Chip-to-wafer bonding equipment

Abstract

The invention relates to the technical field of chip bonding, and particularly discloses chip-to-wafer bonding equipment, which comprises a marble gantry platform, and further comprises a chip feeding motion table mechanism, a wafer feeding motion table mechanism, a wafer feeding motion table mechanism, a wafer feeding motion table mechanism, a wafer feeding motion table mechanism, a wafer feeding motion table mechanism, a wafer feeding motion table mechanism, a wafer feeding motion table mechanism and a wafer feeding motion table mechanism, the feeding positioning detection mechanism is used for judging the size and the number of the chips fed on the charging tray, and the feeding positioning detection mechanism is installed above the marble gantry platform and located above the chip feeding movement table mechanism; the chip inversion mechanism is used for protecting the salient points from being damaged when the chips are fed; according to the invention, the existing chip-to-wafer bonding equipment realizes a mixed bonding process combining two bonding processes, that is, the equipment can directly align and bond the Cu-Cu salient points in a real-time heating and pressurizing manner without using a soldering flux, and also can directly align and bond the Cu-Cu salient points, so that the use effect of the bonding equipment is improved.

Description

Technical Field

[0001] The present invention belongs to the technical field of chip bonding, and in particular relates to a chip to wafer bonding device. Background Art

[0002] There is a close relationship between chips and wafers. Wafers are the basic materials for manufacturing semiconductor chips and are usually made of high-purity single-crystal silicon. They are disc-shaped, thin, and have been specially treated on the surface for subsequent circuit processing. Chips are semiconductor devices cut and packaged from wafers, which contain specific circuits and functions and are components ultimately used in electronic devices. Wafers are the basis for chip production, and chips are specific products obtained after wafer processing. Many chips can be processed from a wafer, so wafers are the raw materials in chip production, and batch production can reduce the cost of a single chip. The silicon material with higher purity is melted and formed into single-crystal silicon wafers through crystal growth technology, which are the basic materials for manufacturing semiconductor chips. Through oxidation, photolithography, etching, thin film deposition, interconnection and other process steps on the wafer, the circuit pattern is transferred to the surface of the wafer to form a circuit structure of multiple chips.

[0003] Existing chip-to-wafer bonding equipment usually performs hot-press bonding by dipping the chip in flux, or performs Cu-Cu bump direct alignment bonding after the chip and wafer are placed in a preheating furnace and preheated to a suitable bonding temperature. Cu-Cu bump direct alignment bonding cannot be performed. Therefore, a chip-to-wafer bonding equipment is proposed.

[0004] The present invention realizes a hybrid bonding process combining two bonding processes, that is, the equipment performs direct alignment bonding of Cu-Cu bumps in the form of real-time heating and pressurization without using soldering flux. Summary of the invention

[0005] The object of the present invention is to provide a chip-to-wafer bonding device to solve the problem that the existing chip-to-wafer bonding device usually performs hot compression bonding by dipping the chip in flux, or performs direct Cu-Cu bump alignment bonding after the chip and the wafer are placed in a preheating furnace and preheated to a suitable bonding temperature, but cannot perform direct Cu-Cu bump alignment bonding.

[0006] To achieve the above object, the present invention provides the following technical solutions:

[0007] A chip-to-wafer bonding device includes a marble gantry platform and also includes:

[0008] A chip loading motion platform mechanism is used to realize manual loading of chips, and the chip loading motion platform mechanism is installed above the marble gantry platform;

[0009] A loading positioning detection mechanism is used to determine the size and quantity of the chips loaded on the tray. The loading positioning detection mechanism is installed above the marble gantry platform and is located above the chip loading motion platform mechanism;

[0010] The chip flipping mechanism is used to protect the bumps from being damaged when the chip is loaded. The chip flipping mechanism is arranged above the marble gantry platform and behind the chip loading motion platform mechanism;

[0011] An upper visual alignment mechanism, used for identifying marks on the wafer, wherein the upper visual alignment mechanism is arranged above the marble gantry platform;

[0012] The gantry-type Y-direction motion table mechanism cooperates with the motor's motion mode to meet the positioning accuracy requirements of bonding;

[0013] A wafer heating plate mechanism is used to achieve double water cooling layer thermal insulation, and the wafer heating plate mechanism is installed above the marble gantry platform;

[0014] The wafer alignment X-direction motion stage mechanism is used for quick placement and pick-up of wafers, and the wafer alignment X-direction motion stage mechanism is arranged below the wafer heating plate mechanism;

[0015] The heating and pressurizing bonding head mechanism is used to adjust the chip angle and the wafer angle to align, and the heating and pressurizing bonding head mechanism is arranged above the wafer heating plate mechanism.

