Hot and moisture dual-cured organic silicon sealant and preparation method thereof
By using hydroxy-terminated methylvinyl polysiloxane and alkoxy-terminated polydimethylsiloxane combined with alkoxy-terminated crosslinking agent and platinum catalyst system in the silicone sealant, the hot and moisture dual curing of the silicone sealant is achieved, solving the problems of long curing time, low strength and insufficient temperature resistance of the existing sealant, and achieving rapid positioning, rapid curing, high strength, good adhesion and excellent temperature resistance.
Patent Information
- Application Number
- CN202411939991.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-26
- Publication Date
- 2025-03-25
- Estimated Expiration
- 2044-12-26
AI Technical Summary
The existing silicone sealant has problems such as long curing time, low strength and insufficient temperature resistance. At the same time, the curing speed and adhesive force of the additive sealant are limited by temperature and cannot meet the requirements of rapid positioning and assembly.
The hydroxyl-terminated methylvinyl polysiloxane and alkoxy-terminated polydimethylsiloxane are used as the base polymer, and the crosslinking agent of alkoxy silane or its oligomer and hydrogen-containing polysiloxane are combined, a catalyst system of titanate complex and platinum catalyst, and a tackifier is added to achieve rapid precuring and further crosslinking and curing through hot and moisture dual curing technology.
It realizes rapid positioning and rapid curing of silicone sealants, has high strength, good adhesion and excellent temperature resistance, and has a long storage period, which is suitable for various occasions where rapid positioning and assembly are required.