Drilling processing technology for flexible circuit board production

Abstract

The invention discloses a drilling processing technology for flexible circuit board production, and relates to the technical field of flexible circuit board processing. Comprising the steps of making preparation before drilling the flexible circuit board, setting parameters of a laser drilling machine, drilling the flexible circuit board, automatically recycling a carrier, checking a flexible circuit board workpiece and cleaning the laser drilling machine. The flexible circuit board can be conveyed to a designated position, the speed of conveying the flexible circuit board is stable, it can be guaranteed that the flexible circuit board of each material plate can fall onto the surface of the material plate, the machining precision of the flexible circuit board can be improved, the flexible circuit board on the upper surface of the material plate can be pushed out, and the machining efficiency of the flexible circuit board is improved. The flexible circuit board can be automatically pushed out from the surface of a material plate, and can be pushed by utilizing two stirring sheets, so that the flexible circuit board is moved from the position of a middle plate to the lower part of a blanking box, and the flexible circuit board can be automatically pushed out from the bottom end of the blanking box.

Description

Technical Field

[0001] The invention relates to the technical field of flexible circuit board processing, in particular to a drilling process for producing flexible circuit boards. Background Art

[0002] Flexible circuit boards are widely used in the electronics industry due to their thinness, softness, and bendability, especially in electronic devices that require high density, lightness, and three-dimensional assembly. The drilling process is one of the important links in the manufacture of flexible circuit boards. By rotating the flexible circuit board or the connecting hard board at its edge, the drilling process can achieve electrical connections between different layers or between different circuits.

[0003] In the prior art, the drilling process for producing flexible circuit boards has certain drawbacks. Since the flexible circuit board is thin and light, it is inconvenient to repeatedly place the flexible circuit board directly under the laser head each time. Since it is manually placed directly under the laser head, it cannot be accurately placed directly under the laser head, which affects the accuracy of the processing laser head. The process of manually placing the flexible circuit board requires repeatedly placing the flexible circuit board under the laser head and taking the flexible circuit board out from under the laser head, which is also troublesome and cannot realize automatic placement of the flexible circuit board under the laser head or automatic discharge of the flexible circuit board from under the laser head. Summary of the invention

[0004] The purpose of the present invention is to provide a drilling process for producing a flexible circuit board to solve the problems raised in the above background technology.

[0005] The purpose of the present invention can be achieved through the following technical solutions:

[0006] A drilling process for producing a flexible circuit board comprises the following steps:

[0007] Step 1: Make preparations before drilling holes in the flexible circuit board. Stack the flexible circuit board on the feeding structure of the laser drilling machine chassis. Position the circuit board while conveying it through the feeding structure. Adjust the power of the laser head according to the size of the hole to be drilled in the flexible circuit board, and ensure that the aperture at the processing location of the laser head is smaller than the reserved aperture of the carrier.

[0008] Step 2: Set the parameters of the laser drilling machine and adjust the drilling parameters according to the material, thickness, and aperture of the flexible circuit board;

[0009] Step 3: Drilling holes in the flexible circuit board. After all the preparations are completed, start the laser drilling machine to start the drilling operation. The laser head is lifted and lowered in the vertical direction by the lifting base. The distance between the laser head and the flexible circuit board is determined to drill holes in the flexible circuit board or the connecting hard board at the edge thereof. The drilled flexible circuit board is moved by the blanking structure, and the drilled flexible circuit board falls into the discharge trough along the blanking structure and the blanking trough, and the flexible circuit board falling from the feeding structure continues to move forward along the feeding structure, so that the processed flexible circuit board falls into the discharge trough.

[0010] Step 4: Automatic recycling of the carrier, the carrier is transported along the feeding structure to one end of the feeding structure and then moves in the reverse direction, until the carrier is transported along the feeding structure to the other end of the feeding structure and then moves in the reverse direction again, so that the carrier is automatically recycled repeatedly;

[0011] Step 5: Check the flexible circuit board and clean the laser drilling machine. After drilling, clean the drilling area of ​​the laser drilling machine chassis and check the drilling quality of the flexible circuit board, including the size of the hole, the accuracy of the hole position and the integrity of the hole wall.

