Intelligent wiring optimization method and system for HDI circuit board

Abstract

The invention discloses an intelligent wiring optimization method and system for an HDI circuit board, and relates to the technical field of electronic circuit optimizing.According to the intelligent wiring optimization method and system for the HDI circuit board, by arranging an electromagnetic compatibility monitoring module and a thermal management evaluation module, the electromagnetic interference index Em and the thermal aggregation index Thc of the HDI circuit board are monitored in real time and evaluated; an optimization early warning signal is triggered and a thermal management optimization suggestion is generated, so that the problems of electromagnetic interference and insufficient heat dissipation are accurately solved; by calculating and evaluating a comprehensive optimization index COP, the electromagnetic shielding and heat distribution balancing capability is improved; and finally, by calculating and evaluating an optimization performance evaluation coefficient OPE, a dynamic adjustment module adjusts wiring parameters and optimizes a path in real time, iterative optimization is performed in combination with a real-time feedback mechanism, and finally a wiring scheme meeting requirements is output, so that the problems of low automation degree and poor optimization effect of an existing system are solved, and the system is suitable for popularization and application. And the requirement of wearable equipment on high performance of the HDI circuit board is met.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic circuit optimization, and particularly to an intelligent wiring optimization method and system for an HDI circuit board. Background Art

[0002] The HDI circuit board is an advanced printed circuit board technology developed in response to the requirements of thinning and miniaturization of electronic products. Its origin can be traced back to the 1990s and was first applied to consumer electronics fields such as mobile phones and tablet computers. Through the design of micro-vias, fine lines, and high layer counts, the circuit density and performance have been improved. With the continuous progress of technology, the HDI circuit board has gradually been applied to high-end fields such as automotive electronics, medical devices, and wearable devices, and the complexity of its wiring has also increased significantly. In order to address issues such as signal integrity, electromagnetic compatibility, and thermal management in multi-layer wiring, a wiring optimization system has emerged. This type of system combines computer-aided design and intelligent algorithms to maximize resource utilization and improve performance through precise path planning and wiring parameter optimization. The development of wiring optimization technology has promoted the wide application of HDI circuit boards in high-performance and high-reliability electronic devices.

[0003] However, the wiring optimization system for HDI circuit boards applied to wearable devices often has the following technical drawbacks: Insufficient electromagnetic compatibility: Wearable devices usually need to operate in various wireless communication environments. The existing wiring optimization systems have limited optimization capabilities in electromagnetic shielding and noise suppression design, which may lead to electromagnetic interference problems. Lack of thermal management ability: The high integration of wearable devices brings a higher power density, and the existing optimization systems do not fully consider the optimized design of heat dissipation paths during wiring, which may lead to overheating problems when the device is used for a long time. Lack of intelligent support: The existing wiring optimization systems have a low degree of automation under complex constraint conditions and fail to effectively utilize machine learning or intelligent algorithms for wiring path planning and dynamic adjustment, resulting in poor overall optimization effects. Summary of the Invention

[0004] In view of the deficiencies of the prior art, the present invention provides an intelligent wiring optimization method and system for an HDI circuit board, which solves the technical drawbacks mentioned in the background art.

[0005] To achieve the above objectives, the present invention is realized through the following technical solutions: An intelligent wiring optimization system for an HDI circuit board includes an electromagnetic compatibility monitoring module, a thermal management evaluation module, an intelligent wiring planning module, a comprehensive optimization analysis module, and a dynamic adjustment module. The electromagnetic compatibility monitoring module is used to monitor in real time the data related to electromagnetic interference generated during the operation of the HDI circuit board, and calculate the electromagnetic interference index Em; and compare and analyze the electromagnetic interference index Em with the preset electromagnetic interference threshold EMth, and finally trigger an electromagnetic compatibility optimization warning signal; The thermal management evaluation module is used to collect the data related to the temperature distribution in the high-power consumption area of the circuit board, and calculate the heat aggregation index Thc; by comparing and evaluating the heat aggregation index Thc, judge whether the thermal management ability in the circuit board wiring design meets the requirements, and generate thermal management optimization suggestions; The intelligent wiring planning module uses machine learning algorithms, takes the data related to electromagnetic interference and the data related to temperature distribution as features, and generates a multi-objective wiring scheme through a dynamic path planning method, and finally calculates the comprehensive optimization index COP of the multi-objective wiring scheme; The comprehensive optimization analysis module is based on the electromagnetic interference index Em, the heat aggregation index Thc and the comprehensive optimization index COP, combines the physical constraints and performance requirements of the circuit board design, calculates and evaluates the optimization performance evaluation coefficient OPE, and finally outputs the comprehensive optimization result, including the qualified optimization result and the unqualified optimization result; The dynamic adjustment module dynamically adjusts the wiring parameters and the line direction based on the unqualified optimization result, and at the same time establishes and updates the wiring planning result through a real-time feedback mechanism.

