Silicon optical wafer testing equipment and optical fiber pose adjusting mechanism, method and system thereof

Abstract

The invention discloses silicon optical wafer testing equipment and an optical fiber pose adjusting mechanism, method and system thereof. The optical fiber pose adjusting mechanism comprises a camera assembly and a deflection optical path assembly. The probe station is used for bearing a silicon optical wafer; an optical fiber coupling module; when the driving assembly drives the silicon optical wafer to be located in the imaging view field of the camera assembly, the camera assembly is adjusted to enable the coordinate system to be parallel to the cutting channel of the silicon optical wafer; when the driving assembly drives the deflection optical path assembly to move into an imaging view field of the camera assembly, the camera assembly collects lateral images of the end part of the optical fiber in at least two different directions through the deflection optical path assembly; and the optical fiber coupling module is used for performing pose adjustment on the end part of the optical fiber according to the lateral image and the direction of the coordinate system of the camera assembly, so that the end part of the optical fiber is preliminarily aligned with the silicon optical wafer. The operation difficulty and the equipment structure of alignment coupling between the optical fiber end part and the silicon optical waveguide are simplified, and the equipment cost is reduced.

Description

Technical Field

[0001] The present invention relates to the field of silicon photonics wafer testing technology, and in particular to an optical fiber posture adjustment mechanism for a silicon photonics wafer testing device, a silicon photonics wafer testing device, an optical fiber posture adjustment method for a silicon photonics wafer testing device, and a silicon photonics wafer testing system. Background Art

[0002] Silicon photonics wafer testing equipment is mainly used to test whether the silicon photonics chips processed on silicon photonics wafers can work normally. In the actual testing process, it is necessary to use optical fibers or optical fiber arrays to transmit optical signals to the silicon photonics chips arranged in an array on the wafer, and perform optical performance tests based on the optical signals output by the silicon photonics chips.

[0003] In the process of testing the performance of silicon optical waveguides, ensuring the effective alignment coupling between the ports of the optical fiber and the silicon optical waveguide on the wafer is one of the important factors to improve the accuracy of the test. Therefore, how to achieve the alignment coupling between the ports of the optical fiber array and the optical interface of the silicon optical waveguide on the wafer during the silicon optical wafer testing process is one of the key issues in the industry. Summary of the invention

[0004] The purpose of the present invention is to provide a fiber optic posture adjustment mechanism, coupling method and test system for silicon photonics wafer testing equipment, so as to achieve simpler alignment between optical waveguide and optical fiber port during silicon photonics wafer testing, thereby reducing the difficulty of alignment and coupling while reducing the cost of testing equipment.

[0005] In order to solve the above technical problems, the present invention provides a fiber posture adjustment mechanism for silicon photonics wafer testing equipment, comprising a micro-imaging component, a probe station, a fiber coupling module and a driving component; the micro-imaging component comprises a camera component and a deflection optical path component; the probe station is used to carry a silicon photonics wafer; the driving component is used to drive the probe station and the deflection optical path component to switch between each other and move to the imaging field of view of the camera component;

[0006] When the driving component drives the probe station carrying the silicon photonic wafer to move into the imaging field of view of the camera component, the camera component is adjusted so that the camera component coordinate system is parallel to the cutting path of the silicon photonic wafer;

[0007] When the driving component drives the deflection optical path component to move into the imaging field of view of the camera component, the camera component is used to collect lateral images corresponding to at least two lateral pictures in different directions of the optical fiber end portion deflected and transmitted by the deflection optical path component; the optical fiber coupling module is used to adjust the posture of the optical fiber end portion according to the lateral image and the direction of the camera component coordinate system, so as to preliminarily align the optical fiber end portion with the silicon photonic wafer.

[0008] In an optional embodiment of the present application, a cross cursor is provided in the camera of the camera assembly;

[0009] When the driving component drives the probe station carrying the silicon photonics wafer to move into the imaging field of view of the camera component, the camera component is used to collect the wafer image of the silicon photonics wafer, and adjust the cross cursor of the camera in the camera component to be parallel to the cutting path on the silicon photonics wafer through the wafer image.

[0010] In an optional embodiment of the present application, the deflection optical path assembly includes at least two reflective elements;

[0011] When the driving component drives the deflection optical path component to move into the imaging field of view of the camera component, the camera component is used to collect a first lateral image of the optical fiber end of the optical fiber array in a first horizontal direction and a second lateral image in a second horizontal direction through the deflection optical path component; and adjust the end face of the optical fiber end to a horizontal plane according to the first lateral image and the second lateral image by using the optical fiber coupling module; wherein the first horizontal direction and the second horizontal direction are perpendicular to each other;

[0012] The camera assembly is also used to collect a vertical image of the optical fiber end from a vertical direction; the optical fiber coupling module is used to adjust the contour line of the optical fiber end to be parallel to the cross cursor of the camera according to the vertical image.

[0013] In an optional embodiment of the present application, the deflection optical path assembly includes a carrier platform connected to the probe platform, and a first reflective element and a second reflective element arranged on the carrier platform;

[0014] Also included are a first light source assembly and a second light source assembly disposed on the carrier platform;

[0015] The first light source assembly is used to output a light beam to the first reflecting element along the first horizontal direction, and the first reflecting element is used to reflect the incident light beam in a vertically upward direction; the second light source assembly is used to output a light beam to the second reflecting element along the second horizontal direction, and the second reflecting element is used to reflect the incident light in a vertically upward direction; and the light path between the first light source assembly and the first reflecting element and the light path between the second light source assembly and the second reflecting element intersect each other in a set intersection area;

[0016] When the deflection optical path assembly moves to the bottom of the camera assembly through the second driving assembly, the optical fiber end is located in the set intersection area;

[0017] The camera assembly is used to collect the first lateral image when the camera is translated to be directly above the first reflective element, and to collect the second lateral image when the camera is translated to be directly above the second reflective element.

[0018] In an optional embodiment of the present application, the end connection structure of the optical fiber coupling module for connecting the end of the optical fiber is further provided with a height detection structure;

[0019] Correspondingly, a calibration substrate is also provided on the carrier platform corresponding to the set intersection area;

[0020] When the driving component drives the deflection optical path component to move until the distance between the lower surface of the height detection structure and the upper surface of the calibration substrate is within a set height range, the optical fiber end is located in the set intersection area.

[0021] In an optional embodiment of the present application, the height detection structure is a nanocapacitive displacement sensor.

[0022] In an optional embodiment of the present application, the first light source assembly includes a first surface light source and a third reflective element; the second light source assembly includes a second surface light source and a fourth reflective element;

[0023] The first reflecting element, the second reflecting element, the third reflecting element and the fourth reflecting element are all right-angle prisms, and a reflecting film layer is provided on the hypotenuse reflecting surface of the right-angle prism;

[0024] The beveled reflective surface of the third reflective element is located on the output light path of the first surface light source, and is used to reflect the light beam output by the first surface light source along the first horizontal direction through the set intersection area and incident on the first reflective element, so that the first reflective element reflects the light beam carrying the lateral profile information of the end of the optical fiber;

[0025] The hypotenuse reflection surface of the fourth reflection element is located on the output light path of the second surface light source, and is used to reflect the light beam output by the second surface light source along the second horizontal direction through the set intersection area and incident on the second reflection element, so that the second reflection element reflects the light carrying the lateral profile information of the optical fiber end.

[0026] In an optional embodiment of the present application, the optical fiber coupling module includes three translation components and three rotation components connected in sequence, and an end connection structure;

[0027] The three translation components are used to drive the terminal connection structure to perform translational motion along the first direction, the second direction and the third direction respectively. The three rotation components are used to drive the terminal connection structure to rotate around the first rotation axis, the second rotation axis and the third rotation axis respectively; the first direction, the second direction and the third direction are perpendicular to each other; the first rotation axis, the second rotation axis and the third rotation axis are perpendicular to each other.

[0028] A silicon photonics wafer testing device comprises the optical fiber posture adjustment mechanism of the silicon photonics wafer testing device as described in any one of the above items.

[0029] A coupling method for an optical fiber posture adjustment mechanism of a silicon photonic wafer testing device is applied to the optical fiber posture adjustment mechanism of the silicon photonic wafer testing device as described in any one of the above items, and the optical fiber posture adjustment method comprises:

[0030] Control the driving component to drive the silicon photonics wafer to translate into the imaging field of view of the camera component, and adjust the camera component through the wafer image collected by the camera component so that the camera component coordinate system and the cutting path on the silicon photonics wafer are parallel to each other;

[0031] Control the silicon photonic wafer to move out of the imaging field of view of the camera component, and move the deflection optical path component into the imaging field of view of the camera component, and collect, through the camera component, lateral images corresponding to lateral pictures in at least two different directions of the end of the optical fiber deflected and transmitted by the deflection optical path component;

[0032] The optical fiber coupling module is controlled to adjust the posture of the optical fiber end according to the lateral image and the direction of the camera component coordinate system, and the driving component is controlled to drive the silicon photonic wafer to translate into the imaging field of view of the camera component, so that the optical fiber array and the silicon photonic wafer are preliminarily aligned.

[0033] In an optional embodiment of the present application, the camera assembly is adjusted through the wafer image captured by the camera assembly so that the camera assembly coordinate system and the dicing road on the silicon photonic wafer are parallel to each other, including:

[0034] Controlling the driving component to drive the probe station carrying the silicon photonic wafer to move into the imaging field of view of the camera component;

[0035] The camera assembly is used to collect a wafer image of the silicon photonic wafer;

[0036] The camera assembly is adjusted by the wafer image so that the cross cursor of the camera in the camera assembly is adjusted to be parallel to the cutting path on the silicon photonic wafer.

