Wafer fixing device for cutting machine

Abstract

The invention relates to the technical field of wafers, in particular to a wafer fixing device for a cutting machine, which comprises a rotary table and a wafer carrier, a first airway is arranged in the center of the turntable; a pore plate is arranged at the top of the rotary table; an air chamber communicated with the first air passage is formed between the pore plate and the rotary table; a plurality of second air channels are formed in the rotary table in the circumferential direction; a control valve for communicating the first air passage with each second air passage is arranged between the first air passage and the plurality of second air passages; the turntable is provided with a supporting table; the wafer carrier comprises a tightening ring arranged on the supporting table and a UV adhesive tape film arranged on the tightening ring; the UV adhesive tape film is provided with a plurality of air cavities communicating with the second air channels in a one-to-one correspondence mode in the circumferential direction. In this way, the centrifugal cleaning force is enhanced, cleaning dead corners are reduced, cutting chippings are easier to clean, the cleaning effect is better, and the cleaning efficiency and the product yield are improved.

Description

Technical Field

[0001] The present invention relates to the field of wafer technology, and in particular to a wafer fixing device for a cutting machine. Background Art

[0002] In the field of semiconductor manufacturing, wafers are important basic materials, and their processing quality is crucial. With the rapid development of electronic technology, the quality requirements for wafers are getting higher and higher. Wafer cutting is one of the key links in the semiconductor manufacturing process. In the traditional wafer cutting process, a specific cutting tool is usually used to cut the wafer to divide the wafer into multiple independent chip units. However, a large amount of debris is inevitably generated during the cutting process. If these debris are not cleaned up in time, they may have a serious impact on the surface quality and performance of the wafer.

[0003] At present, the existing wafer fixture mainly cleans the debris by centrifugal rotation after wafer cutting. Although this structure can clean some debris, some debris will still remain in the cutting path, and the cleaning effect is not good; and the remaining debris will also damage the wafer in the subsequent processing process, thereby affecting the product yield. Summary of the invention

[0004] The object of the present invention is to overcome the above-mentioned shortcomings and provide a wafer fixing device for a cutting machine, thereby enhancing the centrifugal cleaning force and reducing cleaning dead corners, making cutting debris easier to clean, with better cleaning effect, improving cleaning efficiency and product yield.

[0005] To achieve the above object, the specific scheme of the present invention is as follows:

[0006] A wafer fixing device for a cutting machine comprises a turntable and a wafer carrier; a first air channel is arranged at the center of the turntable; a perforated plate is arranged at the top of the turntable, and an air chamber connected to the first air channel is formed between the perforated plate and the turntable; a plurality of second air channels are arranged in the circumferential direction inside the turntable; a control valve for connecting the first air channel with each second air channel is arranged between the first air channel and the plurality of second air channels; and a support platform is arranged on the turntable;

[0007] The wafer carrier comprises a tension ring arranged on a support platform and a UV adhesive tape film arranged on the tension ring; the UV adhesive tape film is provided with a plurality of air cavities corresponding to each other and communicating with a plurality of second air passages along the circumferential direction.

[0008] The present invention is further configured such that a plurality of second air channels are evenly distributed with the first air channel as the center; a third air channel is respectively provided corresponding to each air cavity on the support platform, and the second air channel is connected to the corresponding air cavity through the third air channel, and the second air channel is connected to the corresponding air cavity through the third air channel.

[0009] The present invention is further configured such that a connecting valve is slidably provided in each second air channel, the connecting valve is penetrated by a connecting hole connected to the second air channel, and a tension spring is provided between the connecting valve and the turntable; when the turntable rotates, the connecting valve slides outward under the action of centrifuge to overcome the tension of the tension spring, so that the connecting hole can be connected to the third air channel.

[0010] The present invention is further configured such that the support platform is provided with a slot communicating with the third airway and a first profile hole communicating with the slot at a position corresponding to each connecting valve; the connecting valve is provided with a profile surface; the slot is provided with a one-way valve between the profile hole and the third airway;

[0011] A plug-in arm is provided corresponding to each slot of the tension ring, and a second profile hole and a first avoidance hole and a second avoidance hole distributed on both sides of the second profile hole and connected with the second profile hole are provided on the plug-in arm, and the first avoidance hole runs through the end of the plug-in arm and is used to avoid the one-way valve; when the plug-in arm is inserted into the slot, the second profile hole is coaxial with the first profile hole, and a connecting groove connected with the third airway is formed between the slot, the first profile hole, the second profile hole, the first avoidance hole and the second avoidance hole; the one-way valve is located in the connecting groove; when the connecting valve slides outward, the profile surface cooperates with the profile surface of the first profile hole and the second profile hole.

