Optical module

Abstract

The optical module provided by the invention comprises an upper shell, a circuit board, a base, a light receiving part and a light emitting part. According to the invention, the light receiving part and the light emitting part are respectively arranged on different surfaces of the same base; a base mounting part is formed on the surface of the circuit board, and the base is fixed on the surface of the circuit board through the base mounting part. Meanwhile, in order to improve the heat dissipation effect of the base, a protruding part is formed on the upper surface of the base, protrudes towards the upper shell and is in heat conduction connection with the upper shell, and therefore heat is conducted out through the base. In order to dissipate heat generated by the light emitting component more effectively, the light emitting component is arranged on the lower surface of the base. The projection part is formed on the upper surface of the base, the projection part is used as a heat dissipation projection, the heat dissipation effect of the base can be improved, meanwhile, the light emitting component is arranged on the lower surface of the base, and the light receiving component is arranged on the upper surface of the base, so that light receiving and light emitting of multiple paths of signals are realized.

Description

[0001] This application claims the priority of application number 2023117760595 filed with the China Patent Office on December 21, 2023, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present disclosure relates to the field of optical communication technology, and in particular to an optical module. Background Art

[0003] With the development of new services and application models such as cloud computing, mobile Internet, and video, the advancement of optical communication technology has become increasingly important. In optical communication technology, optical modules, as one of the key components in optical communication equipment, can realize the conversion of optical and electrical signals. In the development of optical communication technology, the data transmission rate of optical modules is required to be continuously improved. Summary of the invention

[0004] The embodiment of the present disclosure provides an optical module, which realizes multi-path light transmission and light reception by arranging a light emitting component and a light receiving component on the same base.

[0005] In some embodiments, an optical module is provided, comprising:

[0006] Upper shell;

[0007] A circuit board having a base mounting portion formed on the surface;

[0008] A base, fixed to the surface of the circuit board through the base mounting portion, a raised portion formed on the upper surface of the base, the raised portion protruding toward the upper housing, and the raised portion being thermally connected to the upper housing;

[0009] A light receiving component is located on the upper surface of the base and on the side of the raised portion, and is used to receive multiple optical signals;

[0010] The light emitting component is located on the lower surface of the base, and is used for emitting multi-path optical signals.

[0011] The above technical solution has the following advantages or beneficial effects: the optical module includes an upper shell, a circuit board, a base, a light receiving component and a light emitting component. The light receiving component and the light emitting component are respectively arranged on different surfaces of the same base to improve the integration of the optical module. A base mounting portion is formed on the surface of the circuit board, and the base is fixed to the surface of the circuit board through the base mounting portion. In order to enhance the heat dissipation effect of the base, a protrusion is formed on the upper surface of the base, and the protrusion protrudes toward the upper shell. The protrusion is thermally connected to the upper shell, so that the heat is conducted through the base. In order to dissipate the heat generated by the light emitting component more effectively, the light emitting component is arranged on the lower surface of the base, so that the light emitting component has a better heat dissipation path and improves the heat dissipation efficiency. Correspondingly, the light receiving component is arranged on the upper surface of the base. The light receiving component is arranged on the side of the protrusion. A protrusion is formed on the upper surface of the base, and the protrusion serves as a heat dissipation protrusion to enhance the heat dissipation effect of the base. At the same time, the light emitting component is arranged on the lower surface of the base, and the light receiving component is arranged on the upper surface of the base to realize the light reception and light emission of multiple signals.

[0012] In some embodiments, the upper surface of the base is formed with:

[0013] A first supporting surface, located at one side of the protruding portion, a first supporting plate is provided on the surface of the first supporting surface, and one end of the first supporting plate extends relative to the surface of the first supporting surface;

[0014] A second supporting surface, located at the other side of the protruding portion, a second supporting plate is provided on the surface of the second supporting surface, and one end of the second supporting plate extends relative to the surface of the second supporting surface;

[0015] The lower surface of the base is formed with:

[0016] A third supporting surface, located at one end of the base;

[0017] a fourth supporting surface, located on one side of the third supporting surface;

[0018] a fifth supporting surface, located on one side of the third supporting surface;

[0019] A sixth supporting surface, located on one side of the fourth supporting surface, the sixth supporting surface is formed with a first avoidance gap, and the sixth supporting surface has a height;

[0020] A supporting boss is located on one side of the sixth supporting surface;

[0021] The limiting boss is located at one side of the fifth supporting surface. The length of the limiting boss is greater than that of the supporting boss. The limiting boss is formed with a second avoidance gap, and the second avoidance gap is arranged opposite to the first avoidance gap.

[0022] The above technical solution has the following advantages or beneficial effects: a first supporting surface and a second supporting surface are formed on the upper surface of the base. The first supporting surface is located on one side of the raised portion, and a first supporting plate is provided on the surface of the first supporting surface to carry the first light receiving component. The second supporting surface is located on the other side of the raised portion, and a second supporting plate is provided on the surface of the second supporting surface to carry the second light receiving component. One end of the first supporting plate extends relative to the surface of the first supporting surface to extend the position of the device carried on the surface of the first supporting plate. Similarly, one end of the second supporting plate extends relative to the surface of the second supporting surface to extend the position of the device on the surface of the second supporting plate. A third supporting surface, a fourth supporting surface, a fifth supporting surface, and a sixth supporting surface are formed on the lower surface of the base to carry the light emitting component. The light emitting component is arranged on the lower surface of the base, which is conducive to improving the heat dissipation efficiency of the light emitting component. The supporting boss is used to limit and fix the third optical fiber collimator in the light emitting component. The limiting boss is used to limit and fix the fourth optical fiber collimator in the light emitting component. The sixth supporting surface is formed with a first avoidance notch to avoid the fourth optical fiber collimator in the light emitting component. The limiting boss is formed with a second avoidance notch to avoid the fourth optical fiber collimator in the light emitting component.

[0023] In some embodiments, one side of the protrusion is provided with:

[0024] A first optical fiber collimator, disposed on the surface of the first supporting plate;

[0025] A first optical demultiplexing component is disposed on the surface of the first supporting plate and is located on the light path of the first optical fiber collimator;

[0026] A first refracting member, one end of which is disposed on the surface of the first supporting plate, and the other end of which is suspended relative to the first supporting plate;

[0027] A first light receiving chip array is located on one side of the first supporting surface;

[0028] The other side of the raised portion is provided with:

[0029] A second optical fiber collimator, disposed on the surface of the second supporting plate;

[0030] A second optical demultiplexing component is disposed on the surface of the second supporting plate and is located in the light path of the second optical fiber collimator;

[0031] A second refracting member, one end of which is disposed on the surface of the second supporting plate, and the other end of which is suspended relative to the second supporting plate;

[0032] The second light receiving chip array is located on one side of the second supporting surface.

[0033] The above technical solution has the following advantages or beneficial effects: a first optical fiber collimator, a first optical demultiplexing component, a first refractive element, and a first optical receiving chip array are provided on one side of the raised portion. The first optical fiber collimator, the first optical demultiplexing component, and the first refractive element are all located on the surface of the first supporting plate, and the first supporting plate can provide a stable optical carrier platform for them, reduce thermal deformation, and thus ensure the stability of the optical path. The first optical fiber collimator receives an optical signal from the outside and transmits the optical signal to the first collimating lens. The first collimating lens performs collimation processing on the optical signal and transmits it to the first optical demultiplexing component. The first optical demultiplexing component decomposes the input optical signal into multiple optical signals of different wavelengths. After being reflected by the first refractive element, the multiple optical signals of different wavelengths are transmitted to the surface of the first optical receiving chip array and received by the first optical receiving chip array. The first optical receiving chip array converts optical signals of different wavelengths into photocurrent signals. A second optical fiber collimator, a second optical demultiplexing component, a second refractive element, and a second optical receiving chip array are provided on the other side of the raised portion. The second optical fiber collimator, the second optical demultiplexing component, and the second refracting element are located on the surface of the second supporting plate to ensure the stability of the optical path. The second optical fiber collimator receives an optical signal from the outside and transmits the optical signal to the second collimating lens. The second collimating lens collimates the optical signal and transmits it to the second optical demultiplexing component. The second optical demultiplexing component decomposes the input optical signal into multiple optical signals of different wavelengths. After being reflected by the second refracting element, the multiple optical signals of different wavelengths are transmitted to the surface of the second optical receiving chip array and received by the second optical receiving chip array. The second optical receiving chip array converts optical signals of different wavelengths into photocurrent signals.

[0034] In some embodiments, the lower surface of the base is provided with:

[0035] A light emitting chip array is located on the surface of the third supporting surface;

[0036] A first optical multiplexing component is located on the surface of the fourth supporting surface and on the light output path of the light emitting chip array;

[0037] A second optical multiplexing component is located on the surface of the fifth supporting surface and on the light path of the light emitting chip array;

[0038] A third optical fiber collimator is located on the light output path of the first optical multiplexing component; the light input end face of the third optical fiber collimator is supported by the side wall of the sixth supporting surface, and the side wall of the third optical fiber collimator is supported by the side wall of the supporting boss to limit the position of the third optical fiber collimator;

[0039] A fourth optical fiber collimator is located on the light output path of the second optical multiplexing component; the light incident end face of the fourth optical fiber collimator is supported by the side wall of the sixth supporting surface, and the side wall of the fourth optical fiber collimator is supported by the side wall of the limiting boss to limit the fourth optical fiber collimator.

[0040] The above technical solution has the following advantages or beneficial effects: the lower surface of the base is provided with a light emitting chip array, a first optical multiplexing component, a second optical multiplexing component, a third optical fiber collimator, and a fourth optical fiber collimator. The light emitting component is arranged on the lower surface of the base so that the light emitting component has a better heat dissipation path and improves the heat dissipation efficiency. Among them, the light emitting chip array is located on the surface of the third supporting surface, the first optical multiplexing component is located on the surface of the fourth supporting surface and is located on the light output path of the light emitting chip array, and the second optical multiplexing component is located on the surface of the fifth supporting surface and is located on the light output path of the light emitting chip array. The third optical fiber collimator is located on the light output path of the first optical multiplexing component, and the fourth optical fiber collimator is located on the light output path of the second optical multiplexing component. The light emitting chip array emits multiple optical signals of different wavelengths. The first optical multiplexing component combines some of the optical signals of different wavelengths to generate a first combined optical signal. The second optical multiplexing component combines other optical signals of different wavelengths to generate a second combined optical signal. Among them, the first combined optical signal is coupled into the third optical fiber collimator for transmission to the outside. The second combined optical signal is coupled into the fourth fiber collimator for transmission to the outside. In addition, the light incident end face of the third fiber collimator bears against the side wall of the sixth support surface, and the side wall of the third fiber collimator bears against the side wall of the supporting boss, so as to limit and fix the third fiber collimator. The light incident end face of the fourth fiber collimator bears against the side wall of the sixth support surface, and the side wall of the fourth fiber collimator bears against the side wall of the limiting boss, so as to limit and fix the fourth fiber collimator.

[0041] In some embodiments, there is a preset distance between the first light receiving chip array and the base, and there is a preset distance between the second light receiving chip and the base;

[0042] The end of the first supporting plate extends relative to the surface of the first supporting surface so that the first light folding member reflects the light path toward the first light receiving chip array;

[0043] The end of the second supporting plate extends out relative to the surface of the second supporting surface so that the second folding member reflects the light path toward the second light receiving chip array.

[0044] The above technical solution has the following advantages or beneficial effects: there is a preset distance between the first light receiving chip array and the base, and there is a preset distance between the second light receiving chip array and the base, thereby preventing the glue fixing the base from contaminating the optical paths of the first light receiving chip array and the second light receiving chip array. The end of the first supporting plate extends relative to the surface of the first supporting surface so that the first refractive element reflects the optical path toward the first light receiving chip array, thereby transmitting the reflected light signal of the first refractive element to the surface of the first light receiving chip array. The end of the second supporting plate extends relative to the surface of the second supporting surface so that the second refractive element reflects the optical path toward the second light receiving chip array, thereby transmitting the reflected light signal of the second refractive element to the surface of the second light receiving chip array.

[0045] In some embodiments, a first groove portion is formed on the surface of the first support surface, and a second groove portion is formed on the surface of the second support surface;

[0046] One end of the first supporting plate extends toward the first light receiving chip array, and the other end extends to above the first groove portion;

[0047] One end of the second supporting plate extends toward the second light receiving chip array; the other end extends to above the second groove portion.

[0048] The above technical solution has the following advantages or beneficial effects: one end of the first supporting plate extends toward the top of the first light receiving chip array, and the other end extends to the top of the first groove portion. Then the two ends of the first supporting plate are respectively suspended, so as to avoid the two ends from being subjected to the stress of the glue used to fix the first supporting plate. At the same time, there is a certain distance between the end of the first supporting plate and the first groove portion, so that the excess glue for fixing the first supporting plate can overflow into the first groove portion, so as to avoid the glue from contaminating the light path. One end of the second supporting plate extends toward the top of the second light receiving chip array, and the other end extends to the top of the second groove portion. Then the two ends of the second supporting plate are respectively suspended, so as to avoid the two ends from being subjected to the stress of the glue used to fix the second supporting plate. At the same time, there is a certain distance between the end of the second supporting plate and the second groove portion, so that the excess glue for fixing the second supporting plate can overflow into the second groove portion, so as to avoid the glue from contaminating the light path.

[0049] In some embodiments, a TEC is disposed on the surface of the third support surface, and the light emitting chip array is located on the surface of the TEC;

[0050] The third supporting surface is recessed downward relative to the fourth supporting surface so that the surface of the light emitting chip array is flush with the surface of the circuit board.

[0051] The above technical solution has the following advantages or beneficial effects: the light emitting chip array is located on the surface of the TEC, and the temperature of the light emitting chip array can be controlled by the TEC. Since the TEC has a certain height, the third support surface is recessed to ensure that the surface of the light emitting chip array is flush with the surface of the circuit board, thereby shortening the wire bonding length between the light emitting chip array and the circuit board, and ensuring the high-frequency signal transmission performance between the two.

[0052] In some embodiments, a first light-bending member and a first light-receiving chip array are disposed on one side of the protrusion, and a second light-bending member and a second light-receiving chip array are disposed on the other side;

[0053] A first converging lens is connected to the light emitting end surface of the first light refracting member, and the light emitting surface of the first converging lens faces the first light receiving chip array;

[0054] A second converging lens is connected to the light emitting end surface of the second light refracting member, and a light emitting surface of the second converging lens faces the second light receiving chip array.

[0055] The above technical solution has the following advantages or beneficial effects: the first converging lens is fixed on the light-emitting end face of the first refractive element. The first converging lens is located between the first refractive element and the first light receiving chip array, and the light-emitting surface of the first converging lens faces the first light receiving chip array. The first converging lens converges the light signal reflected from the first refractive element so that the light signal reflected from the first refractive element falls within the photosensitive surface range of the light receiving chip in the first light receiving chip array. In this way, the first refractive element can be moved away from the surface of the circuit board, increasing the distance between the first refractive element and the first light receiving chip array, thereby increasing the remaining base thickness after the third supporting surface is recessed, thereby increasing the base's support for the optical device and ensuring the stability of the optical path. The same is true for the second converging lens.

[0056] In some embodiments, an end portion of the fourth optical fiber collimator is located in a cavity surrounded by the first avoidance gap and the second avoidance gap.

[0057] The above technical solution has the following advantages or beneficial effects: the end of the fourth optical fiber collimator is located in the cavity surrounded by the first avoidance gap and the second avoidance gap. Then the excess glue fixing the fourth optical fiber collimator will overflow into the cavity surrounded by the first avoidance gap and the second avoidance gap, avoiding the glue from contaminating the optical path of the fourth optical fiber collimator.

[0058] In some embodiments, a light receiving chip array is provided on the surface of the circuit board, and the light receiving components are provided on both sides of the protrusion;

[0059] The protrusion is formed with a first bearing surface and a first extension located at the end of the first bearing surface on one side, and a second bearing surface and a second extension located at the end of the second bearing surface on the other side; the lower surface of the base is formed with a third bearing surface and a fourth bearing surface; the surface of the base is provided with:

[0060] A first optical fiber array, located on the surface of the first bearing surface, for receiving multiple optical signals;

[0061] A second optical fiber array, located on the surface of the second bearing surface, for receiving multiple optical signals;

[0062] A first optical path turning device, located on the surface of the first extension portion, used to change the transmission direction of the multi-path optical signals output by the first optical fiber array, so as to transmit the multi-path optical signals to the optical receiving chip array;

[0063] A second optical path turning device, located on the surface of the second extension portion, used to change the transmission direction of the multi-path optical signals output by the second optical fiber array, so as to transmit the multi-path optical signals to the optical receiving chip array;

[0064] A laser group, located on the surface of the third bearing surface, for emitting multiple optical signals;

[0065] The third optical fiber array is located on the surface of the fourth bearing surface and is used to transmit the multi-path optical signals emitted by the laser group.

[0066] The above technical solution has the following advantages or beneficial effects: a first bearing surface and a first extension portion are formed on one side of the protrusion. A second bearing surface and a second extension portion are formed on the other side of the protrusion. A third bearing surface and a fourth bearing surface are formed on the lower surface of the base. The upper surface of the base is provided with: a first optical fiber array, a second optical fiber array, a first optical path turning device, and a second optical path turning device. The first optical fiber array is located on the surface of the first bearing surface, the second optical fiber array is located on the surface of the second bearing surface, the first optical path turning device is located on the surface of the first extension portion, and the second optical path turning device is located on the surface of the second heat extension portion. The first optical path turning device is used to reflect the optical signal output by the first optical fiber array, thereby changing the transmission direction and transmitting the multi-channel optical signal to the surface of the optical receiving chip array. The second optical path turning device is used to reflect the optical signal output by the second optical fiber array, thereby changing the transmission direction and transmitting the multi-channel optical signal to the surface of the optical receiving chip array. A laser group and a third optical fiber array are provided on the lower surface of the base. The heat generated by the laser group is conducted upward to the protrusion, and the heat is transmitted to the upper shell through the protrusion, which is conducive to improving the heat dissipation efficiency. The laser group is located on the surface of the third bearing surface and is used to emit multiple optical signals. The third optical fiber array is located on the surface of the fourth bearing surface and is used to transmit the multiple optical signals emitted by the laser group to achieve the emission of multiple optical signals.

[0067] In some embodiments, a light receiving chip array is provided on the surface of the circuit board, and the light receiving components are provided on both sides of the protrusion;

[0068] The first and second bearing surfaces are formed on one side of the protrusion, and the third and fourth bearing surfaces are formed on the other side of the protrusion; wherein the side walls of the first and third bearing surfaces are respectively formed with a blocking portion; the surface of the second bearing surface is lower than the surface of the first bearing surface, and the surface of the fourth bearing surface is lower than the surface of the third bearing surface; the surface of the base is respectively provided with:

[0069] A first AWG is disposed on the surface of the first bearing surface, a light emitting end surface of the first AWG is horizontally placed on the surface of the first bearing surface, and the light emitting end surface of the first AWG is set as a plane;

[0070] A second AWG is disposed on the surface of the third bearing surface, the light-emitting end surface of the second AWG is horizontally placed on the surface of the third bearing surface, and the light-emitting end surface of the second AWG is set as a plane;

[0071] A first optical path turning device, disposed on the surface of the second bearing surface, for changing the transmission direction of the multi-path optical signals output by the first AWG so as to transmit them to the optical receiving chip array;

[0072] The second optical path turning device is disposed on the surface of the fourth bearing surface and is used to change the transmission direction of the multi-path optical signals output by the second AWG so as to transmit them to the optical receiving chip array.

[0073] The above technical solution has the following advantages or beneficial effects: a first bearing surface and a second bearing surface are formed on one side of the raised portion, and a third bearing surface and a fourth bearing surface are formed on the other side of the raised portion. A first AWG is provided on the surface of the first bearing surface, and a second AWG is provided on the surface of the third bearing surface. A first optical path turning device is provided on the surface of the second bearing surface, and a second optical path turning device is provided on the surface of the fourth bearing surface. The light-emitting end face of the first AWG is horizontally placed on the surface of the first bearing surface, and the light-emitting end face of the first AWG is a plane, so the first AWG is horizontally placed on the surface of the first bearing surface. The light-emitting end face of the second AWG is horizontally placed on the surface of the third bearing surface, and the light-emitting end face of the second AWG is a plane, so the second AWG is also horizontally placed on the surface of the third bearing surface. The first optical path turning device is used to change the transmission direction of the optical signal output by the first AWG, so as to transmit the optical signal to the surface of the optical receiving chip array. The second optical path turning device is used to change the transmission direction of the optical signal output by the second AWG, so as to transmit the optical signal to the surface of the optical receiving chip array, so as to realize the reception of multiple optical signals.

[0074] In some embodiments, an optical module is provided, comprising:

[0075] Upper shell;

[0076] A circuit board, a base mounting portion is formed on the surface of the circuit board, and a light receiving chip array is provided on the surface of the circuit board;

[0077] The base is fixed to the surface of the circuit board through the base mounting portion, the upper surface of the base is formed with a raised portion, the raised portion protrudes toward the upper shell, and the raised portion is thermally connected to the upper shell; the lower surface of the base is formed with:

[0078] A third supporting surface, located at one end of the base;

[0079] a fourth supporting surface, located on one side of the third supporting surface;

[0080] a fifth supporting surface, located on one side of the third supporting surface;

[0081] A sixth supporting surface, located on one side of the fourth supporting surface, the sixth supporting surface is formed with a first avoidance gap, and the sixth supporting surface has a height;

[0082] A supporting boss is located on one side of the sixth supporting surface;

[0083] A limiting boss, located at one side of the sixth supporting surface, the limiting boss is longer than the supporting boss, the limiting boss is formed with a second avoidance notch, and the second avoidance notch is arranged opposite to the first avoidance notch;

[0084] A first light receiving component is located on the upper surface of the base and on one side of the raised portion;

[0085] A second light receiving component is located on the upper surface of the base and on the other side of the protruding portion;

[0086] A light emitting chip array is located on the surface of the third supporting surface;

[0087] A first optical multiplexing component is located on the surface of the fourth supporting surface and on the light output path of the light emitting chip array;

[0088] A second optical multiplexing component is located on the surface of the fifth supporting surface and on the light path of the light emitting chip array;

[0089] A third optical fiber collimator is located on the light output path of the first optical multiplexing component; the light input end face of the third optical fiber collimator is supported by the side wall of the sixth supporting surface, and the side wall of the third optical fiber collimator is supported by the side wall of the supporting boss to limit the position of the third optical fiber collimator;

[0090] A fourth optical fiber collimator is located on the light output path of the second optical multiplexing component; the light incident end face of the fourth optical fiber collimator is supported by the side wall of the sixth supporting surface, and the side wall of the fourth optical fiber collimator is supported by the side wall of the limiting boss to limit the fourth optical fiber collimator.