[0037] In an optional embodiment of the present application, controlling the optical fiber coupling module to adjust the position of the optical fiber end according to the lateral image and the direction of the camera assembly coordinate system so as to preliminarily align the optical fiber array with the silicon photonic wafer includes:

[0038] The camera assembly collects lateral images of the optical fiber end portion in the first horizontal direction and the second horizontal direction reflected by the deflection optical path assembly to obtain a first lateral image and a second lateral image; wherein the first horizontal direction and the second horizontal direction are perpendicular to each other;

[0039] Controlling the optical fiber coupling module to adjust the end surface of the optical fiber end to a horizontal plane according to the first lateral image and the second lateral image;

[0040] Collecting a vertical image of the optical fiber end from a vertical direction by the camera assembly;

[0041] The optical fiber coupling module is controlled according to the vertical image to adjust the contour line of the optical fiber end to be parallel to the cross cursor of the camera.

[0042] In an optional embodiment of the present application, controlling the optical fiber coupling module to adjust the end face of the optical fiber end to a horizontal plane according to the first lateral image and the second lateral image includes:

[0043] Determine a first angle between the end face of the optical fiber end and the second horizontal direction according to an end face contour line imaged by the optical fiber end in the first lateral image;

[0044] Controlling the optical fiber coupling module to drive the optical fiber end to rotate by a first angle around the second rotation axis; wherein the second horizontal direction and the second rotation axis are parallel to each other;

[0045] Determine a second angle between the end face of the optical fiber end and the first horizontal direction according to an end face contour line imaged by the optical fiber end in the second lateral image;

[0046] The optical fiber coupling module is controlled to drive the optical fiber end to rotate at a second angle around the first rotation axis; wherein the first horizontal direction and the first rotation axis are parallel to each other.

[0047] In an optional embodiment of the present application, after controlling the optical fiber coupling module to drive the optical fiber end to rotate the first angle around the second rotation axis, the method further includes:

[0048] The optical fiber coupling module is used to drive the optical fiber end to translate along the first direction. The distance is translated along the third direction The distance of is the distance between the optical fiber end and the second rotation axis; is the first angle;

[0049] Correspondingly, after controlling the optical fiber coupling module to drive the optical fiber end to rotate about the first rotation axis at a second angle, the method further includes:

[0050] The optical fiber coupling module is used to drive the optical fiber end to translate along the second direction. The distance is translated along the third direction The distance of is the distance between the optical fiber end and the first rotation axis; is the second angle;

[0051] Wherein, the first direction, the second direction and the third direction are perpendicular to each other; the first direction and the first rotation axis, the second direction and the second rotation axis, and the third direction are vertical directions;

[0052] The first direction and the first horizontal direction are parallel to each other; the second direction and the second horizontal direction are parallel to each other.

[0053] In an optional embodiment of the present application, controlling the optical fiber coupling module to adjust the contour line of the optical fiber end to be parallel to the cross cursor of the camera according to the vertical image includes:

[0054] Determine a third angle between the end face contour line of the optical fiber end and the cross cursor according to the end face contour line imaged by the optical fiber end in the vertical image;

[0055] The optical fiber coupling module is controlled to drive the optical fiber end to rotate at the third angle about a third rotation axis; wherein the third rotation axis is a rotation axis in a vertical direction.

[0056] In an optional embodiment of the present application, after controlling the driving component to drive the silicon photonic wafer to translate into the imaging field of view of the camera component so that the optical fiber array and the silicon photonic wafer are preliminarily aligned, the method further includes:

[0057] Controlling the camera assembly to collect an alignment image of the optical fiber end and the silicon photonic wafer formed in the same frame;

[0058] According to the imaging positions of the optical fiber port at the end of the optical fiber and the optical interface in the silicon photonic wafer in the alignment image, respectively, the optical fiber coupling module is controlled to drive the optical fiber end to translate along the first direction and the second direction to achieve preliminary alignment coupling between the optical fiber port at the end of the optical fiber and the optical interface.

[0059] In an optional embodiment of the present application, after the preliminary alignment coupling between the optical fiber port at the end of the optical fiber and the optical interface, the method further includes:

[0060] Controlling a corresponding optical fiber at each optical fiber end to output a light wave;

[0061] The piezoelectric displacement stage connected to the terminal connection structure of the optical fiber coupling module drives the optical fiber end to translate in a horizontal plane;

[0062] The optical power that changes with the translational movement of the optical fiber end is detected by a coupling photodetector connected to an end of the optical fiber away from the optical fiber end;

[0063] When the optical power is maximum, the position corresponding to the end of the optical fiber is the optimal coupling position between the end of the optical fiber and each waveguide in the silicon photonic wafer.

[0064] A silicon photonic wafer testing system comprises an optical performance tester, a controller and the silicon photonic wafer testing device as described above;

[0065] The controller is used to use the silicon photonics wafer testing equipment to execute the steps of the optical fiber posture adjustment method of the silicon photonics wafer testing equipment as described in any one of the above items.

[0066] The present invention provides a silicon photonics wafer testing device and its fiber optic posture adjustment mechanism, fiber optic posture adjustment method and silicon photonics wafer testing system. The fiber optic posture adjustment mechanism includes a microscopic imaging component, a probe station; a fiber coupling module and a driving component; the microscopic imaging component includes a camera component and a deflection optical path component; the probe station is used to carry the silicon photonics wafer; the driving component is used to drive the probe station and the deflection optical path component to switch and move to the imaging field of view of the camera component; when the driving component drives the probe station carrying the silicon photonics wafer to move to the imaging field of view of the camera component, the camera component is adjusted to make the camera component coordinate system parallel to the cutting path of the silicon photonics wafer; when the driving component drives the deflection optical path component to move to the imaging field of the camera component, the camera component is used to collect lateral images corresponding to at least two different directions of lateral pictures of the end of the optical fiber deflected and conducted input by the deflection optical path component; the fiber coupling module is used to adjust the posture of the optical fiber end according to the lateral image and the direction of the camera component coordinate system, so that the optical fiber end is preliminarily aligned with the silicon photonics wafer.

[0067] The optical fiber posture adjustment mechanism in the present application is configured with a deflection optical path component and a fiber coupling module, and the deflection optical path component and the probe station are also connected to a driving component, so that the driving component can switch the deflection optical path component and the probe station carrying the wafer within the imaging field of view of the camera component; therefore, when the probe station carrying the wafer is moved to the imaging field of view of the camera component, the camera component is adjusted so that the coordinate system of the camera component is parallel to the cutting path on the wafer; and when the deflection optical path component is moved and switched to the imaging field of the camera component, the deflection optical path component is used to deflect at least two different lateral images of the optical fiber end and transmit them to the camera component, so as to acquire the lateral image of the optical fiber end, thereby the optical fiber coupling module can be used to adjust the posture of the optical fiber end according to the lateral image and the direction of the camera component coordinate system, so as to achieve preliminary alignment of the optical fiber end and the silicon photonic wafer. The test equipment in the present application only needs to be configured with a set of camera components, and the corresponding alignment process of the test equipment is simple and easy to operate, which can achieve preliminary alignment between the optical fiber end and the silicon optical waveguide, provide a favorable control basis for further precise alignment coupling, simplify the structure of the adjustment mechanism in the entire test equipment, and reduce equipment costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0068] In order to more clearly illustrate the embodiments of the present invention or the technical solutions of the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0069] Figure 1 A schematic diagram of the overall structure of a silicon photonic wafer testing device provided in an embodiment of the present application;

[0070] Figure 2 A partial structural diagram of a fiber optic posture adjustment mechanism for a silicon photonic wafer testing device provided in an embodiment of the present application;

[0071] Figure 3 This is a schematic diagram of the structure of a silicon photonic wafer;

[0072] Figure 4 is a schematic diagram of the structure of the optical fiber end of the optical fiber array;

[0073] Figure 5 A schematic diagram of the structure of a deflection optical path component in an optical fiber posture adjustment mechanism of a silicon photonic wafer testing device provided in an embodiment of the present application;

[0074] Figure 6 A schematic diagram of a partial optical path structure of a deflection optical path assembly provided in an embodiment of the present application;

[0075] Figure 7A schematic diagram of the structure of the optical fiber coupling module provided in an embodiment of the present application;

[0076] Figure 8 A schematic flow chart of a method for adjusting the optical fiber posture of an optical fiber posture adjustment mechanism of a silicon photonic wafer testing device provided in an embodiment of the present application;

[0077] Fig. 9 A schematic diagram of the relative position of the optical waveguide and the optical fiber port within the imaging field of view of the camera provided in an embodiment of the present application. DETAILED DESCRIPTION

[0078] The core of the present invention is to provide a fiber optic posture adjustment mechanism for a silicon photonic wafer testing device, a silicon photonic wafer testing device, a fiber optic posture adjustment method for a silicon photonic wafer testing device, and a silicon photonic wafer testing system, which simplifies the alignment process between the optical fiber end and the silicon photonic waveguide, simplifies the entire device structure, and reduces the equipment cost.

