets 6 to convey the wafers alternately during the loading process. After the wafers in the first cleaning basket 6 are conveyed, the second cleaning basket 6 takes over to continue conveying the wafers. At this time, the first cleaning basket 6 is replaced by a new basket filled with wafers. Among them, the specific structure and working principle of the loading assembly are conventional means in the field, and this application will not repeat them.

[0078] By providing the loading assembly, it is beneficial to realize automatic loading of the wafer 8 to be inspected, thereby improving the degree of automation and sorting efficiency.

[0079] Of course, the setting of the feeding assembly is only a preferred embodiment, and those skilled in the art can choose whether to set it and the specific form of the feeding assembly based on the specific application scenario. For example, the feeding assembly can also be not set, or it can be set as a feeding assembly that can accommodate one washing flower basket 6, three or more clear flower baskets.

[0080] Combine the following Figure 4 and Figure 5 , other embodiments of the chip sorting system of the present application are introduced.

[0081] like Figure 4As shown, in the second embodiment of the present application, under the premise that other settings remain unchanged, the second sub-transmission component 43 is configured as two parts, which are generally L-shaped, wherein the first part is vertically configured with the first sub-transmission component 42, and the second part is vertically configured with the first part, and a lifting and transfer mechanism 51 is provided between the first part and the second part to control the moving direction of the chip.

[0082] Compared with the first embodiment, the system of this embodiment is more compact and can save floor space.

[0083] Reference Figure 5 In the third embodiment of the present application, on the premise that other settings remain unchanged, a set of second auxiliary transmission components 43 is added on the basis of the second embodiment, so that eight first chip receiving boxes 2 are set in one system. In other words, eight first-type chips 9 can be collected at the same time in one receiving process, which can greatly increase the sorting efficiency compared with the first embodiment.

[0084] Of course, the above configuration is only preferred, and those skilled in the art can make adjustments based on specific application scenarios. Figure 5 For the three vertically arranged columns of conveying components shown, the above preferred embodiment is described in conjunction with the left column of conveying components correspondingly setting the second wafer receiving box 3 for receiving the second type of wafers, and the middle and right columns of conveying components correspondingly setting the first wafer receiving box 2 for receiving the first type of wafers 9. However, the above setting method is not the only one. In other replacement methods, the form of the receiving boxes corresponding to the three columns of conveying components can also be adjusted arbitrarily. For example, it is set in the following way: the left and middle columns of conveying components correspondingly set the first wafer receiving box 2 for receiving the first type of wafers 9, and the right column of conveying components correspondingly set the second wafer receiving box 3 for receiving the second type of wafers. Or further subdivide the wafer quality level, for example, the left column of conveying components correspondingly set the second wafer receiving box 3 for receiving the second type of wafers, the middle column of conveying components correspondingly set the first wafer receiving box 2 for receiving the first type of wafers 9, and the right column of conveying components correspondingly set the super-first-class wafer receiving box for receiving the wafers with better quality among the first type of wafers 9. Alternatively, the conveying components in the left column are provided with a waste box for receiving the second-category wafers that have obvious defects and need to be discarded, the conveying components in the middle column are provided with a second-category wafer receiving box 3 for receiving the second-category wafers that have defects but do not need to be discarded, and the conveying components in the right column are provided with a first-category wafer receiving box 2 for receiving the first-category wafers 9. And so on.

[0085] Combine the following Figure 6 , the chip sorting method of the present application is introduced.

[0086] like Figure 6As shown, corresponding to the above-mentioned wafer sorting system, the present application also provides a wafer sorting method, which includes:

[0087] S101, obtaining the number of first-class wafers parked on the conveyor; for example, a sensor is set below / on the side of the conveyor belt corresponding to each first-class wafer receiving box to sense whether there are first-class wafers on the conveyor belt, and when there are first-class wafers on the conveyor belt, a signal is sent out, and the number of first-class wafers parked on the second sub-conveying component is determined by accumulating the number of signals. The sensor can be an infrared sensor, a distance sensor, a visual sensor, etc.

[0088] S103, determine the size of the quantity and the preset quantity threshold; for example, the preset quantity threshold is equal to the quantity of the first wafer receiving box, and after obtaining the quantity of the first type of wafers, compare the quantity with the quantity of the first wafer receiving box, such as by comparing by difference or ratio.

[0089] S105, when the quantity is equal to the preset quantity threshold, the transfer unit is controlled to transfer all the first-category wafers to the corresponding first-chip receiving boxes; for example, when the quantity of the parked first-category wafers is equal to the preset quantity threshold, it proves that there is a first-category wafer parked in front of each first-chip receiving box, and at this time, the lifting and transfer mechanism on one side of the first-chip receiving box is controlled to operate, and the first-category wafers are transferred to the corresponding first-chip receiving boxes, so as to realize the sorting and receiving of the wafers.

[0090] The above wafer sorting method provides a new wafer sorting idea, which can realize the simultaneous parking of multiple first-class wafers and the one-time collection of multiple first-class wafers, thereby improving the sorting efficiency. In addition, the preset quantity threshold is equal to the number of first wafer receiving boxes, which can maximize the collection efficiency and sorting efficiency.

[0091] Of course, there is no unique way to set the preset number, as long as the condition of being at least greater than two is met.

[0092] A possible workflow of the wafer sorting system of the present application is briefly described below.

