Optical anti-shake assembly and long-focus camera module

By increasing the magnet force of the magnet and designing a multi-directional combination of magnets and coils, the jitter problem during handheld shooting of smartphones is solved, optical image stabilization with a larger stroke and faster response time is achieved, and the imaging of the camera module is improved. Spend.

CN119520992APending Publication Date: 2025-02-25NINGBO SUNNY OPOTECH CO LTD
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Patent Information

Application Number
CN202311052084.9
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2023-08-18
Publication Date
2025-02-25

AI Technical Summary

Technical Problem

The shaking of the hand of a smartphone during handheld shooting will lead to a decrease in camera imaging clarity, and the prior art will find it difficult to effectively compensate for this shaking, especially when the space in the coil is limited.

Method used

By increasing the magnetic force of the magnet, the greater the driving force generated by the interaction between the coil and the magnet, the greater the optical anti-shake of a larger stroke can be achieved. At the same time, a multi-directional combination of magnets and coils is designed to enhance the magnetism of the magnets and increase the motor movement speed to achieve better optical anti-shake effect.

Benefits of technology

It realizes optical anti-shake with a larger stroke, reduces the response time of the motor, improves the imaging clarity of the camera module, and meets the lightweight and thin needs of smartphones.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention provides an optical anti-shake assembly and a long-focus camera module, the optical anti-shake assembly is suitable for driving a photosensitive assembly of the camera module to move, the optical anti-shake assembly comprises a base and a support, and the support is fixed on the base; the chip carrier is movably arranged on the base and is suitable for driving the chip carrier to move relative to the base and the bracket; the driving assembly is configured to drive a chip carrier to move in the horizontal direction, the driving assembly comprises at least one first driving mechanism and at least one second driving mechanism, the first driving mechanism is arranged between the chip carrier and the support, and the second driving mechanism is arranged between the chip carrier and the support. The driving chip carrier moves along a first horizontal direction relative to the bracket; the second driving mechanism is arranged between the chip carrier and the base and drives the chip carrier to move relative to the support in the second horizontal direction.
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Description

Technical Field

[0001] The present invention relates to the field of optical imaging technology, and in particular to an optical anti-shake component and a telephoto camera module. Background Art

[0002] Smartphones are equipped with cameras that allow users to take pictures with their hands. In the process of taking pictures with smartphones, hand shaking is an inevitable physiological phenomenon. However, when users take pictures with smartphones, even slight hand shaking will be transmitted to the smartphone, causing the smartphone to shake. The shaking of the smartphone will inevitably affect the imaging clarity of the camera, resulting in blurred and unclear images. On the basis of meeting the development trend of thin and light smartphones, how to compensate for the above-mentioned shaking to allow users to take clear images with their smartphones is a technical problem that this application is committed to solving.

[0003] When the VCM motor of the prior art drives the optical lens and / or photosensitive component to move to realize the optical image stabilization function of the camera module, after the coil is energized, the interaction between the coil and the magnet generates an electromagnetic force (also called a driving force), and the optical lens and / or photosensitive component will move under the drive of the carrier under the drive of the electromagnetic force to realize the optical image stabilization function. However, due to the limited spatial volume, number of coil turns and effective length of the coil, it becomes more difficult to increase the electromagnetic force by increasing the size of the coil. Moreover, if the current energizing the coil increases, energy consumption will also increase. Summary of the invention

[0004] A major advantage of the present invention is that it provides an optical image stabilization component and a telephoto camera module, which increases the driving force by increasing the magnetic force of the magnet. The greater the driving force generated by the interaction between the coil and the magnet, the greater the optical image stabilization range that can be achieved.

[0005] Another advantage of the present invention is that it provides an optical image stabilization component and a telephoto camera module, wherein the optical image stabilization component can speed up the movement speed of the motor, making the response time of the motor shorter, thereby achieving a better optical image stabilization effect.

[0006] Another advantage of the present invention is that it provides an optical image stabilization component and a telephoto camera module, wherein the optical image stabilization component includes a first coil group and a first magnet group arranged relative to each other in a height direction to drive the movable carrier to move in a first direction; a second coil group and a second magnet group are arranged relative to each other in a horizontal direction to drive the movable carrier to move in a second direction and / or rotate around a main axis.

[0007] Another advantage of the present invention is that it provides an optical image stabilization component and a telephoto camera module, wherein the second magnet group and the third magnet group are relatively arranged on the peripheral side of the first magnet group along the width direction, so that the drive in two directions can be separated to avoid interference; and the number of magnets moving in two directions can be increased to increase the magnetic force of the magnets.

[0008] According to one aspect of the present invention, an optical image stabilization assembly of the present invention that can achieve the aforementioned objects and other objects and advantages includes:

[0009] A movable carrier, used to be connected to an optical element having a main axis, wherein the movable carrier has an accommodating cavity inside;

[0010] a support, the movable carrier being movable relative to the support;

[0011] A driving component, wherein the driving component includes a first driving mechanism and a second driving mechanism, wherein the first driving mechanism drives the movable carrier to move in a first direction, and the second driving mechanism drives the movable carrier to move in a second direction, wherein the first direction and the second direction are perpendicular to the main axis direction, and the first direction and the second direction intersect; wherein the first driving mechanism includes: a first magnet group arranged on the movable carrier, and a first coil group arranged opposite to the first magnet group; the second driving mechanism includes: a second magnet group arranged on the movable carrier, and a second coil group arranged opposite to the second magnet group; the first magnet group is arranged in the accommodating cavity of the movable carrier, and the second magnet group is arranged on the side wall of the movable carrier.

[0012] According to an embodiment of the present application, the first magnet group is arranged on one of the movable carrier and the bracket, the first coil group is arranged on the other of the movable carrier and the bracket, and the first magnet group and the first coil group are arranged opposite to each other along the main axis direction.

[0013] According to one embodiment of the present application, the driving device also includes a base, the second magnet group is arranged at one of the base and the movable carrier, the second coil group is arranged at the other of the base and the movable carrier, and the second magnet group and the second coil group are arranged relatively to each other along the second direction.

[0014] According to one embodiment of the present application, during the process in which the first magnet group and the first coil group interact to drive the movable carrier to move along the first direction, the relative distance between the first coil group and the first magnet group remains unchanged; during the process in which the second magnet group and the second coil group interact to drive the movable carrier to move along the second direction, the relative distance between the second coil group and the second magnet group may change.

[0015] According to one embodiment of the present application, the first magnet group is implemented as a Halbach array magnet, the first magnet group includes a plurality of first magnets arranged along a first direction, the first coil group includes at least two first coils arranged along the first direction, and the Halbach array magnet is arranged opposite to the first coil group along the main axis direction.