[0006] Preferably, the electromagnetic compatibility monitoring module includes an electromagnetic interference calculation unit and an electromagnetic interference evaluation unit; The electromagnetic interference calculation unit is used to collect in real time the data related to electromagnetic interference generated during the operation of the HDI circuit board; by collecting the radiation interference signal and the conduction interference signal and converting them into digital forms during the operation of the circuit board itself, then performing spectrum analysis and time-domain decomposition, and then extracting key characteristic parameters and performing dimensionless processing, including the signal frequency band intensity Sfi, the instantaneous peak amplitude Spk, the pulse repetition frequency Prf, and the total interference power Tip, and finally calculating and obtaining the electromagnetic interference index Em based on the following formula;

[0007] Preferably, the electromagnetic interference evaluation unit is used to preset the electromagnetic interference threshold EMth, and compare and evaluate it with the electromagnetic interference index Em, and trigger and generate an electromagnetic compatibility optimization warning signal, and the specific content is as follows: When the electromagnetic interference index Em ≤ the electromagnetic interference threshold EMth: it means that the electromagnetic interference of the HDI circuit board is within the safe range, and no additional optimization measures are required; When the electromagnetic interference index Em > the electromagnetic interference threshold EMth: It indicates that the electromagnetic interference of the HDI circuit board exceeds the safe range, affecting the normal operation of the device or causing interference to communication signals. At this time, an electromagnetic compatibility optimization warning signal is generated.

[0008] Preferably, the thermal management evaluation module includes a heat aggregation calculation unit and a heat aggregation evaluation unit; The heat aggregation calculation unit is used to collect data related to the temperature distribution in the high-power consumption areas on the HDI circuit board in real time. Through the multi-point temperature sensors arranged in the high-power consumption areas of the HDI circuit board, the temperature of each key area is collected in real time by the array. Then, the spatial distribution information of the temperature is recorded by using the sensor array. Secondly, the change trend of the temperature over time during the operation of the circuit board is recorded. Finally, after the collected data related to the temperature distribution is smoothed, denoised, and dimensionless processed, the heat aggregation index Thc is calculated through the following formula:

[0009] In the formula, Tmax represents the highest temperature of the hot spot in the data related to the temperature distribution, Tavg represents the average temperature in the data related to the temperature distribution, Tgra represents the temperature gradient in the data related to the temperature distribution, and Tva represents the thermal fluctuation amplitude in the data related to the temperature distribution; ln represents the natural logarithm, that is, the logarithmic function with the mathematical constant e as the base.

[0010] Preferably, the heat aggregation evaluation unit is used to preset a heat dissipation balance threshold THCth and compare it with the heat aggregation index Thc for evaluation. The specific evaluation content is as follows: When the heat aggregation index Thc ≤ the heat dissipation balance threshold THCth: It indicates that the thermal management ability of the circuit board meets the design requirements and no additional adjustment is required; When the heat aggregation index Thc > the heat dissipation balance threshold THCth: It indicates that the thermal management ability of the circuit board does not meet the design requirements, resulting in local overheating of the device. At this time, thermal management optimization suggestions are generated, including adjusting the wiring path, replacing the heat dissipation material, and adjusting the structural heat dissipation.

[0011] Preferably, the intelligent wiring planning module is used to integrate electromagnetic interference-related data and temperature distribution-related data. Then, after normalizing the electromagnetic interference index Em and the heat aggregation index Thc, they are used as the main features for input. Secondly, based on the main feature input, a multi-objective wiring optimization model is generated using machine learning algorithms, including reinforcement learning algorithms. Then, through the dynamic path planning method, combined with the physical constraints of the circuit board design, the key wiring paths are optimized and adjusted in real time to generate a wiring scheme that meets the multi-objective optimization requirements. Finally, the electromagnetic interference suppression score EDs, the heat distribution balance score TBs, the wiring length optimization score PLs, and the resource utilization score RUs are obtained through the multi-objective wiring optimization model and then fitted to calculate and generate the comprehensive optimization index COP of the wiring scheme. The specific formula is as follows:

[0012] Preferably, the comprehensive optimization analysis module includes a comprehensive optimization calculation unit and a comprehensive optimization evaluation unit; The comprehensive optimization calculation unit is used to calculate the optimization performance evaluation coefficient OPE; by combining the physical constraints and performance requirements of the circuit board design, including the wiring density Dw and the number of vias Vh, and associating them with the electromagnetic interference index Em, the heat aggregation index Thc, and the comprehensive optimization index COP, the optimization performance evaluation coefficient OPE is calculated and obtained through the following formula:

[0013] Preferably, the comprehensive optimization evaluation unit is used to preset the optimization performance evaluation threshold OPEth, compare and evaluate the optimization performance evaluation coefficient OPE, analyze the optimization level of the wiring scheme, and finally output the comprehensive optimization result; the specific evaluation content is as follows: When the optimization performance evaluation coefficient OPE ≥ the optimization performance evaluation threshold OPEth, it is determined that the wiring scheme meets the optimization requirements, and the optimization qualified result is output; When the optimization performance evaluation coefficient OPE < the optimization performance evaluation threshold OPEth, it is determined that the wiring scheme does not meet the optimization requirements. At this time, targeted improvement suggestions are generated and the unqualified result is output.