[0091] The above technical solution has the following advantages or beneficial effects: the optical module includes an upper shell, a circuit board, a base, a first light receiving component, a second light receiving component, and a light emitting component. Among them, a protrusion is formed on the upper surface of the base, and the protrusion protrudes toward the upper shell to be thermally connected with the upper shell. The light emitting component is located on the lower surface of the base, and the heat generated by the light emitting component is conducted upward to the protrusion, and the protrusion conducts the heat to the upper shell, which is conducive to optimizing the heat conduction path and improving the heat dissipation efficiency. The first light receiving component is located on the upper surface of the base and on one side of the protrusion, and the first light receiving component is located on the upper surface of the base and on the other side of the protrusion, thereby realizing multi-channel optical signal reception. In order to assemble the light emitting component on the lower surface of the base, the lower surface of the base is formed with a third supporting surface, a fourth supporting surface, a fifth supporting surface, and a sixth supporting surface. The light emitting component includes a light emitting chip array, a first optical multiplexing component, a second optical multiplexing component, a third optical fiber collimator, and a fourth optical fiber collimator. In order to limit the third fiber collimator and the fourth fiber collimator, a bearing platform and a limiting boss are formed on the lower surface of the base, the bearing platform is located on one side of the sixth supporting surface, and the limiting boss is located on one side of the sixth supporting surface. The optical emission chip array is located on the surface of the third supporting surface, the first optical multiplexing component is located on the surface of the fourth supporting surface and on the light output path of the optical emission chip array, and the second optical multiplexing component is located on the surface of the fifth supporting surface and on the light output path of the optical emission chip array. The third optical fiber collimator is located on the light output path of the first optical multiplexing component, and the fourth optical fiber collimator is located on the light output path of the second optical multiplexing component. The optical emission chip array emits multiple optical signals of different wavelengths. The first optical multiplexing component combines some of the optical signals of different wavelengths to generate a first combined optical signal. The second optical multiplexing component combines other optical signals of different wavelengths to generate a second combined optical signal. Among them, the first combined optical signal is coupled into the third optical fiber collimator for transmission to the outside. The second combined optical signal is coupled into the fourth optical fiber collimator for transmission to the outside. In addition, the light incident end face of the third optical fiber collimator bears against the side wall of the sixth supporting surface, and the side wall of the third optical fiber collimator bears against the side wall of the supporting boss, so as to limit and fix the third optical fiber collimator. The light incident end face of the fourth optical fiber collimator bears against the side wall of the sixth supporting surface, and the side wall of the fourth optical fiber collimator bears against the side wall of the limiting boss, so as to limit and fix the fourth optical fiber collimator.

[0092] In some embodiments, the upper surface of the base is formed with:

[0093] A first supporting surface, located at one side of the protruding portion, a first supporting plate is provided on the surface of the first supporting surface, and one end of the first supporting plate extends relative to the surface of the first supporting surface;

[0094] A second supporting surface, located at the other side of the protruding portion, a second supporting plate is provided on the surface of the second supporting surface, and one end of the second supporting plate extends relative to the surface of the second supporting surface;

[0095] The first light receiving component comprises:

[0096] A first optical fiber collimator, disposed on the surface of the first supporting plate;

[0097] A first optical demultiplexing component is disposed on the surface of the first supporting plate and is located on the light path of the first optical fiber collimator;

[0098] A first refracting member, one end of which is disposed on the surface of the first supporting plate, and the other end of which is suspended relative to the first supporting plate;

[0099] A first light receiving chip array is located on one side of the first supporting surface;

[0100] The second light receiving component comprises:

[0101] A second optical fiber collimator, disposed on the surface of the second supporting plate;

[0102] A second optical demultiplexing component is disposed on the surface of the second supporting plate and is located in the light path of the second optical fiber collimator;

[0103] A second refracting member, one end of which is disposed on the surface of the second supporting plate, and the other end of which is suspended relative to the second supporting plate;

[0104] The second light receiving chip array is located on one side of the second supporting surface.

[0105] The above technical solution has the following advantages or beneficial effects: a first optical fiber collimator, a first optical demultiplexing component, a first refractive element, and a first optical receiving chip array are provided on one side of the raised portion. The first optical fiber collimator, the first optical demultiplexing component, and the first refractive element are all located on the surface of the first supporting plate, and the first supporting plate can provide a stable optical carrier platform for them, reduce thermal deformation, and thus ensure the stability of the optical path. The first optical fiber collimator receives an optical signal from the outside and transmits the optical signal to the first collimating lens. The first collimating lens performs collimation processing on the optical signal and transmits it to the first optical demultiplexing component. The first optical demultiplexing component decomposes the input optical signal into multiple optical signals of different wavelengths. After being reflected by the first refractive element, the multiple optical signals of different wavelengths are transmitted to the surface of the first optical receiving chip array and received by the first optical receiving chip array. The first optical receiving chip array converts optical signals of different wavelengths into photocurrent signals. A second optical fiber collimator, a second optical demultiplexing component, a second refractive element, and a second optical receiving chip array are provided on the other side of the raised portion. The second optical fiber collimator, the second optical demultiplexing component, and the second refracting element are located on the surface of the second supporting plate to ensure the stability of the optical path. The second optical fiber collimator receives an optical signal from the outside and transmits the optical signal to the second collimating lens. The second collimating lens collimates the optical signal and transmits it to the second optical demultiplexing component. The second optical demultiplexing component decomposes the input optical signal into multiple optical signals of different wavelengths. After being reflected by the second refracting element, the multiple optical signals of different wavelengths are transmitted to the surface of the second optical receiving chip array and received by the second optical receiving chip array. The second optical receiving chip array converts optical signals of different wavelengths into photocurrent signals.

[0106] In some embodiments, a TEC is disposed on the surface of the third support surface, and the light emitting chip array is located on the surface of the TEC;

[0107] The third supporting surface is recessed downward relative to the fourth supporting surface so that the surface of the light emitting chip array is flush with the surface of the circuit board.

[0108] The above technical solution has the following advantages or beneficial effects: the light emitting chip array is located on the surface of the TEC, and the temperature of the light emitting chip array can be controlled by the TEC. Since the TEC has a certain height, the third support surface is recessed to ensure that the surface of the light emitting chip array is flush with the surface of the circuit board, thereby shortening the wire bonding length between the light emitting chip array and the circuit board, and ensuring the high-frequency signal transmission performance between the two.

[0109] In some embodiments, a first light-bending member and a first light-receiving chip array are disposed on one side of the protrusion, and a second light-bending member and a second light-receiving chip array are disposed on the other side;

[0110] A first converging lens is connected to the light emitting end surface of the first light refracting member, and the light emitting surface of the first converging lens faces the first light receiving chip array;

[0111] A second converging lens is connected to the light emitting end surface of the second light refracting member, and a light emitting surface of the second converging lens faces the second light receiving chip array.

[0112] The above technical solution has the following advantages or beneficial effects: the first converging lens is fixed on the light-emitting end face of the first refractive element. The first converging lens is located between the first refractive element and the first light receiving chip array, and the light-emitting surface of the first converging lens faces the first light receiving chip array. The first converging lens converges the light signal reflected from the first refractive element so that the light signal reflected from the first refractive element falls within the photosensitive surface range of the light receiving chip in the first light receiving chip array. In this way, the first refractive element can be moved away from the surface of the circuit board, increasing the distance between the first refractive element and the first light receiving chip array, thereby increasing the remaining base thickness after the third supporting surface is recessed, thereby increasing the base's support for the optical device and ensuring the stability of the optical path. The same is true for the second converging lens. BRIEF DESCRIPTION OF THE DRAWINGS

[0113] In order to more clearly illustrate the technical solutions in the present disclosure, the following briefly introduces the drawings used in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can also be obtained based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams, and are not limitations on the actual size of the product involved in the embodiments of the present disclosure, the actual process of the method, the actual timing of the signal, etc.

[0114] Figure 1 is a partial architecture diagram of an optical communication system according to some embodiments;

[0115] Figure 2 is a partial structural diagram of a host computer according to some embodiments;

[0116] Figure 3 is a structural diagram of an optical module according to some embodiments;

[0117] Figure 4A is an exploded view of an optical module according to some embodiments;

[0118] Figure 4B is a diagram of the internal structure of an optical module according to some embodiments;

[0119] Figure 5A The structure of the first base according to some embodiments Figure 1 ;

[0120] Figure 5BThe structure of the first base according to some embodiments Figure 2 ;

[0121] Figure 5C is a structural diagram of a circuit board according to some embodiments;

[0122] Figure 5D is a schematic diagram of assembling a first base and a circuit board according to some embodiments;

[0123] Fig. 6A The structure of the second base according to some embodiments Figure 1 ;

[0124] Figure 6B The structure of the second base according to some embodiments Figure 2 ;

[0125] Figure 6C is a schematic diagram of assembling a second base and a circuit board according to some embodiments;

[0126] Fig. 7A The structure of the third base according to some embodiments is Figure 1 ;

[0127] Figure 7B The structure of the third base according to some embodiments is Figure 2 ;

[0128] Figure 7C is a structural diagram of another circuit board according to some embodiments;

[0129] Fig.7D is an assembly diagram of a third base and a circuit board according to some embodiments;

[0130] Figure 8 is a structural diagram of a fourth base according to some embodiments;

[0131] Fig. 9 is a structural diagram of a fifth base according to some embodiments;

[0132] Fig. 10A Another base structure according to some embodiments Figure 1 ;

[0133] Fig. 10B Another base structure according to some embodiments Figure 2 ;

[0134] Fig.11A is an assembly structure diagram of a light receiving component according to some embodiments;

[0135] Fig. 11B is an exploded view of an optical receiving component according to some embodiments;

[0136] Fig.12 is a cross-sectional structural diagram of a light receiving component according to some embodiments;

[0137] Fig.13 is a schematic diagram of electrical connection between an optical receiving chip and a transimpedance amplifier according to some embodiments;

[0138] Fig.14 is a structural diagram of a light receiving component according to some embodiments;

[0139] Fig.15 is an exploded view of a light receiving component according to some embodiments;

[0140] Fig.16 is a structural diagram of a lens assembly according to some embodiments;

[0141] Fig.17 is a schematic diagram of assembling another light receiving component according to some embodiments;

[0142] Fig.18 is a schematic structural diagram of another light receiving component according to some embodiments;

[0143] Fig.19 is an exploded schematic diagram of another light receiving component according to some embodiments;

[0144] Fig. 20 is an assembly structure diagram of another light receiving component according to some embodiments;

[0145] Fig.21 is a schematic structural diagram of another light receiving component according to some embodiments;

[0146] Fig. 22 is an exploded schematic diagram of another light receiving component according to some embodiments;

[0147] Fig.23 is a top view of another light receiving component according to some embodiments;

[0148] Fig.24 is a schematic structural diagram of another light receiving component according to some embodiments;

[0149] Fig.25 is an exploded schematic diagram of another light receiving component according to some embodiments;

[0150] Fig.26 is a schematic top view of yet another light receiving component according to some embodiments;

[0151] Fig. 27 is a schematic diagram of assembling another light receiving component according to some embodiments;

[0152] Fig.28 is a schematic structural diagram of another light receiving component according to some embodiments;

[0153] Fig.29A is a schematic diagram of assembling another light receiving component according to some embodiments;

[0154] Fig.29B is a schematic structural diagram of another light receiving component according to some embodiments;

[0155] Fig. 30A A schematic diagram of a circuit board upper surface assembly according to some embodiments;

[0156] Fig. 30B is an exploded view of a circuit board upper surface assembly according to some embodiments;

[0157] Fig. 30C A schematic diagram of a circuit board bottom surface assembly according to some embodiments;

[0158] Fig.30D A cross-sectional structural diagram of the upper and lower surfaces of a base according to some embodiments;

[0159] Fig.30E An exploded cross-sectional view of the upper and lower surfaces of a base according to some embodiments;

[0160] Fig.30F A diagram of an upper surface assembly structure of a base according to some embodiments;

[0161] Figure 30G An exploded view of an upper surface assembly structure of a base according to some embodiments;

[0162] Fig.31 is a schematic diagram of assembling a light emitting component according to some embodiments;

[0163] Fig.32 A top view of an assembly of a light emitting component according to some embodiments;

[0164] Fig.33 An exploded view of an optical emission component according to some embodiments;

[0165] Fig.34 A structural diagram of a second protective cover in a light emitting component provided according to some embodiments;

[0166] Fig.35 is an assembled side view of a light emitting component provided according to some embodiments;

[0167] Fig.36An exploded side view of an assembly of a light emitting component provided according to some embodiments;

[0168] Fig.37 is a cross-sectional structural diagram of a light emitting component provided according to some embodiments;

[0169] Fig.38 An exploded structural diagram of a light emitting component provided according to some embodiments;

[0170] Fig.39 is an assembly cross-sectional view of another light emitting component provided according to some embodiments;

[0171] Fig.40 A schematic diagram of assembling another light emitting component according to some embodiments;

[0172] Fig.41 A schematic diagram of the structure of another light emitting component provided according to some embodiments;

[0173] Fig.42 is a cross-sectional structural diagram of another light emitting component provided according to some embodiments;

[0174] Fig.43 A schematic diagram of a partial cross-sectional structure of an optical module provided according to some embodiments Figure 1 ;

[0175] Fig.44 A schematic diagram of a partial cross-sectional structure of an optical module provided according to some embodiments Figure 2 ;

[0176] Fig.45 A schematic diagram of assembling another light emitting component according to some embodiments Figure 1 ;

[0177] Fig.46 A schematic diagram of assembling another light emitting component according to some embodiments Figure 2 ;

[0178] Fig.47 A schematic structural diagram of another light emitting component provided according to some embodiments;

[0179] Fig.48 is an exploded schematic diagram of yet another light emitting component provided according to some embodiments;

[0180] Fig.49A is an assembly diagram of the lower surface of a base according to some embodiments;

[0181] Fig.49B An exploded view of the lower surface of a base according to some embodiments;

[0182] Fig.49C A schematic diagram of an assembly structure of a base and a second protective cover according to some embodiments;

[0183] Fig.49D An exploded view of an assembly structure of a base and a second protective cover according to some embodiments;

[0184] Fig.49E A cross-sectional structural diagram of an assembly of a base and a second protective cover according to some embodiments;

[0185] Fig.50A A diagram showing an assembly structure of a light emitting component and a base according to some embodiments;

[0186] Fig.50B A cross-sectional view of an assembly of a light emitting component and a base according to some embodiments;

[0187] Fig.50C A top view of an assembly of a light emitting component and a base according to some embodiments;

[0188] Fig.50D An exploded view of an assembly of a light emitting component and a base according to some embodiments;

[0189] Fig.50E A cross section of an assembly of a light emitting component and a base according to some embodiments Figure 1 ;

[0190] Fig.50F A cross section of an assembly of a light emitting component and a base according to some embodiments Figure 2 ;

[0191] Figure 50G The present invention is a cross-sectional view of the upper and lower surfaces of a base according to some embodiments. DETAILED DESCRIPTION

[0192] Some embodiments of the present disclosure will be described in detail below in conjunction with the accompanying drawings. However, the described embodiments are only a part of the embodiments of the present disclosure, rather than all of the embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of the present disclosure.

[0193] Unless the context requires otherwise, throughout the specification and claims, the term "comprising" is to be interpreted as having an open, inclusive meaning, that is, "including, but not limited to"; the terms "first" and "second" are not to be understood as indicating or implying relative importance or indicating an upper limit on quantity; the term "plurality" means two or more; the term "connected" is to be understood in a broad sense, for example, "connected" can be a fixed connection, a detachable connection, or an integral connection, and can be directly connected or indirectly connected through an intermediate medium; the use of the terms "suitable for" or "configured to" implies open and inclusive language, which does not exclude devices that are suitable for or configured to perform additional tasks or steps; descriptions such as "parallel", "perpendicular", "same", "consistent", and "flush" are not limited to absolute mathematical theoretical relationships, but also include an acceptable error range generated in practice, and also include differences based on the same design concept but due to manufacturing reasons.

[0194] Optical communication technology establishes information transmission between information processing devices. Optical communication technology loads information onto light and uses the propagation of light to achieve information transmission. Light loaded with information is an optical signal. When optical signals propagate in information transmission equipment, they can reduce the loss of optical power and achieve high-speed, long-distance, and low-cost information transmission. Information that can be processed by information processing equipment exists in the form of electrical signals. Optical network terminals / gateways, routers, switches, mobile phones, computers, servers, tablets, and televisions are common information processing devices, and optical fibers and optical waveguides are common information transmission equipment.

[0195] The mutual conversion of optical signals and electrical signals between information processing equipment and information transmission equipment is realized through optical modules. For example, an optical fiber is connected to the optical signal input end and / or the optical signal output end of the optical module, and an optical network terminal is connected to the electrical signal input end and / or the electrical signal output end of the optical module; the first optical signal from the optical fiber is transmitted into the optical module, the optical module converts the first optical signal into a first electrical signal, and the optical module transmits the first electrical signal into the optical network terminal; the second electrical signal from the optical network terminal is transmitted into the optical module, the optical module converts the second electrical signal into a second optical signal, and the optical module transmits the second optical signal into the optical fiber. Since information processing devices can be connected to each other through an electrical signal network, at least one type of information processing device needs to be directly connected to the optical module, and it is not necessary for all types of information processing devices to be directly connected to the optical module. The information processing device directly connected to the optical module is called the host computer of the optical module.

[0196] Figure 1 FIG. 1 is a partial architecture diagram of an optical communication system according to some embodiments. Figure 1As shown, the optical communication system is partially presented as a remote information processing device 1000 , a local information processing device 2000 , a host computer 100 , an optical module 200 , an optical fiber 101 and a network cable 103 .

[0197] One end of the optical fiber 101 extends toward the remote information processing device 1000, and the other end is connected to the optical interface of the optical module 200. The optical signal can be totally reflected in the optical fiber 101, and the propagation of the optical signal in the direction of total reflection can almost maintain the original optical power. The optical signal is totally reflected multiple times in the optical fiber 101, and the optical signal from the direction of the remote information processing device 1000 is transmitted into the optical module 200, or the light from the optical module 200 is propagated toward the remote information processing device 1000, so as to realize long-distance and low-power-loss information transmission.

[0198] The number of optical fibers 101 may be one or more (two or more); the optical fiber 101 and the optical module 200 may be connected in a pluggable movable manner or in a fixed manner.

[0199] The host computer 100 has an optical module interface 102, which is configured to access the optical module 200, so that the host computer 100 establishes a unidirectional / bidirectional electrical signal connection with the optical module 200; the host computer 100 is configured to provide data signals to the optical module 200, or receive data signals from the optical module 200, or monitor and control the working status of the optical module 200.

[0200] The host computer 100 has an external electrical interface, such as a Universal Serial Bus (USB) interface and a network cable interface 104, which can be connected to an electrical signal network. For example, the network cable interface 104 is configured to connect to the network cable 103, so that the host computer 100 and the network cable 103 establish a unidirectional / bidirectional electrical signal connection.

[0201] Optical Network Unit (ONU), Optical Line Terminal (OLT), Optical Network Equipment (ONT) and Data Center Server are common host computers.

[0202] One end of the network cable 103 is connected to the local information processing device 2000 , and the other end is connected to the host computer 100 . The network cable 103 establishes an electrical signal connection between the local information processing device 2000 and the host computer 100 .

[0203] For example, the third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 through the network cable 103. The host computer 100 generates a second electrical signal based on the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200. The optical module 200 converts the second electrical signal into a second optical signal. The optical module 200 transmits the second optical signal into the optical fiber 101. The second optical signal is transmitted to the remote information processing device 1000 in the optical fiber 101.

[0204] For example, a first optical signal from the direction of a remote information processing device 1000 propagates through the optical fiber 101, the first optical signal from the optical fiber 101 is transmitted into the optical module 200, the optical module 200 converts the first optical signal into a first electrical signal, the optical module 200 transmits the first electrical signal into the host computer 100, the host computer 100 generates a fourth electrical signal based on the first electrical signal, and the host computer 100 transmits the fourth electrical signal to the local information processing device 2000.

[0205] The optical module is a tool for realizing the mutual conversion between optical signals and electrical signals. During the conversion process between optical signals and electrical signals, the information does not change, but the encoding and decoding method of the information can change.

[0206] Figure 2 FIG. 1 is a partial structural diagram of a host computer according to some embodiments. In order to clearly show the connection relationship between the optical module 200 and the host computer 100, Figure 2 Only the structures related to the host computer 100 and the optical module 200 are shown. Figure 2 As shown, the host computer 100 also includes a PCB circuit board 105 arranged in the shell, a cage 106 arranged on the surface of the PCB circuit board 105, a heat sink 107 arranged on the cage 106, and an electrical connector (not shown in the figure) arranged inside the cage 106. The heat sink 107 has a protruding structure that increases the heat dissipation area, and the fin-shaped structure is a common protruding structure.

