Vapor chamber and electronic equipment

Abstract

The invention provides a vapor chamber and electronic equipment. The vapor chamber comprises a first plate body, a second plate body and braided wires. The second plate body and the first plate body are enclosed to form an accommodating cavity; the containing cavity is filled with working liquid. The containing cavity is provided with an evaporation area and a condensation area. The braided wire has a capillary structure and is arranged in the accommodating cavity; one end of the braided wire is arranged in the evaporation area, and the other end of the braided wire is arranged in the condensation area. The working liquid which is cooled again after evaporation is rapidly drained to the evaporation area through the capillary structures of the braided wires, so that water accumulation in the vapor chamber is avoided, and the backflow efficiency and the temperature equalizing performance of the vapor chamber are improved.

Description

Technical Field

[0001] The present application relates to the field of heat dissipation technology, and in particular to a temperature homogenizing plate and electronic equipment. Background Art

[0002] The vapor chamber is a heat transfer element that uses the principle of two-phase heat exchange. It is often used for heat transfer between large surfaces. Due to its large contact area, it can achieve rapid heat transfer.

[0003] At present, the capillary structure of the temperature spreader is a mesh structure made of copper mesh or copper powder sintered. After absorbing the heat from the heat source, the liquid in the vacuum cavity of the temperature spreader evaporates and diffuses in the vacuum cavity, conducts the heat to the outside of the cavity, and then condenses into liquid and flows back to the vicinity of the heat source through the capillary structure. This evaporation and condensation process, similar to that of a refrigerator or air conditioner, circulates rapidly in the vacuum cavity, achieving a very high heat dissipation efficiency. However, water may accumulate in the path where the condensed liquid flows back through the capillary structure, resulting in low reflux efficiency and affecting heat dissipation performance. Summary of the invention

[0004] In order to solve the problems in the prior art, the present application provides a temperature homogenizing plate and an electronic device to improve the temperature homogenizing performance of the temperature homogenizing plate.

[0005] The present application provides a temperature averaging plate, the temperature averaging plate comprising:

[0006] A first plate body;

[0007] A second plate body, wherein the second plate body and the first plate body are enclosed to form a containing cavity; the containing cavity is filled with working liquid; the containing cavity has an evaporation area and a condensation area;

[0008] The braided wire has a capillary structure and is arranged in the accommodating cavity; one end of the braided wire is arranged in the evaporation area, and the other end of the braided wire is arranged in the condensation area.

[0009] In one embodiment, the braided wire comprises a plurality of metal wires twisted together.

[0010] In one embodiment, the metal wire is a copper wire.

[0011] In one embodiment, the accommodating chamber is a vacuum chamber.

[0012] In one embodiment, a plurality of first protrusions are disposed on the first plate toward the accommodating cavity.

[0013] In one embodiment, the temperature homogenizing plate further includes a capillary structure layer, and the capillary structure layer is laid on the first plate body or the second plate body.

[0014] In one embodiment, the capillary structure layer is provided with a plurality of circular holes, and the plurality of circular holes are arranged in a one-to-one correspondence with the plurality of first protrusions.

[0015] In one embodiment, the first plate is provided with a second protrusion in a direction away from the vacuum chamber, and the second protrusion is used to be arranged corresponding to the heating element.

[0016] The present application also proposes an electronic device, comprising a first chip and the above-mentioned temperature vapor chamber, wherein the first chip is arranged close to a first surface of the temperature vapor chamber.

[0017] In one embodiment, the electronic device further includes a condensing device, and the condensing device is arranged close to the second surface of the temperature vapor chamber; the first surface and the second surface are arranged opposite to each other.

[0018] The present application uses the capillary structure of the braided wire to quickly drain the working liquid that is re-cooled after evaporation to the evaporation area, thereby avoiding water accumulation in the temperature equalizer, improving the reflux efficiency and the temperature equalization performance of the temperature equalizer. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a schematic structural diagram of an embodiment of a temperature equalizing plate of the present application.

[0020] Figure 2 This is a schematic structural diagram of another embodiment of the temperature equalizing plate of the present application.

