Furnace tube annealing process wafer transfer debugging system and furnace tube annealing process wafer transfer debugging method

Abstract

The invention discloses a wafer transfer debugging system and method for a furnace tube annealing process. The system comprises a wafer transfer device, a sensor detection device, a platform control device, a wafer to be debugged and a wafer boat, the wafer conveying device comprises a power device and a conveying arm, and the power device drives the conveying arm and the sensor detection device to move in the horizontal direction or the vertical direction; the sensor detection device comprises at least two groups of laser sensors which are respectively used for determining the positions of boat teeth of the wafer boat and measuring the distances from the laser sensors to the conveying arm and / or the wafer to be debugged; and the platform controller adjusts the wafer conveying position of the conveying arm according to the obtained position and distance information and records and stores the adjusted position parameters. According to the wafer conveying device, the sensor detection device is arranged to adjust and determine the wafer conveying position of the conveying arm, repeated debugging is not needed, the operation time and cost are saved, and wafer conveying of a single wafer and double bonded wafers on the same equipment can be met without causing wafer collision.

Description

Technical Field

[0001] The invention relates to the field of furnace tube annealing technology, in particular to a furnace tube annealing technology transmission and debugging system and method. Background Art

[0002] The current products of furnace tube annealing process are divided into single wafers and double wafers after bonding. A wafer transfer device often corresponds to a wafer boat debugging and transfer position with a pitch, and can generally only transfer wafers of the same thickness type to be annealed. If the same device is used to transfer single wafers and double wafers after bonding, due to the different wafer thicknesses, collisions are likely to occur between the wafers and the wafer boat. In order to avoid collisions, when furnace tube annealing process is required for different types of wafers, different equipment is often used for transfer. One device is only used for one type of wafer that requires annealing process, thereby realizing annealing operations for single wafers and double wafers after bonding. However, due to operating conditions, it is sometimes impossible to realize multiple wafer transfer devices and multiple sets of spare parts for the annealing operations of single wafers and double wafers after bonding. In addition, the existing wafer transfer equipment generally relies on visual judgment and manual adjustment of the position of the robot arm during wafer transfer. It often requires multiple debugging to place the wafer to be operated in a relatively accurate position. The debugging accuracy cannot be guaranteed, which increases the operation time and cost.

[0003] Therefore, a furnace tube annealing process wafer transfer debugging device is needed to debug the wafer transfer position of a single wafer transfer equipment, so that the single wafer transfer device can be compatible with the transfer of single wafers and double wafers after bonding without causing collisions, and has high debugging accuracy, does not require repeated debugging, and saves operation time and cost. Summary of the invention

[0004] In order to solve all or part of the problems in the prior art mentioned above, the present invention provides a device, system and method for adjusting the temperature of a furnace tube annealing process.

[0005] To achieve the above-mentioned purpose, a technical solution adopted by the present invention is: to provide a wafer transmission and debugging system for a furnace tube annealing process, including a wafer transmission device, a sensor detection device and a platform control device, a wafer to be debugged and a wafer boat;

[0006] The wafer conveying device comprises a power device and a conveying arm, and the wafer to be debugged is placed on the conveying arm; the power device drives the conveying arm and the sensor detection device to move in the horizontal direction or the vertical direction;

[0007] The sensor detection device includes at least two groups of laser sensors, and the laser sensors are respectively used to determine the position of the boat teeth of the wafer boat and measure the distance from the laser sensor to the transfer arm and / or the wafer to be debugged;

[0008] The platform control adjusts the film transmission position of the transmission arm according to the position and distance information obtained by the laser sensor and records and stores the adjusted position parameters.

[0009] The present invention adjusts and determines the wafer transfer position of the transfer arm by setting a sensor detection device, thereby avoiding the inaccuracy caused by visual and manual debugging in traditional debugging methods, eliminating the need for repeated debugging, saving operation time and cost. Moreover, after the wafer transfer debugging device provided by the present invention determines the wafer transfer position, it can meet the wafer transfer needs of single wafers and double wafers after bonding on the same device without causing wafer collision.