[0016] According to one embodiment of the present application, the first magnet group is composed of five or more magnets including magnets arranged above and below the N pole and the S pole, magnets arranged left and right of the N pole and the S pole, magnets arranged above and below the S pole and the N pole, magnets arranged left and right of the S pole and the N pole, and magnets arranged above and below the N pole and the S pole. The five or more magnets are combined in sequence in the horizontal direction to form a Halbach array magnet.

[0017] According to an embodiment of the present application, the second magnet group includes at least one second magnet and at least one third magnet that are arranged opposite to each other, and the at least one second magnet, the first magnet group and the at least one third magnet are arranged in sequence along the second direction.

[0018] According to an embodiment of the present application, the length directions of the first magnet group, the at least one second magnet and the at least one third magnet are the same.

[0019] According to one embodiment of the present application, the driving device includes at least one magnetic isolation member, which is arranged on the side of the at least one second magnet facing the first magnet group and on the side of the at least one third magnet facing the first magnet group, so as to avoid magnetic interference between the first magnet group and the at least one second magnet and the at least one third magnet.

[0020] According to one embodiment of the present application, the second magnet group is arranged on one long side of the side wall of the movable carrier, the third magnet group is arranged on the other long side of the side wall of the movable carrier opposite thereto, and the second magnet group and the third magnet group are arranged on opposite sides of the movable carrier.

[0021] According to an embodiment of the present application, the magnetic pole directions of the second magnet group and the third magnet group are perpendicular to the winding planes of the second coil group and the third coil group.

[0022] According to an embodiment of the present application, it further includes at least one supporting mechanism, wherein the supporting mechanism is disposed between the bracket and the movable carrier, and maintains a gap between the movable carrier and the bracket.

[0023] According to an embodiment of the present application, the support mechanism includes at least three balls, and at least one of the bracket and the movable carrier is provided with a ball groove for accommodating the support mechanism, and the number of the ball grooves is at least three.

[0024] According to one embodiment of the present application, a circuit board is further included, which is used to connect the anti-shake drive component, wherein the circuit board includes a first bending portion, a second bending portion and a third bending portion that are integrally connected, the first bending portion extends in the height direction, the second bending portion extends in the horizontal direction after being bent from the first bending portion, and the third bending portion extends in the height direction after being bent from the second bending portion, and one end of the circuit board is electrically connected to the chip circuit board of the photosensitive component.

[0025] According to one embodiment of the present application, the circuit board includes two circuit board units, wherein the circuit board unit further includes a first bending section, a second bending section and a third bending section, wherein the first bending section of the circuit board unit is located on the long side of the photosensitive chip and is parallel to the photosensitive surface of the photosensitive chip, that is, the first bending section is perpendicular to the Z axis, the second bending section is located on the long side of the photosensitive chip, and extends from the first bending section, and the extension direction of the second bending section is perpendicular to the X-axis direction, the third bending section is located on the long side of the photosensitive chip, the third bending section extends vertically from the second bending section, and the third bending section is perpendicular to the Y direction.

[0026] According to another aspect of the present application, the present application further provides a telephoto camera module, including:

[0027] Optical lens;

[0028] A photosensitive component, wherein the optical lens is at the front end of the light incident direction of the photosensitive component;

[0029] A light deflection component, wherein the light deflection component is configured to reflect the light at least once so that the light can reach the photosensitive component; and

[0030] An optical image stabilization component as described above, wherein the optical image stabilization component is connected to the photosensitive component.

[0031] Further objects and advantages of the present invention will be fully apparent from an understanding of the following description and the accompanying drawings.

[0032] These and other objects, features and advantages of the present invention will be more fully understood from the following detailed description and accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] The technical solution of the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. In the accompanying drawings, unless otherwise specified, the same reference numerals are used to represent the same components. Among them:

[0034] Figure 1 Schematic diagram of the overall structure of an optical image stabilization assembly according to a first preferred embodiment of the present invention.

[0035] Figure 2 is a schematic exploded view of the optical image stabilization assembly according to the first preferred embodiment of the present invention.

[0036] Figure 3 is a schematic structural diagram of a driving component of the optical image stabilization component according to the first preferred embodiment of the present invention.

[0037] Figure 4 is a schematic structural diagram of the first magnet group of the optical image stabilization assembly according to the first preferred embodiment of the present invention.

[0038] Figure 5 is a three-dimensional cross-sectional schematic diagram of the optical image stabilization assembly according to the first preferred embodiment of the present invention.

[0039] Figure 6 is a schematic structural diagram of a circuit board of the optical image stabilization assembly according to the first preferred embodiment of the present invention.

[0040] Figure 7 is a partial structural schematic diagram of the optical image stabilization component according to the first preferred embodiment of the present invention.

[0041] Fig. 8A is a schematic diagram of another optional implementation of the optical image stabilization component according to the above preferred embodiment of the present invention.

[0042] Figure 8B It is a schematic structural diagram of a circuit board according to another optional implementation of the optical image stabilization component according to the above preferred embodiment of the present invention.

[0043] 9A to 9C It is a schematic diagram of the circuit board structure of another optional implementation of the optical image stabilization component according to the above preferred embodiment of the present invention.

[0044] Fig.10 Schematic diagram of the structure of a telephoto camera module according to a first preferred embodiment of the present invention.

[0045] Fig.11 Schematic diagram of the structure of a telephoto camera module according to a second preferred embodiment of the present invention.

[0046] Fig.12 4 is a schematic structural diagram of a telephoto camera module according to a third preferred embodiment of the present invention.

[0047] Fig.13 4 is a schematic structural diagram of a telephoto camera module according to a third preferred embodiment of the present invention. DETAILED DESCRIPTION

[0048] It should be pointed out that the embodiments shown in the drawings are only used as examples to specifically and figuratively explain and illustrate the concept of the present invention. The size and structure thereof are not necessarily drawn to scale, nor do they constitute a limitation to the concept of the present invention.

[0049] The directional terms such as up, down, left, right, front, back, front, back, top, bottom, etc. mentioned or may be mentioned in this specification are defined relative to the structures shown in the various drawings. They are relative concepts and may change accordingly according to different positions and different usage conditions. Therefore, these or other directional terms should not be interpreted as restrictive terms.

[0050] Referring to the drawings of this application specification Figures 1 to 6 As shown, an optical anti-shake assembly 100 according to the first preferred embodiment of the present application is explained in the following description. The optical anti-shake assembly 100 is suitable for a telephoto camera module, and the telephoto camera module includes an optical element, and the optical anti-shake assembly 100 is used to drive the optical element to move along a direction perpendicular to the direction in which light is incident on the optical element. The optical element can be an optical element such as a photosensitive chip, a lens, a lens, etc.

[0051] Specifically, the telephoto camera module further includes an optical lens 200 and a photosensitive component 300, wherein the photosensitive component 300 is movably arranged on the optical image stabilization component 100, and the optical image stabilization component 100 is used to drive the photosensitive component 300 to move in a direction perpendicular to the light incident on the photosensitive component 300, so as to realize the optical image stabilization function of the camera module; or the optical lens 200 is movably arranged on the optical image stabilization component 100, and the optical image stabilization component 100 is used to drive the optical lens 200 to move in a direction perpendicular to the light incident on the optical lens 200, so as to realize the optical image stabilization function of the camera module.