[0016] Preferably, the chip loading motion platform mechanism includes positioning pins, a support body, diamond pins, a base plate body chip loading tooling and a servo motion control screw module. The positioning pins, the support body and the diamond pins are all installed at the bottom of the chip loading tooling, and the chip loading tooling is located above the servo motion control screw module.

[0017] Preferably, the feeding positioning detection mechanism includes a camera adjustment block, a camera base, a lens, a light source base plate, an industrial camera, a beam, a column and a surface light source, the column is installed at the bottom of the beam, the camera base is installed on one side of the beam, the camera adjustment block, the lens and the industrial camera are all installed on one side of the camera base, the light source base plate is installed at the bottom of the beam, and the surface light source is arranged below the light source base plate.

[0018] Preferably, the chip flipping mechanism includes a Z-axis base plate, a rotating shaft base plate, an X-axis back plate, a guide rail seat, a suction cup connector, a suction head, a first drag chain body, a spring stopper, a linear guide rail, a limit block, a first drag chain mounting plate, a second drag chain mounting plate, an origin sensor plate, a third drag chain mounting plate, a second drag chain, a servo motor, a photoelectric switch, a direct drive motor and a spring body. The X-axis back plate is installed above the servo motion control screw module, and the servo motor is installed on one side of the X-axis back plate. The first drag chain and the first drag chain body are both arranged on the X-axis back plate.

[0019] Preferably, the upper visual alignment mechanism includes a microscope lower bracket, a microscope lower base plate, a lower camera support, a slide seat, a camera adjustment seat, a microscope upper bracket and an electric slide, the microscope upper bracket is installed on the camera adjustment seat and the microscope lower bracket, the camera adjustment seat and the microscope lower bracket are installed on the microscope lower base plate, the electric slide is connected to the lower camera support, the microscope lower base plate is installed above the electric slide, and the slide seat is arranged on the outer wall of the electric slide.

[0020] Preferably, the gantry type Y-direction motion table mechanism comprises a limit end cover, a flat plate mover, a grating ruler and a linear motor stator, and the limit end cover, the flat plate mover, the grating ruler and the linear motor stator are all arranged on a marble gantry platform.

[0021] Preferably, the wafer heating plate mechanism includes a thermocouple, a first water-cooling tube, a second water-cooling plate, a third water-cooling plate, a heating plate body and a silicon carbide supporting plate. The second water-cooling plate, the third water-cooling plate and the heating plate body are all arranged below the silicon carbide supporting plate and are arranged in sequence. The first water-cooling tube is connected to the outer wall of the second water-cooling plate.

[0022] Preferably, the wafer alignment X-direction motion table mechanism comprises a linear motor body, a stage connection plate, a vertical plate and a lifting PIN pin, the linear motor body is mounted on a servo motion control lead screw module, and the stage connection plate and the vertical plate are both mounted above the linear motor body.

[0023] Preferably, the heating and pressurizing bonding head mechanism includes a ceramic heating plate, a vacuum suction cup, a hot plate connecting part, a water-cooling layer body, a heat insulation board, a pressure sensor, a rotating shaft flange, a groove-type photoelectric, a screw seat, a photoelectric adjustment plate, a ball screw, a drag chain sheet metal, a coupling, a fourth drag chain mounting plate and a motor seat. The servo motor is installed on the motor seat, and a screw seat is installed under the motor seat. The ceramic heating plate, vacuum suction cup, hot plate connecting part, a water-cooling layer body, a heat insulation board, a pressure sensor, a rotating shaft flange, a groove-type photoelectric, a photoelectric adjustment plate, a fourth drag chain mounting plate, a ball screw and a drag chain sheet metal are all arranged on the screw seat.

[0024] Preferably, the coupling is installed at the output end of the servo motor.

