Solder paste connecting surface optical detection device applied to SMT (Surface Mount Technology) surface mounting processing

Abstract

The invention relates to the technical field of solder paste connecting surface detection, in particular to a solder paste connecting surface optical detection device applied to SMT surface mounting processing, which comprises a support plate and a conveying table used for conveying a PCB, the front side of the support plate is provided with a recess compensation detection mechanism and a position adjusting shooting mechanism, the recess compensation detection mechanism comprises a rectangular plate, and the rectangular plate is provided with a position adjusting shooting mechanism. A plurality of rectangular boxes with the bottoms open are fixedly connected to the right side of the rectangular plate, rectangular bases are slidably connected to the inner sides of the rectangular boxes, and circular blocks are fixedly connected to the bottoms of the rectangular bases. The device can effectively detect the thickness of the solder paste, can compensate and eliminate a recess formed at a probe entering position, improves the accuracy of detection through the probe, can sequence the infiltrated probes, avoids shielding and other conditions during observation, enables the plurality of infiltrated probes to be located at effective observation positions of a camera, and improves the detection accuracy. And the accuracy of solder paste detection is further improved.

Description

Technical Field

[0001] The invention relates to the technical field of solder paste connection surface detection, and in particular to an optical detection device for solder paste connection surfaces used in SMT mounting processing. Background Art

[0002] Currently, existing solder paste thickness detection only detects the outer thickness of the solder paste. However, for solder paste on non-flat PCB boards, the thickness of the inner part of the printed solder paste cannot be detected by the outer thickness, resulting in a high risk of defective rate in subsequent processes.

[0003] Application number 202410369811.2 discloses a multi-dimensional solder paste thickness detection system, which uses multiple probe mechanisms immersed in the solder paste to measure the thickness; the probe mechanism realizes solder paste thickness detection by the depth of immersion in the solder paste.

[0004] There are some problems in the above detection process. First, the solder paste has a large viscosity. When the probe is inserted into the solder paste, a depression will be formed at the insertion point due to the joint force. That is, the depth of the probe mechanism immersed in the solder paste will be less than the actual depth of the solder paste, resulting in detection errors (such as Figure 1 shown);

[0005] The present invention designs a set of detection mechanisms based on probes, which can compensate and eliminate the depression formed at the needle insertion site, thereby increasing the accuracy of detection by the probe mechanism;

[0006] Because the solder paste is applied to the solder joint positions on the PCB board, and the probes need to correspond to the positions of the solder paste, and the solder joint positions on the PCB board are not regular, when the probes after wetting are observed through a camera, there will be some situations such as obstruction. The present invention can sort the probes after wetting so that the multiple probes after wetting are in the effective observation position of the camera, further increasing the accuracy of solder paste detection. For this reason, we propose an optical detection device for the solder paste connection surface used in SMT mounting processing to solve the above problems. Summary of the invention

[0007] The purpose of the present invention is to provide an optical detection device for solder paste connection surfaces used in SMT mounting processing to solve the problems raised in the above-mentioned background technology.

[0008] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: an optical detection device for solder paste connection surfaces used in SMT mounting processing, comprising a support plate and a conveying platform for conveying PCB boards, a depression compensation detection mechanism and a position adjustment shooting mechanism are arranged on the front side of the support plate, the depression compensation detection mechanism comprises a rectangular plate, a plurality of rectangular boxes with openings at the bottom are fixedly connected to the right side of the rectangular plate, a rectangular seat is slidably connected to the inner side of the rectangular box, a circular block is fixedly connected to the bottom of the rectangular seat, a circular tube is fixedly connected to the bottom of the circular block, a probe is slidably sleeved in the circular tube, the probe can reciprocate, and the positions of the plurality of probes can correspond to the positions of the plurality of solder pastes to be detected;

[0009] The outer side of the probe is also provided with a depression elimination component, which includes a plurality of arc-shaped grooves arranged at equal intervals on the upper part of the outer side of the probe;

[0010] The position adjustment shooting mechanism includes a second motor, a trapezoidal plate and a two-dimensional camera. The trapezoidal plate can slide to one side to push multiple round tubes onto the same plane. A second L-shaped plate is fixedly connected to the right side of the support plate. A two-dimensional camera is fixedly connected to the right inner wall of the second L-shaped plate. The two-dimensional camera is used to shoot the solder paste adhered to the probe, so as to analyze and detect the thickness of the solder paste.