[0012] The feeding structure in steps 1 to 5 is horizontally arranged in the middle of the upper end of the laser drilling machine chassis, and one end of the feeding structure is located directly below the laser head, the discharge trough is arranged below the same end of the feeding structure, and the feeding structure and the blanking structure are respectively arranged at the two ends of the feeding structure, the feeding structure includes a driving motor, the driving motor is arranged on one side of the laser drilling machine chassis, the end of the driving motor is provided with a gear 1 and a gear 2 that mesh with each other, and the interior of the laser drilling machine chassis is horizontally provided with a rotating shaft 1 and a rotating shaft 2 that are parallel to each other, the rotating shaft 1 and the gear 1 rotate synchronously, the rotating shaft 2 and the gear 2 rotate synchronously, and the rotating shaft 1 The cylindrical surfaces of the rotating shaft 2 are both provided with spiral groove 1 and spiral groove 2, the spiral rotation directions of spiral groove 1 and spiral groove 2 are opposite, and the number of spiral wire heads of spiral groove 1 and spiral groove 2 are both two, and the ends of spiral groove 1 and spiral groove 2 are provided with smoothly connected material guide grooves, and the interior of the laser drilling machine chassis and the side walls of the rotating shaft 1 and the side walls of the rotating shaft 2 are both provided with a material guide bar 2 and two material guide bars 1, and the material guide bar 2 is located between the two material guide bars 1, and the carrier of steps 1 to 5 is a material plate, and the four corners of the material plate are located inside the two spiral grooves 1 and the two spiral grooves 2, and the four corners of the material plate are slidably connected to the material guide bar 2.

[0013] As a preferred technical solution of the present invention, a mounting seat is welded between the bottom end of the driving motor and the side wall of the laser drilling machine chassis, and fixed frames are provided at both ends of the rotating shaft one and the rotating shaft two, and the two fixed frames are respectively installed on the surface of the mounting seat and the blanking trough, and the rotating shaft one and the rotating shaft two are rotatably connected to the fixed frames.

[0014] As a preferred technical solution of the present invention, when the material plate is located between the guide bar 2 and the guide bar 1 above, the two corners on one side of the material plate are movably connected to the two spiral grooves 2 of the rotating shaft 1, and the two corners on the other side of the material plate are movably connected to the two spiral grooves 1 of the rotating shaft 2, and the material plate moves toward the blanking structure.

[0015] As a preferred technical solution of the present invention, when the material plate is located between the material guide bar 2 and the material guide bar 1 below, the two corners on one side of the material plate are respectively movably connected to the two spiral grooves 1 of the rotating shaft 1, and the two corners on the other side of the material plate are respectively movably connected to the two spiral grooves 2 of the rotating shaft 2, and the material plate moves toward the feeding structure.

[0016] As a preferred technical solution of the present invention, the blanking structure is arranged on the end face of the blanking trough, and the blanking structure includes a connecting plate welded at the blanking trough, the ends of the connecting plate are located below the ends of the rotating shaft one and the rotating shaft two, a middle groove is opened in the middle of the material plate, a fixed plate is welded on the surface of the connecting plate and located below the middle groove, a rotating plate is arranged on the edge of the fixed plate, the rotating plate is rotatably connected to the fixed plate through a connecting pin, and a torsion spring is arranged on the cylindrical surface of the connecting pin, the two ends of the torsion spring are respectively in contact with the fixed plate and the rotating plate, and the position of the rotating plate is aligned with the position of the middle groove.

[0017] As a preferred technical solution of the present invention, the rotating plate contacts the flexible circuit board on the surface of the material plate, the width of the rotating plate is smaller than the width of the middle groove, and the flexible circuit board slides along the connecting plate and the blanking groove.

[0018] As a preferred technical solution of the present invention, the feeding structure includes a toggle piece 1 and a toggle piece 2, the toggle piece 1 is welded to the end face of gear 1, the toggle piece 2 is welded to the end face of gear 2, the toggle piece 1 and the toggle piece 2 have opposite rotation directions, a blanking box is arranged on the side wall of the laser drilling machine chassis and above the rotating shaft 1 and the rotating shaft 2, reserved grooves are opened at the bottom ends of both sides of the blanking box, and an intermediate plate is arranged at the bottom end of the blanking box, and the spiral surface of the toggle piece 1 and the spiral surface of the toggle piece 2 are respectively in contact with the reserved grooves on both sides of the intermediate plate.

[0019] As a preferred technical solution of the present invention, the end position of the toggle piece one, the end position of the toggle piece two and the edge position of the middle plate are aligned, the thickness of the middle plate is greater than the thickness of the flexible circuit board, the thickness of the toggle piece one and the toggle piece two is adapted to the thickness of the flexible circuit board, and the bottom end of the blanking box is a through groove.

[0020] As a preferred technical solution of the present invention, the distance between the laser of the laser head and the flexible circuit board in the step three is affected by the laser power of the laser drilling machine, and the limit depth of penetration of the laser drilling machine's laser is located at the guide bar two. In the step four, the carrier moves successively above and below the guide bar two.