[0052] In the present application, the direction in which the light is incident on the optical element is defined as the main axis direction of the optical element. For example, in one embodiment of the present application, the direction in which the light is incident on the photosensitive component 300 is defined as the main axis direction of the photosensitive component 300, that is, the direction in which the main axis is perpendicular to the photosensitive surface of the photosensitive component 300. The optical image stabilization component 100 is configured to drive the photosensitive component 300 to move in a plane perpendicular to the main axis direction to achieve an optical image stabilization function. In another embodiment of the present application, the direction in which the light is incident on the optical lens 200 is defined as the main axis direction of the optical lens 200, that is, the optical axis direction of the optical lens 200.

[0053] The optical image stabilization assembly 100 includes a base 10, a bracket 20, a movable carrier 30, and an anti-shake driving assembly 40, wherein the bracket 20 is fixed to the base 10, the movable carrier 30 is movably arranged in the base 10, the anti-shake driving assembly 40 is configured to drive the movable carrier 30 to move relative to the base 10 and the bracket 20, the optical element is fixed to the movable carrier 30, and the movable carrier 30 is movably arranged on the base 10. In a specific example of the present application, the photosensitive chip of the photosensitive assembly 300 is connected to the movable carrier 30, so that the photosensitive chip of the photosensitive assembly 300 moves with the movement of the movable carrier 30. In another specific example of the present application, the optical lens 300 is connected to the movable carrier 30, so that the optical lens 300 can move with the movement of the movable carrier 30.

[0054] In a specific example of the present application, the anti-shake driving assembly 40 is configured to drive the movable carrier 30 to move in the horizontal direction, and the photosensitive chip of the photosensitive assembly 300 moves in the horizontal direction with the movable carrier 30 to achieve the optical anti-shake function. In the present application, the horizontal direction is a direction perpendicular to the main axis direction, and the height direction is a direction parallel to the main axis direction.

[0055] In another specific example of the present application, the anti-shake driving assembly 40 is configured to drive the optical lens 200 to move in the horizontal direction, and at least one lens unit of the optical lens 200 can move in the horizontal direction along with the movable carrier 30 to achieve the optical anti-shake function. In the present application, the horizontal direction is a direction perpendicular to the main axis direction, and the height direction is a direction parallel to the main axis direction.

[0056] In the present application, the base 10 is a stator, that is, the position of the base 10 is fixed. The base 10 includes a base substrate and a base side portion that is bent and extended from the base substrate in an integral manner, wherein the base side portion includes two long side portions and two short side portions, the base substrate is located on one side of the optical image stabilization component 100, the two long side portions are respectively located on the two long sides of the optical image stabilization component 100, and the two short side portions are respectively located on the two short sides of the optical image stabilization component 100. In a specific example of the present application, the base side portion includes a first base side portion, a second base side portion, a third base side portion, and a fourth base side portion that are bent and extended from the peripheral side of the base substrate to wrap the side of the bracket 20, the movable carrier 30, and the anti-shake driving component 40. The first base side portion, the second base side portion, the third base side portion, and the fourth base side portion are arranged on the peripheral side of the base substrate in a clockwise direction. It should be understood that the optical image stabilization assembly 100 has a relative top side and bottom side, and a peripheral side connecting the top side and the bottom side, the peripheral side includes a first side, a second side, a third side and a fourth side distributed in a clockwise direction, the first base side is located on the first side, the second base side is located on the second side, the third base side is located on the third side, and the fourth base side is located on the fourth side.

[0057] The bracket 20 is a stator, and the bracket 20 is located between the movable carrier 30 and the base substrate of the base 10, wherein the bracket 20 is fixed to the side of the base substrate facing the movable carrier 30 by, for example, bonding, so that the relative positions of the bracket 20 and the base 10 remain fixed. In one embodiment of the present application, the base 10 is made of metal, and the bracket 20 is made of resin, so that it is easier to form a ball groove on the bracket 20.

[0058] The movable carrier 30 includes a top, a bottom, two long side portions and two short side portions connected to the top and the bottom. The photosensitive component 300 is fixed to a side of the movable carrier 30 body away from the bracket 20. In a specific example of the present application, the chip circuit board of the photosensitive component 300 is fixed to a side of the movable carrier 30 body away from the bracket 20 by, for example, bonding.

[0059] The anti-shake drive assembly 40 includes at least one first drive mechanism 41 and at least one second drive mechanism 42, wherein the first drive mechanism 41 is arranged between the movable carrier 30 and the bracket 20 to drive the movable carrier 30 to move along a first direction relative to the bracket 20; the second drive mechanism 42 is arranged between the movable carrier 30 and the base 10 to drive the movable carrier 30 to move along a second direction relative to the bracket 20.

[0060] It can be understood that the first direction and the second direction are perpendicular to each other in the plane where the horizontal direction is located. As an example, in this preferred embodiment of the present application, the first direction is parallel to the first base side, and the second direction is parallel to the second base side. The first direction and the second direction are perpendicular to the main axis direction, and the first direction and the second direction intersect.

[0061] It should be understood that as people put forward more stringent requirements on the imaging quality of camera modules, the increase in the size of photosensitive chips is an inevitable development trend. As the size of photosensitive chips increases, the size of optical lenses will also increase to achieve a larger amount of light entering and improve the imaging effect. Furthermore, in order to drive the movement of larger photosensitive chips and / or optical lenses, it is necessary to enable the anti-shake drive component 40 to generate a larger driving force.

[0062] In one embodiment of the present application, the first drive mechanism 41 and the second drive mechanism 42 are implemented as VCM motors. In the present application, the number of magnets is increased to increase the magnetic force of the magnets, thereby increasing the driving force of the first drive mechanism 41 and the second drive mechanism 42. It should be understood that, on the one hand, the greater the driving force generated by the interaction between the coil and the magnet, the greater the optical image stabilization of the stroke can be achieved; on the other hand, the movement speed of the motor can be accelerated, so that the response time of the motor is shorter, thereby achieving a better optical image stabilization effect.

[0063] It is worth mentioning that when the optical image stabilization assembly 100 described in the present application is used in a telephoto camera module, the increase in the height dimension of the optical image stabilization assembly 100 will increase the height of the telephoto camera module, which cannot meet the demand for miniaturization of the camera module. Therefore, in the present application, the coils and magnet assemblies of the first drive mechanism 41 and the second drive mechanism 42 of the optical image stabilization assembly 100 are centrally arranged on the back of the photosensitive chip, that is, the movable carrier 30 is located on the back of the photosensitive chip. This increases the length along the length direction of the optical path, but the dimensions in the first and second directions are reduced, which is conducive to reducing the height of the camera module.