[0014] Preferably, based on the optimized unqualified results, the dynamic adjustment module extracts relevant subordinate parameters including the electromagnetic interference index Em, the heat aggregation index Thc, the wiring density Dw, and the number of vias Vh, and analyzes the specific reasons for the insufficient optimization. Secondly, the wiring parameters are dynamically adjusted, including re-planning the wiring path, optimizing the wiring density distribution, and adjusting the via layout in high-power consumption areas. At the same time, a real-time feedback mechanism is established in combination with the reinforcement learning algorithm. After each adjustment, the optimization performance evaluation coefficient OPE is recalculated, and the adjustment plan is iteratively optimized. Finally, the updated wiring planning result is fed back to the comprehensive optimization analysis module for re-evaluation. If the evaluation result is an optimized qualified result, the final wiring plan is output to complete the dynamic adjustment process.

[0015] An intelligent wiring optimization method for an HDI circuit board includes the following steps: Step 1: Real-time monitor the electromagnetic interference-related data generated during the operation of the HDI circuit board, and calculate the electromagnetic interference index Em; compare and analyze the electromagnetic interference index Em with the preset electromagnetic interference threshold EMth, and finally trigger an electromagnetic compatibility optimization warning signal. Step 2: Collect the temperature distribution-related data in the high-power consumption area of the circuit board, and calculate the heat aggregation index Thc; judge whether the thermal management ability in the circuit board wiring design meets the requirements by comparing and evaluating the heat aggregation index Thc, and generate thermal management optimization suggestions. Step 3: Using the machine learning algorithm, taking the electromagnetic interference-related data and the temperature distribution-related data as features, generate a multi-objective wiring plan through the dynamic path planning method, and finally calculate the comprehensive optimization index COP of the multi-objective wiring plan. Step 4: Based on the electromagnetic interference index Em, the heat aggregation index Thc, and the comprehensive optimization index COP, combined with the physical constraints and performance requirements of the circuit board design, calculate and evaluate the optimization performance evaluation coefficient OPE, and finally output the comprehensive optimization result, including the optimized qualified result and the optimized unqualified result. Step 5: Based on the optimized unqualified results, dynamically adjust the wiring parameters and the circuit path, and at the same time establish and update the wiring planning result through a real-time feedback mechanism.

[0016] The present invention provides an intelligent wiring optimization method and system for an HDI circuit board. It has the following beneficial effects: (1)The intelligent wiring optimization method and system for an HDI circuit board monitor the electromagnetic interference-related data and temperature distribution-related data in the high-power consumption areas generated during the operation of the HDI circuit board in real time by setting up an electromagnetic compatibility monitoring module and a thermal management evaluation module, and calculate the electromagnetic interference index Em and the thermal aggregation index Thc. By comparing and evaluating with the preset electromagnetic interference threshold EMth and the heat dissipation balance threshold THCth, it can accurately identify the electromagnetic interference problems and insufficient heat dissipation problems that may be caused by the circuit board in various wireless communication environments. When Em exceeds EMth or Thc exceeds THCth, an electromagnetic compatibility optimization warning signal is triggered and a thermal management optimization suggestion is generated respectively, so as to provide a quantitative basis for electromagnetic interference suppression and thermal management performance optimization.

[0017] (2)The intelligent wiring optimization method and system for an HDI circuit board use a machine learning algorithm, including a reinforcement learning algorithm, in the intelligent wiring planning module. After normalizing the electromagnetic interference index Em and the thermal aggregation index Thc as the main features, combined with the physical constraint parameters (wiring density Dw and via number Vh) and performance requirements (such as electromagnetic compatibility and thermal management efficiency) of the circuit board design, a multi-objective wiring optimization model is generated. The key wiring paths are optimized in real time through a dynamic path planning method to generate a wiring scheme that meets the multi-objective optimization requirements. The comprehensive optimization index COP is calculated by combining the electromagnetic interference suppression score EDs, the thermal distribution balance score TBs, the wiring length optimization score PLs and the resource utilization score RUs to ensure that the wiring scheme achieves the best effect in terms of electromagnetic shielding and thermal distribution balance.

[0018] (3)The intelligent wiring optimization method and system for an HDI circuit board calculate the optimization performance evaluation coefficient OPE through the comprehensive optimization analysis module. Based on the comprehensive optimization index COP, the electromagnetic interference index Em, the thermal aggregation index Thc, and the physical constraint parameters of the circuit board, the wiring density Dw and the via number Vh, the overall optimization effect of the wiring scheme is quantified. When the optimization performance evaluation coefficient OPE is less than the optimization performance evaluation threshold OPEth, the dynamic adjustment module combines the reinforcement learning algorithm to adjust the wiring parameters in real time, including re-planning the wiring path, optimizing the wiring density distribution, and adjusting the via layout in the high-power consumption area, and updates the wiring planning result through a real-time feedback mechanism. Finally, a wiring scheme with the optimization performance evaluation coefficient OPE meeting the requirements is generated, comprehensively solving the problems of low automation and poor optimization effect of the existing wiring optimization system under complex constraint conditions, and ensuring the high-performance application requirements of the HDI circuit board in wearable devices. Description of the Drawings

