OSFP-XD optical module and mounting method thereof

Abstract

The application discloses an OSFP-XD optical module and a mounting method thereof, and the OSFP-XD optical module comprises a shell seat and a heat dissipation piece; a first mounting groove is arranged above the shell seat, the heat dissipation piece is arranged in the first mounting groove, and a plurality of air ducts in the axial direction of the shell seat are arranged on the heat dissipation piece; at least one air flow groove is arranged on the shell seat, the air flow groove is arranged opposite to the air inlet of one or more air ducts, and external cold air is drawn into the air duct through the air flow groove, so that the inside of the optical module is cooled. The OSFP-XD optical module is characterized in that at least one air flow groove is arranged on the shell seat, the air flow groove is arranged opposite to the air inlet of one or more air ducts on the heat dissipation piece, and the air flow groove is arranged to reduce the air inlet damping in the air duct of the heat dissipation piece, so that the heat in the optical module can be smoothly discharged from the optical module.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of optical communication modules, in particular to an OSFP-XD optical module and a mounting method thereof. BACKGROUND

[0002] As a new optical and electrical module packaging form, the octal small form factor extra dense pluggable module (OSFP-XD) emerges as the times require. It supports the upgrade of global communication network architecture to 1.6T and provides an ideal solution for the next generation of data center construction. This module has the characteristics of high density and miniaturization, which can effectively improve the integration and performance of the optical module. The two main means to increase the rate of the optical module are to increase the number of channels or to increase the rate of a single channel. However, these means also bring some challenges. With the increase of the number of channels and the increase of the rate, the density of the optical and electrical components inside the optical module will increase, and the power consumption of the corresponding elements will also increase. These factors will cause the heat generated inside the optical module to increase, which will directly affect the normal operation of the optical module. In order to ensure the efficient heat dissipation of the optical module, effective heat dissipation measures need to be taken.

[0003] In order to dissipate heat from the optical module, it is usually necessary to provide a heat dissipation member in the optical module, and a wind channel in the heat dissipation member to transmit heat outside the optical module through the wind channel in the heat dissipation member. When the heat dissipation member is provided in the optical module, the heat dissipation member is usually provided on the shell of the optical module and closely attached to the shell to guide the heat in the optical module out of the optical module through heat exchange, thereby reducing the temperature of the optical module. In the existing OSFP-XD optical module, the number of channels is usually increased by stacking the adapters up and down to increase the density of the optical module. Due to the stacking of the adapters up and down, one end of the shell (i.e., the end where the adapters are provided) is higher than the other end. When the heat dissipation member is provided on the shell, the air inlet of the heat dissipation member is blocked by the one end of the shell due to the fact that the one end of the shell is higher than the other end, forming a large damping, making it difficult to smoothly transmit the heat in the optical module to the outside of the optical module through the wind channel provided by the heat dissipation member. Therefore, improvement is needed to smoothly transmit heat and improve the working performance, stability and service life of the optical module.

[0004] In view of this, how to overcome the defects of the prior art and solve the above technical problems is a difficult problem to be solved in the technical field. SUMMARY

[0005] This invention provides an optimized solution for OSFP-XD optical modules, aiming to solve the problem in the prior art where the adapter is stacked on top of each other, causing one end of the housing to be higher than the other. Furthermore, when heat sinks are installed, the air inlet of the heat sink is blocked by one end of the housing, creating significant damping and making it difficult to smoothly conduct the heat inside the optical module to the outside through the air duct set by the heat sink.

[0006] This invention is implemented as follows:

[0007] In a first aspect, the present invention provides an OSFP-XD optical module, including a housing 1 and a heat sink 2;

[0008] A first mounting groove 11 is provided above the housing 1, and the heat sink 2 is disposed in the first mounting groove 11. The heat sink 2 is provided with a plurality of air ducts 21 along the axial direction of the housing 1.

[0009] The housing 1 is provided with at least one airflow groove 15, which is arranged opposite to one or more air inlets of the air duct 21, so as to draw external cold air into the air duct 21 through the airflow groove 15 for heat dissipation inside the optical module.

[0010] Preferably, the OSFP-XD optical module further includes a cage 3;

[0011] A grid through hole 31 is provided on one end of the cage 3. The cage 3 is fitted onto the housing 1. The air outlet of the air duct 21 is connected to the grid through hole 31 so as to dissipate heat from the optical module through the airflow groove 15, the air duct 21 and the grid through hole 31.

[0012] Preferably, the cage 3 is provided with a second mounting groove 32, and a heat dissipation frame 321 is provided in the second mounting groove 32. The bottom surface of the heat dissipation frame 321 extends into the cage 3 with a first preset thickness so that the heat dissipation frame 321 fits against the heat dissipation component 2.

[0013] Preferably, an overflow groove 111 is provided on the bottom surface of the first mounting groove 11, and the heat sink 2 is attached to the overflow groove 111.

[0014] Preferably, the optical module further includes a pull ring 4;

[0015] The pull ring 4 includes a pair of sliding plates 41, and a first limiting protrusion 411 is provided on the inner wall of the sliding plate 41, the first limiting protrusion 411 extending inward to the sliding plate 41.

[0016] The housing 1 includes a first housing 13, the first housing 13 includes two side plates 131, the outer wall of the side plates 131 is provided with an elongated groove 1311, and one end of the elongated groove 13111 is provided with a sliding groove 13111 along the axial direction of the first housing 13.

[0017] The sliding plate 41 is disposed in the long groove 1311 so that the first limiting protrusion 411 is movably disposed in the sliding groove 13111 to realize the assembly of the pull ring 4 and the first housing 13.

[0018] Preferably, the tail of the sliding plate 41 is provided with a second limiting protrusion 412 that extends vertically upward;

[0019] The housing 1 further includes a second housing 14, which is disposed on the first housing 13. A first limiting groove 141 is provided on the side plate of the second housing 14, and a second limiting protrusion 412 is disposed in the first limiting groove 141 so as to facilitate the second housing 14 being disposed on the first housing 13 by means of the sliding plate 41.

[0020] Preferably, the optical module further includes an optoelectronic component 5, which is disposed within the first housing 13. The optoelectronic component 5 includes at least two sets of optical adapters 51, wherein the two sets of optical adapters 51 are arranged in two layers, one above the other.

[0021] The head of the first housing 13 is provided with a cavity 132, and a support member 1321 is provided inside the cavity 132. At least two sets of bracket inner cavities 13211 are provided on the support member 1321, and the optical adapter 51 is disposed inside the bracket inner cavity 13211.

[0022] Preferably, the tail of the sliding plate 41 is provided with an unlocking protrusion 413 along the axial direction of the sliding plate 41, and the other end of the long groove 1311 is provided with an arc-shaped groove 13112, and the unlocking protrusion 413 is disposed in the arc-shaped groove 13112.