[0064] The first driving mechanism 41 includes at least one first magnet group 411 and at least one first coil group 412, wherein the first magnet group 411 is arranged on one of the movable carrier 30 and the bracket 20, and the first coil group 412 is arranged on the other of the movable carrier 30 and the bracket 20; and the first magnet group 411 and the first coil group 412 are arranged relative to each other in the height direction, so that the movable carrier 30 can be driven to move along the first direction relative to the bracket 20 through the magnetic force between the first magnet group 411 and the first coil group 412, so as to realize the optical image stabilization function.

[0065] As an example, the movable carrier 30 is provided with a first magnet installation groove, the first magnet group 411 is arranged in the first magnet installation groove of the movable carrier 30, and the first coil group 412 is arranged on the bottom surface of the bracket 20, so as to drive the movable carrier 30 to move along the first direction relative to the bracket 20 through the interaction between the first magnet group 411 and the first coil group 412. The first magnet installation groove is a accommodating cavity inside the movable carrier 30.

[0066] In a specific example of the present application, the first magnet group 411 is implemented as a Halbach array magnet, the first magnet group 411 includes a plurality of first magnets arranged along a first direction, the first coil group 412 includes at least two first coils arranged along the first direction, and the Halbach array magnet and the first coil group are arranged relative to each other along the main axis direction to drive the movable carrier 30 to move relative to the bracket 20 along the first direction. The setting of the Halbach array magnet can increase the magnetic force of the magnet, thereby increasing the driving force generated by the interaction between the first magnet group 411 and the first coil group 412, thereby increasing the thrust of the optical image stabilization component 100 along the first direction. On the one hand, it can enable the movable carrier 30 to move a greater distance along the first direction; on the other hand, it can enable the movable carrier 30 to respond faster when moving along the first direction, and the required response time is shorter, so as to achieve a better optical image stabilization effect.

[0067] like Figure 4 As shown, the first magnet group 411 is composed of five or more magnets including a magnet arranged above and below the N pole and the S pole, a magnet arranged left and right between the N pole and the S pole, a magnet arranged above and below the S pole and the N pole, a fourth magnet arranged left and right between the S pole and the N pole, and a fifth magnet arranged above and below the N pole and the S pole. The five or more magnets are sequentially combined in the horizontal direction to form a Halbach array magnet. It should be understood that in another optional real-time method of the present application, the magnetic pole directions of the five magnets can also be swapped.

[0068] In a specific example of the present application, the second driving mechanism 42 includes a second magnet group 421 and a second coil group 422 that is positively opposite to the second magnet group 421. In another specific example of the present application, the second driving mechanism 42 includes a second magnet group 421 and at least one third magnet group 423, and a second coil group 422 that is positively opposite to the second magnet group 421 and a third coil group 424 that is positively opposite to the third magnet group 423. In other words, the second driving mechanism 42 may only include the second magnet group 421 and the second coil group 422; or, the second driving mechanism 42 may include the second magnet group 421 and the second coil group 422, and the third magnet group 423 and the third coil group 424 at the same time. In the present application, the second driving mechanism 42 may include the second magnet group 421 and the second coil group 422, and the third magnet group 423 and the third coil group 424 at the same time as an example for introduction.

[0069] The second magnet group 421 and the third magnet group 423 are arranged on one of the movable carrier 30 and the base 10, the second coil group 422 and the third coil group 424 are arranged on the other of the movable carrier 30 and the base 10, the second magnet group 421 and the second coil group 422 are arranged relative to each other along the second direction, and the third magnet group 423 and the third coil group 424 are arranged relative to each other along the second direction, so that the movable carrier 30 can be driven to move relative to the base 10 along the second direction by the magnetic force between the second magnet group 421 and the second coil group 422, and the magnetic force between the third magnet group 423 and the third coil group 424, so as to realize the optical image stabilization function. Further, in the present application, the movable carrier 30 is driven to rotate relative to the base 10 around the main axis direction by the magnetic force between the second magnet group 421 and the second coil group 422, and the magnetic force between the third magnet group 423 and the third coil group 424, so as to realize the optical image stabilization function.

[0070] In a specific example of the present application, the second magnet group 421 is arranged on one long side of the side wall of the movable carrier 30, the third magnet group 423 is arranged on the other long side of the side wall of the movable carrier 30 opposite thereto, and the second magnet group 421 and the third magnet group 423 are arranged on opposite sides of the movable carrier 30. The second coil group 422 is arranged on one long side of the side of the base 10, the third coil group 424 is arranged on the other long side of the side of the base 10 opposite thereto, and the second coil group 422 and the third coil group 424 are arranged on opposite sides of the side of the base 10. It should be understood that in the present application, by increasing the number of magnets and improving the magnetic force of the magnets, the second driving mechanism 42 can generate a greater driving force.

[0071] In addition, in this embodiment of the present application, the first magnet group 411 is arranged in the middle cavity of the movable carrier 30, and the second magnet 421 and the third magnet 423 are arranged on the opposite side walls of the movable carrier 30. The second magnet group 421, the first magnet group 411, and the third magnet 423 are arranged in sequence along the second direction, wherein the first magnet group 411 is arranged between the second magnet 421 and the third magnet 423. In this way, the magnets of the driving assembly are centrally arranged on the movable carrier, making the overall structure of the driving assembly compact and simple, which is conducive to reducing the structural complexity of the overall driving device.

[0072] Furthermore, the optical image stabilization assembly 100 further includes at least one magnetic shielding member 70, and the magnetic shielding member 70 is arranged on the side of the image stabilization magnet away from the image stabilization coil, that is, the magnetic shielding member 70 is arranged on the movable carrier 30. This arrangement can make the magnetic lines of force of the image stabilization magnet concentrate in the direction of the image stabilization coil to increase the magnetic field strength of the optical image stabilization assembly 100, and can also avoid the magnetic force of the image stabilization magnet from overflowing. In this embodiment of the present application, the magnetic shielding member 70 is arranged between the first magnet group 411, the second magnet group 421 and the third magnet group 423. It should be understood that in the present application, the first magnet group 411, the second magnet group 421 and the third magnet group 423 are all arranged on the movable carrier 30, and the magnetic shielding member 70 can avoid the magnetic forces between the first magnet group 411, the second magnet group 421 and the third magnet group 423 from interfering with each other. Specifically, at least one magnetic isolation member 70 is disposed between the first magnet group 411 and the second magnet group 421, at least one magnetic isolation member 70 is disposed between the first magnet group 411 and the third magnet group 423, and the magnetic isolation member 70 is disposed on the side of the second magnet group 421 and the third magnet group 423 facing the first magnet group 411 to avoid magnetic interference. Furthermore, the magnetic isolation member 70 can also concentrate the magnetic force on the side away from the first magnet group 411, thereby avoiding the magnetic force from overflowing and enhancing the magnetic force on one side.