[0019] Figure 1 It is a schematic diagram of the framework structure of the intelligent wiring optimization system for an HDI circuit board of the present invention; Figure 2 Schematic diagram of the step flow of an intelligent wiring optimization method for an HDI circuit board according to the present invention. Detailed implementation manners

[0020] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0021] Embodiment 1 Please refer to Figure 1 , the present invention provides an intelligent wiring optimization system for an HDI circuit board, including an electromagnetic compatibility monitoring module, a thermal management evaluation module, an intelligent wiring planning module, a comprehensive optimization analysis module, and a dynamic adjustment module; The electromagnetic compatibility monitoring module is used to monitor in real time the electromagnetic interference related data generated during the operation of the HDI circuit board, and calculate the electromagnetic interference index Em; and compare and analyze the electromagnetic interference index Em with a preset electromagnetic interference threshold EMth, and finally trigger an electromagnetic compatibility optimization warning signal; The thermal management evaluation module is used to collect the temperature distribution related data of high-power consumption areas on the circuit board, and calculate the heat aggregation index Thc; by comparing and evaluating the heat aggregation index Thc, judge whether the thermal management ability in the circuit board wiring design meets the requirements, and generate thermal management optimization suggestions; The intelligent wiring planning module uses machine learning algorithms, takes the electromagnetic interference related data and the temperature distribution related data as features, generates a multi-objective wiring scheme through a dynamic path planning method, and finally calculates the comprehensive optimization index COP of the multi-objective wiring scheme; The comprehensive optimization analysis module is based on the electromagnetic interference index Em, the heat aggregation index Thc, and the comprehensive optimization index COP, combines the physical constraints and performance requirements of the circuit board design, calculates and evaluates the optimization performance evaluation coefficient OPE, and finally outputs a comprehensive optimization result, including an optimization qualified result and an optimization unqualified result; The dynamic adjustment module dynamically adjusts the wiring parameters and the circuit routing based on the optimization unqualified result, and at the same time establishes and updates the wiring planning result through a real-time feedback mechanism.

[0022] In this embodiment, the electromagnetic compatibility monitoring module can monitor in real time the data related to electromagnetic interference generated during the operation of the HDI circuit board, and compare and analyze the electromagnetic interference index Em with the preset electromagnetic interference threshold EMth through calculation, accurately identify and trigger the electromagnetic compatibility optimization warning signal, so as to effectively solve the electromagnetic interference problem; the thermal management evaluation module can judge whether the thermal management ability of the circuit board wiring design meets the requirements by collecting the data related to the temperature distribution in the high-power consumption area and calculating the thermal aggregation index Thc, and combining the comparison and evaluation of the heat dissipation balance threshold THCth, and generate targeted thermal management optimization suggestions to effectively solve the problems of insufficient heat dissipation and local overheating; the intelligent wiring planning module uses machine learning algorithms to normalize the electromagnetic interference index Em and the thermal aggregation index Thc as feature inputs, combines the wiring density Dw and the number of vias Vh, and generates a wiring scheme that meets the multi-objective optimization requirements through a dynamic path planning method, and calculates the comprehensive optimization index COP to ensure the comprehensive performance of the wiring scheme in terms of electromagnetic shielding, thermal management and resource utilization; the comprehensive optimization analysis module calculates the optimization performance evaluation coefficient OPE through the electromagnetic interference index Em, the thermal aggregation index Thc, the comprehensive optimization index COP, the wiring density Dw and the number of vias Vh, and outputs the comprehensive optimization result through the comparison and evaluation with the optimization performance evaluation threshold OPEth to effectively quantify the optimization level of the wiring scheme; the dynamic adjustment module dynamically adjusts the wiring parameters, the wiring density Dw and the number of vias Vh based on the unqualified optimization results, and updates the wiring planning results through a real-time feedback mechanism to ensure that the wiring scheme meets the high-performance requirements of the wearable device for the HDI circuit board after iterative optimization.

[0023] Embodiment 2 The electromagnetic compatibility monitoring module includes an electromagnetic interference calculation unit and an electromagnetic interference evaluation unit; The electromagnetic interference calculation unit is used to collect in real time the data related to electromagnetic interference generated during the operation of the HDI circuit board; when the circuit board is running, it collects the radiation interference signal and the conducted interference signal and converts them into digital form, then performs spectrum analysis and time-domain decomposition, and then extracts the key characteristic parameters and performs dimensionless processing, including the signal frequency band intensity Sfi, the instantaneous peak amplitude Spk, the pulse repetition frequency Prf, and the total interference power Tip, and finally calculates and obtains the electromagnetic interference index Em based on the following formula;

[0024] The electromagnetic interference evaluation unit is used to preset the electromagnetic interference threshold EMth, compare and evaluate it with the electromagnetic interference index Em, and trigger and generate an electromagnetic compatibility optimization warning signal, and the specific content is as follows: When the electromagnetic interference index Em ≤ the electromagnetic interference threshold EMth: it means that the electromagnetic interference of the HDI circuit board is within the safe range and no additional optimization measures are required; When the electromagnetic interference index Em > the electromagnetic interference threshold EMth: It indicates that the electromagnetic interference of the HDI circuit board exceeds the safe range, affecting the normal operation of the device or causing interference to communication signals. At this time, an electromagnetic compatibility optimization warning signal is generated.