[0207] The optical module 200 is inserted into the cage 106 of the host computer 100, and the cage 106 fixes the optical module 200. The heat generated by the optical module 200 is transferred to the cage 106 and then diffused through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical interface of the optical module 200 is connected to the electrical connector inside the cage 106.

[0208] Figure 3 is a structural diagram of an optical module according to some embodiments, Figure 4A FIG. 1 is an exploded view of an optical module according to some embodiments. Figure 3 and Figure 4AAs shown, the optical module 200 includes a shell, a circuit board 300 disposed in the shell, a light emitting component 400 and a light receiving component 500. However, the present disclosure is not limited thereto. In some embodiments, the optical module 200 includes one of the light emitting component 400 and the light receiving component 500.

[0209] The housing comprises an upper housing 201 and a lower housing 202 . The upper housing 201 covers the lower housing 202 to form the housing having two openings 204 and 205 . The outer contour of the housing is generally a square body.

[0210] In some embodiments, the lower shell 202 includes a bottom plate 2021 and two lower side plates located on both sides of the bottom plate 2021 and arranged perpendicular to the bottom plate 2021; the upper shell 201 includes a cover plate 2011, and the cover plate 2011 is covered on the two lower side plates of the lower shell 202 to form the above-mentioned shell.

[0211] In some embodiments, the lower shell 202 includes a bottom plate 2021 and a first lower side plate 2022 and a second lower side plate 2023 located on both sides of the bottom plate 2021 and perpendicular to the bottom plate 2021; the upper shell 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and perpendicular to the cover plate 2011, and the two upper side plates are combined with the two lower side plates to achieve the upper shell 201 covering the lower shell 202.

[0212] The direction of the line connecting the two openings 204 and 205 may be consistent with the length direction of the optical module 200, or may be inconsistent with the length direction of the optical module 200. For example, the opening 204 is located at the end of the optical module 200 ( Figure 3 The opening 205 is also located at the end of the optical module 200 ( Figure 3 Alternatively, the opening 204 is located at the end of the optical module 200, and the opening 205 is located at the side of the optical module 200. The opening 204 is an electrical interface, and the gold finger of the circuit board 300 extends from the electrical interface and is inserted into the electrical connector of the host computer; the opening 205 is an optical port, which is configured to access the optical fiber 101 so that the optical fiber 101 is connected to the optical emitting component 400 and / or the optical receiving component 500 in the optical module 200.

[0213] The assembly method of combining the upper shell 201 and the lower shell 202 is adopted, which facilitates the installation of components such as the circuit board 300, the light emitting component 400, and the light receiving component 500 into the above-mentioned shell, and the upper shell 201 and the lower shell 202 can encapsulate and protect the shapes of these components. In addition, when assembling components such as the circuit board 300, the light emitting component 400 and the light receiving component 500, it is convenient to deploy the positioning components, heat dissipation components, and electromagnetic shielding components of these devices, which is conducive to the automated implementation of production.

[0214] In some embodiments, the upper shell 201 and the lower shell 202 are made of metal materials to facilitate electromagnetic shielding and heat dissipation.

[0215] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0216] For example, the unlocking component 600 is located on the outside of the two lower side plates 2022 of the lower housing 202, and includes a snap-fit ​​component that matches the cage 106 of the host computer. When the optical module 200 is inserted into the cage 106, the snap-fit ​​component of the unlocking component 600 fixes the optical module 200 in the cage 106; when the unlocking component 600 is pulled, the snap-fit ​​component of the unlocking component 600 moves accordingly, thereby changing the connection relationship between the snap-fit ​​component and the host computer, so as to release the snap-fit ​​fixed connection between the optical module 200 and the host computer, so that the optical module 200 can be pulled out of the cage 106.

[0217] The circuit board 300 includes circuit traces, electronic components and chips, etc. The electronic components and chips are connected together according to the circuit design through the circuit traces to realize the functions of power supply, electrical signal transmission and grounding. The electronic components may include capacitors, resistors, triodes, metal-oxide-semiconductor field-effect transistors (MOSFET), etc. The chips may include microcontroller units (MCU), laser driver chips, transimpedance amplifiers (TIA), limiting amplifiers, clock and data recovery chips (CDR), power management chips, and digital signal processing (DSP) chips.

[0218] The circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the load-bearing function. For example, the rigid circuit board can stably carry the above-mentioned electronic components and chips; the rigid circuit board is also easy to insert into the electrical connector in the upper computer cage.

[0219] The circuit board 300 also includes a gold finger formed on the end surface thereof, and the gold finger is composed of a plurality of independent pins. The circuit board 300 is inserted into the cage 106, and the gold finger is connected to the electrical connector in the cage 106. The gold finger can be provided on the surface of only one side of the circuit board 300 (for example, Figure 4AThe gold finger is configured to establish an electrical connection with the host computer to achieve power supply, grounding, I2C signal transmission, data signal transmission, etc.

[0220] Of course, flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards to supplement rigid circuit boards.

[0221] The light emitting component 400 and / or the light receiving component 500 are located on the side of the circuit board 300 away from the gold finger; in some embodiments, the light emitting component 400 and the light receiving component 500 are physically separated from the circuit board 300, and then electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors. In some embodiments, the light emitting component and / or the light receiving component can be directly set on the circuit board 300, can be set on the surface of the circuit board, and can also be set on the side of the circuit board. In some embodiments, the light emitting component 400 and the light receiving component 500 are respectively located on the upper and lower surfaces of the circuit board.

[0222] In order to make full use of the limited space, the existing 800G QSFPDD 2xFR4 is mainly hard-connected, that is, the optical emitting component 400 and the optical receiving component 500 are connected to the optical fiber adapter. In the OSFQ package, the optical emitting component 400 and the optical receiving component 500 need to be connected to the optical fiber first, and the optical fiber has an optical fiber adapter at the optical port position. The present disclosure provides an optical module, in which the optical emitting component 400 and the optical receiving component 500 are respectively arranged on the two surfaces of the base, the base is embedded in the circuit board, and the coupling connection with the optical fiber is realized, and then the soft connection is realized through the optical fiber and the optical port of the optical module. Through this design, the same optical and module structure design is realized, which can be applied to the QSFP-DD packaging method and the OSFP packaging method, and the requirements of the FR4 and LR4 optical modules for loss and sensitivity are met at the same time. Because the structure realizes the optical design of the transmitting and receiving ends as much as possible, and unifies different product packaging platforms (such as QSFP-DD and OSFP) and product standards (FR4 and LR4) in one optical and structural design, the assembly process is simplified. By rationally arranging the optical components and optimizing the assembly process, the overall assembly of the module is greatly simplified.

[0223] Figure 4B FIG. 1 is a diagram showing the internal structure of an optical module according to some embodiments. Figure 4B As shown, in some embodiments, the optical module includes a base 900. A base mounting portion is formed on the surface of the circuit board 300. The structure of the base mounting portion can be an opening or other structures.

[0224] In some embodiments, the base 900 is embedded in the base mounting portion, thereby fixing the base to the surface of the circuit board 300 .

[0225] In some embodiments, one surface of the base 900 is used to carry the light receiving component, and the other surface is used to carry the light emitting component, so that the light receiving component and the light emitting component are arranged in layers on the same base 900 to achieve a reasonable layout of the optical components.

[0226] In some embodiments, the first light receiving component 510 and the second light receiving component 520 are located on one surface of the base 900, and the first light emitting component 410 and the second light emitting component 420 are located on another surface of the base 900, thereby realizing multi-channel reception and multi-channel transmission of the optical module, such as a 1.6T optical module, thereby improving the transmission rate of the optical module.

[0227] In some embodiments, the upper housing 201 of the optical module may form a heat dissipation duct with the cage 106 of the host computer 100 , so the upper housing 201 has a better heat dissipation effect than the lower housing 202 .

[0228] In some embodiments, the first light emitting component 410 and the second light emitting component 420 are the main heat sources. When the first light emitting component 410 and the second light emitting component 420 are arranged on the lower surface of the base 900, the heat generated by them is first transferred upward to the surface of the base 900, and then the heat is continuously transferred upward to the upper shell 201 through the thermal connection between the base 900 and the upper shell 201, and then the heat is dissipated through the upper shell 201. In some embodiments, when the first light emitting component 410 and the second light emitting component 420 are arranged on the upper surface of the base 900, the heat generated by them is first transferred downward to the surface of the base 900, and then the heat is continuously transferred upward to the upper shell 201 through the thermal connection between the base 900 and the upper shell 201, and then the heat is dissipated through the upper shell 201.

[0229] In some embodiments, the heat dissipation path is smoother when the first light emitting component 410 and the second light emitting component 420 are disposed on the lower surface of the base 900. Based on this, the first light receiving component 510 and the second light receiving component 520 are located on the upper surface of the base 900, and the first light emitting component 410 and the second light emitting component 420 are located on the lower surface of the base 900.

[0230] In some embodiments, the base 900 may include a protrusion 910. The protrusion 910 protrudes toward the upper housing 201, and the protrusion 910 is thermally connected to the upper housing 201. The protrusion 910 and the upper housing 201 can be thermally connected through a thermally conductive gel or a thermally conductive pad, and the larger spreading surface of the protrusion can increase the heat conduction area between the base and the upper housing 201, thereby improving the heat dissipation effect.

[0231] In some embodiments, the first light receiving component 510 and the second light receiving component 520 are respectively located on both sides of the protrusion 910. The surface where the protrusion is located is protruding relative to the surface supporting the light receiving component.

[0232] In some embodiments, a base mounting portion is formed on the surface of the circuit board 300, and the base is fixed to the surface of the circuit board through the base mounting portion. Exemplarily, the structure of the base mounting portion can be an opening or other structures. The base is embedded in the base mounting portion, so that the base is fixed to the surface of the circuit board 300. In some embodiments, the size of the base along the width direction of the circuit board 300 is larger than the size of the base mounting portion, so that the surfaces on both sides of the base mounting portion can support the base, so that the base is fixed to the surface of the circuit board 300.

[0233] In some embodiments, the base 900 presents different structures, provides bases with different structural forms, and provides optical components with different structural combinations, thereby forming optical modules with different structures.

[0234] In some embodiments, in order to realize the transmission of multiple optical signals, the optical transmission component can emit multiple optical signals. In some embodiments, when emitting multiple optical signals, they can be emitted separately instead of being combined into a beam of optical signals for emission. Exemplarily, multiple optical signals are emitted separately through an optical fiber array, and the laser has a corresponding optical fiber ribbon for transmitting optical signals. In some embodiments, when emitting multiple optical signals, they can be combined into a beam of optical signals for emission. Exemplarily, when combining, combining can be achieved through an optical multiplexing component. Exemplarily, when combining, combining can be achieved through a combination of different filters, and the transmission and reflection characteristics of the filters for specific wavelengths are utilized, so that combining can be achieved by using a combination of multiple filters. Exemplarily, when combining, combining can also be achieved by a combination of different polarization state devices such as polarizers, and the polarization state devices have different transmission characteristics for light in different polarization directions, so that combining can be achieved by using a combination of multiple polarizers. Exemplarily, when combining, combining can also be achieved by a combination of filters and polarizers.

[0235] In some embodiments, in order to realize the reception of multiple optical signals, the optical receiving component may include multiple photodetectors to receive multiple optical signals. In some embodiments, multiple optical signals can be received through an optical fiber array, and then the optical path is turned through an optical path turning device, so that the multiple optical signals are transmitted to multiple photodetectors respectively. When turning the optical path, the optical fiber end face can also be formed into a reflective surface by grinding, so as to realize the change of the optical path. Exemplarily, when the optical fiber end face is formed into a reflective surface by grinding, the optical fiber can be clamped up and down because the optical fiber is soft. At this time, the optical fiber can be extended or not. If the optical fiber is extended, the optical fiber end face can be polished separately. If the optical fiber is not extended, it can be polished together with the upper and lower clamping structures. In some embodiments, a received optical signal can be decomposed into multiple optical signals through an optical demultiplexing component, and then the optical path is turned through an optical path turning device, so that the multiple optical signals are transmitted to multiple photodetectors respectively. In some embodiments, an arrayed waveguide grating (AWG) can be used to decompose a received optical signal into multiple optical signals, and then the optical path is turned, so that the multiple optical signals are transmitted to the photodetector respectively. Among them, after the multiplexed signal light containing multiple wavelengths in the AWG is output through the central input channel waveguide, it is diffracted in the input slab waveguide, reaches the input concave grating for power distribution, and is coupled into the array waveguide area. Because the end face of the array waveguide is located on the circumference of the grating circle, the diffracted light arrives at the end face of the array waveguide with the same phase. After being transmitted through the array waveguide, because the adjacent array waveguides maintain the same length difference ΔL, the output light of a certain wavelength of adjacent array waveguides on the output concave grating has the same phase difference. For light of different wavelengths, this phase difference is different, so light of different wavelengths is diffracted in the output slab waveguide and focused to different output channel waveguide positions. After being output through the output channel waveguide, the wavelength distribution, i.e., demultiplexing function, is completed.

[0236] In some embodiments, multiple optical signals are emitted separately through an optical fiber array, the laser has a corresponding optical fiber ribbon for transmitting the optical signal, and multiple optical signals are received through the optical fiber array. Since the optical emitting component is located on the lower surface of the base and the optical receiving component is located on the upper surface of the base, the optical fiber array for the optical emitting component is located at the bottom, and the optical fiber array for the optical receiving component is located at the top.

[0237] Figure 5A The structure of the first base according to some embodiments Figure 1 , Figure 5B The structure of the first base according to some embodiments Figure 2 .like Figure 5A and Figure 5B As shown, in some embodiments, a base 900a is provided. Figure 5AThe surface structure of the base 900a is shown. Figure 5B Another surface structure of the base 900a is shown. Figure 5A The upper surface structure of the base 900a is shown. Figure 5B The bottom surface structure of the base 900a is shown.

[0238] In some embodiments, the upper surface of the base 900a is used to carry the light receiving component, and the lower surface of the base 900a is used to carry the light emitting component. The light receiving component includes a light receiving passive device, and the light receiving passive device receives the externally transmitted optical signal, thereby transmitting the optical signal to the inside of the light receiving component. Exemplarily, the light receiving passive device can be an optical fiber array, an optical demultiplexing component, or an AWG, etc.

[0239] like Figure 5A As shown, in some embodiments, the base 900a may include a protrusion 910a. The protrusion 910a is located on the upper surface of the base 900a. The light emitting component is located on the lower surface of the base 900a, and the light emitting component generates more heat. The surface of the base 900a protrudes upward to form the protrusion 910a, so as to facilitate the heat dissipation of the light emitting component. Exemplarily, the middle surface of the base 900a protrudes upward to form the protrusion 910a.

[0240] In some embodiments, the protrusion 910a protrudes toward the upper housing 201 and is thermally connected to the upper housing 201 to transfer the heat generated by the light emitting component to the outside of the optical module to achieve better heat dissipation.

[0241] In some embodiments, the base 900a may include a first bearing surface 911a and a second bearing surface 912a. The first bearing surface 911a and the second bearing surface 912a are respectively located on both sides of the protrusion 910a. The surfaces of the first bearing surface 911a and the second bearing surface 912a do not protrude upward. In this way, the upper surface of the base 900a is divided into the protrusion 910a, the first bearing surface 911a and the second bearing surface 912a respectively located on both sides of the protrusion 910a.

[0242] In some embodiments, the base 900a may include an extension portion 913a. The extension portion 913a extends relative to the first bearing surface 911a and the second bearing surface 912a. The extension portion 913a is used to carry an optical path turning device. Exemplarily, the optical path turning device may be a turning prism.

[0243] In some embodiments, in order to avoid electrical components on the surface of the circuit board and correspond to the light receiving passive components, the extension portion 913a includes a first extension portion 9131, a second extension portion 9133, and a gap 9132 located between the first extension portion 9131 and the second extension portion 9133. The gap 9132 is used to avoid electrical components on the circuit board, such as resistors or capacitors. The first extension portion 9131 is located at the end of the first bearing surface 911a and is used to set the first light path turning component in the first light receiving component. The second extension portion 9133 is located at the end of the second bearing surface 912a and is used to set the second light path turning component in the second light receiving component.

[0244] In some embodiments, the first extension portion 9131 is disposed in the light emitting direction of the passive optical receiving device in the first optical receiving component and extends relative to the first bearing surface 911a. The second extension portion 9133 is disposed in the light emitting direction of the passive optical receiving device in the second optical receiving component and extends relative to the second bearing surface 912a.

[0245] In some embodiments, the surfaces of the first extension portion 9131 and the second extension portion 9133 are respectively lower than the surfaces of the first bearing surface 911 a and the second bearing surface 912 a to achieve optical path height matching.

[0246] In some embodiments, the base 900a may include a first limiting platform 914a and a second limiting platform 915a. The first limiting platform 914a and the second limiting platform 915a are located on the upper surface of the base 900a. Exemplarily, the first limiting platform 914a is formed between the first extension portion 9131 and the first bearing surface 911a, and the second limiting platform 915a is formed between the second extension portion 9133 and the second bearing surface 912a.

[0247] In some embodiments, the surface of the first limiting platform 914a is higher than the surface of the first supporting surface 911a. The surface of the second limiting platform 915a is higher than the surface of the second supporting surface 912a.

[0248] like Figure 5B As shown, in some embodiments, the base 900a may include a third bearing surface 921a. The third bearing surface 921a is located on the lower surface of the base 900a.

[0249] In some embodiments, the base 900a may include a fourth bearing surface 922a. The fourth bearing surface 922a is located on the lower surface of the base 900a. The fourth bearing surface 922a is located on one side of the third bearing surface 921a.

[0250] In some embodiments, the base 900a may include a fifth bearing surface 923a. The fifth bearing surface 923a is located on the lower surface of the base 900a. The fifth bearing surface 923a is located on one side of the fourth bearing surface 922a.

[0251] In some embodiments, the surface of the fifth bearing surface 926a is higher than the fourth bearing surface 922a to achieve optical path matching. When processing the base, due to the height difference between the fifth bearing surface 926a and the fourth bearing surface 922a, a chamfer may be formed at the junction of the two. The existence of the chamfer causes the end of the light emitting passive component to be tilted when mounting the light emitting passive component, thereby causing the light emitting passive component to be mounted unevenly and reducing the stability of the emission optical path.

[0252] In some embodiments, the end of the second support portion 925a close to the fifth bearing surface 926a is formed with a notch 9251. The notch 9251 is provided so that the end of the light emitting passive component is horizontally abutted against the wall of the fifth bearing surface 926a, thereby ensuring that the light emitting passive component is mounted flat and the emission light path is stable.

[0253] In some embodiments, the passive light emitting device such as an optical fiber array may be mounted on the fourth bearing surface 922a by glue. If the stress generated by the glue bonding is too concentrated, the bottom surface of the passive light emitting device such as an optical fiber array may be broken.

[0254] In some embodiments, protrusions 927a are formed at intervals on the surface of the fourth bearing surface 922a. The intervals between the protrusions 927a can disperse the stress generated by the glue, thereby avoiding excessive concentration of stress generated during glue bonding, so as to ensure that the light emitting passive device such as the optical fiber array is not damaged during mounting.

[0255] In some embodiments, the surface of the fifth bearing surface 926a is higher than the fourth bearing surface 922a, which can achieve optical path matching and also limit the light emitting passive device such as the optical fiber array in the first direction. Exemplarily, the first direction can be the length direction of the protrusion 910a.

[0256] In some embodiments, the surfaces at both ends of the fifth bearing surface 926a are recessed downward, so that the width of the protruding surface of the fifth bearing surface 926a is the same as the width of the light emitting passive device such as the optical fiber array, thereby limiting the light emitting passive device in the second direction. Exemplarily, the second direction can be the width direction of the protruding portion 910a.

[0257] Figure 5C FIG. 1 is a structural diagram of a circuit board according to some embodiments. Figure 5C As shown, in some embodiments, the circuit board 300 includes a base mounting portion 301. The base 900a can be embedded in the base mounting portion 301, so that the base 900a is fixed to the surface of the circuit board 300.

[0258] In some embodiments, the circuit board 300 is designed to be compatible with different types of light emitting passive components to match different types of light emitting passive components.

[0259] In some embodiments, when the optical emitting passive device is an optical multiplexing component, multiple optical signals emitted by the laser group are combined into one optical signal through the optical multiplexing component. The optical signal is converged by a lens and transmitted to the fiber collimator, and the fiber collimator is connected to a pigtail, through which the optical signal is transmitted. Since the pigtail has a certain rigidity, the pigtail is horizontally output along the port of the fiber collimator, and the output position is close to the surface of the circuit board. However, under the action of the gravity of the pigtail, the pigtail will move downward to the circuit board until it contacts the circuit board, thereby causing interference between the pigtail and the circuit board. In order to avoid interference between the pigtail and the circuit board, the pigtail can be lifted upward to a certain height so that there is a certain gap between the pigtail and the circuit board to avoid mutual interference between the two. When the pigtail is lifted upward, due to the interference between the pigtail and the surface of the circuit board, the pigtail may be broken during the lifting process due to the lack of bending space.

[0260] In some embodiments, when there are two optical multiplexing components, the end surface of the base mounting portion 301 is respectively formed with a first notch portion 302 and a second notch portion 303a. The first notch portion 302 and the second notch portion 303a are arranged at the end of the base mounting portion 301 away from the optical receiving chip. When the pigtail is lifted upward, the first notch portion 302 and the second notch portion 303a are arranged to provide bending space for the pigtail, so that when the pigtail is lifted, the area in the pigtail that interferes with the surface of the circuit board can be bent downward into the first notch portion 302 and the second notch portion 303a, thereby preventing the pigtail from being broken. It can be understood that when the optical emission passive device is an optical fiber array, the fiber outlet position is far away from the surface of the circuit board, and the thread is sufficient for the pigtail to bend when it reaches the surface of the circuit board. Therefore, at this time, two notches are not required to be formed on the end surface of the base mounting portion 301. In the present disclosure, the first notch portion 302 and the second notch portion 303a are respectively formed on the end surface of the base mounting portion 301, so that the circuit board 300 is compatible with different types of optical emission passive devices.