[0011] The present invention can effectively detect the thickness of solder paste, compensate for and eliminate the depression formed at the needle entry point, thereby increasing the accuracy of detection by the probe, and can sort the probes after infiltration to avoid obstructions during observation, so that multiple probes after infiltration are in the effective observation position of the camera, further increasing the accuracy of solder paste detection.

[0012] After the solder paste is printed, the PCB board is transported through the conveyor table. After being sent to the inspection station, the solder paste printed on the PCB board is located below the probe. Then the electric telescopic rod is started in the positive direction. The electric telescopic rod drives the connecting plate to move downward, and the connecting plate drives the rectangular plate to move downward. The rectangular plate drives the rectangular seat to move downward through the rectangular box, and the rectangular seat drives the round tube to move downward through the round block. The round tube drives the corresponding probe to move downward and insert into the solder paste. Due to the high viscosity of the solder paste, the probe will form a depression at the needle entry point under the action of the joint force during the insertion of the solder paste. Since the position of the solder joints on the PCB board is not regular, as shown in the figure, when the probes on the front and rear sides move downward and contact the PCB board, the probe in the middle cannot contact the PCB board. With the movement of the electric telescopic rod, the probes on the front and rear sides generate a reaction force and compress the corresponding second spring. When it is necessary to compensate and eliminate the depression formed at the needle entry point, thereby increasing the accuracy of detection by the probe, the first motor is started, and the first motor drives the eccentric wheel to rotate. The eccentric wheel rotates the first half of the circle to squeeze the ball. Under the action of the squeezing force , the ball drives the connecting block to move backward, the connecting block drives the rack to move backward, the rack drives the two rectangular blocks to move backward, a rectangular block on the front side stretches the corresponding first spring during the movement, and a rectangular block on the rear side compresses the corresponding first spring during the movement, and the rack drives the two gears and the outer gear ring to rotate counterclockwise during the backward movement, the gears on the front and rear sides drive the corresponding round tubes to rotate, the outer gear ring drives the planetary reducer to rotate, and the output shaft of the planetary reducer drives the corresponding round tubes to rotate, so that the rotation speeds of the three round tubes are close to the same, and the round tubes The probe is driven to rotate counterclockwise by the slider, and when the eccentric wheel rotates the second half of a circle to relax the squeezing of the ball, the first spring in the stretched state and the first spring in the compressed state respectively drive the rack forward through the rectangular block, and the rack drives the two gears and the outer gear ring to rotate clockwise during the forward movement. Similarly, the round tube drives the probe to rotate clockwise through the slider. At this time, under the action of the arc groove opened on the outside of the probe, the solder paste enters the arc groove and is discharged, so that the solder paste in the depression moves to the surface of the probe, thereby destroying the depression area and making the depression area close to flat.

[0013] Further preferably, sliding grooves are provided on the inner walls on both sides of the circular tube, sliders are fixedly connected to both sides of the probe, the sliders are slidably connected to the corresponding sliding grooves, a second spring is fixedly connected between the top of the probe and the top inner wall of the circular tube, and the probe can slide up and down inside the circular tube.

[0014] Further preferably, gears are fixedly sleeved on the outer sides of several of the several circular tubes, planetary reducers are arranged on the outer sides of the remaining circular tubes, the center of the planetary reducer is the output end, the output end is fixedly connected to the outer sides of the remaining circular tubes, the outer input end of the planetary reducer is fixedly connected to an outer gear ring, and the planetary carrier in the middle position of the planetary reducer is fixedly connected to the circular block through an L-shaped block.

[0015] Further preferably, the right side of the rectangular plate is fixedly connected to a first L-shaped plate, the rear side of the first L-shaped plate is fixedly connected to a cross seat, the left side of the cross seat is fixedly connected to two fixed blocks, a square rod is fixedly connected between the two fixed blocks, the rectangular block is slidably sleeved on the outside of the square rod, one side of the two rectangular blocks is fixedly connected to a rack, the front side of the rack is fixedly connected to a connecting block, the front side of the connecting block is embedded with a ball, a first spring is fixedly connected between the rectangular block and the corresponding fixed block, the first spring movably sleeved on the outside of the square rod, the rack is meshed with the gear and the outer gear ring, and the reciprocating rotation of the round tube is realized by the reciprocating movement of the rack, and the planetary reducer is used to change the speed so that the rotation speeds of the three round tubes are close to the same.

[0016] Further preferably, a first motor is fixedly connected to the top inner wall of the first L-shaped plate, an eccentric wheel is fixedly connected to the output end of the first motor, the outer side of the eccentric wheel is in rolling contact with the ball bearing, and the reciprocating movement of the rack is achieved by driving the eccentric wheel to rotate by the first motor.