[0025] The thermal management evaluation module includes a heat aggregation calculation unit and a heat aggregation evaluation unit; The heat aggregation calculation unit is used to collect data related to the temperature distribution in the high-power consumption area of the HDI circuit board in real time. Through the multi-point temperature sensors arranged in the high-power consumption area of the HDI circuit board, the temperature of each key area is collected in real time by the array. Then, the spatial distribution information of the temperature is recorded by the sensor array. Secondly, the change trend of the temperature over time during the operation of the circuit board is recorded. Finally, after the collected data related to the temperature distribution is smoothed, denoised, and dimensionless processed, the heat aggregation index Thc is calculated through the following formula:

[0026] In the formula, Tmax represents the highest temperature of the hot spot in the data related to the temperature distribution, Tavg represents the average temperature in the data related to the temperature distribution, Tgra represents the temperature gradient in the data related to the temperature distribution, and Tva represents the thermal fluctuation amplitude in the data related to the temperature distribution; ln represents the natural logarithm, that is, the logarithmic function with the mathematical constant e as the base.

[0027] The heat aggregation evaluation unit is used to preset a heat dissipation balance threshold THCth and compare and evaluate it with the heat aggregation index Thc. The specific evaluation content is as follows: When the heat aggregation index Thc ≤ the heat dissipation balance threshold THCth: It indicates that the thermal management ability of the circuit board meets the design requirements and no additional adjustment is required; When the heat aggregation index Thc > the heat dissipation balance threshold THCth: It indicates that the thermal management ability of the circuit board does not meet the design requirements, resulting in local overheating of the device. At this time, thermal management optimization suggestions are generated, including adjusting the wiring path, replacing the heat dissipation material, and adjusting the structural heat dissipation.

[0028] The intelligent wiring planning module is used to integrate electromagnetic interference-related data and temperature distribution-related data. Then, after normalizing the electromagnetic interference index Em and the heat aggregation index Thc, they are used as the main feature inputs. Secondly, based on the main feature inputs, machine learning algorithms, including reinforcement learning algorithms, are used to generate a multi-objective wiring optimization model. Then, through a dynamic path planning method, combined with the physical constraints of the circuit board design, the key wiring paths are optimized and adjusted in real time to generate a wiring scheme that meets the multi-objective optimization requirements. Finally, the electromagnetic interference suppression score EDs, the heat distribution balance score TBs, the wiring length optimization score PLs, and the resource utilization score RUs are obtained through the multi-objective wiring optimization model and fitted, and the comprehensive optimization index COP of the wiring scheme is calculated and generated. The specific formula is as follows:

[0029] The comprehensive optimization analysis module includes a comprehensive optimization calculation unit and a comprehensive optimization evaluation unit; The comprehensive optimization calculation unit is used to calculate the optimization performance evaluation coefficient OPE; by combining the physical constraints and performance requirements of the circuit board design, including the wiring density Dw and the number of vias Vh, and associating them with the electromagnetic interference index Em, the heat aggregation index Thc, and the comprehensive optimization index COP, the optimization performance evaluation coefficient OPE is calculated and obtained through the following formula:

[0030] In this embodiment, through the collaborative work of the electromagnetic compatibility monitoring module, the thermal management evaluation module, the intelligent wiring planning module, and the comprehensive optimization analysis module, the wiring optimization ability of the HDI circuit board is comprehensively improved. Among them, the electromagnetic interference calculation unit of the electromagnetic compatibility monitoring module collects radiation interference signals and conducted interference signals in real time, and calculates the electromagnetic interference index Em by extracting key characteristic parameters including the signal frequency band intensity Sfi, the instantaneous peak amplitude Spk, the pulse repetition frequency Prf, and the total interference power Tip, which can accurately quantify the electromagnetic interference level of the circuit board. The electromagnetic interference evaluation unit compares and analyzes the electromagnetic interference index Em with the preset electromagnetic interference threshold EMth, triggers the electromagnetic compatibility optimization warning signal, and effectively suppresses the electromagnetic interference. The thermal management evaluation module collects data related to the temperature distribution in high-power consumption areas in real time through the heat aggregation calculation unit, including the highest hot spot temperature Tmax, the average temperature Tavg, the temperature gradient Tgra, and the thermal fluctuation amplitude Tva, and quantifies the heat aggregation effect of the circuit board based on the calculated heat aggregation index Thc. The heat aggregation evaluation unit generates optimization suggestions to solve the problem of insufficient heat dissipation by comparing the heat aggregation index Thc with the preset heat dissipation balance threshold THCth. The intelligent wiring planning module combines the normalized electromagnetic interference index Em and the heat aggregation index Thc with the physical constraint parameters, the wiring density Dw and the number of vias Vh, uses the reinforcement learning algorithm to generate a multi-objective wiring optimization model, optimizes the wiring path through the dynamic path planning method, and calculates and generates the comprehensive optimization index COP by calculating the electromagnetic interference suppression score EDs, the thermal distribution balance score TBs, the wiring length optimization score PLs, and the resource utilization score RUs, ensuring the balance between the performance and resource utilization of the wiring scheme. The comprehensive optimization analysis module calculates the optimization performance evaluation coefficient OPE, and evaluates the overall optimization level of the wiring scheme by comparing it with the optimization performance evaluation threshold OPEth. Finally, the dynamic adjustment module adjusts the wiring parameters and path planning in real time, and iteratively optimizes through the feedback mechanism to ensure that the wiring scheme meets the high-performance requirements of the HDI circuit board in terms of electromagnetic compatibility, thermal management ability, and resource utilization efficiency.