[0012] The present invention is further configured such that an annular groove is provided on the turntable, the support platform is lifted and lowered in the annular groove, and a second spring is connected between the support platform and the turntable;

[0013] The side wall of the annular groove is provided with a locking block, the locking block is provided with a locking groove, the tension ring is provided with an elastic claw, and the elastic claw cooperates with the locking groove to unlockably lock the tension ring.

[0014] The present invention is further configured such that the locking groove includes a first vertical groove, a first inclined groove, a second vertical groove, a second inclined groove, a third inclined groove, a third vertical groove and a fourth inclined groove connected in sequence; one end of the first vertical groove passes through the locking block; the second inclined groove and the third inclined groove are connected in a V-shape, and a locking position is formed; the locking position is on the side of the first vertical groove close to the second vertical groove; a step is provided between the fourth inclined groove and the first vertical groove, and a transition inclined surface is provided in the fourth inclined groove.

[0015] The present invention is further configured such that a plurality of second springs are evenly distributed in the annular groove along the circumferential direction.

[0016] The present invention is further configured such that the side wall of the annular groove is evenly provided with a plurality of locking blocks along the circumferential direction, and the tension ring is evenly provided with a plurality of elastic claws along the circumferential direction.

[0017] The present invention is further configured such that the one-way valve includes a one-way valve plate and a connecting shaft, the one-way valve plate is arranged on the connecting shaft, both ends of the connecting shaft are rotatably connected to a support platform, and torsion springs are respectively arranged between the two ends of the connecting shaft and the support platform; the torsion spring causes the one-way valve plate to close the connecting groove.

[0018] The present invention is further configured such that the wafer fixing device further comprises a frame, a first displacement mechanism arranged at the bottom of the frame, a second displacement mechanism arranged at the top of the frame, a third displacement mechanism arranged at the output end of the second displacement mechanism, and a cutter assembly arranged at the output end of the third displacement mechanism; a turntable is arranged at the output end of the first displacement mechanism, the first displacement mechanism is used to drive the turntable to move along the first direction; the second displacement mechanism is used to drive the cutter assembly to move along the second direction, and the third displacement mechanism is used to drive the cutter assembly to move along the third direction;

[0019] There is also an industrial camera on the top of the rack.

[0020] The beneficial effects of the present invention are as follows: when it is necessary to clean the cutting debris, the turntable drives the wafer carrier to rotate centrifugally, and the air pump is used to pump air into the first air channel. The air flows into the air chamber through the first air channel and flows from the holes of the orifice plate toward the UV tape film, so that the UV tape film expands outward, thereby increasing the spacing between each chip and making the cutting path into an inverted trapezoid. By increasing the spacing and changing the shape of the cutting path, the residue of cutting debris during cleaning is reduced. At the same time, the control valve controls the first air channel to be connected with each second air channel in sequence, and the gas enters the corresponding air cavity along the first air channel, the second air channel, and the third air channel, so that the UV tape film portion corresponding to the air cavity is expanded and stretched, so that the axis of the wafer workpiece deviates from the axis of the turntable, thereby changing the centrifugal force at the axis of the wafer workpiece. In this way, by connecting the first air channel with each second air channel in sequence, the UV tape film portion corresponding to each air cavity is expanded and stretched, thereby enhancing the strength of centrifugal cleaning and reducing cleaning dead corners, making the cutting debris easier to be cleaned, the cleaning effect is better, and the cleaning efficiency and product yield are improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the structure of the present invention;

[0022] Figure 2 is a cross-sectional schematic diagram of the present invention in which a wafer carrier is installed on a turntable;

[0023] Figure 3 yes Figure 2 A local enlarged schematic diagram of the middle A;

[0024] Figure 4 It is a structural schematic diagram of the turntable of the present invention;

[0025] Figure 5 is an exploded schematic diagram of the turntable of the present invention;

[0026] Figure 6 is a cross-sectional schematic diagram of the turntable of the present invention when the connecting valve slides into the first profile hole;

[0027] Figure 7 yes Figure 6 A partial enlarged schematic diagram of point B in the middle;

