Metal honeycomb ice holding processing equipment for semiconductor refrigeration

Abstract

The invention belongs to the technical field of thin-wall metal cutting machining, and particularly relates to metal honeycomb ice holding machining equipment for semiconductor refrigeration. The invention provides metal honeycomb ice holding processing equipment for semiconductor refrigeration. The device comprises a clamp body 1.1, and is characterized in that a water container 1.3 is arranged in the clamp body 1.1, a temperature thermocouple 1.6 and a stirrer 2.1 are arranged on the side wall of the water container 1.3, a heating part 3.9 is arranged on the bottom surface of the water container 1.3, and semiconductor chilling plates 1.5 are arranged on the side wall of the water container 1.3 and the bottom surface of the water container 1.3; a water inlet 1.8 is formed in one side of the lower end of the clamp body 1.1, and a water outlet 1.9 is formed in the other side of the lower end of the clamp body 1.1; and cooling water cavities 1.7 are reserved between the inner wall of the clamp body 1.1 and the outer wall of the water container 1.3 and between the inner bottom surface of the clamp body 1.1 and the outer bottom surface of the water container.

Description

Technical Field

[0001] The invention belongs to the technical field of thin-wall metal cutting and processing, and in particular relates to a metal honeycomb ice holding and processing equipment for semiconductor refrigeration. Background Art

[0002] In view of the characteristics of light weight, high strength, good rigidity, long service life and good processing adaptability, metal alloys such as titanium alloy, nickel-based high-temperature alloy, aluminum alloy and other honeycomb material components are widely used in important national economy and people's livelihood fields such as aerospace, aviation, shipbuilding, etc. This kind of honeycomb component is mainly made of several thin-walled alloy strips pressed into corrugated shapes and welded in opposite directions, and belongs to a porous thin-walled structure. Although it has high strength along the axial direction of the honeycomb hole, its hole wall thickness is generally less than 0.1mm, and the equivalent strength in the radial direction is poor, which is a difficult to process thin-walled material with weak rigidity. In the machining process, the traditional holding and clamping method is adopted. This kind of component is constantly subjected to the radial force of the tool, which will inevitably produce a certain amount of extrusion deformation. At the same time, the cutting part is the weakest position in rigidity. During the processing, cutting avoidance often occurs, and the chip cannot be effectively cut and broken. There are often problems such as insufficient cutting and residual burrs, which leads to reduced manufacturing accuracy, and the yield rate is only about 30%, while the processing cost is as high as 90%. This leads to the metal honeycomb components obtained by traditional processing methods cannot meet the assembly requirements of aviation, affecting the practical function and processing cost of the product.

[0003] Therefore, it is usually necessary to effectively position and clamp the honeycomb components in honeycomb machining, especially in the milling of aerospace metal honeycomb materials. Relevant research has been conducted in China on improving the ice holding capacity of thin-walled parts. Domestic invention patent, patent number: ZL202210441745.6, invention name: An ice holding cooling fixture and its clamping method. This method uses water to fill the freezer and freeze to form solid ice to hold thin-walled components in ice, but this method still requires offline refrigeration of the refrigerator freezer, which takes a long time and the ice is easy to melt, affecting the long-term holding capacity. Domestic utility model patent, patent number: ZL93212141.1, patent name: Electric cooling ice-fixing fixture. The fixture lacks an ice control system and a rapid melting function after processing, and the holding capacity cannot be effectively controlled. Summary of the invention

[0004] The present invention is aimed at the above-mentioned problems and provides a metal honeycomb ice holding and processing equipment for semiconductor refrigeration.

[0005] To achieve the above object, the present invention adopts the following technical scheme, which includes a clamp body 1.1, characterized in that a water container 1.3 is arranged inside the clamp body 1.1, a temperature measuring thermocouple 1.6 and a stirrer 2.1 are arranged on the side wall of the water container 1.3, a heating component 3.9 is arranged on the bottom surface of the water container 1.3, and semiconductor cooling sheets 1.5 are arranged on the side wall of the water container 1.3 and the bottom surface of the water container 1.3;

[0006] A water inlet 1.8 is provided on one side of the lower end of the clamp body 1.1, and a water outlet 1.9 is provided on the other side of the lower end of the clamp body 1.1; a cooling water cavity 1.7 is left between the inner wall of the clamp body 1.1 and the outer wall of the water container 1.3, and between the inner bottom surface of the clamp body 1.1 and the outer bottom surface of the water container;

[0007] A positioning device 1.10 for the honeycomb workpiece 1.11 is arranged in the middle of the inner bottom surface of the water container 1.3, and supporting plates 2.3 for the honeycomb workpiece 1.11 are arranged on the inner bottom surface of the water container 1.3 on both sides of the positioning device 1.10;

[0008] A pressing plate 2.7 of the honeycomb workpiece 1.11 is arranged at the upper end of the water container 1.3.