[0023] Metal springs are respectively provided on the inner walls of both sides of the cage 3. One end of the metal spring is connected to the inner wall of the cage 3, and the metal spring is inclined at a preset angle to the inner wall of the cage 3.

[0024] The cage 3 is fitted onto the outside of the housing 1 so that the optical module can be locked and unlocked by the metal spring and the unlocking protrusion 413.

[0025] Secondly, the present invention also provides an installation method for an OSFP-XD optical module, the method being applicable to the OSFP-XD optical module of the first aspect, the installation method comprising:

[0026] Install the heat sink 2 into the first mounting slot 11 of the housing 1;

[0027] One or more air inlets of the heat sink 21 are aligned with the airflow slots 15 to facilitate heat dissipation of the optical module through the air ducts 21 and the airflow slots 15.

[0028] Preferably, the OSFP-XD optical module further includes a cage 3, on which a heat sink 321 is provided. The installation method specifically includes:

[0029] Install the heat sink 2 into the first mounting slot 11 and lift the heat sink bracket 321 on the cage 3;

[0030] Align the cage 3 with the housing 1, insert the housing 1 into the cage 3, and press the heat sink 321 against the heat sink 2 to install the cage 3 and the housing 1 together.

[0031] Compared with the prior art, the above technical solutions adopted in this invention have the following beneficial effects:

[0032] This invention provides at least one airflow slot 15 on the housing 1 of the OSFP-XD optical module and positions the airflow slot 15 opposite to the air inlet of one or more air ducts 21 on the heat sink 2. By setting the airflow slot 15, the air intake damping in the air ducts of the heat sink 2 is reduced, so that the heat inside the optical module can be smoothly discharged from the optical module, thereby avoiding the problem of heat dissipation difficulties caused by the stacking of OSFP-XD optical modules. Attached Figure Description

[0033] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0034] Figure 1 This is a schematic diagram of the overall structure of an OSFP-XD optical module provided in an embodiment of the present invention;

[0035] Figure 2 This is a structural component diagram of the connection between the heat sink and the housing of an OSFP-XD optical module provided in an embodiment of the present invention;

[0036] Figure 3 This is a schematic diagram of the connection between the inner cage and the housing of an OSFP-XD optical module according to an embodiment of the present invention;

[0037] Figure 4This is a schematic diagram of the cage-like structure of an OSFP-XD optical module provided in an embodiment of the present invention;

[0038] Figure 5 A schematic diagram of the cage structure of an OSFP-XD optical module provided in an embodiment of the present invention;

[0039] Figure 6 This is a schematic diagram of the position structure of the first mounting slot within an OSFP-XD optical module, provided in an embodiment of the present invention.

[0040] Figure 7 A cross-sectional view of the fins inside an OSFP-XD optical module provided in an embodiment of the present invention;

[0041] Figure 8 A schematic diagram of a fin structure within an OSFP-XD optical module provided in an embodiment of the present invention;

[0042] Figure 9 This is a schematic diagram of an adhesive overflow groove structure within an OSFP-XD optical module, provided by an embodiment of the present invention.

[0043] Figure 10 A schematic diagram of a pull ring structure inside an OSFP-XD optical module provided in an embodiment of the present invention;

[0044] Figure 11 This is an exploded view of an OSFP-XD optical module provided in an embodiment of the present invention.

[0045] Figure 12 A schematic diagram of a second housing structure within an OSFP-XD optical module provided in an embodiment of the present invention;

[0046] Figure 13 A schematic diagram of the optoelectronic component structure within an OSFP-XD optical module provided in an embodiment of the present invention;

[0047] Figure 14 This is a schematic diagram of a double-layer stacked adapter structure within an OSFP-XD optical module, provided by an embodiment of the present invention.

[0048] Figure 15 This is a schematic diagram of the structure of an internal support component of an OSFP-XD optical module provided in an embodiment of the present invention;

[0049] Figure 16 This is a schematic diagram of the position structure of the bottom of the first housing of an OSFP-XD optical module provided in an embodiment of the present invention, showing a rib-like protrusion.

[0050] Figure 17 A flowchart illustrating an installation method for an OSFP-XD optical module provided in an embodiment of the present invention;

[0051] Figure 18 A flowchart illustrating the installation method of an OSFP-XD optical module with fins provided in an embodiment of the present invention.

[0052] Figure 19 A schematic diagram of the stacked structure of a first optical transceiver component and a second optical transceiver component of an OSFP-XD optical module provided in an embodiment of the present invention;

[0053] Figure 20 This invention provides a schematic diagram of the structure of an OSFP-XD optical module in which a first optical transceiver component and a second optical transceiver component are stacked inside a housing.

[0054] Figure 21 A schematic diagram of a support frame structure for an OSFP-XD optical module provided in an embodiment of the present invention;

[0055] Figure 22 A schematic diagram of a limiting card structure for an OSFP-XD optical module provided in this embodiment of the invention;

[0056] The attached figures are labeled as follows:

[0057] 1-Shell base; 11-First mounting groove; 111-Overflow groove; 12-Fin; 121-Protrusion; 122-Clamping notch; 13-First shell; 131-Side plate; 1311-Long groove; 13111-Sliding groove; 13112-Arc groove; 132-Cavity; 1321-Support member; 13211-Bracket inner cavity; 14-Second shell; 141-First limiting groove; 15-Airflow groove; 2-Heat dissipation component; 21-Air duct; 3-Cage; 31-Grid 32-Second mounting slot; 321-Heat sink; 4-Pull ring; 41-Sliding plate; 411-First limiting protrusion; 412-Second limiting protrusion; 413-Unlocking protrusion; 5-Optical component; 51-Optical adapter; 6-Slit; 7-Limiting clip; 71-Fixing part; 72-Claw part; 721-Pressing plate; 722-Stop plate; 8-First optical transceiver assembly; 81-First optical fiber; 9-Second optical transceiver assembly; 91-Second optical fiber; 10-Snap fastener. Detailed Implementation

[0058] In the description of this invention, the terms "inner", "outer", "longitudinal", "lateral", "upper", "lower", "top", "bottom", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and do not require that this invention must be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0059] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0060] Example 1:

[0061] This invention provides an OSFP-XD optical module, such as... Figures 1-2 As shown, it includes a housing 1 and a heat sink 2.

[0062] A first mounting groove 11 is provided above the housing 1, and the heat sink 2 is disposed in the first mounting groove 11. The heat sink 2 is provided with a plurality of air ducts 21 along the axial direction of the housing 1.

[0063] The housing 1 is provided with at least one airflow groove 15, which is arranged opposite to one or more air inlets of the air duct 21, so as to draw external cold air into the air duct 21 through the airflow groove 15 for heat dissipation inside the optical module.