[0028] Figure 8 A cross-sectional schematic diagram of the turntable of the present invention when the one-way valve is opened;

[0029] Fig. 9 yes Figure 8 A partial enlarged schematic diagram of point C in the middle;

[0030] Fig.10 is a schematic structural diagram of a wafer carrier of the present invention;

[0031] Fig.11 is a cross-sectional schematic diagram of a wafer carrier of the present invention;

[0032] Fig.12 It is a structural schematic diagram of the connecting valve of the present invention;

[0033] Fig.13 is a cross-sectional schematic diagram of a control valve of the present invention;

[0034] Fig.14 is a cross-sectional schematic diagram of the support platform of the present invention;

[0035] Fig.15 It is a structural schematic diagram of the one-way valve of the present invention;

[0036] Fig.16 It is a structural schematic diagram of the locking block of the present invention;

[0037] Description of the reference numerals: 1, frame; 2, first displacement mechanism; 3, second displacement mechanism; 4, third displacement mechanism; 5, cutter assembly; 6, turntable; 61, first air channel; 62, air pump; 63, orifice plate; 64, air chamber; 65, second air channel; 651, connecting valve; 652, connecting hole; 653, tension spring; 654, profile surface; 66, control valve; 661, annular valve body; 662, conduction block; 663, first spring; 67, support platform; 671, third air channel; 672, slot; 673, first profile surface; 6741, one-way valve plate; 6742, connecting shaft; 674 3. Torsion spring; 68. Annular groove; 681. Locking block; 6811. First vertical groove; 6812. First inclined groove; 6813. Second vertical groove; 6814. Second inclined groove; 6815. Third inclined groove; 6816. Third vertical groove; 6817. Fourth inclined groove; 6818. Step; 6819. Transition slope; 69. Second spring; 7. Industrial camera; 8. Wafer carrier; 81. Tension ring; 811. Plug arm; 812. Second profile hole; 813. First avoidance hole; 814. Second avoidance hole; 82. UV tape film; 83. Air cavity; 84. Elastic claw. DETAILED DESCRIPTION

[0038] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments, but the implementation scope of the present invention is not limited thereto.

[0039] like Figures 1 to 16 As shown, a wafer fixing device for a cutting machine described in this embodiment includes a turntable 6 and a wafer carrier 8; a first air channel 61 is provided at the center of the turntable 6, and preferably, the first air channel 61 is connected to an air pump 62 to pump air through the air pump 62; a perforated plate 63 is provided on the top of the turntable 6, and an air chamber 64 connected to the first air channel 61 is formed between the perforated plate 63 and the turntable 6; a plurality of second air channels 65 are uniformly distributed along the circumferential direction with the first air channel 61 as the center are provided in the turntable 6; a control valve 66 is provided between the first air channel 61 and the plurality of second air channels 65, and the control valve 66 is used to connect the first air channel 61 with each second air channel 65 respectively; the turntable 6 is provided with a support platform 67;

[0040] The wafer carrier 8 includes a tension ring 81 and a UV tape film 82; the tension ring 81 is arranged on the support platform 67; the UV tape film 82 is arranged on the tension ring 81; the UV tape film 82 is provided with a plurality of air cavities 83 along the circumferential direction; the support platform 67 is provided with a third air channel 671 corresponding to each air cavity 83, and the plurality of second air channels 65 are connected to the plurality of air cavities 83 through the corresponding third air channels 671. In this embodiment, the number of the second air channels 65 is set to four, and the four second air channels 65 are distributed in a cross shape. Correspondingly, the number of the air cavities 83 is set to four, and the four air cavities 83 are also distributed in a cross shape, so that the UV tape film 82 can be fully expanded and stretched, and the centrifugal cleaning effect is better.