[0009] As a preferred solution, the upper end of the water container 1.3 of the present invention has a connecting plate extending outward, and the connecting plate is connected to the upper end of the clamp body 1.1 through a fastener 1.2.

[0010] As another preferred solution, the fastener 1.2 of the present invention is a screw.

[0011] As another preferred embodiment, the water container 1.3 of the present invention is made of low thermal conductivity Ti-6Al-4V titanium alloy material, and the surface of the water container 1.3 is subjected to micro-arc oxidation to form a ZrO2 thermal insulation ceramic coating.

[0012] As another preferred embodiment, the semiconductor cooling sheet 1.5 of the present invention is arranged in holes on the side wall and the bottom surface of the water container 1.3, and a sealing ring 1.4 is arranged between the outer wall of the semiconductor cooling sheet 1.5 and the hole wall.

[0013] As another preferred embodiment, the upper and lower parts of the two side walls of the water container 1.3 in the length direction of the present invention are provided with semiconductor cooling plates 1.5, and semiconductor cooling plates 1.5 are provided on both sides of the bottom surface of the water container 1.3; the middle parts of the two side walls of the water container 1.3 in the length direction are provided with temperature measuring thermocouples 1.6; and the two side walls of the water container 1.3 in the width direction are provided with agitators 2.1.

[0014] As another preferred embodiment, the positioning device 1.10 of the present invention includes a rotating plate 5.1, the upper end of the stud 5.2 passes through the center hole of the rotating plate 5.1 and is screwed with a nut 5.3, and horizontal strip-shaped notches 2.4 are provided on both sides of the rotating plate 5.1; a positioning diamond pin 5.4 is provided at the notch 2.4 on one side, and a positioning cylindrical pin 5.7 is provided at the notch 2.4 on the other side; the screws at the lower ends of the positioning diamond pin 5.4 and the positioning cylindrical pin 5.7 pass through the notch 2.4 and the washer 5.5 in turn and are screwed with a nut 5.6; the lower end of the stud 5.2 is screwed into the threaded hole on the bottom surface of the water container 1.3.

[0015] As another preferred solution, both sides of the support plate 2.3 of the present invention are connected to the bottom surface of the water container 1.3 by screws 2.2.

[0016] As another preferred scheme, the semiconductor refrigeration plate 1.5 described in the present invention is connected in series and connected to the output end of the controllable power supply 3.3 through the cable 3.4, the control signal input end of the controllable power supply 3.3 is connected to the control signal output end of the programmable controller (PLC) 3.2, and the control signal input end of the programmable controller 3.2 is connected to the control signal output end of the processor 3.1; the detection signal output port of the temperature measuring thermocouple 1.6 is connected to the detection signal input port of the processor 3.1; the control signal output end of the programmable controller 3.2 is respectively connected to the control signal input end of the agitator motor 3.7, the control signal input end of the circulating pump motor 3.8, and the control signal input end of the heating component 3.9.

[0017] As another preferred solution, the heating component 3.9 of the present invention adopts a heating resistor.

[0018] As another preferred solution, the heating resistor of the present invention is connected to the bottom surface of the water container 1.3 through a buckle 4.3 and a screw, the heating resistor is arranged in a serpentine shape, and both ends of the heating resistor are connected to the wire 4.4.

[0019] Secondly, the relationship between the ratio of the honeycomb ice holding strength to the honeycomb tensile strength at freezing temperature and the 1.11 elastic modulus of the honeycomb workpiece at freezing temperature is as follows:

[0020]

[0021] Where: P T(x,y,z) is the holding strength of honeycomb ice in x, y and z directions (MPa), δ T is the honeycomb tensile strength (MPa), T is the temperature (℃), E w is the elastic modulus of the workpiece (GPa), ΔL w is the radial dimension change of the workpiece, ΔL i is the radial size variation of ice.

[0022] In addition, the ice holding strength of the present invention is obtained as follows:

[0023] (1) Apply a force perpendicular to the table surface to the honeycomb workpiece 1.11, with the force increasing from small to large, until the honeycomb workpiece 1.11 loosens and falls off from the holding processing equipment, and record the applied force F z The z-direction holding function of the holding processing equipment is achieved by the static friction between the ice injected into the honeycomb core of the honeycomb workpiece 1.11 and the n side walls of the honeycomb. During the processing, the static friction between the honeycomb and the ice is F f With F zAchieve balance to prevent the honeycomb core from moving in the z direction; the following formula is used to express the z-direction honeycomb ice retention strength P Tz ;

[0024]

[0025] Where: S z is the total contact area between ice and the side wall of a single honeycomb (m 2 ).