[0021] Compared with the prior art, the present invention has the following beneficial effects:

[0022] A feeding structure is provided, through which the four corners of the material plate slide along the spiral groove 1 and the spiral groove 2, so as to move the flexible circuit board on the surface of the material plate to the bottom of the laser head, and the flexible circuit board can be transported to the designated position, and the speed of transporting the flexible circuit board is relatively stable;

[0023] Through the automatic recycling process step of the carrier, the material plate can move along the upper and lower sides of the second material guide bar, and the material plate can be recycled along the spiral groove, and the linear distance between each material plate is the same, so that the flexible circuit board of each material plate can be ensured to fall onto the surface of the material plate, which is conducive to improving the processing accuracy of the flexible circuit board;

[0024] A blanking structure is provided. When the material plate reaches the end of the spiral groove, the rotating plate rotates around the connecting pin, so that the flexible circuit board on the upper surface of the material plate can be pushed out, and the flexible circuit board can be automatically pushed out from the surface of the material plate;

[0025] A feeding structure is provided. When the material plate moves to the bottom of the blanking box, the two toggle plates can be used to push the flexible circuit board, so that the flexible circuit board moves from the middle plate position to the bottom of the blanking box, and the flexible circuit board can be automatically pushed out from the bottom of the blanking box. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to facilitate understanding by those skilled in the art, the present invention is further described below with reference to the accompanying drawings.

[0027] Figure 1 It is the main structure diagram of the present invention;

[0028] Figure 2 It is a schematic diagram of the laser head and the blanking trough of the present invention;

[0029] Figure 3 It is a schematic diagram of the feeding structure of the present invention;

[0030] Figure 4 Schematic diagram of spiral groove 1 and spiral groove 2 of the present invention;

[0031] Figure 5 It is a schematic diagram of the blanking structure of the present invention;

[0032] Figure 6It is a schematic diagram of a fixed plate and a rotating plate of the present invention;

[0033] Figure 7 It is a schematic diagram of the feeding structure of the present invention;

[0034] Figure 8 It is a schematic diagram of the middle plate and two paddles of the present invention.

[0035] In the figure: 1. Laser drilling machine chassis; 2. Laser head; 3. Lifting machine base; 4. Material discharge trough; 5. Feeding structure; 6. Blanking structure; 7. Feeding structure; 8. Blanking trough; 51. Driving motor; 52. Gear 1; 53. Gear 2; 54. Rotating shaft 1; 55. Rotating shaft 2; 56. Material guide trough; 57. Spiral groove 1; 58. Spiral groove 2; 59. Material plate; 510. Material guide bar 1; 511. Material guide bar 2; 61. Connecting plate; 62. Middle groove; 63. Fixed plate; 64. Rotating plate; 65. Connecting pin; 66. Torsion spring; 71. Toggle plate 1; 72. Toggle plate 2; 73. Blanking box; 74. Reserved groove; 75. Middle plate. DETAILED DESCRIPTION

[0036] The technical solution of the present invention will be clearly and completely described below in conjunction with the embodiments. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0037] Embodiment 1:

[0038] See also Figure 1-Figure 3 As shown, a drilling process for producing a flexible circuit board is characterized by comprising the following steps:

[0039] Step 1: Make preparations before drilling holes in the flexible circuit board, stack the flexible circuit board on the feeding structure 7 of the laser drilling machine chassis 1, position the circuit board while conveying it through the feeding structure 5, place the flexible circuit board inside the feeding structure 7, and ensure that the flexible circuit board is neatly stacked inside the blanking box 73 of the feeding structure 7, and move each flexible circuit board through the feeding structure 7 and drop it onto the surface of the material plate 59, adjust the power of the laser head 2 according to the size of the hole drilled in the flexible circuit board, and ensure that the aperture processed by the laser head 2 is smaller than the reserved aperture of the carrier to prevent the laser emitted by the laser head 2 from damaging the carrier;

[0040] Step 2: Set the parameters of the laser drilling machine, and adjust the drilling parameters according to the material, thickness, and aperture of the flexible circuit board, so that the laser of the laser head 2 can drill holes in the flexible circuit board or the connecting hard board at its edge;

