Integrated packaging module and packaging method for gravitational wave front-end conditioning circuit

Abstract

The invention relates to a front-end conditioning circuit integrated packaging module for gravitational waves and a packaging method, belongs to the technical field of semiconductor packaging, integrates a front-end circuit, greatly reduces the circuit area, facilitates temperature control, and is beneficial to improving the temperature consistency of the front-end conditioning circuit. The front-end conditioning circuit is integrally packaged, so that electromagnetic interference protection of the circuit can be realized, the influence of cosmic radiation on the front-end analog circuit of the measurement system can be avoided when the space environment is used for measurement, and the anti-interference capability of the measurement system is greatly enhanced; the method is suitable for precise measurement of gravitational wave signals in satellite-borne and intense radiation application scenes.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor packaging, and in particular relates to an integrated packaging module and packaging method for a front-end conditioning circuit for gravitational waves. Background Art

[0002] Weak signal detection is an important research direction in modern electronic technology and signal processing technology. It involves accurately extracting, recovering and measuring weak signals from complex background noise. Such signals are usually easily masked due to their extremely low amplitude. Therefore, improving the ability to detect weak signals is of great significance in scientific research, engineering applications and daily life.

[0003] The interstellar laser interferometry system for space gravitational wave detection places extremely high demands on the detection accuracy of weak signals such as gravitational waves, among which the performance of the front-end conditioning circuit is particularly important. The front-end conditioning circuit needs to have an extremely good noise floor and anti-interference ability. The existing front-end signal circuits mostly use discrete devices, which will make the link of the front-end conditioning circuit longer and occupy more space on the circuit board, which will make the signal susceptible to interference, and the impedance consistency is difficult to control, making it difficult to effectively extract, amplify and filter the gravitational wave signal.

[0004] The front-end conditioning circuit is integrated into an integrated chip, which can greatly reduce the circuit area, make the measures of anti-electromagnetic radiation interference and circuit temperature consistency more efficient, and can also improve the front-end conditioning circuit for weak signal acquisition performance. Based on the integrated chip integration solution of IPD (Integrated Passive Devices, integrated passive devices) technology, the effective integration of front-end conditioning circuit devices can be achieved by etching directly on the wafer. However, active amplifier devices such as operational amplifiers cannot be directly integrated, and often require external amplifier circuits and single-ended differential circuits to achieve integration, so the circuit area cannot be minimized. At the same time, due to the highly customized design structure inside the passive integrated device, when the passive integrated device is connected to the external circuit, it is easy to have problems such as impedance discontinuity, resulting in signal reflection; it is also not conducive to the overall temperature control of the front-end conditioning circuit, making the temperature consistency of the front-end conditioning circuit poor, which is not conducive to the measurement of weak signals. Therefore, a method of integrating and packaging the front-end conditioning circuit to improve the processing effect of the front-end conditioning circuit for weak signals is needed. Summary of the invention

[0005] In order to solve the above problems existing in the prior art, the present invention provides an integrated packaging module and packaging method for a front-end conditioning circuit for gravitational waves. The technical problem to be solved by the present invention is achieved through the following technical solutions:

[0006] The present invention provides an integrated packaging module for a front-end conditioning circuit for gravitational waves, comprising: a front-end conditioning circuit, a silicon chip, an ABF interconnection substrate and packaging pins; wherein, a plurality of silicon chips are arranged at intervals on the ABF interconnection substrate, a plurality of front-end conditioning circuits are laid on the plurality of silicon chips in a one-to-one correspondence to form a plurality of signal paths, the plurality of signal paths are isolated from each other, and each signal path is used to receive and amplify a gravitational wave signal to be measured; a plurality of packaging pins are evenly arranged at intervals on the lower surface of the ABF interconnection substrate, a plurality of through holes are arranged at intervals on each silicon chip, the front-end conditioning circuit is connected to the ABF interconnection substrate through the plurality of through holes, and is interconnected with the plurality of packaging pins through the ABF interconnection substrate.

[0007] In one embodiment of the present invention, each front-end conditioning circuit includes: a first band-pass filter, a two-stage operational amplifier, and a second band-pass filter connected in sequence; the first band-pass filter is used to receive the gravitational wave signal to be measured and filter the gravitational wave signal to be measured to obtain a first filtered signal; the two-stage operational amplifier is used to perform two-stage amplification on the first filtered signal to obtain a two-stage amplified signal; the second band-pass filter is used to filter the two-stage amplified signal to obtain a second filtered signal.