[0079] In order to enable those skilled in the art to better understand the scheme of the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0080] like Figures 1 to 7 As shown, Figure 1 A schematic diagram of the overall structure of a silicon photonic wafer testing device provided in an embodiment of the present application; Figure 2 A partial structural diagram of a fiber optic posture adjustment mechanism for a silicon photonic wafer testing device provided in an embodiment of the present application; Figure 3 This is a schematic diagram of the structure of a silicon photonic wafer; Figure 4 is a schematic diagram of the structure of the optical fiber end of the optical fiber array; Figure 5 A schematic diagram of the structure of a deflection optical path component in an optical fiber posture adjustment mechanism of a silicon photonic wafer testing device provided in an embodiment of the present application; Figure 6 A schematic diagram of a partial optical path structure of a deflection optical path assembly provided in an embodiment of the present application; Figure 7 A schematic diagram of the structure of the optical fiber coupling module provided in an embodiment of the present application.

[0081] In order to facilitate the understanding of the technical solution of this application, first combine Figure 3 and Figure 4 A brief introduction to the in-phase coupling between silicon photonics wafer and optical fiber array is given.

[0082] like Figure 3As shown, for the silicon photonic wafer 30, a large number of optical waveguides 31 arranged in an array are formed on its upper surface, and cutting grooves that divide the adjacent optical waveguides 31 are cut between two adjacent rows and two adjacent columns. The straight area where the cutting grooves are located is also the cutting road 32. It can be seen that the silicon photonic wafer 30 includes cutting roads 32 in two directions perpendicular to each other.

[0083] like Figure 4 As shown, the optical fiber end 20 of the optical fiber array includes a plurality of optical fiber ports 21 arranged in a row and fixed together on a fixing member 22. As for the optical fiber end 20 as a whole, the end face formed by the lower surface of each optical fiber port 21 and the fixing member as a whole is roughly a rectangular plane.

[0084] During the actual mutual coupling between the optical fiber array and the optical waveguide 31, when one of the optical fiber ports 21 in the optical fiber array is located directly above the optical waveguide 31 and just faces one of the optical waveguides 31, the optical fiber array achieves preliminary alignment with the optical waveguide 31. Furthermore, when the optical fiber ports 21 of the optical fiber array and the optical waveguide 31 are aligned and coupled, the vertical plane where each optical fiber port 21 is arranged should be parallel to the cutting path 32 in one direction on the silicon photonic wafer 30 and perpendicular to the cutting path 32 in another direction.

[0085] Based on the above discussion, refer to Figure 1 and Figure 2 In a specific embodiment of the present application, the optical fiber posture adjustment mechanism of the silicon photonic wafer testing device 10 may include:

[0086] A microscopic imaging component, a probe station 11, a fiber coupling module 14 and a driving component; the microscopic imaging component includes a camera component 15 and a deflection optical path component 12; the probe station 11 is used to carry a silicon photonic wafer 30; the driving component is used to drive the probe station 11 and the deflection optical path component 12 to switch between each other and move to the imaging field of view of the camera component 15;

[0087] When the driving component 13 drives the probe station 11 carrying the silicon photonic wafer 30 to move into the imaging field of view of the camera component 15, the camera component 15 is adjusted so that the camera component coordinate system is parallel to the cutting path 32 of the silicon photonic wafer 30;

[0088] When the driving component 13 drives the deflection optical path component 12 to move into the imaging field of view of the camera component 15, the camera component 15 is used to collect lateral images corresponding to at least two lateral pictures in different directions of the optical fiber end 20 deflected and transmitted by the deflection optical path component 12; the optical fiber coupling module 14 is used to adjust the posture of the optical fiber end 20 according to the lateral image and the direction of the camera component coordinate system, so as to preliminarily align the optical fiber end 20 with the silicon photonic wafer 30.

[0089] It is understandable that during the actual test process of the test device 10 of this embodiment, the silicon photonic wafer 30 is placed on the probe station 11, and the optical fiber port 21 in the optical fiber end 20 of the optical fiber array is vertically downward facing the optical interface of the optical waveguide.

[0090] In addition, the camera component coordinate system refers to the coordinate system of the camera of the camera component 15 for collecting images, which is generally a two-dimensional rectangular coordinate system on the imaging plane of the camera component 15; in this embodiment, the camera component coordinate system is parallel to the cutting road 32 of the silicon photonic wafer 30, which means that the two mutually perpendicular coordinate axes of the two-dimensional rectangular coordinate system are respectively parallel to the cutting roads 32 of the silicon photonic wafer 30 in two mutually perpendicular directions. On this basis, the camera component 15 in this application collects images by keeping the optical axis of the camera vertically downward in the vertical direction; therefore, when the driving component 13 drives the probe station 11 to make the silicon photonic wafer 30 located in the imaging field of view of the camera component 15 (generally located directly below the camera), it is only necessary to control the camera component 15 to rotate with the optical axis of the camera as the rotation center, so that the camera component coordinate system and the cutting road 32 of the silicon photonic wafer 30 can be made parallel to each other.

[0091] Further optionally, a cross cursor is provided in the camera of the camera assembly 15; the cross cursor is formed by the intersection of two mutually perpendicular straight lines provided in the middle area of ​​the lens of the camera in the camera assembly 15, and the two straight lines constituting the cross cursor are respectively parallel to the two coordinate axis directions of the two-dimensional rectangular coordinate system of the camera assembly 15. Thus, when the driving assembly 13 drives the probe station 11 carrying the silicon photonic wafer 30 to move to the imaging field of view of the camera assembly 15, the camera assembly 15 is used to collect the wafer image of the silicon photonic wafer 30, and adjust the cross cursor of the camera in the camera assembly 15 to be parallel to the cutting path on the silicon photonic wafer 30 through the wafer image. In addition, the camera of the camera assembly 15 in this embodiment can adopt a multi-magnification fixed-magnification lens, which can realize image acquisition of imaging fields of different sizes.

[0092] On this basis, in an optional implementation of this embodiment, the deflection optical path component 12 may be an optical path structure including at least two reflective elements;

[0093] When the driving component 13 drives the deflection optical path component 12 to move into the imaging field of view of the camera component 15, the camera component 15 is used to collect a first lateral image of the optical fiber end 20 in a first horizontal direction and a second lateral image in a second horizontal direction through the deflection optical path component 12; and the optical fiber coupling module 14 is used to adjust the end face of the optical fiber end 20 to a horizontal plane according to the first lateral image and the second lateral image; wherein the first horizontal direction and the second horizontal direction are perpendicular to each other;

[0094] The camera assembly 15 is also used to collect a vertical image of the optical fiber end 20 from a vertical direction, and the optical fiber coupling module 14 is used to adjust the contour line of the optical fiber end 20 to be parallel to the cross cursor of the camera according to the vertical image.

[0095] The first lateral image in the present embodiment is equivalent to an image formed by photographing the first lateral picture of the optical fiber end 20 from the first horizontal direction. Similarly, the second lateral image is an image formed by photographing the second lateral picture of the optical fiber end 20 from the second horizontal direction. However, if the shooting direction of the camera assembly 15 is modulated in the horizontal direction and needs to be roughly on the same horizontal plane as the position of the optical fiber end 20, it will obviously make the adjustment of the camera assembly 15 too complicated. If multiple cameras with different shooting angles are added, the equipment cost will increase. Therefore, the deflection optical path assembly 12 in the present embodiment utilizes the reflective effect of at least two reflective elements to respectively reflect the lateral pictures of the two optical fiber ends 20 in two different horizontal directions to the camera assembly 15, that is, only one camera assembly 15 is used, and there is no need to make overly complicated position adjustments to the camera assembly 15 to acquire images of two different lateral directions of the optical fiber end 20.

[0096] On this basis, in this embodiment, by collecting lateral images corresponding to the lateral images of the optical fiber end 20 along two directions perpendicular to each other, the inclination angle between the end face of the optical fiber end 20 and the horizontal plane can be obtained, and based on the inclination angle, the end face of the optical fiber end 20 can be adjusted to the horizontal.

[0097] Reference Figure 2 ,exist Figure 2 In the embodiment shown, the deflection optical path component 12 can be arranged at the side position of the probe station 11 and fixedly connected to the probe station 11, while the probe station 11 is arranged on the driving component 13; in addition, the driving component 13 includes two mutually perpendicular slide rails, so that the driving component 13 can drive the probe station 11 and the deflection optical path component 12 to move translationally along two mutually perpendicular directions as a whole, that is, it can drive the adjustment of the position of the probe station 11 and the deflection optical path component 12 as a whole in the horizontal plane, thereby realizing that one of the probe station 11 and the deflection optical path component 12 is located directly below the camera in the camera component 15, that is, within the imaging field of view of the camera.

[0098] When the camera component 15 is adjusted to the point where the cross cursor and the cutting path 32 of the silicon photonic wafer 30 are parallel to each other, the driving component 13 can further drive the probe station 11 and the deflection optical path component 12 to move synchronously, thereby driving the deflection optical path component 12 to move below the camera, that is, within the imaging field of view of the camera. The deflection optical path component 12 includes at least a first reflection element 121 and a second reflection element 122, and the reflection surfaces of the first reflection element 121 and the second reflection element 122 can be perpendicular to each other, and both form an angle of 45 degrees with the horizontal plane; when the driving component 13 moves the deflection optical path component 12 to the set position below the camera, the first reflection element 121, the second reflection element 122 and the optical fiber end 20 should be distributed in a right triangle; and the end face height of the optical fiber end 20 should be approximately the same as the height of the middle area of ​​the first reflection element 121 and the second reflection element 122; ensuring that the side view of the optical fiber end 20 can be incident on the camera in a vertical direction after being deflected 90° by the first reflection element 121 and the second reflection element 122 respectively.