[0064] like Figures 1-2 As shown, this embodiment of the invention includes a housing 1 and a heat sink 2. The housing 1 has a first mounting groove 11, and the heat sink 2 is disposed within the first mounting groove 11 to dissipate heat from the optical module. In specific application scenarios, the OSFP-XD optical module of this embodiment is arranged in a stacked configuration. When using the air duct 21 within the heat sink 2 for heat dissipation, the stacked design can obstruct the air inlet of the heat sink 2, resulting in poor airflow. This embodiment of the invention addresses this by providing at least one airflow groove 15 on the housing 1 of the OSFP-XD optical module and aligning the airflow groove 15 with the air inlet of one or more air ducts 21 on the heat sink 2. This allows the airflow groove 15 to communicate with the air ducts 21 within the heat sink 2, forming a channel for heat dissipation of the OSFP-XD optical module, thereby ensuring that the OSFP-XD optical module operates under normal operating temperature conditions.

[0065] In this embodiment of the invention, a first mounting groove 11 is provided above the housing 1, and the heat sink 2 is disposed within the first mounting groove 11. Specifically, baffles are respectively provided on both sides of the upper part of the housing 1 (see...). Figure 2As shown in the figure (not marked), a first mounting groove 11 for mounting the heat sink 2 is formed. The heat sink 2 has multiple air ducts 21 arranged along the axial direction of the housing 1. In this embodiment of the invention, the heat sink 2 can be made of aluminum, but is not limited to, and has multiple hollow open cavities to form the air ducts 21 within it. During manufacturing, the heat sink 2 can be made using a pressing process, which requires low precision, has low cost, and good thermal conductivity. Furthermore, in practical applications, the heat sink 2 needs to be mounted on a heat sink frame 321 on the cage 3 (such as...). Figure 3 As shown, the heat sink 2 is made of aluminum. The metal has good ductility, which can ensure the surface roughness and flatness of the heat sink 2, making it easy for the heat sink 2 to contact the module cage and the system heat sink for heat conduction.

[0066] like Figures 3-5 As shown, the OSFP-XD optical module of this embodiment of the invention also includes a cage 3; a grid through hole 31 is provided on one end of the cage 3, the cage 3 is sleeved on the housing 1, and the air outlet of the air duct 21 is connected to the grid through hole 31 so as to dissipate heat from the optical module through the airflow groove 15, the air duct 21 and the grid through hole 31.

[0067] like Figure 3 As shown, this embodiment of the invention also includes a cage 3, which is fitted onto the housing 1 and primarily serves to protect the optical module. To further dissipate heat from the optical module, a grid through-hole 31 is provided at one end of the cage 3. Specifically, a grid through-hole 31 is provided at the tail of the cage 3, and this grid through-hole 31 communicates with the air duct 21 on the heat sink 2 to facilitate heat dissipation from the optical module. It is worth noting that the shape of the grid through-hole 31 in this embodiment can be customized according to specific circumstances; for example, the grid through-hole 31 can be, but is not limited to, one or more of square, circular, and strip shapes.

[0068] The OSFP-XD optical module of this invention includes a housing 1, a heat sink 2, and a cage 3. An air duct 21 is provided on the heat sink 2, and the heat sink 2 with the air duct 21 is installed in the first mounting groove 11 of the housing 1. A grid through hole 31 is provided at one end of the cage 3. When the cage 3 is fitted onto the housing 1, the air duct 21 communicates with the grid through hole 31 to form a channel for heat dissipation of the optical module.

[0069] To illustrate the complete solution of the embodiments of the present invention, the details of the embodiments of the present invention will be described in detail below. During the installation of the heat sink 2, in order to fix the heat sink 2 within the first mounting groove 11, as follows... Figures 6-7As shown, at least one fin 12 is provided on the inner wall of one end of the first mounting groove 11 along the axial direction of the housing 1. One end of the fin 12 is provided with a protrusion 121, which is suspended on one end of the fin 12, so that the protrusion 121 and the bottom surface of the first mounting groove 11 form a retaining notch 122 (e.g., Figure 8 As shown in the figure, the protrusion 121 is disposed in the air duct 21 of the heat sink 2 so as to hold and fix the heat sink 2 through the retaining notch 122.

[0070] like Figures 6-8 As shown, a fin 12 is provided in the first mounting groove 11 of this embodiment of the invention. One end of the fin 12 has a protrusion 121, which is suspended from the fin 12. The heat sink 2 is fixed in the first mounting groove 11 by inserting the protrusion 121 into the air duct 21 of the heat sink 2. Specifically, in this embodiment of the invention, the lower end of the fin 12 is provided in the first mounting groove 11, and the fin 12 is axially arranged along the housing 1. One end of the fin 12 has a protrusion 121 near the upper side, which is suspended so that the protrusion 121 forms a retaining notch 122 with the bottom surface of the first mounting groove 11. When the heat sink 2 is installed in the first mounting groove 11, the port of the air duct 21 of the heat sink 2 is inserted into the protrusion 121 on the fin 12 to fix the heat sink 2 in the first mounting groove 11. It is worth noting that the heat sink 2 in this embodiment of the invention is provided with multiple air ducts 21, and one fin 12 only needs to be held with one air duct 21. Through the function of the fin 12, on the one hand, the heat sink 2 is fixedly held in the first mounting groove 11, and on the other hand, during the installation of the heat sink 2, the fin 12 can also serve to position the heat sink 2.

[0071] The optical module of this embodiment of the invention is provided with a cage 3 to further dissipate heat from the optical module of this embodiment of the invention, such as... Figure 3 As shown, the cage 3 of the present invention is provided with a second mounting groove 32, and a heat dissipation frame 321 is provided in the second mounting groove 32. The bottom surface of the heat dissipation frame 321 extends into the cage 3 with a first preset thickness so that the heat dissipation frame 321 is attached to the heat dissipation component 2.

[0072] like Figures 3-4As shown, in this embodiment of the invention, a second mounting groove 32 is provided on the cage 3, and a corresponding heat sink 321 is provided in the second mounting groove 32. When the cage 3 is installed on the housing 1, the heat sink 321 rests on the heat sink 2. Through the combined action of the heat sink 2 and the heat sink 321, heat is dissipated from the inside of the optical module. In order to stably mount the heat sink 321 on the cage 3, the bottom of the heat sink 321 in this embodiment of the invention is easily cut by cutting a notch 6 on the edge of the bottom of the heat sink 321 (see reference). Figure 4 As shown, when the heat sink 321 is installed into the second mounting slot 32, it is inserted into the second mounting slot 32 through the cut 6 at the bottom of the heat sink 321, and under the action of gravity, the heat sink 321 will be held in the second mounting slot 32.