[0008] In one embodiment of the present invention, the front-end conditioning circuit integrated packaging module also includes: a resistive pilot distribution module; the resistive pilot distribution module is arranged on the ABF interconnect substrate and is respectively connected to a plurality of front-end conditioning circuits; the resistive pilot distribution module is used to receive the pilot signal and distribute the pilot signal into a plurality of pilot operation signals.

[0009] In one embodiment of the present invention, each front-end conditioning circuit also includes: a fully differential amplifier; a fully differential amplifier connected to the ABF interconnection substrate through a plurality of through holes, and interconnected with the resistive pilot distribution module through the ABF interconnection substrate; a fully differential amplifier connected to the second bandpass filter, for performing a differential operation on the second filtered signal and the pilot operation signal, obtaining a differential signal and outputting it.

[0010] In one embodiment of the present invention, each signal path further includes: a programmable resistor, which is connected to the two-stage operational amplifier and is used to change the amplification factor of the two-stage operational amplifier by changing the resistance value.

[0011] In one embodiment of the present invention, a plurality of through holes are filled with a conductor material, and the conductor material includes copper.

[0012] In one embodiment of the present invention, both the first bandpass filter and the second bandpass filter are resistor-capacitor filters; both the first bandpass filter and the second bandpass filter include a plurality of resistor-capacitor components, and the resistor-capacitor components include resistors or capacitors.

[0013] The present invention also provides a packaging method for a front-end conditioning circuit for gravitational waves, comprising:

[0014] Step 1: placing a plurality of silicon chips and resistive pilot frequency distribution modules on the ABF interconnect substrate respectively, and placing a first bandpass filter, a two-stage operational amplifier bare chip, a second bandpass filter, a fully differential amplifier bare chip and a programmable resistor bare chip on each silicon chip in sequence;

[0015] Step 2: fan out several pins of the first bandpass filter, the two-stage operational amplifier bare chip, the second bandpass filter, the fully differential amplifier bare chip and the programmable resistor bare chip to correspondingly placed silicon wafers through RDL technology; wherein the several pins include interconnect pins and input and output pins;

[0016] Step 3: connecting the first bandpass filter, the two-stage operational amplifier bare chip, the second bandpass filter, the fully differential amplifier bare chip and the programmable resistor bare chip on each silicon wafer in sequence through a plurality of interconnect pins to form a plurality of signal paths;

[0017] Step 4: a plurality of through holes are respectively provided on each silicon wafer, and a plurality of input and output pins are correspondingly led out to the ABF interconnect substrate through the plurality of through holes, so as to respectively connect the resistive pilot frequency distribution module and a plurality of BGA package pins of the ABF interconnect substrate;

[0018] Step 5: Encapsulate several silicon chips and the ABF interconnect substrate as a whole in a metal shell and fill it with thermal conductive material.

[0019] In one embodiment of the present invention, the first bandpass filter and the second bandpass filter both include a plurality of resistor-capacitor components, the plurality of resistor-capacitor components of the first bandpass filter are interconnected by bonding wires, and the plurality of resistor-capacitor components of the second bandpass filter are interconnected by bonding wires; the two-stage operational amplifier bare chip and the fully differential amplifier bare chip both include a plurality of peripheral components, the plurality of peripheral components of the two-stage operational amplifier bare chip and its interconnection pins are interconnected by bonding wires, and the plurality of peripheral components of the fully differential amplifier bare chip and its interconnection pins are interconnected by bonding wires.

[0020] In one embodiment of the present invention, the input and output pins include: a test signal input pin, a pilot signal input pin, a communication configuration pin and a differential signal output pin.

[0021] Compared with the prior art, the present invention has the following beneficial effects:

[0022] The front-end conditioning circuit integrated packaging module for gravitational waves of the present invention is based on the system-level packaging technology, and the front-end circuit is integrated and packaged, which greatly reduces the circuit area and is convenient for temperature control, which is conducive to improving the temperature consistency of the front-end conditioning circuit, making the front-end conditioning circuit less susceptible to temperature fluctuations, improving signal stability, and avoiding measurement errors caused by temperature changes. The front-end conditioning circuit is packaged in an integrated manner, which is also conducive to realizing electromagnetic interference protection of the circuit. When measuring in the space environment, the influence of cosmic radiation on the front-end analog circuit of the measurement system can be avoided, which greatly enhances the anti-interference ability of the measurement system, and is suitable for realizing precise measurement of gravitational wave signals in satellite-borne and strong radiation application scenarios.