[0073] In an embodiment of the present application, in the process of realizing chip anti-shake, the first magnet group 411, the second magnet group 421 and the third magnet group 423 serve as the mover of the driving component, and the first coil group 412, the second coil group 422 and the third coil group 424 serve as the stator of the driving component; the first coil group 412, the second coil group 422 and the third coil group 424 respectively drive the first magnet group 411, the second magnet group 421 and the third magnet group 423 to move to drive the movable carrier 30 to move.

[0074] The second magnet group 421 includes at least one magnet unit, which is arranged in the second magnet mounting groove of the side wall of the movable carrier 30, and the third magnet group 423 includes at least one magnet unit, which is arranged in the third magnet mounting groove of the side wall of the movable carrier 30. As an example, in an embodiment of the present application, the second magnet group 421 includes a second magnet and a third magnet, and the third magnet group 423 includes a fourth magnet and a fifth magnet, and the second magnet and the third magnet are located on a long side of the side wall of the movable carrier 30, and the fourth magnet and the fifth magnet are located on another long side of the side of the carrier opposite to the long side. In other words, the second magnet and the third magnet are arranged on the same side, the fourth magnet and the fifth magnet are arranged on the same side, and the second magnet, the third magnet and the fourth magnet, and the fifth magnet are arranged on different sides.

[0075] In a specific example of the present application, the length direction of each magnet unit of the first magnet group 411, the second magnet group 421 and the third magnet group 423 is the same. This is because the length direction of the first magnet group 411 is the same as the driving direction of the first driving component 41, and the second magnet group 421 and the third magnet group 423 cannot be set in the direction of movement of the movable carrier 30, that is, they cannot be set on the short side of the movable carrier 30. Therefore, in this embodiment of the present application, the second magnet group 421 and the third magnet group 423 are both set on the long side of the movable carrier 30. In this way, it can be avoided that the interaction between the first magnet group 411 and the first coil group 412 drives the movable carrier to move along the first direction without affecting the drive between the second magnet group 421 and the second coil group 422, nor affecting the drive between the third magnet group 423 and the third coil group 424.

[0076] The second coil group 422 includes at least one coil, and the third coil group 424 includes at least one coil. As an example, the second coil group 422 includes a second coil and a third coil, and the third coil group includes a fourth coil and a fifth coil, and the second coil is arranged relative to the second magnet in a horizontal direction, the third coil is arranged relative to the third magnet in a horizontal direction, the fourth coil is arranged relative to the fourth magnet in a horizontal direction, and the fifth coil is arranged relative to the fifth magnet in a horizontal direction. In this way, the movable carrier 30 can be driven to move in the second direction through the magnetic force between the second coil and the second magnet, the magnetic force between the third coil and the third magnet, the magnetic force between the fourth coil and the fourth magnet, and the magnetic force between the fifth coil and the fifth magnet.

[0077] Further, the magnetic pole direction of the second magnet group 421 and the third magnet group 423 is perpendicular to the winding plane of the second coil group 422 and the third coil group 424. It should be understood that the magnetic pole direction of the magnet refers to the direction in which the N pole (North Pole) of the magnet points to the S pole (South Pole), and the winding plane of the second coil group 422 and the third coil group 424 is also the plane where the largest surface of the coil is located. In other words, the magnetic pole direction of the second magnet is perpendicular to the winding plane of the second coil, the magnetic pole direction of the third magnet is perpendicular to the winding plane of the third coil, the magnetic pole direction of the fourth magnet is perpendicular to the winding plane of the fourth coil, and the magnetic pole direction of the fifth magnet is perpendicular to the winding plane of the fifth coil. Therefore, during the operation of the optical image stabilization component 100, the second coil drives the third magnet to approach or move away from the second coil to enable the movable carrier 30 to move along the second direction, the third coil drives the third magnet to approach or move away from the third coil to enable the movable carrier 30 to move along the second direction, the fourth coil drives the fourth magnet to approach or move away from the fourth coil to enable the movable carrier 30 to move along the second direction, and the fifth coil drives the fifth magnet to approach or move away from the fifth coil to enable the movable carrier 30 to move along the second direction.

[0078] It should be noted that, in this embodiment of the present application, the directions of the forces exerted by the second magnet group 421 and the third magnet group 423 on the movable carrier 30 are opposite, that is, when the second coil group 422 is energized, the thrust generated on the second magnet group 421 is opposite to the thrust generated on the third magnet group 423 when the third coil group 424 is energized. Then, when the movable carrier 30 translates along the second direction, the second coil group 422 and the third coil group 424 on both sides are energized at the same time, and the second magnet group 421 and the third magnet group 423 on both sides of the movable carrier 30 jointly push the movable carrier 30 to move. For example, when the driving force between the second coil group 422 and the second magnet group 421 is greater than the driving force between the third coil group 424 and the third magnet group 423, the movable carrier 30 moves in a direction parallel to the second direction; when the driving force between the second coil group 422 and the second magnet group 421 is less than the driving force between the third coil group 424 and the third magnet group 423, the movable carrier 30 moves in the opposite direction parallel to the second direction.

[0079] It is worth mentioning that when the second coil and the fourth coil, and the third coil and the fifth coil all pass currents of the same direction and magnitude, the movable carrier 30 is driven to translate along the second direction. When the second coil and the fourth coil are energized and the third coil and the fifth coil are de-energized; or the second coil and the fourth coil are de-energized and the third coil and the fifth coil are energized; that is, the currents passing through are in opposite directions and have the same magnitude, or the currents passing through are in the same direction and have different magnitudes, the movable carrier 30 is driven to rotate around the main axis. That is, the chip anti-shake function in this application includes both translational anti-shake and rotational anti-shake.

[0080] The optical image stabilization assembly 100 further includes at least one sensing assembly 50 for sensing the position of the movable carrier 30 and the photosensitive assembly 300, wherein the sensing assembly 50 includes at least two sensing elements 51, and the at least two sensing elements 51 are used to sense the position changes of the first magnet group 411, the second magnet group 421 and / or the third magnet group 423 to obtain the position of the movable carrier 30 and the photosensitive assembly 300 fixed to the at least one image stabilization magnet. The sensing assembly 50 includes a first image stabilization sensing element 511 and a second image stabilization sensing element 512, wherein the first image stabilization sensing element 511 is used to sense the position moved along the first direction, and the second image stabilization sensing element 512 is used to sense the position moved along the second direction.

[0081] Correspondingly, the first anti-shake sensing element 511 is disposed adjacent to the first coil group 412 of the first driving mechanism 41, and is used to sense the position of the first magnet group 411 of the first driving mechanism 41; the second anti-shake sensing element 512 is disposed adjacent to the second coil group 422 and / or the third coil group 424 of the second driving structure 42, and is used to sense the position of the second magnet group 421 and / or the third magnet group.