[0017] Further preferably, the recess elimination component also includes an arc-shaped sheet and a limit block, the arc-shaped sheet is rotatably installed on the side wall of the arc-shaped groove, and a plurality of limit blocks are equidistantly installed on the outside of the probe, when the probe rotates counterclockwise, the arc-shaped sheet closes the arc-shaped groove in a clockwise direction, and when the probe rotates clockwise, the arc-shaped sheet rotates counterclockwise to open and contact the limit block, and the arc-shaped sheet can move a portion of the solder paste to the surface of the probe, thereby destroying the recessed area and making the recessed area nearly flat.

[0018] Further preferably, the second motor is fixedly installed on the rear side of the support plate, the front side of the support plate is rotatably connected to a screw rod, the trapezoidal plate is threadedly sleeved on the outside of the screw rod, the output end of the second motor is fixedly connected to the rear end of the screw rod, the front side of the support plate is fixedly connected to a positioning rod, the trapezoidal plate is slidably sleeved on the outside of the positioning rod, and the left side of the trapezoidal plate is fixedly connected to an L-shaped rod.

[0019] Further preferably, a round rod is fixedly connected between the inner walls on both sides of the rectangular box, the rectangular seat is slidably sleeved on the outside of the round rod, a third spring is fixedly connected between the left side of the rectangular seat and the left inner wall of the rectangular box, and the third spring is movably sleeved on the outside of the round rod.

[0020] Then, the electric telescopic rod is started in the same way, so that the probe is moved out of the solder paste, and the second motor is started. The second motor drives the screw to rotate, and the rotation of the screw drives the trapezoidal plate to move forward. The trapezoidal plate slides on the outside of the positioning rod, and the hypotenuse of the trapezoidal plate contacts the round tube to generate an extrusion pressure. Under the action of the extrusion pressure, the round tube slides on the hypotenuse of the trapezoidal plate and drives the corresponding circular block to move to the left. The circular block drives the corresponding rectangular seat to move, and the rectangular seat slides on the outside of the round rod and compresses the third spring, so that the three round tubes move to the area between the L-shaped rod and the left side of the trapezoidal plate, so that the three round tubes are aligned. At this time, the two-dimensional camera shoots the three completely sorted round tubes, so that the multiple probes after infiltration are in the effective observation position of the camera, and the thickness of the solder paste is optically detected by the two-dimensional camera, thereby further increasing the accuracy of solder paste detection.

[0021] Further preferably, the front side of the support plate is fixedly connected to a top plate, the bottom of the top plate is fixedly connected to two electric telescopic rods, the left side of the rectangular plate is fixedly connected to a connecting plate, and the output shaft end of the electric telescopic rod is fixedly connected to the top of the connecting plate.

[0022] Compared with the prior art, the present invention has the following beneficial effects:

[0023] 1. The electric telescopic rod of the present invention drives the connecting plate to move downward, the connecting plate drives the rectangular plate to move downward, the rectangular plate drives the rectangular seat to move downward through the rectangular box, the rectangular seat drives the round tube to move downward through the round block, and the round tube drives the corresponding probe to move downward and insert into the solder paste. Since the solder paste has a large viscosity, the probe will form a depression at the needle entry point under the action of the joint force during the insertion of the solder paste. Since the position of the solder joints on the PCB board is not regular, when the probes on the front and rear sides move downward and contact the PCB board, the probe located in the middle cannot contact the PCB board. As the electric telescopic rod moves, the probes on the front and rear sides generate a reaction force and compress the corresponding second spring.

[0024] 2. Start the first motor and rotate the eccentric wheel for the first half circle to squeeze the ball. The ball drives the rack to move backward through the connecting block. The rack drives the two rectangular blocks to move backward to stretch and compress the two first springs respectively. The rack drives the corresponding round tube to rotate through the gear. The outer gear ring drives the planetary reducer to rotate. The output shaft of the planetary reducer drives the corresponding round tube to rotate. The rotation speeds of the three round tubes are almost the same. The round tube drives the probe to rotate counterclockwise through the slider. When the eccentric wheel rotates the second half circle to relax the squeezing of the ball, the first spring resets and drives the rack forward through the rectangular block. During the forward movement of the rack, it drives the two gears and the outer gear ring to rotate clockwise. Similarly, the round tube drives the probe to rotate clockwise through the slider. During the rotation process, the probe causes the solder paste around the recessed area to enter the arc groove and be discharged into the recessed area, so that the solder paste in the recessed area moves to the surface of the probe, thereby destroying the recessed area and making the recessed area nearly flat.