[0041] Step 3: Drilling holes in the flexible circuit board. After all the preparations are completed, start the laser drilling machine to start the drilling operation. The lifting base 3 is used to lift and lower the laser head 2 in the vertical direction. The distance between the laser of the laser head 2 and the flexible circuit board is affected by the laser power of the laser drilling machine, and the limit depth of the laser penetration of the laser drilling machine is located at the guide bar 2 511. The distance between the laser head 2 and the flexible circuit board is determined so as to drill holes in the flexible circuit board or the connecting hard board at its edge, so that the flexible circuit board can be processed at a specific position, and the drilled flexible circuit board is moved by the blanking structure 6, and the drilled flexible circuit board falls into the discharge trough 4 along the blanking structure 6 and the blanking trough 8, and the flexible circuit board falling from the feeding structure 7 continues to move forward along the feeding structure 5, and the carrier moves successively above and below the guide bar 2 511, so that the processed flexible circuit board falls into the discharge trough 4, and the flexible circuit board can be dropped from the material plate 59 of the feeding structure 5;

[0042] Step 4: Automatic recycling of the carrier, the carrier is transported along the feeding structure 5 to one end of the feeding structure 5 and then moves in the reverse direction, until the carrier is transported along the feeding structure 5 to the other end of the feeding structure 5 and then moves in the reverse direction again, and the shape of the spiral grooves of the two rotating shafts is used to limit the four corners of the material plate 59, so that the material plate 59 is moved along the guide strip 1 510 and the guide strip 2 511, so that the carrier is automatically recycled repeatedly;

[0043] Step 5: Check the flexible circuit board and clean the laser drilling machine. After the drilling is completed, the drilling area of ​​the laser drilling machine chassis 1 needs to be cleaned and the drilling quality of the flexible circuit board is checked, including the size of the hole diameter, the accuracy of the hole position and the integrity of the hole wall;

[0044] The feeding structure 5 in steps 1 to 5 is horizontally arranged in the middle of the upper end of the laser drilling machine chassis 1, and one end of the feeding structure 5 is located directly below the laser head 2, the discharge trough 4 is arranged below the same end of the feeding structure 5, the feeding structure 7 and the blanking structure 6 are respectively arranged at the two ends of the feeding structure 5, the flexible circuit board falls from the feeding structure 7 to the feeding structure 5, is transported to the top of the blanking structure 6 by the feeding structure 5, and is pushed to the discharge trough 4 by the blanking structure 6, the feeding structure 5 includes a driving motor 51, the driving motor 51 is arranged on one side of the laser drilling machine chassis 1, and the end of the driving motor 51 is provided with a gear 52 and a gear 53 that mesh with each other. The laser drilling machine case 1 is provided with a rotating shaft 1 54 and a rotating shaft 2 55 which are parallel to each other. The rotating shaft 1 54 and the gear 1 52 rotate synchronously, and the rotating shaft 2 55 rotates synchronously with the gear 2 53. The driving motor 51 is started to rotate so that the gear 1 52 and the gear 2 53 rotate at the same time, and the rotation directions of the gear 1 52 and the gear 2 53 are opposite, so that the rotating shaft 1 54 and the rotating shaft 2 55 can be driven to rotate in opposite directions. The cylindrical surfaces of the rotating shaft 1 54 and the rotating shaft 2 55 are provided with a spiral groove 1 57 and a spiral groove 2 58. The spiral rotation directions of the spiral groove 1 57 and the spiral groove 2 58 are opposite, and the spiral groove 1 57 and the spiral groove 2 58 are opposite. The number of spiral wire heads of spiral groove 7 and spiral groove 2 58 are both two. Since two left-handed spiral wires and two right-handed spiral wires are provided on the cylindrical surfaces of the two rotating shafts, the spiral wires can be used to limit the material plate 59. The ends of spiral groove 1 57 and spiral groove 2 58 are provided with smoothly connected material guide grooves 56. The material guide grooves 56 can move the corner of the material plate 59 along a spiral wire of one hand direction to a spiral wire of another hand direction, thereby changing the moving direction of the material plate 59. The interior of the laser drilling machine chassis 1 and the side walls of the rotating shaft 1 54 and the side walls of the rotating shaft 2 55 are provided with a material guide strip 2 511 and two material guide strips 1 510, and the material guide strips 2 51 1 is located between two material guide bars 1 510, the carrier of steps 1 to 5 is a material plate 59, the four corners of the material plate 59 are located inside the two spiral grooves 1 57 and the two spiral grooves 2 58, the four corners of the material plate 59 are slidably connected with the material guide bar 2 511, when the material plate 59 moves from the feeding structure 7 to the blanking structure 6, the material plate 59 is located above the material guide bar 2 511, when the material plate 59 moves from the blanking structure 6 to the feeding structure 7, the material plate 59 is located below the material guide bar 2 511, and the material guide bar 2 511 is located between two rows of material plates 59, so that the four corners of the material plate 59 can be restricted by the cooperation of the material guide bar 2 511 and the material guide bar 1 510.