[0073] It is worth noting that, in order to fix the heat sink 321 in the second mounting slot 32, the bottom of the heat sink 321 in this embodiment extends into the cage 3 by a first preset thickness. The first preset thickness in this embodiment can be, but is not limited to, 0.01 mm. The direction in which the bottom of the heat sink 321 extends into the cage 3 is specifically expressed as: extending from the upper surface of the cage 3 into the inner cavity of the cage 3. This is achieved by cutting the bottom of the heat sink 321, resulting in a cut 6 at the bottom of the heat sink 321 (see...). Figure 4 As shown in the diagram, this allows the heat sink 321 to be held in the second mounting slot 32. It is worth noting that, in this embodiment of the invention, the bottom of the heat sink 321 extends into the cage 3 with a first preset thickness. This first preset thickness can be, but is not limited to, 0.01 mm.

[0074] In a preferred application scenario, to prevent the heat sink 321 from detaching from the cage 3, a clip 10 is provided on the cage 3 after the heat sink 321 is installed into the second mounting slot 32 (see [reference]). Figure 4 As shown), the heat sink 321 is fixed to the cage 3. In addition, the cage 3, which is equipped with the buckle 10, usually has a certain degree of elasticity. When the cage 3 is inserted into the housing 1, the heat sink 321 on the cage 3 is lifted up by the fins 12. The cage 3 has a certain degree of elasticity, and the heat sink 321 is fixed in the second mounting groove 32 of the cage 3 by the buckle 10. When the fins 12 lift the heat sink 321, the upper part of the cage 3 will be lifted and deformed within the range of elastic deformation. When the heat sink 321 has completely passed the fins 12, the fins 12 no longer contact the heat sink 321. At this time, the force applied by the fins 12 is lost. Through the buckle 10 and the elasticity of the cage 3, the heat sink 321 is firmly attached to the heat sink 2.

[0075] To achieve better heat dissipation for the optical module in this embodiment, after the cage 3 is installed symmetrically on the housing 1, the heat sink 321 needs to be placed on the heat sink 2, ensuring a tight fit between the heat sink 321 and the heat sink 2. This allows for the transfer of heat from inside the optical module to the outside through heat transfer. Therefore, the size of the cage 3 in this embodiment cannot be too large. On one hand, it needs to ensure that after the cage 3 is inserted into the housing 1, the heat sink 321 and the heat sink 2 fit together well without any gaps, thus achieving excellent heat dissipation. On the other hand, since the bottom of the heat sink 321 has a cutout 6, the bottom of the heat sink 321 extends into the cage 3. During installation, it is also necessary to ensure that the heat sink 321 can slide onto the heat sink 2. Based on this, in embodiments of the present invention, the size of the cage 3 is usually set to be slightly larger than the size of the housing 1, so that the cage 3 can be smoothly inserted into the housing 1. Since the size of the cage 3 is slightly larger, during the process of inserting the cage 3 into the housing 1, the bottom of the heat sink 321 will inevitably scrape against the heat sink 2, exerting force on the heat sink 2. During the repeated insertion and unlocking of the cage 3 and the housing 1, the heat sink 2 is very likely to fall out of the first mounting slot 11, thereby causing the heat dissipation failure in the optical module.

[0076] To solve the above problems, the fins 12 of the present invention are higher than the heat sink 2 by a first preset height (see reference). Figure 7 As shown, Figure 7 The height of the middle fin 12 is slightly higher than the height of the heat sink 2 (the visual difference is not significant). During the installation and disassembly of the cage 3, the heat sink 321 is raised by the fin 12 to avoid the heat sink 321 exerting force on the heat sink 2, which could cause the heat sink 2 to loosen.

[0077] This invention not only uses fins 12 to position and fix the heat sink 2, but also sets the height of the fins 12 to exceed a first preset height of the heat sink 2. During the installation of the cage 3, when the heat sink frame 321 on the cage 3 passes the fins 12, the fins 12 lift the heat sink frame 321, raising it and minimizing contact between the heat sink frame 321 and the heat sink 2. This prevents the heat sink 2 from being affected by the heat sink frame 321 during installation, thus avoiding loosening due to stress. It is worth noting that in this embodiment, the fins 12 are higher than the first preset height of the heat sink 2; for example, they may be, but are not limited to, 0.1mm higher, to avoid the heat sink frame 321 exerting force on the heat sink 2, thus preventing the heat sink 2 from loosening.

[0078] like Figure 9As shown, in order to stably install the heat sink 2 into the first mounting slot 11, an overflow groove 111 is provided on the bottom surface of the first mounting slot 11 in this embodiment of the invention, and the heat sink 2 is attached to the overflow groove 111. In a specific application scenario, this embodiment of the invention sets a grid-like overflow groove 111 in the first mounting slot 11. The overflow groove 111 of each grid is formed by drawing an n×m grid (where n≥2 and m≥2) on the bottom surface of the first mounting slot 11, and setting channels along the edge line of each grid, thereby forming the overflow groove 111. The overflow groove 111 is actually formed by the interconnection of channels on the edge of each grid. When it is necessary to install the heat sink 2 into the first mounting slot 11, the overflow groove 111 is formed by the interconnection of channels on the edge of each grid. When the heat sink 2 is assembled into the first mounting slot 11, the heat sink 2 is filled with solder paste or glue. When the heat sink 2 is assembled into the first mounting slot 11, the inner surface of the heat sink 2 is squeezed with solder paste or glue, so that the solder paste or glue flows along the overflow slot 111 to expel the gas in the overflow slot 111. Then, the heat sink 2 is fixed in the first mounting slot 11 by soldering or high-temperature curing. This reduces the problem of soldering or high-temperature curing failure caused by air between the housing 1 and the heat sink 2, thereby greatly improving the yield of this process.

[0079] It is worth noting that when the heat sink 2 and the overflow groove 111 in the first mounting groove 11 are filled with solder paste in this embodiment of the invention, the heat sink 2 is attached to the overflow groove 111 coated with solder paste. The solder paste is melted by high temperature, causing it to flow along the edge of the groove and evenly fill the overflow groove 111. After the temperature drops, the heat sink 2 is fixed to the overflow groove 111 of the first mounting groove 11 by the solder paste. When the heat sink 2 and the overflow groove 111 in the first mounting groove 11 are filled with water in this embodiment of the invention, the heat sink 2 is attached to the overflow groove 111 coated with glue. The glue flows along the edge of the groove due to its fluidity. After the glue is evenly filled to the overflow groove 111, it is cured by heating, and the glue fixes the heat sink 2 to the overflow groove 111 of the first mounting groove 11.

[0080] like Figures 10-12 As shown, the optical module in this embodiment of the invention also includes a pull ring 4; the pull ring 4 includes a pair of sliding plates 41, and a first limiting protrusion 411 is provided on the inner wall of the sliding plate 41, the first limiting protrusion 411 extending inward to the sliding plate 41; the housing 1 includes a first housing 13, the first housing 13 includes two side plates 131, and an elongated groove 1311 is provided on the outer wall of the side plate 131, one end of the elongated groove 13111 is provided with a sliding groove 13111 along the axial direction of the first housing 13; the sliding plate 41 is disposed in the elongated groove 1311, so that the first limiting protrusion 411 is movably disposed in the sliding groove 13111, so as to realize the assembly of the pull ring 4 and the first housing 13.

