Diode packaging structure convenient for chip packaging and photovoltaic junction box

Abstract

The invention relates to the technical field of chip packaging, and discloses a diode packaging structure facilitating chip packaging and a photovoltaic junction box.The structure comprises a copper-clad plate, the top of the copper-clad plate is fixedly connected with one or more chip bodies, the right side of the top of the copper-clad plate is fixedly connected with soldering tin, and the left side of the top of the copper-clad plate is provided with a connecting port; four positioning holes are formed in the surface of the copper-clad plate, two rectangular grooves are formed in the surface of the copper-clad plate, and a cable is fixedly connected to the left side of the copper-clad plate. The chip body is packaged through resin pouring, the mold manufacturing cost required by traditional packaging is omitted, the overall production cost is greatly reduced, the resin pouring can be accurately allocated according to the characteristics of the chip and is highly matched with the thermal expansion coefficient of the chip, the packaging stress is greatly reduced, and the packaging efficiency is improved. The conditions of welding spot cracking and internal structure damage caused by stress problems in the packaging process and subsequent use of the chip are effectively avoided, and the damage risk of the chip is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of chip packaging, and specifically to a diode packaging structure and a photovoltaic junction box that are convenient for chip packaging. Background Art

[0002] Diode packaging structures play a crucial role in today's photovoltaic field. They are widely used in photovoltaic power generation systems. Their core purpose is to create more favorable conditions and environments for chip packaging. As an indispensable and important part of photovoltaic junction boxes, they shoulder the key responsibilities of realizing precise circuit connection and effectively ensuring the stable and continuous transmission of current. Moreover, they can also exert an effective protective effect on photovoltaic modules. With their excellent performance and design, they can calmly cope with various complex and changeable environments and operating conditions. Through their outstanding performance, they effectively ensure that the entire photovoltaic power generation system can operate stably and efficiently for a long time, providing a solid and reliable strong support for the effective conversion and full utilization of energy, and promoting the continuous development and wide application of photovoltaic power generation technology.

[0003] Traditional diode packaging structures use molds to package chips. The production of molds requires professional technology and equipment, and the cost is high. In addition, the molds are worn during use and need to be replaced regularly, which increases the long-term production cost. In large-scale production, the investment and maintenance costs of the molds will significantly increase the product cost and reduce the profit margin of enterprises. Summary of the Invention

[0004] In view of the deficiencies of the prior art, the present invention provides a diode packaging structure and a photovoltaic junction box that are convenient for chip packaging, and solves the problem that the existing diodes are packaged with molds, resulting in high costs and increased costs.

[0005] To achieve the above objectives, the present invention is realized through the following technical solutions: A diode packaging structure that is convenient for chip packaging includes a copper clad laminate. One or more chip bodies are fixedly connected to the top of the copper clad laminate. Solder is fixedly connected to the right side of the top of the copper clad laminate. A connection port is provided on the left side of the top of the copper clad laminate. Four positioning holes are opened on the surface of the copper clad laminate. Two rectangular grooves are opened on the surface of the copper clad laminate. A cable is fixedly connected to the left side of the copper clad laminate.

[0006] Preferably, an insulating layer and a conductive layer are provided on the surface of the copper clad laminate. The chip body is installed on the conductive layer, and the chip body is encapsulated on the top of the copper clad laminate with resin.

[0007] Preferably, the length of the rectangular groove is 8 MM, and the rectangular groove can be passed through by a ribbon.

[0008] Preferably, an outer shell is provided outside the copper clad laminate. A terminal base station is provided inside the outer shell. Four positioning columns are fixedly connected to the top of the terminal base station. All four positioning columns are located inside adjacent positioning holes. Four connecting blocks are fixedly connected to the top of the terminal base station. A cover plate is provided on the top of the outer shell. A fixing component is provided on the top of the outer shell. The fixing component is used to fix the cover plate.

[0009] Preferably, the fixing component includes a positioning block which is fixedly connected to the outer shell. A locking block is fixedly connected to the right side of the top of the outer shell. A positioning groove is formed on the left side of the cover plate. A slot is formed on the right side of the cover plate.