[0010] The sensor detection device also includes a laser bracket, on which a first laser sensor and a second laser sensor are arranged. The first laser sensor measures the distance between itself and the transfer arm and / or the wafer to be debugged, and the second laser sensor determines the position of the boat teeth of the wafer boat.

[0011] The conveying arms are divided into multiple groups, and the distance between two adjacent groups of conveying arms is the same. One end of each group of conveying arms is fixedly connected to the power device.

[0012] The crystal boat comprises a plurality of groups of boat teeth, the boat teeth have the same thickness, and the intervals between two adjacent groups of boat teeth are the same.

[0013] The platform control device includes a debugging module and a storage module. The wafer transfer position includes a wafer entry position where the transfer arm sends the wafer to be debugged into the wafer boat and a wafer removal position where the wafer to be debugged is taken out from the wafer boat after the process is completed. The debugging module adjusts the wafer entry position and the wafer removal position according to the position and the distance information obtained by the laser sensor. The storage module records and stores the adjusted wafer entry position parameters and wafer removal position parameters for use in wafer transfer of the wafer to be transferred.

[0014] Assume that the distance between two adjacent boat teeth on the wafer boat is X, the two boat teeth are divided into upper boat teeth and lower boat teeth according to their relative positions, the thickness of the wafer to be debugged is Y, the distance between the first laser sensor and the second laser sensor in the vertical direction is d, when the debugging module determines the wafer feed position, the lower surface of the upper boat tooth is determined as the test baseline A by using the second laser sensor, the distance from the first laser sensor to the upper surface of the wafer to be debugged is D1, the distance Z1 from the upper surface of the wafer to be debugged to the test baseline A is calculated, and the wafer feed position is adjusted to ensure that the distance Z1 satisfies 1mm≤Z1≤(XY) / 2. When the distance Z1 from the upper surface of the wafer to be debugged to the lower surface of the upper boat tooth satisfies 1mm≤Z1≤(XY) / 2, the wafer to be debugged will not collide with the wafer during entering the wafer boat. For a standard wafer boat, the spacing between the boat teeth is 3.5±1.mm, the thickness of a single wafer is 0.725mm, and the thickness of a double wafer after bonding is 1.45mm. When the distance Z1 from the upper surface of the wafer to be debugged to the lower surface of the upper boat tooth is equal to 1mm, no matter whether the wafer to be operated is a single wafer or a double wafer after bonding, the wafers will not collide when entering the wafer boat.

[0015] When the debugging module determines the film-taking position, the upper surface of the lower boat tooth is determined to be the test baseline B by using the second laser sensor, the thickness of the boat tooth is E, the distance from the first laser sensor to the upper surface of the conveying arm is D2, the distance from the upper surface of the conveying arm to the test baseline B is calculated to be Z2, and the film-taking position is adjusted to ensure that the distance Z2 satisfies Z2≤(XY) / 2+E. When the distance Z2 from the upper surface of the conveying arm to the upper surface of the lower boat tooth satisfies Z2≤(XY) / 2+E, the conveying arm will not hit the lower wafer in the process of taking the film out of the wafer boat.

[0016] The storage module also includes a calculation function, which performs a film transmission debugging on the top boat teeth and the bottom boat teeth of the wafer boat, records the film feed position parameters and the film pickup position parameters, and calculates the film feed position and the film pickup position parameters of the middle part of the wafer boat through a pre-set program. Since the thickness of the boat teeth and the boat teeth spacing of the wafer boat are fixed values, the spacing between every two of the transmission arms is the same, and it is only necessary to perform a film transmission debugging on the top boat teeth and the bottom boat teeth of the wafer boat, respectively, and after recording the film feed position parameters and the film pickup position parameters, the position parameters of the middle part of the wafer boat can be calculated through a set program, and it is not necessary to perform multiple debugging on the same wafer boat, saving debugging steps and time.