[0023] The present invention integrates various modules of the front-end circuit on independent silicon chips respectively, and the front-end circuit on each silicon chip forms a signal path, thereby increasing the isolation between the signal paths and reducing signal crosstalk.

[0024] The present invention encapsulates the resistive pilot distribution module inside the module, and uses the method of inserting pilots to individually reduce the time jitter noise in each signal path to eliminate the influence of time jitter; the fully differential amplifier directly outputs the differential signal after the gravitational wave signal to be measured and the pilot signal are mixed, which also makes it convenient for the subsequent digital circuit to directly use the differential signal to perform pilot correction operations.

[0025] Under the premise of realizing the integration of the front-end conditioning circuit, the present invention adopts a programmable resistor as the feedback resistor of the operational amplifier, and realizes a variable amplification factor through the programmable resistor. Under the premise of ensuring integration, the portability of use is increased, a flexible configuration method is provided, and different project requirements can be met, which greatly improves the development efficiency of the project.

[0026] The packaging method of the integrated packaging module of the front-end conditioning circuit for gravitational waves of the present invention integrates and packages the front-end conditioning circuit, which is more conducive to the system to perform temperature control and electromagnetic protection on it, better ensures the temperature consistency of the front-end conditioning circuit, and plays an effect of suppressing measurement noise; the packaged module can be used in strong electromagnetic radiation environments such as outer space, which is conducive to the detection of gravitational wave signals.

[0027] The present invention adopts a bare tape chip to solve the impedance discontinuity problem caused by the traditional chip packaging structure, effectively suppressing signal reflection; and adopts a bonding wire packaging process to greatly shorten the transmission and interconnection length of the signal path, improve the interconnection impedance accuracy, reduce the influence of signal transmission reflection and crosstalk, and achieve the purpose of suppressing the transmission phase change of the signal.

[0028] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, the following specifically cites a preferred embodiment and describes it in detail with the accompanying drawings as follows. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a structural schematic diagram of a front-end conditioning circuit integrated packaging module for gravitational waves provided by an embodiment of the present invention;

[0030] Figure 2 is a structural cross-sectional view of a front-end conditioning circuit integrated packaging module for gravitational waves provided by an embodiment of the present invention;

[0031] Figure 3 is a structural block diagram of a front-end conditioning circuit provided by an embodiment of the present invention;

[0032] Figure 4 is a structural perspective view of a front-end conditioning circuit integrated packaging module for gravitational waves provided by an embodiment of the present invention;

[0033] Figure 5 It is a flow chart of an integrated packaging method for a front-end conditioning circuit for gravitational waves provided by an embodiment of the present invention.

[0034] Icons: 1-front-end conditioning circuit; 10-first bandpass filter; 20-two-stage operational amplifier; 30-second bandpass filter; 40-fully differential amplifier; 50-programmable resistor; 2-silicon wafer; 21-through hole; 3-ABF interconnect substrate; 4-package pin; 5-resistive pilot distribution module. DETAILED DESCRIPTION

[0035] In order to further explain the technical means and effects adopted by the present invention to achieve the predetermined purpose of the invention, the following is a detailed description of an integrated packaging module and packaging method for a front-end conditioning circuit for gravitational waves proposed in accordance with the present invention, in combination with the accompanying drawings and specific implementation methods.

[0036] The above and other technical contents, features and effects of the present invention are clearly presented in the following detailed description of the specific implementation modes in conjunction with the accompanying drawings. Through the description of the specific implementation modes, the technical means and effects adopted by the present invention to achieve the predetermined purpose can be more deeply and specifically understood. However, the attached drawings are only for reference and explanation purposes and are not used to limit the technical solutions of the present invention.