[0041] Specifically, when the wafer fixing device for the cutting machine of this embodiment is actually used, the wafer carrier 8 carrying the wafer workpiece is placed from top to bottom on the turntable 6, so that the tension ring 81 is supported on the support table 67; after the wafer workpiece is cut, when the cutting debris needs to be cleaned, the turntable 6 drives the wafer carrier 8 to rotate centrifugally, and pumps air into the first air channel 61 through the air pump 62. The air flows through the first air channel 61 into the air chamber 64, and flows from the holes of the orifice plate 63 toward the UV tape film 82, so that the UV tape film 82 expands outward, thereby increasing the spacing between each chip, and making the cutting path into an inverted trapezoid. By increasing the spacing and changing the shape of the cutting path, the residual cutting debris during cleaning is reduced, and at the same time The control valve 66 controls the first air channel 61 to be connected with each second air channel 65 in sequence, and the gas enters the corresponding air cavity 83 along the first air channel 61, the second air channel 65, and the third air channel 671, so that the part of the UV tape film 82 corresponding to the air cavity 83 is expanded and stretched, so that the axis of the wafer workpiece deviates from the axis of the turntable 6, thereby changing the centrifugal force at the axis of the wafer workpiece. In this way, by connecting the first air channel 61 with each second air channel 65 in sequence, the part of the UV tape film 82 corresponding to each air cavity 83 is expanded and stretched, thereby enhancing the strength of centrifugal cleaning and reducing cleaning dead corners, making it easier to clean cutting debris, and achieving better cleaning effect, thereby improving cleaning efficiency and product yield.

[0042] like Figure 2 and Fig.13 As shown, in the wafer fixing device for a cutting machine of this embodiment, in some embodiments, the control valve 66 includes a circular valve body 661, the circular valve body 661 is penetrated with a mounting hole, a conduction block 662 is movably arranged in the mounting hole, a first spring 663 is connected between the conduction block 662 and the circular valve body 661, and the circular valve body 661 is built with an electric control element for controlling the rotation of the circular valve body 661, so that the conduction block 662 can correspond to the position of each second air channel 65 in sequence. The circular valve body is coaxially arranged with the first air channel 61.

[0043] Specifically, when it is necessary to clean the cutting debris, the electronic control element controls the annular valve body 661 to rotate, and the annular valve body 661 drives the conducting block 662 to rotate. When the conducting block 662 corresponds to the position of the second air channel 65, the first spring 663 makes the conducting block 662 and the second air channel 65 seal and abut against the inner wall of the first air channel 61. Then the electronic control element controls the conducting block 662 to open, so that the first air channel 61 is connected with the corresponding second air channel 65 through the annular valve body 661 and the conducting block 662. The airflow in the first air channel 61 enters the corresponding second air channel 65, and then enters the corresponding air cavity 83 through the corresponding third air channel 671, and the corresponding part of the UV tape film 82 is expanded and stretched. In this way, the electronic control element controls the annular valve body 661 to rotate until the conducting block 662 corresponds to the position of each second air channel 65 in turn, so as to expand and stretch the part of the UV tape film 82 corresponding to each air cavity 83; thereby enhancing the strength of centrifugal cleaning and reducing cleaning dead corners.

[0044] like Figure 2 , Figure 3 , Figures 6 to 9 , Fig.12 As shown, in the wafer fixing device for a cutting machine of this embodiment, in some embodiments, a connecting valve 651 is slidably provided in each second air channel 65, and the connecting valve 651 passes through a connecting hole 652 connected to the second air channel 65, and a tension spring 653 is provided between the connecting valve 651 and the turntable 6; when the turntable 6 rotates, the connecting valve 651 overcomes the tension of the tension spring 653 and slides outward under the action of centrifugation, so that the connecting hole 652 can be connected to the third air channel 671.

[0045] Specifically, initially, the connecting valve 651 is located in the second air channel 65 under the action of the tension spring 653, and the connecting hole 652 is not connected to the third air channel 671; after the wafer workpiece is cut and the cutting debris needs to be cleaned, the turntable 6 drives the wafer carrier 8 to rotate centrifugally, so that each connecting valve 651 overcomes the tension spring 653 and slides outward under the action of centrifugal force, so that the connecting hole 652 is connected to the corresponding third air channel 671, and when the electronic control element makes the conduction block 662 correspond to the position of the second air channel 65, the air flow in the first air channel 61 enters the second air channel 65 through the control valve 66, and then enters the third air channel 671 through the connecting hole 652, and enters the air cavity 83 through the third air channel 671, thereby expanding and stretching the corresponding part of the UV tape film 82.