[0017] The present invention also provides a film transmission debugging method for a furnace tube annealing process, which uses the film transmission debugging system for a furnace tube annealing process described in any one of the above technical solutions to adjust and record the film transmission position parameters of the transmission arm, including the following steps:

[0018] Step 1: placing the wafer to be debugged on the conveying arm, and moving the conveying arm to an initial position;

[0019] Step 2: Adjust the film feed position of the conveying arm, assume that the distance between two adjacent boat teeth on the wafer boat is X, the two boat teeth are divided into upper boat teeth and lower boat teeth according to their relative positions, the thickness of the wafer to be debugged is Y, the distance between the first laser sensor and the second laser sensor in the vertical direction is d, when the debugging module determines the film feed position, the lower surface of the upper boat tooth is determined as the test baseline A by using the second laser sensor, the distance from the first laser sensor to the upper surface of the wafer to be debugged is D1, the distance Z1 from the upper surface of the wafer to be debugged to the test baseline A is calculated, and the film feed position is adjusted to ensure that the distance Z1 satisfies 1mm≤Z1≤(XY) / 2;

[0020] Step 3: Adjust the film-taking position of the conveying arm, use the second laser sensor to determine that the upper surface of the lower boat tooth is the test baseline B, the thickness of the boat tooth is E, the distance from the first laser sensor to the upper surface of the conveying arm is D2, and the distance from the upper surface of the conveying arm to the test baseline B is calculated to be Z2, and adjust the film-taking position to ensure that the distance Z2 satisfies Z2≤(XY) / 2+E;

[0021] Step 4: Record and store the wafer feeding position parameters in step 2 and the wafer taking position parameters in step 3 for use in wafer transfer.

[0022] Compared with the prior art, the beneficial effects of the present invention are as follows: the film transfer debugging device for the furnace tube annealing process provided by the present invention adjusts and determines the film transfer position of the transfer arm by setting a sensor detection device, thereby avoiding the inaccuracy caused by visual and manual debugging in traditional debugging methods, and does not require repeated debugging, thus saving operation time and cost. Moreover, after the film transfer debugging device provided by the present invention determines the film transfer position, it can meet the film transfer of single wafers and double wafers after bonding on the same device without causing collision. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0024] Figure 1 It is a structural schematic diagram of a furnace tube annealing process transmission and debugging device provided by Example 1 of the present invention;

[0025] Figure 2 is a schematic diagram of the device for adjusting the film feeding position of the conveying arm in Example 1;

[0026] Figure 3 is a schematic diagram of the device for adjusting the film taking position of the conveying arm in Example 1;

[0027] Figure 4 It is a flow chart of a furnace tube annealing process transmission and debugging method provided in Example 2 of the present invention.

[0028] Description of reference numerals:

[0029] 1. Wafer conveying device; 11. Power device; 12. Conveying arm; 2. Sensor detection device; 21. Laser bracket; 22. Laser sensor; 221. First laser sensor; 222. Second laser sensor; 3. Platform control device; 31. Debugging module; 32. Storage module; 4. Wafer to be debugged; 5. Wafer boat; 51. Boat gear. DETAILED DESCRIPTION

[0030] In order to make the purpose, technical scheme and advantages of the present invention clearer, the specific embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. Examples of these preferred embodiments are illustrated in the accompanying drawings. The embodiments of the present invention shown in the accompanying drawings and described according to the accompanying drawings are merely exemplary, and the present invention is not limited to these embodiments.

[0031] It should also be noted that, in order to avoid obscuring the present invention due to unnecessary details, only structures and / or processing steps closely related to the solutions according to the present invention are shown in the accompanying drawings, while other details that are not closely related to the present invention are omitted.

[0032] Example 1

[0033] This embodiment provides a furnace tube annealing process transmission and debugging system. Figure 1 As shown, it includes a wafer conveying device 1, a sensor detection device 2, a platform control device 3, a wafer to be debugged 4 and a wafer boat 5.

[0034] The wafer conveying device 1 includes a power device 11 and a conveying arm 12, and the wafer 4 to be debugged is placed on the conveying arm 12; the power device 11 drives the conveying arm 12 and the sensor detection device 2 to move in the horizontal direction or the vertical direction. In this embodiment, the conveying arms 12 are multiple groups, and the spacing between two adjacent groups of conveying arms 12 is the same, and one end of each group of conveying arms 12 is connected to the power device 11. The wafer boat 5 includes multiple groups of boat teeth 51, and the boat teeth 51 have the same thickness, and the spacing between two adjacent groups of boat teeth 51 is the same.