[0026] (2) When the honeycomb wall is subjected to a load F perpendicular to the honeycomb wall r When the honeycomb wall is subjected to the x-direction honeycomb ice holding strength P Tx Equal to the compressive strength of ice σ Ti , and at the same time is greater than the extrusion stress of the honeycomb under load, and less than the ultimate tensile strength δ T ;

[0027]

[0028] Where: F r is the applied load (N), α is the angle between two adjacent sides of the honeycomb ( o ), S xy is the contact area between the honeycomb wall and the applied load (m 2 ).

[0029] The invention has beneficial effects.

[0030] The invention relates to a clamp device which utilizes semiconductor refrigeration function and controls its ability to hold a metal honeycomb, thereby realizing a process method for efficient clamping and high-precision cutting of a weak-rigidity metal honeycomb component.

[0031] The present invention overcomes the deficiencies of conventional ice holding capabilities and invents a new method for metal honeycomb ice holding processing using semiconductor refrigeration. The method is highly practical and adopts a universal fixture design concept, thereby ensuring the standardization and universalization of the ice holding fixture device in structural design, as well as the serialization of a series of fixture devices developed later.

[0032] The technical solution adopted by the present invention is a method for holding metal honeycomb ice by semiconductor refrigeration. Semiconductor refrigeration is a technology that uses the Peltier effect of semiconductor materials to achieve refrigeration. The refrigeration capacity can be controlled by controlling the current flowing through the semiconductor couple, and the refrigeration and heating functions can be changed by controlling the direction of the current, so as to facilitate the rapid melting of ice after refrigeration. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] The present invention is further described below in conjunction with the accompanying drawings and specific implementation methods. The protection scope of the present invention is not limited to the following description.

[0034] Figure 1-Cross-sectional view of ice holding fixture device. Including: 1.1-clamp body, 1.2-fastener, 1.3-water container, 1.4-sealing ring, 1.5-semiconductor cooling plate, 1.6-temperature measuring thermocouple, 1.7-cooling water chamber (cooling water is drawn in the cooling water chamber), 1.8-water inlet, 1.9-water outlet, 1.10-positioning device, 1.11-honeycomb workpiece.

[0035] Figure 2 -Top view of the ice holding fixture, wherein 2.1 - stirrer, 2.2 - screw, 2.3 - support plate, 5.4 - positioning diamond pin, 5.7 - positioning cylindrical pin, 2.6 - screw, 2.7 - pressure plate, 2.8 - U-shaped opening, 2.9 - pin hole.

[0036] Figure 3 - Layout of semiconductor cooling chip. Among them: 3.1-processor, 3.2-programmable controller PLC, 3.3-controllable power supply, 3.4-cable, 1.5-semiconductor cooling chip, 1.6-temperature measuring thermocouple, 3.7-agitator motor, 3.8-circulation pump motor, 3.9-heating component.

[0037] Figure 4 - Heating system diagram. Including: 1.3-water container, 4.3-clip, 4.4-connecting wire.

[0038] Figure 5 , Figure 6 —Location device diagram. Including: 5.1-disc, 5.2-stud, 5.3-nut, 5.4-locating diamond pin, 5.5-washer, 5.6-nut 2, 5.7-locating cylindrical pin.

[0039] Figure 7 - Diagram of support plates at different heights.

[0040] Figure 8 - Structural diagram of the pressure plate related components.

[0041] Fig. 9 - Temperature control flow chart. DETAILED DESCRIPTION

[0042] like Figure 1As shown, the clamping process of the honeycomb workpiece 1.11 is as follows. First, place the clamp body 1.1 on a flat workbench, and use the fastener 1.2 to fix the water container 1.3 on the clamp body 1.1. The water container 1.3 is made of low thermal conductivity Ti-6Al-4V titanium alloy material, and the surface is micro-arc oxidized to generate a ZrO2 thermal insulation ceramic coating. The water inlet 1.8 is connected to the water pipe to inject cooling water into the cooling water chamber 1.7. Cooling water is injected into the cooling water chamber 1.7, and the cooling water in the cooling water chamber 1.7 is circulated through the circulating pump motor 3.8 to complete the heat exchange process of the semiconductor refrigeration plate 1.5. The semiconductor refrigeration plate 1.5 cools on one side and generates heat on the other side, which needs to be dissipated.

[0043] The water container 1.3 and the clamp body 1.1 are made into a detachable structure, the processing technology is simple, and it is easy to process a qualified shape to achieve the required function.