[0037] Embodiment 1

[0038] like Figures 1 to 4As shown, the present invention provides an integrated packaging module of a front-end conditioning circuit for gravitational waves, comprising: a front-end conditioning circuit 1, a silicon wafer 2, an ABF interconnection substrate 3 and packaging pins 4; wherein, a plurality of silicon wafers 2 are arranged at intervals on the ABF interconnection substrate 3, a plurality of front-end conditioning circuits 1 are laid on the plurality of silicon wafers 2 in a one-to-one correspondence to form a plurality of signal paths, the plurality of signal paths are isolated from each other, and each signal path is used to receive and amplify a gravitational wave signal to be measured; a plurality of packaging pins 4 are evenly arranged on the lower surface of the ABF interconnection substrate 3, a plurality of through holes 21 are arranged on each silicon wafer 2 at intervals, the front-end conditioning circuit 1 is connected to the ABF interconnection substrate 3 through the plurality of through holes 21, and is interconnected with the plurality of packaging pins 4 through the ABF interconnection substrate 3.

[0039] In this embodiment, each front-end conditioning circuit 1 includes: a first band-pass filter 10, a two-stage operational amplifier 20, and a second band-pass filter 30 connected in sequence; the first band-pass filter 10 is used to receive the gravitational wave signal to be measured and filter the gravitational wave signal to be measured to obtain a first filtered signal; the two-stage operational amplifier 20 is used to perform two-stage amplification on the first filtered signal to obtain a two-stage amplified signal; the second band-pass filter 30 is used to filter the two-stage amplified signal to obtain a second filtered signal.

[0040] In this embodiment, the front-end conditioning circuit integrated packaging module also includes: a resistive pilot distribution module 5; the resistive pilot distribution module 5 is arranged on the ABF interconnection substrate 3 and is respectively connected to a plurality of front-end conditioning circuits 1; the resistive pilot distribution module 5 is used to receive the pilot signal and distribute the pilot signal into a plurality of pilot operation signals.

[0041] In this embodiment, each front-end conditioning circuit 1 also includes: a fully differential amplifier 40; the fully differential amplifier 40 is connected to the ABF interconnection substrate 3 through a plurality of through holes 21, and is interconnected with the resistive pilot distribution module 5 through the ABF interconnection substrate 3; the fully differential amplifier 40 is connected to the second bandpass filter 30, and is used to perform a differential operation on the second filtered signal and the pilot operation signal to obtain a differential signal and output it.

[0042] The principle is that for the detection of gravitational wave signals, the noise floor performance in the MHz frequency band is particularly important, among which the influence of sampling time jitter is particularly obvious. Sampling time jitter mainly includes: encoding clock jitter and aperture jitter of analog to digital converter (ADC). Sampling time jitter causes the actual sampling time to deviate from the ideal sampling time, thereby introducing a phase measurement error, and the magnitude of the phase measurement error is proportional to the frequency of the gravitational wave signal to be measured. Taking the heterodyne laser interferometer as a measurement device as an example, its phase meter is used to measure the phase difference between the two interference beat frequency signals, and the two phase signals are affected by different sampling time jitter noises. Since the two ADCs use the same encoding clock, most of the influence of the encoding clock jitter in the differential phase can be deducted by the difference, but the residual clock jitter noise is still limited by the common mode rejection ratio of the two ADC clock lines. Therefore, the time jitter noise of each sampling must be reduced separately. The influence of time jitter can be eliminated by inserting a pilot tone, which requires a high-frequency signal to be mixed into the gravitational wave signal to be measured. Therefore, the gravitational wave signal to be measured and the high-frequency pilot tone operation signal are respectively connected to the positive and negative differential input terminals of the fully differential amplifier 40 to achieve differential operation of the two signals. After differential operation, the two differential signals are transmitted to the ADC chip in the back-end circuit for collection, thereby eliminating the influence of time jitter.

[0043] In an optional implementation, each signal path further includes: a programmable resistor 50 , which is connected to the two-stage operational amplifier 20 and is used to change the amplification factor of the two-stage operational amplifier 20 by changing the resistance value.

[0044] In an optional implementation, the first bandpass filter 10 and the second bandpass filter 30 are both resistor-capacitor filters; the first bandpass filter 10 and the second bandpass filter 30 both include a plurality of resistor-capacitor components, and the resistor-capacitor components include: resistors or capacitors.

[0045] It is worth noting that, since the gravitational wave signal to be measured is distributed in the range of 5MHz to 25MHz, it is necessary to ensure the amplitude of the gravitational wave signal to be measured within the passband range, ensure that the phase of the gravitational wave signal to be measured is not distorted, and ensure that the noise signal outside the passband is filtered out, so the first bandpass filter 10 and the second bandpass filter 30 both adopt a fifth-order Bessel bandpass filter structure, which has a small phase shift distortion and excellent amplitude-frequency characteristic ripple characteristics. In addition, in order to achieve a larger signal amplification factor, considering that the gain-bandwidth product of domestic operational amplifiers at this stage is relatively small, a two-stage operational amplifier structure is adopted in this embodiment.