[0021] Figure 3 This is a schematic structural diagram of another embodiment of the temperature equalizing plate of the present application.

[0022] Figure 4 This is a schematic structural diagram of another embodiment of the temperature equalizing plate of the present application.

[0023] Figure 5 This is a schematic structural diagram of another embodiment of the temperature equalizing plate of the present application.

[0024] Figure 6 This is a cross-sectional view of an embodiment of a temperature vapor chamber of the present application.

[0025] Figure 7 This is a module structure diagram of an embodiment of the electronic device of the present application.

[0026] Main component symbols

[0027] Temperature balancing plate 100 First plate body 110

[0028] Second plate 120 Braided wire 130

[0029] Accommodating cavity 140 First protrusion 111

[0030] Capillary structure layer 150 Circular hole 151

[0031] Second protrusion 112 First chip 200

[0032] Condensation device 300 Evaporation zone 141

[0033] Condensation area 142 Electronic device 10

[0034] The following specific implementation methods will further illustrate the present application in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0035] The following description will refer to the accompanying drawings to more fully describe the content of the present application. Shown in the accompanying drawings are exemplary embodiments of the present application. However, the present application can be implemented in many different forms and should not be construed as being limited to the exemplary embodiments set forth herein. These exemplary embodiments are provided to make the present application thorough and complete, and to fully convey the scope of the present application to those skilled in the art. Similar reference numerals represent identical or similar components.

[0036] The terms used herein are only used for the purpose of describing specific exemplary embodiments and are not intended to limit the present application. As used herein, unless the context clearly indicates otherwise, the singular forms "a", "an" and "the" are intended to also include the plural forms. In addition, when used herein, "including" and / or "comprising" and / or "having", integers, steps, operations, components and / or components, but do not exclude the existence or addition of one or more other features, regions, integers, steps, operations, components and / or groups thereof.

[0037] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those of ordinary skill in the art to which this application belongs. In addition, unless explicitly defined herein, terms such as those defined in general dictionaries should be interpreted as having a meaning consistent with their meaning in the relevant technology and the content of this application, and will not be interpreted as an idealized or overly formal meaning.

[0038] The following will describe exemplary embodiments in conjunction with the accompanying drawings. It should be noted that the components depicted in the reference drawings are not necessarily shown to scale; and the same or similar components will be given the same or similar reference numerals or similar technical terms.

[0039] Reference Figure 1The present application proposes a temperature averaging plate 100, which includes a first plate body 110, a second plate body 120 and a braided wire 130. The second plate body 120 and the first plate body 110 enclose a receiving cavity 140; the receiving cavity 140 is filled with a working liquid; the receiving cavity 140 has an evaporation area 141 and a condensation area 142. The braided wire 130 has a capillary structure and is disposed in the receiving cavity 140; one end of the braided wire 130 is disposed in the evaporation area 141, and the other end of the braided wire 130 is disposed in the condensation area 142.

[0040] In this embodiment, the braided wire 130 can be implemented by using a plurality of strands of wound metal wires, for example, copper, copper alloy, aluminum, aluminum alloy, titanium, titanium alloy, magnesium alloy, stainless steel material, etc. The plurality of strands of metal wires are intertwined to form a plurality of capillary structures, which increase the capillary force, and can quickly drain the working liquid in the condensation zone 142 or between the condensation zone 142 and the evaporation zone 141 back to the evaporation zone 141, which can avoid the phenomenon of water accumulation of the working liquid to the greatest extent, thereby improving the thermal response capability and temperature uniformity of the temperature equalizing plate 100. In addition, the structure formed by the winding of a plurality of strands of metal wires is relatively stable, not easy to disperse or collapse, and can effectively support the capillary structure to ensure the stability of the temperature equalizing plate 100. Among them, the working liquid can be implemented by using one or more of water, methanol, and ethanol.

[0041] In one embodiment, the accommodating chamber 140 is a vacuum chamber.