[0044] The circulation pump inlet can be connected to the external water tank outlet, the circulation pump outlet can be connected to the water inlet 1.8, and the water outlet 1.9 can be connected to the external water tank inlet.

[0045] like Figure 2 As shown, the stirrer 2.1 is installed on the side wall of the water container 1.3, and the support plate 2.3 is installed on the bottom surface of the water container 1.3 by screws 2.2. The honeycomb workpiece 1.11 is placed on the support plate 2.3, and the positioning device 1.10 is equipped with positioning pins (positioning diamond pins 5.4 and positioning cylindrical pins 5.7). The positions of the positioning pins are adjusted so that the positioning pins are inserted into the two positioning holes on the honeycomb workpiece 1.11 to limit the freedom of the honeycomb workpiece 1.11 and complete the positioning work.

[0046] like Figure 1 , 8 As shown, first, screw the bolt 2.6 and the screw 9.2 into the water container 1.3. Then, insert the spring 9.3, the washer 1 9.4 and the pressure plate 2.7 into the bolt 2.6 in sequence. When the pressing end of the pressure plate 2.7 contacts the upper surface of the honeycomb, adjust the height of the screw 9.2 so that the top of the screw 9.2 contacts the bottom surface of the end of the pressure plate 2.7 to ensure that the pressure plate 2.7 remains horizontal. Then, continue to insert the washer 2 9.6 into the bolt 2.6. Finally, screw the nut 9.7 into the bolt 2.6 and tighten it to complete the clamping work.

[0047] The support plate 2.3 is detachably connected to the water container 1.3. The support plates 2.3 of different heights can be replaced according to the honeycomb height of the honeycomb workpiece 1.11. For example, a short support plate 2.3 can be selected for a high honeycomb.

[0048] The positioning cylindrical pin 5.7 limits two degrees of freedom of movement of the honeycomb workpiece 1.11, the diamond pin 5.4 limits one degree of freedom of rotation of the honeycomb workpiece 1.11, and the supporting plate 2.3 limits two rotations and one movement of the honeycomb workpiece 1.11, a total of six degrees of freedom, to achieve complete positioning.

[0049] like Figure 3 As shown, the processor 3.1 is connected to the input end of the programmable controller (PLC) 3.2 by using a cable, and the output terminal of the programmable controller (PLC) 3.2 is connected to the input end of the controllable power supply 3.3 by using a cable, the semiconductor cooling plate 1.5 is connected in series by using a cable and connected to the output end of the controllable power supply 3.3, the temperature measuring thermocouple 1.6 is connected to the processor 3.1, and the agitator motor 3.7, the circulating pump motor 3.8 and the heating component 3.9 are connected to the output end of the programmable controller (PLC) 3.2.

[0050] like Figure 4 As shown, the heating component 3.9 is arranged on the bottom surface of the water container 1.3 and fixed by means of a buckle 4.3 and a screw, and two joints of the heating component 3.9 are connected to the wires 4.4.

[0051] As another preferred solution, the buckle 4.3 of the present invention may adopt a U-shaped clip from the following website: https: / / e.tb.cn / h.TkkMtkMs3rhPGBX?tk=ljTzedjzazd HU287.

[0052] like Figure 5 As shown, initially the nut 5.3 is not tightened, the turn plate 5.1 can rotate around the stud 5.2, and the center hole of the turn plate 5.1 is a light hole without threads. According to the deflection angle between the positioning hole on the honeycomb workpiece 1.11 and the notch 2.4 of the turn plate 5.1, the rotation angle of the turn plate 5.1 is determined, so that the positioning diamond pin 5.4 and the positioning cylindrical pin 5.7 at the notch 2.4 can be inserted into the positioning hole on the honeycomb workpiece 1.11, and then the nut 5.3 is tightened to fix the turn plate 5.1, so that the turn plate 5.1 remains stationary. Then, according to the radial size of the center of the honeycomb positioning distance clamp body 1.1, the positioning diamond pin 5.4 and the positioning cylindrical pin 5.7 are slid horizontally through the notch 2.4 and placed at the desired position, and the positioning diamond pin 5.4 and the positioning cylindrical pin 5.7 are fixed by the washer 5.5 and the nut 5.6, so that the positioning diamond pin 5.4 and the positioning cylindrical pin 5.7 are inserted into the two positioning holes on the honeycomb workpiece 1.11.