[0025] Compared with the prior art, the present invention has the following beneficial effects:

[0026] Place the chip on the tray with the bump facing upwards for loading; take pictures with a visual camera at the loading position for foolproof detection, confirm the presence of chips in each tray point in the tray, and determine the chip position; the chip flipping mechanism sucks and flips the chip 180° so that the chip bump faces downwards: the wafer is loaded in the X direction, and the Y direction gantry sucks the flipped chip to the lower camera position, the lower camera takes a picture of the chip mark point, and then moves to the wafer position for the upper camera to take a picture of the wafer mark position; after the upper and lower cameras take pictures, the algorithm compensates and adjusts the XY movement direction positioning of the wafer and adjusts the θ direction through the bonding head; the wafer heating plate heats the wafer, the hot press bonding head heats the chip to the bonding temperature, and the pressure head presses down to output a constant pressure value to complete the bonding step;

[0027] The heated and pressurized bonding head drives the screw to rotate and move in the Z direction through the motor and outputs the screw thrust as the bonding pressure. The pressure sensor reads the real-time pressure and feeds it back to the motor motion control system to make the bonding pressure controllable. The heating plate heats the suction head, and the water cooling layer and the heat insulation plate prevent the heat from conducting upward. The direct drive motor adjusts the chip angle to align with the wafer angle.

[0028] The existing chip-to-wafer bonding equipment realizes a hybrid bonding process combining two bonding processes, that is, the equipment can perform Cu-Cu bump direct alignment bonding in the form of real-time heating and pressurization without using flux, and can also perform Cu-Cu bump direct alignment bonding, thereby improving the use effect of this bonding equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a structural diagram of the present invention;

[0030] Figure 2 It is a structural diagram of the chip loading motion platform mechanism of the present invention;

[0031] Figure 3 It is a structural diagram of the feeding positioning detection mechanism of the present invention;

[0032] Figure 4 It is a structural diagram of the chip flipping mechanism of the present invention;

[0033] Figure 5 It is a structural diagram of the visual alignment mechanism of the present invention;

[0034] Figure 6 It is a structural diagram of the gantry type Y-direction motion table mechanism of the present invention;

[0035] Figure 7 It is a structural diagram of the wafer heating plate mechanism of the present invention;

[0036] Figure 8 It is a structural diagram of the wafer alignment X-direction motion stage mechanism of the present invention;

[0037] Fig. 9 It is a structural diagram of the heating and pressurizing bonding head mechanism of the present invention;

[0038] Fig.10 It is a structural diagram of the visual alignment mechanism of the present invention.

[0039] In the figure: 1. Chip loading motion platform mechanism; 101. Positioning pin; 102. Support body; 103. Diamond pin; 104. Bottom plate body; 105. Chip loading tooling; 106. Servo motion control screw module; 2. Loading positioning detection mechanism; 201. Camera adjustment block; 202. Camera base; 203. Lens; 204. Light source bottom plate; 205. Industrial camera; 206. Beam; 207. Column; 208. Surface light source; 3. Chip flipping mechanism; 301. Z-axis bottom plate; 302. Rotating shaft bottom plate; 303. X-axis back plate; 304. Guide Rail seat; 305, suction cup connector; 306, suction head; 307, first drag chain body; 308, spring stopper; 309, linear guide rail; 3010, limit block; 3011, first drag chain mounting plate; 3012, second drag chain mounting plate; 3013, origin sensor; 3014, third drag chain mounting plate; 3015, second drag chain; 3016, servo motor; 3017, photoelectric switch; 3018, direct drive motor; 3019, spring body; 4, upper visual alignment mechanism; 5, gantry Y-direction motion platform mechanism; 501, limit end cover; 502 , marble gantry platform; 503, flat plate mover; 504, grating ruler; 505, linear motor stator; 6, wafer heating plate mechanism; 601, thermocouple; 602, first water cooling tube; 603, second water cooling plate; 604, third water cooling plate; 605, heating plate body; 606, silicon carbide carrier plate; 7, wafer alignment X-direction motion stage mechanism; 701, linear motor body; 702, carrier connection plate; 703, vertical plate; 704, lifting PIN needle; 8, heating and pressurizing bonding head mechanism; 801, ceramic heating plate; 802, vacuum suction cup; 80 3. Hot plate connector; 804. Water cooling layer body; 805. Heat insulation board; 806. Pressure sensor; 807. Shaft flange; 808. Coupling; 809. Motor seat; 8010. Groove-type photoelectric; 8011. Screw seat; 8012. Photoelectric adjustment plate; 8013. Fourth drag chain mounting plate; 8014. Ball screw; 8015. Drag chain sheet metal; 901. Microscope lower bracket; 902. Microscope lower base plate; 903. Lower camera bracket; 904. Slide seat; 905. Camera adjustment seat; 906. Microscope upper bracket; 907. Electric slide. DETAILED DESCRIPTION