[0099] On this basis, the camera in the camera assembly 15 can move horizontally above the first reflective element 121, the second reflective element 122 and the optical fiber end 20. When the camera is located directly above the first reflective element 121, the first side view of the optical fiber end 20 can be reflected to the camera by the first reflective element 121, so that the camera can collect the first lateral image of the optical fiber end 20. It can be understood that the first lateral image is equivalent to the image formed by the camera being located at the position of the first reflective element 121 and shooting the optical fiber end 20 along the first horizontal direction pointing to the optical fiber end 20. Similarly, when the camera moves to the position of the second reflective element 122, the camera can also collect the second lateral image of the optical fiber end 20, which is equivalent to the image formed by the camera being located at the position of the second reflective element 122 and shooting the optical fiber end 20 along the second horizontal direction pointing to the optical fiber end 20. And the first horizontal direction and the second horizontal direction are perpendicular to each other. According to the principle of geometric optics, when the end face of the optical fiber end 20 and the horizontal plane are not parallel to each other, the angle between the end face of the optical fiber end 20 and the second horizontal direction can be determined through the first lateral image, and the angle between the end face of the optical fiber end 20 and the first horizontal direction can be determined through the second lateral image. Based on this, the optical fiber coupling module 14 can modulate the end face of the optical fiber end 20 to the horizontal plane according to the above two angles.

[0100] It is understandable that, when the ambient light is bright enough, only the first reflective element 121 and the second reflective element 122 are used to reflect the lateral image of the optical fiber end 20 to the camera, so that the end face contour of the optical fiber end 20 can be collected and imaged clearly; but further considering that the structural components in the test device 10 are relatively more and more complex, resulting in the ambient light where the optical fiber end 20 is located being relatively dim; in order to ensure that the end face contour of the optical fiber end 20 is imaged more clearly in the first lateral image and the second lateral image. In an optional embodiment of the present application, a light source assembly 16 may be further included to output a light beam to the position where the optical fiber end 20 is located; wherein the light source assembly 16 is disposed on the support platform 120 of the deflection optical path assembly 12. In this embodiment, the light end 20 is illuminated by the light source assembly 16, thereby ensuring the clarity of the end face contour imaging of the light end 20.

[0101] Further optionally, in this embodiment, the deflection optical path component 12 may include a carrier 120 connected to the probe station, a first reflective element 121 and a second reflective element 122 disposed on the carrier 120 and having a reflective surface that forms an angle of 45 degrees with the horizontal plane;

[0102] The light source assembly 16 includes a first light source assembly 161 and a second light source assembly 162 disposed on the carrier 120;

[0103] The first light source assembly 161 is used to output a light beam to the first reflecting element 121 along the first horizontal direction, and the first reflecting element 121 is used to reflect the incident light beam in a vertically upward direction; the second light source assembly 162 is used to output a light beam to the second reflecting element 122 along the second horizontal direction, and the second reflecting element 122 is used to reflect the incident light in a vertically upward direction; and the light path between the first light source assembly 161 and the first reflecting element 121 and the light path between the second light source assembly 162 and the second reflecting element 122 intersect each other in a set intersection area;

[0104] When the deflection optical path assembly 12 is moved to the bottom of the camera assembly 15 by the second driving assembly 13, the optical fiber end 20 is located in the set intersection area;

[0105] The camera assembly 15 is used to collect a first lateral image when the camera is translated to be directly above the first reflective element 121 , and to collect a second lateral image when the camera is translated to be directly above the second reflective element 122 .

[0106] exist Figure 5 and Figure 6In the illustrated embodiment, the first light source assembly 161 is used to output a light beam to the first reflecting element 121 along a first horizontal direction, and the first reflecting element 121 is used to reflect the incident light beam in a vertically upward direction; the second light source assembly 162 is used to output a light beam to the second reflecting element 122 along a second horizontal direction, and the second reflecting element 122 is used to reflect the incident light in a vertically upward direction; and the light path between the first light source assembly 161 and the first reflecting element 121 and the light path between the second light source assembly 162 and the second reflecting element 122 intersect each other in a set intersection area; the first reflecting element 121 and the second reflecting element 122 are both at an angle of 45° with the horizontal plane; when the deflection optical path assembly 12 is moved to the bottom of the camera assembly 15 through the second driving assembly 13, the optical fiber end 20 is located in the set intersection area;

[0107] The camera assembly 15 is used to collect a first lateral image when the camera is translated to be directly above the first reflective element 121, and to collect a second lateral image when the camera is translated to be directly above the second reflective element.

[0108] Specifically, when the camera is translated to directly above the first reflecting element 121, the first light source assembly 161 can output a light beam to the first reflecting element 121 along a first horizontal direction. The light beam incident on the first reflecting element 121 is deflected 90° and then incident vertically upward on the camera. At this time, the image captured by the camera is also the first lateral image.

[0109] Because the optical fiber end 20 of the optical fiber array is located between the first light source component 161 and the first reflecting element 121, it is inevitable that the light output by the first light source component 161 is partially blocked, so that the outline of the optical fiber end 20 appears in the first lateral image captured by the camera; and the outline of the optical fiber end 20 shown in the first lateral image is equivalent to the outline shown when the optical fiber end 20 is viewed along the first horizontal direction. Obviously, based on the picture shown in the first lateral image, the angle between the end face of the optical fiber end 20 and the second horizontal direction can be determined, and the angle is set to be the first angle; based on this, the optical fiber coupling module 14 controls the optical fiber end 20 to rotate about a rotation axis parallel to the first horizontal direction, and the rotation angle is equal to the above-mentioned first angle. Obviously, the end face of the optical fiber end 20 after rotation is also parallel to the second horizontal direction.

[0110] In addition, in order to reduce the difficulty of determining the first angle between the end face of the optical fiber end 20 and the second horizontal direction, a first marking line can be further provided on the first reflective element 121, and the first marking line and the second horizontal direction are parallel to each other. Thus, in the first lateral image captured by the camera, the direction in which the first marking line is imaged also represents the first horizontal direction, and the first angle can be determined directly based on the angle between the end face contour line of the optical fiber end 20 and the first marking line.

[0111] Similarly, when the camera is translated to just above the second reflective element 124, the second light source assembly 162 can output a light beam to the second reflective element 122 along the second horizontal direction, and the light beam incident on the second reflective element 122 is also deflected 90° and incident on the camera, so that the camera captures a second lateral image. Similar to the above-mentioned first lateral image, the outline of the optical fiber end 20 displayed in the second lateral image in this embodiment is equivalent to the outline displayed by viewing the optical fiber end 20 along the second horizontal direction, that is, based on the second lateral image, the second angle between the end face of the optical fiber end 20 and the first horizontal direction can be determined; by controlling the optical fiber coupling module 14 to rotate the optical fiber end 20 by the second angle with a rotation axis parallel to the second horizontal direction, the end face of the optical fiber end 20 and the first horizontal direction can be made parallel to each other.

[0112] Similar to the first marking line set on the above-mentioned first reflecting element 121, a second marking line 1221 parallel to the first horizontal direction can also be set on the second reflecting element 122, thereby facilitating the determination of the second angle based on the imaging of the second marking line 1221 and the end face contour line of the optical fiber end 20 in the second lateral image.

[0113] In addition, the first light source assembly 161 and the second light source assembly 162 in this embodiment can adopt surface light sources, and the light beams output by the first light source assembly 161 and the second light source assembly 162 are both parallel light beams, thereby ensuring that the light beams output by the first light source assembly 161 and the second light source assembly 162 can more clearly illuminate the outline of the optical fiber end 20.

[0114] In addition, in order to ensure that the optical fiber end 20 can be located in the above-mentioned set area so that the end face of the optical fiber end 20 can be adjusted to a horizontal level, a height detection structure is also provided on the end connection structure of the optical fiber coupling module 14 for connecting the optical fiber end 20;

[0115] Accordingly, a calibration substrate 123 is also provided on the carrier platform 120;

[0116] When the driving assembly 13 drives the deflection optical path assembly to move until the lower surface of the height detection structure 147 and the upper surface of the calibration substrate 123 are within a set height range, the optical fiber end 20 is located in a set intersection area.

[0117] In this embodiment, the height detection structure 147 and the calibration substrate 123 are used as markers for each other. The relative height between the two ensures that the optical fiber end 20 is exactly located in the above-mentioned set intersection area, that is, located in the light path of the deflection optical path component, thereby reducing the difficulty of driving the deflection component 12 to adjust until the optical fiber end 20 is located in the set intersection area.

[0118] In another optional implementation of the present embodiment, the height detection structure may be a nanocapacitive displacement sensor, which may further detect the vertical distance between the end connection structure that clamps the optical fiber end 20 and other structural components thereunder during the subsequent position adjustment process of the optical fiber end 20, thereby avoiding collision between the optical fiber end 20 and other structural components.