[0045] See also Figure 3-Figure 5As shown, a mounting seat is welded between the bottom end of the driving motor 51 and the side wall of the laser drilling machine chassis 1, and the driving motor 51 is installed on the side wall of the laser drilling machine chassis 1. Fixed frames are provided at both ends of the rotating shaft 1 54 and the rotating shaft 2 55, and the two fixed frames are respectively installed on the surface of the mounting seat and the blanking groove 8, and the rotating shaft 1 54 and the rotating shaft 2 55 are rotatably connected to the fixed frames, thereby ensuring that the rotating shaft 1 54 and the rotating shaft 2 55 can rotate normally.

[0046] See also Figure 5 As shown, when the material plate 59 is located between the material guide bar 2 511 and the material guide bar 1 510 above, the two corners on one side of the material plate 59 are movably connected to the two spiral grooves 2 58 of the rotating shaft 1 54, and the two corners on the other side of the material plate 59 are movably connected to the two spiral grooves 1 57 of the rotating shaft 2 55, respectively. The material plate 59 moves toward the blanking structure 6. Since the two rotating shafts rotate in opposite directions and the spiral rotation directions of the two rotating shafts are opposite, it is similar to a double screw conveyor at this time, so that the flexible circuit board dropped on the material plate 59 can be conveyed to the bottom of the laser head 2, and after the driving motor 51 stops rotating, the laser head 2 can drill holes in the flexible circuit board or the connecting hard board of the flexible circuit board. The corners of the material plate 59 are restricted by the material guide bars and the spiral grooves, which can ensure that each material plate 59 moves evenly and at a uniform speed.

[0047] See also Figure 5 As shown, when the material plate 59 moves from above the second material guide bar 511 to the end of the spiral groove, it will enter the material guide groove 56, so that it can enter the spiral groove below the second material guide bar 511. When the material plate 59 is located between the second material guide bar 511 and the lower material guide bar 1 510, the two corners on one side of the material plate 59 are movably connected with the two spiral grooves 1 57 of the rotating shaft 1 54, and the two corners on the other side of the material plate 59 are movably connected with the two spiral grooves 2 58 of the rotating shaft 2 55. The corner of the material plate 59 located above the second material guide bar 511 is located at one spiral line, and the corner of the material plate 59 that enters below the second material guide bar 511 changes to another spiral line. The material plate 59 moves toward the feeding structure 7. During this period, the drive motor 51 needs to be started intermittently to ensure that the laser head 2 can drill holes in the flexible circuit board.

[0048] It should be noted that the flexible circuit board is placed on the material sheet 59, and the four corners of the material sheet 59 are respectively located at the two spiral grooves of the two rotating shafts, wherein the directions of the two spiral grooves on one side of the material sheet 59 are opposite to the directions of the two spiral grooves on the other side of the material sheet 59, so that the material sheet 59 can be moved, and the four corners of the material sheet 59 are moved along the guide bar 2 511 and the guide bar 1 510 until the material sheet 59 is moved to the bottom of the laser head 2, so that the flexible circuit board directly under the laser head 2 is punched, so that the flexible circuit board or the flexible circuit board connected to the hard board can be processed, and when moving to the end of the rotating shaft, the four corners of the material sheet 59 enter the guide groove 56, so that the material sheet 59 located above the guide bar 2 511 is moved to the bottom of the guide bar 2 511, until the material sheet 59 is moved from the blanking structure 6 to the feeding structure 7.

[0049] See also Figure 2 and Figure 5 As shown, the blanking structure 6 is arranged on the end surface of the blanking trough 8, and the blanking structure 6 includes a connecting plate 61 welded at the blanking trough 8, and the end of the connecting plate 61 is located below the end of the rotating shaft 1 54 and the rotating shaft 2 55. The material plate 59 on the rotating shaft 1 54 and the rotating shaft 2 55 is moved to the connecting plate 61 to discharge the material plate 59. Specifically, a middle groove 62 is opened in the middle of the material plate 59, and a fixed plate 63 is welded on the surface of the connecting plate 61 and located below the middle groove 62. A rotating plate 64 is arranged on the edge of the fixed plate 63, and the rotating plate 64 is connected to the connecting plate 61. The connecting pin 65 is rotatably connected to the fixed plate 63, and a torsion spring 66 is provided on the cylindrical surface of the connecting pin 65. The two ends of the torsion spring 66 are respectively in contact with the fixed plate 63 and the rotating plate 64. The position of the rotating plate 64 is aligned with the position of the middle groove 62. When the material plate 59 is located at the end of the guide strip 510, the material plate 59 presses the rotating plate 64. When the rotating plate 64 is aligned with the middle groove 62, the rotating plate 64 rotates around the connecting pin 65 under the action of the torsion spring 66, so that the rotating plate 64 passes through the middle groove 62 to discharge the flexible circuit board.