[0040] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0041] like Figure 1 , Figure 2 As shown, a chip-to-wafer bonding device includes a marble gantry platform 502, and also includes: a chip loading motion platform mechanism 1, which is used to realize manual loading of chips. The chip loading motion platform mechanism 1 is installed above the marble gantry platform 502. The chip loading motion platform mechanism 1 includes a positioning pin 101, a support body 102, a diamond pin 103, a bottom plate body 104, a chip loading tool 105 and a servo motion control screw module 106. The positioning pin 101, the support body 102 and the diamond pin 103 are all installed at the bottom of the chip loading tool 105, and the chip loading tool 105 is located above the servo motion control screw module 106;

[0042] From the above, it can be seen that in the tooling design, as many chip placement positions as possible are reserved according to the chip size within the 300mm*300mm area, and the chips are placed in order in the positions of the loading tooling. The two pins on one side of the pin are used to position the loading tray to ensure sufficient repeat positioning accuracy. The servo motion control screw module 106 can meet the chip loading positioning requirements.

[0043] like Figure 1 , Figure 3 As shown, the loading positioning detection mechanism 2 is used to determine the size and quantity of the chips loaded on the material tray. The loading positioning detection mechanism 2 is installed above the marble gantry platform 502 and is located above the chip loading motion platform mechanism 1. The loading positioning detection mechanism 2 includes a camera adjustment block 201, a camera base 202, a lens 203, a light source base plate 204, an industrial camera 205, a beam 206, a column 207 and a surface light source 208. The column 207 is installed at the bottom of the beam 206, the camera base 202 is installed on one side of the beam 206, the camera adjustment block 201, the lens 203 and the industrial camera 205 are all installed on one side of the camera base 202, the light source base plate 204 is installed at the bottom of the beam 206, and the surface light source 208 is arranged below the light source base plate 204;

[0044] From the above, we can see that the loading positioning detection uses visual judgment to determine the size and number of chips loaded on the tray. Because the tooling is a universal design, the number of loaded chips does not correspond to the number of tray points in actual use. Therefore, visual detection is used to prevent mistakes and ensure smooth execution of subsequent equipment actions.

[0045] like Figure 1 , Figure 4 As shown, the chip flipping mechanism 3 is used to protect the bumps from being damaged when the chip is loaded. The chip flipping mechanism 3 is arranged above the marble gantry platform 502 and is located behind the chip loading motion platform mechanism 1. The chip flipping mechanism 3 includes a Z-axis bottom plate 301, a rotating shaft bottom plate 302, an X-axis back plate 303, a guide rail seat 304, a suction cup connector 305, a suction head 306, a first drag chain body 307, a spring stopper 308, a linear guide rail 309, a limit block 3010, a first drag chain mounting The mounting plate 3011, the second drag chain mounting plate 3012, the origin sensor sheet 3013, the third drag chain mounting plate 3014, the second drag chain 3015, the servo motor 3016, the photoelectric switch 3017, the direct drive motor 3018 and the spring body 3019, the X-axis back plate 303 is installed above the servo motion control screw module 106, the servo motor 3016 is installed on one side of the X-axis back plate 303, and the first drag chain 3015 and the first drag chain body 307 are both arranged on the X-axis back plate 303;

[0046] As can be seen from the above, in order to protect the bumps from being damaged during chip loading, the bump-up loading method is adopted. Before bonding, the chip must be flipped downward to make the chip and the corresponding copper contacts of the wafer directly contact each other. Therefore, it is necessary to design a chip flipping mechanism 3. The chip flipping mechanism 3 is controlled by a servo motion screw module 106 to complete the movement in the X and Z directions, and the direct drive motor 3018 completes the 180° flipping action. The chip is sucked by the vacuum suction head 306. The suction head 306 absorbs the cotton-wrapped rubber to protect the copper contacts from being damaged during this process.