[0261] Figure 5D FIG. 1 is a schematic diagram of the assembly of the first base and the circuit board according to some embodiments. Figure 5D As shown, in some embodiments, a base mounting portion 301 is formed on the surface of the circuit board 300 .

[0262] In some embodiments, first support portions 924a are formed on both sides of the base 900a. In some embodiments, the first support portions 924a on both sides of the base 900a are embedded in the base mounting portion 301, and the outward side surfaces of the first support portions 924a are respectively attached to the surface of the circuit board 300, thereby fixing the base 900a to the surface of the circuit board 300, and realizing a fixed connection between the base 900a and the circuit board 300.

[0263] Fig. 6A The structure of the second base according to some embodiments Figure 1 , Figure 6B The structure of the second base according to some embodiments Figure 2 .like Fig. 6A and Figure 6B As shown, in some embodiments, the light receiving component and the light emitting component are arranged on different surfaces of the same base, wherein the base may be base 900b. Fig. 6A The structure of one surface of the base 900b is shown. Figure 6B The structure of the other surface of the base 900b is shown. For example, Fig. 6A The surface shown in FIG. 1 is the upper surface of the base 900b. Figure 6B The unfolded surface is the lower surface of the base 900b.

[0264] In some embodiments, the light receiving component and the light emitting component are respectively disposed on different surfaces of the base 900b. For example, the upper surface of the base 900b is used to carry the light receiving component, and the lower surface is used to carry the light emitting component.

[0265] like Fig. 6A As shown, in some embodiments, the base 900b may include a protrusion 914b. The protrusion 914b protrudes toward the upper housing 201 and is thermally connected to the upper housing 201 to dissipate heat of the device.

[0266] In some embodiments, the upper surface of the protrusion 914b protrudes upward relative to the upper surface of the base 900b, and one end of the protrusion 914b protrudes from the side wall of the base 900b. The first light receiving passive component is located on one side of the first side wall 9141 of the protrusion 914b, and the second light receiving passive component is located on one side of the second side wall 9142 of the protrusion 914b. The second side wall 9142 is located on the opposite side of the first side wall 9141.

[0267] In some embodiments, the base 900b may include a first notch 911b. The edge of the first notch 911b defines the light receiving passive component in the length direction.

[0268] In some embodiments, the base 900b may include a second notch 912b, and the edge of the second notch 912b defines the light receiving passive component in the length direction.

[0269] In some embodiments, the base 900 b may include a third notch 913 b . The third notch 913 b is provided to facilitate positioning and observation during the installation process of the base 900 b and the circuit board 300 .

[0270] like Figure 6B As shown, in some embodiments, the base 900b may include a first recessed portion 915b. The first recessed portion 915b is located on the lower surface of the base 900b. The lower surface of the base 900b is in contact with the upper surface of the circuit board. The bottom surface of the first recessed portion 915b is recessed relative to the lower surface of the base 900b to minimize the electrical connection line between the light emitting component and the circuit board.

[0271] In some embodiments, the first recessed portion 915b is connected to the third notch 913b, so as to facilitate observation and positioning from the third notch 913b during installation.

[0272] Figure 6C FIG. 1 is a schematic diagram of assembling a second base and a circuit board according to some embodiments. Figure 6C As shown, in some embodiments, the base mounting portion 303 is a hollow structure of the circuit board 300 .

[0273] In some embodiments, the base mounting portion 303 includes a first mounting portion 3031 and a second mounting portion 3032. The width of the second mounting portion 3032 is greater than the width of the first mounting portion 3031. The first mounting portion 3031 is adjacent to the optical port position, and the second mounting portion 3032 is adjacent to the electrical port position. A DSP chip is disposed on the upper surface of the circuit board 300, the light receiving component is disposed on the upper surface of the base 900b, and the light emitting component is disposed on the lower surface of the base 900b.

[0274] In some embodiments, the width of the base 900b is greater than the width of the second mounting portion 3032, and the base 900b is located on the upper surface of the circuit board 300. The base 900b covers the second mounting portion 3032.

[0275] In some embodiments, the base 900b does not completely cover the first installation portion 3031, and a gap of part of the first installation portion 3031 is left between the circuit board and the base 900b to facilitate the clamping and installation of the optical fiber connector.

[0276] In some embodiments, to shorten the connection between the optical emission component and the circuit board, the pins of the optical emission component are flush with the lower surface of the circuit board. To achieve avoidance installation of the optical emission component, the first recessed portion 915b is located at the second installation position 3032.

[0277] Fig. 7A The structure of the third base according to some embodiments is Figure 1 , Figure 7B The structure of the third base according to some embodiments is Figure 2 .like Fig. 7A and Figure 7B As shown, in some embodiments, the light receiving component and the light emitting component are arranged on different surfaces of the same base, wherein the base may be base 900c. Fig. 7A The structure of one surface of the base 900c is shown. Figure 7B Another surface structure of the base 900c is shown. Fig. 7A The surface shown in FIG. 1 is the upper surface of the base 900c. Figure 7B The surface shown in is the lower surface of the base 900c.

[0278] In some embodiments, the upper surface of the base 900c is used to carry the light receiving component, and the lower surface is used to carry the light emitting component.

[0279] like Fig. 7A As shown, in some embodiments, the base 900c may include a protrusion 914c. The protrusion 914c protrudes toward the upper housing 201 and is thermally connected to the upper housing 201 to dissipate heat of the device.

[0280] In some embodiments, the base 900c may include a first bearing surface 911c, a second bearing surface 912c, and a third bearing surface 913c. The first bearing surface 911c, the second bearing surface 912c, and the third bearing surface 913c are located on the side of the protrusion 914c. Exemplarily, the first bearing surface 911c and the second bearing surface 912c are respectively located on both sides of the length direction of the protrusion 914c, and the third bearing surface 913c is located on one side of the width direction of the protrusion 914c. The surfaces where the first bearing surface 911c, the second bearing surface 912c, and the third bearing surface 913c are located are all lower than the surface of the protrusion 914c. The second bearing surface 912c is on the opposite side to the first bearing surface 911c, and the third bearing surface 913c is on the adjacent side to the first bearing surface 911c.

[0281] like Figure 7B As shown, in some embodiments, the bottom surface of the base 900c is respectively formed with a fourth bearing surface 921c, a fifth bearing surface 922c and a sixth bearing surface 923c. The fifth bearing surface 922c is disposed between the fourth bearing surface 921c and the sixth bearing surface 923c.

[0282] In some embodiments, the fifth bearing surface 922c is provided with limiting portions 924c on both sides thereof. For example, the surface of the limiting portion 924c protrudes relative to the surface of the fifth bearing surface 922c, and the structure of the limiting portion 924c can be a limiting boss, thereby limiting and fixing the optical multiplexing component.

[0283] Figure 7C FIG. 1 is a structural diagram of another circuit board according to some embodiments. Figure 7C As shown, in some embodiments, a light receiving chip 515c and a light receiving chip 525c are respectively disposed on the surface of the circuit board 300. The light receiving directions of the two light receiving chips are perpendicular to the surface of the circuit board.

[0284] In some embodiments, in order to fix the base 900c to the surface of the circuit board 300, a base mounting portion 301 is formed on the surface of the circuit board 300. For example, the base mounting portion 301 can be a through-hole structure. The base 900c is embedded in the base mounting portion 301, thereby achieving a fixed connection between the base 900c and the circuit board 300.

[0285] Fig.7D FIG. 1 is an assembly diagram of a third base and a circuit board according to some embodiments. Fig.7D As shown, in some embodiments, a base mounting portion 301 is formed on the surface of the circuit board 300. Exemplarily, the base mounting portion 301 may be a through-hole structure. The limiting portion 924c of the base 900c is embedded in the base mounting portion 301, and the surface of the limiting portion 924c facing outward is mounted on the surface of the circuit board 300, thereby achieving a fixed connection between the base 900c and the circuit board 300.

[0286] Figure 8 FIG. 4 is a structural diagram of a fourth base according to some embodiments. Figure 8 As shown, in some embodiments, the light receiving component and the light emitting component are arranged on different surfaces of the same base, wherein the base may be base 900d. Figure 8 The upper surface structure of the base 900d is shown, and the lower surface structure of the base 900d can refer to the lower surface structure of the above-mentioned base 900c.

[0287] In some embodiments, the base 900d may include a protrusion 914d. The upper surface of the base 900d protrudes upward to form a protrusion 914d. The protrusion 914d is in contact with the upper housing to achieve heat dissipation of the optical device. The protrusion 914d protrudes toward the upper housing 201 and is thermally connected to the upper housing 201 to dissipate heat from the device.

[0288] In some embodiments, a first bearing surface 911d and a second bearing surface 913d are formed on one side of the protrusion 914d. The surface of the second bearing surface 913d is lower than the surface of the first bearing surface 911d to match the optical path between the optical components. A third bearing surface 912d and a fourth bearing surface 915d are formed on the other side of the protrusion 914d. The surface of the fourth bearing surface 915d is lower than the surface of the third bearing surface 912d to match the optical path between the optical components.

[0289] Fig. 9 FIG. 4 is a structural diagram of a fifth base according to some embodiments. Fig. 9 As shown, in some embodiments, the light receiving component and the light emitting component are arranged on different surfaces of the same base, wherein the base may be base 900e. Fig. 9 The upper surface structure of the base 900e is shown, and the lower surface structure of the base 900e can refer to the lower surface structure of the above-mentioned base 900c.

[0290] In some embodiments, the base 900e may include a protrusion 914e. The upper surface of the base 900e protrudes upward to form a protrusion 914e. The protrusion 914e is in contact with the upper housing to achieve heat dissipation of the light emitting component. The protrusion 914e protrudes toward the upper housing 201 and is thermally connected to the upper housing 201 to perform heat dissipation of the device.

[0291] In some embodiments, a first bearing surface 911e and a second bearing surface 912e are formed on one side of the protrusion 914e. In order to facilitate the positioning of the optical device, the end surfaces of the first bearing surface 911e and the second bearing surface 912e can be flush with the end surface of the protrusion 914e. The surface of the protrusion 914e is relatively protruding from the first bearing surface 911e and the second bearing surface 912e.

[0292] In some embodiments, a first light receiving component is disposed on the surface of the first bearing surface 911e, and a second light receiving component is disposed on the surface of the second bearing surface 912e, so as to realize the reception of multiple optical signals.

[0293] Fig. 10A Another base structure according to some embodiments Figure 1 .like Fig. 10A As shown, in some embodiments, a base 900f is provided. Fig. 10A The figure shows a surface structure diagram of the base 900f. Fig. 10A Shown is a structural diagram of the upper surface of the base 900f.

[0294] In some embodiments, the base 900f may include a protrusion 910f. The upper surface of the base 900f is formed with the protrusion 910f. The protrusion 910f protrudes toward the upper housing 201 and is thermally connected to the upper housing 201 to dissipate heat of the device.

[0295] In some embodiments, the base 900f may include a first support surface 920f. The first support surface 920f is formed on the upper surface of the base 900f. The first support surface 920f is located on one side of the raised portion 910f. The surface of the raised portion 910f is higher than the surface of the first support surface 920f.

[0296] In some embodiments, the base 900f may include a second support surface 930f. The second support surface 930f is formed on the upper surface of the base 900f. The second support surface 930f is located on the other side of the raised portion 910f. The surface of the raised portion 910f is higher than the surface of the second support surface 930f.

[0297] In some embodiments, a first groove portion 921f is formed on the surface of the first supporting surface 920f.

[0298] In some embodiments, a second groove portion 931f is formed on the surface of the second supporting surface 930f.

[0299] Fig. 10B Another base structure according to some embodiments Figure 2 .like Fig. 10B As shown, in some embodiments, Fig. 10B FIG. 9 is another surface structure diagram of the base 900f. Fig. 10B Shown is a structural diagram of the lower surface of the base 900f.

[0300] In some embodiments, the base 900f may include a third support surface 940f. The third support surface 940f is formed on the lower surface of the base 900f. The third support surface 940f is located at one end of the base 900f.

[0301] In some embodiments, the base 900f may include a fourth support surface 950f. The fourth support surface 950f is formed on the lower surface of the base 900f and is located on one side of the third support surface 940f.

[0302] In some embodiments, the base 900f may include a fifth support surface 960f. The lower surface of the base 900f is formed with the fifth support surface 960f. The fifth support surface 960f is located on one side of the third support surface 940f. The fifth support surface 960f and the fourth support surface 950f may be arranged side by side on one side of the third support surface 940f.

[0303] In some embodiments, the base 900f may include a sixth supporting surface 970f. The lower surface of the base 900f is formed with the sixth supporting surface 970f. The sixth supporting surface 970f is located on one side of the fourth supporting surface 950f.

[0304] In some embodiments, the base 900f may include a bearing boss 980f. The lower surface of the base 900f is formed with a bearing boss 980f. The bearing boss 980f is located on one side of the sixth supporting surface 970f.

[0305] In some embodiments, the base 900f may include a limiting boss 990f. The limiting boss 990f is formed on the lower surface of the base 900f. The limiting boss 990f is located on one side of the fifth supporting surface 960f.

[0306] Fig.11A is an assembly structure diagram of a light receiving component according to some embodiments, Fig. 11B FIG. 1 is an exploded view of an optical receiving component according to some embodiments. Fig.11A and Fig. 11B As shown, in some embodiments, taking the base as the base 900a as an example, the base 900a is embedded in the surface of the circuit board 300. Different surfaces of the base 900a are used to set the light receiving component and the light emitting component. Exemplarily, the upper surface of the base 900a is used to set the light receiving component 500a, and the lower surface is used to set the light emitting component 400a. The "upper surface" refers to the attached Fig. 10A The "lower surface" shown is the surface opposite to the upper surface. It is understandable that the light receiving component 500a can also be arranged on the lower surface of the base 900a, and the light emitting component 400a can also be arranged on the upper surface of the base 900a.

[0307] In some embodiments, the surface of the base 900a is covered with a first protective cover 530a to protect the optical device in the light receiving component 500a disposed on the surface of the base 900a. Exemplarily, when part of the optical device in the light receiving component is disposed on the upper surface of the base 900a, the upper surface of the base 900a is covered with a first protective cover 530a.

[0308] In some embodiments, the base 900a may include a protrusion 910a. The surface of the base 900a protrudes upward to form the protrusion 910a. A first light receiving component 510a is provided on one side of the protrusion 910a, and a second light receiving component 520a is provided on the other side of the protrusion 910a to achieve reception of multiple optical signals.

[0309] In some embodiments, the first protective cover 530a has a first notch 531a and a second notch 532a. The first notch 531a is used to avoid the protrusion 910a, and the second notch 532a is used to avoid electrical components on the surface of the circuit board 300, such as capacitors, resistors, etc. The first notch 531a faces the protrusion 910a and is connected to the end of the protrusion 910a to avoid the protrusion 910a. The second notch 532a faces the circuit board to avoid electrical components on the surface of the circuit board 300.

[0310] Fig.12 FIG. 4 is a cross-sectional structural diagram of a light receiving component according to some embodiments. Fig.12 As shown, the protrusion 910 a protrudes upward to be thermally connected to the upper housing 201 .

[0311] In some embodiments, a first bearing surface 911a is formed on one side of the protrusion 910a. A first light receiving passive component is disposed on the surface of the first bearing surface 911a. The first light receiving passive component may be a first optical fiber array 511a.

[0312] In some embodiments, a second bearing surface 912a is formed on the other side of the protrusion 910a. A second light receiving passive component is disposed on the surface of the second bearing surface 912a to achieve multi-path optical signal reception. The second light receiving passive component may be a second optical fiber array 521a.

[0313] In some embodiments, a first extending portion 9131 is formed at an end of the first bearing surface 911 a , and a second extending portion 9133 is formed at an end surface of the second bearing surface 912 a .

[0314] In some embodiments, the first light receiving component 510a may include a first optical fiber array 511a. The optical signal transmission direction of the first optical fiber array 511a is parallel to the surface of the circuit board 300.

[0315] In some embodiments, the second light receiving component 520a may include a second optical fiber array 521a. The optical signal transmission direction of the second optical fiber array 521a is parallel to the surface of the circuit board 300.

[0316] In some embodiments, the first light receiving component 510 a may include a first turning prism 5124 to adjust the transmission direction of the optical signal received by the first optical fiber array 511 a from parallel to the surface of the circuit board 300 to perpendicular to the surface of the circuit board 300 .

[0317] In some embodiments, the second light receiving component 520a may include a second turning prism 5124a to adjust the transmission direction of the optical signal received by the second optical fiber array 521a from parallel to the surface of the circuit board 300 to perpendicular to the surface of the circuit board.

[0318] In some embodiments, a lens, such as a convergent lens, is disposed in the light incident direction of the first turning prism 5124 and the second turning prism 5124a to improve light coupling efficiency. The structure including the lens and the first turning prism or the second turning prism is described as a lens assembly.

[0319] In some embodiments, a first lens assembly 512a is disposed in the light emitting direction of the first optical fiber array 511a. The first lens assembly 512a includes a first converging lens 5123 and a first turning prism 5124.

[0320] In some embodiments, a second lens assembly 522a is disposed in the light emitting direction of the second optical fiber array 521a. The second lens assembly 522a includes a second converging lens 5123a and a second turning prism 5124a.

[0321] In some embodiments, the first optical fiber array 511a is disposed on the first bearing surface 911a, and the first lens assembly 512a is disposed on the first extension portion 9131. The second optical fiber array 521a is disposed on the second bearing surface 912a, and the second lens assembly 522a is disposed on the second extension portion 9133.

[0322] In some embodiments, the first light receiving component 510 a may include a light receiving chip 513 a and a transimpedance amplifier 514 a . The light receiving chip 513 a and the transimpedance amplifier 514 a are located on the surface of the circuit board 300 .

[0323] In some embodiments, the optical receiving chip 513a may be arranged in an array. The optical receiving chip 513a is used to convert an optical signal into an electrical signal. The optical receiving chip 513a is electrically connected to a transimpedance amplifier 514a to amplify the electrical signal through the transimpedance amplifier 514a.

[0324] In some embodiments, the first turning prism 5124 adjusts the transmission direction of the optical signal received by the first optical fiber array 511a from parallel to the surface of the circuit board 300 to perpendicular to the surface of the circuit board 300, thereby coupling the optical signal to the photosensitive surface of the optical receiving chip 513a. The light receiving direction of the optical receiving chip 513a is perpendicular to the surface of the circuit board 300.

[0325] In some embodiments, the light receiving chip 513a and the transimpedance amplifier 514a can be connected by wire bonding to achieve electrical connection between the two. The surface of the light receiving chip 513a has a first connecting pad, and the surface also has a photosensitive surface. The first connecting pad of the light receiving chip and the photosensitive surface are located on the same surface. The surface of the transimpedance amplifier has a second connecting pad, and the first connecting pad and the second connecting pad are connected by wire bonding to achieve electrical connection between the two. The photosensitive surface and the first connecting pad of the light receiving chip 513a are both facing upward, and the photosensitive surface is exposed to the air. In order to reduce the reflection of the light signal into the air and allow more light signals to be absorbed into the photosensitive surface, the surface of the photosensitive surface will be coated with an anti-reflection film, and the refractive index of the anti-reflection film is greater than the refractive index of the air, so that more light signals are transmitted to the photosensitive surface to ensure the light receiving power.

[0326] Fig.13 The figure is a schematic diagram of electrical connection between an optical receiving chip and a transimpedance amplifier according to some embodiments. Fig.13 Another way of electrically connecting the optical receiving chip and the transimpedance amplifier is shown in FIG. Fig.13 As shown, in some embodiments, the transimpedance amplifier 514a is disposed on the surface of the circuit board 300, and the first connecting pad on the surface of the optical receiving chip 513a is welded together with the second connecting pad on the surface of the transimpedance amplifier 514a, thereby realizing electrical connection between the optical receiving chip 513a and the transimpedance amplifier 514a.

[0327] In some embodiments, the light receiving chip 513a is attached upside down on the surface of the transimpedance amplifier 514a, and the photosensitive surface of the light receiving chip 513a is set downward. In order to transmit the light signal to the photosensitive surface, a lens is provided on the surface of the light receiving chip 513a exposed to the air, and an optical through hole can be formed between the lens and the photosensitive surface, and the light signal is transmitted to the photosensitive surface through the optical through hole, thereby realizing the reception of the light signal. By flip-chip soldering the light receiving chip 513a on the transimpedance amplifier 514a, the parasitic effects generated during the wire bonding connection can be avoided, and the signal transmission performance can be improved; at the same time, since the photosensitive surface of the light receiving chip 513a is not exposed to the air, the light signal is reduced from being reflected into the air, thereby ensuring the light receiving power.

[0328] In some embodiments, a second connecting pad is provided on the surface of the transimpedance amplifier 514a, the photosensitive surface of the light receiving chip 513a is set upward, and then bonded to the surface of the second connecting pad by glue, and the first connecting pad and the second connecting pad are electrically connected through metal vias, thereby realizing electrical connection between the light receiving chip 513a and the transimpedance amplifier 514a.

[0329] Fig.14 is a structural diagram of a light receiving component according to some embodiments, Fig.15 is an exploded view of a light receiving component according to some embodiments, Fig.16 FIG. 4 is a structural diagram of a lens assembly according to some embodiments. Figure 14-16 As shown, in some embodiments, the middle surface of the base 900a protrudes upward to form a protrusion 910a.