[0010] Preferably, two supporting members are fixedly connected to the left inner wall of the outer shell. Two supporting rods are fixedly connected to the right inner wall of the outer shell.

[0011] Preferably, a fixing block is provided on the left side of the outer shell. The fixing block is slidably connected to the outer shell.

[0012] Preferably, the outer shell is filled with silicone potting glue. The filling volume inside the outer shell is 7ML.

[0013] Preferably, the outer shell is made of reinforced nylon material. Three diodes can be accommodated inside the outer shell.

[0014] The usage method of the photovoltaic junction box includes the following steps: S1. Apply silicone to the bottom edge of the outer shell, and then insert the oxygen bar into the corresponding area of the backplane of the photovoltaic panel; S2. Insert the ribbon into the rectangular groove on the copper clad laminate to fix it firmly, and then bend the ribbon to the welding surface of the conductor; S3. Immerse the outer shell into the silicone potting glue until it covers the ribbon and the conductor; S4. Place the cover plate on the top of the outer shell after the potting material is cured. Slide the positioning block on the cover plate to the left and insert it into the positioning groove; S5. Press the right side of the cover plate and slowly move it downward. Insert the locking block into the slot to fix the cover plate.

[0015] Working principle: When in use, the user first applies silicone to the bottom edge of the outer shell, then inserts the oxygen bar into the corresponding area of the backplane of the photovoltaic panel, and then inserts the ribbon into the rectangular groove on the copper clad laminate to firmly fix it. After that, the ribbon is bent to the soldering surface of the conductor, and then the outer shell is immersed in silicone potting compound until it covers the ribbon and the conductor. After the potting material cures, the copper clad laminate with the chip body is accurately docked with the positioning posts on the terminal base station through the positioning holes on its surface. During this process, the connecting block fully plays an auxiliary and stabilizing role. After the docking is completed, the whole is placed inside the outer shell. Next, place the cover plate on the top of the outer shell, slide it to the left so that the positioning block inserts into the positioning groove for preliminary fixation, and then press the right side of the cover plate and slowly move it downward so that the locking block on the right side of the top of the outer shell inserts into the slot on the right side of the cover plate, thus firmly fixing the cover plate.

[0016] The current is transmitted to the copper clad laminate through the cable. The copper clad laminate, with good electrical conductivity, guides the current to the chip body. The chip body performs photoelectric conversion to achieve power processing. The insulating layer on the surface of the copper clad laminate ensures electrical isolation and prevents dangerous situations such as electric leakage. The conductive layer facilitates the chip body to be externally connected with pins through soldering, optimizes electrical connection, reduces signal interference, and improves the current transmission efficiency. The two support members on the left inner wall and the two support rods on the right inner wall of the outer shell provide support points for the cover plate, enhancing the overall structural stability and ensuring that the cover plate remains horizontal after installation. The fixing block on the left side of the outer shell can better fix the cable. The silicone potting compound filled inside the outer shell exhibits good insulation performance, preventing short circuits of circuit components. Its excellent sealing performance effectively blocks the entry of dust and moisture, avoiding damage to components due to moisture. At the same time, it has a certain shock absorption and buffering effect, protecting internal components from vibration impact, and also helping internal components dissipate heat, improving the working stability and service life of components.

[0017] The enhanced nylon material used for the outer shell has high strength and toughness, effectively protecting the internal diodes from external impact. Good wear resistance prevents the outer shell from being scratched. Excellent insulation performance avoids short circuits between diodes and with other components, ensuring the safe and stable operation of the circuit. Its corrosion resistance adapts to different working environments. The design that can accommodate three diodes facilitates the realization of specific circuit functions, is conducive to the compact layout of the circuit, improves space utilization, and is convenient for the overall circuit design and assembly, ultimately ensuring the stable operation of the entire photovoltaic junction box and meeting the usage requirements.