[0053] In order to improve the clamping efficiency of honeycomb materials, shorten the freezing time, enable the clamp system to clamp the metal honeycomb workpiece with ice and maintain the freezing temperature, and realize the rapid melting of ice and disassembly of the workpiece after the honeycomb processing is completed, the specific steps of the implementation method of the present invention are as follows:

[0054] 1. When the sealing ring 1.4 and the semiconductor cooling sheet 1.5 are installed on the water container 1.3, the inner and outer surfaces of the sealing ring 1.4 need to be close to the water container 1.3 and the semiconductor cooling sheet 1.5, and their bottom surfaces should be on the same surface. They can be installed on the clamp body 1.1 only after the water pressure test shows that there is no leakage;

[0055] 2. Based on the height and bottom surface of the honeycomb workpiece 1.11, select the support plate 2.3 that is adapted to the honeycomb height, and use a level to measure the top surface of the support plate 2.3 to keep the top surface level, ensuring that the bottom surface of the honeycomb workpiece 1.11 is used as a positioning surface to limit the x- and y-axis rotation and z-axis movement freedom. The bottom surface of the honeycomb workpiece 1.11 must be horizontal, and the top surface of the support plate 2.3 is in contact with the bottom surface of the honeycomb workpiece 1.11 to achieve positioning freedom restriction.

[0056] 3. When the positioning device 1.10 is installed in the blind hole in the middle of the water container 1.3, it is necessary to ensure that the axis of the rotating plate 5.1 is perpendicular to the bottom surface of the clamp body 1.1, and at the same time, it is necessary to ensure that the axes of the positioning diamond pin 5.4 and the positioning cylindrical pin 5.7 are parallel to the axis of the rotating plate 5.1, so that the positioning cylindrical pin 5.7 limits the movement in the x and y directions and the positioning diamond pin 5.4 limits the freedom of rotation in the z axis, meeting the requirements of the one-side two-hole positioning method and achieving complete positioning.

[0057] 4. After positioning, the clamping portion of the non-processed area of ​​the upper surface of the honeycomb workpiece 1.11 is clamped by the pressing plate 2.7, and then pure water is injected into the water container 1.3.

[0058] The freezing temperature setting scheme is as follows:

[0059] At ultra-low temperatures, the volume of ice increases as the temperature decreases. When ice is held, the lower the temperature, the smaller the volume of the metal honeycomb, and the greater the ice holding force on the honeycomb. However, due to the poor radial stiffness of the honeycomb, a greater holding force will affect the deformation of the honeycomb, thereby affecting the size after processing. It is necessary to set the honeycomb ice holding strength and the honeycomb tensile strength at freezing temperatures (-10℃~-55℃) to maintain a balanced relationship, and their ratio and the workpiece elastic modulus at freezing temperatures are as follows:

[0060]

[0061] Where: P T(x,y,z) is the holding strength of honeycomb ice in x, y and z directions (MPa), δ T is the honeycomb tensile strength (MPa), T is the temperature (℃), E w is the elastic modulus of the workpiece (GPa), ΔL w is the radial dimension change of the workpiece, ΔL i is the change in the radial size of ice. Honeycomb tensile strength (MPa)δ T Can be measured by laboratory tensile testing. ΔL w The above formula is specifically used to set the ice holding parameters to prevent the honeycomb from being unable to recover its original shape after being subjected to the holding force and undergoing plastic deformation. It requires that the ice holding strength under ice holding conditions and the honeycomb tensile strength must maintain a state of equilibrium. This equilibrium state is specifically measured by the workpiece elastic modulus E at a certain temperature.w , Workpiece radial dimension change ΔL w and ice radial size change ΔL i To measure.

[0062] The scheme for obtaining ice holding strength is as follows:

[0063] (1) Apply a force perpendicular to the table surface (i.e., an upward force in the z direction, Fz, equivalent to pulling up the honeycomb) to the honeycomb workpiece 1.11, with the force increasing from small to large (the initial value of the applied force can be set to 0, and then the honeycomb workpiece is pulled upward at a pulling force of 5N / s) until the honeycomb core loosens and falls off the holding platform, and record the applied force F z (i.e., the force that eventually causes the honeycomb workpiece 1.11 to fall off), the z-direction holding action of the holding platform is achieved by the static friction between the ice injected into the honeycomb core and the n side walls of the honeycomb (after freezing and bonding, each honeycomb wall and the ice are in a relatively static state, and when a load is applied to the honeycomb, a static friction force is generated between the honeycomb and the ice). During the processing, the static friction force F between the honeycomb and the ice f With F z Achieve balance and prevent the honeycomb core from moving in the z direction. Therefore, the z-direction holding strength P is expressed by the following formula: Tz .

[0064]

[0065] Where: S z is the total contact area between ice and the side wall of a single honeycomb (m 2 ). z For the z-direction cutting force, the ice holding focus is to suppress the x- and y-direction loads (x- and y-direction cutting forces).

