Method and system for measuring and calculating weight of PCB (Printed Circuit Board)

By analyzing the two-dimensional design drawings and stacking drawings of the PCB board, checking and confirming the information of the slot and copper blocks, and using pre-configured algorithms to calculate the precise weight of the PCB board, solving the problems of calculation complexity and inaccuracy in the prior art, and achieving accurate weight calculation and fast computing efficiency in the design stage.

CN119670670APending Publication Date: 2025-03-21CHENGDU JIACHI ELECTRONIC TECH CO LTD
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Patent Information

Application Number
CN202411751266.X
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-12-02
Publication Date
2025-03-21

AI Technical Summary

Technical Problem

The prior art has complexity and inaccuracy in calculating the weight of PCB boards, especially when dealing with special-shaped PCB boards, multi-layer material stacks, step grooves and copper blocks, resulting in low computational cost and efficiency.

Method used

By inputting the two-dimensional design diagram and stacked diagram of the PCB board, the analysis layer parses out the required parameter information, and the data verification layer checks and confirms the number and position of the slots, the number and position of the copper blocks, the depth of the slots or copper blocks. The calculation layer uses a pre-configured weight calculation algorithm to calculate the exact weight of the PCB board.

Benefits of technology

It achieves accurate grasp of the weight of PCB boards during the design stage, without the need to be processed into physical products for weighing, and the calculation is more accurate and fast, reducing calculation costs and improving efficiency.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention relates to a PCB weight measuring and calculating method and system. The method comprises the steps that a two-dimensional design drawing and a lamination drawing of a PCB are input through an input layer; analyzing the two-dimensional design drawing and the laminated drawing through an analysis layer, and reading parameter information required for calculating the weight of the PCB; checking and confirming the data analyzed by the analysis layer through a data checking layer, wherein the number and the position of grooves, whether copper blocks exist or not, the number and the position of the copper blocks and the depth of the grooves or the copper blocks are checked and confirmed; the calculation layer receives the data of the data checking layer to calculate the parameter information added to the PCB, and meanwhile, a pre-configured weight calculation algorithm is input to calculate the weight of the PCB. The weight of the PCB can be accurately mastered in the process of designing the PCB, the PCB does not need to be weighed after being machined according to a design drawing, and the weight of the PCB can be more accurately and rapidly calculated.
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Description

Technical Field

[0001] The present invention relates to the field of electronic devices, and in particular to a method and system for measuring the weight of a PCB board. Background Art

[0002] With the rapid development of aerospace, aerospace equipment must be lightweight, and the quality of aerospace components is subject to strict requirements. Many products need to be evaluated for weight at the beginning of their design to ensure that the product is within a reasonable weight range. PCB (printed circuit board) supports electronic components and provides circuit connections for electronic components to achieve electrical connections between electronic components. It has been widely used in the aerospace field. The existing method of calculating the weight of a PCB board requires first processing the physical object of the designed PCB board, and then manually calculating the weight of the various step grooves, embedded copper base and copper blocks of the PCB board, and then adding and subtracting them from the weight of the entire PCB board.

[0003] Currently, PCB weight is calculated based on the board's area × thickness × material density. However, PCB board structures present several issues: 1. Most PCBs are irregularly shaped, making area calculation more complex; 2. PCBs may be composed of multiple different materials, requiring multiple density calculations, further complicating the weight calculation; 3. PCBs contain numerous stepped grooves or embedded copper bases and copper blocks, leading to inaccurate calculations of the removed step groove weight and the weight of the copper base and copper blocks. Due to these issues with existing PCB weight calculation methods, current PCB weight calculations require either processing the designed PCB into a physical product for weighing, or undergoing complex and inaccurate calculations, resulting in low computational costs and efficiency. Summary of the Invention

[0004] The purpose of the present invention is to overcome the shortcomings of the prior art and provide a PCB board weight measurement method and system to solve the deficiencies of the prior art.