[0047] like Figure 1 , Figure 5 , Fig.10 As shown, the upper visual alignment mechanism 4 is used to identify the mark on the wafer. The upper visual alignment mechanism 4 is arranged above the marble gantry platform 502. The upper visual alignment mechanism 4 includes a microscope bracket 901, a microscope bottom plate 902, a lower camera support 903, a slide seat 904, a camera adjustment seat 905, a microscope upper bracket 906 and an electric slide 907. The microscope upper bracket 906 is installed on the camera adjustment seat 905 and the microscope bracket 901. The camera adjustment seat 905 and the microscope bracket 901 are installed on the microscope bottom plate 902. The electric slide 907 is connected to the lower camera support 903. The microscope bottom plate 902 is installed above the electric slide 907. The slide seat 904 is arranged on the outer wall of the electric slide 907.

[0048] As can be seen from the above, the heated and pressurized bonding head drives the screw to rotate and move in the Z direction through the motor and outputs the screw thrust as the bonding pressure. The pressure sensor 806 reads the real-time pressure size and feeds it back to the motor motion control system to make the bonding pressure size controllable. The heating plate heats the suction head 306, and the water-cooling layer body 804 and the insulation plate 805 prevent heat from conducting upwards. The direct drive motor 3018 adjusts the chip angle to align with the wafer angle.

[0049] like Figure 1 , Figure 6 As shown, the gantry type Y-direction motion table mechanism 5 cooperates with the motion mode of the motor to meet the positioning accuracy requirements of the bonding. The gantry type Y-direction motion table mechanism 5 includes a limit end cover 501, a flat plate mover 503, a grating ruler 504 and a linear motor stator 505. The limit end cover 501, the flat plate mover 503, the grating ruler 504 and the linear motor stator 505 are all arranged on the marble gantry platform 502;

[0050] like Figure 1 , Figure 7 As shown, the wafer heating plate mechanism 6 is used to achieve double water-cooling layer insulation. The wafer heating plate mechanism 6 is installed above the marble gantry platform 502. The wafer heating plate mechanism 6 includes a thermocouple 601, a first water-cooling pipe 602, a second water-cooling plate 603, a third water-cooling plate 604, a heating plate body 605 and a silicon carbide carrier plate 606. The second water-cooling plate 603, the third water-cooling plate 604 and the heating plate body 605 are all arranged below the silicon carbide carrier plate 606 and are arranged in sequence. The first water-cooling pipe 602 is connected to the outer wall of the second water-cooling plate 603;

[0051] like Figure 1 , Figure 8 As shown, the wafer alignment X-direction motion stage mechanism 7 is used for quick placement and pick-up of wafers. The wafer alignment X-direction motion stage mechanism 7 is arranged below the wafer heating plate mechanism 6. The wafer alignment X-direction motion stage mechanism 7 includes a linear motor body 701, a stage connection plate 702, a vertical plate 703 and a lifting PIN needle 704. The linear motor body 701 is installed on the servo motion control lead screw module 106, and the stage connection plate 702 and the vertical plate 703 are both installed above the linear motor body 701.

[0052] like Figure 1 , Fig. 9As shown, the heating and pressurizing bonding head mechanism 8 is used to adjust the chip angle and the wafer angle to be aligned. The heating and pressurizing bonding head mechanism 8 is arranged above the wafer heating plate mechanism 6. The heating and pressurizing bonding head mechanism 8 includes a ceramic heating plate 801, a vacuum suction cup 802, a hot plate connector 803, a water cooling layer body 804, a heat insulation plate 805, a pressure sensor 806, a shaft flange 807, a slot-type photoelectric 8010, a screw seat 8011, a photoelectric adjustment plate 8012, a ball screw 8014, a drag chain sheet metal 8015, a coupling 808, and a fourth drag chain mounting plate 801. 3 and motor seat 809, the servo motor 3016 is installed on the motor seat 809, a screw seat 8011 is installed below the motor seat 809, the ceramic heating plate 801, the vacuum suction cup 802, the hot plate connector 803, the water-cooling layer body 804, the insulation board 805, the pressure sensor 806, the shaft flange 807, the slot-type photoelectric 8010, the photoelectric adjustment plate 8012, the fourth drag chain mounting plate 8013, the ball screw 8014 and the drag chain sheet metal 8015 are all arranged on the screw seat 8011, and the coupling 808 is installed at the output end of the servo motor 3016.