[0082] In another specific example of the present application, the sensing element 51 further includes a third anti-shake sensing element 513, wherein the third anti-shake sensing element 513 and the second anti-shake sensing element 512 are respectively used to sense the magnetic field changes of the second magnet and the third magnet, so as to be suitable for obtaining the tilt state change of the movable carrier 30 relative to the side of the base 10, so that the sensing component 50 can also detect the rotation state of the movable carrier 30 and the photosensitive component 300. Of course, the second anti-shake sensing element 512 and the third anti-shake sensing element 513 can be arranged opposite to the third magnet group 423.

[0083] The optical image stabilization assembly 100 further includes at least one supporting mechanism 60, wherein the supporting mechanism 60 is disposed between the bracket 20 and the movable carrier 30, and maintains a gap between the movable carrier 30 and the bracket 20, so that the resistance encountered by the movable carrier 30 when moving relative to the bracket 20 and the base 10 is reduced.

[0084] At least one anti-shake magnetic suction component 90 is also provided on the bottom surface of the bracket 20. The anti-shake magnetic suction component 90 is provided on the side of the first coil group 412 away from the first magnet group 411, that is, the first coil group 412 is provided between the anti-shake magnetic suction component 90 and the first magnet group 411. The anti-shake magnetic suction component 90 and the first magnet group 411 attract each other, generating a magnetic suction force along the height direction, so that the support mechanism 60 is clamped between the bracket 20 and the movable carrier 30. The anti-shake magnetic suction component 90 can be attached to the bottom surface of the bracket 20, or it can be integrally formed and embedded in the bracket 20. The magnetic suction component is a material that can attract each other with a magnet, such as an iron sheet.

[0085] like Figure 7 As shown, in another optional embodiment of the present application, the anti-shake magnetic component 90 further includes a first anti-shake magnetic unit 91, a second anti-shake magnetic unit 92 and a third anti-shake magnetic unit 93, wherein the first anti-shake magnetic unit 91, the second anti-shake magnetic unit 92 and the third anti-shake magnetic unit 93 are arranged on the bracket 20, and the first anti-shake magnetic unit 91 is opposite to the first coil group 412, the second anti-shake magnetic unit 92 is opposite to the second magnet group 421, and the third anti-shake magnetic unit 93 is opposite to the third magnet group 423.

[0086] Preferably, in this preferred embodiment of the present application, the first anti-shake magnetic unit 91, the second anti-shake magnetic unit 92 and the third anti-shake magnetic unit 93 are located in the same plane, and at least one of the anti-shake magnetic units of the anti-shake magnetic component 90 along the main axis direction (that is, the first anti-shake magnetic unit 91, the second anti-shake magnetic unit 92 and the third anti-shake magnetic unit 93) overlaps with at least a portion of the first magnet group 411, the second magnet group 421 or the third magnet group 423.

[0087] In a specific example, the support mechanism 60 can be implemented as a ball bearing, and the support mechanism 60 includes at least three balls. Specifically, at least three balls are arranged between the bracket 20 and the movable carrier 30 body of the movable carrier 30 in the height direction, so that the bracket 20 and the movable carrier 30 maintain a fixed gap in the height direction. It is worth mentioning that at least three balls can roll between the bracket 20 and the movable carrier 30, or at least three balls can be fixed to one of the bracket 20 or the movable carrier 30 so as to slide relative to the other of the bracket 20 and the movable carrier 30.

[0088] The bracket 20 and the movable carrier 30 are provided with ball grooves for accommodating the support mechanism 60, wherein the balls of the support mechanism 60 are held in the ball grooves in a rolling manner. Accordingly, the bracket 20 is provided with at least three lower ball grooves 201, and the movable carrier 30 is provided with at least three upper ball grooves 301, and the lower ball grooves 201 of the bracket 20 are positively opposite to the upper ball grooves 301 of the movable carrier 30, and the at least three balls of the support mechanism 60 are arranged between the upper ball grooves and the lower ball grooves.

[0089] Optionally, in another optional embodiment of the present application, a ball groove for accommodating the support mechanism 60 is provided at a corresponding position of the bracket 20 or the movable carrier 30, wherein the ball of the support mechanism 60 is rollably disposed in the ball groove. As an example, in a specific example of the present application, the ball groove is formed in the bracket 20, and the corresponding movable carrier 30 is a planar structure; or the ball groove is formed in the movable carrier 30, and the corresponding bracket 20 is a planar structure, that is, the ball groove is a semi-groove structure.

[0090] It is worth mentioning that in this embodiment of the present application, the aperture size of the lower ball groove 201 of the bracket 20 is different from that of the upper ball groove 301 of the movable carrier 30, so as to allow the bracket 20 and the movable carrier 30 to be relatively offset or move in the horizontal direction. As an example, in a specific example of the present application, the aperture of the lower ball groove 201 of the bracket 20 is larger than that of the upper ball groove 301 of the movable carrier 30. Of course, in other embodiments of the present application, the aperture of the lower ball groove 201 of the bracket 20 is smaller than that of the upper ball groove 301 of the movable carrier 30.

[0091] In order to limit the range of movement of the ball, the bracket 20 also includes at least three bracket 20 ball grooves formed on the bottom surface of the bracket 20, and the movable carrier 30 body also includes at least three carrier ball grooves formed on the top surface of the movable carrier 30 body, and the positions of the bracket 20 ball grooves and the carrier ball grooves correspond to each other to form a accommodating cavity suitable for accommodating and limiting the range of movement of the ball.

[0092] It should be understood that three balls can form a support plane, and a larger number of balls will form multiple support planes. For example, when the number of balls is implemented as four, the four balls will form four support planes (any three of which form a support plane). The multiple support planes will make it possible for the movable carrier 30 to be adsorbed toward the bracket 20 through the anti-shake magnetic suction part. The movable carrier 30 will be supported by any three of the multiple ball bearings. Therefore, due to the existence of multiple support planes, when the magnetic attraction force between the anti-shake magnetic suction part and at least one anti-shake magnet is uneven, the movable carrier 30 will be at risk of tilting relative to the bracket 20. Accordingly, in a preferred example, three bracket 20 ball grooves are formed in a triangular shape on the bottom surface of the bracket 20, and three carrier ball grooves are formed in a triangular shape on the top surface of the movable carrier 30 body corresponding to the three bracket 20 ball grooves, and the distance between any one of the three bracket 20 ball grooves and the other two bracket 20 ball grooves is equal, and the distance between any one of the three carrier ball grooves and the other two carrier ball grooves is equal.