[0330] In some embodiments, one side of the protrusion 910a is used to set the first light receiving component 510a, and the other side is used to set the second light receiving component 520a, so as to achieve the reception of multiple optical signals.

[0331] In some embodiments, the surfaces on both sides of the protrusion 910a respectively form a first bearing surface 911a and a second bearing surface 912a. The first bearing surface 911a is used to bear the first optical fiber array 511a. The second bearing surface 912a is used to bear the second optical fiber array 521a.

[0332] In some embodiments, the base 900a may include an extension portion 913a. The extension portion 913a extends relative to the first supporting surface 911a and the second supporting surface 912a.

[0333] In some embodiments, the extension portion 913a includes a first extension portion 9131, a second extension portion 9133, and a notch 9132 between the first extension portion 9131 and the second extension portion 9133. The notch 9132 is used to avoid electrical components on the circuit board 300, such as resistors or capacitors.

[0334] In some embodiments, one end of the first supporting surface 911 a is extended to form a first extending portion 9131 , and one end of the second supporting surface 912 a is extended to form a second extending portion 9133 .

[0335] In some embodiments, the first extension portion 9131 is located at the end of the first bearing surface 911a. The first extension portion 9131 is used to carry the first lens assembly 512a. The first lens assembly 512a is used to turn the optical signal received by the first optical fiber array 511a toward the surface of the circuit board 300, thereby transmitting the optical signal to the surface of the optical receiving chip.

[0336] In some embodiments, the second extension portion 9133 is located at the end of the second bearing surface 912a. The second extension portion 9133 is used to carry the second lens assembly 522a, and the second lens assembly 522a is used to turn the optical signal received by the second optical fiber array 521a toward the surface of the circuit board 300, so as to transmit the optical signal to the surface of the optical receiving chip.

[0337] In some embodiments, the first extension portion 9131 is disposed in the light emitting direction of the first optical fiber array 511a and extends relative to the first supporting surface 911a. The second extension portion 9133 is disposed in the light emitting direction of the second optical fiber array 521a and extends relative to the second supporting surface 912a.

[0338] In some embodiments, in order to limit the first optical fiber array 511a and the second optical fiber array 521a respectively, a first limiting platform 914a is formed between the first extension portion 9131 and the first supporting surface 911a, and a second limiting platform 915a is formed between the second extension portion 9133 and the second supporting surface 912a.

[0339] In some embodiments, the surface of the first limiting platform 914a is higher than the surface of the first bearing surface 911a, so as to limit the first optical fiber array 511a in the first direction. The surface of the second limiting platform 915a is higher than the surface of the second bearing surface 912a, so as to limit the second optical fiber array 521a in the first direction. Exemplarily, the first direction can be along the length direction of the raised portion 910a. The width of the two limiting platforms is the same as the width of the corresponding optical fiber array, so as to limit the first optical fiber array 511a and the second optical fiber array 521a in the second direction. Exemplarily, the second direction can be along the width direction of the raised portion 910a.

[0340] In some embodiments, since the surface of the first limit platform 914a is higher than the surface of the first bearing surface 911a, and the surface of the second limit platform 915a is higher than the surface of the second bearing surface 912a, a chamfer is formed at the junction of the limit platform and the corresponding bearing surface when processing the base. The existence of the chamfer causes the end of the first optical fiber array 511a or the second optical fiber array 521a to be lifted up at the chamfer position when mounting the first optical fiber array 511a or the second optical fiber array 521a, thereby causing the first optical fiber array 511a or the second optical fiber array 521a to be mounted unevenly, thereby reducing the stability of the receiving optical path. To this end, a first depressed portion 916a is formed at the junction of the first limit platform 914a and the first bearing surface 911a, and a second depressed portion 917a is formed at the junction of the second limit platform 915a and the second bearing surface 912a.

[0341] In some embodiments, the first recessed portion 916a is provided so that the end of the first optical fiber array 511a is horizontally abutted against the wall surface of the first limiting platform 914a, thereby ensuring that the first optical fiber array 511a is mounted flatly. Similarly, the second recessed portion 917a is provided so that the end surface of the second optical fiber array 521a is horizontally abutted against the wall surface of the second limiting platform 915a, thereby ensuring that the second optical fiber array 521a is mounted flatly.

[0342] In some embodiments, the surface of the first recessed portion 916a is gradually inclined toward the wall of the first limit platform 914a, and the surface of the second recessed portion 917a is gradually inclined toward the wall of the second limit platform 915a, so that the surface of one end of the first recessed portion 916a and the second recessed portion 917a close to the corresponding limit platform is recessed to avoid interference with the first optical fiber array 511a or the second optical fiber array 521a, thereby ensuring that the first optical fiber array 511a or the second optical fiber array 521a is mounted flatly, thereby ensuring the stability of the receiving optical path.

[0343] In some embodiments, the first lens assembly 512a is disposed on the surface of the first extension portion 9131, and the second lens assembly 522a is disposed on the surface of the second extension portion 9133. In order to make the optical paths of the first lens assembly 512a and the first optical fiber array 511a at the same height, the surface of the first extension portion 9131 is lower than the surface of the first bearing surface 911a; similarly, the surface of the second extension portion 9133 is lower than the surface of the second bearing surface 912a.

[0344] In some embodiments, the first lens assembly 512a includes a first substrate 5121, a backing plate 5122, a first converging lens 5123, and a first turning prism 5124. Correspondingly, the second lens assembly 522a also includes the same optical components as above.

[0345] In some embodiments, in order to facilitate mounting the light receiving chip array on the surface of the circuit board 300, the extension lengths of the first extension portion 9131 and the second extension portion 9133 expose the light receiving chip array. The first turning prism 5124 is disposed on the surface of the first extension portion 9131 through the first substrate 5121. The extension length of the first substrate 5121 is longer than the extension length of the first extension portion 9131, so as to extend the first turning prism 5124 to the surface of the light receiving chip array. Similarly, the second turning prism in the second lens assembly 522a is disposed on the surface of the second extension portion 9133 through the second substrate. The extension length of the second substrate is longer than the extension length of the second extension portion, so as to extend the second turning prism to the surface of the light receiving chip array.

[0346] In some embodiments, the optical receiving chip and TIA are mounted on the surface of the circuit board 300 below the first extension 9131 and the second extension 9133. To facilitate mounting of the optical receiving chip and the TIA, the length of the first extension 9131 and the second extension 9133 cannot be too long, otherwise it will increase the difficulty of mounting the optical receiving chip and the TIA. Exemplarily, the length of the first extension 9131 and the second extension 9133 is extended so that the optical receiving chip and the TIA are exposed, so as to facilitate mounting of the optical receiving chip and the TIA.

[0347] In some embodiments, one end of the first substrate 5121 is used to support the pad 5122, and the pad 5122 is used to support the first converging lens 5123. The other end of the first substrate 5121 is used to support the turning prism 5124. At the same time, the length of the first substrate 5121 is longer than the length of the first extension portion 9131 and the second extension portion, so that the first turning prism 5124 is extended to the top of the optical receiving chip and the TIA.

[0348] In some embodiments, in order to allow the light output by the first turning prism 5124 to be transmitted to the surface of the light receiving chip, the support surface of the first substrate 5121 used to support the turning prism 5124 has a light-transmitting opening, so that the light output by the first turning prism 5124 can reach the surface of the light receiving chip through the light-transmitting opening. Exemplarily, the support surface of the first substrate 5121 used to support the first turning prism 5124 is set in a U shape, the arms on both sides of the U-shaped support surface are used to support the first turning prism 5124, and the opening in the middle of the U-shaped support surface is the light-transmitting opening, so that the light output by the first turning prism 5124 can reach the surface of the light receiving chip through the light-transmitting opening.

[0349] In some embodiments, the first substrate 5121 carries the first turning prism 5124, so that the first turning prism 5124 extends above the optical receiving chip and the TIA. The pad 5122 carries the first converging lens 5123, so that the optical path of the first converging lens 5123 matches the optical path of the first turning prism 5124.

[0350] In some embodiments, the end surface of the pad 5122 facing the first turning prism 5124 is supported and connected to the first turning prism 5124 , and the end surface of the pad 5122 facing the first turning prism 5124 can be used to limit and fix the first turning prism 5124 .

[0351] Fig.17 is a schematic diagram of assembling another light receiving component according to some embodiments, Fig.18 is a schematic structural diagram of another light receiving component according to some embodiments, Fig.19 FIG. 2 is a schematic diagram of another exploded view of a light receiving component according to some embodiments. Figure 17-Figure 19 As shown, in some embodiments, taking the base as the base 900b as an example, the circuit board 300 is provided with a base mounting portion 303, and the base 900b is located above the base mounting portion 303. The light receiving component is located above the base 900b, and the light emitting component is located below the base 900b.

[0352] In some embodiments, a protrusion 914b is formed on the surface of the base 900b, and the protrusion 914b is thermally connected to the upper housing 201, thereby facilitating heat dissipation of the optical device.

[0353] In some embodiments, a first light receiving component 510b is provided on one side of the protrusion 914b, and a second light receiving component 520b is provided on the other side to achieve reception of multiple optical signals. The first light receiving component 510b and the second light receiving component 520b are provided on the same surface of the base. Exemplarily, the first light receiving component 510b and the second light receiving component 520b are provided on the upper surface of the base.

[0354] In some embodiments, the first light receiving component 510b includes: a first light collimator 511b, a first demultiplexer 512b, a first lens assembly 513b, a first optical chipset group 514b, and a first transimpedance amplifier 515b. The first light collimator 511b and the first demultiplexer 512b are located on the upper surface of the base 900b and on the side of the first side wall 9141 of the raised portion 914b. The first lens assembly 513b, the first optical chipset group 514b, and the first transimpedance amplifier 515b are located on the upper surface of the circuit board 300.

[0355] In some embodiments, in order to facilitate assembly, the first side wall 9141 forms a position for the first light collimator 511b and the first demultiplexer 512b, and the first light collimator 511b and the first demultiplexer 512b are connected to the upper surface of the base 900b. The first lens assembly 513b includes: a first coupling substrate, a first converging lens group and a first reflecting prism. The first coupling substrate is located on the upper surface of the circuit board, and provides a suitable installation height for the first converging lens group and the first reflecting prism, so that the height of the central axis of the first converging lens group and the first reflecting prism is consistent with the height of the first light collimator 511b and the first demultiplexer 512b, so as to achieve optical path coupling.

[0356] In some embodiments, the first optical collimator 511b is connected to the optical fiber adapter through an optical fiber, receives the signal light from the outside and collimates the signal light. The first demultiplexer 512b demultiplexes the signal light from the first optical collimator 511b to form signal lights with different wavelengths. The first converging lens group converges the demultiplexed signal light, and the first reflecting prism reflects the converged light to the first optical chip group 514b, which converts the optical signal into an electrical signal and transmits it to the first transimpedance amplifier 515b.

[0357] In some embodiments, the second light receiving component 520b includes: a second light collimator 521b, a second demultiplexer 522b, a second lens assembly 523b, a second optical chipset group 524b, and a second transimpedance amplifier 525b. The second light collimator 521b and the second demultiplexer 522b are located on the upper surface of the base 900b and on one side of the second side wall 9142 of the raised portion 914b. The second lens assembly 523b, the second optical chipset group 524b, and the second transimpedance amplifier 525b are located on the upper surface of the circuit board 300.

[0358] In some embodiments, in order to facilitate assembly, the second side wall 9142 forms a position for the second demultiplexer 522b, and the second optical collimator 521b and the second demultiplexer 522b are connected to the upper surface of the base 900b. In order to unify the optical center axis of the second optical collimator 521b, the second demultiplexer 522b, and the second lens assembly, the second lens assembly 523b includes: a second coupling substrate, a second converging lens group, and a second reflecting prism. The second coupling substrate is located on the upper surface of the circuit board, and provides a mounting platform for the second converging lens group and the second reflecting prism, so that the height of the center axis of the second converging lens group and the second reflecting prism is consistent with the height of the second optical collimator 521b and the second demultiplexer 522b, so as to achieve optical path coupling.

[0359] In some embodiments, the second optical collimator 521b is connected to the optical fiber adapter through an optical fiber, receives the signal light from the outside and collimates the signal light. The second demultiplexer 522b demultiplexes the signal light from the second optical collimator 521b to form signal lights with different wavelengths. The second converging lens group converges the demultiplexed signal light, and the second reflecting prism reflects the converged light to the second optical chip group 524b. The second optical chip group 524b converts the optical signal into an electrical signal and transmits it to the second transimpedance amplifier 525b.

[0360] In some embodiments, the first converging lens group and the second converging lens group may be disposed on a base or on a circuit board.

[0361] In some embodiments, the surface of the base 900b may also be covered with a first protective cover to protect the light receiving component disposed on the surface of the base 900a. For example, when part of the optical device in the light receiving component is disposed on the upper surface of the base 900b, the upper surface of the base 900b is covered with a first protective cover to protect the optical device.

[0362] Fig. 20 is an assembly structure diagram of another light receiving component according to some embodiments; Fig.21 is a schematic structural diagram of another light receiving component according to some embodiments; Fig. 22is a schematic diagram of an exploded view of another light receiving component according to some embodiments; Figure 20-22 As shown, in some embodiments, taking the base as the base 900c as an example, the light receiving component 500c and the light emitting component 400c are respectively located on different surfaces of the base 900c. Exemplarily, the light receiving component 500c is located on the upper surface of the base 900c, and the light emitting component 400c is located on the lower surface of the base 900c. The circuit board 300 is provided with a base mounting portion 303, and the base 900c is located above the base mounting portion 303.

[0363] In some embodiments, the light receiving component 500c and the light emitting component 400c are respectively located on different surfaces of the base 900c.

[0364] In some embodiments, the upper surface of the base 900c protrudes upward to form a protrusion 914c. The contact between the protrusion 914c and the upper housing is used to dissipate heat for the optical device.

[0365] In some embodiments, the upper surface of the base 900c further includes a first bearing surface 911c, a second bearing surface 912c, and a third bearing surface 913c located on different sides of the protrusion 914c. Exemplarily, the first bearing surface 911c and the second bearing surface 912c are respectively located on both sides of the protrusion 914c in the length direction, and the third bearing surface 913c is located on one side of the protrusion 914c in the width direction. The surfaces where the first bearing surface 911c, the second bearing surface 912c, and the third bearing surface 913c are located are all lower than the surface of the protrusion 914c.

[0366] In some embodiments, in order to achieve multi-path reception, a first light receiving component is disposed on one side of the protrusion 914c, and a second light receiving component is disposed on the other side of the protrusion 914c.

[0367] In some embodiments, taking the optical receiving passive components in the first optical receiving component and the second optical receiving component as arrayed waveguide gratings (AWG) as an example, the first optical receiving component may include a first AWG511c, and the second optical receiving component may include a second AWG521c.

[0368] In some embodiments, a first AWG 511c is disposed on the surface of the first bearing surface 911c, and a second AWG 521c is disposed on the surface of the second bearing surface 912c.

[0369] In some embodiments, Fig.21 and Fig. 22As shown, taking the example that the first AWG511c and the second AWG521c can be vertically placed on the corresponding supporting surfaces respectively, and the light-emitting end faces of the first AWG511c and the second AWG521c do not have a reflective surface, the first light receiving component is located on one side of the protrusion 914c, and the second light receiving component is located on the other side of the protrusion 914c, so as to realize the reception of multiple optical signals.

[0370] In some embodiments, the first light receiving component includes a first AWG 511 c , a first reflector 513 c , a first turning prism 514 c , and a light receiving chip disposed on the surface of the circuit board.

[0371] In some embodiments, in order to improve the optical coupling efficiency, a first lens 512c is further disposed between the light emitting end surface of the first AWG 511c and the first reflector 513c.

[0372] In some embodiments, the optical signals demultiplexed by the first AWG511c are converged by the first lens 512c and then reflected by the first reflector 513c into the first turning prism 514c. The first reflector 513c reflects the optical signal toward the light-entering end face of the first turning prism 514c. The first turning prism 514c turns the optical path of the received optical signal perpendicular to the surface of the circuit board to transmit the optical signals to the optical receiving chip on the surface of the circuit board 300. The light-entering end face and the light-emitting end face of the first turning prism 514c are located on two adjacent sides. The first reflector 513c is provided at the light-entering end face of the first turning prism 514c, and the light-emitting end face is provided below the light-emitting end face.

[0373] In some embodiments, the second light receiving component includes a second AWG521c, a second reflector 523c, a second turning prism 524c, and a light receiving chip disposed on the surface of the circuit board. Among them, the second turning prism 524c is a second optical path turning device. Exemplarily, in order to improve the optical coupling efficiency, a second lens 522c is further disposed between the light emitting end face of the second AWG521c and the second reflector 523c. The optical path principle of the second light receiving component can refer to the optical path principle of the first light receiving component.

[0374] In some embodiments, the first lens 512c is disposed between the light-emitting optical path of the first light-receiving passive device and the first reflector 513c. One end of the first lens 512c is disposed at one end of the third bearing surface, and the other end of the first lens 512c is used to bear the first reflector 513c. The second lens 522c is disposed between the light-emitting optical path of the second light-receiving passive device and the second reflector 523c, one end of the second lens 522c is disposed at the other end of the third bearing surface, and the other end of the second lens 522c is used to bear the second reflector 523c.

[0375] In some embodiments, one end of the first turning prism 514c is connected to the side wall of the protrusion 914c, and the other end is suspended. One end of the second turning prism 524c is connected to the side wall of the protrusion 914c, and the other end is suspended.

[0376] In some embodiments, the light incident end of the first turning prism 514c faces the light emitting end surface of the first reflector 513c, and the light emitting end faces the light receiving chip array. The light incident end of the second turning prism 524c faces the light emitting end surface of the second reflector 523c, and the light emitting end faces the light receiving chip array.

[0377] In some embodiments, the first lens 512c, the first reflector 513c, and the first turning prism 514c are respectively disposed on one side of the third supporting surface 913c, and the second lens 522c, the second reflector 523c, and the second turning prism 524c are respectively disposed on the other side of the third supporting surface 913c.

[0378] In one embodiment, the first lens 512c and the first reflector 513c are fixed together by optical adhesive bonding. Similarly, the second lens 522c and the second reflector 523c are fixed together by optical adhesive bonding.

[0379] In some embodiments, the AWG includes an AWG chip and a capillary, wherein the AWG chip and the capillary are connected via a connecting component. Exemplarily, the connecting component may be glue.

[0380] In some embodiments, a first avoidance portion 9111 is formed on the surface of the first bearing surface 911 c , and a second avoidance portion 9121 is formed on the surface of the second bearing surface 912 c , so as to avoid glue respectively.

[0381] In some embodiments, since the connecting component has a certain thickness, in order to further avoid the connecting component, the width of one end of the protrusion 910a close to the third bearing surface 913c is greater than the width of the other end, so as to further avoid the connecting component and provide sufficient space for the pigtails of the first AWG511c and the second AWG521c to prevent the pigtails from being bent.

[0382] In some embodiments, in order to limit the optical element on the third bearing surface 913c, a first limiting groove 9131c is formed on the side of the third bearing surface 913c close to the first AWG, and a second limiting groove 9132c is formed on the side close to the second AWG. Exemplarily, the first lens 512c is arranged on the first limiting groove 9131c, and then the first reflector 513c is fixed on the light-emitting end face of the first lens 512c; the second lens 522c is arranged on the second limiting groove 9132c, and then the second reflector 523c is fixed on the light-emitting end face of the second lens 522c.

[0383] Fig.23 FIG. 4 is a top view of another light receiving component according to some embodiments. Fig.23 As shown, the first AWG 511c and the second AWG 521c are respectively arranged on both sides of the protrusion 914c. The first lens 512c is arranged on the first limiting groove 9131c, and then the first reflector 513c is fixed on the light-emitting end surface of the first lens 512c; the second lens 522c is arranged on the second limiting groove 9132c, and then the second reflector 523c is fixed on the light-emitting end surface of the second lens 522c. The first turning prism 514c and the second turning prism 524c are respectively fixed on the end surface of the protrusion 914c facing the third bearing surface 913c, and the end surface of the protrusion 914c facing the third bearing surface 913c plays a role of limiting and fixing the first turning prism 514c and the second turning prism 524c.

[0384] In some embodiments, one end of the first turning prism 514c and the second turning prism 524c is disposed on the surface of the third supporting surface 913c, and the other end is suspended in the air to output the turned optical signal.

[0385] Fig.24 is a schematic structural diagram of another light receiving component according to some embodiments; Fig.25 is an exploded schematic diagram of another light receiving component according to some embodiments; Fig.26 FIG. 4 is a schematic top view of another light receiving component according to some embodiments. Figure 24-26 As shown, taking the example that the first AWG and the second AWG can be respectively placed vertically on the corresponding supporting surfaces and the light-emitting ends of the first AWG and the second AWG have a reflective surface, the light receiving component at this time is defined as the light receiving component 500d. In order to realize the reception of multi-path optical signals, the light receiving component 500d includes a first light receiving component and a second light receiving component.

[0386] In some embodiments, the first light receiving component includes a first AWG 511d and a first turning prism 513d. The light emitting end face of the first AWG 511d has a reflecting surface, through which the optical signal can be reflected toward the light incident end face of the first turning prism 513d.

[0387] In some embodiments, a light receiving chip is provided below the light emitting end surface of the first turning prism 513d, so that the optical signal is reflected by the light emitting end surface of the first AWG511d and then incident on the first turning prism 513d, and then the first turning prism 513d turns the optical signal downward, thereby transmitting the optical signal to the surface of the light receiving chip.

[0388] In some embodiments, in order to improve the optical coupling efficiency, a first converging lens 512d is fixedly connected to the light emitting end face of the first AWG 511d, thereby improving the optical coupling efficiency.