[0081] like Figures 10-12 As shown, the pull ring 4 of this embodiment includes a pair of sliding plates 41, the two movable plates are symmetrically arranged, and a first limiting protrusion 411 is provided on the inner wall of each movable plate; the first housing 13 includes two side plates 131, and a long groove 1311 is provided on the outer wall of each side plate 131. One end of the long groove 1311 is provided with a sliding groove 13111 along the axial direction of the first housing 13. When the sliding plate 41 is placed in the long groove 1311 of the side plate 131, the first limiting protrusion 411 is placed in the long groove 1311 so that the first limiting protrusion 411 is movably placed in the sliding groove 13111, thereby connecting the sliding plate 41 with the housing 1. In practical applications, in order to insert the first limiting protrusion 411 on the sliding plate 41 into the slide groove 13111 on the long groove 1311, the embodiments of the present invention may, but are not limited to, provide a corresponding notch at the lower end of the slide groove 13111, connect the notch with the lower end of the slide groove 13111, slide the first limiting protrusion 411 along the notch into the slide groove 13111, and then assemble the sliding plate 41 into the long groove 1311 of the side plate 131, so as to realize the assembly of the pull ring 4 and the first housing 13.

[0082] like Figures 11-12 As shown, the sliding plate 41 of this embodiment of the invention has a second vertically upward limiting protrusion 412 at its tail end; the housing 1 also includes a second housing 14, which is disposed on the first housing 13; a first limiting groove 141 is provided on the side plate 131 of the first housing 13, and the second limiting protrusion 412 is disposed in the first limiting groove 141, so as to facilitate the second housing 14 being disposed on the first housing 13 by means of the sliding plate 41. It is worth noting that the airflow groove 15 and the first mounting groove 11 mentioned above in this embodiment of the invention are actually disposed on the second housing 14 (see Figure 9 (As shown).

[0083] like Figure 11 As shown, the tail of the sliding plate 41 in this embodiment of the invention is also provided with a vertically upward second limiting protrusion 412. The housing 1 also includes a second housing 14, which is disposed on the first housing 13. A first limiting groove 141 is provided on the side plate of the second housing 14. The first limiting groove 141 matches the second limiting protrusion 412. That is, the first limiting groove 141 is also arranged vertically upward. When the sliding plate 41 of the pull ring 4 is connected to the first housing 13, the pull ring 4, the first housing 13 and the second housing 14 are connected together by inserting the second limiting protrusion 412 on the sliding plate 41 into the first limiting groove 141.

[0084] Furthermore, such as Figure 11As shown, in this embodiment of the invention, the tail of the sliding plate 41 is provided with an unlocking protrusion 413 along the axial direction of the sliding plate 41, and the other end of the long groove 1311 is provided with an arc-shaped groove 13112, and the unlocking protrusion 413 is disposed in the arc-shaped groove 13112; metal springs are respectively provided on the inner walls of both sides of the cage 3, one end of the metal spring is connected to the inner side wall of the cage 3, and the metal spring is inclined at a preset angle to the inner wall of the cage 3; the cage 3 is sleeved on the outer side of the housing 1 so as to lock and unlock the optical module by means of the metal spring and the unlocking protrusion 413.

[0085] To enable the reset and unlocking of the optical module in this embodiment of the invention, the tail of the sliding plate 41 in this embodiment of the invention is provided with an unlocking protrusion 413 along the axial direction of the sliding plate 41 (see [reference]). Figure 11 As shown, Figure 11 (Not marked in the text) The unlocking protrusion 413 is arched, and the other end of the elongated groove 1311 on the first housing 13 is provided with an arc-shaped groove 13112 that matches the unlocking protrusion 413 (see reference). Figure 11 As shown, Figure 11 (Not marked in the text). When the sliding plate 41 is installed on the elongated slot 1311 of the first housing 13, it is fixed by pushing the unlocking protrusion 413 at the tail of the sliding plate 41 into the arc-shaped slot 13112. Metal springs are respectively provided on the inner walls of the two sides of the corresponding cage 3 (see...). Figure 1 As shown, Figure 1 (Not marked in the text) One end of the metal spring is connected to the inner wall of the cage 3, and the metal spring is tilted at a preset angle to the inner wall of the cage 3.

[0086] After the unlocking protrusion 413 at the tail of the sliding plate 41 is pushed into the arc groove 13112 for fixation, the cage 3 is fitted onto the outside of the housing 1 and the cage 3 and the housing 1 are inserted into each other. During the insertion process, under the action of the side of the first housing 13, the metal spring is in a state of close contact with the side of the first housing 13. When the metal spring reaches the unlocking protrusion 413, the metal spring bounces up and then locks onto the unlocking protrusion 413, thereby locking the pull ring 4, the first housing 13 and the second housing 14 through the cage 3.

[0087] It is worth noting that, in order to lock the pull ring 4, the first housing 13, and the second housing 14 by means of the metal spring on the cage 3, the end of the pull ring 4 in this embodiment of the invention is recessed inward so that when the metal spring on the cage 3 passes the unlocking protrusion 413, the metal spring can spring up and lock the metal spring onto the unlocking protrusion 413. When unlocking is required, the sliding plate 41 is pulled, so that the first limiting protrusion 411 on the sliding plate 41 moves along the slide groove 13111, thereby pulling the unlocking protrusion 413 away from the arc groove 13112; at the same time, when the unlocking protrusion 413 of the pull ring 4 is pulled away from the arc groove 13112, the unlocking protrusion 413 separates from the metal spring, and then the pull ring 4 is taken out from below the slide groove 13111, thereby realizing the separation of the pull ring 4, the first housing 13, and the second housing 14.

[0088] It is worth noting that, in order to facilitate applying force to the pull ring 4, the sliding plate 41 of this embodiment is also provided with a handle. A pair of sliding plates 41 on the pull ring 4 are respectively arranged on both sides of the handle. The handle makes it easy for the user to apply force, so as to reset and unlock the optical module of this embodiment.

[0089] To achieve the photoelectric conversion of the optical module in the embodiments of the present invention, such as Figure 13 As shown, the optical module in this embodiment of the invention further includes an optoelectronic component 5, which is disposed within the first housing 13. The optoelectronic component 5 includes at least two sets of optical adapters 51, wherein the two sets of optical adapters 51 are arranged in upper and lower layers.

[0090] The head of the first housing 13 is provided with a cavity 132, and a support member 1321 is provided inside the cavity 132. At least two sets of bracket inner cavities 13211 are provided on the support member 1321, and the optical adapter 51 is disposed inside the bracket inner cavity 13211.