[0119] Reference Figure 6 In another optional embodiment of this embodiment, the deflection optical path component 12 may further include:

[0120] The first light source assembly 161 structure includes a first surface light source 1611 and a third reflective element 1612; the second light source assembly 162 includes a second surface light source and a fourth reflective element; and the first reflective element 121, the second reflective element 122, the third reflective element 1612 and the fourth reflective element are all right-angle prisms, and a reflective film layer is provided on the hypotenuse reflective surface of the right-angle prism;

[0121] The hypotenuse reflection surface of the third reflection element 1612 is located on the output light path of the first surface light source 1611, and is used to reflect the light beam output by the first surface light source 1611 along the first horizontal direction through the set intersection area and incident on the first reflection element 121, so that the first reflection element 121 reflects the light beam carrying the lateral profile information of the optical fiber end 20;

[0122] The hypotenuse reflection surface of the fourth reflection element is located on the output light path of the second surface light source, and is used to reflect the light beam output by the second surface light source along the second horizontal direction through the set intersection area and incident on the second reflection element 122, so that the second reflection element 122 reflects the light carrying the lateral profile information of the optical fiber end 20.

[0123] exist Figure 6The optical path structure between the first surface light source 1611 structure and the first reflecting element 121 is shown in the figure. In addition to the first surface light source 1611, the first surface light source 1611 structure is further provided with a third reflecting element 1612 on the output optical path of the first surface light source 1611. To this end, in this embodiment, in order to enable the light beam output vertically upward by the first surface light source 1611 to first be vertically incident on the vertical plane of the right-angled side of the third reflecting element 1612, and be reflected and deflected 90° by the hypotenuse reflecting surface in the third reflecting element 1612, and then be incident on the first reflecting element 121 along the first horizontal direction. As a result, the optical path structure composed of the first surface light source 1611 and the third reflecting element 1612 can finally output a light beam to the first reflecting element 121 along the first horizontal direction.

[0124] In practical applications, the first surface light source 1611 can be a surface light source or a light source that outputs a divergent light beam. In this case, the first light source component 161 can further add optical elements such as convex lenses to modulate the divergent light beam, so that the first light source component 161 can finally output a parallel light beam.

[0125] Based on the above discussion, when the end face of the optical fiber array is parallel to both the first horizontal direction and the second horizontal direction, it is obvious that the end face of the optical fiber array is also in the horizontal plane.

[0126] After adjusting the end face of the optical fiber end 20 to be horizontal, the camera can be further used to capture a vertical image from the top of the optical fiber end 20 to the bottom. Obviously, the third angle between the vertical plane where the side wall of the optical fiber end 20 is located and the cross cursor in the camera can be displayed in the vertical image. By controlling the optical fiber coupling module 14 to rotate the optical fiber end 20 around the vertical rotation axis at the third angle, the optical fiber end 20 can be adjusted to a state where the contour line and the cross cursor of the camera are aligned with each other.

[0127] As mentioned above, the cutting path 32 of the silicon photonic wafer 30 has been adjusted to be parallel to the cross cursor in the camera. Therefore, when the driving component 13 drives the probe station 11 again to the bottom of the camera, it is located between the optical fiber end 20 and the silicon photonic wafer 30 under the camera at the same time, that is, the contour line of the optical fiber end 20 and the silicon photonic wafer 30 are parallel to each other, and the preliminary positioning between the optical fiber end 20 and the silicon photonic wafer 30 is achieved.

[0128] In addition, the camera of the camera system in the present application may be a multi-magnification fixed-magnification lens.

[0129] Based on any of the above embodiments, refer to Figure 7, in the present application, the optical fiber coupling module 14 for realizing the position adjustment of the optical fiber end 20 in space may include three translation components and three rotation components connected in sequence, and an end connection structure;

[0130] Among them, the three translation components are used to drive the end connection structure to perform translational movement along the first direction, the second direction and the third direction respectively; the three rotation components are used to drive the end connection structure to rotate around the first rotation axis, the second rotation axis and the third rotation axis respectively; the first direction, the second direction and the third direction are perpendicular to each other; the first rotation axis, the second rotation axis and the third rotation axis are perpendicular to each other.

[0131] The optical fiber coupling module 14 in this embodiment can realize the movement of the optical fiber end 20 in six different degrees of freedom, that is, it can translate along the first direction, the second direction, and the third direction, and rotate around the first rotation axis, the second rotation axis, and the third rotation axis. The optical fiber coupling module 14 in this embodiment simply connects the structural components that realize one degree of freedom movement in series in sequence, and finally realizes the six different degrees of freedom movement of the optical fiber end 20. The structure is simple and easy to implement, which is conducive to reducing the practical cost of the equipment.

[0132] On this basis, the optical fiber coupling module 14 in this embodiment may specifically include:

[0133] The first translation assembly 141, the second translation assembly 142, the third translation assembly 143, the first rotation assembly 144, the second rotation assembly 145 and the third rotation assembly 146 are connected in sequence; the end connection structure of the optical fiber coupling module 14 is connected to the third rotation assembly 146;

[0134] The first translation assembly 141 is used to drive the second translation assembly 142, the third translation assembly 143, the first rotation assembly 144, the second rotation assembly 145, the third rotation assembly 146 and the end connection structure to translate synchronously along the first direction;

[0135] The second translation assembly 142 is used to drive the third translation assembly 143, the first rotation assembly 144, the second rotation assembly 145, the third rotation assembly 146 and the end connection structure to translate synchronously along the second direction;

[0136] The third translation assembly 143 is used to drive the first rotation assembly 144, the second rotation assembly 145, the third rotation assembly 146 and the end connection structure to translate synchronously along the third direction;

[0137] The first rotating assembly 144 is used to drive the second rotating assembly 145, the third rotating assembly and the terminal connection structure to rotate synchronously with the first rotating axis as the rotation center;

[0138] The second rotating assembly 145 is used to drive the third rotating assembly 146 and the end connection structure to rotate synchronously with the second rotating axis as the rotation center;

[0139] The third rotating assembly 146 is used to drive the end connection structure to rotate with the third rotating axis as the rotation center;

[0140] The first direction and the first rotation axis, the second direction and the second rotation axis, and the third direction and the third rotation axis are parallel to each other; the first direction and the first horizontal direction are parallel to each other; and the second direction and the second horizontal direction are parallel to each other.

[0141] As shown above, the use of the fiber coupling module 14 to drive the movement of the optical fiber end 20 can only achieve preliminary alignment between the optical fiber end 20 and the optical waveguide 31 on the silicon photonic wafer 30. For this reason, the end connection structure connected to the optical fiber end 20 in the fiber coupling module 14 of the present application is also connected to a piezoelectric displacement stage 4, which is used to drive the movement of the optical fiber end 20 through the end connection structure when different control voltages are connected to control the alignment coupling between the optical fiber end 20 and the silicon photonic wafer 30.

[0142] In the actual test process, one end of each optical fiber in the optical fiber array that is away from the optical fiber end 20 connected to the optical fiber coupling module 14 is generally connected to a coupling photodetector. On this basis, the piezoelectric displacement stage 4 in this embodiment is specifically a driving device including piezoelectric ceramics. As the voltage of the piezoelectric displacement stage 4 changes, the piezoelectric ceramics in the piezoelectric displacement stage 4 can drive the position of the optical fiber end 20 to change slightly; in this process, a light wave can be input into the optical fiber array, and the light wave is transmitted from the port of the optical fiber end 20 to the optical interface of the optical waveguide 31. After the light wave is transmitted in the optical waveguide 31, it can be retransmitted to the optical fiber port 21 and received by the coupling photodetector after being transmitted through the optical fiber; on this basis When the optical port 21 of the optical fiber array and the optical interface of the optical waveguide 31 reach the best alignment coupling state, the light wave power transmitted back through the optical waveguide 31 is also the largest; therefore, as the piezoelectric displacement stage 4 moves with the fine adjustment of the optical fiber end 20, the light wave power measured by the coupling photodetector also changes accordingly. When the power measured by the coupling photodetector is the largest, that is, the alignment coupling between the optical port 21 of the optical fiber array and the optical interface of the optical waveguide 31 is the best, thereby achieving fine alignment coupling between the optical fiber array and the optical waveguide 31.

[0143] In addition, in order to prevent the distance between the optical fiber end 20 and the silicon photonic wafer 30 from being too close, a nanocapacitive displacement sensor is further used to detect the relative position between the optical fiber end 20 and the silicon photonic wafer 30 thereunder, to prevent the optical fiber end 20 from being too low and causing damage to the silicon photonic wafer 30.

[0144] To summarize, the optical fiber posture adjustment mechanism in the present application is configured with a deflection optical path component and an optical fiber coupling module, and the deflection optical path component and the probe station are also connected to the driving component 13, so that the driving component 13 can switch the deflection optical path component and the probe station carrying the wafer within the imaging field of view of the camera component; therefore, when the probe station carrying the wafer is moved to the imaging field of view of the camera component, the camera component is adjusted so that the coordinate system of the camera component is parallel to the cutting path on the wafer; and when the deflection optical path component is moved and switched to the imaging field of view of the camera component, the deflection optical path component is used to deflect at least two different lateral images of the optical fiber end and transmit them to the camera component, so as to collect and obtain the lateral image of the optical fiber end, thereby the optical fiber coupling module can be used to adjust the posture of the optical fiber end according to the lateral image and the direction of the camera component coordinate system, so as to achieve preliminary alignment of the optical fiber end and the silicon photonic wafer. The test equipment in the present application only needs to be configured with a set of camera components, and the corresponding alignment process of the test equipment is simple and easy to operate, which can achieve preliminary alignment between the optical fiber end and the silicon optical waveguide, provide a favorable control basis for further precise alignment coupling, simplify the structure of the adjustment mechanism in the entire test equipment, and reduce equipment costs.

[0145] This application also discloses a Figure 1 The silicon photonics wafer testing equipment shown includes an optical fiber posture adjustment mechanism as described in any of the above items.