[0066] For a regular hexagonal honeycomb, S z =6lz h , where l is the side length of the regular hexagon (m), z h is the height of the honeycomb in the z-axis direction (m). The formula can be changed to

[0067]

[0068] Where: m is the number of honeycombs in the honeycomb material.

[0069] (2) The purpose of ice fixation is to increase the x- and y-direction honeycomb stiffness, that is, to increase the x- and y-direction fixation strength. As long as the ice in the honeycomb does not deform, the honeycomb will not deform. When the honeycomb wall is subjected to a load F perpendicular to the honeycomb wall, r (That is, use a horizontal force, such as P Tx , to push the honeycomb workpiece after holding, the holding strength P of the honeycomb wall TxShould be equal to the compressive strength of ice σ Ti , and should be greater than the extrusion stress of the honeycomb under load and less than the ultimate tensile strength δ T .

[0070]

[0071] Where: F r is the applied load (N), α is the angle between two adjacent sides of the honeycomb ( o ), S xy is the contact area between the honeycomb wall and the applied load (m 2 ). Ty It is applied by pushing the honeycomb workpiece with a horizontal force after being held. Tx and P Ty It is the cutting force in the x and y directions in actual machining.

[0072] The specific operation mode of the device of the present invention is as follows:

[0073] 1. If Figure 1 , 2 As shown, the sealing ring 1.4 is pressed into the square hole of the water container 1.3, and then the semiconductor cooling plate 1.5 is installed into the sealing ring 1.4, ensuring that the sides of the semiconductor cooling plate 1.5 and the sealing ring 1.4 are on the same plane as the corresponding sides of the water container 1.3.

[0074] 2. If Figure 1 , 2 As shown, the temperature measuring thermocouple 1.6 is screwed into the hole of the water container 1.3, and four stirrers 2.1 are installed on the side wall of the water container 1.3, and the temperature measuring thermocouple 1.6 and the stirrers 2.1 are connected to the processor 3.1 by wires.

[0075] 3. If Figure 3 As shown, the semiconductor cooling plates 1.5 are connected in series by cables and are connected to a programmable controller (PLC) 3.2 and a processor 3.1 in sequence.

[0076] 4. If Figure 4 As shown, the heating resistor 3.9 is placed in the water container 1.3 and fixed with a buckle 4.3, two joints are connected to the wire 4.4, and then the connecting wire 4.4 is connected to the processor 3.1.

[0077] 5. If Figure 1 , 2 As shown, the support plate 2.3 is mounted on the water container 1.3 by means of screws 2.2, ensuring that the top surface is a parallel surface and meets the positioning requirements of the positioning surface of the honeycomb workpiece 1.11 to be processed.

[0078] 6. If Figure 5As shown, based on the position of the positioning hole of the honeycomb workpiece 1.11, the circumferential angle and radial coordinate of the positioning cylindrical pin 5.7 and the positioning diamond pin 5.4 on the rotating plate 5.1 are adjusted to complete the assembly of the positioning device 1.10 components, and then the installed positioning components are installed in the blind hole in the middle position of the water container 1.3.

[0079] 7. If Figure 2 As shown, the positioning holes of the honeycomb workpiece 1.11 are inserted into the positioning pins (positioning cylindrical pins 5.7 and positioning diamond pins 5.4), and at the same time, the bottom surface of the honeycomb workpiece 1.11 and the top surface of the support plate 2.3 are in plane contact positioning, and then the clamping work of the honeycomb workpiece 1.11 is realized by the pressing plate 2.7.

[0080] 8. If Figure 1 As shown, the assembled water container 1.3 is installed on the clamp body 1.1 by screws 1.2, and then the clamp body 1.1 is clamped to the workbench of the CNC machine tool. U-shaped openings 2.8 and pin holes 2.9 can be set on both sides of the clamp body 1.1. The fixture 1.1 is fixed to the machine tool workbench with fixing bolts through the U-shaped opening 2.8, and then the positioning pin is inserted into the pin hole 2.9 and positioned with the workbench hole. After that, water is poured into the inner cavity (cooling water cavity 1.7) from the water inlet 1.8 until it is full, and water is poured into the water container 1.3 at the same time until the water just covers the workpiece.