[0046] Taking the setting of 4 signal paths as an example, the integrated packaging module of the front-end conditioning circuit for gravitational waves in this embodiment includes 5 strip-shaped areas, such as Figure 1 As shown, a resistive pilot distribution module 5 is placed in the middle area of ​​the ABF interconnection substrate 3 to realize the function of dividing the pilot signal into four. In order to achieve effective signal isolation, two silicon wafers 2 are first placed on both sides of the resistive pilot distribution module 5, and then a first bandpass filter 10, a two-stage operational amplifier 20, a second bandpass filter 30 and a fully differential amplifier 40 are placed on each silicon wafer 2 in sequence to form a total of four signal paths. The components in the front-end conditioning circuit 1 first realize the interconnection of signal lines on the silicon wafer 2, and the signal lines that need to be led out are realized by drilling holes on the silicon wafer 2 to the ABF interconnection substrate 3, and further connected to the components outside the silicon wafer 2 through the ABF interconnection substrate 3 and a number of package pins 4.

[0047] It can be understood that any number of front-end circuits can be integrated to form corresponding signal paths, and the number of signal paths is not limited in this embodiment.

[0048] For example, Figure 2 and Figure 3 As shown, various devices of the front-end circuit 1 are placed on the silicon wafer 2, and an ABF interconnect substrate 3 is provided below the silicon wafer 2. A plurality of through holes 21 are filled with conductive materials to achieve signal transmission, and the conductive materials include copper.

[0049] like Figures 1 to 3 As shown, the integrated package module of the front-end conditioning circuit for gravitational waves of this embodiment is described. Inside the module, the first bandpass filter 10, the two-stage operational amplifier 20, the second bandpass filter 30, the fully differential amplifier 40 and the resistive pilot distribution module 5 are respectively connected to their peripheral circuits, and the pilot operation signal output by the resistive pilot distribution module 5 is introduced into the signal path at the fully differential amplifier 40. Outside the module, the four signal paths are interconnected with a plurality of package pins 4 through the ABF interconnect substrate 3, and are connected to external circuits through a plurality of package pins 4, so as to facilitate user development and use.

[0050] Exemplarily, the two-stage operational amplifier 20 can adopt the domestic chip SC7503, which has the advantages of low noise, high slew rate and large gain-bandwidth product; the fully differential amplifier 40 can adopt the domestic chip SC7516; the programmable resistor 50 can adopt the AD5272 chip, and the resistance control can be completed through the IIC (Inter-Integrated Circuit, integrated circuit bus) communication protocol to adjust the amplification factor of the two-stage operational amplifier 20.

[0051] It is understandable that the models of the two-stage operational amplifier 20 , the fully differential amplifier 40 and the programmable resistor 50 can be selected according to actual needs, and the specific models are not limited in this embodiment.

[0052] The working principle of the integrated packaging module for the front-end conditioning circuit of gravitational waves of this embodiment is that the first bandpass filter 10, the two-stage operational amplifier 20, the second bandpass filter 30, the fully differential amplifier 40 and the programmable resistor 50 in the front-end conditioning circuit 1 are integrated on a silicon chip to realize noise filtering and amplification processing of the gravitational wave signal to be measured. The gravitational wave signal to be measured passes through the first bandpass filter 10, the two-stage operational amplifier 20, the second bandpass filter 30 and the differential amplifier 40 in sequence, and the one-way pilot signal input from the outside is converted into four-way pilot operation signals through the resistive pilot distribution module 5. The four-way pilot operation signals are respectively corresponding to the four fully differential amplifiers 40 for differential operation together with the processed gravitational wave signal to be measured, and finally the fully differential amplifier 40 outputs the mixed differential signal.