[0035] The sensor detection device 2 includes at least two groups of laser sensors 22, and the laser sensors 22 are respectively used to determine the position of the boat teeth 51 of the wafer boat 5 and measure the distance from the laser sensor 22 to the transfer arm 12 and / or the wafer to be debugged 4. In this embodiment, the sensor detection device 2 includes two groups of laser sensors 22 and a laser bracket 21, a first laser sensor 221 is arranged on the horizontal end of the laser bracket 21, and a second laser sensor 222 is arranged on the vertical end of the laser bracket 21.

[0036] The platform control device 3 includes a debugging module 31 and a storage module 32. The wafer transfer position includes the wafer entry position where the transfer arm 12 sends the wafer 4 to be debugged into the wafer boat 5 and the wafer removal position where the wafer 4 to be debugged is taken out from the wafer boat 5 after the process is completed. The debugging module 31 adjusts the wafer entry position and the wafer removal position according to the position and the distance information obtained by the laser sensor 22. The storage module 32 records and stores the adjusted wafer entry position parameters and wafer removal position parameters for use in wafer transfer of the wafer to be transferred.

[0037] Assume that the distance between two adjacent boat teeth 51 on the wafer boat 5 is X, the two boat teeth 51 are divided into an upper boat tooth 51 and a lower boat tooth 51 according to their relative positions, the thickness of the wafer 4 to be debugged is Y, the distance between the first laser sensor 221 and the second laser sensor 222 in the vertical direction is d, and the thickness of the boat tooth 51 is E.

[0038] Specifically, when the debugging module 31 determines the film feed position, Figure 2 As shown, the second laser sensor 222 is used to determine that the lower surface of the upper boat tooth 51 is the test baseline A, and the first laser sensor 221 is used to measure the distance D1 between it and the upper surface of the wafer 4 to be debugged, and the distance Z1 from the wafer 4 to be debugged to the test baseline A is calculated. The calculation method is Z1=D1-d, and the wafer feeding position is adjusted to ensure that the distance Z1 satisfies 1mm≤Z1≤(XY) / 2, which can ensure that the wafer 4 to be debugged will not collide with the wafer during entering the wafer boat 5.

[0039] For a standard wafer boat, the spacing between its boat teeth 51 is 3.5±1.mm, the thickness of a single wafer is 0.725mm, and the thickness of a double wafer after bonding is 1.45mm. When the distance Z1 from the upper surface of the wafer 4 to be debugged to the lower surface of the upper boat tooth 51 is equal to 1mm, no matter whether the wafer to be operated is a single wafer or a double wafer after bonding, the wafer will not collide when entering the wafer boat 5.

[0040] When the debugging module 31 determines the film taking position, Figure 3As shown, the second laser sensor 222 is used to determine that the upper surface of the lower boat tooth 51 is the test baseline B, and the first laser sensor 221 is used to measure the distance D2 between it and the upper surface of the conveying arm 12, and the distance Z2 from the conveying arm 12 to the test baseline B is calculated. The calculation method is Z2=D2-d, and the film taking position is adjusted to ensure that the distance Z2 satisfies Z2≤(XY) / 2+E, which can ensure that the conveying arm 12 will not collide with the lower wafer during the process of taking the film out of the wafer boat 5.

[0041] The storage module 32 also includes a calculation function, which performs a film transmission debugging on the top boat tooth 51 and the bottom boat tooth 51 of the crystal boat 5 respectively, records the film feeding position parameters and the film taking position parameters, and obtains the film feeding position and the film taking position parameters in the middle of the crystal boat 5 through calculations set in advance. It is not necessary to perform multiple debugging on the same crystal boat 5, thus saving debugging steps and time.

[0042] The present invention adjusts and determines the wafer transfer position of the transfer arm 12 by setting a sensor detection device 2, thereby avoiding the inaccuracy caused by visual and manual debugging in traditional debugging methods, eliminating the need for repeated debugging, saving operation time and cost, and the wafer transfer position determined by the wafer transfer debugging device provided by the present invention can meet the wafer transfer requirements of single wafers and double wafers after bonding on the same device without causing wafer collision.