[0031] Embodiment 3 The comprehensive optimization evaluation unit is used to preset the optimization performance evaluation threshold OPEth, compare and evaluate the optimization performance evaluation coefficient OPE, analyze the optimization level of the wiring scheme, and finally output the comprehensive optimization result. The specific evaluation content is as follows: When the optimization performance evaluation coefficient OPE ≥ the optimization performance evaluation threshold OPEth, it is determined that the wiring scheme meets the optimization requirements, and the qualified optimization result is output. When the optimization performance evaluation coefficient OPE < the optimization performance evaluation threshold OPEth, it is determined that the wiring scheme does not meet the optimization requirements. At this time, targeted improvement suggestions are generated and the unqualified result is output.

[0032] The dynamic adjustment module extracts relevant lower-level parameters including the electromagnetic interference index Em, the thermal aggregation index Thc, the wiring density Dw, and the number of vias Vh based on the optimized unqualified results, and analyzes the specific reasons for the insufficient optimization. Secondly, it dynamically adjusts the wiring parameters, including re-planning the wiring path, optimizing the wiring density distribution, and adjusting the via layout in high-power consumption areas. At the same time, it establishes a real-time feedback mechanism in combination with the reinforcement learning algorithm, recalculates the optimization performance evaluation coefficient OPE after each adjustment, and iteratively optimizes the adjustment plan. Finally, it feeds back the updated wiring planning result to the comprehensive optimization analysis module for re-evaluation. If the evaluation result is an optimized qualified result, it outputs the final wiring plan to complete the dynamic adjustment process.

[0033] In this embodiment, through the collaborative work of the comprehensive optimization evaluation unit and the dynamic adjustment module, the intelligence and dynamic adjustment ability of the HDI circuit board wiring optimization scheme are effectively improved. The comprehensive optimization evaluation unit presets the optimization performance evaluation threshold OPEth, compares and evaluates the optimization performance evaluation coefficient OPE, and comprehensively analyzes the optimization level of the wiring scheme. When the optimization performance evaluation coefficient OPE is less than the performance evaluation threshold OPEth, it generates targeted improvement suggestions to output unqualified results and provides a reference basis for subsequent dynamic adjustment. The dynamic adjustment module extracts lower-level parameters including the electromagnetic interference index Em, the thermal aggregation index Thc, the wiring density Dw, and the number of vias Vh based on the optimized unqualified results, and analyzes the specific reasons for the insufficient optimization. Among them, the electromagnetic interference index Em is used to quantify the electromagnetic interference level of the wiring scheme, the thermal aggregation index Thc is used to characterize the thermal aggregation effect, and the wiring density Dw and the number of vias Vh are used to evaluate the density distribution and resource utilization rate of the wiring respectively. The module dynamically adjusts the wiring parameters, re-plans the wiring path, optimizes the wiring density distribution, and adjusts the via layout in high-power consumption areas. In combination with the reinforcement learning algorithm, it establishes a real-time feedback mechanism, recalculates the optimization performance evaluation coefficient OPE after each adjustment, and iteratively optimizes the adjustment plan. Finally, it feeds back the updated wiring planning result to the comprehensive optimization analysis module for re-evaluation. If the optimized performance evaluation coefficient OPE reaches the performance evaluation threshold OPEth after adjustment, it outputs the final optimized qualified wiring plan to complete the dynamic adjustment process. Through the above process, Embodiment 3 can achieve the efficient optimization of the HDI circuit board under complex constraint conditions, improve the electromagnetic compatibility, thermal management ability, and resource utilization efficiency of the wiring scheme, and ensure meeting high-performance requirements.

[0034] Embodiment 4 Please refer to Figure 2 , an intelligent wiring optimization method for an HDI circuit board, including the following steps: Step 1: Monitor in real time the data related to electromagnetic interference generated during the operation of the HDI circuit board, and calculate the electromagnetic interference index Em; compare and analyze the electromagnetic interference index Em with the preset electromagnetic interference threshold EMth, and finally trigger an electromagnetic compatibility optimization warning signal; Step 2: Collect the data related to the temperature distribution in the high-power consumption area of the circuit board, and calculate the heat aggregation index Thc; by comparing and evaluating the heat aggregation index Thc, determine whether the thermal management ability in the circuit board wiring design meets the requirements, and generate thermal management optimization suggestions; Step 3: Use machine learning algorithms, take the data related to electromagnetic interference and the data related to temperature distribution as features, and generate a multi-objective wiring scheme through a dynamic path planning method. Finally, calculate the comprehensive optimization index COP of the multi-objective wiring scheme; Step 4: Based on the electromagnetic interference index Em, the heat aggregation index Thc, and the comprehensive optimization index COP, combined with the physical constraints and performance requirements of the circuit board design, calculate and evaluate the optimization performance evaluation coefficient OPE, and finally output the comprehensive optimization result, including the qualified optimization result and the unqualified optimization result; Step 5: Based on the unqualified optimization result, dynamically adjust the wiring parameters and the circuit routing, and at the same time establish and update the wiring planning result through a real-time feedback mechanism.