[0042] It is understandable that the working liquid has a low boiling point under vacuum. When heat is conducted from the heat source to the evaporation zone 141, the working liquid in the vacuum cavity begins to vaporize after being heated in the vacuum environment. The working liquid absorbs heat energy and its volume rapidly vaporizes and expands, and the gaseous working medium quickly fills the entire vacuum cavity. When the gaseous working medium contacts a relatively cold area in the cooling zone, condensation will occur, and the heat accumulated during evaporation will be released through the condensation phenomenon. The condensed coolant returns to the evaporation zone 141 through the capillary structure of the braided wire 130. In this way, the working liquid circulates repeatedly in the vacuum cavity to achieve the uniform temperature performance of the temperature equalizing plate 100.

[0043] Reference Figures 1 to 4 In one embodiment, the braided wire 130 may be disposed in parallel with the first plate 110 in the vacuum chamber, for example, parallel to the first side of the first plate 110, along the diagonal line of the first plate 110, etc. There may be a plurality of braided wires 130.

[0044] In this embodiment, the first plate 110 is arranged close to the heating element. The temperature plate 100 is arranged perpendicular to the direction of gravity, and the first plate 110 is at the bottom. The gaseous working medium formed by the vaporization and evaporation of the working liquid quickly fills the entire vacuum cavity, and re-condenses into the working liquid when it approaches the second plate 120. Since the gaseous working medium fills the entire vacuum cavity, it may re-condense to form the working liquid at any position in the vacuum cavity or at any position of the second plate 120, and fall on the first plate 110. At this time, the braided wire 130 can guide the working liquid that is far away from the evaporation area 141 (for example, corners, edge areas) to the evaporation area 141. The heating element may be an electronic component that is easy to generate heat.

[0045] Alternatively, the first plate 110 is disposed near the heating element. The temperature equalizing plate 100 is disposed perpendicular to the direction of gravity, with the first plate 110 on top. The gaseous working medium formed by the vaporization and evaporation of the working liquid quickly fills the entire vacuum cavity, and re-condenses into the working liquid when it approaches the second plate 120. Since the gaseous working medium fills the entire vacuum cavity, it may re-condense to form the working liquid at any position in the vacuum cavity or at any position of the second plate 120, and fall on the second plate 120. At this time, the braided wire 130 can guide the working liquid on the second plate 120 below to the evaporation zone 141 near the top.

[0046] Alternatively, the first plate 110 is arranged close to the heating element. The temperature plate 100 is arranged parallel to the direction of gravity. The gaseous working medium formed by the vaporization and evaporation of the working liquid quickly fills the entire vacuum cavity, and recondenses into working liquid when it approaches the second plate 120. The working liquid falls to the lower area under the guidance of gravity. At this time, the working liquid below can flow back to the evaporation area 141 above along the braided wire 130.

[0047] Reference Figure 5 and Figure 6 In one embodiment, the first plate 110 is provided with a plurality of first protrusions 111 in a direction toward the accommodating cavity 140 .

[0048] In this embodiment, the re-condensed working liquid can flow along the first protrusion 111 to the braided wire 130 or the first plate 110, and then return to the evaporation area 141 under the guidance of the braided wire 130. Furthermore, the first protrusion 111 can be arranged to contact the second plate 120. In this way, the first plate 110 and the second plate 120 can play a supporting role, ensuring that the working liquid and the vaporized working medium have sufficient transmission channels.

[0049] In one embodiment, the temperature equalizing plate 100 further includes a capillary structure layer 150, and the capillary structure layer 150 is laid on the first plate body 110 or the second plate body 120. The re-condensed working liquid can also flow back to the evaporation area 141 along the capillary structure layer 150, further improving the temperature equalization performance of the temperature equalizing plate 100. The capillary structure layer 150 can be implemented by metal materials, such as copper mesh, copper powder, etc.

[0050] In one embodiment, the capillary structure layer 150 is provided with a plurality of circular holes 151, and the plurality of circular holes 151 are arranged one by one with the plurality of first protrusions 111, so that the first protrusions 111 are sleeved. The re-condensed working liquid can also be guided back to the evaporation area 141 under the cooperation of the capillary structure layer 150, the first protrusions 111 and the braided wire 130.