[0018] The present invention provides a diode packaging structure and a photovoltaic junction box that are convenient for chip packaging. It has the following beneficial effects: 1. In the present invention, the chip body is encapsulated by resin pouring, eliminating the mold manufacturing cost required for traditional encapsulation, greatly reducing the overall production cost. The resin pouring can be precisely formulated according to the chip characteristics, highly matching the thermal expansion coefficient of the chip, greatly reducing the encapsulation stress, effectively avoiding the situation of solder joint cracking and internal structure damage due to stress problems during the encapsulation process and subsequent use of the chip, reducing the risk of chip damage, and significantly improving the yield rate of the product.

[0019] 2. In the present invention, by using a copper clad laminate as the diode base material, which is internally composed of an alternating composite of a copper foil layer with high thermal conductivity and an insulating layer. The copper foil layer can quickly absorb the heat generated by the diode chip and conduct it rapidly in a large area around. With the help of external auxiliary heat dissipation measures, the heat can be efficiently dissipated into the surrounding environment, ensuring that the diode can maintain an appropriate temperature range during operation. The surface of the copper clad laminate has high flatness, and the chip can be evenly stressed after installation, and the stress received is evenly dispersed.

[0020] 3. In the present invention, an insulating layer is attached to the surface of the copper clad laminate, and the conductive layer is reasonably laid according to actual needs. Such a design can not only effectively achieve electrical isolation, avoid problems such as short circuits between circuits, and ensure the safe and stable operation of the circuit, but also provide convenient conditions for the chip body to be externally connected with pins through the conductive layer. This connection method optimizes the electrical connection effect, reduces the interference of signals during transmission, significantly improves the efficiency of current transmission, and enables the entire circuit system to work more efficiently.

[0021] 4. In the present invention, the silicone potting compound has good electrical insulation properties, can prevent current leakage, and ensure circuit safety. It also has excellent high and low temperature resistance performance and can still maintain stable performance under extreme temperature conditions. At the same time, the silicone potting compound has good waterproof and moisture-proof performance, can effectively prevent moisture and moisture from invading, and protect internal components. In addition, it has a certain flexibility and can buffer external impacts. These characteristics can effectively protect the internal electronic components from the influence of external environmental factors, thereby improving the protection level of the photovoltaic junction box and enhancing the reliability of its operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 is a perspective view of the present invention; Figure 2 is a schematic diagram of the outer shell of the present invention; Figure 3 is a schematic diagram of the cover plate of the present invention; Figure 4 is a schematic diagram of the copper clad laminate of the present invention; Figure 5 is a schematic diagram of the slot of the present invention; Figure 6 is a schematic diagram of the connecting block of the present invention; Figure 7 Schematic diagram of the fixing block of the present invention; Figure 8 Schematic diagram of the cable of the present invention.

[0023] Wherein, 1, copper clad laminate; 2, chip body; 3, connection port; 4, solder; 5, positioning hole; 6, rectangular groove; 7, housing; 8, cover plate; 9, cable; 10, positioning block; 11, positioning groove; 12, locking block; 13, slot; 14, support member; 15, fixing block; 16, positioning post; 17, connection block; 18, terminal base station; 19, support rod. Specific embodiments

[0024] Next, the technical solutions of the present invention will be clearly and completely described in conjunction with the accompanying drawings of the specification. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without making creative efforts belong to the scope of protection of the present invention.

[0025] Please refer to the attached Figure 1 - attached Figure 3 , an embodiment of the present invention provides a diode packaging structure convenient for chip packaging, including a copper clad laminate 1, two chip bodies 2 are fixedly connected to the top of the copper clad laminate 1, a solder 4 is fixedly connected to the right side of the top of the copper clad laminate 1, a connection port 3 is arranged on the left side of the top of the copper clad laminate 1, four positioning holes 5 are formed on the surface of the copper clad laminate 1, two rectangular grooves 6 are formed on the surface of the copper clad laminate 1, and a cable 9 is fixedly connected to the left side of the copper clad laminate 1.