[0043] Example 2

[0044] The present invention also provides a furnace tube annealing process film transmission debugging method, using the furnace tube annealing process film transmission debugging system in the above technical solution to adjust and record the film transmission position parameters of the transmission arm, such as Figure 4 As shown, the following steps are included:

[0045] Step 1: placing the wafer 4 to be debugged on the conveying arm 12, and moving the conveying arm 12 to the initial position;

[0046] Step 2: Adjust the wafer feeding position of the conveying arm 12, assume that the distance between two adjacent boat teeth 51 on the wafer boat 5 is X, the two boat teeth 51 are divided into an upper boat tooth 51 and a lower boat tooth 51 according to the relative position, the thickness of the wafer 4 to be debugged is Y, the vertical distance between the first laser sensor 221 and the second laser sensor 222 is d, when the debugging module 31 determines the wafer feeding position, the second laser sensor 222 is used to determine that the lower surface of the upper boat tooth is the test baseline A, the distance from the first laser sensor to the upper surface of the wafer to be debugged is D1, the distance Z1 from the upper surface of the wafer 4 to be debugged to the test baseline A is calculated, and the wafer feeding position is adjusted to ensure that the distance Z1 satisfies 1mm≤Z1≤(XY) / 2;

[0047] Step 3: Adjust the film-taking position of the conveying arm 12, use the second sensor to determine that the upper surface of the lower boat tooth 51 is the test baseline B, the thickness of the boat tooth 51 is E, the distance from the first laser sensor 221 to the upper surface of the conveying arm 12 is D2, and the distance from the upper surface of the conveying arm 12 to the test baseline B is calculated to be the distance Z2 from the upper surface to the test baseline B, and adjust the film-taking position to ensure that the distance Z2 satisfies Z2≤(XY) / 2+E;

[0048] Step 4: Record and store the wafer feeding position parameters in step 2 and the wafer taking position parameters in step 3 for use in wafer transfer.

[0049] In addition, it should be noted that in this specification, "includes", "comprising" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprising a ..." does not exclude the existence of other identical elements in the process, method, article or device including the element.

[0050] It should be understood that although this specification is described according to implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

Claims

1. A furnace tube annealing process transmission and debugging system, characterized in that: It comprises a wafer conveying device (1), a sensor detection device (2), a platform control device (3), a wafer to be debugged (4) and a wafer boat (5); The wafer conveying device (1) comprises a power device (11) and a conveying arm (12), and the wafer to be debugged (4) is placed on the conveying arm (12); the power device (11) drives the conveying arm (12) and the sensor detection device (2) to move in a horizontal direction or a vertical direction; The sensor detection device (2) comprises at least two groups of laser sensors (22), and the laser sensors (22) are respectively used to determine the position of the boat teeth (51) of the wafer boat (5), and to measure the distance from the laser sensor (22) to the transfer arm (12) and / or the wafer to be debugged (4). The platform control device (3) adjusts the film transmission position of the transmission arm (12) according to the position and distance information obtained by the laser sensor (22) and records and stores the adjusted position parameters.

2. A furnace tube annealing process transmission and debugging system according to claim 1, characterized in that: The sensor detection device (2) also includes a laser bracket (21), on which a first laser sensor (221) and a second laser sensor (222) are arranged, wherein the first laser sensor measures the distance between itself and the transfer arm (12) and / or the wafer to be debugged (4), and the second laser sensor (222) determines the position of the boat teeth (51) of the wafer boat (5).

3. A furnace tube annealing process transmission and debugging system according to claim 1, characterized in that: The transmission arms (12) are provided in multiple groups, and the spacing between two adjacent groups of the transmission arms (12) is the same. One end of each group of the transmission arms (12) is fixedly connected to the power device (11).

4. A furnace tube annealing process transmission and debugging system according to claim 3, characterized in that: The crystal boat (5) comprises a plurality of groups of boat teeth (51), the boat teeth (51) have the same thickness, and the spacing between two adjacent groups of boat teeth (51) is the same.