[0093] The optical image stabilization assembly 100 further includes a circuit board 80, which is used to connect the image stabilization drive assembly 40. In a specific example of the present application, the circuit board 80 is a bent U-shaped structure. The circuit board 80 includes a first bending portion 81, a second bending portion 82 and a third bending portion 83 connected in an integral manner. The first bending portion 81 extends in the height direction, the second bending portion 82 extends in the horizontal direction after being bent from the first bending portion 81, and the third bending portion 83 extends in the height direction after being bent from the second bending portion 82. In other words, the second bending portion 82 is arranged between the first bending portion 81 and the third bending portion 83. The first bending portion 81 and the third bending portion 83 are fixed to the two long side walls of the base 10, and the second bending portion 82 is fixed to the bottom surface of the bracket 20. The first coil group 412, the second coil group 422 and the third coil group 424 are arranged on the circuit board 80 and are electrically connected to the circuit board 80. It should be noted that, in this preferred embodiment of the present application, since the driving mechanism is a combination of a magnet and a coil, and the circuit board 80 has fewer bends, the anti-shake effect may be prevented from being affected by the reaction force of the circuit board.

[0094] like 8A to 9CAs shown, another optional real-time method of a circuit board 80A according to the above preferred embodiment of the present application is explained in the following description. The circuit board 80A includes two circuit board units 84A, wherein one end of the circuit board unit 84A of the circuit board 80A is connected to the circuit board connected to the photosensitive chip, and the other end thereof is connected to the anti-shake drive component 40. Preferably, in this preferred embodiment of the present application, the two circuit board units 84A of the circuit board 80A are symmetrically arranged on both sides of the photosensitive component 300, that is, one end of the circuit board unit 84A of the circuit board 80A is connected to a circuit board, and the other end of the circuit board unit 84A is connected to the circuit board of the photosensitive component 300.

[0095] In this embodiment of the present application, the circuit board unit 84A of the circuit board 80A is a flexible circuit board, and the two circuit board units 84A of the circuit board 80A can reduce the problem of the circuit board's reaction force when the chip is moving.

[0096] Correspondingly, the circuit board unit 84A further includes a first bending section 841A, a second bending section 842A and a third bending section 843A, wherein the first bending section 841A, the second bending section 842A and the third bending section 843A are an integrated structure, wherein the second bending section 842A is located between the first bending section 841A and the third bending section 843A. The first bending section 841A is fixedly connected to the connection circuit board of the camera module, and the third bending section 843A is movably connected to the circuit board of the photosensitive chip. The connection circuit board is connected to external electronic equipment.

[0097] like FIG. 9B to FIG. 9C As shown, the left side of the diagram is established with the long side of the photosensitive chip as the X-axis (first direction), the short side of the photosensitive chip as the Y-axis (second direction), and the plane perpendicular to the photosensitive chip as the Z-axis (central axis direction), wherein the first bending section 841A of the circuit board unit 84A is located on the long side of the photosensitive chip and is parallel to the photosensitive surface of the photosensitive chip, that is, the first bending section 841A is perpendicular to the Z-axis. Therefore, the first bending section 841A of the circuit board unit 84A can reduce the Rz torsional reaction force. The first bending section 841A of the circuit board unit 84A extends along the length direction in the plane where the circuit board is located, which can reduce the torsional reaction force in the Z-axis direction.

[0098] The second bending section 842A is located at the short side of the photosensitive chip, and is bent and extended from the first bending section 841A, and the extension direction of the second bending section 842A is perpendicular to the X-axis direction to reduce the reaction force in the X-axis direction. The second bending section 842A is bent from the first bending section 841A in a direction perpendicular to the plane, and extends along the width direction on the side of the driving component to reduce the reaction force during translation in the X-axis direction.

[0099] The third bending section 843A is located at the long side of the photosensitive chip, and the third bending section 843A extends vertically from the second bending section 842A, and the third bending section 843A is perpendicular to the Y direction to reduce the reaction force in the Y direction. The third bending section 843A extends from the second bending section 842A and along the width direction to reduce the reaction force during translation in the Y-axis direction.

[0100] It should be understood that if the circuit board is directly connected to the photosensitive chip, that is, the plane of the circuit board is parallel to the plane of the photosensitive chip, when the photosensitive chip moves, the circuit board will move within the plane. At this time, the circuit board will produce a large resistance to the movement of the photosensitive chip, and this resistance is the reaction force. In the present application, by bending the circuit board three times in a direction perpendicular to the plane, the planes where the three bending sections are located are perpendicular to each other, so that the reaction force of the circuit board can be smaller when the photosensitive chip moves in the first direction, the second direction, and rotates around the central axis, thereby avoiding affecting the optical image stabilization effect. One end of the circuit board 80 is electrically connected to the chip circuit board and the connecting circuit board to realize centralized conduction of the circuit of the optical image stabilization component 100. The connecting circuit board conducts the circuit to the external electronic components.

[0101] It should be understood that the lens driving assembly and the optical image stabilization assembly 100 in the present application can be used not only in a telephoto camera module with a light deflection element, but also in a vertical module.

[0102] Referring to the drawings of this application specification Fig.10 As shown, a telephoto camera module according to another aspect of the present application is explained in the following description. The telephoto camera module includes an optical lens 200, a photosensitive component 300, and at least one light deflection element 400 located at the light incident front end of the optical lens 200, wherein the light entering the light deflection element 400 enters the optical lens 200 after being deflected at least once, and then reaches the photosensitive component 300, so as to be imaged by the photosensitive component 300 to obtain image information.

[0103] Referring to the drawings of this application specification Figures 11 to 13As shown, a telephoto camera module according to another aspect of the present application is explained in the following description. The telephoto camera module includes an optical lens 200, a photosensitive component 300, and at least one light deflection element 400 located between the photosensitive component 300 and the optical lens 200, wherein the light deflection element 400 is disposed between the optical lens 200 and the photosensitive component 300, so that the light incident on the optical lens 200 is reflected at least once in the light deflection element 400 before reaching the photosensitive component 300, and the light deflection element 400 folds the light emitted from the optical lens 200 and guides it to the photosensitive component 300, so as to image through the photosensitive component 300 to obtain image information.

[0104] It is worth mentioning that the telephoto camera module further includes an optical image stabilization component 100 as described above, wherein the optical image stabilization component 100 is connected to the photosensitive component 300, and is used to drive the photosensitive component 300 to move in the horizontal direction to achieve the optical image stabilization function of the telephoto camera module. It will be understood that the specific structure and function of the optical image stabilization component 100 are not described here. In this preferred embodiment of the present application, the telephoto camera module may be but is not limited to a telephoto camera module. In a specific example of the present application, the optical image stabilization component 100 can be used to drive the optical lens of the periscope camera module or to drive the photosensitive component to achieve optical image stabilization of the telephoto camera module.

[0105] In this preferred embodiment of the present application, the optical image stabilization component 100 can be connected to the optical lens 200 of the periscope camera module, and it acts on at least one lens unit of the optical lens 200 to drive the optical lens 200 to move in a plane perpendicular to the main axis direction to achieve the optical image stabilization function. It is worth mentioning that the light deflection element 400 is in the shape of a long strip, so that the light can be reflected multiple times in the light deflection element 400, thereby folding the light path multiple times. In the present application, the position of one or more components in the optical lens 200, the light deflection element 400 or the photosensitive component 300 in the camera module can be adjusted to achieve the optical focus and / or optical image stabilization function of the camera module.