[0026] Specifically, when the user uses the device, first, the cable 9 needs to be connected to an external power source or electrical equipment. Subsequently, the current will be smoothly transmitted to the copper clad laminate 1 through the cable 9. The copper clad laminate 1, relying on its excellent electrical conductivity, guides the current to the chip body 2. After receiving the current, the chip body 2 immediately performs corresponding optoelectronic conversion work, thereby realizing the processing of electrical energy. The insulating layer provided on the surface of the copper clad laminate 1 can ensure electrical isolation and effectively prevent dangerous situations such as electric leakage. Its conductive layer facilitates the external connection of the chip body 2 by soldering pins through the solder 4. This design optimizes the electrical connection, reduces signal interference, and improves the current transmission efficiency. In addition, the four positioning holes 5 on the copper clad laminate 1 can be docked with the positioning posts 16 to ensure the stability of the installation. At the same time, the two rectangular grooves 6 can allow ribbons to pass through, which can play a role in assisting the fixation of wire components and ensure the stable and reliable operation of the photovoltaic junction box.

[0027] Refer to the attached Figure 1 , an insulating layer and a conductive layer are provided on the surface of the copper clad laminate 1, the chip body 2 is installed on the conductive layer, and the chip body 2 is encapsulated on the top of the copper clad laminate 1 by resin.

[0028] Specifically, the insulating layer provided on the surface of the copper clad laminate 1 serves to block the current, thereby achieving electrical isolation and effectively preventing short circuits. This ensures that each part of the circuit can work independently without interference from each other. The conductive layer provided on the surface of the copper clad laminate 1 facilitates the installation of the chip body 2. The principle lies in constructing a good electrical connection channel, which enables the chip body 2 to be externally connected with welding pins through the conductive layer, thus smoothly realizing signal transmission and current conduction, and ensuring the transmission of information and energy in the circuit.

[0029] Two chip bodies 2 are resin-encapsulated on the top of the copper clad laminate 1. The resin wrapping plays a role in fixing and protecting the chip body 2. This encapsulation method can save mold costs without the need for complex and expensive molds; simplifies the production process, reduces unnecessary production links and operation steps; improves production efficiency and speeds up the output speed of products. At the same time, it can also reduce the encapsulation stress, reduce the pressure on the chip body 2, thereby reducing the risk of chip damage and improving the product quality. In addition, the resin encapsulation can effectively block moisture and dust in the external environment, creating a relatively stable and clean working environment for the chip body 2, ensuring the stable operation of the chip body 2 and extending the service life of the chip.

[0030] Refer to the appendix Figure 1 , the length of the rectangular groove 6 is 8 MM, and the rectangular groove 6 can be passed through by a ribbon.

[0031] Specifically, the length of the rectangular groove 6 is 8 MM. Such a length can provide a passing space for the ribbon, ensuring that the ribbon can pass through the rectangular groove 6 without getting stuck due to overly narrow space, facilitating the operation of tying with the ribbon.

[0032] Refer to the appendix Figure 3 , appendix Figure 4 and appendix Figure 8 , an outer shell 7 is provided outside the copper clad laminate 1. A terminal base station 18 is provided inside the outer shell 7. Four positioning posts 16 are fixedly connected to the top of the terminal base station 18. All four positioning posts 16 are located inside adjacent positioning holes 5. Four connection blocks 17 are fixedly connected to the top of the terminal base station 18. A cover plate 8 is provided on the top of the outer shell 7. A fixing component is provided on the top of the outer shell 7 for fixing the cover plate 8.

[0033] Specifically, when the user is ready to use, first, the copper clad laminate 1 with the chip body 2 is precisely docked with the positioning posts 16 on the terminal base station 18 through the positioning holes 5 carefully set on its surface. This operation can ensure precise internal electrical connection. During this process, the connecting block 17 fully plays its auxiliary role and firmly stabilizes the entire structure. Immediately afterwards, the completed docked unit is carefully placed inside the housing 7, the cover plate 8 is smoothly placed on the top of the housing 7, and the cover plate 8 is firmly and tightly fixed, further enhancing the overall sealing performance, ensuring that the entire photovoltaic junction box can operate stably in various complex and changeable environments, and allowing the current to be transmitted through the copper clad laminate 1.