[0091] In specific application scenarios, such as Figures 13-15As shown, the optoelectronic component 5 within the optical module of this embodiment includes at least two sets of optical adapters 51, which are arranged in upper and lower layers. To fix the upper and lower layers of optical adapters 51 within the optical module, the head of the first housing 13 of this embodiment is provided with a cavity 132. A support member 1321 is provided within the cavity 132, and at least two sets of upper and lower layered bracket cavities 13211 are provided on the support member 1321 to facilitate the placement of the optical adapter 51 within the bracket cavity 13211. In specific application scenarios, the positioning ring of the optical adapter is machined into a flat shape on both sides by cutting. The sides of the bracket cavity 13211 of the corresponding support member 1321 are matched with the flat shape on both sides of the positioning ring. This allows the positioning ring of the adapter to be inserted into the bracket cavity 13211, where the flat shape on the positioning ring and the side walls of the bracket cavity 13211 form a limit, preventing the optical adapter 51 from rotating during use or cleaning, thus avoiding fiber optic damage. (See reference...) Figure 14 As shown, since the optical transceiver assembly includes an optical transceiver end and an optical receiver end, each bracket cavity includes two cavity structures. It is understandable that... Figure 14 The two cavity structures in the upper layer form one set of bracket cavities, and the two cavity structures in the lower layer form another set of bracket cavities. In addition, the optoelectronic component 5 within the optical module of this embodiment is mainly used for photoelectric conversion. The optoelectronic component 5 of this embodiment includes at least two optical transceiver components, including an optical receiving component and an optical emitting component, a PCB circuit board, and a DSP chip. The optical transceiver component and the DSP chip are connected through the PCB circuit board to form the optoelectronic component 5 for photoelectric conversion. After the optical transceiver component and the DSP chip are mounted on the PCB circuit board, the PCB circuit board needs to be mounted inside the first housing 13. In a specific application scenario, a heat sink is provided inside the first housing 13, thereby mounting the PCB circuit board containing the optical transceiver component and the DSP chip inside the first housing 13.

[0092] In addition, to further dissipate heat within the housing 1, the lower surface of the first housing 13 in this embodiment of the invention is provided with a plurality of rib-like protrusions (see [reference]). Figure 16 As shown, Figure 16 (Not marked in the text), adjacent rib-like protrusions are spaced accordingly, and the cage 3 is provided with grid holes (the shape of the grid holes can be, but is not limited to, circular, square, or rectangular). By fitting the cage 3 onto the housing 1, the inner wall of the cage 3 cooperates with the rib-like protrusions to form a bottom heat dissipation channel, thereby better dissipating heat from the inside of the optical module. It is worth noting that, see [reference missing]. Figure 16As shown, the heat dissipation direction of the heat dissipation air duct in the embodiment of the present invention is shown. Heat is dissipated through the air duct 21 in the heat dissipation component 2 and the heat dissipation air duct formed by the rib-like protrusions on the lower surface of the cage 3 and the lower surface of the first housing 13, thereby transferring the heat inside the optical module to the outside of the optical module.

[0093] In addition, since the optical module in this embodiment of the invention is arranged in a stacked configuration, when using the air duct 21 inside the heat sink 2 for heat dissipation, the stacked design will obstruct the air inlet of the heat sink 2, thus making the airflow of the heat sink 2 unsmooth. In order to ensure the smooth airflow at the air inlet of the heat sink 2, this embodiment of the invention provides an airflow groove 15 on the second housing 14 opposite to the air inlet of the heat sink 2. By setting the air inlet of the heat sink 2 as an airflow groove 15, the incoming air can smoothly enter the air duct 21 of the heat sink 2, and thus smoothly dissipate the heat inside the optical module from the optical module, thereby achieving the purpose of cooling the optical module.

[0094] The OSFP-XD optical module of this embodiment includes a housing 1, a heat sink 2, and a cage 3. An air duct 21 is provided on the heat sink 2, and the heat sink 2 with the air duct 21 is installed in the first mounting groove 11 of the housing 1. A grid through-hole 31 is provided at one end of the cage 3. When the cage 3 is fitted onto the housing 1, the air duct 21 communicates with the grid through-hole 31 to form a channel for heat dissipation of the optical module. In this embodiment, multiple rib-like protrusions are provided at the bottom of the housing 1 (i.e., the first housing 13), with gaps between adjacent rib-like protrusions. When the cage 3 is fitted onto the housing 1, another set of heat dissipation air ducts is formed between the inner wall of the cage 3 and the rib-like protrusions. The heat generated inside the optical module is then dissipated through these air ducts, thereby improving the heat dissipation performance of the optical module. In addition, the bottom surface of the first mounting groove 11 in this embodiment of the invention is provided with an overflow groove 111, which mainly serves to overflow glue and vent air, so that when the first housing 13 is fixed with the heat sink 2, failures such as hollowing are avoided, and the yield of this process is greatly improved. By providing at least one fin 12 in the first mounting groove 11, and providing a protrusion 121 at one end of the fin 12, the protrusion 121 is suspended on one end of the fin 12, so that the protrusion 121 and the bottom surface of the first mounting groove 11 form a locking notch 122, which can determine the installation position of the heat sink 2 and protect the heat sink 2 from falling off. In addition, the height of the fin 12 exceeds the height of the heat sink 2. When the cage 3 is fitted onto the housing 1 and the cage 3 and the housing 1 are inserted into each other, the heat sink bracket 321 on the cage 3 can be prevented from exerting force on the heat sink 2, thereby preventing the heat sink 2 from loosening due to force.

[0095] Example 2:

[0096] Embodiment 2 of the present invention also proposes an installation method for an OSFP-XD optical module, which is applicable to the installation of the OSFP-XD optical module described in Embodiment 1, such as... Figure 17 As shown, the installation method includes:

[0097] Step 201: Install the heat sink 2 into the first mounting slot 11 of the housing 1. The housing 1 of the OSFP-XD optical module in this embodiment of the invention is provided with at least one airflow slot 15. During installation, the airflow slot 15 needs to be aligned (relatively positioned) with the air inlet of the air duct 21 of the heat sink 2 so that the airflow slot 15 communicates with the air duct 21 inside the heat sink 2, forming a channel for heat dissipation of the OSFP-XD optical module in this embodiment of the invention, thereby ensuring that the OSFP-XD optical module operates under normal operating temperature conditions.

[0098] Step 202: Align the air inlets of one or more air ducts 21 within the heat sink 2 with the airflow slots 15 to facilitate heat dissipation of the optical module through the air ducts 21 and the airflow slots 15.

[0099] The OSFP-XD optical module of this embodiment has a first mounting groove 11 on its housing 1 and an overflow groove 111 inside the first mounting groove 11. The heat sink 2 is attached to the overflow groove 111 of the first mounting groove 11. By applying solder paste or glue to the overflow groove 111, the heat sink 2 can be firmly installed in the first mounting groove 11. The installation of the heat sink 2 and the first mounting groove 11 has been described in detail above and will not be repeated here.