[0025] 3. In the present invention, a plurality of arc-shaped pieces are rotatably installed on the outer side of the probe. When the probe rotates counterclockwise, the arc-shaped piece is driven to rotate and contact the outer side of the probe. At this time, the arc-shaped piece blocks the corresponding arc-shaped groove. When the probe rotates clockwise, the arc-shaped piece is driven to rotate, and the outer side of the arc-shaped piece contacts the limit block. At this time, the arc-shaped piece opens to scrape the solder paste around the recessed area into the recessed area, so that the solder paste in the recessed area moves to the surface of the probe, thereby destroying the recessed area and making the recessed area nearly flat.

[0026] 4. Start the electric telescopic rod to move the probe out of the solder paste, start the second motor to drive the screw to rotate, the rotation of the screw drives the trapezoidal plate to move forward, the hypotenuse of the trapezoidal plate contacts the round tube to generate an extrusion force, the round tube slides on the hypotenuse of the trapezoidal plate and drives the corresponding circular block to move to the left, the circular block drives the rectangular seat to move and compress the third spring, so that the three circular tubes are aligned, and the two-dimensional camera shoots the three sorted complete circular tubes at this time, so that the multiple probes after infiltration are in the effective observation position of the camera, and the thickness of the solder paste is optically detected by the two-dimensional camera, so as to further increase the accuracy of solder paste detection. The present invention can effectively detect the thickness of the solder paste, can compensate for and eliminate the depression formed at the needle insertion point, thereby increasing the accuracy of detection by the probe, and can sort the probes after infiltration to avoid some situations such as occlusion during observation, so that the multiple probes after infiltration are in the effective observation position of the camera, so as to further increase the accuracy of solder paste detection. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 This is a schematic diagram of the structure of the probe inserted into the solder paste in the present invention;

[0028] Figure 2 It is a schematic diagram of the main stereoscopic structure of the present invention;

[0029] Figure 3 It is a right-side stereoscopic structural schematic diagram of the present invention;

[0030] Figure 4 It is a left-side stereoscopic structural schematic diagram of the present invention;

[0031] Figure 5 It is a schematic diagram of the three-dimensional structure of the connection between the gear and the rack in the present invention;

[0032] Figure 6 It is a schematic diagram of the three-dimensional structure of the connection between the square rod and the rectangular block in the present invention;

[0033] Figure 7 It is a schematic diagram of the three-dimensional structure of the connection between the outer gear ring and the planetary reducer in the present invention;

[0034] Figure 8 It is a schematic diagram of the internal cross-sectional structure of the circular tube in the present invention;

[0035] Fig. 9 It is a schematic diagram of the internal cross-sectional structure of the rectangular box in the present invention;

[0036] Fig.10 It is a schematic diagram of the three-dimensional structure of the connection between the second L-shaped plate and the two-dimensional camera in the present invention;

[0037] Fig.11 It is a schematic diagram of the three-dimensional structure of the connection between the screw rod and the trapezoidal plate in the present invention;

[0038] Fig.12 Schematic diagram of the top view of the probe in the present invention;

[0039] Fig.13 It is a schematic diagram of the top view of the connection structure between the probe and the arc-shaped sheet in the present invention.

[0040] In the figure:

[0041] 1. Rectangular plate; 101. Rectangular box; 102. Rectangular seat; 103. Round block; 104. Round tube; 105. Probe; 106. Gear; 107. Rack; 108. Outer gear ring; 109. L-shaped block; 110. Planetary reducer; 111. Connecting block; 112. Ball; 113. First L-shaped plate; 114. First motor; 115. Eccentric wheel; 116. Cross seat; 117. Fixed block; 118. Square rod; 119. Rectangular block; 120. First spring; 121. Slide groove; 122. Sliding block; 123. Second spring; 124. Arc groove; 125. Arc sheet; 126. Limit block.