[0053] In summary, the working principle of the present invention is as follows:

[0054] Place the chip on the tray with the bump facing upwards for loading; take pictures with a visual camera at the loading position for foolproof detection, confirm the presence of chips in each tray point in the tray, and determine the chip position; the chip flipping mechanism 3 sucks and flips the chip 180° so that the chip bump faces downwards: the wafer is loaded in the X direction, and the Y direction gantry sucks the flipped chip to the lower camera position, the lower camera takes pictures of the chip mark point, and then moves to the wafer position for the upper camera to take pictures of the wafer mark position; after the upper and lower cameras take pictures, the algorithm compensates and adjusts the XY movement direction positioning of the wafer and adjusts the θ direction through the bonding head; the wafer heating plate heats the wafer, the hot pressing bonding head heats the chip to the bonding temperature, and the pressure head presses down to output a constant pressure value to complete the bonding step;

[0055] The heating and pressurizing bonding head drives the screw to rotate and move in the Z direction through the motor and outputs the screw thrust as the bonding pressure. The pressure sensor 806 reads the real-time pressure and feeds it back to the motor motion control system to make the bonding pressure controllable. The heating plate heats the suction head 306, and the water cooling layer and the heat insulation plate 805 prevent the heat from being conducted upward. The direct drive motor 3018 adjusts the chip angle to align with the wafer angle.

[0056] The existing chip-to-wafer bonding equipment realizes a hybrid bonding process combining two bonding processes, that is, the equipment can perform Cu-Cu bump direct alignment bonding in the form of real-time heating and pressurization without using flux, and can also perform Cu-Cu bump direct alignment bonding, thereby improving the use effect of this bonding equipment.

[0057] Furthermore, the present design application is applied to a device for bonding chips to wafers, so that the existing chip-to-wafer bonding device realizes a hybrid bonding process combining two bonding processes, that is, the device can perform direct Cu-Cu bump alignment bonding in the form of real-time heating and pressurization without using flux, and can also perform direct Cu-Cu bump alignment bonding, thereby improving the use effect of this bonding device.

[0058] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A chip-to-wafer bonding device, characterized in that: It includes a marble gantry platform (502), and also includes: A chip loading motion platform mechanism (1) is used to realize manual loading of chips, and the chip loading motion platform mechanism (1) is installed above the marble gantry platform (502); A loading positioning detection mechanism (2) is used to determine the size and quantity of the chips loaded on the tray, and the loading positioning detection mechanism (2) is installed above the marble gantry platform (502) and is located above the chip loading motion platform mechanism (1); A chip flipping mechanism (3) is used to protect the bumps from being damaged when the chip is loaded. The chip flipping mechanism (3) is arranged above the marble gantry platform (502) and behind the chip loading motion platform mechanism (1); An upper visual alignment mechanism (4) is used to identify marks on the wafer, and the upper visual alignment mechanism (4) is arranged above the marble gantry platform (502); A gantry-type Y-direction motion table mechanism (5) cooperates with the motion mode of the motor to meet the positioning accuracy requirements of bonding; A wafer heating plate mechanism (6) is used to achieve double water cooling layer thermal insulation, and the wafer heating plate mechanism (6) is installed above the marble gantry platform (502); A wafer alignment X-direction motion stage mechanism (7) is used for quickly taking and placing wafers, and the wafer alignment X-direction motion stage mechanism (7) is arranged below the wafer heating plate mechanism (6); The heating and pressurizing bonding head mechanism (8) is used to adjust the chip angle and the wafer angle to align, and the heating and pressurizing bonding head mechanism (8) is arranged above the wafer heating plate mechanism (6).

2. The chip-to-wafer bonding device according to claim 1, characterized in that: The chip loading motion platform mechanism (1) comprises a positioning pin (101), a support body (102), a diamond pin (103), a base body (104), a chip loading tool (105) and a servo motion control screw module (106); the positioning pin (101), the support body (102) and the diamond pin (103) are all installed at the bottom of the chip loading tool (105); and the chip loading tool (105) is located above the servo motion control screw module (106).

3. The chip-to-wafer bonding device according to claim 1, characterized in that: The loading positioning detection mechanism (2) comprises a camera adjustment block (201), a camera base (202), a lens (203), a light source base plate (204), an industrial camera (205), a crossbeam (206), a column (207) and a surface light source (208); the column (207) is mounted at the bottom of the crossbeam (206); the camera base (202) is mounted on one side of the crossbeam (206); the camera adjustment block (201), the lens (203) and the industrial camera (205) are all mounted on one side of the camera base (202); the light source base plate (204) is mounted at the bottom of the crossbeam (206); and the surface light source (208) is arranged below the light source base plate (204).