[0053] It is worth noting that, since the gravitational wave signal received by the present embodiment is a voltage signal obtained by conversion of the four-quadrant photodiode of the front stage, the voltage signal obtained by direct conversion may have spike pulse noise, which may cause the amplifier circuit to saturate, thereby causing measurement errors and even damage to the subsequent stage devices; at the same time, the voltage signal obtained by direct conversion also has certain signal spurious, so first passing through the first bandpass filter 10 can improve the quality of the gravitational wave signal to be measured. The gravitational wave signal to be measured after the filtering process is effectively amplified within the specified bandwidth in the two-stage operational amplifier 20. In addition, since the weak signal will introduce the amplifier's own noise and peripheral circuit noise after passing through the two-stage operational amplifier 20, the second bandpass filter 30 is connected after the two-stage operational amplifier 20 to improve the signal quality.

[0054] It is understandable that the overall circuit structure of the front-end conditioning circuit 1 can also correspond to different application scenarios. For example, the current structure of filtering-amplifying-filtering-single-ended to differential can be adjusted to different structures such as amplifying-filtering-single-ended to differential, filtering-amplifying-single-ended to differential or amplifying-single-ended to differential. This is not limited in the present embodiment.

[0055] The front-end conditioning circuit integrated packaging module for gravitational waves of the present invention is based on the system-level packaging (Systemina Package, SiP) technology, and the front-end circuit is integrated, which greatly reduces the circuit area, saves the PCB (Printed Circuit Board) board space, and is convenient for temperature control, which is conducive to improving the temperature consistency of the front-end conditioning circuit, making the front-end conditioning circuit less susceptible to temperature fluctuations, improving signal stability, and avoiding measurement errors caused by temperature changes. The front-end conditioning circuit is packaged in an integrated manner, which is also conducive to realizing electromagnetic interference protection of the circuit. When measuring in the space environment, the influence of cosmic radiation on the front-end analog circuit of the measurement system can be avoided, and the anti-interference ability of the measurement system is greatly enhanced, which is suitable for realizing precise measurement of gravitational wave signals in space-borne and strong radiation application scenarios.

[0056] The present invention integrates various modules of the front-end circuit on independent silicon chips respectively, and the front-end circuit on each silicon chip forms a signal path, thereby increasing the isolation between the signal paths and reducing signal crosstalk.

[0057] The present invention encapsulates the resistive pilot distribution module inside the module, and uses the method of inserting pilots to individually reduce the time jitter noise in each signal path to eliminate the influence of time jitter; the fully differential amplifier directly outputs the differential signal after the gravitational wave signal to be measured and the pilot signal are mixed, which also makes it convenient for the subsequent digital circuit to directly use the differential signal to perform pilot correction operations.

[0058] Under the premise of realizing the integration of the front-end conditioning circuit, the present invention adopts a programmable resistor as the feedback resistor of the operational amplifier, and realizes a variable amplification factor through the programmable resistor. Under the premise of ensuring integration, the portability of use is increased, a flexible configuration method is provided, and different project requirements can be met, which greatly improves the development efficiency of the project.

[0059] Embodiment 2

[0060] like Figure 5 As shown, this embodiment provides a packaging method for a front-end conditioning circuit integrated packaging module for gravitational waves, which is used to prepare the front-end conditioning circuit integrated packaging module for gravitational waves of embodiment 1. The packaging method includes:

[0061] Step 1: Place several silicon chips and resistive pilot frequency distribution modules on the ABF interconnect substrate respectively, and place the first bandpass filter, the two-stage operational amplifier bare chip, the second bandpass filter, the fully differential amplifier bare chip and the programmable resistor bare chip on each silicon chip in sequence.

[0062] It is worth noting that placing the four signal paths on separate silicon chips can increase the isolation between the signal paths and reduce crosstalk.

[0063] Step 2: Use RDL technology to fan out several pins of the first bandpass filter, the two-stage operational amplifier bare chip, the second bandpass filter, the fully differential amplifier bare chip and the programmable resistor bare chip to the corresponding silicon wafers; wherein the several pins include interconnect pins and input and output pins.

[0064] It is worth noting that the fan-out pins include two categories, one is the interconnection pins that need to be interconnected on the silicon wafer, and the other is the input and output pins that pass through the silicon wafer to connect to the resistive pilot distribution module on the ABF interconnect substrate, or the input and output pins that need to be led out to the outside. Exemplary input and output pins include: input pins for signals to be tested, pilot signal input pins, communication configuration pins, and differential signal output pins.

[0065] Step 3: Connect the first bandpass filter, the two-stage operational amplifier bare chip, the second bandpass filter, the fully differential amplifier bare chip and the programmable resistor bare chip on each silicon wafer in sequence through a plurality of interconnect pins to form a plurality of signal paths.