[0051] In one embodiment, the first plate 110 may further be provided with a second protrusion 112 in a direction away from the vacuum chamber, and the second protrusion 112 is used to correspond to the heating element. The second protrusion 112 is arranged close to the heating element, and the heat emitted by the heating element can be quickly transferred to the vacuum chamber, thereby improving the temperature balancing efficiency of the temperature balancing plate 100.

[0052] Reference Figure 7 The present application also proposes an electronic device 10 , comprising a first chip 200 and the above-mentioned temperature vapor chamber 100 , wherein the first chip 200 is arranged close to the first surface of the temperature vapor chamber 100 .

[0053] The detailed structure of the temperature equalizing plate 100 can be referred to the above-mentioned embodiment, which will not be described in detail here; it can be understood that since the above-mentioned temperature equalizing plate 100 is used in the electronic device 10 of the present invention, the embodiment of the electronic device 10 of the present invention includes all technical solutions of all embodiments of the above-mentioned temperature equalizing plate 100, and the technical effects achieved are also exactly the same, which will not be described in detail here.

[0054] In one embodiment, the electronic device 10 further includes a condensing device 300 , and the condensing device 300 is disposed close to the second surface of the temperature vapor chamber 100 ; the second surface is disposed opposite to the second surface.

[0055] In this embodiment, the condensing device 300 can be implemented by a fan. The first surface of the temperature evaporating plate 100 is arranged close to the first chip 200 which is easy to generate heat, and the second surface is arranged close to the condensing device 300, so as to increase the temperature difference between the first surface and the second surface, thereby allowing the working liquid to evaporate and cool quickly, thereby improving the temperature averaging performance of the temperature evaporating plate 100.

[0056] In the above, the specific implementation of the present application is described with reference to the accompanying drawings. However, those skilled in the art will appreciate that various changes and substitutions may be made to the specific implementation of the present application without departing from the spirit and scope of the present application. These changes and substitutions are all within the scope defined by the present application.

Claims

1. A temperature equalizing plate, characterized in that: The temperature homogenizing plate comprises: A first plate body; A second plate body, wherein the second plate body and the first plate body are enclosed to form a containing cavity; the containing cavity is filled with working liquid; the containing cavity has an evaporation area and a condensation area; The braided wire has a capillary structure and is arranged in the accommodating cavity; one end of the braided wire is arranged in the evaporation area, and the other end of the braided wire is arranged in the condensation area.

2. The temperature equalizing plate according to claim 1, characterized in that: The braided wire includes a plurality of metal wires twisted together.

3. The temperature equalizing plate according to claim 2, characterized in that: The metal wire is a copper wire.

4. The temperature equalizing plate according to claim 1, characterized in that: The accommodating cavity is a vacuum cavity.

5. The temperature equalizing plate according to claim 1, characterized in that: The first plate is provided with a plurality of first protrusions in a direction toward the accommodating cavity.

6. The temperature equalizing plate according to claim 5, characterized in that: The temperature homogenizing plate further includes a capillary structure layer, and the capillary structure layer is laid on the first plate body or the second plate body.

7. The temperature equalizing plate according to claim 6, characterized in that: The capillary structure layer is provided with a plurality of circular holes, and the plurality of circular holes are arranged in one-to-one correspondence with the plurality of first protrusions.

8. The temperature equalizing plate according to claim 1, characterized in that: The first plate body is provided with a second protrusion in a direction away from the accommodating cavity, and the second protrusion is used to be arranged corresponding to the heating element.

9. An electronic device, characterized in that: The device comprises a first chip and a temperature vapor chamber as claimed in any one of claims 1 to 8, wherein the first chip is arranged close to a first surface of the temperature vapor chamber.

10. The electronic device according to claim 9, characterized in that: The electronic device further includes a condensing device, which is arranged close to the second surface of the temperature vapor chamber; the first surface is arranged opposite to the second surface.

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