[0100] After the heat sink 2 is installed into the first mounting slot 11, the cage 3 is fitted onto the housing 1 so that the air duct 21 of the heat sink 2 is connected to the grille through-hole on the cage 3. The air duct 21 on the heat sink 2 and the grille through-hole form a complete ventilation system to facilitate heat dissipation of the optical module. It is worth noting that in the actual application of this embodiment of the invention, after the housing 1, cage 3, and pull ring 4 are connected to form the optical module of this embodiment, an external fan is usually set outside the optical module system. The external fan is connected to the grille through-hole 31 on the cage 3. The external fan draws air out of the optical module, thereby drawing out the heat generated inside the optical module through the air duct 21 design.

[0101] like Figure 18 As shown, the OSFP-XD optical module of this embodiment further includes a cage, on which a heat sink is provided, and the installation method includes:

[0102] Step 301: Insert the OSFP-XD optical module into the first mounting slot 11 of the housing 1. The fins 12 of the OSFP-XD optical module lift the heat sink 321 on the cage 3, thereby protecting the end face of the heat sink 2 from colliding with the end face of the contact part of the heat sink 321 during the insertion process.

[0103] In conjunction with Embodiment 1, the cage 3 of this embodiment is provided with a heat dissipation frame 321. During the insertion process between the cage 3 and the housing 1, to prevent the heat dissipation frame 321 from applying force to the heat dissipation component 2 located in the first mounting groove 11, causing the heat dissipation component 2 to loosen and thus lose its heat dissipation effect, the optical module of this embodiment is provided with fins 12, the height of which is higher than that of the heat dissipation component 2. During the insertion process between the housing 1 and the cage 3, the fins 12 lift up the heat dissipation frame 321 on the cage 3. In addition, the fins 12 are provided with protrusions 121, which are inserted into the air duct 21 of the heat dissipation component 2. The protrusions 121 of the fins 12 fix the heat dissipation component 2 in the first mounting groove 11, which can both determine the installation position of the heat dissipation component 2 and protect the heat dissipation component 2 from falling off.

[0104] Step 302: After the OSFP-XD optical module is inserted into the housing 1, the fin 12 disengages from the contact part, and the corresponding contact part, based on the elastic force of the housing 1, tightly abuts against the surface of the heat sink 2.

[0105] In this embodiment of the invention, during the installation of the optical module, the cage 3 needs to be fitted onto the housing 1. The height of the fins 12 is higher than that of the heat sink 2. During the installation of the cage 3, the fins 12 lift up the heat sink bracket 321 on the cage 3 to prevent the heat sink bracket 321 from contacting and exerting force on the heat sink 2. This prevents the heat sink 2 from falling out of the first mounting slot 11 due to the force exerted by the heat sink bracket 321 on the heat sink 2 during the insertion of the cage 3 and the housing 1. This effectively avoids the problem of heat dissipation disorder inside the optical module caused by the heat sink 2 falling off. After the heat sink bracket 321 passes over the fins 12, it falls down under the action of gravity, so that the heat sink bracket 321 is close to the heat sink 2. Then, the heat sink 2 and the heat sink bracket 321 work together to dissipate heat from the optical module.

[0106] In actual production, the heat sink 2 and the housing 1 can be welded together as a single unit using a reflow soldering process. The heat sink 321 is lifted up by the fins 12 of the module when the assembled module is inserted into the cage.

[0107] Example 3:

[0108] Based on Embodiment 1, Embodiment 3 of the present invention further provides a limiting card 7. The limiting card 7 serves as a small structure within the optical module, facilitating the confinement of the optical fiber within the optical module of this embodiment within the range of the limiting card. Specifically, as shown... Figures 19-22 As shown, the optical module of this embodiment includes a first optical transceiver component 8 and a second optical transceiver component 9. The first optical transceiver component 8 is connected to a first optical fiber 81, and the second optical transceiver component 9 is connected to a second optical fiber 91. Both the first and second optical transceiver components 8 and 9 have an optical adapter 51, which is mounted on a support member 1321. The optical adapter 51 of the first optical transceiver component 8 is connected to the first optical fiber 81, and the optical adapter 51 of the second optical transceiver component 9 is connected to the second optical fiber 91.

[0109] In conjunction with Embodiment 1, the support member 1321 is disposed within the housing 1, and both the first optical transceiver assembly 8 and the second optical transceiver assembly 9 are disposed on the support member 1321. The limiting clip 7 includes a fixing part 71 and a claw part 72. One end of the fixing part 71 is connected to the claw part 72, and the fixing part 71 is connected to the side of the support member 1321 to fix the limiting clip 7 on the support member 1321. The first optical fiber 81 and the second optical fiber 91 are respectively disposed within the claw part 72 to constrain the first optical fiber 81 and the second optical fiber 91 within the housing 1 through the claw part 72.

[0110] Specifically, the upper end of the support member 1321 is provided with an upper mounting groove extending towards the lower surface of the support member 1321, and the lower end of the support member 1321 is provided with a lower mounting groove extending towards the upper surface of the support member 1321; the first optical transceiver component 8 is disposed in the upper mounting groove, and the second optical transceiver component 9 is disposed in the lower mounting groove. Since each optical transceiver component (the first optical transceiver component 8 and / or the second optical transceiver component 9) includes an optical emitting component and an optical receiving component, the upper mounting groove of this embodiment includes two bracket cavities 13211, and the lower mounting groove is also provided with two bracket cavities 13211.

[0111] like Figures 19-22As shown, the multi-channel OSFP-XD optical module of the present invention includes a housing 1, a support member 1321, and a limiting card 7. The support member 1321 is configured with a two-layer structure (i.e., an upper mounting slot and a lower mounting slot). The corresponding first optical transceiver component 8 is disposed in the upper mounting slot, and the second optical transceiver component 9 is disposed in the lower mounting slot to increase the density of the optical module of the present invention. The limiting card 7 is disposed inside the optical module. The limiting card 7 includes a fixing part 71 and a claw part 72. The fixing part 71 is connected to the side of the support member 1321 so that the limiting card 7 is fixed on the support member 1321. The first optical fiber 81 and the second optical fiber 91 are respectively disposed in the claw part 72 so that the first optical fiber 81 and the second optical fiber 91 are constrained in the housing 1 by the claw part 72.

[0112] The present invention is a high-density optical module. A limiting card 7 is set inside the optical module. The first optical fiber 81 and the second optical fiber 91 inside the optical module are constrained within the housing 1 by the claw part 72 on the limiting card 7. This avoids the optical fiber pulling at the optical transceiver components (including the first optical transceiver component 8 and the second optical transceiver component 9), which would cause the optical fiber distribution to be messy and thus cause the problem of the optical fiber being broken during the installation process.