[0066] In an optional embodiment, the first bandpass filter and the second bandpass filter each include a plurality of resistor-capacitor components, the plurality of resistor-capacitor components of the first bandpass filter are interconnected by bonding wires, and the plurality of resistor-capacitor components of the second bandpass filter are interconnected by bonding wires; the two-stage operational amplifier bare chip and the fully differential amplifier bare chip each include a plurality of peripheral components, the plurality of peripheral components of the two-stage operational amplifier bare chip and its interconnection pins are interconnected by bonding wires, and the plurality of peripheral components of the fully differential amplifier bare chip and its interconnection pins are interconnected by bonding wires.

[0067] It is understandable that the structures of the first bandpass filter and the second bandpass filter and the resistance and capacitance of the corresponding resistor and capacitor components can be adjusted to achieve responses with different amplitude frequencies and phase frequencies, which is not limited in this embodiment.

[0068] Step 4: a plurality of through holes are respectively provided on each silicon wafer, and a plurality of input and output pins are correspondingly led out to the ABF interconnect substrate through the plurality of through holes, so as to respectively connect the resistive pilot frequency distribution module and a plurality of BGA package pins of the ABF interconnect substrate;

[0069] Step 5: Encapsulate several silicon chips and the ABF interconnect substrate as a whole in a metal shell and fill it with thermal conductive material.

[0070] Exemplarily, the metal housing package uses a through-body interface to reduce heat dissipation requirements and reduce package size.

[0071] The packaging method of the integrated packaging module of the front-end conditioning circuit for gravitational waves of the present invention integrates and packages the front-end conditioning circuit, which is more conducive to the system to perform temperature control and electromagnetic protection on it, better ensures the temperature consistency of the front-end conditioning circuit, and plays an effect of suppressing measurement noise; the packaged module can be used in strong electromagnetic radiation environments such as outer space, which is conducive to the detection of gravitational wave signals.

[0072] The present invention adopts a bare tape chip to solve the impedance discontinuity problem caused by the traditional chip packaging structure, effectively suppressing signal reflection; and adopts a bonding wire packaging process to greatly shorten the transmission and interconnection length of the signal path, improve the interconnection impedance accuracy, reduce the influence of signal transmission reflection and crosstalk, and achieve the purpose of suppressing the transmission phase change of the signal.

[0073] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply that there is any such actual relationship or order between these entities or operations. Moreover, the term "include", "comprise" or any other variant is intended to cover non-exclusive inclusion, so that the article or device including a series of elements includes not only those elements, but also other elements that are not explicitly listed. In the absence of more restrictions, the elements defined by the sentence "including one..." do not exclude the existence of other identical elements in the article or device including the elements. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. The orientation or position relationship indicated by "up", "down", "left", "right", etc. is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention.

[0074] The above contents are further detailed descriptions of the present invention in combination with specific preferred embodiments, and it cannot be determined that the specific implementation of the present invention is limited to these descriptions. For ordinary technicians in the technical field to which the present invention belongs, several simple deductions or substitutions can be made without departing from the concept of the present invention, which should be regarded as falling within the protection scope of the present invention.

Claims

1. A front-end conditioning circuit integrated packaging module for gravitational waves, characterized in that: include: Front-end conditioning circuits, silicon wafers, ABF interconnect substrates, and package pins; Wherein, a plurality of silicon chips are arranged at intervals on the ABF interconnect substrate, a plurality of front-end conditioning circuits are laid on the plurality of silicon chips one by one to form a plurality of signal paths, the plurality of signal paths are isolated from each other, and each of the signal paths is used to receive and amplify a gravitational wave signal to be detected; A plurality of the package pins are evenly spaced on the lower surface of the ABF interconnect substrate, a plurality of through holes are spaced on each silicon wafer, the front-end conditioning circuit is connected to the ABF interconnect substrate through the plurality of through holes, and is interconnected with the plurality of the package pins through the ABF interconnect substrate.

2. The front-end conditioning circuit integrated packaging module according to claim 1, characterized in that: Each of the front-end conditioning circuits includes: a first band-pass filter, a two-stage operational amplifier, and a second band-pass filter connected in sequence; the first band-pass filter is used to receive a gravitational wave signal to be measured and filter the gravitational wave signal to be measured to obtain a first filtered signal; the two-stage operational amplifier is used to perform two-stage amplification on the first filtered signal to obtain a two-stage amplified signal; the second band-pass filter is used to filter the two-stage amplified signal to obtain a second filtered signal.