[0050] See also Figure 5 and Figure 6 As shown, the rotating plate 64 contacts the flexible circuit board on the surface of the material plate 59, the width of the rotating plate 64 is smaller than the width of the middle groove 62, and the flexible circuit board slides along the connecting plate 61 and the blanking groove 8, so that the rotating plate 64 can pass through the inside of the middle groove 62, and the flexible circuit board falls from the material plate 59, and slides from the connecting plate 61 to the blanking groove 8, and then the processed flexible circuit board falls into the discharge groove 4.

[0051] It should be noted that after the flexible circuit board above the material plate 59 is processed, the material plate 59 continues to move along the guide strip 511, the material plate 59 presses the rotating plate 64, and the rotating plate 64 is aligned with the middle groove 62 of the material plate 59. At this time, the rotating plate 64 rotates under the action of the torsion spring 66, and the flexible circuit board can be discharged from the material plate 59 and fall into the connecting plate 61 and the blanking trough 8 until the flexible circuit board falls into the discharge trough 4.

[0052] See also Figure 2 and Figure 7 As shown, the feeding structure 7 includes a toggle piece 1 71 and a toggle piece 2 72, the toggle piece 1 71 is welded to the end face of the gear 1 52, the toggle piece 2 72 is welded to the end face of the gear 2 53, the toggle piece 1 71 and the toggle piece 2 72 rotate in opposite directions, the rotation of the gear 1 52 and the gear 2 53 will drive the toggle piece 1 71 and the toggle piece 2 72 to rotate, the toggle piece 1 71 and the toggle piece 2 72 are symmetrically arranged, and a blanking box 73 is arranged on the side wall of the laser drilling machine chassis 1 and above the rotating shaft 1 54 and the rotating shaft 2 55. The flexible circuit board is put into the blanking box 73 from the top and stacked inside the blanking box 73. Since the thickness of the flexible circuit board is relatively thin, it is ensured that the thickness of the two toggle pieces is the same as that of the flexible circuit board. The thickness of the plates is adapted, and reserved grooves 74 are provided at the bottom ends of both sides of the blanking box 73. When the toggle pieces 1 71 and the toggle pieces 2 72 are rotated, they will be inserted into the reserved grooves 74 on both sides of the blanking box 73. An intermediate plate 75 is provided at the bottom end of the blanking box 73. The spiral surfaces of the toggle pieces 1 71 and the spiral surfaces of the toggle pieces 2 72 are in contact with the reserved grooves 74 on both sides of the intermediate plate 75 respectively. The rotating toggle pieces can push the flexible circuit board above the intermediate plate 75, thereby pushing the flexible circuit board along the intermediate plate 75 to the other side of the intermediate plate 75, thereby discharging the flexible circuit board from the bottom of the blanking box 73. At this time, the material plate 59 is just located below the blanking box 73, so that the flexible circuit board falls onto the material plate 59.

[0053] See also Figure 7 and Figure 8 As shown, the end position of the toggle piece 1 71, the end position of the toggle piece 2 72 and the edge position of the middle plate 75 are aligned, and the flexible circuit board above the middle plate 75 is pushed by the ends of the toggle piece 1 71 and the toggle piece 2 72. The thickness of the middle plate 75 is greater than the thickness of the flexible circuit board, and the thickness of the toggle piece 1 71 and the toggle piece 2 72 is adapted to the thickness of the flexible circuit board, so that the flexible circuit board can be pushed along the middle plate 75. The bottom end of the drop box 73 is a through groove, so that the flexible circuit board falls from the drop box 73.

[0054] It should be noted that the material plate 59 moving from under the guide strip 2 511 will move to the feeding structure 7, and the material plate 59 is located directly below the blanking box 73. At the same time, gear 1 52 and gear 2 53 rotate, and the toggle piece 1 71 and the toggle piece 2 72 also rotate, and the toggle piece 1 71 and the toggle piece 2 72 rotate in opposite directions, so that the spiral surfaces of the toggle piece 1 71 and the toggle piece 2 72 enter the reserved groove 74, and the spiral surfaces of the toggle piece 1 71 and the toggle piece 2 72 can push the flexible circuit board located on the upper surface of the middle plate 75, thereby pushing the stacked flexible circuit boards, so that the lowest flexible circuit board is moved to the bottom end of the blanking box 73, so that the flexible circuit board is discharged from the bottom end of the blanking box 73 and falls on the surface of the material plate 59. Since the surface of the material plate 59 is provided with a shape that matches the shape of the flexible circuit board, the laser head 2 punches holes in the flexible circuit board.