[0046] like Figures 2 to 11 , Fig.14As shown, in the wafer fixing device for a cutting machine of this embodiment, in some embodiments, the support table 67 is provided with a slot 672 communicating with the third air channel 671 and a first profile hole 673 communicating with the slot 672 at a position corresponding to each connecting valve 651; the connecting valve 651 is provided with a profile surface 654; the slot 672 is provided with a one-way valve between the profile hole and the third air channel 671;

[0047] The tension ring 81 is respectively provided with a plug-in arm 811 corresponding to each slot 672, and the plug-in arm 811 is provided with a second profile hole 812 and a first avoidance hole 813 and a second avoidance hole 814 distributed on both sides of the second profile hole 812 and connected to the second profile hole 812, the first avoidance hole 813 passes through the end of the plug-in arm 811 and is used to avoid the one-way valve; when the plug-in arm 811 is inserted into the slot 672, the second profile hole 812 is coaxial with the first profile hole 673, and a connecting groove connected to the third airway 671 is formed between the slot 672, the first profile hole 673, the second profile hole 812, the first avoidance hole 813 and the second avoidance hole 814; the one-way valve is located in the connecting groove; when the connecting valve 651 slides outward, the profile surface 654 cooperates with the profiles of the first profile hole 673 and the second profile hole 812.

[0048] Specifically, during actual use, the wafer carrier 8 carrying the wafer workpiece is placed on the turntable 6 from top to bottom, and the plug-in arms 811 on each tension ring 81 are inserted into the slots 672 on the support table 67 one by one, and the first avoidance hole 813 avoids the one-way valve until the first profile hole 673 and the second profile hole 812 are coaxial. At this time, the slot 672, the first profile hole 673, the second profile hole 812, the first avoidance hole 813 and the second avoidance hole 814 are jointly enclosed to form a connecting groove connected to the third airway 671, and the one-way valve initially closes the connecting groove; when it is necessary to clean the cutting debris, the turntable 6 drives the wafer carrier 8 to centrifuge. Rotate so that each connecting valve 651 overcomes the tension spring 653 and slides outward under the action of centrifugal force, and the profile surface 654 of the connecting valve 651 slides and is inserted into the first profile hole 673 and the second profile hole 812, thereby locking and fixing the support table 67 and the wafer carrier 8, thereby enhancing the stability of the wafer carrier 8; at this time, the connecting hole 652 is connected with the connecting groove, and when the airflow enters the second air channel 65 and enters the connecting groove through the connecting hole 652, the one-way valve opens under the action of air pressure, so that the airflow enters the third air channel 671 through the connecting groove, and then enters the corresponding air cavity 83, so as to expand and stretch the corresponding part of the UV tape film 82.

[0049] like Figure 2 , Figure 3 , Figures 5 to 11As shown, in the wafer fixing device for a cutting machine of this embodiment, in some embodiments, an annular groove 68 is provided on the turntable 6, and the support platform 67 is lifted and lowered in the annular groove 68, and a second spring 69 is connected between the support platform 67 and the turntable 6; the annular groove 68 is provided to facilitate the installation of the support platform 67; and the second spring 69 is provided to facilitate the reset of the support platform 67;

[0050] The side wall of the annular groove 68 is provided with a locking block 681, the locking block 681 is provided with a locking groove, and the tension ring 81 is provided with an elastic claw 84, and the elastic claw 84 cooperates with the locking groove to unlockably lock the tension ring 81. Fig.16 As shown, further, the locking groove includes a first vertical groove 6811, a first inclined groove 6812, a second vertical groove 6813, a second inclined groove 6814, a third inclined groove 6815, a third vertical groove 6816 and a fourth inclined groove 6817 which are connected in sequence; one end of the first vertical groove 6811 passes through the locking block 681; the second inclined groove 6814 and the third inclined groove 6815 are connected in a V shape, and a locking position is formed; the locking position is on the side of the first vertical groove 6811 close to the second vertical groove 6813; a step 6818 is provided between the fourth inclined groove 6817 and the first vertical groove 6811, and a transition slope 6819 is provided in the fourth inclined groove 6817.