[0005] The object of the present invention is achieved through the following technical solution: a method for measuring the weight of a PCB board, the method comprising:

[0006] Step 1: Input the 2D design and stackup diagram of the PCB board through the input layer. The 2D design diagram shows the shape, size, number and location of the grooves of the PCB board. The stackup diagram shows the total number of PCB layers, thickness of each layer, and specific parameter information of various material distributions.

[0007] Step 2: Analyze the two-dimensional design drawing and the stack-up drawing through the analysis layer to read the parameter information required to calculate the weight of the PCB board;

[0008] Step 3: The data parsed by the parsing layer is checked and confirmed by the data verification layer, including the number and position of the slots, the presence of copper blocks, the number and position of the copper blocks, and the depth of the slots or copper blocks.

[0009] Step 4: The calculation layer receives the data from the data verification layer to calculate the parameter information added to the PCB board, and at the same time inputs the pre-configured weight calculation algorithm to calculate the weight of the PCB board.

[0010] The analyzing of the two-dimensional design drawing and the stacked drawing by the analysis layer includes:

[0011] S1. Read the number of layers, thickness of each layer, material type of each layer, and density parameter information of the PCB board from the stackup diagram;

[0012] S2. The total thickness of the PCB is H = h1 + h2 + ... + h n , h n Indicates the thickness of the nth material layer;

[0013] S3. Analyze the overall shape and area S of the PCB board from the graphics in the 2D design drawing of the PCB board;

[0014] S4, analyzing the number and position of milling slots;

[0015] S5. Calculate the area of ​​each milling slot as S1, S2, S3…

[0016] The number of the milling slots is determined based on the existence of closed areas in the PCB board. A closed area is a milling slot, and the position of each milling slot is determined based on the center coordinates of the closed area; the area of ​​each milling slot is determined based on the number of milling slot grids.

[0017] The weight calculation algorithm includes Where i = 0, ..., n, ρ i represents the density of the i-th material.

[0018] A PCB board weight measurement system includes an input layer, a parsing layer, a data checking layer, a calculation layer and an output layer;

[0019] The input layer is configured to receive an input two-dimensional design drawing and a stackup drawing of a PCB board;

[0020] The parsing layer is connected to the input layer and is configured to parse the two-dimensional design diagram and the stack-up diagram, and read the parameter information required to calculate the weight of the PCB board;

[0021] The data verification layer is connected to the parsing layer and is used to confirm the number and position of the slots, whether there are copper blocks, the number and position of the copper blocks, and the depth of the slots or copper blocks through the data parsed by the parsing layer;

[0022] The calculation layer is connected to the data verification layer and is configured to receive data provided by the data verification layer to calculate parameter information required by the PCB board, and calculate the weight of the PCB board according to a pre-configured weight calculation algorithm;

[0023] The output layer is configured to output the PCB board weight calculated by the calculation layer to the user.

[0024] The two-dimensional design drawing shows the shape, size, number and position of the grooves of the PCB board, and the stackup diagram shows the total number of layers of the PCB, the thickness of each layer, and specific parameter information of the distribution of various materials.

[0025] The analyzing of the two-dimensional design drawing and the stacked drawing by the analysis layer includes:

[0026] S1. Read the number of layers, thickness of each layer, material type of each layer, and density parameter information of the PCB board from the stackup diagram;

[0027] S2. The total thickness of the PCB is H = h1 + h2 + ... + h n , h n Indicates the thickness of the nth material layer;

[0028] S3. Analyze the overall shape and area S of the PCB board from the graphics in the 2D design drawing of the PCB board;

[0029] S4, analyzing the number and position of milling slots;

[0030] S5. Calculate the area of ​​each milling slot as S1, S2, S3…

[0031] The number of the milling slots is determined based on the existence of closed areas in the PCB board. A closed area is a milling slot, and the position of each milling slot is determined based on the center coordinates of the closed area; the area of ​​each milling slot is determined based on the number of milling slot grids.

[0032] The weight calculation algorithm includes Where i = 0, ..., n, ρ i represents the density of the i-th material, and S is the total area of ​​the PCB board.