[0035] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An intelligent wiring optimization system for HDI circuit boards, characterized in that: It includes electromagnetic compatibility monitoring module, thermal management evaluation module, intelligent wiring planning module, comprehensive optimization analysis module and dynamic adjustment module; The electromagnetic compatibility monitoring module is used to monitor the electromagnetic interference related data generated during the operation of the HDI circuit board in real time, and calculate the electromagnetic interference index Em; and compare and analyze the electromagnetic interference index Em with the preset electromagnetic interference threshold EMth, and finally trigger the electromagnetic compatibility optimization early warning signal; The thermal management evaluation module is used to collect temperature distribution related data of high power consumption areas on the circuit board and calculate the heat aggregation index Thc; by comparing and evaluating the heat aggregation index Thc, it is determined whether the thermal management capability in the circuit board wiring design meets the requirements, and a thermal management optimization suggestion is generated; The intelligent wiring planning module uses a machine learning algorithm to take electromagnetic interference related data and temperature distribution related data as feature inputs, generates a multi-objective wiring scheme through a dynamic path planning method, and finally calculates the comprehensive optimization index COP of the multi-objective wiring scheme; The comprehensive optimization analysis module calculates and evaluates the optimization performance evaluation coefficient OPE based on the electromagnetic interference index Em, the heat aggregation index Thc and the comprehensive optimization index COP, combined with the physical constraints and performance requirements of the circuit board design, and finally outputs the comprehensive optimization results, including the optimization qualified results and the optimization unqualified results; The dynamic adjustment module dynamically adjusts the wiring parameters and line directions based on the optimization unqualified results, and at the same time establishes and updates the wiring planning results through a real-time feedback mechanism.

2. The intelligent wiring optimization system for HDI circuit boards according to claim 1, characterized in that: The electromagnetic compatibility monitoring module includes an electromagnetic interference calculation unit and an electromagnetic interference evaluation unit; the electromagnetic interference calculation unit is used to collect electromagnetic interference related data generated during the operation of the HDI circuit board in real time; when the circuit board is running, the radiation interference signal and the conducted interference signal are collected and converted into digital form, and then spectrum analysis and time domain decomposition are performed, and then key characteristic parameters are extracted and dimensionless processing is performed, including signal frequency band intensity Sfi, instantaneous peak amplitude Spk, pulse repetition frequency Prf and total interference power Tip, and finally the electromagnetic interference index Em is calculated based on the following formula; .

3. The intelligent wiring optimization system for HDI circuit boards according to claim 2, characterized in that: The electromagnetic interference evaluation unit is used to preset the electromagnetic interference threshold EMth, compare and evaluate it with the electromagnetic interference index Em, and trigger the generation of an electromagnetic compatibility optimization warning signal. The specific contents are as follows: When the electromagnetic interference index Em≤the electromagnetic interference threshold EMth: it means that the electromagnetic interference of the HDI circuit board is within the safe range and no additional optimization measures are required; When the electromagnetic interference index Em> electromagnetic interference threshold EMth: it means that the electromagnetic interference of the HDI circuit board exceeds the safety range, affecting the normal operation of the equipment or causing communication signal interference. At this time, an electromagnetic compatibility optimization warning signal is generated.

4. The intelligent wiring optimization system for HDI circuit boards according to claim 1, characterized in that: The thermal management assessment module includes a heat accumulation calculation unit and a heat accumulation assessment unit; The heat aggregation calculation unit is used to collect temperature distribution related data of high power consumption areas on the HDI circuit board in real time. The array collects the temperature of each key area in real time through multi-point temperature sensors arranged in the high power consumption area of ​​the HDI circuit board. Then the spatial distribution information of the temperature is recorded by the sensor array. Secondly, the temperature change trend over time during the operation of the circuit board is recorded; finally, the collected temperature distribution related data is smoothed, denoised and dimensionless, and the heat aggregation index Thc is calculated by the following formula: Wherein, Tmax represents the maximum temperature of the hot spot in the temperature distribution related data, Tavg represents the average temperature in the temperature distribution related data, Tgra represents the temperature gradient in the temperature distribution related data, Tva represents the thermal fluctuation amplitude in the temperature distribution related data; ln represents the natural logarithm, that is, the logarithmic function with the mathematical constant e as the base.