[0389] In some embodiments, the second light receiving component includes a second AWG521d and a second turning prism 523d. The light emitting end face of the second AWG521d also has a reflecting surface, through which the light signal is reflected toward the light incident end face of the second turning prism 523d. A light receiving chip is provided below the light emitting end face of the second turning prism 523d. The second turning prism 523d ​​is used to turn the light signal toward the surface of the light receiving chip below, thereby transmitting the light signal to the surface of the light receiving chip.

[0390] In some embodiments, similarly, in order to improve the optical coupling efficiency, a second converging lens 522d is fixedly connected to the light emitting end face of the second AWG 521d, thereby improving the optical coupling efficiency.

[0391] Fig. 27 is a schematic diagram of assembling another light receiving component according to some embodiments; Fig.28 FIG. 2 is a schematic diagram of the structure of another light receiving component according to some embodiments. Fig. 27 and Fig.28 As shown, in some embodiments, taking the base as the base 900d as an example, the light receiving component 500e and the light emitting component are respectively located on different surfaces of the base 900d. Exemplarily, the light receiving component 500e is located on the upper surface of the base 900d, and the light emitting component is located on the lower surface of the base 900d.

[0392] In some embodiments, a protrusion 914d is formed on the surface of the base 900d. The upper surface of the base 900d protrudes upward to form the protrusion 914d. The protrusion 914d is thermally connected to the upper housing through thermal conduction to achieve heat dissipation of the light emitting component.

[0393] In some embodiments, a first bearing surface 911d and a second bearing surface 913d are formed on one side of the protrusion 914d, and a third bearing surface 912d and a fourth bearing surface 915d are formed on the other side of the protrusion 914d.

[0394] In some embodiments, the first light receiving component is located on one side of the protrusion 914d. The first light receiving component includes a first AWG 511e. The first AWG 511e is horizontally placed on the first bearing surface 911d.

[0395] In some embodiments, the second light receiving component is located at the other side of the protrusion 914d. The second light receiving component includes a second AWG 521e. The second AWG 521e is horizontally placed on the third bearing surface 912d.

[0396] In some embodiments, since the first AWG 511e and the second AWG 521e emit light horizontally, an optical path turning device such as a turning prism is required to turn the optical signal output by the AWG to transmit the optical signal to the surface of the optical receiving chip. Based on this, the first optical receiving component includes a first turning prism 512e, and the second optical receiving component includes a second turning prism 522e.

[0397] In some embodiments, a first turning prism 512e is disposed on the surface of the second bearing surface 913d to turn the optical path of the optical signal output by the first AWG511e.

[0398] In some embodiments, the surface of the fourth bearing surface 915d is provided with a second turning prism 522e to turn the optical path of the optical signal output by the second AWG521e. In order to achieve matching in optical path height, the surface of the second bearing surface 913d is lower than the surface of the first bearing surface 911d, and the surface of the fourth bearing surface 915d is lower than the surface of the third bearing surface 912d.

[0399] In some embodiments, in order to transmit the optical signal output by the AWG to the surface of the optical receiving chip, a portion of the surface of the first turning prism 512e is mounted on the surface of the circuit board 300, and another portion of the surface is suspended, so that the optical signal is transmitted from the first turning prism 512e and transmitted to the surface of the optical receiving chip. The second turning prism 522e is configured in the same manner.

[0400] In some embodiments, in order to facilitate the positioning of the first turning prism 512e and the second turning prism 522e, the end surface of the protrusion 914d is flush with the end surfaces of the second bearing surface 913d and the fourth bearing surface 915d, respectively.

[0401] In some embodiments, in order to avoid the connection component between the AWG chip and the capillary in the AWG, a first limiting portion 919d is formed on the surface of the first bearing surface 911d, and a second limiting portion 918d is formed on the surface of the third bearing surface 912d, so as to avoid the connection component respectively. Exemplarily, the connection component can be glue.

[0402] In some embodiments, in order to limit and fix the AWG, a blocking portion 917d is formed on the side of the first bearing surface 911d, and a blocking portion 916d is formed on the side of the third bearing surface 912d, so as to respectively block the first AWG 511e and the second AWG 521e at a certain height, thereby limiting and fixing the AWG.

[0403] Fig.29A is a schematic diagram of assembling another light receiving component according to some embodiments; Fig.29B FIG. 2 is a schematic diagram of the structure of another light receiving component according to some embodiments. Fig.29A and Fig.29B As shown, in some embodiments, taking the base as the base 900e as an example, the base 900e is connected to the circuit board 300, and a light receiving component 500f is disposed on the surface of the base 900e.

[0404] In some embodiments, the base 900e may include a protrusion 914e. The upper surface of the protrusion 914e protrudes upward to form the protrusion 914e. The protrusion 914e is connected to the upper housing through thermal conduction to achieve heat dissipation of the light emitting component.

[0405] In some embodiments, a first bearing surface 911e and a second bearing surface 912e are formed on one side of the protrusion 914e. For example, in order to facilitate the positioning of the optical device, the end surfaces of the first bearing surface 911e and the second bearing surface 912e can be flush with the end surface of the protrusion 914e. The surface of the protrusion 914e is relatively protruding from the first bearing surface 911e and the second bearing surface 912e.

[0406] In some embodiments, in order to achieve reception of optical path optical signals, partial optical devices of the first light receiving component are provided on the surface of the first bearing surface 911e, and partial optical devices of the second light receiving component are provided on the surface of the second bearing surface 912e.

[0407] In some embodiments, some optical devices of the first light receiving component include a first fiber collimator 511f, a first converging lens 512f, a first optical demultiplexing component 513f, a first collimating lens 514f, and a first turning prism 515f, respectively. In addition to the above optical devices, the first light receiving component also includes a light receiving chip disposed on the surface of the circuit board 300. Exemplarily, the light receiving chip is disposed on the surface of the circuit board 300 in the form of an array.

[0408] In some embodiments, an external optical signal is transmitted to the interior of the first optical receiving component via a first optical fiber collimator 511f. After being converged by a first converging lens 512f, the optical signal is transmitted to a first optical demultiplexing component 513f. After being divided into multiple optical signals by the first optical demultiplexing component 513f, the multiple optical signals are collimated by a first collimating lens 514f, and then transmitted to a first turning prism 515f. The first turning prism 515f is used to adjust the optical route of each optical signal from parallel to the surface of the circuit board 300 to perpendicular to the surface of the circuit board 300, thereby transmitting each optical signal to the optical receiving chip on the surface of the circuit board.

[0409] In some embodiments, some optical devices of the second light receiving component include a second optical fiber collimator 521f, a second converging lens 522f, a second optical demultiplexing component 523f, a second collimating lens 524f, and a second turning prism 525f. In addition to the above optical devices, the second light receiving component also includes a light receiving chip disposed on the surface of the circuit board 300. Exemplarily, the light receiving chip is also disposed on the surface of the circuit board 300 in the form of an array. The optical path principle in the second light receiving component is the same as that of the first light receiving component, so it will not be elaborated.

[0410] Fig. 30A is a schematic diagram of a circuit board upper surface assembly according to some embodiments, Fig. 30B FIG. 1 is an exploded view of a circuit board upper surface assembly according to some embodiments. Fig. 30A and Fig. 30B As shown, in some embodiments, a base mounting portion 304 is formed on the surface of the circuit board 300. The base 900f is embedded in the base mounting portion 304, so that the base 900f is fixedly connected to the circuit board 300.

[0411] In some embodiments, the base 900f is formed with a protrusion 910f. The protrusion 910f is formed on the upper surface of the base 900f.

[0412] In some embodiments, a first light receiving component 510g and a second light receiving component 520g are disposed on the upper surface of the base 900f. The surfaces of the first light receiving component 510g and the second light receiving component 520g are covered with a first protective cover 530g.

[0413] In some embodiments, the first light receiving component 510g is located on one side of the protrusion 910f, and the second light receiving component 520g is located on the other side of the protrusion 910f.

[0414] In some embodiments, a first DSP chip 305 is disposed on one side of the first light receiving component 510g, and a second DSP chip 306 is disposed on one side of the second light receiving component 520g.

[0415] In some embodiments, a first supporting surface 920f and a second supporting surface 930f are formed on the upper surface of the base 900f. The first supporting surface 920f is located on one side of the raised portion 910f, and the second supporting surface 930f is located on the other side of the raised portion 910f.

[0416] In some embodiments, the first light receiving component 510g may include a first fiber collimator 511g. The first fiber collimator 511g is located on the surface of the first supporting surface 920f.

[0417] In some embodiments, the first light receiving component 510g may include a first collimating lens 512g. The first collimating lens 512g is located on the surface of the first supporting surface 920f.

[0418] In some embodiments, the first light receiving component 510g may include a first optical demultiplexing component 513g. The first optical demultiplexing component 513g is located on the surface of the first supporting surface 920f.

[0419] In some embodiments, the first light receiving component 510g may include a first folding element 514g. The first folding element 514g is located on the surface of the first supporting surface 920f. The first folding element 514g reflects the input light signal.

[0420] In some embodiments, the first light receiving component 510g may include a first light receiving chip array 516g. The first light receiving chip array 516g is located on the reflection light path of the first light deflecting member 514g. The first light receiving chip array 516g is located on the surface of the circuit board.

[0421] In some embodiments, the first light receiving component 510g may include a first TIA 517g. The first TIA 517g is electrically connected to a first light receiving chip array 516g. Exemplarily, the first light receiving chip array 516g is located on a surface of the first TIA 517g.

[0422] In some embodiments, the first fiber collimator 511g receives an optical signal from the outside and transmits the optical signal to the first collimating lens 512g. The first collimating lens 512g performs collimation processing on the optical signal and transmits it to the first optical demultiplexing component 513g. The first optical demultiplexing component 513g decomposes the input optical signal into multiple optical signals of different wavelengths. After being reflected by the first refractive element 514g, the multiple optical signals of different wavelengths are transmitted to the surface of the first optical receiving chip array 516g and received by the first optical receiving chip array 516g. The first optical receiving chip array 516g converts the optical signals of different wavelengths into photocurrent signals. The first TIA517g converts the photocurrent signal into a photovoltage signal, amplifies the photovoltage signal, and transmits it to the first DSP chip 305, thereby realizing multi-channel optical signal reception.

[0423] In some embodiments, the second light receiving component 520g may include a second fiber collimator 521g. The second fiber collimator 521g is located on the surface of the second supporting surface 930f.

[0424] In some embodiments, the second light receiving component 520g may include a second collimating lens 522g. The second collimating lens 522g is located on the surface of the second supporting surface 930f.

[0425] In some embodiments, the second light receiving component 520g may include a second optical demultiplexing component 523g. The second optical demultiplexing component 523g is located on the surface of the second supporting surface 930f.

[0426] In some embodiments, the second light receiving component 520g may include a second folding element 524g. The second folding element 524g is located on the surface of the second supporting surface 930f. The second folding element 524g reflects the input optical signal.

[0427] In some embodiments, the second light receiving unit 520g may include a second light receiving chip array 526g. The second light receiving chip array 526g is located on the reflection light path of the second light folding member 524g.

[0428] In some embodiments, the second light receiving component 520g may include a second TIA 527g. A second light receiving chip array 526g is disposed on a surface of the second TIA 527g.

[0429] In some embodiments, the second fiber collimator 521g receives an optical signal from the outside and transmits the optical signal to the second collimating lens 522g. The second collimating lens 522g performs collimation processing on the optical signal and transmits it to the second optical demultiplexing component 523g. The second optical demultiplexing component 523g decomposes the input optical signal into multiple optical signals of different wavelengths. After being reflected by the second refractive element 524g, the multiple optical signals of different wavelengths are transmitted to the surface of the second optical receiving chip array 526g and received by the second optical receiving chip array 526g. The second optical receiving chip array 526g converts the optical signals of different wavelengths into photocurrent signals. The second TIA527g converts the photocurrent signal into a photovoltage signal, amplifies the photovoltage signal, and transmits it to the second DSP chip 306, thereby realizing multi-channel optical signal reception.

[0430] Fig. 30C FIG. 1 is a schematic diagram of a circuit board bottom surface assembly according to some embodiments. Fig. 30C As shown, a light emitting component 400g is provided on the lower surface of the base 900f.

[0431] In some embodiments, the light emitting component 400g may include a light emitting chip array 410g. The light emitting chip array 410g is located on the surface of the third supporting surface 940f. The light emitting chip array 410g includes a plurality of light emitting chips. The plurality of light emitting chips respectively emit light signals of different wavelengths.

[0432] In some embodiments, the light emitting component 400g may include a first optical multiplexing component 420g. The first optical multiplexing component 420g is located on the light emitting optical path of the light emitting chip array 410g. The first optical multiplexing component 420g is located on the surface of the fourth supporting surface 950f.

[0433] In some embodiments, the light emitting component 400g may include a second optical multiplexing component 430g. The second optical multiplexing component 430g is located on the light emitting optical path of the light emitting chip array 410g. The second optical multiplexing component 430g is located on the surface of the fifth supporting surface 960f.

[0434] In some embodiments, the light emitting component 400g may include a third optical fiber collimator 440g. The third optical fiber collimator 440g is located on the light output path of the first optical multiplexing component 420g.

[0435] In some embodiments, the light incident end face of the third fiber collimator 440g bears against the side wall of the sixth supporting surface 970f, and the side wall of the third fiber collimator 440g bears against the side wall of the supporting boss 980f, thereby limiting and fixing the third fiber collimator 440g.

[0436] In some embodiments, the light emitting component 400g may include a fourth optical fiber collimator 450g. The fourth optical fiber collimator 450g is located on the light output path of the second optical multiplexing component 430g.

[0437] In some embodiments, the light incident end face of the fourth fiber collimator 450g rests on the side wall of the sixth supporting surface 970f, and the side wall of the fourth fiber collimator 450g rests on the side wall of the limiting boss 990f, thereby limiting and fixing the fourth fiber collimator 450g.

[0438] In some embodiments, the optical emission chip array 410g emits multiple optical signals of different wavelengths. The first optical multiplexing component 420g combines some of the optical signals of different wavelengths to generate a first combined optical signal. The second optical multiplexing component 430g combines other optical signals of different wavelengths to generate a second combined optical signal. The first combined optical signal is coupled into the third optical fiber collimator 440g for transmission to the outside. The second combined optical signal is coupled into the fourth optical fiber collimator 450g for transmission to the outside.

[0439] Fig.30D The figure is a cross-sectional structural diagram of the upper and lower surfaces of a base according to some embodiments. Fig.30E FIG. 1 is a cross-sectional exploded view of the upper and lower surfaces of a base assembly according to some embodiments. Fig.30D , Fig.30E As shown, in some embodiments, the base 900f is embedded in the surface of the circuit board 300. A protrusion 910f is formed on the upper surface of the base 900f, and the protrusion 910f is thermally connected to the upper housing 201.

[0440] In some embodiments, a first light receiving component 510g and a second light receiving component 520g are disposed on the upper surface of the base 900f, and a light emitting component 400g is disposed on the lower surface of the base 900f.

[0441] In some embodiments, the heat generated by the light emitting component 400g is transferred upward to the protrusion 910f, and the protrusion 910f conducts the heat to the upper housing 201, and the heat is transferred to the outside through the upper housing 201.

[0442] In some embodiments, the surfaces of the first light receiving component 510g and the second light receiving component 520g are covered with a first protective cover 530g. The first light receiving component 510g and the second light receiving component 520g are located in a cavity formed by the protective cover 530g and the surface of the circuit board 300.

[0443] In some embodiments, the surface of the light emitting component 400g is covered with a second protective cover 540g. The light emitting component 400g is located in a cavity formed by the protective cover 540g and the surface of the circuit board 300.

[0444] In some embodiments, the structure of the first protective cover 530g can refer to the structure of the first protective cover 530a.

[0445] Fig.30F This is a diagram of a base upper surface assembly structure according to some embodiments. Figure 30G FIG. 1 is an exploded view of an upper surface assembly structure of a base according to some embodiments. Fig.30F , Figure 30G As shown, in some embodiments, a protrusion 910f is formed on the upper surface of the base 900f.

[0446] In some embodiments, a first light receiving component 510g and a second light receiving component 520g are disposed on the upper surface of the base 900f.

[0447] In some embodiments, the first light receiving component 510g and the second light receiving component 520g are respectively located on both sides of the protrusion 9410f.

[0448] In some embodiments, a first supporting surface 920f and a second supporting surface 930f are respectively formed on both sides of the protrusion 910f.

[0449] In some embodiments, a first supporting plate 550g is disposed on the first supporting surface 920f, and a second supporting plate 560g is disposed on the second supporting surface 930f.

[0450] In some embodiments, the first supporting plate 550g and the second supporting plate 560g have smaller thermal expansion coefficients and smaller thermal deformation.

[0451] In some embodiments, the surface of the first supporting plate 550g is used to carry the first optical fiber collimator 511g, the first collimating lens 512g, the first optical demultiplexing assembly 513g, and the first refraction member 514g. The first supporting plate 550g has a small thermal deformation, thereby ensuring the optical path stability of the first light receiving component. Exemplarily, the thermal expansion coefficient of the first supporting plate 550g is smaller than the thermal expansion coefficient of the base 900f.

[0452] In some embodiments, the surface of the second supporting plate 560g is used to carry the second optical fiber collimator 521g, the second collimating lens 522g, the second optical demultiplexing assembly 523g, and the second refraction member 524g. The second supporting plate 560g has a small thermal deformation, thereby ensuring the optical path stability of the second light receiving component. Exemplarily, the thermal expansion coefficient of the second supporting plate 560g is less than the thermal expansion coefficient of the base 900f.

[0453] In some embodiments, the base 900f is fixed to the circuit board 300 by glue. The first light receiving chip array 516g and the second light receiving chip array 526g are respectively at a certain distance from the base 900f to prevent glue overflowing from the base 900f from contaminating the first light receiving chip array 516g and the second light receiving chip array 526g.

[0454] In some embodiments, one end of the first supporting plate 550g protrudes relative to the surface of the first supporting surface 920f to extend the first light folding member 514g to above the first light receiving chip array 516g.

[0455] In some embodiments, one end of the second supporting plate 560g extends out from the surface of the second supporting surface 930f to extend the second light folding member 524g to above the second light receiving chip array 526g.

[0456] In some embodiments, one end of the first refracting member 514g is disposed on the surface of the first supporting plate 550g, and the other end is suspended relative to the first supporting plate 550g, so that the reflected light of the first refracting member 514g is incident on the first light receiving chip array 516g.

[0457] In some embodiments, one end of the second refracting member 524g is disposed on the surface of the second supporting plate 560g, and the other end is suspended relative to the second supporting plate 560g, so that the reflected light of the second refracting member 524g is incident on the second light receiving chip array 526g.

[0458] In some embodiments, a first groove portion 921f is formed on the surface of the first supporting surface 920f, and a second groove portion 931f is formed on the surface of the second supporting surface 930f.

[0459] In some embodiments, the first supporting plate 550g and the second supporting plate 560g are respectively fixed to the surfaces of the first supporting surface 920f and the second supporting surface 930f by glue.

[0460] In some embodiments, one end of the first supporting plate 550g extends toward the top of the first light receiving chip array 516g, and the other end extends to the top of the first groove portion 921f. Then, the two ends of the first supporting plate 550g are respectively suspended, so as to avoid the two ends from being subjected to the stress of the glue used to fix the first supporting plate 550g. At the same time, there is a certain distance between the end of the first supporting plate 550g and the first groove portion 921f, so that the excess glue fixing the first supporting plate 550g can overflow into the first groove portion 921f, so as to avoid the glue from contaminating the optical path.

[0461] In some embodiments, one end of the second supporting plate 560g extends toward the second light receiving chip array 526g, and the other end extends to the second groove portion 931f. Then, the two ends of the second supporting plate 560g are respectively suspended, so as to avoid the two ends from being subjected to the stress of the glue used to fix the second supporting plate 560g. At the same time, there is a certain distance between the end of the second supporting plate 560g and the second groove portion 931f, so that the excess glue fixing the second supporting plate 560g can overflow to the second groove portion 931f, so as to avoid the glue from contaminating the light path.

[0462] In some embodiments, the optical fiber connected to the first optical fiber collimator 511g passes along the first groove portion 921f. The first groove portion 921f can provide bending space for the optical fiber, thereby avoiding fiber breakage. Similarly, the optical fiber connected to the second optical fiber collimator 521g passes along the second groove portion 931f. The second groove portion 931f can provide bending space for the optical fiber, thereby avoiding fiber breakage.

[0463] It can be understood that the technical features of the light receiving components disclosed in the above-mentioned embodiments can be mutually referenced, and any incomplete information can be referred to the contents related to other light receiving components.

[0464] Fig.31 is a schematic diagram of assembling a light emitting component according to some embodiments; Fig.32 FIG. 1 is a top view of an assembly of a light emitting component according to some embodiments. Fig.31 and Fig.32As shown, in some embodiments, taking the base as the base 900a as an example, the light receiving component 500a is disposed on one surface of the base 900a, and the light emitting component 400a is disposed on the other surface of the base 900a. Exemplarily, the light receiving component 500a and the light emitting component 400a are distributed up and down. In some embodiments, the upper surface of the base 900a is covered with a first protective cover, and the lower surface is covered with a second protective cover. Exemplarily, the surface of the light receiving component 500a is covered with a first protective cover 530a to protect the optical device in the light receiving component 500a; the surface of the light emitting component 400a is covered with a second protective cover 420a to protect the optical device in the light emitting component 400a.

[0465] In some embodiments, the second protective cover 420a is divided into a first partition and a second partition from a top view. Fig.32 The A zone is shown, and the second zone is as Fig.32 The circuit board width corresponding to the A area is small, so the width of the A area is smaller than the width of the B area to ensure the relative distance between the A area and the circuit board, thereby ensuring the glue amount of the second protective cover 420a in the A area and increasing the firmness of the second protective cover 420a.