[0033] The present invention has the following advantages: a PCB board weight measurement method and system can accurately grasp the weight of the PCB board during the design process, without having to weigh the PCB board after it is processed according to the design drawing, and can calculate the weight of the PCB board more accurately and quickly. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 It is a schematic diagram of the process of the present invention. DETAILED DESCRIPTION

[0035] In order to make the purpose, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application generally described and shown in the drawings here can be arranged and designed in various different configurations. Therefore, the detailed description of the embodiments of the present application provided below in conjunction with the drawings is not intended to limit the scope of protection of the application claimed for protection, but merely represents the selected embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without making creative work are within the scope of protection of the present application. The present invention is further described below in conjunction with the drawings.

[0036] like Figure 1 As shown, the present invention relates to a PCB board weight calculation system to ensure that the weight of the PCB board can be accurately and quickly calculated after the PCB board is designed without having to process the PCB board into a physical product; the system includes an input layer, a parsing layer, a data verification layer, a calculation layer, and an output layer.

[0037] Furthermore, the input layer is configured to receive the input two-dimensional design drawing (DXF format) and stackup diagram of the PCB board; the two-dimensional design drawing shows the shape, size, number and position of the PCB board; the stackup diagram can display the total number of layers of the PCB board, the thickness of each layer, and specific parameter information of the distribution of various materials.

[0038] The parsing layer is connected to the input layer. The parsing layer is configured to parse the two-dimensional design drawing and the stacking diagram, and read the parameter information required to calculate the weight of the PCB board.

[0039] Furthermore, the parsing layer performs the following steps to parse the input data:

[0040] S1. Read the number of layers, thickness of each layer, material type of each layer, and density parameter information of the PCB board from the stackup diagram;

[0041] The parameter information specifically includes: copper layer H 2n+1 , where n = 0, 1, 2..., material layer H 2n , material 1, material 2... material n, the thickness of each layer of material is h1, h2... h n , the densities of the materials are ρ1, ρ2…ρ n .

[0042] S2. The total thickness of the PCB is H = h1 + h2 + ... + h n , h nIndicates the thickness of the nth material layer;

[0043] S3. Analyze the overall shape and area S of the PCB board from the graphics in the 2D design drawing of the PCB board;

[0044] S4, analyzing the number and position of milling slots;

[0045] S5. Calculate the area of ​​each milling slot as S1, S2, S3…

[0046] Among them, the buried copper block can be regarded as a special slot, and the area of ​​the PCB board and the milling slot is based on the number of grids representing the milling slot (0.01×0.01mm 2 ) obtained.

[0047] The data verification layer is connected to the parsing layer. The data verification layer confirms the number and position of the slots, whether there are copper blocks and the number and position of the copper blocks, and the depth of the slots or copper blocks through the parsed data. When it is confirmed to be a milling slot, its weight is a negative value. When it is confirmed to be a copper block, its weight is a positive value. When it is confirmed to be a copper block, the weight of the milling slot at the location of the copper block is first subtracted (that is, a negative value is added), and then the weight of the copper block is added.

[0048] The calculation layer is connected to the data verification layer. The calculation layer is configured to receive the data provided by the data verification layer to calculate the parameter information required by the PCB board, and at the same time calculate the weight of the PCB board according to the pre-configured weight calculation algorithm. The weight calculation algorithm is Where i = 0, ..., n, ρ i represents the density of the i-th material, and S is the total area of ​​the PCB board.

[0049] The output layer is configured to output the PCB board weight calculated by the calculation layer to the user.

[0050] The foregoing description is merely a preferred embodiment of the present invention. It should be understood that the present invention is not limited to the form disclosed herein and should not be construed as excluding other embodiments. Rather, the present invention is capable of various other combinations, modifications, and improvements, and is capable of modifications within the scope of the concepts described herein, through the above teachings, or through techniques or knowledge in the relevant fields. Modifications and variations made by those skilled in the art do not depart from the spirit of the present invention.