[0051] In actual use, the wafer carrier 8 carrying the wafer workpiece is placed on the turntable 6 from top to bottom, and the plug-in arms 811 on each tension ring 81 are inserted into the slots 672 on the support table 67 one by one. At the same time, the ends of the elastic claws 84 enter the corresponding first vertical grooves 6811, and then the wafer carrier 8 is pressed, the support table 67 moves downward, and the second spring 69 is compressed. As the wafer carrier 8 moves downward, the elastic claws 84 move along the trajectory of the first vertical groove 6811. Due to the obstruction of the step 6818, the elastic claws 84 enter the first inclined groove 6812 from the first vertical groove 6811, and enter the second vertical groove 6813 through the first inclined groove 6812. When the elastic claw 84 moves to the intersection of the second vertical groove 6813 and the second inclined groove 6814, the downward pressure is released, the second spring 69 pushes the support table 67 to reset, and the support table 67 drives the wafer carrier 8 to reset. At this time, the elastic claw 84 enters the second inclined section under its own elastic action. Since the locking position is on the side of the first vertical groove 6811 close to the second vertical groove 6813, the elastic claw 84 is locked into the locking position, thereby realizing the locking and fixing of the wafer carrier 8, that is, the wafer carrier 8 is in a locked state; so that the wafer carrier 8 and the turntable 6 are locked and matched to enhance the stability of the wafer carrier 8 and prevent the wafer workpiece from shifting during the cleaning process;

[0052] When the corresponding part of the UV tape film 82 is released to expand and stretch, the gas in the air cavity 83 enters the annular groove 68 through the third air channel 671, thereby achieving the discharge of the gas in the air cavity 83, so that the UV tape film 82 recovers its deformation;

[0053] When the wafer carrier 8 needs to be removed from the turntable 6, the wafer carrier 8 is pressed down again. At this time, the elastic claw 84 enters the third inclined groove 6815 from the locking position under the action of its own elasticity, that is, the wafer carrier 8 is in an unlocked state, until the elastic claw 84 enters the junction of the third inclined groove 6815 and the third vertical groove 6816. At this time, the downward pressure is released, and the elastic claw 84 moves along the third vertical groove 6816 and enters the fourth inclined groove 6817. It moves along the fourth inclined groove 6817 through the transition slope 6819 and crosses the step 6818 and then returns to the first vertical groove 6811. Then, the wafer carrier 8 is lifted upward, and the elastic claw 84 moves out along the first vertical groove 6811, thereby realizing the unloading of the wafer carrier 8 for the next wafer carrier 8 cutting and cleaning operation.

[0054] like Figure 5 As shown, in the wafer fixing device for a cutting machine of this embodiment, in some embodiments, a plurality of second springs 69 are evenly distributed along the circumference in the annular groove 68. In this embodiment, by evenly distributing a plurality of second springs 69 in the annular groove 68, the support platform 67 is subjected to a more balanced force and moves more stably.

[0055] like Figure 5 As shown, in the wafer fixing device for a cutting machine of this embodiment, in some embodiments, the side wall of the annular groove 68 is evenly distributed with a plurality of locking blocks 681 along the circumferential direction, and the tension ring 81 is evenly distributed with a plurality of elastic claws 84 along the circumferential direction. The locking blocks 681 and the elastic claws 84 are arranged one by one, such as four locking blocks 681 and four elastic claws 84 are arranged respectively; so that the wafer carrier 8 is locked on the turntable 6 more stably, and the stability of the wafer carrier 8 during the cutting process is enhanced.

[0056] like Figure 3 , Figure 7 , Fig. 9 and Fig.15 As shown, the wafer fixing device for the cutting machine of this embodiment, in some embodiments, the one-way valve includes a one-way valve plate 6741 and a connecting shaft 6742, the one-way valve plate 6741 is arranged on the connecting shaft 6742, both ends of the connecting shaft 6742 are rotatably connected to the support platform 67, and torsion springs 6743 are respectively arranged between the two ends of the connecting shaft 6742 and the support platform 67; the torsion spring 6743 causes the one-way valve plate 6741 to close the connecting groove.

[0057] Specifically, when it is necessary to clean the cutting debris, the turntable 6 drives the wafer carrier 8 to rotate centrifugally, so that each connecting valve 651 overcomes the tension spring 653 and slides outward under the action of centrifugal force, and the profile surface 654 of the connecting valve 651 slides and inserts into the first profile hole 673 and the second profile hole 812, thereby locking and fixing the support table 67 and the wafer carrier 8, thereby enhancing the stability of the wafer carrier 8. At this time, the connecting hole 652 is connected to the connecting groove, and when the position of the conducting block 662 corresponds to the second air channel 65, the airflow enters the second air channel 65 and enters the connecting groove through the connecting hole 652, so that the one-way valve plate 6741 overcomes the torsion of the torsion spring 6743 and flips upward to swing, so that the connecting groove is opened. Fig. 9 As shown, at this time, the airflow enters the third air channel 671 through the connecting groove, and then enters the corresponding air cavity 83, thereby expanding and stretching the corresponding part of the UV tape film 82 to enhance the strength of centrifugal cleaning and reduce cleaning dead corners.