[0081] 9. If Figure 3 , 8 , first set the freezing temperature T in processor 3.1 设 (T 设 The temperature T of the pure water in the water container 1.3 is measured by using the temperature measuring thermocouple 1.6. 测 ; Then, by comparing T 设 and T 测 , when ΔT=|T 测 -T 设 |≥2℃, the processor 3.1 starts the programmable controller (PLC) 3.2, and the programmable controller (PLC) 3.2 starts the controllable power supply 3.3, then the semiconductor cooling sheet 1.5 starts to work, and the agitator motor 3.7 and the circulating pump motor 3.8 start to work. 测 =0°C, the processor 3.1 controls the agitator motor 3.7 to stop working; then when ΔT=|T 测 -T 设|<2℃, and maintain it for 5 minutes, then perform milling and tool setting, and then start the spindle for milling processing (the milling cutter enters from the top of the device of the present invention to mill the honeycomb workpiece 1.11. The milling cutter processes the honeycomb workpiece 1.11 when the honeycomb workpiece 1.11 is frozen. The milling cutter first penetrates the ice and then processes the honeycomb workpiece 1.11). Finally, after the honeycomb workpiece 1.11 is processed, the processor 3.1 controls the circulating pump motor 3.8 to stop working, and at the same time starts the heating resistor 3.9 to heat the pure ice. After the pure ice melts, the honeycomb workpiece 1.11 is taken out, completing the entire process of honeycomb ice holding processing.

[0082] Compared with the existing offline freezing fixation of refrigerators, the present invention is a semiconductor refrigerator ice fixation metal honeycomb processing method, which can enhance the honeycomb fixing ability, maintain a long-term fixing state, and fully consider the fixing temperature and fixing strength and the influence of internal stress on the fixing accuracy (for the offline freezing fixation method, as the processing time, the freezing temperature cannot be maintained, the ice will melt and the temperature will rise, resulting in changes in the fixing strength, so the fixing state and ability of the ice fixation cannot be accurately guaranteed, affecting the processing accuracy, while the present invention can maintain a stable freezing temperature, and can obtain accurate fixing and machinability), and realizes the need for rapid ice melting (heating resistance 3.9 ice melting) of the workpiece after the processing is completed and disassembled, improves the cutting efficiency of difficult metal thin-wall honeycombs, and suppresses the processing defects of curling, open welding, and deformation. The method can be very effectively used for CNC machine tools for cutting difficult-to-process metal honeycomb materials, and realizes efficient cutting of difficult-to-process weak-rigidity thin-wall honeycomb material workpieces.

[0083] The device of the present invention can realize the controllable function of ice holding capacity, improve the processing range of workpieces and the processing efficiency of metal honeycombs. (1) The adjustable positioning device 1.10 can realize the holding processing of metal honeycombs of different sizes, and the temperature control device and system can realize the honeycomb processing with different holding state requirements. (2) Compared with traditional cutting, the cutting accuracy and processing efficiency are improved. Compared with traditional offline ice holding, the temperature control device and system reduce the pre-freezing time, accurately maintain the ice holding temperature, and improve the processing accuracy.

[0084] It can be understood that the above specific description of the present invention is only used to illustrate the present invention and is not limited to the technical solutions described in the embodiments of the present invention. Those skilled in the art should understand that the present invention can still be modified or replaced by equivalents to achieve the same technical effects; as long as the use requirements are met, they are within the protection scope of the present invention.

Claims

1. A metal honeycomb ice holding processing equipment for semiconductor refrigeration, comprising a clamp body (1.1), characterized in that A water container (1.3) is arranged in the clamp body (1.1), a temperature measuring thermocouple (1.6) and a stirrer (2.1) are arranged on the side wall of the water container (1.3), a heating component (3.9) is arranged on the bottom surface of the water container (1.3), and semiconductor cooling sheets (1.5) are arranged on the side wall and the bottom surface of the water container (1.3); A water inlet (1.8) is provided on one side of the lower end of the clamp body (1.1), and a water outlet (1.9) is provided on the other side of the lower end of the clamp body (1.1); a cooling water cavity (1.7) is reserved between the inner wall of the clamp body (1.1) and the outer wall of the water container (1.3), and between the inner bottom surface of the clamp body (1.1) and the outer bottom surface of the water container; A positioning device (1.10) for the honeycomb workpiece (1.11) is arranged in the middle of the inner bottom surface of the water container (1.3), and supporting plates (2.3) for the honeycomb workpiece (1.11) are arranged on the inner bottom surface of the water container (1.3) on both sides of the positioning device (1.10); A pressing plate (2.7) of a honeycomb workpiece (1.11) is arranged at the upper end of the water container (1.3).

2. A metal honeycomb ice holding processing equipment for semiconductor refrigeration according to claim 1, characterized in that The upper end of the water container (1.3) has a connecting plate extending outward, and the connecting plate is connected to the upper end of the clamp body (1.1) via a fastener (1.2).

3. A metal honeycomb ice holding processing equipment for semiconductor refrigeration according to claim 1, characterized in that The water container (1.3) is made of a low thermal conductivity Ti-6Al-4V titanium alloy material, and the surface of the water container (1.3) is subjected to micro-arc oxidation to generate a ZrO2 thermal insulation ceramic coating.