Claims

1. A method for measuring the weight of a PCB board, characterized in that: The calculation method includes: Step 1: Input the 2D design and stackup diagram of the PCB board through the input layer. The 2D design shows the shape, size, number and position of grooves of the PCB board. The stackup diagram shows the total number of layers of the PCB, the thickness of each layer and the specific parameter information of the distribution of various materials. Step 2: Analyze the two-dimensional design drawing and the stacking diagram through the analysis layer to read the parameter information required to calculate the weight of the PCB board; Step 3: Verify and confirm the data parsed by the parsing layer through the data verification layer, including verifying and confirming the number and position of the slots, whether there are copper blocks and the number and position of the copper blocks, and the depth of the slots or copper blocks; Step 4: Receive data from the data verification layer through the calculation layer to calculate the parameter information added by the PCB board, and simultaneously input a pre-configured weight calculation algorithm to calculate the weight of the PCB board.

2. A PCB board weight measurement method according to claim 1, characterized in that: The analyzing of the two-dimensional design drawing and the stacking drawing by the analysis layer includes: S1. Read the number of layers, thickness of each layer, material type of each layer and density parameter information of the PCB board from the stackup diagram; S2. The total thickness of the PCB board is H = h1 + h2 + ... + h n ,h n Indicates the thickness of the nth material layer; S3, parse out the overall shape and area S of the PCB board from the graphics in the two-dimensional design drawing of the PCB board; S4, analyzing the number and position of milling slots; S5. Calculate the area of ​​each milling slot as S1, S2, S3… 3. A PCB board weight measurement method according to claim 2, characterized in that: The number of the milling grooves is determined according to the closed areas in the PCB board. A closed area is a milling groove, and the position of each milling groove is determined according to the center coordinates of the closed area; the area of ​​each milling groove is determined according to the number of grids of the milling groove.

4. A PCB board weight measurement method according to claim 2, characterized in that: Where i = 0, ..., n, ρ i represents the density of the i-th material.

5. A PCB board weight measurement system, characterized in that: It includes input layer, parsing layer, data checking layer, calculation layer and output layer; The input layer is configured to receive an input two-dimensional design drawing and a stacking drawing of a PCB board; The analysis layer is connected to the input layer, and is configured to analyze the two-dimensional design drawing and the stacking drawing, and read the parameter information required to calculate the weight of the PCB board; The data checking layer is connected to the analysis layer, and is used to confirm the number and position of the slots, whether there are copper blocks, the number and position of the copper blocks, and the depth of the slots or copper blocks through the data analyzed by the analysis layer; The calculation layer is connected to the data checking layer and is configured to receive data provided by the data checking layer to calculate parameter information required by the PCB board, and calculate the weight of the PCB board according to a pre-configured weight calculation algorithm; The output layer is configured to output the PCB board weight calculated by the calculation layer to the user.

6. A PCB board weight measurement system according to claim 5, characterized in that: The two-dimensional design drawing shows the shape, size, number and position of grooves of the PCB board, and the stackup diagram shows the total number of layers of the PCB, the thickness of each layer and specific parameter information of the distribution of various materials.

7. A PCB board weight measurement system according to claim 5, characterized in that: The analyzing of the two-dimensional design drawing and the stacking drawing by the analysis layer includes: S1. Read the number of layers, thickness of each layer, material type of each layer and density parameter information of the PCB board from the stackup diagram; S2. The total thickness of the PCB board is H = h1 + h2 + ... + h n ,h n Indicates the thickness of the nth material layer; S3. Analyze the overall shape and area S of the PCB board from the graphics in the two-dimensional design drawing of the PCB board; S4, analyzing the number and position of milling slots; S5. Calculate the area of ​​each milling slot as S1, S2, S3… 8. A PCB board weight measurement system according to claim 6, characterized in that: The number of the milling grooves is determined according to the closed areas in the PCB board. A closed area is a milling groove, and the position of each milling groove is determined according to the center coordinates of the closed area; the area of ​​each milling groove is determined according to the number of grids of the milling groove.

9. A PCB board weight measurement system according to claim 6, characterized in that: Where i = 0, ..., n, ρ i represents the density of the i-th material, and S is the total area of ​​the PCB board.