5. A furnace tube annealing process transmission and debugging system according to claim 4, characterized in that: The platform control device (3) comprises a debugging module (31) and a storage module (32); the wafer transfer position comprises a wafer feed position where the transfer arm (12) delivers the wafer to be debugged (4) into the wafer boat (5) and a wafer removal position where the wafer to be debugged (4) is removed from the wafer boat (5) after the process is completed; the debugging module (31) adjusts the wafer feed position and the wafer removal position according to the position and distance information obtained by the laser sensor (22); the storage module (32) records and stores the adjusted wafer feed position parameters and wafer removal position parameters for use in wafer transfer of the wafer to be transferred.

6. A furnace tube annealing process transmission and debugging system according to claim 5, characterized in that: Assuming that the distance between two adjacent boat teeth (51) on the wafer boat (5) is X, the two boat teeth (51) are divided into an upper boat tooth and a lower boat tooth according to their relative positions, the thickness of the wafer (4) to be debugged is Y, the distance between the first laser sensor (221) and the second laser sensor (222) in the vertical direction is d, when the debugging module (31) determines the wafer feeding position, the second laser sensor (222) is used to determine that the lower surface of the upper boat tooth is a test baseline A, the distance from the first laser sensor to the upper surface of the wafer to be debugged is D1, and the distance Z1 from the upper surface of the wafer (4) to be debugged to the test baseline A is calculated. ， , adjust the film feed position to ensure that the distance Z1 satisfies 1mm≤Z1≤(XY) / 2.

7. A furnace tube annealing process transmission and debugging system according to claim 6, characterized in that: When the debugging module (31) determines the film picking position, the second laser sensor (222) is used to determine that the upper surface of the lower boat tooth is the test baseline B, the thickness of the boat tooth (51) is E, the distance from the first laser sensor (221) to the upper surface of the conveying arm (12) is D2, and the distance from the upper surface of the conveying arm (12) to the test baseline B is calculated to be Z2, and the film picking position is adjusted to ensure that the distance Z2 satisfies Z2≤(XY) / 2+E.

8. A furnace tube annealing process transmission and debugging system according to claim 7, characterized in that: The storage module (32) also includes a calculation function, which performs a film transmission debugging on the top boat teeth and the bottom boat teeth of the wafer boat (5) respectively, records the film feed position parameters and the film take-out position parameters, and calculates the film feed position and the film take-out position parameters of the middle part of the wafer boat (5) through a pre-set program.

9. A furnace tube annealing process transmission and debugging method, characterized in that: The process of adjusting and recording the film transfer position parameters of the transfer arm by using the film transfer debugging system for the furnace tube annealing process according to any one of claims 1 to 8 comprises the following steps: Step 1: placing the wafer (4) to be debugged on the transfer arm (12), and moving the transfer arm (12) to an initial position; Step 2: adjusting the wafer feeding position of the conveying arm (12), assuming that the distance between two adjacent boat teeth on the wafer boat (5) is X, the two boat teeth are divided into an upper boat tooth and a lower boat tooth according to their relative positions, the thickness of the wafer (4) to be debugged is Y, the vertical distance between the first laser sensor (221) and the second laser sensor (222) is d, when the debugging module (31) determines the wafer feeding position, the second laser sensor (222) is used to determine that the lower surface of the upper boat tooth is the test baseline A, the distance from the first laser sensor to the upper surface of the wafer to be debugged is D1, the distance Z1 from the upper surface of the wafer (4) to be debugged to the test baseline A is calculated, and the wafer feeding position is adjusted to ensure that the distance Z1 satisfies 1mm≤Z1≤(XY) / 2; Step 3: Adjust the film picking position of the conveying arm (12), use the second laser sensor (222) to determine that the upper surface of the lower boat tooth is the test baseline B, the thickness of the boat tooth is E, the distance from the first laser sensor (221) to the upper surface of the conveying arm (12) is D2, and the distance from the upper surface of the conveying arm (12) to the test baseline B is calculated to be Z2, and adjust the film picking position to ensure that the distance Z2 satisfies Z2≤(XY) / 2+E; Step 4: Record and store the wafer feeding position parameters in step 2 and the wafer taking position parameters in step 3 for use in wafer transfer.

Images