4. The chip-to-wafer bonding device according to claim 1, characterized in that: The chip flipping mechanism (3) comprises a Z-axis base plate (301), a rotating shaft base plate (302), an X-axis back plate (303), a guide rail seat (304), a suction cup connector (305), a suction head (306), a first drag chain body (307), a spring stopper (308), a linear guide rail (309), a limit block (3010), a first drag chain mounting plate (3011), a second drag chain mounting plate (3012), an origin sensor plate (3013), a third drag chain mounting plate ( 3014), a second drag chain (3015), a servo motor (3016), a photoelectric switch (3017), a direct drive motor (3018) and a spring body (3019), the X-axis back plate (303) is installed above the servo motion control screw module (106), the servo motor (3016) is installed on one side of the X-axis back plate (303), and the first drag chain (3015) and the first drag chain body (307) are both arranged on the X-axis back plate (303).

5. The chip-to-wafer bonding device according to claim 1, characterized in that: The upper visual alignment mechanism (4) comprises a lower microscope support (901), a lower microscope base plate (902), a lower camera support (903), a slide seat (904), a camera adjustment seat (905), an upper microscope support (906) and an electric slide (907), wherein the upper microscope support (906) is mounted on the camera adjustment seat (905) and the lower microscope support (901), the camera adjustment seat (905) and the lower microscope support (901) are mounted on the lower microscope base plate (902), the electric slide (907) is connected to the lower camera support (903), the lower microscope base plate (902) is mounted above the electric slide (907), and the slide seat (904) is arranged on the outer wall of the electric slide (907).

6. The chip-to-wafer bonding device according to claim 1, characterized in that: The gantry type Y-direction motion platform mechanism (5) comprises a limit end cover (501), a flat plate mover (503), a grating ruler (504) and a linear motor stator (505); the limit end cover (501), the flat plate mover (503), the grating ruler (504) and the linear motor stator (505) are all arranged on a marble gantry platform (502).

7. The chip-to-wafer bonding device according to claim 1, characterized in that: The wafer heating plate mechanism (6) includes a thermocouple (601), a first water-cooling tube (602), a second water-cooling plate (603), a third water-cooling plate (604), a heating plate body (605) and a silicon carbide supporting plate (606). The second water-cooling plate (603), the third water-cooling plate (604) and the heating plate body (605) are all arranged below the silicon carbide supporting plate (606) and are arranged in sequence. The first water-cooling tube (602) is connected to the outer wall of the second water-cooling plate (603).

8. The chip-to-wafer bonding device according to claim 2, characterized in that: The wafer alignment X-direction motion stage mechanism (7) comprises a linear motor body (701), a stage connection plate (702), a vertical plate (703) and a lifting PIN pin (704); the linear motor body (701) is mounted on a servo motion control lead screw module (106); and the stage connection plate (702) and the vertical plate (703) are both mounted above the linear motor body (701).

9. The chip-to-wafer bonding device according to claim 4, characterized in that: The heating and pressurizing bonding head mechanism (8) includes a ceramic heating plate (801), a vacuum suction cup (802), a hot plate connector (803), a water cooling layer body (804), a heat insulation plate (805), a pressure sensor (806), a shaft flange (807), a slotted photoelectric (8010), a screw seat (8011), a photoelectric adjustment plate (8012), a ball screw (8014), a drag chain sheet metal (8015), a coupling (808), a fourth drag chain mounting plate (8013) and a motor seat (809), wherein the servo motor (3016 ) is installed on a motor seat (809), a screw seat (8011) is installed below the motor seat (809), and the ceramic heating plate (801), vacuum suction cup (802), hot plate connector (803), water cooling layer body (804), heat insulation board (805), pressure sensor (806), shaft flange (807), slot-type photoelectric (8010), photoelectric adjustment plate (8012), fourth drag chain mounting plate (8013), ball screw (8014) and drag chain sheet metal (8015) are all arranged on the screw seat (8011).

10. The chip-to-wafer bonding device according to claim 9, characterized in that: The coupling (808) is installed at the output end of the servo motor (3016).

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