[0466] Fig.33 is an exploded view of an assembly of a light emitting component according to some embodiments; Fig.34 FIG. 4 is a structural diagram of a second protective cover in a light emitting component according to some embodiments. Fig.33 and Fig.34 As shown, in some embodiments, a third bearing surface 921 a, a fourth bearing surface 922 a, and a fifth bearing surface 923 a are respectively formed on the lower surface of the base 900 a.

[0467] In some embodiments, the third bearing surface 921a is used to set the laser group 412a in the light emitting component. A TEC411a is provided below the laser group 412a. The TEC411a and the laser group 412a are superimposed together to have a certain height. The setting of the third bearing surface 921a allows the laser group 412a to sink until it is flush with the surface of the circuit board 300, thereby ensuring that the wire bonding length between the laser group 412a and the surface of the circuit board 300 is short.

[0468] In some embodiments, the fourth bearing surface 922a is used to bear light emitting passive components. For example, the light emitting passive components may be optical fiber arrays, optical multiplexing components, AWGs, and the like.

[0469] In some embodiments, when the light emitting passive device is an optical fiber array, the surface of the fifth bearing surface 923a is used to place the pigtail. Taking the fourth bearing surface 922a bearing the optical fiber array 415a as an example, the surface of the fifth bearing surface 923a bears the pigtail.

[0470] In some embodiments, a lens group 413a is provided between the optical fiber array 415a and the laser group 412a to converge the optical signals emitted by each laser and then emit them out, thereby improving the optical coupling efficiency.

[0471] In some embodiments, in order to prevent the second protective cover 420a from contacting with the optical emitting component, especially contacting with the pigtail to cause interference, a first support portion 924a is formed on both sides of the fifth bearing surface 923a. At the same time, a second support portion 925a can also be formed on both sides of the fourth bearing surface 922a. Through the first support portion 924a and the second support portion 925a, the protective cover can be erected to a certain height, so that there is a certain gap between the protective cover and the optical emitting component, thereby avoiding interference between the two.

[0472] In some embodiments, a plug-in portion 421a is formed at one end of the second protective cover 420a, and a avoiding portion 424a is formed at the other end. A side wall 423a is also formed in the middle of the second protective cover 420a, and a gap 422a is formed between the plug-in portion 421a and the side wall 423a.

[0473] In some embodiments, in order to achieve a fixed connection between the protective cover and the base 900a, an embedding portion 9241 is provided on the surface of the first support portion 924a, and the protective cover is disposed on the embedding portion 9241, thereby fixing the protective cover to the base 900a. Of course, other structures can also be adopted to achieve the fixation of the protective cover. Exemplarily, the second protective cover 420a is formed with an inserting portion 421a, and the inserting portion 421a is inserted into the embedding portion 9241, thereby fixing the protective cover to the base 900a.

[0474] In some embodiments, the side walls 423a on both sides of the second protective cover 420a respectively wrap the first supporting portion 924a and the second supporting portion 925a, so that the second protective cover 420a is buckled on the base 900a.

[0475] In some embodiments, from Fig.34 It can be seen that the dimension of the plug-in portion 421a along the width direction of the second protective cover 420a is smaller than the dimension of the side wall 423a along the width direction of the second protective cover 420a. Therefore, it is easy to form an inner chamfer at the intersection of the plug-in portion 421a and the side wall 423a during machining, and the inner chamfer interferes with the base 900a. Therefore, a notch 422a is formed between the plug-in portion 421a and the side wall 423a to remove the inner chamfer formed by machining to avoid interference between the second protective cover 420a and the base 900a.

[0476] In some embodiments, a high-frequency signal line is provided between the laser group 412a and the DSP chip provided on the surface of the circuit board 300 to transmit the electrical signal from the DSP chip to the laser group 412a. The dielectric constant of the second protective cover 420a is different from that of the air, and the dielectric constant of the second protective cover 420a is greater than that of the air. If the surface of the high-frequency signal line contacts the second protective cover 420a, based on the negative correlation between impedance and dielectric constant, the impedance of the high-frequency signal line at the position where it intersects with the second protective cover 420a will be reduced, thereby reducing the high-frequency signal transmission performance. Therefore, a avoidance portion 424a is formed at the other end of the second protective cover 420a to keep the second protective cover 420a as far away from the high-frequency signal line as possible, thereby reducing the influence on the impedance of the high-frequency signal line.

[0477] In some embodiments, an isolator is provided to prevent the optical signal emitted by the laser group 412a from returning to the laser group 412a again, thereby affecting the optical signal quality. Exemplarily, the isolator 414a is provided between the optical fiber array 415a and the laser group 412a. Correspondingly, in order to provide the isolator, a fifth bearing surface 926a is formed between the fourth bearing surface 922a and the third bearing surface 921a. The fifth bearing surface 926a is used to provide the isolator 414a.

[0478] In some embodiments, as described above, for optical path matching, the surface of the fifth bearing surface 926a is higher than the fourth bearing surface 922a, which can also limit the optical fiber array 415a in the first direction. Exemplarily, the first direction can be the length direction of the protrusion 910a. In order to limit the optical fiber array 415a in the second direction, the surfaces at both ends of the fifth bearing surface 926a can be recessed downward, so that the width of the protruding surface of the fifth bearing surface 926a is the same as the width of the optical fiber array 415a, thereby limiting the optical fiber array 415a in the second direction. Exemplarily, the second direction can be the width direction of the protrusion 910a.

[0479] Fig.35 is an assembled side view of a light emitting component according to some embodiments; Fig.36 FIG. 1 is an exploded side view of an assembly of a light emitting component according to some embodiments. Fig.35 and Fig.36 As shown, in some embodiments, a plug-in portion 421a is formed at one end of the second protective cover 420a, and an embedded portion 9241 is formed on the base 900a. The plug-in portion 421a is inserted into the embedded portion 9241, thereby fixing the protective cover on the base 900a.

[0480] In some embodiments, a avoiding portion 424a is formed at the other end of the second protective cover 420a to keep the second protective cover 420a as far away from the high-frequency signal line as possible, thereby reducing the impact on the impedance of the high-frequency signal line and ensuring the high-frequency signal transmission performance.

[0481] Fig.37 is a cross-sectional structural diagram of a light emitting component according to some embodiments; Fig.38 FIG. 4 is an exploded structural diagram of a light emitting component according to some embodiments. Fig.37 and Fig.38 As shown, in some embodiments, a third bearing surface 921 a, a fourth bearing surface 922 a, and a fifth bearing surface 923 a are respectively formed on the lower surface of the base 900 a.

[0482] In some embodiments, the third bearing surface 921a is used to set the TEC411a in the light emitting component and the laser group 412a and the lens group 413a respectively located on the surface of the TEC411a. The third bearing surface 921a makes the laser group sink until the surface of each laser is flush with the surface of the circuit board 300, thereby ensuring that the wire bonding length between each laser and the surface of the circuit board 300 is short, and improving the high-frequency performance transmission performance. Taking the fourth bearing surface 922a surface carrying the optical fiber array 415a as an example, the fifth bearing surface 923a surface carries the pigtail.

[0483] In some embodiments, the fifth bearing surface 923a, the fourth bearing surface 922a, and the third bearing surface 921a are arranged in steps, and the surface heights of the three decrease successively, thereby achieving matching in optical path height.

[0484] In some embodiments, light emitting passive components such as optical fiber arrays can be mounted on the fourth bearing surface 922a by glue. When the stress generated by glue bonding is too concentrated, the bottom surface of the optical fiber array 415a will be broken. Therefore, in order to avoid stress concentration, protrusions 927a are formed at intervals on the surface of the fourth bearing surface 922a. The interval arrangement of the protrusions 927a can disperse the stress generated by the glue, thereby avoiding excessive concentration of the glue stress, so as to ensure that the optical fiber array 415a is intact during mounting.

[0485] Fig.39 FIG. 2 is a cross-sectional view of another light emitting component according to some embodiments. Fig.39 As shown, in some embodiments, taking the base as the base 900b as an example, the circuit board 300 is provided with a base mounting portion 303, and the base 900b is located above the base mounting portion 303. The light receiving component 500b is located above the base 900b, and the light emitting component 400b is located below the base 900b.

[0486] Fig.40is a schematic diagram of assembling another light emitting component according to some embodiments; Fig.41 is a schematic structural diagram of another light emitting component according to some embodiments; Fig.42 FIG. 4 is a cross-sectional structural diagram of another light emitting component according to some embodiments. Figure 40-Figure 42 As shown, in order to transmit multiple optical signals, the optical transmitting component 400b includes a first optical transmitting component 410b and a second optical transmitting component 420b.

[0487] In some embodiments, the first light emitting component 410b includes: a first optical fiber connector 411b, a first converging lens 412b, a first multiplexer 413b and a first light emitting assembly 414b. The first optical fiber connector 411b, the first converging lens 412b and the first multiplexer 413b are located on the lower surface of the base 900b. The first light emitting assembly 414b is located in the first recessed portion 915b, and a semiconductor refrigerator 417 is also provided above the first light emitting assembly 414b. The first recessed portion 915b makes the lower surface of the first light emitting assembly 414b flush with the lower surface of the circuit board 300, thereby shortening the wiring distance between the first light emitting assembly 414b and the circuit board 300.

[0488] In some embodiments, the first optical transmission component 414b is electrically connected to the circuit board 300, and the first optical transmission component 414b converts the multi-channel electrical signals into multi-channel optical signals and forms collimated light. The first multiplexer 413b multiplexes the multi-channel optical signals into a beam of multi-wavelength signal light. The multi-wavelength signal light is converged to the first optical fiber connector 411b by the first converging lens 412b and then enters the optical fiber, realizing the soft connection between the optical transmission component and the optical fiber adapter of the module optical port. An optical isolator is provided inside the first optical fiber connector 411b to simplify the assembly process and also reduce costs.

[0489] In some embodiments, the laser in the first light emitting assembly 414b in the first light emitting component emits scattered light of four different wavelengths, which are collimated by a collimating lens to form four parallel light beams. After being merged into a collimated light beam by the first wavelength division multiplexer, the collimated light beams enter the first converging lens 412b to form a converging light beam that enters the first optical fiber connector 411b. The distance between the first converging lens and the first optical fiber connector conforms to the focal length of the converging lens.

[0490] In some embodiments, in the optical receiving component, the light emitted by the first collimator is a collimated light beam, which is decomposed into 4 beams by the first demultiplexer, and formed into 4 converging beams by the first lens assembly, and the circuit direction is converted to face the circuit board surface. Therefore, the optical path length of the first optical emitting component from the laser to the first optical fiber connector is greater than the optical path length from the optical receiving chip in the first optical receiving component to the first optical collimator.

[0491] In some embodiments, the area between the first notch 911b and the second notch 912b of the carrier plate 916b protrudes toward the optical port relative to the side wall of the base 900b, and the carrier plate 916b is used to carry the optical fiber connector. The first optical fiber connector is connected to the carrier plate 916b.

[0492] In some embodiments, the second light emitting component 420b includes: a second optical fiber connector 421b, a second converging lens 422b, a second multiplexer 423b, and a second optical emission assembly 424b. The second optical fiber connector 421b, the second converging lens 422b, and the second multiplexer 423b are located on the lower surface of the base 900b. The second optical emission assembly 424b is located in the first recessed portion 915b, and a semiconductor refrigerator 417 is also provided above the second optical emission assembly 424b. The first recessed portion 915b makes the lower surface of the second optical emission assembly 424b flush with the lower surface of the circuit board 300, shortening the wiring distance between the second optical emission assembly 424b and the circuit board 300. The second optical fiber connector is connected to the carrier plate 916b.

[0493] In some embodiments, the protrusion 914b is thermally connected to the upper housing. The first light emitting assembly and the second light emitting assembly are the main heat sources of the optical module, and the heat emitted by them is transferred to the upper housing through the protrusion 914b, thereby improving the heat dissipation effect of the optical module.

[0494] In some embodiments, the first fiber adapter is connected to the first fiber connector, the second fiber adapter is connected to the second fiber connector, the third fiber adapter is connected to the first optical collimator, and the fourth fiber adapter is connected to the second optical collimator.

[0495] In some embodiments, the first light emitting component includes four lasers, and the second light emitting component includes four lasers. The first wavelength division multiplexer combines the light emitted by the four lasers in the first light emitting component into one beam, and sends it out through the first optical fiber adapter. The second wavelength division multiplexer combines the light emitted by the four lasers in the second light emitting component into one beam, and sends it out through the second optical fiber adapter.

[0496] In some embodiments, the light beam carried in the third optical fiber adapter is divided into four beams by the first demultiplexer and received by four optical receiving chips. The light beam carried in the fourth optical fiber adapter is divided into four beams by the second demultiplexer and received by four optical receiving chips.

[0497] In some embodiments, the first fiber optic adapter, the third fiber optic adapter, the second fiber optic adapter and the fourth fiber optic adapter may be arranged sequentially at the same height, or may be presented in two rows, such as the first fiber optic adapter and the third fiber optic adapter are respectively located above the second fiber optic adapter and the fourth fiber optic adapter.

[0498] In some embodiments, the base mounting portion 303 provides space for mounting a light emitting component.

[0499] Fig.43 A schematic diagram of a partial cross-sectional structure of an optical module provided according to some embodiments of the present application Figure 1 ; Fig.44 A schematic diagram of a partial cross-sectional structure of an optical module provided according to some embodiments of the present application Figure 2 .like Fig.43 and Fig.44 As shown, in some embodiments of the present application, the hot surface of the semiconductor cooler 417 is connected to positive and negative power wires, and is led out from the third notch 913b; the upper surface of the circuit board is provided with conductive pins, and the positive and negative power wires are connected to the conductive pin wires. In some embodiments, the conductive pins are located at the third notch 913b, and the conductive pins are located above the power wires.

[0500] In some embodiments, the hot surface of the semiconductor cooler 417 is a side adjacent to the light emitting chip.

[0501] In some embodiments, a substrate 418 is provided between the semiconductor cooler 417 and the first recessed portion 915b, and the substrate is provided with a circuit electrically connected to other parts of the semiconductor cooler 417. One end of the substrate 418 extends into the third notch and is located below the circuit board 300. The hot surface of the semiconductor cooler is connected to a positive power supply wire and a negative power supply wire. A positive pin and a negative pin are provided on the upper surface of the circuit board. The third notch 913b allows the positive power supply wire 4181 and the negative power supply wire 4182 to be led out from the bottom of the circuit board. The positive pin is electrically connected to the positive power supply wire, and the negative pin is conductively connected to the negative power supply wire.

[0502] In some embodiments, the circuit board is provided with a base mounting portion, and the base covers part of the base mounting portion. The base is arranged on the lower surface of the circuit board. The upper surface of the base 900b is raised to form a raised portion 914b, and the first light receiving component and the second light receiving component are respectively located on both sides of the raised portion 914. The lower surface of the base 900b is recessed to form a first recessed portion 915b, and the lower surface of the base 900b is in contact with the upper surface of the circuit board. The bottom surface of the first recessed portion 915b is recessed relative to the lower surface of the base 900b, so that the electrical connection line between the light emitting component and the circuit board is the shortest. The base 900b is also provided with a third notch 913b, and the first recessed portion 915b is connected to the third notch 913b, which is convenient for observing and positioning from the third notch 913b during installation.

[0503] In some embodiments, the first optical chipset 514b, the first transimpedance amplifier 515b, the second optical chipset 524b, and the second transimpedance amplifier 525b are fixed at the position of the circuit board. During the installation process, the base, the first optical emission assembly, and the second optical emission assembly can be connected first, and then the first optical collimator, the first demultiplexer, the second optical collimator, and the second demultiplexer can be connected to the base to form a transceiver component. The base provides an installation platform for the first optical emission assembly, the second optical emission assembly, the first optical collimator, the first demultiplexer, the second optical collimator, and the second demultiplexer. Then the transceiver component is positioned and connected to the circuit board, and the first lens assembly and the second lens assembly are installed according to the positional relationship between the base and the circuit board.

[0504] In some embodiments, the base, the first optical transmission component, and the second optical transmission component are connected, and then the first optical collimator, the first demultiplexer, the second optical collimator, and the second demultiplexer are connected to the base to form a transceiver component. The transceiver component is an integral component, which is easy to install and can be applied to a variety of optical modules.

[0505] In some embodiments, the light emitting component is designed to be assembled in reverse, so that the bonding surface height of the light emitting component is the same as the lower surface of the circuit board during assembly, so that the connection bonding between the two is minimized to ensure excellent high-frequency transmission performance. The light emitting component is designed to be assembled in reverse, and the base serves as a heat sink for the laser and semiconductor cooler, directly contacting the upper cover of the optical module to form a more direct and efficient heat transfer channel.

[0506] Fig.45 FIG. 1 is a schematic diagram of assembling another light emitting component according to some embodiments. Figure 1 ; Fig.46 FIG. 1 is a schematic diagram of assembling another light emitting component according to some embodiments. Figure 2 .like Fig.45 and Fig.46 As shown, in some embodiments, taking the base as the base 900c as an example, the light receiving component 500c is disposed on one surface of the base 900c, and the light emitting component 400c is disposed on the other surface of the base 900c.

[0507] In some embodiments, the surface of the light emitting component 400c is covered with a second protective cover 420c to protect the optical components in the light emitting component 400c. The second protective cover 420c includes a first overlapping portion 421c, a first avoidance gap 422c, a second avoidance gap 423c and a second overlapping portion 424c in sequence. The first overlapping portion 421c and the second overlapping portion 424c are overlapped on the surface of the circuit board respectively, so that the second protective cover 420c is fixed to the surface of the circuit board 300.

[0508] In some embodiments, the optical emission component 400c includes a laser group, an optical emission passive device for wave combining, and an optical emission passive device for transmission. Exemplarily, the optical emission passive device for wave combining can be an optical multiplexing component, etc.; the optical emission passive device for transmission can be a fiber collimator, etc.

[0509] In some embodiments, the optical transmission component 400c includes a laser group 411c, an optical multiplexing component 412c, and an optical fiber collimator 413c. The laser group 411c includes a plurality of lasers, and the multi-channel optical signals generated by the laser group 411c are transmitted to the optical multiplexing component 412c. After the optical multiplexing component 412c is processed by beam combining, it is emitted through the optical fiber collimator 413c. Exemplarily, the laser groups 411c correspond to two optical multiplexing components 412c, and one optical multiplexing component 412c corresponds to one optical fiber collimator 413c. The multiple optical signals emitted by the laser group 411c are synthesized into two optical signals through the two optical multiplexing components 412c, and then emitted through the two optical fiber collimators 413c.

[0510] In some embodiments, the surface of each laser in the laser group 411c is flush with the surface of the circuit board to shorten the wire bonding length between the two, thereby improving high-frequency signal transmission performance.

[0511] Fig.47 is a schematic structural diagram of another light emitting component according to some embodiments; Fig.48 FIG. 2 is a schematic diagram of an exploded view of another light emitting component according to some embodiments. Fig.47 and Fig.48 As shown, in some embodiments, one surface of the base 900c is used to carry the light receiving component, and the other surface is used to carry the light emitting component. Exemplarily, the lower surface of the base 900c is used to set the light emitting component. The lower surface of the base 900c is respectively formed with a fourth bearing surface 921c, a fifth bearing surface 922c and a sixth bearing surface 923c. The fifth bearing surface 922c is arranged between the fourth bearing surface 921c and the sixth bearing surface 923c.

[0512] In some embodiments, the fourth bearing surface 921c is used to set the laser group 411c for emitting multiple optical signals; the fifth bearing surface 922c is used to set the optical multiplexing component 412c for combining multiple optical signals; the sixth bearing surface 923c is used to set the optical fiber collimator 413c for transmitting the combined optical signal.

[0513] In some embodiments, in order to limit and fix the optical multiplexing component 412c, limiting portions 924c are formed on both sides of the fifth bearing surface 922c. For example, the surface of the limiting portion 924c protrudes relative to the surface of the fifth bearing surface 922c, and the structure of the limiting portion 924c can be a limiting boss, so as to limit and fix the optical multiplexing component 412c.

[0514] In some embodiments, the circuit board 300 is embedded in the surface of the base 900a to be relatively closer to the laser group 411c. The surface of the fourth bearing surface 921c is recessed relative to the surface of the fifth bearing surface 922c, so that the laser group 411c is set downward, so that the surface of the laser group 411c is flush with the surface of the circuit board 300, thereby shortening the wire bonding length between the two and improving the high-frequency performance transmission performance. In some embodiments, the height difference between the fifth bearing surface 922c and the sixth bearing surface 923c is sufficient to make the optical path height of the optical multiplexing component 412c and the optical fiber collimator 413c match.

[0515] It can be understood that the light receiving component matched with the light emitting component 400c can be the light receiving component 500c mentioned above, or can be the light receiving component 500d, or the light receiving component 500e, or the light receiving component 500f.

[0516] Fig.49A is an assembly diagram of the lower surface of a base according to some embodiments, Fig.49B FIG. 1 is an exploded view of the lower surface of a base according to some embodiments. Fig.49A and 49B As shown, in some embodiments, a light emitting component 400g is provided on the lower surface of the base 900f.

[0517] In some embodiments, the surface of the light emitting component 400g is covered with a second protective cover 540g. The light emitting component 400g is located in a cavity formed by the protective cover 540g and the surface of the circuit board 300.

[0518] In some embodiments, a limiting boss 990f is formed on the lower surface of the base 900f. The limiting boss 990f is located on one side of the fifth supporting surface 960f.

[0519] In some embodiments, the second protective cover 540g is connected to the side wall of the limiting boss 990f, so that the second protective cover 540g is limited and fixed by the limiting boss 990f.

[0520] In some embodiments, an embedding groove 991f is formed on the surface of the limiting boss 990f. An inserting portion 541g is formed at the end of the second protective cover 540g. The inserting portion 541g is connected to the embedding groove 991f, thereby limiting and fixing the second protective cover 540g.