[0042] 2. second motor; 201. screw rod; 202. trapezoidal plate; 203. positioning rod; 204. L-shaped rod; 205. second L-shaped plate; 206. two-dimensional camera; 207. round rod; 208. third spring;

[0043] 3. Support plate; 4. Top plate; 5. Electric telescopic rod; 6. Connecting plate; 7. Conveying platform. DETAILED DESCRIPTION

[0044] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0045] Example 1, please refer to Figure 1-13 The present invention provides a technical solution: an optical detection device for solder paste connection surfaces used in SMT mounting processing, comprising a support plate 3 and a conveying table 7 for conveying PCB boards, a depression compensation detection mechanism and a position adjustment shooting mechanism are arranged on the front side of the support plate 3, the depression compensation detection mechanism comprises a rectangular plate 1, a plurality of rectangular boxes 101 with openings at the bottom are fixedly connected to the right side of the rectangular plate 1, a rectangular seat 102 is slidably connected to the inner side of the rectangular box 101, a circular block 103 is fixedly connected to the bottom of the rectangular seat 102, a circular tube 104 is fixedly connected to the bottom of the circular block 103, a probe 105 is slidably sleeved in the circular tube 104, the probe 105 can reciprocate, and the positions of the plurality of probes 105 can correspond to the positions of the plurality of solder pastes to be detected;

[0046] The outer side of the probe 105 is also provided with a depression elimination component, which includes a plurality of arc-shaped grooves 124 equidistantly arranged on the upper part of the outer side of the probe 105;

[0047] The position adjustment shooting mechanism includes a second motor 2, a trapezoidal plate 202 and a two-dimensional camera 206. The trapezoidal plate 202 can slide to one side to push the multiple circular tubes 104 onto the same plane. A second L-shaped plate 205 is fixedly connected to the right side of the support plate 3. A two-dimensional camera 206 is fixedly connected to the right inner wall of the second L-shaped plate 205. The two-dimensional camera 206 is used to shoot the solder paste adhered to the probe 105, so as to analyze and detect the thickness of the solder paste.

[0048] The present invention can effectively detect the thickness of solder paste, compensate for and eliminate the depression formed at the needle entry point, thereby increasing the accuracy of detection by the probe 105, and can sort the probes 105 after infiltration to avoid obstructions during observation, so that the multiple probes 105 after infiltration are in the effective observation position of the camera, further increasing the accuracy of solder paste detection.

[0049] After the solder paste is printed, the PCB board is transported by the conveying table 7. After being sent to the inspection station, the solder paste printed on the PCB board is located below the probe 105. Then the electric telescopic rod 5 is started forward, and the electric telescopic rod 5 drives the connecting plate 6 to move downward. The connecting plate 6 drives the rectangular plate 1 to move downward. The rectangular plate 1 drives the rectangular seat 102 to move downward through the rectangular box 101. The rectangular seat 102 drives the round tube 104 to move downward through the round block 103. The round tube 104 drives the corresponding probe 105 to move downward and insert into the solder paste. Since the position of the solder joints on the PCB board is not regular, such as Figure 1 As shown, when the probes 105 at the front and rear sides move downward and contact the PCB board, the probe 105 located in the middle cannot contact the PCB board. As the electric telescopic rod 5 moves, the probes 105 at the front and rear sides generate a reaction force and compress the corresponding second spring 123;

[0050] At this time, the probe 105 is inserted into the solder paste. Due to the high viscosity of the solder paste, the probe 105 will form a depression at the insertion point under the action of the joint force during the insertion of the solder paste. That is, the depth of the probe 105 immersed in the solder paste will be less than the actual depth of the solder paste. Figure 1As shown, when it is necessary to drive the probe 105 to rotate counterclockwise and clockwise to make the concave area of ​​the solder paste nearly flat, to compensate for and eliminate the concave formed at the needle insertion point, thereby increasing the accuracy of detection by the probe 105, the first motor 114 is started, and the first motor 114 drives the eccentric wheel 115 to rotate. The eccentric wheel 115 rotates the first half circle to squeeze the ball 112. Under the action of the squeezing force, the ball 112 drives the connecting block 111 to move backward, the connecting block 111 drives the rack 107 to move backward, the rack 107 drives the two rectangular blocks 119 to move backward, and a rectangular block 119 on the front side stretches the corresponding first spring 120 during the movement, and a rectangular block 119 on the rear side compresses the corresponding first spring 120 during the movement. In the process of moving backward, the rack 107 drives the two gears 106 and the outer gear ring 108 to rotate counterclockwise, the front and rear gears 106 drive the corresponding round tube 104 to rotate, and the outer gear ring 108 The planetary reducer 110 is driven to rotate, and the output shaft of the planetary reducer 110 drives the corresponding circular tube 104 to rotate, so that the rotation speeds of the three circular tubes 104 are close to the same. The circular tube 104 drives the probe 105 to rotate counterclockwise through the slider 122. When the eccentric wheel 115 rotates the second half of the circle to relax the squeezing of the ball 112, the first spring 120 in the tension state and the first spring 120 in the compression state drive the rack 107 to move forward through the rectangular block 119. During the forward movement of the rack 107, the two gears 106 and the outer gear ring 108 are driven to rotate clockwise. Similarly, the circular tube 104 drives the probe 105 to rotate clockwise through the slider 122. At this time, under the action of the arc groove 124 provided on the upper outer side of the probe 105, the rotating probe 105 causes the solder paste around the recessed area to enter the arc groove 124 and be discharged into the recessed area, so that the solder paste in the recessed area moves to the surface of the probe 105, thereby destroying the recessed area and making the recessed area nearly flat.