[0146] The present application also discloses a coupling method for an optical fiber posture adjustment mechanism of a silicon photonic wafer testing device, such as Figure 8 As shown, the optical fiber posture adjustment method is applied to the optical fiber posture adjustment mechanism of the silicon photonic wafer testing equipment as described in any of the above items.

[0147] In a specific embodiment of the present application, a method for adjusting the optical fiber posture of the optical fiber posture adjustment mechanism of the silicon photonic wafer testing device includes:

[0148] S1: Control the driving component 13 to drive the silicon photonics wafer to translate into the imaging field of view of the camera component, and adjust the camera component through the wafer image collected by the camera component to make the camera component coordinate system and the cutting path on the silicon photonics wafer parallel to each other.

[0149] S2: Control the silicon photonic wafer to move out of the imaging field of view of the camera component, and move the deflection optical path component into the imaging field of view of the camera component, and collect lateral images corresponding to at least two different directions of lateral pictures of the end of the optical fiber deflected and transmitted input by the deflection optical path component through the camera component.

[0150] S3: Control the fiber coupling module to adjust the posture of the fiber end according to the lateral image and the direction of the camera component coordinate system, and control the drive component 13 to drive the silicon photonic wafer to translate into the imaging field of view of the camera component, so that the fiber array and the silicon photonic wafer are preliminarily aligned.

[0151] Optionally, the process of adjusting the camera assembly so that the camera assembly coordinate system and the dicing road on the silicon photonics wafer are parallel to each other may specifically include:

[0152] S11: Control the driving component 13 to drive the probe station carrying the silicon photonic wafer to move into the imaging field of view of the camera component;

[0153] S12: used to collect wafer images of silicon photonic wafers through a camera component;

[0154] S13: The camera assembly is adjusted through the wafer image so that the cross cursor of the camera in the camera assembly is adjusted to be parallel to the cutting path on the silicon photonics wafer.

[0155] Optionally, the optical fiber coupling module is controlled to adjust the posture of the optical fiber end according to the lateral image and the direction of the camera component coordinate system, and the driving component 13 is controlled to drive the silicon photonic wafer to translate into the imaging field of view of the camera component so that the optical fiber array and the silicon photonic wafer are preliminarily aligned, including:

[0156] S31: collecting, by means of a camera assembly, lateral images of the end of the optical fiber reflected by the deflection optical path assembly in a first horizontal direction and a second horizontal direction to obtain a first lateral image and a second lateral image; wherein the first horizontal direction and the second horizontal direction are perpendicular to each other;

[0157] S32: controlling the optical fiber coupling module to adjust the end surface of the optical fiber end to a horizontal plane according to the first lateral image and the second lateral image;

[0158] S33: collecting a vertical image of the optical fiber end from a vertical direction through a camera assembly;

[0159] S34: Control the optical fiber coupling module according to the vertical image to adjust the contour line of the optical fiber end to be parallel to the cross cursor of the camera.

[0160] In this embodiment, by collecting lateral images corresponding to the lateral images of the optical fiber end 20 along two directions perpendicular to each other, the inclination angle between the end face of the optical fiber end 20 and the horizontal plane can be obtained, and the end face of the optical fiber end 20 can be adjusted to the horizontal based on the inclination angle.

[0161] Further optionally, the above step S32 may also include:

[0162] S321: determining a first angle between an end face of the optical fiber end and a second horizontal direction according to an end face contour line of the optical fiber end imaged in the first lateral image;

[0163] S322: Control the optical fiber coupling module to drive the optical fiber end portion to rotate around the second rotation axis by a first angle; wherein the second horizontal direction and the second rotation axis are parallel to each other;

[0164] S323: determining a second angle between the end face of the optical fiber end and the first horizontal direction according to an end face contour line imaged by the optical fiber end in the second lateral image;

[0165] S324: Control the optical fiber coupling module to drive the optical fiber end to rotate around the first rotation axis to a second angle; wherein the first horizontal direction and the first rotation axis are parallel to each other.

[0166] In combination with the deflection optical path component in the embodiment of the above-mentioned test equipment, it can be known that the first lateral image in this embodiment is equivalent to an image of the optical fiber end taken laterally along the first horizontal direction. Based on the imaging position of the end face contour line of the optical fiber end in the first lateral image, it is obvious that the first angle between the end face of the optical fiber end and the second horizontal direction can be determined.

[0167] In addition, when a first marking line parallel to the second horizontal direction is provided on the first reflecting element in the deflection optical path assembly, the first angle can be directly determined based on the angle formed by imaging the first marking line and the end face contour line of the optical fiber end in the first lateral image.

[0168] Similarly, when a second marking line parallel to the first horizontal direction is provided on the second reflecting element in the deflection optical path assembly, the second angle can also be determined directly based on the second marking line, which will not be described in detail in this embodiment.

[0169] In addition, refer to Figure 7 Based on the embodiment of the above-mentioned test equipment, it can be known that the optical fiber coupling module in the present application may include a first translation component 141, a second translation component 142, a third translation component 143, a first rotation component 144, a second rotation component 145 and a third rotation component 146 connected in series in sequence; wherein the first translation component 141, the second translation component 142 and the third translation component 143 are respectively used to realize translation in the first direction, the second direction and the third direction; and the first rotation component 144, the second rotation component 145 and the third rotation component 146 are respectively used to realize rotation around the first rotation axis, the second rotation axis and the third rotation axis. Figure 7As shown, an XYZ three-dimensional rectangular coordinate system is established, wherein the X-axis, Y-axis and Z-axis are parallel to the first direction, the second direction and the third direction respectively, and the first rotation axis, the second rotation axis and the third rotation axis are also parallel to the X-axis, the Y-axis and the Z-axis respectively.

[0170] In addition, the first direction in this embodiment should also be parallel to the first horizontal direction for collecting the first lateral image, and the second direction should be parallel to the second horizontal direction for collecting the second lateral image.

[0171] Therefore, when the six-axis serial displacement platform is used to rotate the optical fiber end by the first angle in a direction parallel to the second direction, the second rotating assembly is used to drive the optical fiber end to rotate by the second angle about the second rotation axis.

[0172] However, it is obvious that this rotation process will inevitably cause the position of the optical fiber end in space to change, and may even move out of the imaging field of the camera. Therefore, after the optical fiber end is driven to rotate the second angle about the second rotation axis by the second rotation component, the following steps may be further included:

[0173] Using the optical fiber coupling module to drive the optical fiber end to translate along the first direction Distance, translation along the third direction The distance of is the distance between the optical fiber end and the second rotation axis; is the first angle.

[0174] It is understandable that in practical applications, the first translation component in the optical fiber coupling module can be used to drive the optical fiber end to translate along the first direction. The third translation assembly then drives the optical fiber end to translate along the third direction. The distance between the ends of the optical fiber and the ends of the optical fiber can be returned to the original position when the rotation adjustment is realized.

[0175] Similarly, after the second rotating assembly is used to drive the optical fiber end portion to rotate about the second rotating axis at the second angle, the method may further include:

[0176] Using the optical fiber coupling module to drive the optical fiber end to translate along the second direction Distance, translation along the third direction The distance of is the distance between the optical fiber end and the first rotation axis; is the second angle.

[0177] Specifically, the second translation assembly can be used to drive the optical fiber end to translate along the second direction. The third translation assembly then drives the optical fiber end to translate along the third direction. The distance between the optical fiber end and the horizontal plane makes the position of the optical fiber end remain unchanged.

[0178] It can be understood that the optical fiber end is roughly in the form of a rectangular structure. The vertical image taken from directly above the optical fiber end is also a top-down image of the optical fiber end, and each optical fiber port is arranged on a side of the rectangular block. The contour line of the optical fiber end is adjusted to be parallel to the crosshairs of the camera, so that the vertical plane where each optical fiber port is located and a straight line in the crosshairs are parallel to each other; as mentioned above, the two straight lines of the crosshairs are respectively parallel to the cutting paths in two directions on the silicon photonic wafer, thereby making it possible to make the plane where each optical fiber port is arranged and the cutting path in one direction on the silicon photonic wafer parallel to each other.

[0179] In an optional implementation of this embodiment, the process of rotationally adjusting the optical fiber end based on the vertical image may include:

[0180] Determine a third angle between the end face contour line of the optical fiber end and the cross cursor according to the end face contour line of the optical fiber end imaged in the vertical image;

[0181] The optical fiber coupling module is used to drive the optical fiber end to rotate at a third angle about a third rotation axis; wherein the third rotation axis is a rotation axis in a vertical direction.

[0182] In this embodiment, the third rotating assembly in the optical fiber coupling module can be used to drive the optical fiber end to rotate around the third rotating axis to a third angle.

[0183] Based on the above discussion, in this embodiment, the cross cursor in the camera lens is first adjusted to be parallel to the cutting path on the silicon photonic wafer; then the mutual cooperation between the deflection optical path component and the camera is further utilized to collect the first lateral image and the second lateral image in two mutually perpendicular horizontal directions of the optical fiber end. Based on the first lateral image and the second lateral image, the angle between the end face of the optical fiber end in the optical fiber array and the horizontal plane can be determined, and then the optical fiber end is controlled by the six-axis serial displacement platform to rotate and adjust in the first horizontal direction and the second horizontal direction respectively, so that the end face of the optical fiber end is adjusted to the horizontal plane; on this basis, the camera is further used to obtain the angle between the end face of the optical fiber end in the optical fiber array and the horizontal plane. A vertical image of the optical fiber end is measured in the vertical downward direction, and based on the vertical image, the angle between the side of the optical fiber end and the crosshairs of the camera can be determined. Then, the six-axis serial displacement platform is used to control the rotation of the optical fiber end about the vertical axis, so that the side of the optical fiber end and the crosshairs of the camera can be adjusted to be parallel to each other. On this basis, because the crosshairs of the camera and the cutting path on the silicon photonics wafer are parallel to each other, the silicon photonics wafer is translated again to directly below the camera, and the side wall of the optical fiber end can also remain parallel to the cutting path of the silicon photonics wafer, thereby achieving preliminary alignment coupling between the optical fiber end and the optical waveguide on the silicon photonics wafer.