[0521] Fig.49C This is a schematic diagram of an assembly structure of a base and a second protective cover according to some embodiments. Fig.49D FIG. 1 is an exploded view of a base and a second protective cover assembly structure according to some embodiments. Fig.49C , Fig.49D As shown, in some embodiments, an embedding groove 991f is formed on the surface of the limiting boss 990f. An inserting portion 541g is formed at the end of the second protective cover 540g. The inserting portion 541g is connected to the embedding groove 991f, thereby limiting and fixing the second protective cover 540g.

[0522] Fig.49E FIG. 1 is a cross-sectional structural diagram of a base and a second protective cover assembly according to some embodiments. Fig.49E As shown, in some embodiments, the second protective cover 540g is connected to the side wall of the limiting boss 990f, so that the second protective cover 540g is limited and fixed by the limiting boss 990f.

[0523] Fig.50A FIG. 1 is a diagram of an assembly structure of a light emitting component and a base according to some embodiments. Fig.50A As shown, in some embodiments, a light emitting component 400g is provided on the lower surface of the base 900f.

[0524] In some embodiments, the light emitting chip array 410g is located on the surface of the third supporting surface 940f.

[0525] In some embodiments, the first optical multiplexing component 420g is located on the light emitting path of the optical emitting chip array 410g. The first optical multiplexing component 420g is located on the surface of the fourth supporting surface 950f.

[0526] In some embodiments, the second optical multiplexing component 430g is located on the light emitting optical path of the optical emitting chip array 410g. The second optical multiplexing component 430g is located on the surface of the fifth supporting surface 960f.

[0527] In some embodiments, the third optical fiber collimator 440g is located on the light output path of the first optical multiplexing component 420g.

[0528] In some embodiments, the light incident end face of the third fiber collimator 440g bears against the side wall of the sixth supporting surface 970f, and the side wall of the third fiber collimator 440g bears against the side wall of the supporting boss 980f, thereby limiting and fixing the third fiber collimator 440g.

[0529] In some embodiments, the fourth optical fiber collimator 450g is located on the light output path of the second optical multiplexing component 430g.

[0530] In some embodiments, the light incident end face of the fourth fiber collimator 450g rests on the side wall of the sixth supporting surface 970f, and the side wall of the fourth fiber collimator 450g rests on the side wall of the limiting boss 990f, thereby limiting and fixing the fourth fiber collimator 450g.

[0531] Fig.50B FIG. 1 is a cross-sectional view of a light emitting component and a base assembly according to some embodiments. Fig.50B As shown, in some embodiments, a TEC 460g is disposed on the surface of the third supporting surface 940f.

[0532] In some embodiments, the surface of TEC 460g carries a light emitting chip array 410g.

[0533] In some embodiments, the surface of TEC 460g carries a lens array 470g, which is located on the light-emitting optical path of the light-emitting chip array 410g to converge the emitted optical signals and improve coupling efficiency.

[0534] In some embodiments, since TEC460g has a certain height, the third supporting surface 940f is recessed toward the base 900f to sink the TEC460g, ensuring that the surface of the light emitting chip array 410g is flush with the surface of the circuit board 300, thereby shortening the wiring distance between the light emitting chip and the circuit board 300 and ensuring high-frequency signal transmission performance.

[0535] In some embodiments, the surface of the fourth supporting surface 950f where the first optical multiplexing component 420g is located is higher than the surface of the third supporting surface 940f, so that the optical axis of the first optical multiplexing component 420g is highly matched with the optical axis of the optical emitting chip array 410g, thereby ensuring the coupling efficiency between the two. Similarly, the surface of the fifth supporting surface 960f where the second optical multiplexing component 430g is located is also the same.

[0536] Fig.50C A top view of a light emitting component and a base assembly according to some embodiments. Fig.50D FIG. 1 is an exploded view of an assembly of a light emitting component and a base according to some embodiments. Fig.50C , 50D As shown, in some embodiments, the light emitting component 400g is located on the lower surface of the base 900f.

[0537] In some embodiments, the fourth supporting surface 950f and the fifth supporting surface 960f are provided with a spacer 951f to limit the first optical multiplexing component 420g and the second optical multiplexing component 430g to prevent interference between the two.

[0538] In some embodiments, a first converging lens 481g and a second converging lens 482g are disposed on the surface of the sixth supporting surface 970f.

[0539] The first converging lens 481g is located on the light output path of the first optical multiplexing component 420g to converge the optical signal synthesized by the first optical multiplexing component 420g.

[0540] The second converging lens 482g is located on the light outgoing path of the second optical multiplexing component 430g to converge the optical signal synthesized by the second optical multiplexing component 430g.

[0541] In some embodiments, the first converging lens 481g is located between the first optical multiplexing component 420g and the third optical fiber collimator 440g, and the second converging lens 482g is located between the second optical multiplexing component 430g and the fourth optical fiber collimator 450g.

[0542] In some embodiments, a first avoidance gap 971f is formed on the surface of the sixth supporting surface 970f to avoid the fourth fiber optic collimator 450g, so that one end of the fourth fiber optic collimator 450g is supported on the side wall of the sixth supporting surface 970f, and the fourth fiber optic collimator 450g is limited and fixed on the side wall of the sixth supporting surface 970f.

[0543] In some embodiments, the side wall of the fourth optical fiber collimator 450g is supported on the side wall of the limiting boss 990f.

[0544] In some embodiments, the fourth optical fiber collimator 450g is fixed to the lower surface of the base 900f by glue.

[0545] In some embodiments, a second avoidance gap 992f is formed on the surface of the limiting boss 990f. The second avoidance gap 992f is arranged opposite to the first avoidance gap 971f to form a cavity to accommodate the fourth optical fiber collimator 450g.

[0546] In some embodiments, the end of the fourth optical fiber collimator 450g is located in the cavity surrounded by the first avoidance gap 971f and the second avoidance gap 992f. Then, the excess glue fixing the fourth optical fiber collimator 450g will overflow into the cavity surrounded by the first avoidance gap 971f and the second avoidance gap 992f to prevent the glue from contaminating the optical path.

[0547] In some embodiments, one side of the limiting boss 990f is used to limit the fourth optical fiber collimator 450g, and the other side is used to limit the second protective cover 540g. The supporting boss 980f is used to support and fix the third optical fiber collimator 440g.

[0548] In some embodiments, since the limiting boss 990f needs to limit the fourth optical fiber collimator 450g and the second protective cover 540g at the same time, the length of one side of the limiting boss 990f used to limit the fourth optical fiber collimator 450g is less than the length of one side used to limit the second protective cover 540g. In this way, the shape of the limiting boss 990 is different from the shape of the supporting boss 980f.

[0549] Fig.50E A cross section of an assembly of a light emitting component and a base according to some embodiments Figure 1 .like Fig.50E As shown, in some embodiments, the sixth support surface 970f has a certain height to provide a bearing surface for the third fiber collimator 440g and the fourth fiber collimator 450g. The side wall of the sixth support surface 970f provides a bearing surface for the third fiber collimator 440g and the fourth fiber collimator 450g.

[0550] In some embodiments, the light input end of the fourth optical fiber collimator 450g is supported on the side wall of the sixth supporting surface 970f, and the side wall is supported on the side wall of the limiting boss 990f.

[0551] Fig.50F A cross section of an assembly of a light emitting component and a base according to some embodiments Figure 2 .like Fig.50F As shown, in some embodiments, the sixth supporting surface 970f has a certain height to provide a bearing surface for the third fiber collimator 440g.

[0552] In some embodiments, the light input end of the third optical fiber collimator 440g is supported on the side wall of the sixth supporting surface 970f, and the side wall is supported on the side wall of the supporting boss 980f.

[0553] Figure 50G FIG. 1 is a cross-sectional view of the upper and lower surfaces of a base according to some embodiments. Figure 50G As shown, in some embodiments, a protrusion 910f is formed on the upper surface of the base 900f. The protrusion 910f is thermally connected to the upper housing 201. A light emitting component 400g is provided on the lower surface of the base 900f. The heat generated by the light emitting component 400g is conducted upward to the protrusion 910f, and then conducted to the upper housing 201 through the protrusion 910f, and the heat is conducted to the outside through the heat dissipation channel of the upper housing 201.

[0554] In some embodiments, the upper surface of the base 900f is provided with a first light receiving component 510g and a second light receiving component 520g, and the lower surface is provided with a light emitting component 400g, and the base 900f is required to have a strong supporting force to ensure the stability of the optical path.

[0555] In some embodiments, the third support surface 940f is recessed toward the upper surface of the base 900f so that the surface of the light emitting chip array 410g is flush with the surface of the circuit board 300. Since the third support surface 940f is recessed toward the upper surface of the base 900f, the thickness of the base 900f is reduced, reducing the support strength of the base 900f.

[0556] In some embodiments, a first convergent lens 515g is connected to the light emitting end surface of the first light refracting member 514g. The light emitting surface of the first convergent lens 515g faces the first light receiving chip array 516g. Similarly, a second convergent lens 525g is connected to the light emitting end surface of the second light refracting member 524g, and the light emitting surface of the second convergent lens 525g faces the second light receiving chip array 526g.

[0557] In some embodiments, the first converging lens 515g is fixed on the light-emitting end surface of the first refraction member 514g. The first converging lens 515g is located between the first refraction member 514g and the first light receiving chip array 516g, and the light-emitting surface of the first converging lens 515g faces the first light receiving chip array 516g. The first converging lens 515g performs converging processing on the light signal reflected from the first refraction member 514g, so that the light signal reflected from the first refraction member 514g falls within the photosensitive surface range of the light receiving chip in the first light receiving chip array 516g. In this way, the first refraction member 514g can be moved away from the surface of the circuit board 300, and the distance between the first refraction member 514g and the first light receiving chip array 516g can be increased, thereby increasing the thickness of the base 900f remaining after the third supporting surface 940f is recessed, thereby increasing the support degree of the base 900f for the optical device and ensuring the stability of the optical path. The second converging lens 525g is also the same.

[0558] In some embodiments, the first converging lens 515g converges the optical signal reflected from the first light-bending element 514g to compensate for the optical path difference from the first light-bending element 514g to the first light-receiving chip array 516g caused by the increase in the thickness of the base 900f, so that the optical signal reflected from the first light-bending element 514g falls within the photosensitive surface range of the light-receiving chips in the first light-receiving chip array 516g. The second converging lens 525g is similar.

[0559] Those skilled in the art will readily appreciate other embodiments of the present application after considering the specification and practicing the disclosure of the present application. The present application is intended to cover any variation, use or adaptation of the present application, which follows the general principles of the present application and includes common knowledge or customary techniques in the art that are not disclosed in the present application. The specification and examples are intended to be exemplary only, and the true scope and spirit of the present application are indicated by the content of the claims.

[0560] The above-described embodiments of the present application do not constitute a limitation on the protection scope of the present application.

Claims

1. An optical module, characterized in that: include: Upper shell; A circuit board having a base mounting portion formed on the surface; A base, fixed to the surface of the circuit board through the base mounting portion, a raised portion formed on the upper surface of the base, the raised portion protruding toward the upper housing, and the raised portion being thermally connected to the upper housing; A light receiving component is located on the upper surface of the base and on the side of the raised portion, and is used to receive multiple optical signals; The light emitting component is located on the lower surface of the base, and is used for emitting multi-path optical signals.

2. The optical module according to claim 1, characterized in that: The upper surface of the base is formed with: A first supporting surface, located at one side of the protruding portion, a first supporting plate is provided on the surface of the first supporting surface, and one end of the first supporting plate extends relative to the surface of the first supporting surface; A second supporting surface, located at the other side of the protruding portion, a second supporting plate is provided on the surface of the second supporting surface, and one end of the second supporting plate extends relative to the surface of the second supporting surface; The lower surface of the base is formed with: A third supporting surface, located at one end of the base; a fourth supporting surface, located on one side of the third supporting surface; a fifth supporting surface, located on one side of the third supporting surface; A sixth supporting surface, located on one side of the fourth supporting surface, the sixth supporting surface is formed with a first avoidance gap, and the sixth supporting surface has a height; A supporting boss is located on one side of the sixth supporting surface; The limiting boss is located at one side of the fifth supporting surface. The length of the limiting boss is greater than that of the supporting boss. The limiting boss is formed with a second avoidance gap, and the second avoidance gap is arranged opposite to the first avoidance gap.

3. The optical module according to claim 2, characterized in that: One side of the raised portion is provided with: A first optical fiber collimator, disposed on the surface of the first supporting plate; A first optical demultiplexing component is disposed on the surface of the first supporting plate and is located on the light path of the first optical fiber collimator; A first refracting member, one end of which is disposed on the surface of the first supporting plate, and the other end of which is suspended relative to the first supporting plate; A first light receiving chip array is located on one side of the first supporting surface; The other side of the raised portion is provided with: A second optical fiber collimator, disposed on the surface of the second supporting plate; A second optical demultiplexing component is disposed on the surface of the second supporting plate and is located in the light path of the second optical fiber collimator; A second refracting member, one end of which is disposed on the surface of the second supporting plate, and the other end of which is suspended relative to the second supporting plate; The second light receiving chip array is located on one side of the second supporting surface.

4. The optical module according to claim 2, characterized in that: The lower surface of the base is provided with: A light emitting chip array is located on the surface of the third supporting surface; A first optical multiplexing component is located on the surface of the fourth supporting surface and on the light output path of the light emitting chip array; A second optical multiplexing component is located on the surface of the fifth supporting surface and on the light path of the light emitting chip array; A third optical fiber collimator is located on the light output path of the first optical multiplexing component; the light input end face of the third optical fiber collimator is supported by the side wall of the sixth supporting surface, and the side wall of the third optical fiber collimator is supported by the side wall of the supporting boss to limit the position of the third optical fiber collimator; A fourth optical fiber collimator is located on the light output path of the second optical multiplexing component; the light incident end face of the fourth optical fiber collimator is supported by the side wall of the sixth supporting surface, and the side wall of the fourth optical fiber collimator is supported by the side wall of the limiting boss to limit the fourth optical fiber collimator.

5. The optical module according to claim 3, characterized in that: There is a preset distance between the first light receiving chip array and the base, and there is a preset distance between the second light receiving chip and the base; The end of the first supporting plate extends relative to the surface of the first supporting surface so that the first light folding member reflects the light path toward the first light receiving chip array; The end of the second supporting plate extends out relative to the surface of the second supporting surface so that the second folding member reflects the light path toward the second light receiving chip array.

6. The optical module according to claim 3, characterized in that: A first groove portion is formed on the surface of the first supporting surface, and a second groove portion is formed on the surface of the second supporting surface; One end of the first supporting plate extends toward the first light receiving chip array, and the other end extends to above the first groove portion; One end of the second supporting plate extends toward the second light receiving chip array; The other end extends to above the second groove portion.

7. The optical module according to claim 4, characterized in that: The third support surface is provided with a TEC, and the light emitting chip array is located on the TEC surface; The third supporting surface is recessed downward relative to the fourth supporting surface so that the surface of the light emitting chip array is flush with the surface of the circuit board.

8. The optical module according to claim 7, characterized in that: A first refracting member and a first light receiving chip array are disposed on one side of the protruding portion, and a second refracting member and a second light receiving chip array are disposed on the other side; A first converging lens is connected to the light emitting end surface of the first light refracting member, and the light emitting surface of the first converging lens faces the first light receiving chip array; A second converging lens is connected to the light emitting end surface of the second light refracting member, and a light emitting surface of the second converging lens faces the second light receiving chip array.

9. The optical module according to claim 4, characterized in that: The end of the fourth optical fiber collimator is located in a cavity surrounded by the first avoidance gap and the second avoidance gap.

10. The optical module according to claim 1, characterized in that: The surface of the circuit board is provided with a light receiving chip array, and the light receiving components are respectively provided on both sides of the protrusion; The protrusion is formed with a first bearing surface and a first extension located at the end of the first bearing surface on one side, and a second bearing surface and a second extension located at the end of the second bearing surface on the other side; the lower surface of the base is formed with a third bearing surface and a fourth bearing surface; the surface of the base is provided with: A first optical fiber array, located on the surface of the first bearing surface, for receiving multiple optical signals; A second optical fiber array, located on the surface of the second bearing surface, for receiving multiple optical signals; A first optical path turning device, located on the surface of the first extension portion, used to change the transmission direction of the multi-path optical signals output by the first optical fiber array, so as to transmit the multi-path optical signals to the optical receiving chip array; A second optical path turning device, located on the surface of the second extension portion, used to change the transmission direction of the multi-path optical signals output by the second optical fiber array, so as to transmit the multi-path optical signals to the optical receiving chip array; A laser group, located on the surface of the third bearing surface, for emitting multiple optical signals; The third optical fiber array is located on the surface of the fourth bearing surface and is used to transmit the multi-path optical signals emitted by the laser group.

11. The optical module according to claim 1, characterized in that: The surface of the circuit board is provided with a light receiving chip array, and the light receiving components are respectively provided on both sides of the protrusion; The first and second bearing surfaces are formed on one side of the protrusion, and the third and fourth bearing surfaces are formed on the other side of the protrusion; wherein the side walls of the first and third bearing surfaces are respectively formed with a blocking portion; the surface of the second bearing surface is lower than the surface of the first bearing surface, and the surface of the fourth bearing surface is lower than the surface of the third bearing surface; the surface of the base is respectively provided with: A first AWG is disposed on the surface of the first bearing surface, a light-emitting end surface of the first AWG is horizontally placed on the surface of the first bearing surface, and the light-emitting end surface of the first AWG is set as a plane; A second AWG is disposed on the surface of the third bearing surface, the light-emitting end surface of the second AWG is horizontally placed on the surface of the third bearing surface, and the light-emitting end surface of the second AWG is set as a plane; A first optical path turning device, disposed on the surface of the second bearing surface, for changing the transmission direction of the multi-path optical signals output by the first AWG so as to transmit them to the optical receiving chip array; The second optical path turning device is disposed on the surface of the fourth bearing surface and is used to change the transmission direction of the multi-path optical signals output by the second AWG so as to transmit them to the optical receiving chip array.

12. An optical module, characterized in that: include: Upper shell; A circuit board, a base mounting portion is formed on the surface of the circuit board, and a light receiving chip array is provided on the surface of the circuit board; A base, fixed to the surface of the circuit board through the base mounting portion, a raised portion formed on the upper surface of the base, the raised portion protruding toward the upper housing, and the raised portion being thermally connected to the upper housing; The lower surface of the base is formed with: A third supporting surface, located at one end of the base; a fourth supporting surface, located on one side of the third supporting surface; a fifth supporting surface, located on one side of the third supporting surface; A sixth supporting surface, located on one side of the fourth supporting surface, the sixth supporting surface is formed with a first avoidance gap, and the sixth supporting surface has a height; A supporting boss is located on one side of the sixth supporting surface; A limiting boss, located at one side of the sixth supporting surface, the limiting boss is longer than the supporting boss, the limiting boss is formed with a second avoidance notch, and the second avoidance notch is arranged opposite to the first avoidance notch; A first light receiving component is located on the upper surface of the base and on one side of the raised portion; A second light receiving component is located on the upper surface of the base and on the other side of the protruding portion; A light emitting chip array is located on the surface of the third supporting surface; A first optical multiplexing component is located on the surface of the fourth supporting surface and on the light output path of the light emitting chip array; A second optical multiplexing component is located on the surface of the fifth supporting surface and on the light path of the light emitting chip array; A third optical fiber collimator is located on the light output path of the first optical multiplexing component; the light input end face of the third optical fiber collimator is supported by the side wall of the sixth supporting surface, and the side wall of the third optical fiber collimator is supported by the side wall of the supporting boss to limit the position of the third optical fiber collimator; A fourth optical fiber collimator is located on the light output path of the second optical multiplexing component; the light incident end face of the fourth optical fiber collimator is supported by the side wall of the sixth supporting surface, and the side wall of the fourth optical fiber collimator is supported by the side wall of the limiting boss to limit the fourth optical fiber collimator.

13. The optical module according to claim 12, characterized in that: The upper surface of the base is formed with: A first supporting surface, located at one side of the protruding portion, a first supporting plate is provided on the surface of the first supporting surface, and one end of the first supporting plate extends relative to the surface of the first supporting surface; A second supporting surface, located at the other side of the protruding portion, a second supporting plate is provided on the surface of the second supporting surface, and one end of the second supporting plate extends relative to the surface of the second supporting surface; The first light receiving component comprises: A first optical fiber collimator, disposed on the surface of the first supporting plate; A first optical demultiplexing component is disposed on the surface of the first supporting plate and is located on the light path of the first optical fiber collimator; A first refracting member, one end of which is disposed on the surface of the first supporting plate, and the other end of which is suspended relative to the first supporting plate; A first light receiving chip array is located on one side of the first supporting surface; The second light receiving component comprises: A second optical fiber collimator, disposed on the surface of the second supporting plate; A second optical demultiplexing component is disposed on the surface of the second supporting plate and is located in the light path of the second optical fiber collimator; A second refracting member, one end of which is disposed on the surface of the second supporting plate, and the other end of which is suspended relative to the second supporting plate; The second light receiving chip array is located on one side of the second supporting surface.

14. The optical module according to claim 12, characterized in that: The third support surface is provided with a TEC, and the light emitting chip array is located on the TEC surface; The third supporting surface is recessed downward relative to the fourth supporting surface so that the surface of the light emitting chip array is flush with the surface of the circuit board.

15. The optical module according to claim 14, characterized in that: A first refracting member and a first light receiving chip array are disposed on one side of the protruding portion, and a second refracting member and a second light receiving chip array are disposed on the other side; A first converging lens is connected to the light emitting end surface of the first light refracting member, and the light emitting surface of the first converging lens faces the first light receiving chip array; A second converging lens is connected to the light emitting end surface of the second light refracting member, and a light emitting surface of the second converging lens faces the second light receiving chip array.

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