[0106] like Figures 10 to 13As shown, the light deflection element 400 includes a plurality of reflective surfaces 410. The light emitted from the optical lens 200 is reflected multiple times on the plurality of reflective surfaces of the light deflection element 400. The light is emitted from the light deflection element 400 and reaches the photosensitive component 300. The photosensitive component 300 and the optical lens 200 are arranged on the same side of the light deflection element 400. Therefore, the height dimension of the camera module only needs to consider the sum of the height dimension of one of the photosensitive component 300 and the optical lens 200 and the height dimension of the light deflection element 400, without having to simultaneously superimpose the heights of the optical lens 200, the light deflection element 400 and the photosensitive component 300. In this way, the height dimension of the camera module can be reduced.

[0107] It should be understood by those skilled in the art that the embodiments of the present invention described above and shown in the accompanying drawings are only examples and do not limit the present invention. The purpose of the present invention has been fully and effectively achieved. The functional and structural principles of the present invention have been demonstrated and explained in the embodiments, and the embodiments of the present invention may be deformed or modified in any way without departing from the principles.

[0108] The technical scope of the present invention is not limited to the contents in the above description. Those skilled in the art can make various deformations and modifications to the above embodiments without departing from the technical idea of ​​the present invention, and these deformations and modifications all belong to the protection scope of the present invention.

Claims

1. An optical image stabilization component, characterized in that: include: A movable carrier, used to be connected to an optical element having a main axis, wherein the movable carrier has an accommodating cavity inside; a support, the movable carrier being movable relative to the support; A driving assembly, the driving assembly comprising a first driving mechanism and a second driving mechanism, the first driving mechanism drives the movable carrier to move along a first direction, and the second driving mechanism drives the movable carrier to move along a second direction, the first direction and the second direction are perpendicular to the main axis direction, and the first direction and the second direction intersect; The first driving mechanism includes: a first magnet group arranged on the movable carrier, and a first coil group arranged opposite to the first magnet group; the second driving mechanism includes: a second magnet group and a third magnet group arranged on the movable carrier, and a second coil group arranged opposite to the second magnet group, and a third coil group arranged opposite to the third magnet group; the first magnet group is arranged in the accommodating cavity of the movable carrier, and the second magnet group and the third magnet group are arranged on the side wall of the movable carrier.

2. The optical image stabilization assembly according to claim 1, wherein: The first coil group is arranged on the bracket, and the first magnet group and the first coil group are arranged opposite to each other along the main axis direction.

3. The optical image stabilization assembly according to claim 2, wherein: The driving device further includes a base, the second coil group is arranged on the base, and the second magnet group and the second coil group are arranged opposite to each other along a second direction.

4. The optical image stabilization assembly according to claim 3, wherein: During the process in which the first magnet group and the first coil group interact to drive the movable carrier to move along the first direction, the relative distance between the first coil group and the first magnet group remains unchanged; during the process in which the second magnet group and the second coil group interact to drive the movable carrier to move along the second direction, the relative distance between the second coil group and the second magnet group can change.

5. The optical image stabilization assembly according to claim 4, wherein: The first magnet group is implemented as a Halbach array magnet, the first magnet group includes a plurality of first magnets arranged along a first direction, the first coil group includes at least two first coils arranged along the first direction, and the Halbach array magnet and the first coil group are arranged opposite to each other along the main axis direction.

6. The optical image stabilization assembly according to claim 5, wherein: The first magnet group is composed of five or more magnets including magnets arranged above and below the N pole and S pole, magnets arranged left and right between the N pole and S pole, magnets arranged above and below the S pole and N pole, magnets arranged left and right between the S pole and N pole, and magnets arranged above and below the N pole and S pole. The five or more magnets are combined in sequence in the horizontal direction to form a Halbach array magnet.

7. The optical image stabilization assembly according to claim 5, wherein: The second magnet group and the third magnet group are arranged oppositely on the side wall of the movable carrier, and the second magnet group, the first magnet group and the third magnet group are arranged in sequence along the second direction.

8. The optical image stabilization assembly according to claim 7, wherein: The first magnet group, the second magnet group and the third magnet group have the same length direction.

9. The optical image stabilization assembly according to claim 8, wherein: The driving device includes at least one magnetic isolation component, which is arranged on the side of the second magnet group facing the first magnet group and on the side of the third magnet group facing the first magnet group to avoid magnetic interference between the first magnet group and the second magnet group and the third magnet group.

10. The optical image stabilization assembly according to claim 9, wherein the second magnet group is arranged on one long side of the side wall of the movable carrier, the third magnet group is arranged on the other long side of the side wall of the movable carrier opposite thereto, and the second magnet group and the third magnet group are arranged on opposite sides of the movable carrier. 11 . The optical image stabilization assembly according to claim 10 , wherein the magnetic pole directions of the second magnet group and the third magnet group are perpendicular to the winding planes of the second coil group and the third coil group.

12. The optical image stabilization assembly according to claim 10, further comprising at least one supporting mechanism, wherein the supporting mechanism is disposed between the bracket and the movable carrier and maintains a gap between the movable carrier and the bracket.

13. The optical image stabilization assembly according to claim 11, wherein the supporting mechanism comprises at least three balls, and at least one of the bracket and the movable carrier is provided with a ball groove for accommodating the supporting mechanism, and the number of the ball grooves is at least three.

14. The optical image stabilization component according to claim 11 further comprises a circuit board for connecting the image stabilization drive component, wherein the circuit board comprises a first bending portion, a second bending portion and a third bending portion that are integrally connected, the first bending portion extends in a height direction, the second bending portion extends in a horizontal direction after being bent from the first bending portion, the third bending portion extends in a height direction after being bent from the second bending portion, and one end of the circuit board is electrically connected to the chip circuit board of the photosensitive component.

15. The optical image stabilization component according to claim 11, wherein the circuit board comprises two circuit board units, wherein the circuit board unit further comprises a first bending section, a second bending section and a third bending section, wherein the first bending section of the circuit board unit is located on the long side of the photosensitive chip and is parallel to the photosensitive surface of the photosensitive chip, that is, the first bending section is perpendicular to the Z axis, the second bending section is located on the short side of the photosensitive chip, is bent and extended from the first bending section, and the extension direction of the second bending section is perpendicular to the X axis direction, the third bending section is located on the long side of the photosensitive chip, the third bending section extends perpendicularly from the second bending section, and the third bending section is perpendicular to the Y direction.

16. A telephoto camera module, characterized in that: include: Optical lens; A photosensitive component, wherein the optical lens is at the front end of the light incident direction of the photosensitive component; A light deflection component, wherein the light deflection component is configured to reflect the light at least once so that the light can reach the photosensitive component; and An optical image stabilization component as described in any one of claims 1 to 14, wherein the optical image stabilization component is connected to the photosensitive component.

Citation Information

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