4. A metal honeycomb ice holding processing equipment for semiconductor refrigeration according to claim 1, characterized in that The semiconductor cooling sheet (1.5) is arranged in holes on the side wall of the water container (1.3) and the bottom surface of the water container (1.3), and a sealing ring (1.4) is arranged between the outer wall of the semiconductor cooling sheet (1.5) and the hole wall.

5. A metal honeycomb ice holding processing equipment for semiconductor refrigeration according to claim 1, characterized in that Semiconductor cooling sheets (1.5) are arranged on the upper and lower parts of both side walls in the length direction of the water container (1.3), and semiconductor cooling sheets (1.5) are arranged on both sides of the bottom surface of the water container (1.3); temperature measuring thermocouples (1.6) are arranged in the middle parts of both side walls in the length direction of the water container (1.3); and stirrers (2.1) are arranged on both side walls in the width direction of the water container (1.3).

6. A metal honeycomb ice holding processing equipment for semiconductor refrigeration according to claim 1, characterized in that The positioning device (1.10) comprises a rotating plate (5.1), the upper end of a stud (5.2) passes through a central hole of the rotating plate (5.1) and is screwed with a nut (5.3), and transverse strip-shaped notches (2.4) are arranged on both sides of the rotating plate (5.1); a positioning diamond pin (5.4) is arranged at the notch (2.4) on one side, and a positioning cylindrical pin (5.7) is arranged at the notch (2.4) on the other side; the screws at the lower ends of the positioning diamond pin (5.4) and the positioning cylindrical pin (5.7) pass through the notch (2.4) and the washer (5.5) in turn and are screwed with a nut (5.6); the lower end of the stud (5.2) is screwed into a threaded hole on the bottom surface of the water container (1.3).

7. A metal honeycomb ice holding processing equipment for semiconductor refrigeration according to claim 1, characterized in that The semiconductor cooling sheets (1.5) are connected in series to the output end of the controllable power supply (3.3) through the cable (3.4); the control signal input end of the controllable power supply (3.3) is connected to the control signal output end of the programmable controller (3.2); the control signal input end of the programmable controller (3.2) is connected to the control signal output end of the processor (3.1); the detection signal output port of the temperature measuring thermocouple (1.6) is connected to the detection signal input port of the processor (3.1); the control signal output end of the programmable controller (3.2) is respectively connected to the control signal input end of the stirrer motor (3.7), the control signal input end of the circulating pump motor (3.8), and the control signal input end of the heating component (3.9).

8. A metal honeycomb ice holding processing equipment for semiconductor refrigeration according to claim 1, characterized in that The heating component (3.9) adopts a heating resistor.

9. A metal honeycomb ice holding processing equipment for semiconductor refrigeration according to claim 1, characterized in that The relationship between the ratio of the honeycomb ice holding strength to the honeycomb tensile strength at freezing temperature and the elastic modulus of the honeycomb workpiece (1.11) at freezing temperature is as follows: Where: P T(x,y,z) is the holding strength of honeycomb ice in x, y and z directions (MPa), δ T is the honeycomb tensile strength (MPa), T is the temperature (℃), E w is the elastic modulus of the workpiece (GPa), ΔL w is the radial dimension change of the workpiece, ΔL i is the radial size variation of ice.

10. A semiconductor refrigeration metal honeycomb ice holding processing equipment according to claim 9, characterized in that The ice holding strength is obtained as follows: (1) Apply a force perpendicular to the table surface to the honeycomb workpiece (1.11) from small to large until the honeycomb workpiece (1.11) loosens and falls off from the holding processing equipment. Record the applied force F z The z-direction holding function of the holding processing equipment is achieved by the static friction between the ice injected into the honeycomb core of the honeycomb workpiece (1.11) and the n side walls of the honeycomb. During the processing, the static friction F between the honeycomb and the ice is f With F z Achieve balance to prevent the honeycomb core from moving in the z direction; the following formula is used to express the z-direction honeycomb ice retention strength P Tz ; Where: S z is the total contact area between ice and the side wall of a single honeycomb (m 2 ). (2) When the honeycomb wall is subjected to a load F perpendicular to the honeycomb wall r When the honeycomb wall is subjected to the x-direction honeycomb ice holding strength P Tx Equal to the compressive strength of ice σ Ti , and at the same time is greater than the extrusion stress of the honeycomb under load, and less than the ultimate tensile strength δ T ; Where: F r is the applied load (N), α is the angle between two adjacent sides of the honeycomb (°), S xy is the contact area between the honeycomb wall and the applied load (m 2 ).

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