[0184] In an optional embodiment of the present application, after achieving preliminary alignment coupling between the optical fiber end and the silicon photonics wafer, the following may further be included:

[0185] Control the camera component to collect the alignment image of the optical fiber end and the silicon photonic wafer in the same frame;

[0186] According to the imaging positions of the optical fiber port at the end of the optical fiber and the optical interface in the silicon photonic wafer in the alignment image, the optical fiber coupling module is controlled to drive the optical fiber end to translate along the first direction and the second direction, so as to achieve initial alignment coupling between the optical fiber port at the end of the optical fiber and the optical interface.

[0187] Reference Figure 4 and Fig. 9 It can be seen that each fiber port 21 is arranged side by side on the side of the fiber end 20, so the position of each fiber port 21 in the alignment image can be determined based on the imaging position of the side of the fiber end 20 in the alignment image. On this basis, the optical interface of each optical waveguide 31 will also be imaged in the alignment image, so the relative position between a fiber port 21 and an optical interface can be determined based on the alignment image; thus, the fiber end 20 can be driven to translate in the horizontal plane through the fiber coupling module, so that a fiber port 21 is located directly above an optical interface, thereby achieving the preliminary alignment between the fiber port 21 and the optical interface.

[0188] On this basis, in order to achieve further precise alignment between the optical fiber port and the optical interface, after moving an optical fiber port to directly above an optical interface, the following steps may be further performed:

[0189] Controlling the output light wave of a corresponding optical fiber at each optical fiber end;

[0190] The piezoelectric displacement stage connected to the end connection structure of the optical fiber coupling module drives the end of the optical fiber to translate in a horizontal plane;

[0191] The optical power that changes with the translational movement of the optical fiber end is detected by a coupling photodetector connected to the end of the optical fiber away from the optical fiber end;

[0192] When the optical power is maximum, the position of the optical fiber end is the optimal coupling position between the optical fiber end and each waveguide in the silicon photonic wafer.

[0193] In this embodiment, a light wave can be input into the optical fiber array, and the light wave is transmitted from the optical fiber port to the optical interface of the optical waveguide, and after the transmission in the optical waveguide is completed, it is input to the optical interface and transmitted to the optical fiber port through the optical interface, so as to be received by the coupling photodetector; therefore, when the alignment coupling effect between the optical fiber port of the optical fiber array and the optical interface of the optical waveguide is better, the power of the light wave retransmitted back through the optical waveguide is greater, and therefore, as the piezoelectric displacement stage moves with the fine adjustment of the optical fiber end, the light wave power measured by the coupling photodetector also changes accordingly. When the power measured by the coupling photodetector is the largest, that is, the alignment coupling between the optical fiber port of the optical fiber array and the optical interface of the optical waveguide is the best, thereby achieving fine alignment coupling between the optical fiber array and the optical waveguide.

[0194] The present application also provides an embodiment of a silicon photonics wafer testing system, which may include an optical performance testing machine, a controller, and an optical fiber posture adjustment mechanism of the silicon photonics wafer testing device as described in any one of the above items;

[0195] The controller is used to use the silicon photonics wafer testing equipment to execute the steps of the optical fiber array coupling method as described in any one of the above items.

[0196] It can be understood that the controller in this embodiment can be built into the test equipment, or it can be a host computer connected to the test equipment; in short, it can control and implement the automated testing of silicon photonic wafers.

[0197] In addition, the optical performance tester is equipped with a motion controller that is communicatively connected to the above-mentioned optical fiber coupling module and the piezoelectric displacement stage, a tunable light source for outputting light waves to the optical fiber array, a tunable light source and a polarization scrambler connected to the end of the optical fiber array away from the above-mentioned optical fiber end, and an optical power meter and a coupling photodetector connected to the output end of the polarization scrambler.

[0198] In practical applications, the motion controller first controls the fiber coupling module to drive the posture adjustment change of the fiber end, so as to achieve preliminary alignment between the fiber end and the optical waveguide on the silicon photonic wafer; then the light wave is output to the optical fiber in the fiber array through the tunable light source; the light wave is transmitted to the optical waveguide on the silicon photonic wafer through the fiber end, and the light wave transmitted back from the silicon photonic wafer is received. The light wave is transmitted along the optical fiber in the fiber array to the polarization scrambler, and is divided into two light waves through the polarization scrambler and transmitted to the coupling photodetector and the optical power meter respectively; the coupling photodetector converts the received optical signal into a voltage signal, and controls the piezoelectric displacement stage with the motion controller to drive the position of the fiber end to fine-tune, and the position point corresponding to the fiber end when the voltage signal is maximum is the position point of the best alignment coupling between the fiber end and the optical waveguide on the silicon photonic wafer.

[0199] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply that there is any such actual relationship or order between these entities or operations. Moreover, the term "includes", "comprising" or any other variant thereof is intended to cover non-exclusive inclusion, so that the process, method, article or equipment comprising a series of elements are inherent to the elements. In the absence of more restrictions, the elements limited by the sentence "comprising one..." do not exclude the presence of other identical elements in the process, method, article or equipment comprising the elements. In addition, the above-mentioned technical solution provided in the embodiment of the present application is consistent with the corresponding technical solution in the prior art in principle, and the part is not described in detail, so as to avoid too much redundancy.

Claims

1. An optical fiber posture adjustment mechanism for silicon photonic wafer testing equipment, characterized in that: It includes a micro-imaging component, a probe station, a fiber coupling module and a driving component; the micro-imaging component includes a camera component and a deflection optical path component; the probe station is used to carry a silicon photonic wafer; the driving component is used to drive the probe station and the deflection optical path component to switch between each other and move to the imaging field of view of the camera component; When the driving component drives the probe station carrying the silicon photonic wafer to move into the imaging field of view of the camera component, the camera component is adjusted so that the camera component coordinate system is parallel to the cutting path of the silicon photonic wafer; When the driving component drives the deflection optical path component to move into the imaging field of view of the camera component, the camera component is used to collect lateral images corresponding to lateral pictures in at least two different directions of the end of the optical fiber deflected and transmitted by the deflection optical path component; The fiber coupling module is used to adjust the position of the fiber end according to the lateral image and the direction of the camera component coordinate system, so that the fiber end is preliminarily aligned with the silicon photonic wafer.

2. The optical fiber posture adjustment mechanism of the silicon photonic wafer testing equipment according to claim 1, characterized in that: A cross cursor is arranged inside the camera head of the camera assembly; When the driving component drives the probe station carrying the silicon photonics wafer to move into the imaging field of view of the camera component, the camera component is used to collect the wafer image of the silicon photonics wafer, and adjust the cross cursor of the camera in the camera component to be parallel to the cutting path on the silicon photonics wafer through the wafer image.

3. The optical fiber posture adjustment mechanism of the silicon photonic wafer testing equipment according to claim 2, characterized in that: The deflection optical path assembly includes at least two reflective elements; When the driving assembly drives the deflection optical path assembly to move into the imaging field of view of the camera assembly, the camera assembly is used to collect a first lateral image of the optical fiber end of the optical fiber array in a first horizontal direction and a second lateral image in a second horizontal direction through the deflection optical path assembly; Using the optical fiber coupling module to adjust the end face of the optical fiber end to a horizontal plane according to the first lateral image and the second lateral image; wherein the first horizontal direction and the second horizontal direction are perpendicular to each other; The camera assembly is also used to collect a vertical image of the optical fiber end from a vertical direction; the optical fiber coupling module is used to adjust the contour line of the optical fiber end to be parallel to the cross cursor of the camera according to the vertical image.

4. The optical fiber posture adjustment mechanism of the silicon photonic wafer testing equipment according to claim 3, characterized in that: The deflection optical path assembly includes a carrier platform connected to the probe platform, and a first reflective element and a second reflective element arranged on the carrier platform; Also included are a first light source assembly and a second light source assembly disposed on the carrier platform; The first light source assembly is used to output a light beam to the first reflecting element along the first horizontal direction, and the first reflecting element is used to reflect the incident light beam in a vertically upward direction; the second light source assembly is used to output a light beam to the second reflecting element along the second horizontal direction, and the second reflecting element is used to reflect the incident light in a vertically upward direction; and the light path between the first light source assembly and the first reflecting element and the light path between the second light source assembly and the second reflecting element intersect each other in a set intersection area; When the deflection optical path assembly moves to the bottom of the camera assembly through the second driving assembly, the optical fiber end is located in the set intersection area; The camera assembly is used to collect the first lateral image when the camera is translated to be directly above the first reflective element, and to collect the second lateral image when the camera is translated to be directly above the second reflective element.