3. The front-end conditioning circuit integrated packaging module according to claim 2, characterized in that: Also includes: Resistive pilot distribution module; The resistive pilot frequency distribution module is arranged on the ABF interconnect substrate and is respectively connected to a plurality of the front-end conditioning circuits; The resistive pilot distribution module is used to receive a pilot signal and distribute the pilot signal into a plurality of pilot operation signals.

4. The front-end conditioning circuit integrated packaging module according to claim 3, characterized in that: Each of the front-end conditioning circuits further includes: a fully differential amplifier; the fully differential amplifier is connected to the ABF interconnection substrate through a plurality of the through holes, and is interconnected with the resistive pilot frequency distribution module through the ABF interconnection substrate; The fully differential amplifier is connected to the second bandpass filter and is used to perform a differential operation on the second filtered signal and the pilot operation signal to obtain a differential signal and output it.

5. The front-end conditioning circuit integrated packaging module according to claim 2, characterized in that: Each of the signal paths further includes: a programmable resistor, which is connected to the two-stage operational amplifier and is used to change the amplification factor of the two-stage operational amplifier by changing the resistance value.

6. The front-end conditioning circuit integrated packaging module according to claim 1, characterized in that: A plurality of the through holes are filled with a conductor material, and the conductor material includes copper.

7. The front-end conditioning circuit integrated packaging module according to claim 2, characterized in that: The first band-pass filter and the second band-pass filter are both resistor-capacitor filters; the first band-pass filter and the second band-pass filter both include a plurality of resistor-capacitor components, and the resistor-capacitor components include resistors or capacitors.

8. A packaging method for a front-end conditioning circuit integrated packaging module for gravitational waves, characterized in that: The method is used to prepare the integrated packaging module of the front-end conditioning circuit for gravitational waves according to any one of claims 1 to 7, and the packaging method comprises: Step 1: placing a plurality of silicon chips and resistive pilot frequency distribution modules on the ABF interconnect substrate respectively, and placing a first bandpass filter, a two-stage operational amplifier bare chip, a second bandpass filter, a fully differential amplifier bare chip and a programmable resistor bare chip in sequence on each of the silicon chips; Step 2: fanning out several pins of the first bandpass filter, the two-stage operational amplifier bare chip, the second bandpass filter, the fully differential amplifier bare chip and the programmable resistor bare chip to the correspondingly placed silicon wafers through RDL technology; wherein the several pins include interconnect pins and input and output pins; Step 3: sequentially connecting the first bandpass filter, the two-stage operational amplifier bare chip, the second bandpass filter, the fully differential amplifier bare chip and the programmable resistor bare chip on each of the silicon wafers through a plurality of the interconnection pins to form a plurality of signal paths; Step 4: a plurality of through holes are respectively provided on each silicon wafer, and a plurality of the input and output pins are correspondingly led out to the ABF interconnect substrate through the plurality of through holes, so as to respectively connect the resistive pilot frequency distribution module and a plurality of BGA package pins of the ABF interconnect substrate; Step 5: Encapsulate several silicon chips and the ABF interconnect substrate as a whole through a metal shell, and fill it with thermal conductive material.

9. The packaging method of the integrated packaging module for the front-end conditioning circuit for gravitational waves according to claim 8, characterized in that: The first band-pass filter and the second band-pass filter each include a plurality of resistor-capacitor components, wherein the plurality of resistor-capacitor components of the first band-pass filter are interconnected by bonding wires, and the plurality of resistor-capacitor components of the second band-pass filter are interconnected by bonding wires; The two-stage operational amplifier bare chip and the fully differential amplifier bare chip both include a number of peripheral devices, the several peripheral devices of the two-stage operational amplifier bare chip and its interconnection pins are interconnected via bonding wires, and the several peripheral devices of the fully differential amplifier bare chip and its interconnection pins are interconnected via bonding wires.

10. The packaging method of the integrated packaging module of the front-end conditioning circuit for gravitational waves according to claim 8, characterized in that: The input and output pins include: a signal to be tested input pin, a pilot signal input pin, a communication configuration pin and a differential signal output pin.

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