[0058] like Figure 1 As shown, the wafer fixing device for the cutting machine of this embodiment, in some embodiments, the wafer fixing device also includes a frame 1, a first displacement mechanism 2 arranged at the bottom of the frame 1, a second displacement mechanism 3 arranged at the top of the frame 1, a third displacement mechanism 4 arranged at the output end of the second displacement mechanism 3 and a cutter assembly 5 arranged on the output end of the third displacement mechanism 4; an industrial camera 7 is also arranged on the top of the frame 1; a turntable 6 is arranged at the output end of the first displacement mechanism 2, and the first displacement mechanism 2 is used to drive the turntable 6 to move along the first direction; the second displacement mechanism 3 is used to drive the cutter assembly 5 to move along the second direction, and the third displacement mechanism 4 is used to drive the cutter assembly 5 to move along the third direction.

[0059] It should be noted that the first direction, the second direction and the third direction are perpendicular to each other. The first displacement mechanism 2 can adopt a screw transmission structure, the second displacement mechanism 3 adopts a linear module, and the third displacement mechanism 4 adopts an electric push rod structure.

[0060] The cutter assembly 5 includes a cutter seat, a cutting blade rotatably arranged on the cutter seat, and a motor fixedly installed on the cutter seat. The motor is connected to the cutting blade to drive the cutting blade to rotate and perform a cutting operation on the wafer workpiece. A water spray block is arranged at the bottom of the cutter seat, and the cutting blade moves through the water spray block. The water spray block is arranged to cool the cutting blade.

[0061] Specifically, in actual use, the wafer carrier 8 is placed on the turntable 6 from top to bottom by the material taking robot, so that each plug-in arm 811 is inserted into the slot 672 one by one to complete the placement of the wafer carrier 8, and then the first displacement mechanism 2 drives the turntable 6 to move to the bottom of the industrial camera 7, the industrial camera 7 takes a picture of the wafer workpiece, detects the contour line of the wafer workpiece, and obtains the cutting path trajectory of the wafer workpiece, and then the first displacement mechanism 2 drives the turntable 6 to move to the bottom of the cutter assembly 5, and then the second displacement mechanism 3 and the third displacement mechanism 4 cooperate to drive the cutter assembly 5 to move, cut the wafer workpiece, so that the wafer workpiece is divided into a plurality of chips, and the cutting path cross-section between each chip is rectangular;

[0062] After the wafer workpiece is cut, the turntable 6 is started to rotate centrifugally, and air is pumped into the first air channel 61 through the air pump 62, so that the UV tape film 82 expands outward, thereby increasing the spacing between each chip and making the cutting path into an inverted trapezoid. By increasing the spacing and changing the shape of the cutting path, the residual cutting debris during cleaning is reduced. At the same time, the control valve 66 controls the first air channel 61 to be connected with each second air channel 65 in turn, so that the part of the UV tape film 82 corresponding to the air cavity 83 is expanded and stretched, so that the axis of the wafer workpiece deviates from the axis of the turntable 6, thereby changing the centrifugal force at the axis of the wafer workpiece. In this way, by connecting the first air channel 61 with each second air channel 65 in turn, the part of the UV tape film 82 corresponding to each air cavity 83 is expanded and stretched, thereby enhancing the strength of centrifugal cleaning and reducing cleaning dead corners, making it easier to clean cutting debris, thereby improving cleaning efficiency and product yield.

[0063] The above is only a preferred embodiment of the present invention. Therefore, any equivalent changes or modifications made according to the structure, characteristics and principles described in the scope of the patent application of the present invention are included in the protection scope of the patent application of the present invention.

Claims

1. A wafer fixing device for a cutting machine, characterized in that: Includes a turntable and a wafer carrier; A first air channel is provided at the center of the turntable; a perforated plate is provided at the top of the turntable, and an air chamber connected to the first air channel is formed between the perforated plate and the turntable; a plurality of second air channels are provided in the turntable along the circumferential direction; a control valve for connecting the first air channel with each of the second air channels is provided between the first air channel and the plurality of second air channels; and a support platform is provided on the turntable; The wafer carrier comprises a tension ring arranged on a support platform and a UV adhesive tape film arranged on the tension ring; the UV adhesive tape film is provided with a plurality of air cavities corresponding to each other and communicating with a plurality of second air passages along the circumferential direction.

