A low-electrical-loss copper-surface bonding compound, its preparation method and application

By chemically bonding polythiourea molecules with a nitrogen-azole structure to a copper surface bonding agent, the problem that existing PCB copper surface treatment methods cannot meet the requirements of high-frequency signal transmission is solved, achieving a copper surface treatment effect with low power loss and environmental friendliness.

CN120058623BActive Publication Date: 2025-12-02上海富柏化工有限公司 +2
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Patent Information

Application Number
CN202510196200.7
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2025-02-21
Publication Date
2025-12-02
Estimated Expiration
2045-02-21

AI Technical Summary

Technical Problem

Existing PCB copper surface treatment methods cannot meet the requirements of high-frequency signal transmission, and have problems such as high cost, complex process and large signal attenuation due to current eddy currents.

Method used

A low-electric-loss copper-surface bonding compound is used to form a stable chemical bond between the copper surface and the dry film through a nitrile-structured polythiourea molecule. The preparation method includes reacting the compound in dehydrated chloroform and washing the organic phase. The resulting compound is used in the copper-surface bonding agent.

Benefits of technology

It achieves a stable bond between the copper surface and the dry film, reduces electrical losses during signal transmission, improves the electrical performance of the PCB, reduces production costs and environmental pollution, and is suitable for high-frequency signal transmission.

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Abstract

This application relates to the field of printed circuit board processing technology, and more specifically, to a low-electrical-loss copper bonding compound, its preparation method, and its application. The compound has the following structural formula: a polythiourea molecule with a nitrazole structure, wherein the degree of polymerization n is 3-10. This application benefits from the compound's special structure (C=S and -NH2), effectively achieving bonding under copper-free etching conditions, and the smooth copper surface meets the requirements for high-frequency signal transmission.
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