[0113] To illustrate the complete details of the embodiments of the present invention, the details of the embodiments of the present invention will be described in detail below, and further, as follows... Figure 22 As shown, the claw portion 72 includes a pressing plate 721 and a stop plate 722; the two ends of the pressing plate 721 are respectively connected to a stop plate 722, and the first optical fiber 81 and the second optical fiber 91 are respectively disposed under the pressing plate 721 so as to be constrained by the stop plates 722 at both ends of the pressing plate 721, so as to gather the first optical fiber 81 and the second optical fiber 91 within the claw portion 72.

[0114] like Figure 22As shown, the limiting card 7 in this embodiment of the invention includes a fixing part 71 and a claw part 72. The claw part 72 includes a pressing plate 721 and a stop plate 722. The first optical transceiver assembly 8 and the second optical transceiver assembly 9 in this embodiment of the invention are respectively located in the upper mounting slot and the lower mounting slot. Since the first optical transceiver assembly 8 is located in the upper mounting slot, the first optical transceiver assembly 8 is connected to the first optical fiber 81. By pulling the first optical fiber 81 through the first optical transceiver assembly 8, the first optical fiber 81 is usually in the upper position, and the corresponding second optical transceiver assembly 9 is in the lower mounting slot. This allows the second optical fiber 91 to be positioned at the lower level. The first optical fiber 81 is pressed down to be flush with the second optical fiber 91 by the pressing plate 721 on the claw part 72. The first optical fiber 81 and the second optical fiber 91 are constrained by the stop plates 722 on both sides of the pressing plate 721, so that the first optical fiber 81 and the second optical fiber 91 are constrained within the range constrained by the pressing plate 721 and the stop plates 722. This avoids pulling of the optical fibers at the optical transceiver components (first optical transceiver component 8 and second optical transceiver component 9), thereby avoiding the problem of the optical fiber being broken during the installation process.

[0115] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. An OSFP-XD optical module, characterized in that, Includes a housing (1) and a heat sink (2); A first mounting groove (11) is provided above the housing (1), and the heat sink (2) is provided in the first mounting groove (11). The heat sink (2) is provided with a plurality of air ducts (21) along the axial direction of the housing (1). At least one fin (12) along the axial direction of the housing (1) is provided on the inner wall of one end of the first mounting groove (11). At least one airflow groove (15) is provided on the housing (1). The airflow groove (15) is arranged opposite to the air inlet of one or more air ducts (21) so as to draw external cold air into the air duct (21) through the airflow groove (15) for heat dissipation inside the optical module. The OSFP-XD optical module also includes a cage (3), on which a heat sink (321) is provided. The heat sink (321) is provided with a contact part that contacts the heat sink (2). The contact part passes through a slot provided on the cage (3). The fins (12) lift the heat sink (321) and protect the end face of the heat sink (2) from colliding with the end face of the contact part during the insertion process; after the OSFP-XD optical module is inserted into the cage (3), the fins (12) disengage from the contact part, and the contact part is tightly abutted against the surface of the heat sink (2).

2. The OSFP-XD optical module according to claim 1, characterized in that, A grid through hole (31) is provided on one end of the cage (3). The cage (3) is fitted onto the housing (1). The air outlet of the air duct (21) is connected to the grid through hole (31) so as to dissipate heat from the optical module through the airflow groove (15), the air duct (21) and the grid through hole (31).

3. The OSFP-XD optical module according to claim 2, characterized in that, The cage (3) is provided with a second mounting groove (32), and a heat sink (321) is provided in the second mounting groove (32). The bottom of the heat sink (321) extends into the cage (3) with a first preset thickness so that the heat sink (321) fits against the heat sink (2).

4. The OSFP-XD optical module according to claim 1, characterized in that, An overflow groove (111) is provided on the bottom surface of the first mounting groove (11), and the heat sink (2) is attached to the overflow groove (111).

5. The OSFP-XD optical module according to claim 1, characterized in that, The optical module also includes a pull ring (4); The pull ring (4) includes a pair of sliding plates (41), and a first limiting protrusion (411) is provided on the inner wall of the sliding plate (41), and the first limiting protrusion (411) extends into the inner side of the sliding plate (41). The housing (1) includes a first housing (13), the first housing (13) includes two side plates (131), the outer wall of the side plates (131) is provided with a long groove (1311), and one end of the long groove (1311) is provided with a sliding groove (13111) along the axial direction of the first housing (13). The sliding plate (41) is disposed in the long groove (1311) so that the first limiting protrusion (411) is movably disposed in the sliding groove (13111) to realize the assembly of the pull ring (4) and the first housing (13).

6. The OSFP-XD optical module according to claim 5, characterized in that, The sliding plate (41) is provided with a second limiting protrusion (412) that extends vertically upward at its tail. The housing (1) further includes a second housing (14), which is disposed on the first housing (13); a first limiting groove (141) is provided on the side plate of the second housing (14), and a second limiting protrusion (412) is disposed in the first limiting groove (141) so as to facilitate the second housing (14) being disposed on the first housing (13) by means of the sliding plate (41).

7. The OSFP-XD optical module according to claim 5, characterized in that, The optical module also includes an optoelectronic component (5), which is disposed inside the first housing (13). The optoelectronic component (5) includes at least two sets of optical adapters (51); wherein the two sets of optical adapters (51) are arranged in two layers, one above the other. The head of the first housing (13) is provided with a cavity (132), and a support member (1321) is provided inside the cavity (132). At least two sets of bracket inner cavities (13211) are provided on the support member (1321), and the optical adapter (51) is provided inside the bracket inner cavity (13211).

8. The OSFP-XD optical module according to claim 5, characterized in that, The tail of the sliding plate (41) is provided with an unlocking protrusion (413) along the axial direction of the sliding plate (41), and the other end of the long groove (1311) is provided with an arc groove (13112), and the unlocking protrusion (413) is located in the arc groove (13112). Metal springs are respectively provided on the inner walls of both sides of the cage (3). One end of the metal spring is connected to the inner wall of the cage (3), and the metal spring is inclined at a preset angle to the inner wall of the cage (3). The cage (3) is fitted onto the outside of the housing (1) so that the optical module can be locked and unlocked by the metal spring and the unlocking protrusion (413).

9. A method for installing an OSFP-XD optical module, characterized in that, For installing the OSFP-XD optical module as described in any one of claims 1-8, the installation method includes: Install the heat sink (2) into the first mounting slot (11) of the housing (1); The air inlets of one or more air ducts (21) in the heat sink (2) are aligned with the airflow slots (15) so as to dissipate heat from the optical module through the air ducts (21) and the airflow slots (15); The installation method further includes: When the OSFP-XD optical module is inserted into the cage (3), the fins (12) of the OSFP-XD optical module lift the heat sink (321) on the cage (3), thereby protecting the end face of the heat sink (2) from colliding with the end face of the contact part of the heat sink (321) during the insertion process. After the OSFP-XD optical module is inserted into the cage (3), the fin (12) disengages from the contact part, and the corresponding contact part, based on the elastic force of the cage (3), tightly abuts against the surface of the heat sink (2).

Images