[0051] In this embodiment, specifically: a slide groove 121 is provided on the inner walls of both sides of the circular tube 104, and a slider 122 is fixedly connected to both sides of the probe 105, and the slider 122 is slidably connected to the corresponding slide groove 121, and a second spring 123 is fixedly connected between the top of the probe 105 and the top inner wall of the circular tube 104, so that the probe 105 can slide up and down inside the circular tube 104;

[0052] In this embodiment, specifically: a gear 106 is fixedly sleeved on the outer side of several of the circular tubes 104, a planetary reducer 110 is arranged on the outer side of the remaining circular tubes 104, the center of the planetary reducer 110 is the output end, the output end is fixedly connected to the outer side of the remaining circular tubes 104, the outer input end of the planetary reducer 110 is fixedly connected to the outer gear ring 108, and the planet carrier in the middle position of the planetary reducer 110 is fixedly connected to the circular block 103 through the L-shaped block 109;

[0053] In this embodiment, specifically: the right side of the rectangular plate 1 is fixedly connected with a first L-shaped plate 113, the rear side of the first L-shaped plate 113 is fixedly connected with a cross seat 116, the left side of the cross seat 116 is fixedly connected with two fixed blocks 117, a square rod 118 is fixedly connected between the two fixed blocks 117, a rectangular block 119 is slidably sleeved on the outside of the square rod 118, one side of the two rectangular blocks 119 is fixedly connected with a rack 107, the front side of the rack 107 is fixedly connected with a connecting block 111, the front side of the connecting block 111 is embedded with a ball 112, a first spring 120 is fixedly connected between the rectangular block 119 and the corresponding fixed block 117, the first spring 120 is movably sleeved on the outside of the square rod 118, the rack 107 is meshed with the gear 106 and the outer gear ring 108, and the reciprocating movement of the rack 107 realizes the reciprocating rotation of the round tube 104, and the planetary reducer 110 is used to play a role of speed change, so that the rotation speeds of the three round tubes 104 are close to the same;

[0054] In this embodiment, specifically: a first motor 114 is fixedly connected to the top inner wall of the first L-shaped plate 113, an eccentric wheel 115 is fixedly connected to the output end of the first motor 114, the outer side of the eccentric wheel 115 is in rolling contact with the ball 112, and the first motor 114 drives the eccentric wheel 115 to rotate to realize the reciprocating movement of the rack 107;

[0055] In this embodiment, specifically: the depression elimination component also includes an arc piece 125 and a limit block 126, the arc piece 125 is rotatably mounted on the side wall of the arc groove 124, and a plurality of limit blocks 126 are equidistantly mounted on the outside of the probe 105, when the probe 105 rotates counterclockwise, the arc piece 125 closes the arc groove 124 in a clockwise direction, when the probe 105 rotates clockwise, the arc piece 125 rotates counterclockwise to open and contact the limit block 126, the arc piece 125 can move a portion of the solder paste to the surface of the probe 105, thereby destroying the depressed area, making the depressed area nearly flat;

[0056] In this embodiment, specifically: the second motor 2 is fixedly installed on the rear side of the support plate 3, the front side of the support plate 3 is rotatably connected with a screw rod 201, the trapezoidal plate 202 is threadedly sleeved on the outside of the screw rod 201, the output end of the second motor 2 is fixedly connected to the rear end of the screw rod 201, the front side of the support plate 3 is fixedly connected with a positioning rod 203, the trapezoidal plate 202 is slidably sleeved on the outside of the positioning rod 203, and the left side of the trapezoidal plate 202 is fixedly connected with an L-shaped rod 204;

[0057] In this embodiment, specifically: a round rod 207 is fixedly connected between the inner walls of both sides of the rectangular box 101, the rectangular seat 102 is slidably sleeved on the outer side of the round rod 207, a third spring 208 is fixedly connected between the left side of the rectangular seat 102 and the left inner wall of the rectangular box 101, and the third spring 208 is movably sleeved on the outer side of the round rod 207;

[0058] In this embodiment, specifically: the front side of the support plate 3 is fixedly connected to the top plate 4, the bottom of the top plate 4 is fixedly connected to two electric telescopic rods 5, the left side of the rectangular plate 1 is fixedly connected to the connecting plate 6, and the output shaft end of the electric telescopic rod 5 is fixedly connected to the top of the connecting plate 6.