[0034] Refer to the appendix Figure 4 and the appendix Figure 5 , the fixing component includes a positioning block 10, and the positioning block 10 is fixedly connected to the housing 7. A locking block 12 is fixedly connected to the right side of the top of the housing 7. A positioning groove 11 is opened on the left side of the cover plate 8, and a slot 13 is opened on the right side of the cover plate 8.

[0035] Specifically, when the user installs the cover plate 8, first, the left side of the cover plate 8 needs to be aligned with the housing 7, and the positioning block 10 is inserted into the positioning groove 11 provided on the left side of the cover plate 8 to initially fix the position of the cover plate 8. The user presses the right side of the cover plate 8 to cause the locking block 12 on the right side of the top of the housing 7 to move down along the slot 13 on the right side of the cover plate 8 until the locking block 12 is inserted into the slot 13. Through the cooperation between the positioning block 10 and the positioning groove 11 and between the locking block 12 and the slot 13, the cover plate 8 is fixed to the top of the housing 7, ensuring the sealing performance inside the housing 7.

[0036] Refer to the appendix Figure 5 , two support members 14 are fixedly connected to the left inner wall of the housing 7, and two support rods 19 are fixedly connected to the right inner wall of the housing 7.

[0037] Specifically, the two support members 14 on the left inner wall of the housing 7 and the two support rods 19 on the right inner wall are used to provide effective support points for the cover plate 8, thereby enhancing the stability of the overall structure. This can ensure that the cover plate 8 remains horizontal after installation, preventing the cover plate 8 from falling into the housing 7 due to its own gravity or external forces.

[0038] Refer to the appendix Figure 7 , a fixing block 15 is provided on the left side of the housing 7, and the fixing block 15 is slidably connected to the housing 7.

[0039] Specifically, the surface of the housing 7 opposite to the fixing block 15 is provided with a groove adapted to the shape of the cable 9. This groove can better fit the contour of the cable 9, and then firmly clamp and fix the cable 9. This is beneficial to ensuring the stability of the position of the cable 9 and preventing it from loosening or shifting.

[0040] Refer to the appendix Figure 3 , the inside of the housing 7 is filled with silicone potting compound, and the filling volume inside the housing 7 is 7 ML.

[0041] Specifically, the silicone potting compound has good insulation performance, which can prevent the circuit components inside the housing 7 from short - circuiting. It also has excellent sealing performance, which can effectively block dust and moisture from entering the inside of the housing 7, thus avoiding component damage due to moisture. At the same time, the silicone potting compound has a shock - absorbing and buffering effect, which can protect the internal components from vibration and shock. In addition, it can help the internal components dissipate the heat generated during operation, thereby improving the working stability and service life of the components. The filling volume of 7 ML can ensure full filling of the internal space of the housing 7, give full play to the above - mentioned functions, and at the same time avoid waste caused by excessive potting compound or excessive pressure on the internal components.

[0042] Refer to the appendix Figure 3 , the housing 7 is made of reinforced nylon material, and three diodes can be accommodated inside the housing 7.

[0043] Specifically, the reinforced nylon material has high strength and toughness, which can protect the three internal diodes from damage due to external force impact. Its good wear - resistance can prevent the housing 7 from being scratched during use, extending the service life of the housing. Reinforced nylon also has excellent insulation performance, which can avoid short - circuiting between the three diodes and with other components, ensuring the safe and stable operation of the circuit. At the same time, the corrosion - resistance of this material can adapt to different working environments. The design that can accommodate three diodes enables the housing 7 to provide a suitable installation space for the three diodes, facilitating their integration together to achieve specific circuit functions, which is conducive to the compact layout of the circuit, improving space utilization rate, and facilitating the design and assembly of the overall circuit.