[0055] The preferred embodiments of the present invention disclosed above are only used to help explain the present invention. The preferred embodiments do not describe all the details in detail, nor do they limit the invention to only specific implementation methods. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present invention, so that those skilled in the art can understand and use the present invention well. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A drilling process for producing a flexible circuit board, characterized in that: The following steps are involved: Step 1: Make preparations before drilling holes in the flexible circuit board, stack the flexible circuit board on the feeding structure (7) of the laser drilling machine chassis (1), position the circuit board while conveying it through the feeding structure (5), adjust the power of the laser head (2) according to the size of the hole to be drilled in the flexible circuit board, and ensure that the aperture of the hole processed by the laser head (2) is smaller than the reserved aperture of the carrier; Step 2: Set the parameters of the laser drilling machine and adjust the drilling parameters according to the material, thickness, and aperture of the flexible circuit board; Step 3: drilling holes in the flexible circuit board. After all the preparatory work is completed, the laser drilling machine is started to start the drilling operation. The laser head (2) is lifted and lowered in the vertical direction by the lifting base (3). The distance between the laser head (2) and the flexible circuit board is determined so as to drill holes in the flexible circuit board or the connecting hard board at the edge thereof. The drilled flexible circuit board is moved by the blanking structure (6). The drilled flexible circuit board falls into the discharge trough (4) along the blanking structure (6) and the blanking trough (8). The flexible circuit board dropped from the feeding structure (7) continues to move forward along the feeding structure (5), so that the processed flexible circuit board automatically falls into the discharge trough (4). Step 4: Automatic recycling of the carrier, the carrier is transported along the feeding structure (5) to one end of the feeding structure (5) and then moves in the reverse direction, until the carrier is transported along the feeding structure (5) to the other end of the feeding structure (5) and then moves in the reverse direction again, thereby realizing automatic and repeated recycling of the carrier; Step 5: Inspect the flexible circuit board and clean the laser drilling machine. After drilling is completed, the drilling area of ​​the laser drilling machine chassis (1) needs to be cleaned and the drilling quality of the flexible circuit board is inspected, including the size of the hole, the accuracy of the hole position and the integrity of the hole wall.

2. A drilling process for producing a flexible circuit board according to claim 1, characterized in that: The feeding structure (5) in the steps 1 to 5 is transversely arranged in the middle of the upper end of the laser drilling machine chassis (1), and one end of the feeding structure (5) is located directly below the laser head (2), the material discharge trough (4) is arranged below the same end of the feeding structure (5), the feeding structure (7) and the blanking structure (6) are respectively arranged at the two ends of the feeding structure (5), the feeding structure (5) comprises a driving motor (51), the driving motor (51) is arranged on one side of the laser drilling machine chassis (1), the end of the driving motor (51) is provided with a gear 1 (52) and a gear 2 (53) meshing with each other, and a rotating shaft 1 (54) and a rotating shaft 2 (55) parallel to each other are transversely arranged inside the laser drilling machine chassis (1), the rotating shaft 1 (54) and the gear 1 (52) rotate synchronously, the rotating shaft 2 (55) and the gear 2 (53) rotate synchronously, and the rotating shaft 1 (54) and the rotating shaft 2 (53) rotate synchronously. The cylindrical surface of the laser drilling machine (1) is provided with a spiral groove 1 (57) and a spiral groove 2 (58), the spiral directions of the spiral groove 1 (57) and the spiral groove 2 (58) are opposite, and the number of spiral thread ends of the spiral groove 1 (57) and the spiral groove 2 (58) are two, and the ends of the spiral groove 1 (57) and the spiral groove 2 (58) are provided with a smoothly connected material guide groove (56), and the laser drilling machine case (1) is located inside the side wall of the rotating shaft 1 (54) and the rotating shaft The side walls of the movable shaft 2 (55) are each provided with a material guide strip 2 (511) and two material guide strips 1 (510), and the material guide strip 2 (511) is located between the two material guide strips 1 (510), and the carrier of steps 1 to 5 is a material plate (59), and the four corners of the material plate (59) are located inside the two spiral grooves 1 (57) and the two spiral grooves 2 (58), and the four corners of the material plate (59) are slidably connected to the material guide strip 2 (511).