[0059] Example 2, please refer to Figure 1-13 The present invention is a further supplement to Example 1 and provides a technical solution: at this time, a plurality of arc-shaped pieces 125 are rotatably installed on the outer side of the probe 105. When the probe 105 rotates counterclockwise, the arc-shaped piece 125 is driven to rotate and contact the outer side of the probe 105. At this time, the arc-shaped piece 125 blocks the corresponding arc-shaped groove 124. When the probe 105 rotates clockwise, the arc-shaped piece 125 is driven to rotate, and the outer side of the arc-shaped piece 125 contacts the limit block 126. At this time, the arc-shaped piece 125 opens to scrape the solder paste around the recessed area into the recessed area, so that the solder paste in the recessed area moves to the surface of the probe 105, thereby destroying the recessed area and making the recessed area nearly flat.

[0060] Then, the electric telescopic rod 5 is started in the reverse direction in the same way, so that the probe 105 is moved out of the solder paste, and the second motor 2 is started. The second motor 2 drives the screw 201 to rotate, and the rotation of the screw 201 drives the trapezoidal plate 202 to move forward. The trapezoidal plate 202 slides on the outside of the positioning rod 203, and the hypotenuse of the trapezoidal plate 202 contacts the circular tube 104 and generates an extrusion force. Under the action of the extrusion force, the circular tube 104 slides on the hypotenuse of the trapezoidal plate 202 and drives the corresponding circular block 103 to move to the left, and the circular block 103 drives the corresponding rectangular plate 202 to move to the left. The rectangular seat 102 moves, and the rectangular seat 102 slides on the outside of the round rod 207 and compresses the third spring 208, so that the three round tubes 104 move to the area between the L-shaped rod 204 and the left side of the trapezoidal plate 202, so that the three round tubes 104 are aligned. At this time, the two-dimensional camera 206 takes pictures of the three complete round tubes 104, so that the multiple probes 105 after infiltration are in the effective observation position of the camera, and the thickness of the solder paste is optically detected by the two-dimensional camera 206, thereby further increasing the accuracy of solder paste detection.

[0061] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An optical detection device for solder paste connection surfaces used in SMT mounting processing, comprising a support plate (3) and a conveying table (7) for conveying PCB boards, characterized in that: The front side of the support plate (3) is provided with a depression compensation detection mechanism and a position adjustment shooting mechanism, the depression compensation detection mechanism comprises a rectangular plate (1), a plurality of rectangular boxes (101) with an opening at the bottom are fixedly connected to the right side of the rectangular plate (1), a rectangular seat (102) is slidably connected to the inner side of the rectangular box (101), a circular block (103) is fixedly connected to the bottom of the rectangular seat (102), a circular tube (104) is fixedly connected to the bottom of the circular block (103), a probe (105) is slidably sleeved inside the circular tube (104), the probe (105) can reciprocate, and the positions of the plurality of probes (105) can correspond to the positions of the plurality of solder pastes to be detected; The outer side of the probe (105) is also provided with a depression elimination component, which includes a plurality of arc-shaped grooves (124) arranged at equal intervals on the upper part of the outer side of the probe (105); The position adjustment shooting mechanism comprises a second motor (2), a trapezoidal plate (202) and a two-dimensional camera (206); the trapezoidal plate (202) can slide to one side to push the multiple circular tubes (104) onto the same plane; a second L-shaped plate (205) is fixedly connected to the right side of the support plate (3); a two-dimensional camera (206) is fixedly connected to the right inner wall of the second L-shaped plate (205); the two-dimensional camera (206) is used to shoot the solder paste adhered to the probe (105), so as to analyze and detect the thickness of the solder paste.

2. The optical detection device for solder paste connection surface used in SMT mounting processing according to claim 1, characterized in that: Slide grooves (121) are provided on the inner walls on both sides of the circular tube (104); sliders (122) are fixedly connected to the two sides of the probe (105); the sliders (122) are slidably connected to the corresponding slide grooves (121); a second spring (123) is fixedly connected between the top of the probe (105) and the top inner wall of the circular tube (104); and the probe (105) can slide up and down inside the circular tube (104).