5. The optical fiber posture adjustment mechanism of the silicon photonic wafer testing equipment according to claim 4, characterized in that: The optical fiber coupling module is also provided with a height-probing structure on the end connection structure used to connect the end of the optical fiber; Correspondingly, a calibration substrate is also provided on the carrier platform corresponding to the set intersection area; When the driving component drives the deflection optical path component to move until the distance between the lower surface of the height detection structure and the upper surface of the calibration substrate is within a set height range, the optical fiber end is located in the set intersection area.

6. The optical fiber posture adjustment mechanism of the silicon photonic wafer testing equipment according to claim 5, characterized in that: The height detection structure is a nanocapacitive displacement sensor.

7. The optical fiber posture adjustment mechanism of the silicon photonic wafer testing equipment according to claim 4, characterized in that: The first light source assembly includes a first surface light source and a third reflecting element; the second light source assembly includes a second surface light source and a fourth reflecting element; The first reflecting element, the second reflecting element, the third reflecting element and the fourth reflecting element are all right-angle prisms, and a reflecting film layer is provided on the hypotenuse reflecting surface of the right-angle prism; The beveled reflective surface of the third reflective element is located on the output light path of the first surface light source, and is used to reflect the light beam output by the first surface light source along the first horizontal direction through the set intersection area and incident on the first reflective element, so that the first reflective element reflects the light beam carrying the lateral profile information of the end of the optical fiber; The hypotenuse reflection surface of the fourth reflection element is located on the output light path of the second surface light source, and is used to reflect the light beam output by the second surface light source along the second horizontal direction through the set intersection area and incident on the second reflection element, so that the second reflection element reflects the light carrying the lateral profile information of the optical fiber end.

8. The optical fiber posture adjustment mechanism of the silicon photonic wafer testing equipment according to any one of claims 1 to 7, characterized in that: The optical fiber coupling module includes three translation components and three rotation components connected in sequence, and an end connection structure; Among them, the three translation components are respectively used to drive the end connection structure to perform translational movement along the first direction, the second direction and the third direction; the three rotation components are respectively used to drive the end connection structure to rotate around the first rotation axis, the second rotation axis and the third rotation axis; the first direction, the second direction and the third direction are perpendicular to each other; the first rotation axis, the second rotation axis and the third rotation axis are perpendicular to each other.

9. The optical fiber posture adjustment mechanism of the silicon photonic wafer testing equipment according to claim 8, characterized in that: The end connection structure is also connected to a piezoelectric displacement stage, which is used to drive the end of the optical fiber to move through the end connection structure when control voltages of different sizes are turned on, so as to control the alignment coupling between the end of the optical fiber and the silicon photonic wafer.

10. A silicon photonic wafer testing device, characterized in that: It comprises the optical fiber posture adjustment mechanism of the silicon photonic wafer testing equipment as described in any one of claims 1 to 9.

11. A method for adjusting the optical fiber posture of a silicon photonic wafer testing device, characterized in that: The optical fiber posture adjustment mechanism applied to the silicon photonic wafer testing equipment according to any one of claims 1 to 9, wherein the optical fiber posture adjustment method comprises: Control the driving component to drive the silicon photonics wafer to translate into the imaging field of view of the camera component, and adjust the camera component through the wafer image collected by the camera component so that the camera component coordinate system and the cutting path on the silicon photonics wafer are parallel to each other; Control the silicon photonic wafer to move out of the imaging field of view of the camera component, and move the deflection optical path component into the imaging field of view of the camera component, and collect, through the camera component, lateral images corresponding to lateral pictures in at least two different directions of the end of the optical fiber deflected and transmitted by the deflection optical path component; The optical fiber coupling module is controlled to adjust the posture of the optical fiber end according to the lateral image and the direction of the camera component coordinate system, and the driving component is controlled to drive the silicon photonic wafer to translate into the imaging field of view of the camera component, so that the optical fiber array and the silicon photonic wafer are preliminarily aligned.

12. The method for adjusting the optical fiber posture of silicon photonic wafer testing equipment according to claim 11, characterized in that: The camera assembly is adjusted through the wafer image collected by the camera assembly so that the camera assembly coordinate system and the cutting path on the silicon photonic wafer are parallel to each other, including: Controlling the driving component to drive the probe station carrying the silicon photonic wafer to move into the imaging field of view of the camera component; The camera assembly is used to collect a wafer image of the silicon photonic wafer; The camera assembly is adjusted by the wafer image so that the cross cursor of the camera in the camera assembly is adjusted to be parallel to the cutting path on the silicon photonic wafer.

13. The method for adjusting the optical fiber posture of silicon photonic wafer testing equipment according to claim 12, characterized in that: Controlling the optical fiber coupling module to adjust the position of the optical fiber end according to the lateral image and the direction of the camera assembly coordinate system, so as to preliminarily align the optical fiber array with the silicon photonic wafer, including: The camera assembly collects lateral images of the optical fiber end portion in the first horizontal direction and the second horizontal direction reflected by the deflection optical path assembly to obtain a first lateral image and a second lateral image; wherein the first horizontal direction and the second horizontal direction are perpendicular to each other; Controlling the optical fiber coupling module to adjust the end surface of the optical fiber end to a horizontal plane according to the first lateral image and the second lateral image; Collecting a vertical image of the optical fiber end from a vertical direction by the camera assembly; The optical fiber coupling module is controlled according to the vertical image to adjust the contour line of the optical fiber end to be parallel to the cross cursor of the camera.

14. The method for adjusting the optical fiber posture of silicon photonic wafer testing equipment according to claim 13, characterized in that: Controlling the optical fiber coupling module to adjust the end surface of the optical fiber end to a horizontal plane according to the first lateral image and the second lateral image includes: Determine a first angle between the end face of the optical fiber end and the second horizontal direction according to an end face contour line imaged by the optical fiber end in the first lateral image; Controlling the optical fiber coupling module to drive the optical fiber end to rotate by a first angle around the second rotation axis; wherein the second horizontal direction and the second rotation axis are parallel to each other; Determine a second angle between the end face of the optical fiber end and the first horizontal direction according to an end face contour line imaged by the optical fiber end in the second lateral image; The optical fiber coupling module is controlled to drive the optical fiber end to rotate at a second angle around the first rotation axis; wherein the first horizontal direction and the first rotation axis are parallel to each other.

15. The method for adjusting the optical fiber posture of silicon photonic wafer testing equipment according to claim 14, characterized in that: After controlling the optical fiber coupling module to drive the optical fiber end to rotate the first angle around the second rotation axis, the method further includes: The optical fiber coupling module is used to drive the optical fiber end to translate along the first direction. The distance is translated along the third direction The distance of is the distance between the optical fiber end and the second rotation axis; is the first angle; Correspondingly, after controlling the optical fiber coupling module to drive the optical fiber end to rotate about the first rotation axis at a second angle, the method further includes: The optical fiber coupling module is used to drive the optical fiber end to translate along the second direction. The distance is translated along the third direction The distance of is the distance between the optical fiber end and the first rotation axis; is the second angle; Wherein, the first direction, the second direction and the third direction are perpendicular to each other; the first direction and the first rotation axis, the second direction and the second rotation axis, and the third direction are vertical directions; The first direction and the first horizontal direction are parallel to each other; the second direction and the second horizontal direction are parallel to each other.

16. The method for adjusting the optical fiber posture of silicon photonic wafer testing equipment according to claim 13, characterized in that: Controlling the optical fiber coupling module according to the vertical image to adjust the contour line of the optical fiber end to be parallel to the cross cursor of the camera includes: Determine a third angle between the end face contour line of the optical fiber end and the cross cursor according to the end face contour line imaged by the optical fiber end in the vertical image; The optical fiber coupling module is controlled to drive the optical fiber end to rotate at the third angle about a third rotation axis; wherein the third rotation axis is a rotation axis in a vertical direction.

17. The method for adjusting the optical fiber posture of silicon photonic wafer testing equipment according to claim 11, characterized in that: After controlling the driving component to drive the silicon photonic wafer to translate into the imaging field of view of the camera component so that the optical fiber array and the silicon photonic wafer are preliminarily aligned, the method further includes: Controlling the camera assembly to collect an alignment image of the optical fiber end and the silicon photonic wafer formed in the same frame; According to the imaging positions of the optical fiber port at the end of the optical fiber and the optical interface in the silicon photonic wafer in the alignment image, respectively, the optical fiber coupling module is controlled to drive the optical fiber end to translate along the first direction and the second direction to achieve preliminary alignment coupling between the optical fiber port at the end of the optical fiber and the optical interface.

18. The method for adjusting the optical fiber posture of silicon photonic wafer testing equipment according to claim 17, characterized in that: After the preliminary alignment coupling between the optical fiber port at the end of the optical fiber and the optical interface, the method further comprises: Controlling a corresponding optical fiber at each optical fiber end to output a light wave; The piezoelectric displacement stage connected to the terminal connection structure of the optical fiber coupling module drives the optical fiber end to translate in a horizontal plane; The optical power that changes with the translational movement of the optical fiber end is detected by a coupling photodetector connected to an end of the optical fiber away from the optical fiber end; When the optical power is maximum, the position corresponding to the end of the optical fiber is the optimal coupling position between the end of the optical fiber and each waveguide in the silicon photonic wafer.

19. A silicon photonic wafer testing system, characterized in that: It comprises an optical performance tester, a controller and the silicon photonic wafer test equipment as claimed in claim 10; The controller is used to use the silicon photonics wafer testing equipment to execute the steps of the optical fiber posture adjustment method of the silicon photonics wafer testing equipment as described in any one of claims 11 to 18.

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