[0044] A diode packaging structure for facilitating chip packaging and a usage method of a photovoltaic junction box, including the following steps: S1. Apply silicone on the bottom edge of the housing 7, and then insert the oxygen rod into the corresponding area of the photovoltaic panel backplane; S2. Insert the ribbon into the rectangular groove 6 on the copper - clad laminate 1 to fix it firmly, and then bend the ribbon to the welding surface of the conductor; S3. Immerse the housing 7 into the silicone potting compound until it covers the ribbon and the conductor; S4. After the filling material is cured, place the cover plate 8 on the top of the housing 7, and insert the left - sliding positioning block 10 of the cover plate 8 into the positioning groove 11; S5. Press the right side of the cover plate 8 and slowly move it downward, and insert the locking block 12 into the slot 13 to fix the cover plate 8.

[0045] Although embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A diode packaging structure for facilitating chip packaging, comprising a copper clad plate (1), characterized in that: One or more chip bodies (2) are fixedly connected to the top of the copper clad board (1), solder (4) is fixedly connected to the right side of the top of the copper clad board (1), a connection port (3) is provided on the left side of the top of the copper clad board (1), four positioning holes (5) are provided on the surface of the copper clad board (1), two rectangular grooves (6) are provided on the surface of the copper clad board (1), and a cable (9) is fixedly connected to the left side of the copper clad board (1).

2. A diode packaging structure for facilitating chip packaging according to claim 1, characterized in that: An insulating layer and a conductive layer are provided on the surface of the copper clad laminate (1); the chip body (2) is mounted on the conductive layer; and the chip body (2) is encapsulated on the top of the copper clad laminate (1) by resin.

3. The diode packaging structure for facilitating chip packaging according to claim 1, characterized in that: The rectangular groove (6) is 8 mm long and can allow a ribbon to pass through.

4. A photovoltaic junction box, comprising a diode packaging structure for facilitating chip packaging as described in claim 1 or 2, wherein a housing (7) is provided outside the diode packaging structure, characterized in that: A terminal base station (18) is arranged inside the shell (7), four positioning columns (16) are fixedly connected to the top of the terminal base station (18), the four positioning columns (16) are all located inside adjacent positioning holes (5), four connecting blocks (17) are fixedly connected to the top of the terminal base station (18), a cover plate (8) is arranged on the top of the shell (7), and a fixing component is arranged on the top of the shell (7), the fixing component is used to fix the cover plate (8).

5. The photovoltaic junction box according to claim 4, characterized in that: The fixing assembly comprises a positioning block (10), the positioning block (10) being fixedly connected to the housing (7), a locking block (12) being fixedly connected to the right side of the top of the housing (7), a positioning groove (11) being provided on the left side of the cover plate (8), and a slot (13) being provided on the right side of the cover plate (8).

6. The photovoltaic junction box according to claim 4, characterized in that: Two support members (14) are fixedly connected to the left side of the inner wall of the shell (7), and two support rods (19) are fixedly connected to the right side of the inner wall of the shell (7).

7. The photovoltaic junction box according to claim 4, characterized in that: A fixing block (15) is provided on the left side of the outer shell (7), and the fixing block (15) is slidably connected to the outer shell (7).

8. The photovoltaic junction box according to claim 4, characterized in that: The shell (7) is filled with organic silicon potting glue, and the filling volume of the shell (7) is 7 ml.

9. The photovoltaic junction box according to claim 4, characterized in that: The shell (7) is made of reinforced nylon material, and three diodes can be accommodated in the shell (7).

10. A method for using a photovoltaic junction box, characterized in that: The photovoltaic junction box according to any one of claims 4 to 9 comprises the following steps: S1, apply silica gel on the bottom edge of the housing (7), and then insert the oxygen rod into the corresponding area of ​​the photovoltaic panel back plate; S2, insert the ribbon into the rectangular groove (6) on the copper clad plate (1) to fix it firmly, and then bend the ribbon to the welding surface of the conductor; S3, immersing the housing (7) in the silicone potting adhesive until it covers the strip and the conductor; S4. After the filling material is solidified, the cover plate (8) is placed on the top of the housing (7), and the cover plate (8) is slid to the left and the positioning block (10) is inserted into the positioning groove (11); S5. Press the right side of the cover plate (8) and slowly move it downward, and insert the locking block (12) into the slot (13) to fix the cover plate (8).

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