2. A wafer fixing device for a cutting machine according to claim 1, characterized in that: Multiple second air channels are evenly distributed with the first air channel as the center; the support platform is respectively provided with a third air channel corresponding to each air cavity, and the second air channel is connected with the corresponding air cavity through the third air channel, and the second air channel is connected with the corresponding air cavity through the third air channel.

3. The wafer fixing device for a cutting machine according to claim 1, characterized in that: A connecting valve is slidably provided in each second air channel, and a connecting hole connected to the second air channel is penetrated by the connecting valve, and a tension spring is provided between the connecting valve and the turntable; when the turntable rotates, the connecting valve slides outward under the action of centrifugation to overcome the tension of the tension spring, so that the connecting hole can be connected with the third air channel.

4. The wafer fixing device for a cutting machine according to claim 3, characterized in that: The support platform is provided with a slot communicating with the third airway and a first profile hole communicating with the slot at a position corresponding to each connecting valve; the connecting valve is provided with a profile surface; the slot is provided with a one-way valve between the profile hole and the third airway; A plug-in arm is provided corresponding to each slot of the tension ring, and a second profile hole and a first avoidance hole and a second avoidance hole distributed on both sides of the second profile hole and connected with the second profile hole are provided on the plug-in arm, and the first avoidance hole runs through the end of the plug-in arm and is used to avoid the one-way valve; when the plug-in arm is inserted into the slot, the second profile hole is coaxial with the first profile hole, and a connecting groove connected with the third airway is formed between the slot, the first profile hole, the second profile hole, the first avoidance hole and the second avoidance hole; the one-way valve is located in the connecting groove; when the connecting valve slides outward, the profile surface cooperates with the profile surface of the first profile hole and the second profile hole.

5. The wafer fixing device for a cutting machine according to claim 4, characterized in that: The turntable is provided with an annular groove, the support platform is lifted and lowered in the annular groove, and a second spring is connected between the support platform and the turntable; The side wall of the annular groove is provided with a locking block, the locking block is provided with a locking groove, the tension ring is provided with an elastic claw, and the elastic claw cooperates with the locking groove to unlockably lock the tension ring.

6. The wafer fixing device for a cutting machine according to claim 5, characterized in that: The locking groove includes a first vertical groove, a first inclined groove, a second vertical groove, a second inclined groove, a third inclined groove, a third vertical groove and a fourth inclined groove which are connected in sequence; one end of the first vertical groove passes through the locking block; the second inclined groove and the third inclined groove are connected in a V shape and form a locking position; the locking position is on the side of the first vertical groove close to the second vertical groove; a step is provided between the fourth inclined groove and the first vertical groove, and a transition inclined surface is provided in the fourth inclined groove.

7. The wafer fixing device for a cutting machine according to claim 5, characterized in that: A plurality of second springs are evenly distributed in the annular groove along the circumferential direction.

8. The wafer fixing device for a cutting machine according to claim 5, characterized in that: The side wall of the annular groove is evenly distributed with a plurality of locking blocks along the circumferential direction, and the tension ring is evenly distributed with a plurality of elastic claws along the circumferential direction.

9. The wafer fixing device for a cutting machine according to claim 4, characterized in that: The one-way valve includes a one-way valve plate and a connecting shaft. The one-way valve plate is arranged on the connecting shaft. Both ends of the connecting shaft are rotatably connected to the support platform. Torsion springs are respectively arranged between the two ends of the connecting shaft and the support platform; the torsion spring causes the one-way valve plate to close the connecting groove.

10. The wafer fixing device for a cutting machine according to claim 1, characterized in that: The wafer fixing device also includes a frame, a first displacement mechanism arranged at the bottom of the frame, a second displacement mechanism arranged at the top of the frame, a third displacement mechanism arranged at the output end of the second displacement mechanism, and a cutter assembly arranged on the output end of the third displacement mechanism; a turntable is arranged at the output end of the first displacement mechanism, the first displacement mechanism is used to drive the turntable to move along the first direction; the second displacement mechanism is used to drive the cutter assembly to move along the second direction, and the third displacement mechanism is used to drive the cutter assembly to move along the third direction; an industrial camera is also arranged on the top of the frame.

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