5. The intelligent wiring optimization system for HDI circuit boards according to claim 4, characterized in that: The heat accumulation evaluation unit is used to preset the heat dissipation balance threshold THCth and compare and evaluate it with the heat accumulation index Thc. The specific evaluation contents are as follows: When the heat concentration index THC ≤ the heat dissipation balance threshold THCth: it indicates that the thermal management capability of the circuit board meets the design requirements and no additional adjustment is required; When the heat concentration index Thc> the heat dissipation balance threshold THCth: it indicates that the thermal management capability of the circuit board does not meet the design requirements, resulting in local overheating of the equipment. At this time, thermal management optimization suggestions are generated, including wiring path adjustment, heat dissipation material replacement, and structural heat dissipation adjustment.

6. The intelligent wiring optimization system for HDI circuit boards according to claim 1, characterized in that: The intelligent wiring planning module is used to integrate electromagnetic interference related data and temperature distribution related data, and then normalize the electromagnetic interference index Em and the heat aggregation index Thc as the main feature input; Secondly, based on the main feature input, a multi-objective wiring optimization model is generated using machine learning algorithms, including reinforcement learning algorithms; then, through the dynamic path planning method, combined with the physical constraints of the circuit board design, the key wiring paths are optimized and adjusted in real time to generate a wiring scheme that meets the multi-objective optimization requirements; finally, the electromagnetic interference suppression score EDs, the heat distribution balance score TBs, the wiring length optimization score PLs, and the resource utilization score RUs are obtained through the multi-objective wiring optimization model and fitted, and the comprehensive optimization index COP of the wiring scheme is calculated. The specific formula is as follows: 。 7. The intelligent wiring optimization system for HDI circuit boards according to claim 1, characterized in that: The comprehensive optimization analysis module includes a comprehensive optimization calculation unit and a comprehensive optimization evaluation unit; The comprehensive optimization calculation unit is used to calculate the optimization performance evaluation coefficient OPE; by combining the physical constraints and performance requirements of the circuit board design, including the wiring density Dw and the number of vias Vh, and correlating with the electromagnetic interference index Em, the heat concentration index Thc and the comprehensive optimization index COP, the optimization performance evaluation coefficient OPE is calculated by the following formula: 。 8. The intelligent wiring optimization system for HDI circuit boards according to claim 7, characterized in that: The comprehensive optimization evaluation unit is used to preset the optimization performance evaluation threshold OPEth, compare and evaluate the optimization performance evaluation coefficient OPE, analyze the optimization level of the wiring scheme, and finally output the comprehensive optimization result; the specific evaluation contents are as follows: When the optimization performance evaluation coefficient OPE ≥ the optimization performance evaluation threshold OPEth, the wiring scheme is determined to meet the optimization requirements and the optimization qualified result is output; When the optimization performance evaluation coefficient OPE is less than the optimization performance evaluation threshold OPEth, the wiring scheme is determined to not meet the optimization requirements. At this time, targeted improvement suggestions are generated and unqualified results are output.

9. The intelligent wiring optimization system for HDI circuit boards according to claim 1, characterized in that: Based on the unqualified optimization results, the dynamic adjustment module extracts relevant subordinate parameters including electromagnetic interference index Em, heat aggregation index Thc, wiring density Dw and number of vias Vh, and analyzes the specific reasons for insufficient optimization; secondly, the wiring parameters are dynamically adjusted, including re-planning the wiring path, optimizing the wiring density distribution, and adjusting the via layout in the high power consumption area; at the same time, a real-time feedback mechanism is established in combination with the reinforcement learning algorithm, and the optimization performance evaluation coefficient OPE is recalculated after each adjustment, and the adjustment plan is iteratively optimized; finally, the updated wiring planning results are fed back to the comprehensive optimization analysis module for re-evaluation. If the evaluation result is a qualified optimization result, the final wiring plan is output to complete the dynamic adjustment process.

10. An intelligent wiring optimization method for HDI circuit boards, according to an intelligent wiring optimization system for HDI circuit boards according to any one of claims 1 to 9, characterized in that: The following steps are involved: Step 1: Real-time monitoring of electromagnetic interference related data generated during the operation of the HDI circuit board, and calculation of the electromagnetic interference index Em; The electromagnetic interference index Em is compared and analyzed with the preset electromagnetic interference threshold EMth, and finally an electromagnetic compatibility optimization warning signal is triggered; Step 2: Collect temperature distribution data of high power consumption areas on the circuit board and calculate the heat concentration index Thc; by comparing and evaluating the heat concentration index Thc, determine whether the thermal management capability in the circuit board wiring design meets the requirements, and generate thermal management optimization suggestions; Step 3: Using machine learning algorithms, taking electromagnetic interference related data and temperature distribution related data as feature inputs, generating a multi-objective wiring scheme through a dynamic path planning method, and finally calculating the comprehensive optimization index COP of the multi-objective wiring scheme; Step 4: Based on the electromagnetic interference index Em, the heat aggregation index Thc and the comprehensive optimization index COP, combined with the physical constraints and performance requirements of the circuit board design, the optimization performance evaluation coefficient OPE is calculated and evaluated, and finally the comprehensive optimization results are output, including the optimization qualified results and the optimization unqualified results; Step 5: Based on the unqualified optimization results, dynamically adjust the wiring parameters and line directions, and establish and update the wiring planning results through a real-time feedback mechanism.

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