3. A drilling process for producing a flexible circuit board according to claim 1, characterized in that: A mounting seat is welded between the bottom end of the driving motor (51) and the side wall of the laser drilling machine chassis (1), and fixed frames are provided at both ends of the rotating shaft 1 (54) and the rotating shaft 2 (55), and the two fixed frames are respectively installed on the surface of the mounting seat and the blanking groove (8), and the rotating shaft 1 (54) and the rotating shaft 2 (55) are rotatably connected to the fixed frames.

4. A drilling process for producing a flexible circuit board according to claim 3, characterized in that: When the material plate (59) is located between the second material guide strip (511) and the first material guide strip (510) above, the two corners on one side of the material plate (59) are movably connected to the two second spiral grooves (58) of the rotating shaft (54), and the two corners on the other side of the material plate (59) are movably connected to the two first spiral grooves (57) of the rotating shaft (55), and the material plate (59) moves toward the blanking structure (6).

5. A drilling process for producing a flexible circuit board according to claim 3, characterized in that: When the material plate (59) is located between the second material guide strip (511) and the first material guide strip (510) below, the two corners on one side of the material plate (59) are movably connected to the two spiral grooves (57) of the first rotating shaft (54), and the two corners on the other side of the material plate (59) are movably connected to the two spiral grooves (58) of the second rotating shaft (55), and the material plate (59) moves toward the feeding structure (7).

6. A drilling process for producing a flexible circuit board according to claim 1, characterized in that: The blanking structure (6) is arranged on the end surface of the blanking trough (8), and the blanking structure (6) includes a connecting plate (61) welded to the blanking trough (8), the ends of the connecting plate (61) are located below the ends of the rotating shaft 1 (54) and the rotating shaft 2 (55), an intermediate groove (62) is opened in the middle of the material plate (59), a fixed plate (63) is welded on the surface of the connecting plate (61) and located below the intermediate groove (62), a rotating plate (64) is arranged on the edge of the fixed plate (63), the rotating plate (64) is rotatably connected to the fixed plate (63) through a connecting pin (65), and a torsion spring (66) is arranged on the cylindrical surface of the connecting pin (65), the two ends of the torsion spring (66) are respectively in contact with the fixed plate (63) and the rotating plate (64), and the position of the rotating plate (64) is aligned with the position of the intermediate groove (62).

7. A drilling process for producing a flexible circuit board according to claim 6, characterized in that: The rotating plate (64) contacts the flexible circuit board on the surface of the material plate (59), the width of the rotating plate (64) is smaller than the width of the middle groove (62), and the flexible circuit board slides along the connecting plate (61) and the blanking groove (8).

8. The drilling process for producing a flexible circuit board according to claim 1, characterized in that: The feeding structure (7) comprises a toggle plate 1 (71) and a toggle plate 2 (72), wherein the toggle plate 1 (71) is welded to the end face of the gear 1 (52), and the toggle plate 2 (72) is welded to the end face of the gear 2 (53), and the toggle plate 1 (71) and the toggle plate 2 (72) rotate in opposite directions. A material blanking box (73) is arranged on the side wall of the laser drilling machine chassis (1) and above the rotating shaft 1 (54) and the rotating shaft 2 (55), and reserved grooves (74) are provided at the bottom ends of both sides of the material blanking box (73), and an intermediate plate (75) is arranged at the bottom end of the material blanking box (73), and the spiral surface of the toggle plate 1 (71) and the spiral surface of the toggle plate 2 (72) are respectively in contact with the reserved grooves (74) on both sides of the intermediate plate (75).

9. A drilling process for producing a flexible circuit board according to claim 8, characterized in that: The end position of the toggle piece 1 (71), the end position of the toggle piece 2 (72) and the edge position of the middle plate (75) are aligned, the thickness of the middle plate (75) is greater than the thickness of the flexible circuit board, the thickness of the toggle piece 1 (71) and the toggle piece 2 (72) are adapted to the thickness of the flexible circuit board, and the bottom end of the blanking box (73) is a through groove.

10. A drilling process for producing a flexible circuit board according to any one of claims 1 to 9, characterized in that: The distance between the laser of the laser head (2) and the flexible circuit board in step three is affected by the laser power of the laser drilling machine, and the limit depth of penetration of the laser drilling machine laser is located at the guide bar 2 (511). In step four, the carrier moves successively along the top and bottom of the guide bar 2 (511).

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