3. The optical detection device for solder paste connection surface used in SMT mounting processing according to claim 2, characterized in that: Several of the plurality of circular tubes (104) are provided with gears (106) on their outer sides, and the remaining circular tubes (104) are provided with planetary reducers (110) on their outer sides. The center of the planetary reducer (110) is an output end, and the output end is fixedly connected to the outer sides of the remaining circular tubes (104). The outer input end of the planetary reducer (110) is fixedly connected to an outer gear ring (108), and a planet carrier at a middle position of the planetary reducer (110) is fixedly connected to the circular block (103) via an L-shaped block (109).

4. The optical detection device for solder paste connection surface used in SMT mounting processing according to claim 3, characterized in that: The right side of the rectangular plate (1) is fixedly connected to a first L-shaped plate (113); the rear side of the first L-shaped plate (113) is fixedly connected to a cross seat (116); the left side of the cross seat (116) is fixedly connected to two fixed blocks (117); a square rod (118) is fixedly connected between the two fixed blocks (117); a rectangular block (119) is slidably sleeved on the outside of the square rod (118); one side of the two rectangular blocks (119) is fixedly connected to a rack (107); the front side of the rack (107) is fixedly connected to a connecting block (111). A ball (112) is embedded in the front side of the connecting block (111), a first spring (120) is fixedly connected between the rectangular block (119) and the corresponding fixed block (117), the first spring (120) is movably sleeved on the outer side of the square rod (118), the rack (107) is meshed with the gear (106) and the outer gear ring (108), and the reciprocating movement of the rack (107) realizes the reciprocating rotation of the circular tube (104), and the planetary reducer (110) is used to play a role of speed change, so that the rotation speeds of the three circular tubes (104) are close to the same.

5. The optical detection device for solder paste connection surface used in SMT mounting processing according to claim 4, characterized in that: A first motor (114) is fixedly connected to the inner wall of the top of the first L-shaped plate (113); an eccentric wheel (115) is fixedly connected to the output end of the first motor (114); the outer side of the eccentric wheel (115) is in rolling contact with the ball (112); the first motor (114) drives the eccentric wheel (115) to rotate, thereby realizing the reciprocating movement of the rack (107).

6. The optical detection device for solder paste connection surface used in SMT mounting processing according to any one of claims 1 to 5, characterized in that: The recess elimination component also includes an arc-shaped piece (125) and a limit block (126). The arc-shaped piece (125) is rotatably mounted on the side wall of the arc-shaped groove (124). A plurality of limit blocks (126) are equidistantly mounted on the outer side of the probe (105). When the probe (105) rotates counterclockwise, the arc-shaped piece (125) closes the arc-shaped groove (124) in a clockwise direction. When the probe (105) rotates clockwise, the arc-shaped piece (125) rotates counterclockwise to open and contact the limit block (126). The arc-shaped piece (125) can move a portion of the solder paste to the surface of the probe (105), thereby destroying the recessed area and making the recessed area nearly flat.

7. The optical detection device for solder paste connection surface used in SMT mounting processing according to claim 5, characterized in that: The second motor (2) is fixedly mounted on the rear side of the support plate (3); the front side of the support plate (3) is rotatably connected to a screw rod (201); the trapezoidal plate (202) is threadedly sleeved on the outside of the screw rod (201); the output end of the second motor (2) is fixedly connected to the rear end of the screw rod (201); the front side of the support plate (3) is fixedly connected to a positioning rod (203); the trapezoidal plate (202) is slidably sleeved on the outside of the positioning rod (203); and the left side of the trapezoidal plate (202) is fixedly connected to an L-shaped rod (204).

8. The optical detection device for solder paste connection surface used in SMT mounting processing according to claim 7, characterized in that: A round rod (207) is fixedly connected between the inner walls on both sides of the rectangular box (101); the rectangular seat (102) is slidably sleeved on the outer side of the round rod (207); a third spring (208) is fixedly connected between the left side of the rectangular seat (102) and the left inner wall of the rectangular box (101); and the third spring (208) is movably sleeved on the outer side of the round rod (207).

9. The optical detection device for solder paste connection surface used in SMT mounting processing according to claim 8, characterized in that: The front side of the support plate (3) is fixedly connected to a top plate (4), the bottom of the top plate (4) is fixedly connected to two electric telescopic rods (5), the left side of the rectangular plate (1) is fixedly connected to a connecting plate (6), and the output shaft end of the electric telescopic rod (5) is fixedly connected to the top of the connecting plate (6).

Images