[0093] In a possible workflow, first, two cleaning baskets with wafers to be inspected are installed in the loading assembly, and then the loading assembly is started, and the loading assembly conveys the wafers to be inspected in the cleaning baskets to the main conveying assembly. Then, the main conveying assembly conveys the wafers to be inspected to the inspection module for inspection, and the inspection module classifies the wafers to be inspected according to the quality grade, and then conveys the classified wafers through the first auxiliary conveying assembly. If the wafer grade is a first-class wafer, when the first-class wafer is conveyed to the transfer mechanism, the transfer mechanism lifts the first-class wafer and transfers the first-class wafer to the second auxiliary conveying assembly, and then the second auxiliary conveying assembly conveys the first-class wafer to the conveyor belt on one side of the first wafer receiving box and parks it for temporary storage. When all the first-class wafer receiving boxes are correspondingly parked with the first-class wafers, the lifting and transporting mechanism under the first-class wafer is controlled to move, and all the first-class wafers are conveyed to the corresponding first-class wafer receiving boxes. If the wafer grade is a second-class wafer, the second-class wafer is conveyed to the conveyor belt on one side of the second wafer receiving box and parked for temporary storage under the transmission of the first auxiliary conveying assembly. When all the second-type wafer receiving boxes are correspondingly parked with second-type wafers, the lifting and transferring mechanism below the second-type wafers is controlled to move to transport all the second-type wafers to the second-type wafer receiving boxes.

[0094] Although the various steps in the above embodiment are described in the above-mentioned chronological order, those skilled in the art can understand that in order to achieve the effect of this embodiment, different steps do not have to be executed in such an order. They can be executed simultaneously (in parallel) or in a reverse order. These simple changes are within the scope of protection of this application.

[0095] In addition, those skilled in the art will appreciate that, although some embodiments described herein include certain features included in other embodiments but not other features, the combination of features of different embodiments is meant to be within the scope of the present application and form different embodiments. For example, in the claims of the present application, any one of the claimed embodiments may be used in any combination.

[0096] So far, the technical solutions of the present application have been described in conjunction with the preferred embodiments shown in the accompanying drawings. However, it is easy for those skilled in the art to understand that the protection scope of the present application is obviously not limited to these specific embodiments. Without departing from the principles of the present application, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after these changes or substitutions will fall within the protection scope of the present application.

Claims

1. A wafer sorting system, characterized in that: The wafer sorting system comprises: A detection module, used for detecting the wafer to be detected; A first wafer receiving box, used for receiving a first type of wafers; A second wafer receiving box, used for receiving the second type of wafers; A conveying unit, used to convey the wafer to be inspected to the inspection module, and to convey the wafer inspected by the inspection module; A transfer unit, used for transferring the wafers after inspection to the first wafer receiving box or the second wafer receiving box; There are a plurality of first wafer receiving boxes, and the transfer unit can transfer at least two first-type wafers to a corresponding number of the first wafer receiving boxes during one transfer process.

2. The wafer sorting system according to claim 1, characterized in that: A plurality of the first wafer receiving boxes are arranged adjacent to each other.

3. The wafer sorting system according to claim 1, characterized in that: The transfer unit can transfer the same number of first-type wafers as the number of the first wafer receiving boxes to a corresponding number of the first wafer receiving boxes during one transfer process.

4. The wafer sorting system according to claim 1, characterized in that: The conveying part includes a main conveying component, a first sub-conveying component and a second sub-conveying component. One end of the main conveying component is used to receive the wafer to be inspected, and the other end is docked with the inspection module. The first sub-conveying component is docked with the main conveying component, and the second sub-conveying component is docked with the first sub-conveying component. A plurality of the first wafer receiving boxes correspond to one of the first sub-conveying component and the second sub-conveying component, and the second wafer receiving box corresponds to another one of the first sub-conveying component and the second sub-conveying component.

5. The wafer sorting system according to claim 4, characterized in that: A transfer mechanism is provided at the joint between the first sub-transmission assembly and the second sub-transmission assembly, and the transfer mechanism is used to transfer the wafers on the first sub-transmission assembly to the second sub-transmission assembly.

6. The wafer sorting system according to claim 5, characterized in that: The transfer mechanism is a lifting and transfer mechanism, which has a first position not higher than the first sub-conveying component and a second position lifted to the top of the first sub-conveying component under the action of a driving force and docked with the second sub-conveying component.

7. The wafer sorting system according to claim 4, characterized in that: The conveying components corresponding to the plurality of first wafer receiving boxes in the first sub-conveying component and the second sub-conveying component include a plurality of independent conveying belts, and each of the first wafer receiving boxes corresponds to one conveying belt.

8. The wafer sorting system according to claim 1, characterized in that: The transfer part includes a lifting transfer mechanism, which has a third position not higher than the conveying part and a fourth position lifted to the top of the conveying part under the action of a driving force and docked with the first wafer receiving box or the second wafer receiving box.

9. The wafer sorting system according to claim 8, characterized in that: Each of the first wafer receiving boxes is correspondingly equipped with one of the lifting and transferring mechanisms.

10. The wafer sorting system according to any one of claims 1 to 9, characterized in that: The wafer sorting system further comprises a loading assembly, which is docked with one end of the conveying part and is located upstream of the detection module, and is used for conveying the wafer to be detected to the conveying part.

11. A wafer sorting method based on the wafer sorting system according to any one of claims 1 to 10, characterized in that: The sorting method comprises: Acquire the number of first-type wafers parked on the conveying part; Determine the magnitude of the quantity and a preset quantity threshold; When the quantity is equal to the preset quantity threshold, controlling the transfer unit to transfer all the first type of wafers to the corresponding first wafer receiving box; Among them, the preset quantity threshold is greater than or equal to 2.

12. The wafer sorting method according to claim 11, characterized in that: The preset quantity threshold is equal to the quantity of the first wafer receiving boxes.

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